TWM642831U - Expansion card with quick-release heat dissipation structure and electronic device with same - Google Patents

Abstract

The present invention is an expansion card with a quick-release heat dissipation structure, which includes: a first circuit board, at least one electrical connector, at least one solid state disk (SSD) module, a pivot mechanism, a first platform, and at least one radiator. Wherein, a first end of the radiator is pivotally arranged on the pivot mechanism, a first magnet is arranged on the first platform, and a second magnet is arranged on the bottom of a second end of the radiator. According to this design, force is applied to the heat sink to rotate the heat sink, so that the second magnet magnetically attracts the first magnet, and in this way the heat sink is fixed on the solid state hard disk module.

Description

Expansion card with quick-release heat dissipation structure and electronic device with same

The present invention relates to the technical field of expansion cards of computer products, especially an expansion card with a quick-release heat dissipation structure.

It is known that there are various industrial computers, such as servers, switches, routers, gateways, network attached storage computers, embedded computers for specific applications, industrial control computers, vehicle computers, security monitoring Console, game console, game console, etc. Even so, the system architectures of industrial computers currently designed in the industry can be roughly divided into two types. At present, the easiest way to improve the functions of the computer device is to add an expansion card (expansion card). For example, an expansion board including at least one SSD module is inserted into a PCI express (PCIe) slot of a NAS computer, so as to expand the storage module of the NAS computer. It is worth noting that, in addition to the SSD module, the expansion board can also include a network communication module, so that the NAS computer has a 10GBASE-T, 5GbE, 2.5GbE, 1GbE, or 100MbE network route connection function.

The SSD expansion board (or interface card) has the advantages of large storage capacity, high transmission rate, and easy expansion. However, the SSD module of the expansion board tends to generate high heat during operation, so it is necessary to design its own heat dissipation module. In view of this, Taiwan's new patent No. M626088 discloses a heat dissipation module, which includes: a support frame and a heat dissipation element, which The supporting frame is used for accommodating an SSD module, and the cooling element is installed on the supporting frame to contact the SSD module.

Unfortunately, practical experience points out that there are still defects in the use of the aforementioned cooling modules that need to be improved. Therefore, the author of this case tried his best to research and invent, and finally developed a new type of expansion card with a quick-release heat dissipation structure.

The main purpose of this creation is to provide an expansion card with a quick-release heat dissipation structure, which includes: a first circuit board, at least one electrical connector, at least one solid state disk (SSD) module, a pivot mechanism, a The first platform and at least one radiator. Wherein, a first end of the radiator is pivotally arranged on the pivot mechanism, a first magnet is arranged on the first platform, and a second magnet is arranged on the bottom of a second end of the radiator. According to this design, force is applied to the heat sink to rotate the heat sink, so that the second magnet magnetically attracts the first magnet, and in this way the heat sink is fixed on the solid state hard disk module, so that The bottom of the radiator contacts at least one electronic chip contained in the solid state hard disk module.

In order to achieve the above object, this creation proposes an embodiment of the expansion card with a quick-release heat dissipation structure, which includes: a first circuit board with a PCI express (PCIe) interface; at least one an electrical connector disposed on the first circuit board; at least one solid state disk (SSD) module, wherein each of the solid state disk modules is connected to one of the electrical connectors with an electrical connection interface; A pivot mechanism is arranged on the first circuit board; a first platform is arranged on the first circuit board with a distance from the pivot mechanism; at least one first magnet is arranged on the On the first platform; and at least one radiator, wherein each radiator includes: a base; a plurality of fins arranged on the top surface of the base; and a second magnet arranged on the base The bottom surface of the radiator; wherein, a first end of the radiator is pivotally connected to the pivot mechanism, and applying force to the radiator can rotate the radiator clockwise or counterclockwise; wherein, rotating the radiator makes the first After the two magnets and the first magnet are in contact with each other, the first magnet magnetically attracts the second magnet, thereby fixing the heat sink on the solid state disk (SSD) module, and making the bottom surface of the base contact the solid state disk (SSD) module. At least one electronic chip contained in the hard disk module.

In one embodiment, the electronic chip is covered with a temperature uniform sheet.

In one embodiment, the pivot mechanism includes: a second platform disposed on the first circuit board; at least one first groove formed on the second platform; and at least one pillar, Wherein, each of the pillars is arranged in one of the first grooves.

In one embodiment, the first end of the heat sink has an arc structure, and the arc structure is buckled on the column member, so that the heat sink is pivotally connected to the pivot mechanism.

In one embodiment, both the first magnet and the second magnet are powerful magnets.

In one embodiment, at least one second groove is disposed on the first platform, and the first magnet is disposed in the second groove.

In a feasible embodiment, the aforementioned expansion card with a quick-release heat dissipation structure of the present invention further includes: at least one fastening unit disposed on the first circuit board, and each fastening unit includes: a base ; and a fastener, slidably arranged on the base.

In one embodiment, the solid-state hard disk module includes a second circuit board having the electrical connection interface, and pushing the clip can be against the second circuit board, so that the second circuit board is sandwiched between the Between the electrical connector and the fastening unit.

Moreover, this creation discloses an embodiment of an electronic device at the same time, which includes a case and a main board arranged on the case, and a plurality of electronic components are arranged on the main board; it is characterized in that the electronic device further includes As mentioned above, the expansion card with the quick release heat dissipation structure of the present invention is electrically connected to the main board.

In one embodiment, the electronic device is selected from servers, switches, routers, gateways, industrial computers, desktop computers, all-in-one computers, smart TVs, car entertainment Any one of the group consisting of the device, the gaming host, and the game host.

1: Expansion card with quick release heat dissipation structure

11: The first circuit board

111: PCIe interface

12: Electrical connector

13:Solid state drive module

130: the second circuit board

131: electrical connection interface

132: Electronic chip

14: Pivot mechanism

141: second platform

142: The first groove

15: The first platform

15G: the second groove

16: First magnet

17: Radiator

17G: Arc structure

171: base

172: fins

173: second magnet

18:Clamp unit

181: base

182: Card firmware

19: Equalizing sheet

Fig. 1 is a first perspective view of an expansion card with a quick-release heat dissipation structure of the present invention; Fig. 2 is a second perspective view of an expansion card with a quick-release heat dissipation structure of the present invention; 3 is a third perspective view of the expansion card with a quick-release heat dissipation structure of the present invention; and FIG. 4 is a fourth perspective view of the expansion card with a quick-release heat dissipation structure of the present invention.

In order to more clearly describe an expansion card with a quick-release heat dissipation structure of the present invention and an electronic device having the same, preferred embodiments of the present invention will be described in detail below with reference to the drawings.

1 , 2 , 3 , and 4 are respectively first, second, third, and fourth perspective views of an expansion card with a quick-release heat dissipation structure of the present invention. As shown in Figures 1 to 4, the expansion card 1 with a quick-release heat dissipation structure (hereinafter referred to as "expansion card 1") mainly includes: a first circuit board 11, at least one electrical connector 12, at least one solid-state hard disk (SSD) module 13, a pivot mechanism 14, a first platform 15, at least a first magnet 16, and at least a radiator 17, wherein, the first circuit board 11 has a shortcut peripheral interconnect standard (PCI express, PCIe) interface 111 (hereinafter collectively referred to as "PCIe interface 111), the at least one electrical connector 12 is arranged on the first circuit board 11, and each of the solid-state hard disk modules 13 is electrically connected to the interface 131 Connect one of the electrical connectors 12. In more detail, the solid state disk module 13 includes a second circuit board 130 with the electrical connection interface 131, and a plurality of Electronic chips 132 (that is, a plurality of SSD chips and control chips). It should be understood that if the electrical connection interface 131 is a gold finger that conforms to the M.2 M-key protocol, then the corresponding electrical connector 12 is a gold finger that conforms to the M.2 M-key protocol. 2 The electrical slot of the M-key protocol. On the other hand, if the electrical connection interface 131 is a gold finger conforming to the M.2 B-key protocol, then the corresponding electrical connector 12 is conforming to the M.2 Electric socket for B-key protocol.

In this invention, the pivot mechanism 14 is arranged on the first circuit board 11, and the first platform 15 is arranged on the first circuit board 11, so as to be separated from the pivot mechanism 14 by a distance . It should be understood that the solid-state hard disk module 13 has various sizes and specifications, including: 22x30mm, 22x42mm, 22x60mm, and 22x80mm. Therefore, according to the size and specifications of the solid-state hard disk module 13, the distance can be ≦30mm,≦ 42mm, ≦60mm, or ≦80mm. And, as shown in FIGS. 1-4, the pivot mechanism 14 includes: a second platform 141, at least one first groove 142, and at least one column (not shown by the radiator 17), wherein, The second platform 141 is disposed on the first circuit board 11 , the at least one first groove 142 is formed on the second platform 141 , and a post is disposed in a first groove 142 . On the other hand, at least one second groove 15G is disposed on the first platform 15 , and a first magnet 16 is disposed in a second groove 15G.

As shown in Figures 1 to 4, a first end of the radiator 17 has an arc-shaped structure 17G, and the arc-shaped structure 17G is buckled on the column, so that the radiator 17 is pivotally connected to the pivot. Connection mechanism 14. Wherein, each heat sink 17 includes: a base 171, a plurality of fins 172 and a second magnet 173, wherein, the plurality of fins 172 are arranged on the top surface of the base 171, and the second magnet 173 is disposed on the bottom surface of the base 171 . Since the heat sink 17 can be rotated clockwise or counterclockwise by applying a force, the second magnet 173 and the first magnet 16 can contact each other by rotating the heat sink 17 . Further, since the first magnet 16 and the second magnet 173 are both powerful magnets, the heat sink 17 can be fixed on the solid state hard disk through the strong magnetic attraction of the first magnet 16 to the second magnet 173 module 13 , and at the same time make the bottom surface of the base 171 contact at least one electronic chip 132 contained in the solid state hard disk module 13 .

Further, as shown in FIGS. 1-4 , at least one fastening unit 18 is disposed on the first circuit board 11 , and each fastening unit 18 includes a base 181 and a fastening member 182 . Since the clamping member 182 is slidably disposed on the base 181, pushing the clamping member 182 can be against the second circuit board 130, so that the second circuit board 130 is clamped on the electrical connector 12 and between the clamping unit 18. Furthermore, as shown in FIG. 3 , in practice, a temperature equalizer 19 such as a graphene temperature equalizer can be pasted on the electronic chip 132 .

In this way, the above system has completely and clearly described a new type of expansion card with a quick-release heat dissipation structure; and, through the above, it can be known that this creation has the following advantages:

(1) This creation provides an expansion card 1 with a quick-release heat dissipation structure, which includes: a first circuit board 11, at least one electrical connector 12, at least one solid state disk (SSD) module 13, a pivot joint The mechanism 14 , a first platform 15 , and at least one radiator 17 . Wherein, a first end of the radiator 17 is pivotally arranged on the pivot mechanism 14, a first magnet 16 is arranged on the first platform 15, and a first magnet 16 is arranged on the bottom of a second end of the radiator 17. Two magnets 173. According to this design, force is applied to the heat sink 17 to rotate the heat sink 17, so that the second magnet 173 magnetically attracts the first magnet 16, and in this way the heat sink 17 is fixed on the solid state hard disk mold. Above the group 13 , the bottom of the heat sink 17 contacts at least one electronic chip 132 contained in the solid state disk module 13 .

(2) Moreover, this creation provides an embodiment of an electronic device at the same time, which includes a casing and a main board arranged on the casing, and a plurality of electronic components are arranged on the main board; it is characterized in that the electronic The device further includes the expansion card 1 with a quick-release heat dissipation structure of the present invention as described above, and the expansion card 1 with a quick-release heat dissipation structure is electrically connected to the main board. In one embodiment, the electronic device is selected from servers, switches, routers, gateways, industrial computers, desktop computers, all-in-one Any one in the group consisting of computers, smart TVs, car entertainment devices, game consoles, and game consoles.

It must be emphasized that the above detailed description is a specific description of the feasible embodiment of the new model, but the embodiment is not used to limit the patent scope of the new model, and any equivalent implementation or modification without departing from the technical spirit of the new model , should be included in the patent scope of this case.

1: Expansion card with quick release heat dissipation structure

11: The first circuit board

111: PCIe interface

12: Electrical connector

13:Solid state drive module

130: the second circuit board

131: electrical connection interface

132: Electronic chip

14: Pivot mechanism

141: second platform

142: The first groove

15: The first platform

15G: the second groove

16: First magnet

17: Radiator

171: base

172: fins

173: second magnet

18:Clamp unit

181: base

182: Card firmware

19: Equalizing sheet

Claims (10)

An expansion card with a quick-release heat dissipation structure, comprising: a first circuit board with a PCI express (PCIe) interface; at least one electrical connector arranged on the first circuit board; At least one solid-state hard disk (SSD) module, wherein each of the solid-state hard disk modules is connected to one of the electrical connectors through an electrical connection interface; a pivot mechanism is arranged on the first circuit board; A first platform, arranged on the first circuit board, and at a distance from the pivot mechanism; at least one first magnet, arranged on the first platform; and at least one heat sink, wherein each The radiator includes: a base; a plurality of fins arranged on the top surface of the base; and a second magnet arranged on the bottom surface of the base; wherein a first end of the radiator is pivotally connected to The pivoting mechanism, and applying force to the heat sink can rotate the heat sink clockwise or counterclockwise; wherein, after rotating the heat sink so that the second magnet and the first magnet are in contact with each other, the first magnet The second magnet is magnetically attracted, thereby fixing the heat sink on the solid state hard disk module, and making the bottom surface of the base contact at least one electronic chip contained in the solid state hard disk module. The expansion card with a quick-release heat dissipation structure as described in Claim 1, wherein a temperature equalizer is covered on the electronic chip. The expansion card with a quick-release heat dissipation structure as described in claim 1, wherein the pivot mechanism includes: a second platform arranged on the first circuit board; at least one first groove formed on the on the second platform; and at least one pillar, wherein each pillar is arranged in one of the first grooves. The expansion card with a quick-release heat dissipation structure as described in claim 3, wherein the first end of the heat sink has an arc-shaped structure, and the arc-shaped structure is buckled on the column, so that The radiator is pivotally connected to the pivot mechanism. The expansion card with a quick-release heat dissipation structure as described in Claim 3, wherein both the first magnet and the second magnet are strong magnets. The expansion card with a quick-release heat dissipation structure according to claim 3, wherein at least one second groove is disposed on the first platform, and the first magnet is disposed in the second groove. The expansion card with a quick-release heat dissipation structure as described in claim 3 further includes: At least one fastening unit is arranged on the first circuit board, and each fastening unit includes: a base; and a fastening member slidably arranged on the base. The expansion card with a quick-release heat dissipation structure as described in claim 7, wherein the solid-state hard disk module includes a second circuit board with the electrical connection interface, and pushing the card can withstand the second a circuit board, so that the second circuit board is sandwiched between the electrical connector and the fastening unit. An electronic device, comprising a casing and a main board arranged on the casing, and a plurality of electronic parts are arranged on the main board; it is characterized in that the electronic device further includes any one of claim 1 to claim 8 The expansion card with a quick-release heat dissipation structure is electrically connected to the motherboard. The electronic device as described in claim 9, wherein the electronic device is selected from servers, switches, routers, gateways, industrial computers, desktop computers, all-in-one computers, Any one of the group consisting of smart TV, car entertainment device, game console, and game console.

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