TWM641760U - Auxiliary device control system for laser processing - Google Patents

Abstract

A laser processing accessory control system. The first driving device is coupled to a laser processing device, and the second driving device is coupled to a processing accessory device. During the laser processing, the first driving device maintains a first relative motion relationship between the laser processing device and the processing surface of the workpiece according to the first command. During the laser machining process, the second driving device makes the machining attachment device maintain a second relative motion relationship with the machining surface of the workpiece according to the second command. Since the processing attachment has adjustable control items, it can be adjusted according to its reference basis to achieve better laser processing effects.

Description

Attachment Control System for Laser Processing

This creation relates to the technical field of laser processing, in particular to a control system for an accessory device of a laser processing machine.

In industrial metal processing methods, especially metal sheets or profiles, the laser system is used as a thermal tool, according to the interaction parameters of the laser beam and the material to be processed, clearly according to the energy density per incident volume of the laser beam on the material And there are diversified applications according to the interaction time distance.

In the case of laser welding, due to the processing requirements of thick plates, wire feeding equipment is required to feed the welding wire, and the laser beam emitted by the welding head melts the welding wire for fusion welding. Generally, the wire feeding equipment of the wire feeding welding in the laser processing machine will design the welding wire at the front and the laser beam at the back, and use a mechanism to fix the relationship between the laser beam of the welding head and the wire feeding equipment; however, if the processing path is not straight, there will be feeding The moving direction of the wire and the laser beam is inconsistent, which affects the consistency of welding quality.

In this regard, the known solution technology is to arrange the wire feeding device on a rotating shaft, and adjust the wire feeding direction and welding speed according to the welding path planning, such as the patent CN113843505A "Laser welding method, device, equipment, storage medium and electronic Device", this patent discloses a wire feeding device that adjusts the wire feeding direction when the welding laser beam turns to the position area, optimizes the consistency of wire feeding and laser beam movement, and achieves better welding results.

The existing technology mainly finds out the steering area of the laser processing head when planning the path, and then further plans the path of the auxiliary equipment and adjusts the control items. However, in the process of laser processing, due to the processing characteristics, there may be requirements such as material free gas removal, spatter removal, temperature and pressure control, and feeding, and it is necessary to cooperate with auxiliary equipment such as air blowing, wire feeding, and material addition. Although this type of equipment can achieve a binding relationship with the laser processing head through the mechanism design, it cannot achieve the optimal laser processing effect, and cannot maintain the relative position and direction of the laser processing track and the accessory device during processing. sex.

The purpose of this creation is to provide a laser processing accessory device control system, which keeps the relative position and direction of the laser light processing track and the accessory device during the processing process, so as to achieve better laser processing effect.

In order to achieve the above purpose, this creation provides a laser processing accessory device control system, which is applied to a processing machine for laser processing, including: a first driving device coupled to a laser processing device; a second driving device coupled to connected to a processing accessory device; a control unit is coupled to the first drive device and the second drive device, and the control unit generates a first command to control the first drive device according to a processing file of a workpiece; the control unit According to the motion information of the first driving device, a second command is generated to control the second driving device; during the laser processing process, the first driving device makes the laser processing device and the workpiece contact each other according to the first command The processing surface maintains a first relative movement relationship; during laser processing, the second driving device maintains a second relative movement relationship between the processing attachment device and the processing surface of the workpiece according to the second command.

Compared with the previous technology, the existing technology mainly plans the route of the laser processing device after confirming the route of the laser processing device, and then further plans the route of the auxiliary equipment and adjusts the control items; the technical focus of this case is to plan the route of the laser processing device, and its The relationship between the processing surface in the space and the control posture requirements of the auxiliary equipment provide the planning of the processing path and the auxiliary equipment that matches it, and maintain the relative position and directionality of the laser processing trajectory and the auxiliary equipment to achieve better laser processing effects.

Various embodiments of the present creation will be described in detail below, and the accompanying drawings are used as examples. In addition to these detailed descriptions, this creation can also be widely implemented in other embodiments, and any easy replacement, modification, and equivalent changes of any of the described embodiments are included in the scope of this creation, and the scope of the patent application is allow. In the description of the manual, many specific details are provided in order to enable readers to have a more complete understanding of the invention; however, the invention may still be implemented under the premise of omitting some or all of the specific details. Also, well-known steps or elements have not been described in detail in order to avoid unnecessarily limiting the invention. The same or similar elements in the drawings will be denoted by the same or similar symbols. It should be noted that the drawings are for illustrative purposes only, and do not represent the actual size or quantity of components, and some details may not be fully drawn for the sake of simplicity of the drawings.

Please refer to Figure 1, the first block diagram of the control system of the laser processing machine in this case. This case is a laser processing machine control system and control method, which is applied to a processing machine 10 for laser processing. The processing machine 10 includes: a first driving device 300 coupled to a laser processing device 310 for implementation and application The above laser processing device 310 is a laser welding device; a second driving device 400 is coupled to a processing accessory device 410, and the processing accessory device 410 may remove material free gas and splash objects due to different processing situations. Removal, temperature and pressure control, feeding and other requirements, the processing accessory device 410 can be a wire feeding device, a weld seam tracker or an air blowing device and other auxiliary equipment in practical applications.

A control unit 200 is coupled to the first driving device 300 and the second driving device 400, and the control unit 200 generates a first command 210 for controlling the first driving device 300 according to a processing file 110 of a workpiece. The unit 200 generates a second command 220 for controlling the second driving device 400 according to the movement information of the first driving device 300 . Or, when the relative relationship between the laser processing device 310 and the processing accessory device 410 has been built in the processing file 110, the control unit 200 generates the second command 220 according to the movement information of the first driving device 300 used to control the second driving device 400 .

In terms of implementation, the control unit 200 can be the controller and driver of the processing machine 10, and the processing file 110 is input through an input unit 100. The input unit 100 does not limit the input method, and can be the input interface or external input devices (such as laptops, servers). The processing image file of the processing file 110 may be a CAD file or an image file without limitation, or the processing file 110 may be a processing path file (for example, a processing path is described by a program). And preferably, the processing gear 110 can consider the servo control of the processing machine 10 . In practice, the servo control of the processing machine 10 actually includes the delay between all components of the processing machine 10. In addition to including the stroke parameters of the machine (such as: motor speed) or the speed of the machine, the servo control In addition to servo parameters (current, speed, position control loop related parameters), it can also include servo delay or command delay or communication delay, not limited to the delay between the control unit/driver/motor (that is, the problem of servo lag).

During laser processing, the first driving device 300 maintains a first relative motion relationship between the laser processing device 310 and the processing surface of the workpiece according to the first command 210; in practice, the control unit 200 according to the laser The relative speed between the injection processing device 310 and the workpiece is maintained to maintain the first relative motion relationship. During laser processing, the second driving device 400 maintains a second relative motion relationship between the processing attachment 410 and the processing surface of the workpiece according to the second command 220; in practice, the control unit 200 The relative speed between the attachment device 410 and the workpiece is to maintain the second relative motion relationship. Wherein, in practice, the laser processing device 310 and the processing accessory device 410 operate non-coaxially, and the laser processing device 310 and the processing accessory device 410 are driven by the first drive device 300 and the second drive device that are not coaxial. 400 are respectively driven, and independently maintain the first relative motion relationship and the second relative motion relationship with the workpiece.

The technology in this case mainly discloses that laser processing requires auxiliary equipment. When processing, after the processing path of the laser processing device 310 in space is known, the processing auxiliary device 410 is calculated according to the demand relationship between the processing auxiliary device 410 and the processing path. The current posture and device control items simultaneously control the laser processing device 310 and the processing accessory device 410 according to the processing path. When the processing path is located on the processing plane, the focal length of the laser processing device 310 maintains a fixed distance from the processing plane, the laser processing device 310 maintains a normal vector relationship perpendicular to the processing plane, and the processing attachment 410 remains fixed to the processing plane relation. In practice, the first relative motion relationship and/or the second relative motion relationship further includes a preset distance.

In the actual application, the demand relationship between the processing accessory device 410 and the processing path and the device control items are illustrated:

Taking the wire feeding device as an example, Figure 4 is a schematic diagram of the implementation of the wire feeding device in laser processing in this case. In practical application, in order to achieve better laser processing effect, the posture of the wire feeding device 411 of the processing accessory device 410 must satisfy: (1) The wire feeding device 411 feeds the wire to the laser processing device 310 (welding head) The current processing point. (2) The wire feeding distance 412 of the wire feeding device 411 needs to maintain a fixed value. (3) The control item of the wire feeding device 411 is the wire feeding speed, which is adjusted according to the current processing speed of the laser processing device 310 .

In the implementation and application of the wire feeding device 411 of the technology of this case, the laser processing device 310 (welding head) should maintain a vertical normal vector 601 relationship with the processing path 610 of the processing surface 600, and the focal length 311 of the laser processing device 310 To maintain a fixed distance from the processing surface 600 , the first relative motion relationship can be maintained by controlling the speed between the laser processing device 310 and the processing surface 600 of the workpiece. The wire feeding distance 412 of the wire feeding device 411 needs to maintain a fixed value, and the wire feeding device 411 should keep a fixed distance from the processing surface 600, that is, the speed between the wire feeding device 411 and the workpiece can be controlled to achieve this. The wire feeding device 411 maintains a second relative motion relationship with the processing surface 600 . The wire feeding speed of the wire feeding device 411 is adjusted according to the current processing speed of the laser processing device 310 (welding head). In this way, by knowing the path planning of the laser processing device 310 (welding head) and the relationship of the processing surface 600 in space, and matching the control attitude requirements of the wire feeding device 411, the processing accessory that matches the processing path is provided. The device 410 (wire feeding device 411 ) is planned to maintain the relative position and directionality of the laser processing track and the processing accessory device 410 (wire feeding device 411 ), so as to achieve better laser processing effect.

Taking the seam tracker as an example, Figure 5 is a schematic diagram of the implementation of the seam tracker in laser processing in this case. In practical application, in order to achieve better laser processing effect, the posture of the seam tracker 413 of the processing attachment 410 must satisfy the following relationship: (1) The position of the seam tracker 413 must be within the laser processing device 310 In front of the processing direction of the (welding head), the processing path 710 is detected and fed back in advance. (2) The seam tracker 413 maintains a preset seam tracking distance 711 with the laser processing device 310 , and the seam tracking distance 711 is calculated along the processing path 710 . (3) The detection attitude of the seam tracker 413 is ideally equal to the estimated processing attitude of the laser processing device 310 at that time.

In the implementation and application of the seam tracker 413 of the technology of this case, the laser processing device 310 (welding head) should maintain the vertical normal vector 701 relationship on the processing path 710, by controlling the laser processing device 310 on the processing path 710 The speed between them maintains the first relative motion relationship. The position of the seam tracker 413 needs to be in front of the processing direction of the laser processing device 310 to detect and feed back the correction processing path 710 in advance, and the seam tracker 413 must maintain the vertical normal vector 702 relationship on the processing path 710, by The second relative motion relationship is maintained by controlling the speed between the seam tracker 413 and the processing path 710; the detection attitude of the seam tracker 413 is equivalent to estimating the machining attitude of the laser processing device 310 at that time, both Both maintain the vertical normal vector 702 relationship. In practical applications, the seam tracker 413 maintains a preset seam tracking distance 711 with the laser processing device 310, that is, the first relative motion relationship and the second relative motion relationship include a preset distance (welding seam tracking distance 711 ), and the welding seam tracking distance 711 is calculated along the processing path 710 . In this way, by knowing the path planning of the laser processing device 310 and matching the control posture requirements of the seam tracker 413, the processing path 710 and the planning of the processing accessory device 410 (seam tracker 413) that cooperate with it are provided to maintain The relative position and direction of the laser processing track and the processing accessory device 410 (weld seam tracker 413 ) achieve better laser processing effect.

Taking the air blowing device as an example, Figure 6 is a schematic diagram of the implementation of the air blowing device in the laser processing of this case. When the material is melted at high temperature during the welding process, it will be accompanied by the formation of vapor plasma, which will affect the energy absorption rate of the material and the stability of the molten pool. Therefore, the protective gas is usually blown to suppress the generation of plasma. At the same time, the protective gas has the function of isolating the air, which can prevent the molten pool from being oxidized, and effectively reduce the splashing of spatter, so that the surface of the weld is uniform and smooth; on the other hand, it can also be used Pollutants are blown away to avoid contaminating the optical mirror group of the laser processing head; it is usually used in laser welding with multi-side blowing design, and the main consideration is that the application range is wider than that of coaxial. In practical application, in order to achieve better laser processing effect, the posture of the air blowing device 414 of the processing attachment 410 must satisfy the following relationship: (1) The position of the air blowing device 414 needs to be in the same position as the processing of the laser processing device 310 Direction to the rear to protect the molten pool from oxidation. (2) The blowing angle of the blowing device 414 maintains a fixed angle θ with the processing plane 800 along the processing path 810 of the laser processing device 310 . (3) The blowing distance of the blowing device 414 needs to maintain a fixed distance 415 from the current processing point of the laser processing device 310 . (4) The control item of the air blowing device 414 is air blowing flow, which is adjusted according to the current processing speed of the laser processing device 310 .

In the implementation and application of the blowing device 414 of the technology of this case, the laser processing device 310 (welding head) and the processing path 810 of the processing surface 600 maintain a vertical normal vector 801 relationship, by controlling the laser processing device 310 during processing The speed between paths 810 maintains the first relative motion relationship. The air blowing device 414 is located behind the processing direction of the laser processing device 310, and mostly blows air to the processing part in a side blowing manner, and the blowing angle of the air blowing device 414 maintains a fixed angle θ with the processing plane 800, by controlling The speed between the air blowing device 414 and the processing path 810 maintains the second relative motion relationship. In practical applications, the blowing device 414 maintains a preset blowing distance 415 with the laser processing device 310, that is, the first relative movement relationship and the second relative movement relationship include a preset distance (the blowing distance 415 ), and the blowing distance 415 is calculated along the machining path 810 . In this way, by knowing the path planning of the laser processing device 310 and matching the control posture requirements of the blowing device 414 (including the blowing flow rate of the control item), the processing accessory device 410 (the processing accessory device 410 (the The air blowing device 414) is planned to maintain the relative position and directionality between the laser processing trajectory and the processing accessory device 410 (the air blowing device 414), so as to achieve better laser processing effect.

Please refer to Figure 2 and Figure 3, which are block diagrams 2 and 3 of the laser processing machine control system in this case. In practical applications, further, the laser processing device 310 can be coupled to a sensor 510, so that the control unit 200 can judge the laser processing device 310 and The relative relationship between the processing attachments 410 is based on the movement information of the first driving device 300 to generate the second command 220 for controlling the second driving device 400 .

Similarly, in practical applications, the first driving device 300 may also be coupled to a sensor 520, so that the control unit 200 can judge the laser processing according to a sensing signal 521 from the sensor 520. The relative relationship between the device 310 and the processing accessory device 410 is based on the motion information of the first driving device 300 to generate the second command 220 for controlling the second driving device 400 . In practice, the sensors 510 and 520 are encoders, optical scales or other sensors.

In this case, through the known path planning of the laser processing head and the relationship of the processing surface in space, the auxiliary equipment is planned according to the processing path, and the auxiliary equipment planning for the processing path and its matching is provided in accordance with the control attitude requirements of the auxiliary equipment, so as to maintain laser processing The relative position and direction of the track and the attachment device achieve better laser processing effect.

The embodiments disclosed above are only illustrative of the principles, characteristics and effects of this creation, and are not intended to limit the scope of implementation of this creation. Anyone who is familiar with this technology can do so without violating the spirit and scope of this creation. Modifications and changes are made to the above-mentioned embodiments. Any equivalent changes and modifications accomplished by utilizing the content disclosed in this creation shall still be covered by the scope of the following patent application.

10: Processing machine 100: input unit 110: Processing file 200: control unit 210: First order 220: second order 300: the first driving device 310:Laser processing device 311: focal length 400:Second driving device 410: Processing attachments 411: wire feeding device 412: Wire feeding distance 413: Seam Tracker 414: blowing device 415: Blowing distance 510, 520: sensors 511, 521: sensing signal 600: machining surface 610, 710, 810: processing path 601, 701, 702, 801: normal vector 711: Seam tracking distance

[Figure 1] is the first block diagram of the control system of the laser processing machine in this case. [Figure 2] is the second block diagram of the control system of the laser processing machine in this case. [Figure 3] is the third block diagram of the control system of the laser processing machine in this case. [Figure 4] is a schematic diagram of the implementation of the wire feeding device in the laser processing of this case. [Figure 5] is a schematic diagram of the implementation of the weld seam tracker in the laser processing of this case. [Fig. 6] is a schematic diagram of the implementation of the air blowing device in the laser processing of this case.

10: Processing machine

100: input unit

110: Processing file

200: control unit

210: First order

220: second order

300: the first driving device

310:Laser processing device

400:Second driving device

410: Processing attachments

Claims (8)

A laser processing attachment control system, applied to a processing machine for laser processing, including: a first drive device coupled to a laser processing device; a second driving device coupled to a processing attachment; A control unit, which is coupled to the first driving device and the second driving device, the control unit generates a first command to control the first driving device according to a processing file of a workpiece, the control unit generates a first command according to the first The movement information of the driving device generates a second command for controlling the second driving device; During laser processing, the first driving device maintains a first relative motion relationship between the laser processing device and the processing surface of the workpiece according to the first command; During laser processing, the second driving device maintains a second relative motion relationship between the processing attachment device and the processing surface of the workpiece according to the second command. The laser processing accessory device control system as described in Claim 1, wherein the laser processing device is a laser welding device, and the processing accessory device is a wire feeding device, a seam tracker or an air blowing device . The laser processing accessory device control system according to claim 1, wherein when the relative relationship between the laser processing device and the processing accessory device has been built in the processing file, the control unit according to the first The motion information of the driving device generates the second command for controlling the second driving device. The laser processing accessory device control system as described in claim 1, wherein the first driving device or the laser processing device is coupled to a sensor, and the control unit is based on a sensing signal from the sensor The signal judges the relative relationship between the laser processing device and the processing accessory device, and then generates the second command according to the motion information of the first driving device to control the second driving device. The laser processing attachment device control system according to claim 1, wherein the control unit maintains the first relative motion relationship according to the relative speed between the laser processing device and the workpiece. The laser processing attachment control system according to claim 1, wherein the control unit maintains the second relative motion relationship according to the relative speed between the processing attachment and the workpiece. The laser processing attachment device control system according to claim 1, wherein the laser processing device and the processing attachment device are non-coaxially actuated. The laser processing accessory device control system according to Claim 1, wherein the first relative motion relationship and/or the second relative motion relationship further include a preset distance.

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