TWM636799U - Connection extension mechanism for signal transmission lines - Google Patents
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Abstract
本新型為一種訊號傳輸線的連接延長機構,包括兩個訊號傳輸線、一電路板、一晶片、一金屬殼體及一絕緣殼體。兩個訊號傳輸線一端的外披覆層被移除,使得原本被外披覆層包覆的導線及導電層外露。兩個訊號傳輸線的導線經由電路板及晶片相連接,而金屬殼體則包覆電路板及晶片。此外金屬殼體還連接兩個訊號傳輸線外露的導電層,並以絕緣殼體包覆金屬殼體及部分的兩個訊號傳輸線。透過本新型所述的內容可在兩個相連接的訊號傳輸線之間形成完成的連接延長機構,不僅可延長訊號傳輸線的長度,更可提高連接的強度,同時可補償傳輸訊號的衰減。The present invention relates to a connection extension mechanism for signal transmission lines, which comprises two signal transmission lines, a circuit board, a chip, a metal shell and an insulating shell. The outer cladding layer at one end of the two signal transmission lines is removed, so that the wire and the conductive layer originally covered by the outer cladding layer are exposed. The wires of the two signal transmission lines are connected through the circuit board and the chip, and the metal shell covers the circuit board and the chip. In addition, the metal shell is also connected to the exposed conductive layers of the two signal transmission lines, and the metal shell and part of the two signal transmission lines are covered by the insulating shell. Through the content described in the present invention, a complete connection extension mechanism can be formed between two connected signal transmission lines, which can not only extend the length of the signal transmission line, but also improve the strength of the connection, and at the same time compensate for the attenuation of the transmission signal.
Description
本新型有關於一種訊號傳輸線的連接延長機構,不需在訊號傳輸線上額外設置母及公連接器進行連接,便可延長訊號傳輸線的長度及提高連接的強度,並可補償傳輸訊號的衰減及失真,同時可改善插拔連接器可能產生的干擾性及防水性不佳所造成的訊號衰減。The present invention relates to a connection extension mechanism for a signal transmission line, which can extend the length of the signal transmission line and improve the strength of the connection without additionally setting a female and male connector on the signal transmission line for connection, and can compensate for the attenuation and distortion of the transmission signal , At the same time, it can improve the signal attenuation caused by the possible interference and poor waterproof performance of the plug-in connector.
訊號傳輸線主要用以傳輸高頻的訊號,高頻訊號在傳輸的過程中能量容易由傳輸線中以電磁波的形式輻射至外部,當傳輸訊號的頻率越高時能量損失會越嚴重。因此訊號傳輸線通常會設置相關的構造,例如在訊號傳輸線的外圍設置屏蔽構造,以防止高頻訊號能量損耗及外部訊號的干擾。The signal transmission line is mainly used to transmit high-frequency signals. During the transmission process, the energy of high-frequency signals is easily radiated from the transmission line to the outside in the form of electromagnetic waves. The higher the frequency of the transmission signal, the more serious the energy loss will be. Therefore, signal transmission lines are usually equipped with related structures, such as shielding structures around the signal transmission line, to prevent high-frequency signal energy loss and external signal interference.
一般而言,訊號傳輸線的長度有其限制,若訊號傳輸線整體的長度越長,銅導體壓降越大,功率衰減越大,超過一定的範圍,往往會造成訊號傳輸的損害,而造成訊號傳輸出現錯誤或失真,例如USB訊號傳輸線的長度大多會在3公尺以內,並以1.2公尺為較佳。在實際應用時,若傳輸訊號的頻率越高,訊號傳輸線的長度可能會更短,以防止訊號傳輸出現錯誤。Generally speaking, the length of the signal transmission line has its limitations. If the overall length of the signal transmission line is longer, the copper conductor voltage drop will be greater, and the power attenuation will be greater. If it exceeds a certain range, it will often cause damage to the signal transmission and cause signal transmission. Errors or distortions occur. For example, the length of the USB signal transmission line is mostly within 3 meters, and 1.2 meters is better. In practical applications, if the frequency of the transmission signal is higher, the length of the signal transmission line may be shorter to prevent errors in signal transmission.
本新型提供一種訊號傳輸線的連接延長機構,主要包括至少兩個訊號傳輸線、一電路板、至少一晶片、一金屬殼體及一絕緣殼體。訊號傳輸線包括複數個導線、一導電層及一外披覆層,其中導電層包覆複數個導線,而外披覆層則包覆導電層。The present invention provides a connection extension mechanism for signal transmission lines, which mainly includes at least two signal transmission lines, a circuit board, at least one chip, a metal shell and an insulating shell. The signal transmission line includes a plurality of wires, a conductive layer and an outer coating layer, wherein the conductive layer covers the plurality of wires, and the outer coating layer covers the conductive layer.
訊號傳輸線一端的外披覆層被移除,使得訊號傳輸線一端的導線及導電層外露。兩個訊號傳輸線的導線經由電路板及晶片電性相連接,並透過金屬殼體包覆電路板及晶片。連接兩個訊號傳輸線的晶片可用以補償及減少傳輸訊號的衰減。The outer covering layer at one end of the signal transmission line is removed, so that the wire and the conductive layer at one end of the signal transmission line are exposed. The wires of the two signal transmission lines are electrically connected through the circuit board and the chip, and the circuit board and the chip are covered by a metal casing. The chip connecting the two signal transmission lines can be used to compensate and reduce the attenuation of the transmission signal.
金屬殼體分別連接兩個訊號傳輸線一端的導電層,並用以屏蔽被金屬殼體所包覆的電路板及晶片。絕緣殼體用以包覆金屬殼體積及兩個訊號傳輸線的一端,以在兩個訊號傳輸線之間形成完整的連接延長機構,並可避免金屬殼體直接接觸外界的環境。透過本新型所述的內容,不需要在訊號傳輸線上設置對應的公連接器及母連接器,便可增加訊號傳輸線的長度,不僅可延長訊號傳輸線的長度,更可提高訊號傳輸線連接的強度,同時可補償或減少傳輸訊號的衰減。此外更可改善習用技術透過插拔連接器延長訊號傳輸線的長度,可能產生的干擾性及防水性不佳所造成的訊號衰減。The metal casing is respectively connected to the conductive layers at one end of the two signal transmission lines, and is used for shielding the circuit board and the chip covered by the metal casing. The insulating shell is used to cover the volume of the metal shell and one end of the two signal transmission lines, so as to form a complete connection extension mechanism between the two signal transmission lines, and prevent the metal shell from directly contacting the external environment. Through the content described in this new model, the length of the signal transmission line can be increased without the need for corresponding male connectors and female connectors on the signal transmission line, which can not only extend the length of the signal transmission line, but also improve the connection strength of the signal transmission line. At the same time, it can compensate or reduce the attenuation of the transmission signal. In addition, it can also improve the interference and signal attenuation caused by poor waterproof performance that may be caused by extending the length of the signal transmission line through the conventional technology through the plug-in connector.
在本新型一實施例中,可將兩個訊號傳輸線上外露的導電層反摺至外披覆層,並在外披覆層上形成反摺部。此外亦可先將訊號傳輸線一端的外披覆層減薄後,在將外露的導電層反摺至減薄部。In an embodiment of the present invention, the exposed conductive layers on the two signal transmission lines can be folded to the outer cladding layer, and the folded portion is formed on the outer cladding layer. In addition, the outer cladding layer at one end of the signal transmission line can also be thinned first, and then the exposed conductive layer can be folded back to the thinned portion.
在不同實施例中,亦可選擇將兩個訊號傳輸線一端的部分外披覆層移除,並在訊號傳輸線上形成削切部,其中削切部上的導電層外露,並在訊號傳輸線的一端形成外露導電層。透過減薄部及削切部的設置,可進一步降低訊號傳輸線的連接延長機構的線徑及體積。In different embodiments, part of the outer cladding layer at one end of the two signal transmission lines can also be selected to be removed, and a cutting portion is formed on the signal transmission line, wherein the conductive layer on the cutting portion is exposed, and at one end of the signal transmission line An exposed conductive layer is formed. Through the setting of the thinning part and the cutting part, the wire diameter and volume of the connection extension mechanism of the signal transmission line can be further reduced.
為此本新型提供一種訊號傳輸線的連接延長機構,包括:至少兩個訊號傳輸線,包括:複數個導線,包括一內導體芯線及一絕緣層,其中絕緣層包覆內導體芯線;一導電層,包覆複數個導線;一外披覆層,包覆導電層的外週面,其中兩個訊號傳輸線一端的導電層為裸露,並形成一外露導電層;一電路板,位於兩個訊號傳輸線之間,並電性連接兩個訊號傳輸線的導線;至少一晶片,設置在電路板上;一金屬殼體,包覆電路板及晶片,其中金屬殼體連接兩個訊號傳輸線的外露導電層,而電路板及晶片則位於金屬殼體形成的一容置空間內;及一絕緣殼體,包覆金屬殼體及部分兩個訊號傳輸線。To this end, the present invention provides a connection extension mechanism for signal transmission lines, including: at least two signal transmission lines, including: a plurality of wires, including an inner conductor core wire and an insulating layer, wherein the insulating layer covers the inner conductor core wire; a conductive layer, Covering a plurality of wires; an outer cladding layer covering the outer peripheral surface of the conductive layer, wherein the conductive layer at one end of the two signal transmission lines is exposed and forms an exposed conductive layer; a circuit board is located between the two signal transmission lines between, and electrically connect the wires of the two signal transmission lines; at least one chip, set on the circuit board; a metal shell, covering the circuit board and the chip, wherein the metal shell connects the exposed conductive layers of the two signal transmission lines, and The circuit board and the chip are located in an accommodating space formed by the metal casing; and an insulating casing wraps the metal casing and part of the two signal transmission lines.
在本新型至少一實施例中,其中兩個訊號傳輸線的外露導電層分別反摺至兩個訊號傳輸線的外披覆層,並在兩個訊號傳輸線的一端形成一反摺部,而金屬殼體連接訊號傳輸線的反摺部。In at least one embodiment of the present invention, the exposed conductive layers of the two signal transmission lines are respectively folded to the outer covering layers of the two signal transmission lines, and a folded portion is formed at one end of the two signal transmission lines, and the metal shell Connect the reflexed part of the signal transmission line.
在本新型至少一實施例中,其中兩個訊號傳輸線一端的外披覆層包括一減薄部,減薄部的截面積小於外披覆層,而外露導電層反摺至減薄部,並在減薄部上形成一反摺部,而金屬殼體連接訊號傳輸線的反摺部。In at least one embodiment of the present invention, the outer cladding layer at one end of the two signal transmission lines includes a thinned portion, the cross-sectional area of the thinned portion is smaller than that of the outer cladding layer, and the exposed conductive layer is folded back to the thinned portion, and An inflection portion is formed on the thinned portion, and the metal shell is connected to the inflection portion of the signal transmission line.
在本新型至少一實施例中,其中外披覆層的減薄部包括至少一凹槽,而外露導電層則反摺至凹槽內。In at least one embodiment of the present invention, the thinned portion of the outer cladding layer includes at least one groove, and the exposed conductive layer is folded into the groove.
在本新型至少一實施例中,其中晶片包括重計時器、中繼器、電子標記晶片或功率放大晶片。In at least one embodiment of the present invention, the chip includes a re-timer, a repeater, an electronic marker chip or a power amplifier chip.
在本新型至少一實施例中,其中金屬殼體包括一第一金屬殼體及一第二金屬殼體,第一金屬殼體及第二金屬殼體用以包覆電路板及晶片,並用以夾住兩個訊號傳輸線的外露導電層。In at least one embodiment of the present invention, the metal shell includes a first metal shell and a second metal shell, the first metal shell and the second metal shell are used to cover the circuit board and the chip, and are used to Sandwiches the exposed conductive layers of two signal transmission lines.
在本新型至少一實施例中,其中第一金屬殼體及第二金屬殼體的兩端皆包括一夾持部,並用以夾住兩個訊號傳輸線的外露導電層。In at least one embodiment of the present invention, both ends of the first metal shell and the second metal shell include a clamping portion for clamping the exposed conductive layers of the two signal transmission lines.
在本新型至少一實施例中,包括一金屬導電層包覆金屬殼體的兩端,而絕緣殼體則包覆金屬殼體及金屬導電層。In at least one embodiment of the present invention, a metal conductive layer covers both ends of the metal shell, and the insulating shell covers the metal shell and the metal conductive layer.
在本新型至少一實施例中,其中導線包括一訊號線、一排流線或一電源線。In at least one embodiment of the present invention, the wire includes a signal wire, a stream wire or a power wire.
在本新型至少一實施例中,其中外披覆層的減薄部包括至少一削切部,而位於削切部的導電層為外露並形成外露導電層。In at least one embodiment of the present invention, the thinned portion of the outer cladding layer includes at least one cut portion, and the conductive layer located at the cut portion is exposed and forms an exposed conductive layer.
圖1為本新型訊號傳輸線的連接延長機構一實施例的立體分解示意圖及剖面示意圖,圖2為本新型訊號傳輸線一實施例的剖面示意圖。如圖所示,訊號傳輸線的連接延長機構100主要包括至少兩個訊號傳輸線10、一電路板21、至少一晶片23及一金屬殼體25,其中晶片23設置於電路板21,並經由電路板21電性連接兩個訊號傳輸線10,而金屬殼體25則用以包覆電路板21、晶片23及部分兩個訊號傳輸線10。FIG. 1 is a three-dimensional exploded schematic view and a schematic cross-sectional view of an embodiment of a connection extension mechanism of the new signal transmission line, and FIG. 2 is a schematic cross-sectional view of an embodiment of the new signal transmission line. As shown in the figure, the
在本新型一實施例中,如圖2所示,訊號傳輸線10包括複數個導線11、一導電層13及一外披覆層(jacket)15,其中導電層13用以包覆複數個導線11,而外披覆層15則包覆導電層13的外週面。In one embodiment of the present invention, as shown in FIG. 2 , the
導線11包括內導體芯線111及絕緣層113,其中絕緣層113包覆內導體芯線111的外週面,以隔離複數個導線11的內導體芯線111。The
導電層13可以是單層或多層的結構,例如導電層13可以是由金屬導線編織或纏繞的網狀導電體、鋁箔及/或由鋁箔麥拉編織或纏繞的網狀構造,並在複數個導線11的外部形成接地屏蔽,以避免導線11受到外部電磁訊號的干擾。The
在本新型另一實施例中,導電層13可為兩層結構,並包括網狀導電體及鋁箔麥拉,其中鋁箔麥拉包覆導線11,而網狀導電體則包覆鋁箔麥拉。In another embodiment of the present invention, the
外披覆層15為絕緣材質,其中外披覆層15具有絕緣、防水等功能,並用以保護及固定複數個導線11。例如外披覆層15包括聚氯乙烯(PVC) 、低密度聚乙烯(LDPE)、氟化乙烯丙烯共聚物(FEP)或熱塑性彈性體(TPE)。具體而言,本新型實施例的訊號傳輸線10可以是同軸電纜、USB傳輸線或HDMI傳輸線等。The
如圖3所示,在連接兩個訊號傳輸線10時,可以將兩個訊號傳輸線10一端或兩端的外披覆層15移除,使得訊號傳輸線10一端的導線11及導電層13為裸露,其中導電層13會在訊號傳輸線10的一端形成外露導電層131。As shown in Figure 3, when two
如圖2所示,可進一步將外露導電層131反摺至外披覆層15,並在外披覆層15的表面形成反摺部133。將外露導電層131反摺至外披覆層15上僅為本新型一實施例,在實際應用時可不用將外露導電層131反摺,並直接連接圖3所示的兩個訊號傳輸線10。As shown in FIG. 2 , the exposed
在本新型一實施例中,如圖4及圖5所示,訊號傳輸線10的一端或兩端的外披覆層15可設置一減薄部151,其中減薄部151的截面積小於外披覆層15的截面積。在本新型多個實施例中之一,訊號傳輸線10的外觀近似柱狀體,並可透過研磨或削切的方式,沿著柱狀體的徑向均勻的減薄外披覆層15的厚度,使得減薄部151的外徑小於外披覆層15的外徑,例如外披覆層15及減薄部151的剖面皆為環狀。In one embodiment of the present invention, as shown in Fig. 4 and Fig. 5, a
外露導電層131可反摺至減薄部151,並在減薄部151上形成反摺部133。在本新型一實施例中,外披覆層15的減薄部151可以是凹槽,例如凹槽可沿著平行外披覆層15的徑向設置,並朝導電層15的方向內凹,並可將外露導電層131反摺至凹槽內。The exposed
在本新型另一實施例中,如圖6所示,外披覆層15的減薄部151可以是削切部153,例如在外披覆層15上形成兩個對稱的削切部153。削切部153可包括一削切面,其中削切面為外披覆層15形成的圓形剖面的割線。In another embodiment of the present invention, as shown in FIG. 6 , the
削切部153的削切面可連接導電層13,使得位於削切部153的導電層13為外露,並形成一外露導電層131。在本新型實施例中,外露導電層131可不用反摺至外披覆層15,便可進行兩個訊號傳輸線10的連接。The cut surface of the
如圖1所示,可在兩個訊號傳輸線10之間設置電路板21,其中電路板21上設置複數個連接端子211,例如於電路板21的兩端分別設置一連接端子211,其中兩個訊號傳輸線10的導線11分別連接位於電路板21兩端的連接端子211。As shown in Figure 1, a
至少一晶片23設置於電路板21上,並電性連接電路板21的兩個連接端子211,其中兩個訊號傳輸線10的導線11分別經由電路板21的連接端子211及晶片23相連接,例如晶片23包括重計時器(retimer)、中繼器(redriver)、電子標記晶片(Emarker)或功率放大器(Power Amplifier),晶片23可用以補償或減少訊號傳輸線的連接延長機構100傳輸的訊號衰減。At least one
如圖1及圖7所示,金屬殼體25用以包覆電路板21、晶片23及/或部分的訊號傳輸線10,其中金屬殼體25包括一容置空間250,而電路板21及晶片23則位於金屬殼體25的容置空間250內,以保護電路板21及晶片23。As shown in Figures 1 and 7, the
此外,金屬殼體25分別連接兩個訊號傳輸線10的外露導電層131或反摺部133,其中兩個訊號傳輸線10的導電層13經由金屬殼體25相連接,使得金屬殼體25在電路板21及晶片23的外部形成屏蔽構造。In addition, the
在本新型一實施例中,金屬殼體25可包括一第一金屬殼體251及一第二金屬殼體253,其中第一金屬殼體251連接第二金屬殼體253時,會在兩者之間形成容置空間250。在實際應用時,可透過第一金屬殼體251及第二金屬殼體253包覆電路板21及晶片23,而後透過固定單元將第一金屬殼體251及第二金屬殼體鎖固在兩個訊號傳輸線10上,例如固定單元可以是螺絲或是雷射焊錫。In an embodiment of the present invention, the
此外第一金屬殼體251及第二金屬殼體253的兩端可分別設置一夾持部252,分別用以連接及夾住兩個訊號傳輸線10的外露導電層131或反摺部133,使得第一金屬殼體251及第二金屬殼體253扣合在兩個訊號傳輸線10上。例如第一金屬殼體251的夾持部252為單片式的凸出構造,並可由上方抵住訊號傳輸線10的外露導電層131或反摺部133,而第二金屬殼體253的夾持部252則為雙叉式的構造,並可由下方托住訊號傳輸線10的外露導電層131或反摺部133。In addition, the two ends of the
如圖8所示,可進一步透過一金屬導電層17包覆金屬殼體25的兩端,例如金屬導電層17可為銅箔或鋁箔,並纏繞在第一金屬殼體251及第二金屬殼體253兩端的夾持部252上。在本新型一實施例中,金屬導電層17亦可包覆部分的訊號傳輸線10的外披覆層15。As shown in Figure 8, the two ends of the
如圖9所示,可進一步透過一絕緣殼體27包覆金屬殼體25、該金屬導電層17及部分訊號傳輸線10的外披覆層15,使得金屬殼體25及/或訊號傳輸線10的導電層13與外界隔離。As shown in FIG. 9, the
透過本新型所述的訊號傳輸線的連接延長機構100,可在兩個相連接的訊號傳輸線10之間形成完成的連接延長機構,不僅可延長訊號傳輸線10的長度,更可提高連接的強度,同時可補償或減少傳輸訊號的衰減。Through the
在本新型另一實施例中,圖4、圖5及圖6的兩個訊號傳輸線10同樣可透過圖1的電路板21及晶片23電性相連接,而後將金屬殼體25設置在圖4、圖5及圖6的訊號傳輸線10上。金屬殼體25用以包覆電路板21及晶片23,並連接圖4及圖5的減薄部151上的反摺部133,或者是連接圖6位於削切部153上的外露導電層131。In another embodiment of the present invention, the two
透過在訊號傳輸線10一端的外披覆層15上形成減薄部151或削切部153,可使用體積較小的金屬殼體25連接兩個訊號傳輸線10,並可縮小絕緣殼體27的體積,例如可使得絕緣殼體27包覆金屬殼體25後的截面積或線徑與兩個訊號傳輸線10相近。By forming a thinned
本新型所述的訊號傳輸線10內的導線11可以包括訊號線、電線、同軸電纜、CC線、SBU1線、SBU2線及/或Vconn線、排流線(drain wire)或電源線等。在實際應用時,可改變調整導線11的構造,使得導線11具有訊號傳輸、能量傳輸或接地等功能。The
以上所述者,僅為本新型之一較佳實施例而已,並非用來限定本新型實施之範圍,即凡依本新型申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本新型之申請專利範圍內。The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, any equal changes and changes made according to the shape, structure, characteristics and spirit described in the patent scope of the present application Modifications should be included in the scope of the patent application for the present model.
10:訊號傳輸線 100:訊號傳輸線的連接延長機構 11:導線 111:內導體芯線 113:絕緣層 13:導電層 131:外露導電層 133:反摺部 15:外披覆層 151:減薄部 153:削切部 17:金屬導電層 21:電路板 211:連接端子 23:晶片 25:金屬殼體 250:容置空間 251:第一金屬殼體 252:夾持部 253:第二金屬殼體 27:絕緣殼體 10: Signal transmission line 100: Connection extension mechanism of signal transmission line 11: wire 111: inner conductor core wire 113: insulation layer 13: Conductive layer 131: exposed conductive layer 133: Reflexed part 15: Outer coating layer 151: thinning part 153: cutting department 17: Metal conductive layer 21: Circuit board 211: Connecting terminal 23: Wafer 25: Metal shell 250:Accommodating space 251: The first metal shell 252: clamping part 253: Second metal shell 27: Insulation housing
[圖1]為本新型訊號傳輸線的連接延長機構一實施例的立體分解示意圖。[FIG. 1] It is a three-dimensional exploded schematic diagram of an embodiment of the connection extension mechanism of the new signal transmission line.
[圖2]為本新型訊號傳輸線一實施例的剖面示意圖。[ FIG. 2 ] is a schematic cross-sectional view of an embodiment of the new signal transmission line.
[圖3]為本新型訊號傳輸線又一實施例的剖面示意圖。[ FIG. 3 ] is a schematic cross-sectional view of another embodiment of the new signal transmission line.
[圖4]為本新型訊號傳輸線又一實施例的立體示意圖。[ FIG. 4 ] is a three-dimensional schematic view of another embodiment of the new signal transmission line.
[圖5]為本新型訊號傳輸線上述實施例的剖面示意圖。[ Fig. 5 ] is a schematic cross-sectional view of the above embodiment of the new signal transmission line.
[圖6]為本新型訊號傳輸線又一實施例的立體示意圖。[ FIG. 6 ] is a three-dimensional schematic view of another embodiment of the new signal transmission line.
[圖7]為本新型訊號傳輸線的連接延長機構一實施例的立體示意圖。[ FIG. 7 ] is a three-dimensional schematic view of an embodiment of the connection extension mechanism of the new signal transmission line.
[圖8]為本新型訊號傳輸線的連接延長機構又一實施例的立體示意圖。[ FIG. 8 ] is a three-dimensional schematic view of another embodiment of the connection extension mechanism of the new signal transmission line.
[圖9]為本新型訊號訊號傳輸線的連接延長機構又一實施例的立體示意圖。[ FIG. 9 ] is a three-dimensional schematic view of another embodiment of the connection extension mechanism of the new signal transmission line.
10:訊號傳輸線 10: Signal transmission line
100:訊號傳輸線的連接延長機構 100: Connection extension mechanism of signal transmission line
11:導線 11: wire
133:反摺部 133: Reflexed part
15:外披覆層 15: Outer coating layer
21:電路板 21: Circuit board
211:連接端子 211: Connecting terminal
23:晶片 23: Wafer
250:容置空間 250:Accommodating space
251:第一金屬殼體 251: The first metal shell
252:夾持部 252: clamping part
253:第二金屬殼體 253: Second metal shell
Claims (10)
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TW111208803U TWM636799U (en) | 2022-08-12 | 2022-08-12 | Connection extension mechanism for signal transmission lines |
Applications Claiming Priority (1)
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TW111208803U TWM636799U (en) | 2022-08-12 | 2022-08-12 | Connection extension mechanism for signal transmission lines |
Publications (1)
Publication Number | Publication Date |
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TWM636799U true TWM636799U (en) | 2023-01-21 |
Family
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TW111208803U TWM636799U (en) | 2022-08-12 | 2022-08-12 | Connection extension mechanism for signal transmission lines |
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2022
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