TWM632219U - Structure of intelligent memory - Google Patents

Structure of intelligent memory Download PDF

Info

Publication number
TWM632219U
TWM632219U TW111204386U TW111204386U TWM632219U TW M632219 U TWM632219 U TW M632219U TW 111204386 U TW111204386 U TW 111204386U TW 111204386 U TW111204386 U TW 111204386U TW M632219 U TWM632219 U TW M632219U
Authority
TW
Taiwan
Prior art keywords
notification module
memory
micro
control unit
control signal
Prior art date
Application number
TW111204386U
Other languages
Chinese (zh)
Inventor
張錦峰
郭熙霖
Original Assignee
十銓科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 十銓科技股份有限公司 filed Critical 十銓科技股份有限公司
Priority to TW111204386U priority Critical patent/TWM632219U/en
Publication of TWM632219U publication Critical patent/TWM632219U/en

Links

Images

Landscapes

  • Debugging And Monitoring (AREA)
  • Saccharide Compounds (AREA)

Abstract

The present invention provides a structure of an intelligent memory, which is a temperature detection method and structure, which is used in a memory device, wherein the memory device includes a substrate, a temperature sensor, a plurality of memory chips, a micro-control unit, and a notification module. The steps include generating at least one temperature value according to the temperature of the plurality of memory chips sensed by the temperature sensor, transmitting the at least one temperature value to the micro-control unit, and the micro-control unit determining whether the at least one temperature value is not less than a first threshold value, When at least one temperature value is not less than the first threshold value, the micro-control unit transmits a first control signal to a notification module, which can further be used for the method and structure for displaying real-time information.

Description

全智能記憶體之結構 The structure of a fully intelligent memory

本創作係關於一種記憶體之結構,特別是一種全智能記憶體之結構。 This work is about the structure of a memory, especially the structure of a fully intelligent memory.

記憶體是一種儲存資料用的電子裝置,目前普遍用於電腦、手機、遊戲軟體等需要儲存資料的用品。 Memory is an electronic device for storing data. Currently, it is commonly used in computers, mobile phones, game software and other supplies that need to store data.

固態硬碟是一種積體電路製作的儲存硬碟,至1989年第一款固態硬碟被發行至今,也已普遍用於各種硬碟相關領域,相較於傳統硬碟,具有讀取速度更快、低耗能等優勢。 Solid-state hard disk is a storage hard disk made of integrated circuits. Since the first solid-state hard disk was released in 1989, it has also been widely used in various hard disk related fields. Compared with traditional hard disks, it has higher reading speed. Fast, low energy consumption and other advantages.

串列匯流排電路(I2C)是一種串列通訊匯流排,使用兩條通訊線達成積體電路(IC)之間訊息的傳遞。 A serial bus circuit (I 2 C) is a serial communication bus that uses two communication lines to transmit messages between integrated circuits (ICs).

為了監測電腦內部零件溫度,但不希望增加過多的體積的情況下,發展出將溫度感測器結合至電子式可抹除程式化唯讀記憶體(EEPROM),而EEPROM可藉由特定電壓,進行多次資訊抹除並填入新資訊,EEPROM也常用於DDR記憶體內部。 In order to monitor the temperature of the internal parts of the computer, but do not want to increase too much volume, the temperature sensor is developed to integrate the electronic erasable programmable read-only memory (EEPROM), and the EEPROM can be adjusted by a specific voltage. EEPROM is also commonly used inside DDR memory to perform multiple data erasures and fill in new information.

現今,電腦普及於各地,包含家用個人電腦、方便攜帶筆記型電腦、公司與學校內人員使用的電腦、進行工業製造或實驗室裡操作的執行製程步驟以及收集資料的電腦。 Today, computers are ubiquitous everywhere, including home personal computers, portable notebook computers, computers used by personnel in companies and schools, computers that perform process steps in industrial manufacturing or laboratory operations, and computers that collect data.

自從電腦產品普及於各地後,使用者開始利用電腦進行各種娛樂、比賽,追求電腦效能、自行組裝以及增加電腦效能、增加記憶體空間等,而除了效能以外電腦外殼也走向非單一顏色外殼,並開始有圖案設計,更開始將外殼走向透明設計,配合燈光設置,可以清楚看到內部結構,包含風扇等零件是否運轉,而使用RGB燈光配合程式,使電腦運作時,可依照使用者喜好發出特定顏色光芒,走向個人化設計。 Since the popularity of computer products in various places, users have begun to use computers for various entertainment and competitions, pursuing computer performance, self-assembly, and increasing computer performance and memory space. It started with a pattern design, and even started to move the casing to a transparent design. With the lighting settings, you can clearly see the internal structure, including whether the fan and other parts are running. Using the RGB lighting with the program, the computer can emit specific lights according to the user's preferences. Color radiance, towards personal design.

電腦與其相關商品執行時發出光芒普遍出現於電競類電腦設備,其功能僅限於增加電腦的絢麗程度,僅能得知該設備有執行工作。 Computers and their related products emit light when they are executed, which is commonly seen in gaming computer equipment. Its function is limited to increasing the splendor of the computer, and it can only be known that the equipment is performing work.

於工廠內執行工作時,設備通常設有提醒功能,或是額外增設一些偵測器,異常時發出特定顏色或是使用蜂鳴器進行警告,使用者可即時停止運作並進行維修,或是通知人員於氣體外洩等異常狀況發生時,進行緊急撤離,減少意外導致傷亡發生,而使設備正常運行之電腦通常不會額外增設燈光或蜂鳴器去揭露電腦自身狀態,如電腦內部零件溫度,人員在確認狀態時須進入電腦程式去讀取零件溫度,而工廠電腦於執行時螢幕都是顯示執行製造之狀態,或是需要人員控制之執行頁面,不會時時刻刻顯示電腦狀態。 When performing work in the factory, the equipment usually has a reminder function, or some additional detectors are added. When abnormal, it emits a specific color or uses a buzzer to warn the user. The user can immediately stop the operation and perform maintenance, or notify When abnormal situations such as gas leakage occur, personnel should be evacuated urgently to reduce accidents and casualties. Computers that enable normal operation of equipment usually do not add additional lights or buzzers to reveal the state of the computer itself, such as the temperature of the internal parts of the computer. When the personnel confirm the status, they must enter the computer program to read the temperature of the parts. When the factory computer is running, the screen will display the status of the manufacturing, or the execution page that needs to be controlled by the personnel. The computer status will not be displayed all the time.

因此,電腦零件溫度異常時,現場人員難以即時發現,而是溫度異常導致電腦無法正常執行時才意識到散熱系統異常或是其他原因導致電腦溫度過高。 Therefore, when the temperature of computer parts is abnormal, it is difficult for on-site personnel to find out immediately, but only when the abnormal temperature causes the computer to not operate normally will they realize that the cooling system is abnormal or other reasons cause the computer to be overheated.

此外,若工廠內部電腦能於記憶體溫度異常導致溫度過高發生之前,有一警告現場人員的方法,則可以減少更多因為溫度過高所導致的記憶體損壞發生。 In addition, if the computer in the factory can have a method to warn the on-site personnel before the abnormal temperature of the memory causes the overheating, it can reduce the occurrence of memory damage caused by the overheating.

本創作提供一種全智能記憶體,其係針對為解決習知得知記憶體之溫度需透過中央處理器,使其增加中央處理器之資源負載,且其並無設計其他結構或方法予以顯示記憶體之相關狀態。。 This creation provides an all-intelligent memory, which is aimed at solving the conventional knowledge that the temperature of the memory needs to be passed through the central processing unit to increase the resource load of the central processing unit, and no other structure or method is designed to display the memory. related state of the body. .

本創作之一目的,在於提供一種全智能記憶體之結構,其可依據記憶體內部溫度感測器自動偵測記憶裝置之溫度,達到自動偵測溫度之目的。 One purpose of the present invention is to provide an all-intelligent memory structure, which can automatically detect the temperature of the memory device according to the internal temperature sensor of the memory, so as to achieve the purpose of automatic temperature detection.

針對上述之目的,本創作提供一種具溫度監測之全智能記憶體之結構,其用於一記憶裝置,該記憶裝置包含一基板、一溫度感測器、複數個記憶晶片、一微控制單元以及一通知模組,該溫度感測器、該些個記憶晶片、該微控制單元以及該通知模組設置於該基板,該全智能記憶裝置之溫度監測方法之步驟包含:依據該溫度感測器感測該些個記憶晶片之溫度產生該至少一溫度數值;當該至少一溫度數值傳輸至該微控制單元判定並該至少一溫度數值是否不小於一第一門檻值;及當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞一第一控制訊號至一通知模組。 For the above purpose, the present invention provides an all-smart memory structure with temperature monitoring, which is used in a memory device, and the memory device includes a substrate, a temperature sensor, a plurality of memory chips, a micro-control unit, and a notification module, the temperature sensor, the memory chips, the micro-control unit and the notification module are arranged on the substrate, and the steps of the temperature monitoring method of the all-intelligent memory device include: according to the temperature sensor Sensing the temperature of the memory chips to generate the at least one temperature value; when the at least one temperature value is transmitted to the microcontroller, it is determined whether the at least one temperature value is not less than a first threshold value; and when the at least one temperature value is If the value is not less than the first threshold value, the micro-control unit transmits a first control signal to a notification module.

本創作提供一實施例,其中,於當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞該第一控制訊號至該通知模組之步驟中,該微控制單元判定該至少一溫度數值是否小於一第二門檻值,若是則該微控制單元傳遞該第一控制訊號至該通知模組。 The present invention provides an embodiment, wherein, in the step of transmitting the first control signal to the notification module by the micro-control unit when the at least one temperature value is not less than the first threshold value, the micro-control unit determines that the Whether at least one temperature value is less than a second threshold value, if so, the micro-control unit transmits the first control signal to the notification module.

本創作提供一實施例,其中,於當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞該第一控制訊號至該通知模組之步驟中,當該至少一溫度數值不小於該第二門檻值,該微控制單元進一步判定該至少一溫度數值是否小於一第三門檻值,若是則該微控制單元傳遞一第二控制訊號至該通知模組,若否則該微控制單元傳遞一第三控制訊號至該通知模組。 The present invention provides an embodiment, wherein, in the step of transmitting the first control signal to the notification module by the micro-control unit when the at least one temperature value is not less than the first threshold value, when the at least one temperature value is not less than the second threshold value, the micro-control unit further determines whether the at least one temperature value is less than a third threshold value, if so, the micro-control unit transmits a second control signal to the notification module; otherwise, the micro-controller The unit transmits a third control signal to the notification module.

本創作提供一實施例,其中,該通知模組包含一第一發光裝置,該通知模組接收到該第一控制訊號時,該第一發光裝置以一第一對應顏色進行發光。 The present invention provides an embodiment, wherein the notification module includes a first light-emitting device, and when the notification module receives the first control signal, the first light-emitting device emits light in a first corresponding color.

本創作提供一實施例,其中,該通知模組包含一第二發光裝置以及一第三發光裝置,該通知模組接收到該第二控制訊號時,該第二發光裝置以一第二對應顏色進行發光,該通知模組接收到該第三控制訊號時,該第三發光裝置以一第三對應顏色進行發光。 The present invention provides an embodiment, wherein the notification module includes a second light-emitting device and a third light-emitting device, and when the notification module receives the second control signal, the second light-emitting device displays a second corresponding color When the notification module receives the third control signal, the third lighting device emits light in a third corresponding color.

本創作提供一實施例,其中,該通知模組包含一蜂鳴器,該通知模組接收到該第一控制訊號時,該蜂鳴器產生一第一聲響,該通知模組接收到該第二控制訊號時,該蜂鳴器產生一第二聲響,該通知模組接收到該第三控制訊號時,該蜂鳴器產生一第三聲響。 The present invention provides an embodiment, wherein the notification module includes a buzzer, when the notification module receives the first control signal, the buzzer generates a first sound, and the notification module receives the first control signal. When the second control signal is received, the buzzer generates a second sound, and when the notification module receives the third control signal, the buzzer generates a third sound.

本創作提供一實施例,其中,該記憶裝置為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 The present invention provides an embodiment, wherein the memory device is a volatile memory or a non-volatile memory or a solid state hard disk.

本創作提供一實施例,其中,該記憶裝置係電性連接一主機板,一中央處理器透過該主機板傳遞一控制命令至該記憶裝置。 The present invention provides an embodiment, wherein the memory device is electrically connected to a mainboard, and a central processing unit transmits a control command to the memory device through the mainboard.

本創作之另一目的,在於提供一種全智能記憶體之結構,利用微控制單元判定體之溫度數值及門檻值,若溫度數值不小於門檻值,微控制單元傳遞控制訊號至通知模組,使通知模組可即時通知現場人員。 Another object of this creation is to provide a structure of an all-intelligent memory. The micro-control unit is used to determine the temperature value and the threshold value of the body. If the temperature value is not less than the threshold value, the micro-control unit transmits a control signal to the notification module, so that the The notification module can instantly notify field personnel.

針對上述之目的,本創作提供一種具有溫度監測的全智能記憶體之結構,該全智能記憶體包含:一基板,設置一微控制單元及複數個記憶晶片,該微控制單元電性連接該些個記憶晶片;一溫度感測器,係設置於該基板上方,與該微控制單元電性連接,其係用以感測該些個記憶晶片之其中之一;及一通知模組,係設置於該基板上方,與該微控制單元電性連接;其中,該微控制單元接收來自該溫度感測器之至少一溫度數值,若該至少一溫度數值不小於一第一門檻值時,該微控制單元傳遞一第一控制訊號至該通知模組。 For the above purpose, the present invention provides a structure of an all-smart memory with temperature monitoring. The all-smart memory includes: a substrate, a micro-control unit and a plurality of memory chips, and the micro-control unit is electrically connected to these a memory chip; a temperature sensor disposed above the substrate and electrically connected to the micro-control unit for sensing one of the memory chips; and a notification module disposed Above the substrate, it is electrically connected to the micro-control unit; wherein, the micro-control unit receives at least one temperature value from the temperature sensor, and if the at least one temperature value is not less than a first threshold value, the micro-control unit The control unit transmits a first control signal to the notification module.

本創作提供一實施例,其中,於當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞該第一控制訊號至該通知模組之步驟中,該微控制單元判定該至少一溫度數值是否小於一第二門檻值,若是則該微控制單元傳遞該第一控制訊號至該通知模組。 The present invention provides an embodiment, wherein, in the step of transmitting the first control signal to the notification module by the micro-control unit when the at least one temperature value is not less than the first threshold value, the micro-control unit determines that the Whether at least one temperature value is less than a second threshold value, if so, the micro-control unit transmits the first control signal to the notification module.

本創作提供一實施例,其中,於當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞該第一控制訊號至該通知模組之步驟中,當該至少一溫度數值不小於該第二門檻值,該微控制單元進一步判定該至少一溫度數值是否小於一第三門檻值,若是則該微控制單元傳遞一第二控制訊號至該通知模組,若否則該微控制單元傳遞一第三控制訊號至該通知模組。 The present invention provides an embodiment, wherein, in the step of transmitting the first control signal to the notification module by the micro-control unit when the at least one temperature value is not less than the first threshold value, when the at least one temperature value is not less than the second threshold value, the micro-control unit further determines whether the at least one temperature value is less than a third threshold value, if so, the micro-control unit transmits a second control signal to the notification module; otherwise, the micro-controller The unit transmits a third control signal to the notification module.

本創作提供一實施例,其中,該通知模組包含一第一發光裝置,該通知模組接收到該第一控制訊號時,該第一發光裝置以一第一對應顏色進行發光。 The present invention provides an embodiment, wherein the notification module includes a first light-emitting device, and when the notification module receives the first control signal, the first light-emitting device emits light in a first corresponding color.

本創作提供一實施例,其中,該通知模組包含一第二發光裝置以及一第三發光裝置,該通知模組接收到該第二控制訊號時,該第二發光裝置以一第二對應顏色進行發光,該通知模組接收到該第三控制訊號時,該第三發光裝置以一第三對應顏色進行發光。 The present invention provides an embodiment, wherein the notification module includes a second light-emitting device and a third light-emitting device, and when the notification module receives the second control signal, the second light-emitting device displays a second corresponding color When the notification module receives the third control signal, the third lighting device emits light in a third corresponding color.

本創作提供一實施例,其中,該通知模組包含一蜂鳴器,該通知模組接收到該第一控制訊號時,該蜂鳴器產生一第一聲響,該通知模組接收到該第二控制訊號時,該蜂鳴器產生一第二聲響,該通知模組接收到該第三控制訊號時,該蜂鳴器產生一第三聲響。 The present invention provides an embodiment, wherein the notification module includes a buzzer, when the notification module receives the first control signal, the buzzer generates a first sound, and the notification module receives the first control signal. When the second control signal is received, the buzzer generates a second sound, and when the notification module receives the third control signal, the buzzer generates a third sound.

本創作提供一實施例,其中,該全智能記憶體為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 The present invention provides an embodiment, wherein the all-intelligent memory is a volatile memory or a non-volatile memory or a solid state hard disk.

本創作提供一實施例,其中,該全智能記憶體電性連接一主機板,一中央處理器透過該主機板傳遞一控制命令至該記憶裝置。 The present invention provides an embodiment, wherein the all-intelligent memory is electrically connected to a mainboard, and a central processing unit transmits a control command to the memory device through the mainboard.

又,本創作之另一目的,在於提供一種全智能記憶體,通訊軟體來訊息時可利用全智能記憶體的通知模組進行通知。 In addition, another purpose of the present invention is to provide an all-smart memory, and the notification module of the all-smart memory can be used for notification when a communication software receives a message.

針對上述之目的,本創作提供一種具有通知功能的全智能記憶體,其用於一記憶裝置,且其係電性連接一主機板,該主機板電性連接一中央處理器,該記憶裝置包含一基板、一微控制單元以及一通知模組,該微控制單元以及該通知模組設置於該基板,該全智能記憶體之監測方法之步驟包含一電子裝置經由一伺服器傳送一即時訊號至該主機板,該主機板以該中央處理器執行一軟體接收該即時訊號,該中央處理器傳遞一訊號至該微控制單元,以及該微控制單元傳遞一控制訊號以作動該通知模組。 In view of the above purpose, the present invention provides a fully intelligent memory with notification function, which is used in a memory device, and is electrically connected to a motherboard, the motherboard is electrically connected to a central processing unit, and the memory device includes A substrate, a micro-control unit and a notification module, the micro-control unit and the notification module are arranged on the substrate, and the steps of the monitoring method for the all-intelligent memory include an electronic device sending a real-time signal via a server to the mainboard, the mainboard uses the central processing unit to execute a software to receive the real-time signal, the central processing unit transmits a signal to the micro-control unit, and the micro-control unit transmits a control signal to activate the notification module.

本創作提供一實施例,其中,該軟體為即時通訊軟體或遊戲軟體。 This creation provides an embodiment, wherein the software is instant messaging software or game software.

本創作提供一實施例,其中,該通知模組包含一第一發光裝置、一第二發光裝置以及一第三發光裝置,該通知模組接收到該控制訊號時,該第一發光裝置、該第二發光裝置以及該第三發光裝置以一對應顏色進行發光。 The present invention provides an embodiment, wherein the notification module includes a first lighting device, a second lighting device and a third lighting device, when the notification module receives the control signal, the first lighting device, the The second light-emitting device and the third light-emitting device emit light in a corresponding color.

本創作提供一實施例,其中,該通知模組包含一蜂鳴器,該通知模組接收到該控制訊號時,該蜂鳴器產生一對應聲響。 The present invention provides an embodiment, wherein the notification module includes a buzzer, and when the notification module receives the control signal, the buzzer generates a corresponding sound.

本創作提供一實施例,其中,該記憶裝置為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 The present invention provides an embodiment, wherein the memory device is a volatile memory or a non-volatile memory or a solid state hard disk.

本創作另提供一種具有通知功能的全智能記憶體之結構,且其係電性連接一主機板,該主機板電性連接一中央處理器,該全智能記憶體包含:一基板,設置一微控制單元,以及一通知模組,係設置於該基板上方,與該微控制單元電性連接,其中,一電子裝置經由一伺服器傳送一即時訊號至該主機板,該主機板以該中央處理器執行一軟體接收該即時訊號,該中央處理器傳遞一訊號至該微控制單元,該微控制單元傳遞一控制訊號以作動該通知模組。 The present invention also provides a structure of an all-smart memory with a notification function, which is electrically connected to a mainboard, and the mainboard is electrically connected to a central processing unit. The all-smart memory includes: a substrate; The control unit and a notification module are disposed above the substrate and are electrically connected to the micro-control unit, wherein an electronic device transmits a real-time signal to the mainboard via a server, and the mainboard uses the central processing The controller executes a software to receive the real-time signal, the central processing unit transmits a signal to the micro-control unit, and the micro-control unit transmits a control signal to activate the notification module.

本創作提供另一實施例,其中,該軟體為即時通訊軟體或遊戲軟體。 This creation provides another embodiment, wherein the software is instant messaging software or game software.

本創作提供另一實施例,其中,該通知模組包含一第一發光裝置、一第二發光裝置以及一第三發光裝置,該通知模組接收到該控制訊號時,該第一發光裝置、該第二發光裝置以及該第三發光裝置以一對應顏色進行發光。 The present invention provides another embodiment, wherein the notification module includes a first lighting device, a second lighting device and a third lighting device, when the notification module receives the control signal, the first lighting device, The second light-emitting device and the third light-emitting device emit light in a corresponding color.

本創作提供另一實施例,其中,該通知模組包含一蜂鳴器,該通知模組接收到該控制訊號時,該蜂鳴器產生一對應聲響。 The present invention provides another embodiment, wherein the notification module includes a buzzer, and when the notification module receives the control signal, the buzzer generates a corresponding sound.

本創作提供另一實施例,其中,該全智能記憶體為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 The present invention provides another embodiment, wherein the all-intelligent memory is a volatile memory or a non-volatile memory or a solid state hard disk.

1:主機板 1: Motherboard

10:記憶裝置 10: Memory device

101:基板 101: Substrate

102:微控制單元 102: Micro Control Unit

103:溫度感測器 103: Temperature sensor

104:記憶晶片 104: Memory Chip

1041:溫度數值 1041: temperature value

105:通知模組 105: Notification Module

1051:第一發光裝置 1051: The first light-emitting device

1052:第二發光裝置 1052: Second Lighting Device

1053:第三發光裝置 1053: Third Lighting Device

1054:蜂鳴器 1054: Buzzer

11:中央處理器 11: CPU

111:軟體 111: Software

112:訊號 112:Signal

113:控制訊號 113: Control signal

114:對應顏色 114: corresponding color

115:對應聲響 115: Corresponding sound

21:第一門檻值 21: The first threshold value

211:第一控制訊號 211: The first control signal

212:第一對應顏色 212: The first corresponding color

213:第一聲響 213: First sound

22:第二門檻值 22: The second threshold

221:第二控制訊號 221: The second control signal

222:第二對應顏色 222: The second corresponding color

223:第二聲響 223: Second Sound

23:第三門檻值 23: The third threshold

231:第三控制訊號 231: The third control signal

232:第三對應顏色 232: The third corresponding color

233:第三聲響 233: The third sound

3:電子裝置 3: Electronic device

4:伺服器 4: Server

41:即時訊號 41: Instant Signal

S10-S30:步驟 S10-S30: Steps

S31:步驟 S31: Step

S32:步驟 S32: Step

S33:步驟 S33: Step

S40-S50:步驟 S40-S50: Steps

S51-S52:步驟 S51-S52: Steps

S53:步驟 S53: Step

S60-S61:步驟 S60-S61: Steps

S62:步驟 S62: Step

S70-S110:步驟 S70-S110: Steps

S120:步驟 S120: Steps

第1圖:其為本創作之第一實施例之全智能記憶體之溫度檢測方法流程圖;第2圖:其為本創作之第一實施例之全智能記憶體之結構方塊圖;第3圖:其為本創作之第二實施例之全智能記憶體之溫度檢測方法流程圖;第4圖:其為本創作之第二實施例之全智能記憶體之結構方塊圖;第5圖:其為本創作之第三實施例之全智能記憶體之溫度檢測方法流程圖;第6圖:其為本創作之第三實施例之全智能記憶體之結構方塊圖;第7圖:其為本創作之第四實施例之全智能記憶體之通知方法流程圖;第8圖:其為本創作之第四實施例之全智能記憶體之結構方塊圖;第9圖:其為本創作之第五實施例之全智能記憶體之通知方法流程圖第10圖:其為本創作之第五實施例之全智能記憶體之結構方塊圖;第11圖:其為本創作之第六實施例之全智能記憶體之通知方法流程圖;及第12圖:其為本創作之第六實施例之全智能記憶體之結構方塊圖。 Fig. 1: It is a flow chart of the temperature detection method of the all-smart memory according to the first embodiment of the present invention; Fig. 2: It is a block diagram of the structure of the all-smart memory according to the first embodiment of the present invention; Fig. 3 Figure: It is the flow chart of the temperature detection method of the all-smart memory of the second embodiment of the present invention; Figure 4: It is a block diagram of the structure of the all-smart memory of the second embodiment of the present invention; Figure 5: It is a flow chart of the temperature detection method of the all-smart memory of the third embodiment of the present invention; Fig. 6: It is a block diagram of the structure of the all-smart memory of the third embodiment of the present invention; Fig. 7: It is The flow chart of the notification method of the all-intelligent memory of the fourth embodiment of the present creation; Fig. 8: It is a block diagram of the structure of the all-smart memory of the fourth embodiment of the present creation; Fig. 9: It is the present creation The flow chart of the notification method of the all-intelligent memory according to the fifth embodiment. Fig. 10 is a block diagram of the structure of the all-smart memory according to the fifth embodiment of the present invention. Fig. 11 is the sixth embodiment of the present invention. The flow chart of the notification method of the all-smart memory; and Figure 12: It is a block diagram of the structure of the all-smart memory of the sixth embodiment of the creation.

為使 貴審查委員對本創作之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明,說明如後: 習知記憶體雖有設計發光結構,但僅用於外觀變化,並無自我監控系統去監測記憶體溫度是否過高,導致記憶體溫度過高時,使用者無法即時察覺。 In order to enable your reviewers to have a further understanding and understanding of the characteristics of this creation and the effects achieved, I would like to provide a preferred embodiment and a detailed description. The description is as follows: Although the conventional memory is designed with a light-emitting structure, it is only used for appearance changes, and there is no self-monitoring system to monitor whether the memory temperature is too high, so that the user cannot immediately notice when the memory temperature is too high.

而本創作提供一種全智能記憶體,以記憶體本身設置溫度感測器感測記憶體溫度,藉由微控制單元進行溫度比對,並發出對應控制訊號至通知模組,配合先前使用者於電腦使用對應軟體所設置門檻值、發光裝置之RGB混色設定以及蜂鳴器設定,電腦中央處理器將其設定結果以一訊號,藉由一訊號線傳遞至記憶體之微控制單元或藉由另一訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之微控制單元,通知模組依照微控制單元提供之對應控制訊號使內部發光裝置以及蜂鳴器做出對應反應,進而達到記憶體溫度過高時即時通知使用者之功效。 The present invention provides a fully intelligent memory. A temperature sensor is set up in the memory to sense the temperature of the memory, and the temperature is compared by a micro-control unit, and a corresponding control signal is sent to a notification module. The computer uses the threshold value set by the corresponding software, the RGB color mixing setting of the light-emitting device and the buzzer setting. The computer central processing unit transmits the setting result as a signal to the micro-control unit of the memory through a signal line or through another. A signal line is transmitted to the solid-state hard disk controller, and then the solid-state hard disk controller is transmitted to the micro-control unit of the solid-state hard disk, notifying the module according to the corresponding control signal provided by the micro-control unit. Corresponding response, so as to achieve the effect of notifying the user immediately when the memory temperature is too high.

在下文中,將藉由圖式來說明本創作之各種實施例來詳細描述本創作。然而本創作之概念可能以許多不同型式來體現,且不應解釋為限於本文中所闡述之例式性實施例。 Hereinafter, the present creation will be described in detail by illustrating various embodiments of the present creation by means of drawings. The concepts of the present creation may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.

首先,請參閱第1圖,其係為本創作之第一實施例之全智能記憶體之溫度檢測方法流程圖,如圖所示,本創作之全智能記憶體之溫度檢測方法之第一實施例步驟如下:步驟S10:溫度感測器103感測複數個記憶晶片104之溫度產生至少一溫度數值1041;步驟S20:溫度感測器103傳遞至少一溫度數值1041至微控制單元102; 步驟S30:微控制單元102判定至少一溫度數值1041是否不小於第一門檻值21,若是,則執行步驟S31;若否,則回到步驟S10;及步驟S31:微控制單元102傳遞第一控制訊號211至通知模組105。 First, please refer to FIG. 1, which is a flow chart of the temperature detection method of the all-smart memory according to the first embodiment of the present invention. As shown in the figure, the first implementation of the temperature detection method of the all-smart memory of the present invention For example, the steps are as follows: step S10: the temperature sensor 103 senses the temperature of the plurality of memory chips 104 to generate at least one temperature value 1041; step S20: the temperature sensor 103 transmits at least one temperature value 1041 to the micro-control unit 102; Step S30: The micro-control unit 102 determines whether the at least one temperature value 1041 is not less than the first threshold value 21, and if so, executes step S31; if not, returns to step S10; and step S31: the micro-control unit 102 transmits the first control Signal 211 to notification module 105 .

請參閱第2圖,其係為本創作之第一實施例之結構方塊圖,如圖所示,本創作之全智能記憶體之結構,其用於一記憶裝置10,該記憶裝置10包含一基板101、一溫度感測器103、複數個記憶晶片104、一微控制單元102以及一通知模組105,其中,該溫度感測器103、該些個記憶晶片104、該微控制單元102以及該微控制單元102設置於該基板101,該溫度感測器103電性連接該些個記憶晶片104,該微控制單元102電性連接該溫度感測器103以及該通知模組105。 Please refer to FIG. 2, which is a block diagram of the structure of the first embodiment of the present invention. As shown in the figure, the structure of the all-intelligent memory of the present invention is used in a memory device 10. The memory device 10 includes a The substrate 101, a temperature sensor 103, a plurality of memory chips 104, a micro-control unit 102 and a notification module 105, wherein the temperature sensor 103, the memory chips 104, the micro-control unit 102 and The micro-control unit 102 is disposed on the substrate 101 , the temperature sensor 103 is electrically connected to the memory chips 104 , and the micro-control unit 102 is electrically connected to the temperature sensor 103 and the notification module 105 .

再次參閱第1圖,底下將詳細說明本創作之全智能記憶體之溫度檢測方法之第一實施例步驟,如步驟S10所示,一記憶裝置10之該溫度感測器103感測該記憶裝置10之複數個記憶晶片104,其中,該溫度感測器103可從該些個記憶晶片104中選擇一或多個記憶晶片104之溫度產生至少一溫度數值1041,該記憶裝置10可為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 Referring to FIG. 1 again, the steps of the first embodiment of the temperature detection method of the all-smart memory of the present invention will be described in detail below. As shown in step S10, the temperature sensor 103 of a memory device 10 senses the memory device The plurality of memory chips 104 of 10, wherein the temperature sensor 103 can select the temperature of one or more memory chips 104 from the plurality of memory chips 104 to generate at least one temperature value 1041, and the memory device 10 can be a volatile volatile memory or a non-volatile memory or a solid state hard drive.

如步驟S20所示,該溫度感測器103將產生該至少一溫度數值1041傳遞至該微控制單元102。 As shown in step S20 , the temperature sensor 103 generates the at least one temperature value 1041 and transmits it to the micro-control unit 102 .

如步驟S30所示,該微控制單元102將該至少一溫度數值1041與該第一門檻值21進行比對,判定該至少一溫度數值1041是否不小於該第一門檻值21,若是,則執行步驟S31;若否,則回到步驟S10,其中,該第一門檻值21於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由主機板1上設置之中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11 藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S30, the micro-control unit 102 compares the at least one temperature value 1041 with the first threshold value 21, and determines whether the at least one temperature value 1041 is not less than the first threshold value 21, and if so, executes Step S31 ; if not, go back to Step S10 , wherein the first threshold value 21 has been set by the user opening the corresponding program of the computer before the process starts, and the setting result is set by the central processing unit 11 set on the motherboard 1 It is transmitted to the microcontroller 102 or the central processing unit 11 through a signal line The signal line is transmitted to the solid-state hard disk controller, and then the solid-state hard disk controller is transmitted to the microcontroller unit 102 of the solid-state hard disk.

如步驟S31所示,該微控制單元102將傳遞該第一控制訊號211至該通知模組105。 As shown in step S31 , the micro-control unit 102 will transmit the first control signal 211 to the notification module 105 .

本創作第一實施例之該記憶裝置10內設置該溫度感測器103,該記憶裝置10可自行感測該記憶裝置10自身溫度,並即時將溫度傳遞至通知模組105,解決習知需要藉由電腦設置之感測器才能偵測記憶體之溫度,例如偵測揮發性記憶體、非揮發性記憶體與固態硬碟之溫度及其使用率/健康度。 The temperature sensor 103 is set in the memory device 10 of the first embodiment of the present invention. The memory device 10 can sense the temperature of the memory device 10 by itself, and transmit the temperature to the notification module 105 in real time, so as to solve the conventional needs The temperature of the memory can be detected by the sensor set in the computer, such as the temperature of volatile memory, non-volatile memory and solid state hard disk and its usage/health.

接續上述,請參閱第3圖,其為本創作之第二實施例之全智能記憶體之溫度檢測方法流程圖,其中步驟S10至步驟S20與前一實施例相同,不再贅述。 Continuing the above, please refer to FIG. 3 , which is a flow chart of a temperature detection method for an all-smart memory according to the second embodiment of the present invention, wherein steps S10 to S20 are the same as those in the previous embodiment, and will not be repeated here.

本創作第二實施例步驟如下:步驟S30:微控制單元102判定至少一溫度數值1041是否不小於第一門檻值21,若是,則執行步驟S31以及步驟S40;若否,則回到步驟S10;步驟S31:微控制單元102傳遞第一控制訊號211至通知模組105;步驟S32:通知模組105依據第一控制訊號211產生第一對應顏色212;步驟S40:微控制單元102判定至少一溫度數值1041是否小於第二門檻值22,若是,則執行步驟S31;若否,則執行步驟S50;步驟S50:微控制單元102判定至少一溫度數值1041是否小於第三門檻值23,若是,則執行步驟S51;若否,則執行步驟S60;步驟S51:微控制單元102傳遞第二控制訊號221至通知模組105; 步驟S52:通知模組105依據第二控制訊號221產生第二對應顏色222;步驟S60:微控制單元102傳遞第三控制訊號231至通知模組105;步驟S61:通知模組105依據第三控制訊號231產生第三對應顏色232。 The steps of the second embodiment of the present creation are as follows: Step S30: The micro-control unit 102 determines whether at least one temperature value 1041 is not less than the first threshold value 21, if so, executes steps S31 and S40; if not, returns to step S10; Step S31: The micro-control unit 102 transmits the first control signal 211 to the notification module 105; Step S32: The notification module 105 generates the first corresponding color 212 according to the first control signal 211; Step S40: The micro-control unit 102 determines at least one temperature Whether the value 1041 is less than the second threshold value 22, if so, go to step S31; if not, go to step S50; Step S50: the micro-control unit 102 determines whether at least one temperature value 1041 is less than the third threshold value 23, if so, execute Step S51 ; if not, go to Step S60 ; Step S51 : the micro-control unit 102 transmits the second control signal 221 to the notification module 105 ; Step S52: the notification module 105 generates the second corresponding color 222 according to the second control signal 221; Step S60: the microcontroller 102 transmits the third control signal 231 to the notification module 105; Step S61: the notification module 105 according to the third control The signal 231 generates a third corresponding color 232 .

請參閱第4圖,其係為本創作之第二實施例之結構方塊圖,如圖所示,本創作之全智能記憶體之結構,其用於該記憶裝置10,該記憶裝置10包含該基板101、該溫度感測器103、該些個記憶晶片104、該微控制單元102以及該通知模組105,其中,該溫度感測器103、該些個記憶晶片104、該微控制單元102以及該微控制單元102設置於該基板101,該溫度感測器103電性連接該些個記憶晶片104,該微控制單元102電性連接該溫度感測器103以及該通知模組105,其中該通知模組105包含一第一發光裝置1051、一第二發光裝置1052、一第三發光裝置1053。 Please refer to FIG. 4, which is a block diagram of the structure of the second embodiment of the present invention. As shown in the figure, the structure of the all-intelligent memory of the present invention is used in the memory device 10, and the memory device 10 includes the The substrate 101 , the temperature sensor 103 , the memory chips 104 , the microcontroller unit 102 and the notification module 105 , wherein the temperature sensor 103 , the memory chips 104 , the microcontroller unit 102 and the micro-control unit 102 is disposed on the substrate 101, the temperature sensor 103 is electrically connected to the memory chips 104, the micro-control unit 102 is electrically connected to the temperature sensor 103 and the notification module 105, wherein The notification module 105 includes a first lighting device 1051 , a second lighting device 1052 , and a third lighting device 1053 .

再次參閱第3圖,底下將詳細說明本創作之全智能記憶體之溫度檢測方法之第二實施例步驟,如步驟S30所示,該微控制單元102將該至少一溫度數值1041與該第一門檻值21進行比對,判定該至少一溫度數值1041是否不小於該第一門檻值21,若是,則執行步驟S31以及步驟S40;若否則回到步驟S10。 Referring to FIG. 3 again, the steps of the second embodiment of the temperature detection method of the all-smart memory of the present invention will be described in detail below. As shown in step S30, the micro-control unit 102 associates the at least one temperature value 1041 with the first temperature value 1041. The threshold value 21 is compared to determine whether the at least one temperature value 1041 is not less than the first threshold value 21 , if so, go to step S31 and step S40 ; otherwise, go back to step S10 .

步驟S31與前一實施例相同,不再贅述。 Step S31 is the same as that in the previous embodiment, and will not be repeated here.

如步驟S32所示,該通知模組105包含該第一發光裝置1051、該第二發光裝置1052以及該第三發光裝置1053,該通知模組105依據該第一控制訊號211使該第一發光裝置1051以一第一對應顏色212發光,其中,該第一對應顏色212於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由 中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S32 , the notification module 105 includes the first lighting device 1051 , the second lighting device 1052 and the third lighting device 1053 , and the notification module 105 makes the first lighting device 105 according to the first control signal 211 The device 1051 emits light with a first corresponding color 212, wherein the first corresponding color 212 has been set by the user to open the corresponding program of the computer before the process starts, and the setting result is set by The central processing unit 11 transmits the signal line to the microcontroller unit 102, or the central processing unit 11 transmits the signal line to the solid-state hard disk controller, and then the solid-state hard disk controller transmits it to the microcontroller of the solid-state hard disk unit 102.

如步驟S40所示,該微控制單元102將該至少一溫度數值1041與一第二門檻值22進行比對,判定該至少一溫度數值1041是否小於該第二門檻值22,若是,則執行步驟S31;若否,則執行步驟S50,其中,該第二門檻值22於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S40, the micro-control unit 102 compares the at least one temperature value 1041 with a second threshold value 22 to determine whether the at least one temperature value 1041 is smaller than the second threshold value 22, and if so, execute the step S31; if not, go to step S50, wherein the second threshold value 22 has been set by the user to start the corresponding program of the computer before the process starts, and the setting result is transmitted to the microcomputer through the central processing unit 11 through the signal line The control unit 102 or the central processing unit 11 is transmitted to the solid-state hard disk controller through a signal line, and then transmitted from the solid-state hard disk controller to the microcontroller unit 102 of the solid-state hard disk.

如步驟S50所示,該微控制單元102將該至少一溫度數值1041與一第三門檻值23進行比對,判定該至少一溫度數值1041是否小於該第三門檻值23,若是,則執行步驟S51;若否,則執行步驟S53,其中,該第三門檻值23於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S50, the micro-control unit 102 compares the at least one temperature value 1041 with a third threshold value 23 to determine whether the at least one temperature value 1041 is smaller than the third threshold value 23, and if so, execute the step S51; if not, go to step S53, wherein the third threshold value 23 has been set by the user to start the corresponding program of the computer before the process starts, and the setting result is transmitted to the microcomputer through the central processing unit 11 through the signal line The control unit 102 or the central processing unit 11 is transmitted to the solid-state hard disk controller through a signal line, and then transmitted from the solid-state hard disk controller to the microcontroller unit 102 of the solid-state hard disk.

如步驟S51所示,該微控制單元102將傳遞一第二控制訊號221至該通知模組105。 As shown in step S51 , the micro-control unit 102 will transmit a second control signal 221 to the notification module 105 .

如步驟S52所示,該通知模組105依據該第二控制訊號221第二發光裝置1052以一第二對應顏色222發光,其中,該第二對應顏色222於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S52, the notification module 105 emits light in a second corresponding color 222 according to the second control signal 221 and the second light-emitting device 1052, wherein the second corresponding color 222 has been turned on by the user before the process starts The corresponding program is set, and the setting result is transmitted to the micro-control unit 102 through the central processing unit 11 through the signal line, or the central processing unit 11 is transmitted to the solid-state hard disk controller through the signal line, and then controlled by the solid-state hard disk The controller is transmitted to the microcontroller unit 102 of the solid state drive.

如步驟S60所示,該微控制單元102將傳遞一第三控制訊號231至該通知模組105。 As shown in step S60 , the micro-control unit 102 will transmit a third control signal 231 to the notification module 105 .

如步驟S61所示,該通知模組105依據該第三控制訊號231使第三發光裝置1053以一第三對應顏色232發光,其中,該第三對應顏色232於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S61, the notification module 105 causes the third light-emitting device 1053 to emit light with a third corresponding color 232 according to the third control signal 231, wherein the third corresponding color 232 has been turned on by the user before the process starts The corresponding program of the computer is set, and the setting result is transmitted to the micro-control unit 102 through the central processing unit 11 through the signal line, or the central processing unit 11 is transmitted to the solid-state hard disk controller through the signal line, and then the solid-state hard disk is transmitted. The controller is passed to the microcontroller unit 102 of the solid state drive.

本創作第二實施例之該記憶裝置10內設置該溫度感測器103,該記憶裝置10可自行感測該記憶裝置10自身溫度,並即時偵測該記憶裝置10之溫度藉由通知模組105,通知模組105內部第一發光裝置1051、第二發光裝置1052以及第三發光裝置1053通知使用者,解決習知需要藉由電腦查詢電腦各部件狀態才能得到溫度等資訊,達到使用者可即時瞭解該記憶裝置10之溫度狀態以及判斷是否要進行降溫等處理,可解決使用者無法於記憶體溫度過高時即時反應導致記憶體損壞之問題,例如偵測揮發性記憶體、非揮發性記憶體與固態硬碟之溫度及其使用率/健康度。 The temperature sensor 103 is set in the memory device 10 of the second embodiment of the present invention. The memory device 10 can sense the temperature of the memory device 10 by itself, and detect the temperature of the memory device 10 in real time through a notification module 105. The first light-emitting device 1051, the second light-emitting device 1052, and the third light-emitting device 1053 in the notification module 105 notify the user, so as to solve the conventional knowledge that it is necessary to query the status of each part of the computer to obtain information such as temperature, so that the user can obtain information such as temperature. Real-time understanding of the temperature state of the memory device 10 and judging whether to cool down or not can solve the problem that the user cannot respond immediately when the memory temperature is too high, causing memory damage, such as detecting volatile memory, non-volatile memory Memory and SSD temperatures and their usage/health.

接續上述,請參閱第5圖,其為本創作之第三實施例之全智能記憶體之溫度檢測方法流程圖,其中步驟S10至步驟S60、S31以及S51與第二實施例相同,不再贅述。 Continuing the above, please refer to FIG. 5, which is a flow chart of the temperature detection method of the all-smart memory according to the third embodiment of the invention, wherein steps S10 to S60, S31 and S51 are the same as those of the second embodiment, and will not be repeated here. .

本創作第三實施例步驟如下:步驟S33:通知模組105依據第一控制訊號211產生第一聲響213;步驟S53:通知模組105依據第二控制訊號221產生第二聲響223;步驟S62:通知模組105依據第三控制訊號231產生第三聲響233。 The steps of the third embodiment of the present creation are as follows: Step S33: the notification module 105 generates the first sound 213 according to the first control signal 211; Step S53: the notification module 105 generates the second sound 223 according to the second control signal 221; Step S62 : The notification module 105 generates a third sound 233 according to the third control signal 231 .

請參閱第6圖,其係為本創作之第三實施例之結構方塊圖,如圖所示,本創作之全智能記憶體之結構,其用於該記憶裝置10,該記憶裝置10包含該基板101、該溫度感測器103、該些個記憶晶片104、該微控制單元102以及該通知模組105,其中,該溫度感測器103、該些個記憶晶片104、該微控制單元102以及該微控制單元102設置於該基板101,該溫度感測器103電性連接該些個記憶晶片104,該微控制單元102電性連接該溫度感測器103以及該通知模組105,其中該通知模組105包含一蜂鳴器1054。 Please refer to FIG. 6, which is a block diagram of the structure of the third embodiment of the present invention. As shown in the figure, the structure of the all-intelligent memory of the present invention is used in the memory device 10, and the memory device 10 includes the The substrate 101 , the temperature sensor 103 , the memory chips 104 , the microcontroller unit 102 and the notification module 105 , wherein the temperature sensor 103 , the memory chips 104 , the microcontroller unit 102 and the micro-control unit 102 is disposed on the substrate 101, the temperature sensor 103 is electrically connected to the memory chips 104, the micro-control unit 102 is electrically connected to the temperature sensor 103 and the notification module 105, wherein The notification module 105 includes a buzzer 1054 .

再次參閱第5圖,底下將詳細說明本創作之全智能記憶體之溫度檢測方法之第三實施例步驟,如步驟S33所示,該通知模組105包含該蜂鳴器1054,該通知模組105依據該第一控制訊號211使該蜂鳴器1054產生一第一聲響213,其中,該第一聲響213於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由該中央處理器11藉由訊號線傳遞至該微控制單元102,或是該中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 Referring to FIG. 5 again, the steps of the third embodiment of the temperature detection method for an all-smart memory of the present invention will be described in detail below. As shown in step S33, the notification module 105 includes the buzzer 1054, and the notification module 105 causes the buzzer 1054 to generate a first sound 213 according to the first control signal 211, wherein the first sound 213 has been set by the user opening a corresponding program of the computer before the process starts, and the setting result is set by The central processing unit 11 is transmitted to the microcontroller unit 102 through a signal line, or the central processing unit 11 is transmitted to the solid-state hard disk controller through a signal line, and then transmitted from the solid-state hard disk controller to the solid-state hard disk. Micro Control Unit 102 .

如步驟S53所示,該通知模組105依據該第二控制訊號221使該蜂鳴器1054產生一第二聲響223,其中,該第二聲響223於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S53, the notification module 105 causes the buzzer 1054 to generate a second sound 223 according to the second control signal 221, wherein the second sound 223 corresponds to the user turning on the computer before the process starts The program is set, and the setting result is transmitted to the microcontroller unit 102 through the central processing unit 11 through the signal line, or the central processing unit 11 is transmitted to the solid-state hard disk controller through the signal line, and then transmitted by the solid-state hard disk controller. to the microcontroller unit 102 of the solid state hard disk.

如步驟S62所示,該通知模組105依據該第三控制訊號231使該蜂鳴器1054產生一第三聲響233,其中,該第三聲響233於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞 至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 As shown in step S62, the notification module 105 causes the buzzer 1054 to generate a third sound 233 according to the third control signal 231, wherein the third sound 233 corresponds to the user turning on the computer before the process starts The program is set, and the setting result is transmitted through the central processing unit 11 through the signal line To the microcontroller unit 102, or the central processing unit 11 transmits the signal to the solid-state hard disk controller through a signal line, and then the solid-state hard disk controller transmits the signal to the microcontroller unit 102 of the solid-state hard disk.

本創作第三實施例之該記憶裝置10內設置該溫度感測器103,該記憶裝置10可自行感測該記憶裝置10自身溫度,並即時偵測該記憶裝置10之溫度藉由通知模組105,通知模組105內部蜂鳴器1054通知使用者,解決習知需要藉由電腦查詢電腦各部件狀態才能得到溫度等資訊,達到使用者可即時瞭解該記憶裝置10之溫度狀態以及判斷是否要進行降溫等處理,可解決使用者無法於記憶體溫度過高時即時反應導致記憶體損壞之問題,例如偵測揮發性記憶體、非揮發性記憶體與固態硬碟之溫度及其使用率/健康度。 The temperature sensor 103 is set in the memory device 10 of the third embodiment of the present invention. The memory device 10 can sense the temperature of the memory device 10 by itself, and detect the temperature of the memory device 10 in real time through a notification module 105. The internal buzzer 1054 of the notification module 105 notifies the user to solve the conventional knowledge that it is necessary to query the status of various components of the computer to obtain information such as temperature, so that the user can instantly know the temperature status of the memory device 10 and determine whether to Cooling and other processing can solve the problem that the user cannot respond immediately when the memory temperature is too high, causing memory damage, such as detecting the temperature of volatile memory, non-volatile memory and solid-state hard disk and its usage/ health.

本創作之第二實施例之該通知模組105之該第一發光裝置1051、該第二發光裝置1052、該第三發光裝置1053以及第三實施例之該通知模組105之該蜂鳴器1054可合併使用。 The first light-emitting device 1051, the second light-emitting device 1052, the third light-emitting device 1053 of the notification module 105 of the second embodiment of the present invention and the buzzer of the notification module 105 of the third embodiment 1054 can be used in combination.

請參閱第7圖,其為本創作之第四實施例之全智能記憶體之通知方法流程圖,如圖所示,本創作之全智能記憶體之通知方法之第四實施例步驟如下:步驟S70:電子裝置3經由伺服器4傳送即時訊號41至主機板1;步驟S80:主機板1以中央處理器11執行軟體111接收即時訊號41;步驟S90:中央處理器11傳遞訊號112至微控制單元102;步驟S100:微控制單元102傳遞控制訊號113以作動通知模組105。 Please refer to FIG. 7, which is a flow chart of the notification method of the all-smart memory of the fourth embodiment of the present invention. As shown in the figure, the steps of the fourth embodiment of the notification method of the all-smart memory of the present invention are as follows: Steps S70: The electronic device 3 sends the real-time signal 41 to the motherboard 1 via the server 4; Step S80: The motherboard 1 uses the CPU 11 to execute the software 111 to receive the real-time signal 41; Step S90: The CPU 11 transmits the signal 112 to the microcontroller Unit 102 ; Step S100 : the micro-control unit 102 transmits the control signal 113 to actuate the notification module 105 .

請參閱第8圖,其係為本創作之第四實施例之結構方塊圖,如圖所示,一種全智能記憶體,其用於一記憶裝置10,該記憶裝置10,且其係電性連接一主機板1,該主機板1電性連接一中央處理器11,該記憶裝置10包含一基板 101、一微控制單元102以及一通知模組105,該微控制單元102以及該通知模組105設置於該基板101;軟體111係可為通訊軟體(例如:臉書或line或微信等等)或遊戲軟體。 Please refer to FIG. 8, which is a block diagram of the structure of the fourth embodiment of the present invention. As shown in the figure, an all-intelligent memory is used in a memory device 10, and the memory device 10 is electrically Connected to a motherboard 1, the motherboard 1 is electrically connected to a central processing unit 11, and the memory device 10 includes a substrate 101, a micro-control unit 102 and a notification module 105, the micro-control unit 102 and the notification module 105 are arranged on the substrate 101; the software 111 can be a communication software (for example: Facebook or line or WeChat, etc.) or game software.

再次參閱第7圖,底下將詳細說明本創作之全智能記憶體之通知方法之第四實施例步驟,如步驟S70所示,一電子裝置3內之通訊軟體傳遞一即時訊號41至一伺服器4,該伺服器4接收後將該即時訊號41至該主機板1。 Referring to FIG. 7 again, the steps of the fourth embodiment of the all-smart memory notification method of the present invention will be described in detail below. As shown in step S70, the communication software in an electronic device 3 transmits an instant signal 41 to a server 4. The server 4 sends the real-time signal 41 to the motherboard 1 after receiving it.

如步驟S80所示,該主機板1內部該中央處理器11執行一軟體111接收來自該伺服器4之該即時訊號41。 As shown in step S80 , the central processing unit 11 in the motherboard 1 executes a software 111 to receive the real-time signal 41 from the server 4 .

如步驟S90所示,該中央處理器11產生一訊號112並傳遞該訊號112至該微控制單元102。 As shown in step S90 , the central processing unit 11 generates a signal 112 and transmits the signal 112 to the microcontroller unit 102 .

如步驟S100所示,該微控制單元102傳遞一控制訊號113以作動該通知模組105。 As shown in step S100 , the micro-control unit 102 transmits a control signal 113 to activate the notification module 105 .

本創作第四實施例之該主機板1接收來自電子裝置3之通訊軟體訊息通知時,將其訊息經過中央處理器11接收並傳遞訊號112至微控制單元102,該微控制單元102傳遞控制訊號113至通知模組105,解決習知無法利用記憶裝置10取得使用者通訊軟體即時訊息之問題。 When the motherboard 1 of the fourth embodiment of the present invention receives a communication software message notification from the electronic device 3, it receives the message through the central processing unit 11 and transmits the signal 112 to the micro-control unit 102, and the micro-control unit 102 transmits the control signal 113 goes to the notification module 105 to solve the conventional problem that the memory device 10 cannot be used to obtain the instant message of the user communication software.

接續上述,請參閱第9圖,其為本創作之第五實施例之全智能記憶體之通知方法流程圖,其中步驟S70至步驟S100與前一實施例相同,不再贅述。 Continuing from the above, please refer to FIG. 9 , which is a flowchart of a notification method for an all-smart memory according to the fifth embodiment of the present invention, wherein steps S70 to S100 are the same as those in the previous embodiment, and will not be repeated.

本創作第五實施例步驟如下: The steps of the fifth embodiment of this creation are as follows:

步驟S110:通知模組105依據控制訊號113產生對應顏色114。 Step S110 : the notification module 105 generates the corresponding color 114 according to the control signal 113 .

請參閱第10圖,其係為本創作之第五實施例之結構方塊圖,如圖所示,一種全智能記憶體,其用於該記憶裝置10,該記憶裝置10,且其係電性連 接一主機板1,該主機板1電性連接一中央處理器11,該記憶裝置10包含一基板101、一微控制單元102以及一通知模組105,該微控制單元102以及該通知模組105設置於該基板101,其中該通知模組105包含該第一發光裝置1051、該第二發光裝置1052、該第三發光裝置1053。 Please refer to FIG. 10, which is a block diagram of the structure of the fifth embodiment of the present invention. As shown in the figure, an all-intelligent memory is used in the memory device 10, and the memory device 10 is electrical. even A mainboard 1 is connected, the mainboard 1 is electrically connected to a central processing unit 11, the memory device 10 includes a substrate 101, a micro-control unit 102 and a notification module 105, the micro-control unit 102 and the notification module 105 is disposed on the substrate 101 , wherein the notification module 105 includes the first light-emitting device 1051 , the second light-emitting device 1052 , and the third light-emitting device 1053 .

再次參閱第9圖,底下將詳細說明本創作之全智能記憶體之通知方法之第五實施例步驟,如步驟S110所示,該通知模組105包含該第一發光裝置1051、該第二發光裝置1052以及該第三發光裝置1053,該通知模組105依據該控制訊號113使該第一發光裝置1051、該第二發光裝置1052以及該第三發光裝置1053以一對應顏色114發光,其中,該對應顏色114於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 Referring to FIG. 9 again, the steps of the fifth embodiment of the notification method of the all-smart memory of the present invention will be described in detail below. As shown in step S110, the notification module 105 includes the first light-emitting device 1051, the second light-emitting device The device 1052 and the third lighting device 1053, the notification module 105 makes the first lighting device 1051, the second lighting device 1052 and the third lighting device 1053 emit light with a corresponding color 114 according to the control signal 113, wherein, The corresponding color 114 has been set by the user by starting the corresponding program of the computer before the process starts, and the setting result is transmitted to the microcontroller unit 102 through the central processing unit 11 through the signal line, or the central processing unit 11 through the signal line It is transmitted to the solid-state hard disk controller, and then transmitted from the solid-state hard disk controller to the microcontroller unit 102 of the solid-state hard disk.

本創作第五實施例之該主機板1接收來自電子裝置3之通訊軟體訊息通知時,將其訊息經過中央處理器11接收並傳遞訊號112至微控制單元102,該微控制單元102傳遞控制訊號113至通知模組105,通知模組105內部第一發光裝置1051、第二發光裝置1052以及第三發光裝置1053通知使用者,解決習知無法利用記憶裝置10即時通知使用者通訊軟體訊息之問題。 When the motherboard 1 of the fifth embodiment of the present invention receives a communication software message notification from the electronic device 3, it receives the message through the central processing unit 11 and transmits the signal 112 to the micro-control unit 102, and the micro-control unit 102 transmits the control signal 113 Go to the notification module 105, the first light-emitting device 1051, the second light-emitting device 1052 and the third light-emitting device 1053 inside the notification module 105 notify the user, so as to solve the conventional problem that the memory device 10 cannot be used to immediately notify the user of the message of the communication software .

接續上述,請參閱第11圖,其為本創作之第六實施例之全智能記憶體之通知方法流程圖,其中步驟S70至步驟S100與第四實施例相同,不再贅述。 Continuing from the above, please refer to FIG. 11 , which is a flowchart of a notification method for an all-smart memory according to the sixth embodiment of the present invention, wherein steps S70 to S100 are the same as those of the fourth embodiment, and will not be repeated here.

本創作第六實施例步驟如下: The steps of the sixth embodiment of this creation are as follows:

步驟S120:通知模組105依據控制訊號113產生對應聲響115。 Step S120 : the notification module 105 generates the corresponding sound 115 according to the control signal 113 .

請參閱第12圖,其係為本創作之第六實施例之結構方塊圖,如圖所示,一種全智能記憶體,其用於該記憶裝置10,該記憶裝置10,且其係電性連接一主機板1,該主機板1電性連接一中央處理器11,該記憶裝置10包含一基板101、一微控制單元102以及一通知模組105,該微控制單元102以及該通知模組105設置於該基板101,其中該通知模組105包含該蜂鳴器1054。 Please refer to FIG. 12 , which is a structural block diagram of the sixth embodiment of the present invention. As shown in the figure, an all-intelligent memory is used in the memory device 10 , and the memory device 10 is electrical Connected to a mainboard 1, the mainboard 1 is electrically connected to a central processing unit 11, the memory device 10 includes a substrate 101, a micro-control unit 102 and a notification module 105, the micro-control unit 102 and the notification module 105 is disposed on the substrate 101 , wherein the notification module 105 includes the buzzer 1054 .

再次參閱第11圖,底下將詳細說明本創作之全智能記憶體之通知方法之第五實施例步驟,如步驟S120所示,該通知模組105包含該蜂鳴器1054,該通知模組105依據該控制訊號113使該蜂鳴器1054以一對應聲響115,其中,該對應聲響115於流程開始前已經由使用者開啟電腦之對應程式進行設定,而設定結果經由中央處理器11藉由訊號線傳遞至該微控制單元102,或是中央處理器11藉由訊號線傳遞至固態硬碟控制器,再由固態硬碟控制器傳遞至固態硬碟之該微控制單元102。 Referring to FIG. 11 again, the steps of the fifth embodiment of the notification method of the all-smart memory of the present invention will be described in detail below. As shown in step S120, the notification module 105 includes the buzzer 1054, and the notification module 105 According to the control signal 113, the buzzer 1054 makes a corresponding sound 115, wherein the corresponding sound 115 has been set by the user to start the corresponding program of the computer before the process starts, and the setting result is passed through the central processing unit 11 by the signal The line is transmitted to the micro-control unit 102, or the central processing unit 11 transmits the signal line to the solid-state hard disk controller, and then the solid-state hard disk controller transmits the signal to the micro-control unit 102 of the solid-state hard disk.

本創作第六實施例之該主機板1接收來自電子裝置3之通訊軟體訊息通知時,將其訊息經過中央處理器11接收並傳遞訊號112至微控制單元102,該微控制單元102傳遞控制訊號113至通知模組105,通知模組105內部蜂鳴器1054通知使用者,解決習知無法利用記憶裝置10即時通知使用者通訊軟體訊息之問題。 When the motherboard 1 of the sixth embodiment of the present invention receives a communication software message notification from the electronic device 3, it receives the message through the central processing unit 11 and transmits the signal 112 to the micro-control unit 102, and the micro-control unit 102 transmits the control signal 113 Go to the notification module 105, the buzzer 1054 inside the notification module 105 notifies the user, so as to solve the conventional problem that the memory device 10 cannot be used to immediately notify the user of the message of the communication software.

本創作之第五實施例之該通知模組105之該第一發光裝置1051、該第二發光裝置1052、該第三發光裝置1053以及第六實施例之該通知模組105之該蜂鳴器1054可合併使用。 The first light-emitting device 1051, the second light-emitting device 1052, the third light-emitting device 1053 of the notification module 105 of the fifth embodiment of the present invention and the buzzer of the notification module 105 of the sixth embodiment 1054 can be used in combination.

以下,為本創作之一實施例之實際應用說明: 使用者於全智能記憶體執行前使用電腦特定軟體設定抹除式記憶體通知之第一門檻值21為40度、第二門檻值22為50度、第三門檻值23為60度,固態硬碟通知之第一門檻值21為50度、第二門檻值22為60度、第三門檻值23為70度、第一對應顏色212為綠色、第二對應顏色222為橙色、第三對應顏色232為紅色、第一聲響213以一緩慢頻率發出聲響、第二聲響223以一正常頻率發出聲響、第三聲響233以一快速頻率發出聲響。 The following is a description of the practical application of an embodiment of this creation: The user uses the computer specific software to set the first threshold 21 of the erasing memory notification to 40 degrees, the second threshold 22 to 50 degrees, and the third threshold 23 to 60 degrees before the full smart memory is executed. The first threshold value 21 of the disc notification is 50 degrees, the second threshold value 22 is 60 degrees, the third threshold value 23 is 70 degrees, the first corresponding color 212 is green, the second corresponding color 222 is orange, and the third corresponding color 232 is red, the first sound 213 sounds at a slow frequency, the second sound 223 sounds at a normal frequency, and the third sound 233 sounds at a fast frequency.

記憶裝置10之溫度感測器103感測記憶裝置10之複數個記憶晶片104,其中,溫度感測器103可從複數個記憶晶片104中選擇一或多個記憶晶片104之溫度產生至少一溫度數值1041,溫度感測器103將產生至少一溫度數值1041傳遞至該微控制單元102,若記憶裝置10為揮發性記憶體或非揮發性記憶體則該微控制單元102判定至少一溫度數值1041是否不小於40度,若是則該微控制單元102將傳遞該第一控制訊號211至該通知模組105,該通知模組105依據該第一控制訊號211使第一發光裝置1051以綠色閃爍,蜂鳴器1054以一緩慢頻率發出該第一聲響213並判定至少一溫度數值1041是否小於50度,若小於50度,則微控制單元102將傳遞第一控制訊號211至通知模組105,使第一發光裝置1051持續以綠色閃爍,蜂鳴器1054持續以一緩慢頻率發出第一聲響213,若不小於50度,則微控制單元102進行至少一溫度數值1041是否小於60度之判定,若小於60度,微控制單元102將傳遞第二控制訊號221至通知模組105,通知模組105依據第二控制訊號221使第二發光裝置1052以橙色閃爍,蜂鳴器1054以一正常頻率發出第二聲響223,若不小於60度,微控制單元102將傳遞第三控制訊號231至通知模組105,通知模組105依據第三控制訊號231使第三發光裝置1053以紅色閃爍,蜂鳴器1054以一快速頻率發出第三聲響233,若記憶裝置10為固態硬碟,則該微控制單元102 判定至少一溫度數值1041是否不小於50度,若是則該微控制單元102將傳遞該第一控制訊號211至該通知模組105,該通知模組105依據該第一控制訊號211使第一發光裝置1051以綠色閃爍,蜂鳴器1054以一緩慢頻率發出該第一聲響213並判定至少一溫度數值1041是否小於60度,若小於60度,則微控制單元102將傳遞第一控制訊號211至通知模組105,使第一發光裝置1051持續以綠色閃爍,蜂鳴器1054持續以一緩慢頻率發出第一聲響213,若不小於60度,則微控制單元102進行至少一溫度數值1041是否小於70度之判定,若小於70度,微控制單元102將傳遞第二控制訊號221至通知模組105,通知模組105依據第二控制訊號221使第二發光裝置1052以橙色閃爍,蜂鳴器1054以一正常頻率發出第二聲響223,若不小於70度,微控制單元102將傳遞第三控制訊號231至通知模組105,通知模組105依據第三控制訊號231使第三發光裝置1053以紅色閃爍,蜂鳴器1054以一快速頻率發出第三聲響233。 The temperature sensor 103 of the memory device 10 senses a plurality of memory chips 104 of the memory device 10 , wherein the temperature sensor 103 can select the temperature of one or more memory chips 104 from the plurality of memory chips 104 to generate at least one temperature The value is 1041. The temperature sensor 103 will generate at least one temperature value 1041 and transmit it to the microcontroller unit 102. If the memory device 10 is a volatile memory or a non-volatile memory, the microcontroller unit 102 determines at least one temperature value 1041. Whether it is not less than 40 degrees, if so, the micro-control unit 102 will transmit the first control signal 211 to the notification module 105, and the notification module 105 makes the first light-emitting device 1051 flash green according to the first control signal 211, The buzzer 1054 emits the first sound 213 at a slow frequency and determines whether at least one temperature value 1041 is less than 50 degrees. If it is less than 50 degrees, the microcontroller unit 102 will transmit the first control signal 211 to the notification module 105. The first light-emitting device 1051 keeps flashing green, and the buzzer 1054 continuously emits a first sound 213 at a slow frequency. If it is not less than 50 degrees, the micro-control unit 102 determines whether at least one temperature value 1041 is less than 60 degrees. , if it is less than 60 degrees, the micro-control unit 102 will transmit the second control signal 221 to the notification module 105, and the notification module 105 will make the second light-emitting device 1052 flash in orange according to the second control signal 221, and the buzzer 1054 will be in a normal If the frequency is not less than 60 degrees, the micro-control unit 102 will transmit the third control signal 231 to the notification module 105, and the notification module 105 will make the third light-emitting device 1053 flash in red according to the third control signal 231, The buzzer 1054 emits a third sound 233 at a fast frequency. If the memory device 10 is a solid state hard disk, the microcontroller 102 Determine whether at least one temperature value 1041 is not less than 50 degrees, if so, the microcontroller 102 will transmit the first control signal 211 to the notification module 105 , and the notification module 105 will make the first light emitting according to the first control signal 211 The device 1051 flashes green, the buzzer 1054 emits the first sound 213 at a slow frequency and determines whether at least one temperature value 1041 is less than 60 degrees, if it is less than 60 degrees, the micro-control unit 102 will transmit the first control signal 211 To the notification module 105, the first light-emitting device 1051 keeps flashing green, and the buzzer 1054 continuously emits the first sound 213 at a slow frequency. If it is not less than 60 degrees, the micro-control unit 102 performs at least one temperature value 1041 The determination of whether it is less than 70 degrees, if it is less than 70 degrees, the micro-control unit 102 will transmit the second control signal 221 to the notification module 105, and the notification module 105 will make the second light-emitting device 1052 flash orange according to the second control signal 221, and bee The buzzer 1054 emits the second sound 223 at a normal frequency. If it is not less than 70 degrees, the micro-control unit 102 will transmit the third control signal 231 to the notification module 105 , and the notification module 105 will make the third light emitting according to the third control signal 231 The device 1053 flashes red, and the buzzer 1054 emits a third sound 233 at a fast frequency.

以下,為本創作之另一實施例之實際應用說明:使用者之電子裝置3內之通訊軟體傳遞即時訊號41至伺服器4,該伺服器4接收後將該即時訊號41至主機板1,該主機板1內部之中央處理器11執行軟體111接收來自該伺服器4之該即時訊號41,該中央處理器11產生訊號112並傳遞至微控制單元102,該微控制單元102傳遞一控制訊號113以作動通知模組105,該通知模組105依據該控制訊號113使第一發光裝置1051、第二發光裝置1052、第三發光裝置1053以黃色閃爍,蜂鳴器1054以一頻率發出對應聲響115。 The following is a description of the practical application of another embodiment of the present creation: the communication software in the user's electronic device 3 transmits the real-time signal 41 to the server 4, and the server 4 receives the real-time signal 41 to the motherboard 1, The central processing unit 11 inside the motherboard 1 executes the software 111 to receive the real-time signal 41 from the server 4 , the central processing unit 11 generates the signal 112 and transmits it to the micro-control unit 102 , and the micro-control unit 102 transmits a control signal 113 to actuate the notification module 105, the notification module 105 makes the first light-emitting device 1051, the second light-emitting device 1052, and the third light-emitting device 1053 flash in yellow according to the control signal 113, and the buzzer 1054 emits a corresponding sound at a frequency 115.

以上所述之實施例,本創作之全智能記憶體,其係利用記憶裝置內之溫度感測器感測複數記憶晶片之溫度達到自行感測並即時通知之功能,達到該記憶裝置可自行感測該記憶裝置自身溫度,並即時偵測該記憶裝置之溫度 藉由通知模組通知使用者,解決習知需要藉由電腦查詢電腦各部件狀態才能得到溫度等資訊,使用者可即時瞭解該記憶裝置之溫度狀態以及判斷是否要進行降溫等處理,可解決使用者無法於記憶體溫度過高即時反應導致記憶體損壞之問題,例如偵測揮發性記憶體、非揮發性記憶體與固態硬碟之溫度及其使用率/健康度,另通訊軟體(例如:Facebook,IG,or other)來訊息通知時,可利用顏色或聲音進行通知使用者。 In the above-mentioned embodiment, the all-intelligent memory of the present creation uses the temperature sensor in the memory device to sense the temperature of a plurality of memory chips to achieve the function of self-sensing and real-time notification, so that the memory device can sense the temperature by itself Measure the temperature of the memory device itself, and detect the temperature of the memory device in real time The notification module notifies the user to solve the conventional knowledge that the computer needs to query the status of various components of the computer to obtain information such as temperature. It cannot respond to the problem of memory damage when the memory temperature is too high, such as detecting the temperature of volatile memory, non-volatile memory and solid-state hard disk and its usage/health, and communication software (such as: Facebook, IG, or other) can use color or sound to notify users.

故本創作實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出新型專利申請,祈鈞局早日賜准專利,至感為禱。 Therefore, this work is actually novel, progressive and available for industrial use, and it should meet the requirements of patent application in my country's patent law.

惟以上所述者,僅為本創作之較佳實施例而已,並非用來限定本創作實施之範圍,舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本創作之申請專利範圍內。 However, the above descriptions are only preferred embodiments of the present creation, and are not intended to limit the scope of implementation of the present creation. All equivalent changes and modifications are made according to the shape, structure, characteristics and spirit described in the patent scope of the present creation. , shall be included in the scope of the patent application for this creation.

1:主機板 1: Motherboard

10:記憶裝置 10: Memory device

101:基板 101: Substrate

102:微控制單元 102: Micro Control Unit

103:溫度感測器 103: Temperature sensor

104:記憶晶片 104: Memory Chip

105:通知模組 105: Notification Module

11:中央處理器 11: CPU

Claims (13)

一種全智能記憶體,其係包含:一基板,設置一微控制單元及複數個記憶晶片,該微控制單元電性連接該些個記憶晶片;一溫度感測器,係設置於該基板上方,與該微控制單元電性連接,其係用以感測該些個記憶晶片之其中之一;及一通知模組,係設置於該基板上方,與該微控制單元電性連接;其中,該微控制單元接收來自該溫度感測器之至少一溫度數值,若該至少一溫度數值不小於一第一門檻值時,該微控制單元傳遞一第一控制訊號至該通知模組。 An all-intelligent memory, which comprises: a substrate, a micro-control unit and a plurality of memory chips are arranged, the micro-control unit is electrically connected to the memory chips; a temperature sensor is arranged above the substrate, is electrically connected with the micro-control unit, which is used for sensing one of the memory chips; and a notification module is disposed above the substrate and is electrically connected with the micro-control unit; wherein, the The micro-control unit receives at least one temperature value from the temperature sensor, and if the at least one temperature value is not less than a first threshold value, the micro-control unit transmits a first control signal to the notification module. 如請求項1所述之全智能記憶體,其中,於當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞該第一控制訊號至該通知模組之步驟中,該微控制單元判定該至少一溫度數值是否小於一第二門檻值,若是則該微控制單元傳遞該第一控制訊號至該通知模組。 The all-smart memory of claim 1, wherein, in the step of transmitting the first control signal to the notification module by the microcontroller when the at least one temperature value is not less than the first threshold, the The micro-control unit determines whether the at least one temperature value is less than a second threshold value, and if so, the micro-control unit transmits the first control signal to the notification module. 如請求項2所述之全智能記憶體,其中,於當該至少一溫度數值不小於該第一門檻值,則該微控制單元傳遞該第一控制訊號至該通知模組之步驟中,當該至少一溫度數值不小於該第二門檻值,該微控制單元進一步判定該至少一溫度數值是否小於一第三門檻值,若是則該微控制單元傳遞一第二控制訊號至該通 知模組,若否則該微控制單元傳遞一第三控制訊號至該通知模組。 The all-smart memory of claim 2, wherein, in the step of transmitting the first control signal to the notification module by the micro-control unit when the at least one temperature value is not less than the first threshold value, when The at least one temperature value is not less than the second threshold value, the micro-control unit further determines whether the at least one temperature value is less than a third threshold value, and if so, the micro-control unit transmits a second control signal to the communication the notification module, otherwise the micro-control unit transmits a third control signal to the notification module. 如請求項1或2所述之全智能記憶體,其中,該通知模組包含一第一發光裝置,該通知模組接收到該第一控制訊號時,該些個發光裝置以一第一對應顏色進行發光。 The all-smart memory according to claim 1 or 2, wherein the notification module includes a first light-emitting device, and when the notification module receives the first control signal, the light-emitting devices correspond to a first Colors glow. 如請求項3所述之全智能記憶體,其中,該通知模組包含一第二發光裝置以及一第三發光裝置,該通知模組接收到該第二控制訊號時,該第二發光裝置以一第二對應顏色進行發光,該通知模組接收到該第三控制訊號時,該第三發光裝置以一第三對應顏色進行發光。 The all-smart memory of claim 3, wherein the notification module includes a second lighting device and a third lighting device, and when the notification module receives the second control signal, the second lighting device emits A second corresponding color emits light, and when the notification module receives the third control signal, the third light emitting device emits light in a third corresponding color. 如請求項3所述之全智能記憶體,其中,該通知模組包含一蜂鳴器,該通知模組接收到該第一控制訊號時,該蜂鳴器產生一第一聲響,該通知模組接收到該第二控制訊號時,該蜂鳴器產生一第二聲響,該通知模組接收到該第三控制訊號時,該蜂鳴器產生一第三聲響。 The all-smart memory of claim 3, wherein the notification module includes a buzzer, and when the notification module receives the first control signal, the buzzer generates a first sound, and the notification module When the module receives the second control signal, the buzzer generates a second sound, and when the notification module receives the third control signal, the buzzer generates a third sound. 如請求項1所述之全智能記憶體,其中,該全智能記憶體為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 The all-smart memory of claim 1, wherein the all-smart memory is a volatile memory or a non-volatile memory or a solid state hard disk. 如請求項1所述之全智能記憶體,其中,該全智能記憶體電性連接一主機板,一中央處理器透過該主機板傳遞一控制命令至一記憶裝置。 The all-smart memory of claim 1, wherein the all-smart memory is electrically connected to a mainboard, and a central processing unit transmits a control command to a memory device through the mainboard. 一種全智能記憶體,且其係電性連接一主機板,該主機板電性連接一中央處理器,該全智能記憶體包含: 一基板,設置一微控制單元;以及一通知模組,係設置於該基板上方,與該微控制單元電性連接;其中,一電子裝置經由一伺服器傳送一即時訊號至該主機板,該主機板以該中央處理器執行一軟體接收該即時訊號,該中央處理器傳遞一訊號至該微控制單元,該微控制單元傳遞一控制訊號以作動該通知模組。 An all-intelligent memory, which is electrically connected to a mainboard, the mainboard is electrically connected to a central processing unit, and the all-intelligent memory includes: a substrate, a micro-control unit is arranged; and a notification module is arranged above the substrate and is electrically connected to the micro-control unit; wherein, an electronic device transmits a real-time signal to the motherboard via a server, the The main board uses the central processing unit to execute a software to receive the real-time signal, the central processing unit transmits a signal to the micro-control unit, and the micro-control unit transmits a control signal to activate the notification module. 如請求項9所述之全智能記憶體,其中,該軟體為即時通訊軟體或遊戲軟體。 The fully intelligent memory according to claim 9, wherein the software is instant messaging software or game software. 如請求項9所述之全智能記憶體,其中,該通知模組包含一第一發光裝置、一第二發光裝置以及一第三發光裝置,該通知模組接收到該控制訊號時,該第一發光裝置、該第二發光裝置以及該第三發光裝置以一對應顏色進行發光。 The all-intelligent memory of claim 9, wherein the notification module comprises a first lighting device, a second lighting device and a third lighting device, and when the notification module receives the control signal, the first lighting A light-emitting device, the second light-emitting device, and the third light-emitting device emit light in a corresponding color. 如請求項9所述之全智能記憶體,其中,該通知模組包含一蜂鳴器,該通知模組接收到該控制訊號時,該蜂鳴器產生一對應聲響。 The fully intelligent memory of claim 9, wherein the notification module includes a buzzer, and when the notification module receives the control signal, the buzzer generates a corresponding sound. 如請求項9所述之的全智能記憶體,其中,該全智能記憶體為一揮發性記憶體或一非揮發性記憶體或一固態硬碟。 The fully intelligent memory of claim 9, wherein the fully intelligent memory is a volatile memory or a non-volatile memory or a solid state hard disk.
TW111204386U 2022-04-28 2022-04-28 Structure of intelligent memory TWM632219U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111204386U TWM632219U (en) 2022-04-28 2022-04-28 Structure of intelligent memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111204386U TWM632219U (en) 2022-04-28 2022-04-28 Structure of intelligent memory

Publications (1)

Publication Number Publication Date
TWM632219U true TWM632219U (en) 2022-09-21

Family

ID=84613951

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111204386U TWM632219U (en) 2022-04-28 2022-04-28 Structure of intelligent memory

Country Status (1)

Country Link
TW (1) TWM632219U (en)

Similar Documents

Publication Publication Date Title
CN100385409C (en) System, medium, and control method for a computer
US7681059B2 (en) Computer sleep/awake circuit
WO2018040891A1 (en) Information display method and mobile terminal
US9779591B2 (en) Keyboard backlight event messaging system
US9086862B2 (en) Apparatus and method of protecting electronic apparatus using a temperature-power table for an electronic component under different system and environmental temperatures
US20020154131A1 (en) System status display control module
TW201405292A (en) Method, identification system, and electronic system for identifying a fan type of a fan
CN201440264U (en) Processor working state indication system
US11531388B2 (en) Electronic apparatus and power management method thereof
US9021242B2 (en) Boot determining method of electronic device having one or more storage disks in a low temperature environment
JP2013138041A (en) Electronic apparatus and fan control method of the same
TWM632219U (en) Structure of intelligent memory
TWI409629B (en) Computer, method and program production for controlling light
TW202343249A (en) Display method and structure of intelligent memory
CN2519947Y (en) Overheat protector for computer
TW201411340A (en) Battery life displaying device of notebook computer
TWI698796B (en) Storage system and power management method thereof
TWI595455B (en) Control method, system, and non-transitory computer-readable storage medium
JP4964911B2 (en) Electronics
CN102243520B (en) Method for controlling fan
Intel Intel® Desktop Board DG43GT Technical Product Specification
TW202305574A (en) Touch control device with tunable sensitivity and control method thereof
Intel
TWI630478B (en) Method and device for monitoring a temperature of an electronic element
CN114503088A (en) Establishing trusted connections with peripheral devices

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004