TWM631775U - Earphone device - Google Patents
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Abstract
Description
本創作係關於一種耳機裝置,尤指一種頭戴式耳機裝置。This creation is about an earphone device, especially a headphone device.
目前市面上所販售耳機裝置的類型包括:耳塞式耳機、耳道式耳機及頭戴式耳機等。與耳塞式耳機及耳道式耳機相比,由於頭戴式耳機能完整地包覆耳朵,且配戴時較為舒適,因此需長時間配戴的耳機裝置,例如:電競耳機、監聽耳機或音樂耳機等多採用頭戴式的形式製作。The types of earphone devices currently sold on the market include earphones, earphones, and headphone. Compared with earbuds and ear canal earphones, since the earphones can completely cover the ears and are more comfortable to wear, earphone devices that need to be worn for a long time, such as gaming earphones, monitoring earphones or Music headphones, etc. are mostly made in the form of head-mounted.
於現有技術中,如圖1之(i)所示,耳機裝置2的揚聲單元20會被安裝於封閉型的音腔室C2中。而為讓喜好重低音的使用者於使用頭戴式耳機時可聆聽到更多的低沉聲響,許多頭戴式耳機會於揚聲單元的音腔室上開孔,如圖1之(ii)所示,耳機裝置3的揚聲單元30安裝於音腔室C3中,且音腔室C3具有與外界環境相連通之直通型的氣體通道P3。如此一來外界環境的氣流便可經由直通型之氣體通道P3導入音腔室C3中,以進行氣流的交換。藉由氣流的交換,可讓揚聲單元30之振膜的行程增大,使揚聲單元30產生更多的低頻響應,讓使用者可自耳機裝置3中獲得更多的低頻音壓。In the prior art, as shown in (i) of FIG. 1 , the
然而,雖然音腔室C3上的氣體通道P3有助於外界氣流的導入和交換,但也會讓外界環境中的聲響或雜音沿著氣體通道P3進入耳機裝置3之中,導致使用者在聆聽重低音的音效時,也同時會受到更多外界噪音的影響及干擾,而無法獲得良好的聽覺體驗。However, although the gas channel P3 on the sound chamber C3 is helpful for the introduction and exchange of the external air flow, it also allows the sound or noise in the external environment to enter the
是以,如何提供一種具有低頻響應效果的耳機裝置,並可有效阻隔外界環境的噪音,為本創作欲解決的技術課題。Therefore, how to provide an earphone device with a low frequency response effect, which can effectively block the noise of the external environment, is a technical subject to be solved by the present creation.
本創作之主要目的,在於提供一種具有低頻響應效果的耳機裝置,且耳機裝置同時兼具良好的被動降噪功能。The main purpose of this creation is to provide an earphone device with a low frequency response effect, and the earphone device also has a good passive noise reduction function.
為達前述之目的,本創作提供一種耳機裝置,包括: 蓋體,具有多個出音孔; 音腔殼,與蓋體的內表面相結合以形成音腔室,包括: 底部; 側壁部,環繞地設置於底部之上; 弧形基座,設置於底部與側壁部交界處,包括: 凹槽,具有相對的第一端及第二端,第一端位於側壁部之上,第二端位於底部之上,且第一、二端間具有彎折部; 第一通氣孔,設置於凹槽底面並靠近第一端; 弧形蓋板,與弧形基座相結合以封閉凹槽,使凹槽形成氣體通道,並於第二端形成第二通氣孔;以及 揚聲單元,配置於音腔室中並具有聲音發射端,聲音發射端朝向出音孔。 In order to achieve the aforementioned purpose, the present invention provides an earphone device, including: The cover body has a plurality of sound holes; The sound chamber shell, combined with the inner surface of the cover to form the sound chamber, includes: bottom; the side wall part is arranged on the bottom in a surrounding manner; The arc-shaped base is arranged at the junction of the bottom and the side wall, including: The groove has opposite first ends and second ends, the first end is located on the side wall part, the second end is located on the bottom, and there is a bending part between the first and the second ends; The first vent hole is arranged on the bottom surface of the groove and is close to the first end; an arc-shaped cover, combined with the arc-shaped base to close the groove, so that the groove forms a gas channel, and a second vent hole is formed at the second end; and The speaker unit is arranged in the sound chamber and has a sound emitting end, and the sound emitting end faces the sound outlet.
於上述較佳實施方式中,其中蓋體的外表面上具有凹部及凸起部,凸起部設置於凹部中央,且出音孔設置於凸起部之上。In the above preferred embodiment, the outer surface of the cover body has a concave portion and a convex portion, the convex portion is disposed in the center of the concave portion, and the sound outlet hole is disposed on the convex portion.
於上述較佳實施方式中,其中蓋體的內表面上具有容置槽,容置槽對應於凸起部,且揚聲單元安裝於容置槽中。In the above preferred embodiment, the inner surface of the cover body has an accommodating groove, the accommodating groove corresponds to the protrusion, and the speaker unit is installed in the accommodating groove.
於上述較佳實施方式中,其包括外殼,外殼用以包覆音腔殼並與蓋體相結合,且外殼具有對應於第一通氣孔的外部開孔。In the above-mentioned preferred embodiment, it includes a casing, the casing is used to cover the sound cavity casing and is combined with the cover body, and the casing has an external opening corresponding to the first vent hole.
於上述較佳實施方式中,其中凹槽兩側分別具有呈階梯式設置的凸緣結構,凸緣結構的高度高於凹槽底面,且弧形蓋板可與凸緣結構相密合並封閉第一端。In the above preferred embodiment, the two sides of the groove are respectively provided with flange structures arranged in a stepped manner, the height of the flange structure is higher than the bottom surface of the groove, and the arc-shaped cover plate can be closely connected with the flange structure and close the first groove. one end.
本創作的有益效果在於,所提供之耳機裝置的音腔殼內具有音腔室及與音腔室相連通的氣體通道,如此外界環境的氣流便可經由氣體通道導入音腔室中以進行氣流的交換,讓揚聲單元的振膜形成更大擺盪,使得揚聲單元的聲音發射端產生更多的低頻音壓。另一方面,當外界環境的聲響或雜音通過氣體通道的彎折部時,聲響、雜音會被彎折部吸收並逐漸衰減,而可有效隔絕外界的噪音,讓使用者能獲得良好的聽覺體驗。The beneficial effect of the present invention is that the sound chamber shell of the provided earphone device has a sound chamber and an air channel communicated with the sound chamber, so that the airflow of the external environment can be introduced into the sound chamber through the gas channel for airflow. The exchange of the speaker unit makes the diaphragm of the speaker unit oscillate more, so that the sound emitting end of the speaker unit generates more low-frequency sound pressure. On the other hand, when the sound or noise of the external environment passes through the bending part of the gas channel, the sound and noise will be absorbed by the bending part and gradually attenuated, which can effectively isolate the external noise and allow the user to obtain a good listening experience. .
本創作的優點及特徵以及達到其方法將參照例示性實施例及附圖進行更詳細的描述而更容易理解。然而,本創作可以不同形式來實現且不應被理解僅限於此處所陳述的實施例。相反地,對所屬技術領域具有通常知識者而言,所提供的此些實施例將使本揭露更加透徹與全面且完整地傳達本創作的範疇。The advantages and features of the present invention, and the methods for achieving the same, will be more readily understood with reference to the more detailed description of the exemplary embodiments and the accompanying drawings. However, the present creations may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those of ordinary skill in the art.
首先,請參閱圖2及圖3所示。圖2係為耳機頻率響應測量系統;圖3係為耳機被動隔音降噪測量系統。於圖2中,本創作所提供之耳機頻率響應測量系統9包括:音訊分析裝置90、音效卡91、功率放大器92、麥克風前置放大器93、HATS收音麥克風94、待測耳機T及無響室R。其中,音訊分析裝置90電性連接於音效卡91;音效卡91則分別電性連接於功率放大器92及麥克風前置放大器93;而功率放大器92及麥克風前置放大器93再分別電性連接於待測耳機T及HATS收音麥克風94。First, please refer to Figure 2 and Figure 3. Figure 2 shows the frequency response measurement system for earphones; Figure 3 shows the passive sound insulation and noise reduction measurement system for headphones. In FIG. 2 , the headphone frequency
所述待測耳機T及HATS收音麥克風94均放置於無響室R中,且HATS收音麥克風94設置於待測耳機T的聲音發射端之前。所述無響室R用於隔絕環境噪音的干擾,以提升耳機喇叭頻率響應測量系統9檢測的準確度。The earphone T to be tested and the HATS
於進行頻率響應檢測時,首先,由音訊分析裝置90透過音效卡91產生測試訊號並傳送至功率放大器92。而功率放大器92在收到測試訊號後,會驅動待測耳機T產生檢測聲波。接著,由HATS收音麥克風94接收待測耳機T產生的檢測聲波,並經由麥克風前置放大器93傳回音訊分析裝置90進行做分析。When the frequency response detection is performed, first, the
於圖3中,本創作所提供之耳機被動隔音降噪測量系統8包括:音訊分析裝置80、音效卡81、功率放大器82、麥克風前置放大器83、HATS收音麥克風84、檢測用揚聲單元85、待測耳機T及無響室R。其中,音訊分析裝置80電性連接於音效卡81;音效卡81則分別電性連接於功率放大器82及麥克風前置放大器83;而功率放大器82及麥克風前置放大器83再分別電性連接於檢測用揚聲單元85及HATS收音麥克風84。In FIG. 3 , the passive sound insulation and noise
HATS收音麥克風84、檢測用揚聲單元85及待測耳機T均放置於無響室R中。其中,檢測用揚聲單元85設置於與待測耳機T相距50公分處;而HATS收音麥克風84則設置於待測耳機T的聲音發射端之前。所述無響室R用於隔絕環境噪音的干擾,以提升耳機被動隔音降噪測量系統8檢測的準確度。The HATS
於進行被動隔音降噪檢測時,首先,由音訊分析裝置80透過音效卡81產生測試訊號並傳送至功率放大器82。而功率放大器82在收到測試訊號後,會驅動檢測用揚聲單元85朝待測耳機T發射檢測聲波,來模擬外界環境中的聲響或雜音。接著,檢測聲波會通過待測耳機T,並由HATS收音麥克風84接收通過待測耳機T的檢測聲波,隨後再經由麥克風前置放大器83傳回音訊分析裝置80進行做分析。When performing passive sound insulation and noise reduction detection, first, the
請參閱圖4,圖4係為本創作所提供耳機裝置的示意圖。所述耳機裝置1的揚聲單元10安裝於音腔室C1中。所述音腔室C1具有與外界環境相連通的氣體通道P1,且氣體通道P1具有彎折部B。Please refer to FIG. 4 . FIG. 4 is a schematic diagram of the earphone device provided in this creation. The
請參閱圖5A,圖5A係為頻率響應量測曲線圖。於進行頻率響應檢測時,測試者會分別將耳機裝置1(如圖4所示)、2及3(如圖1所示)放置於待測耳機T(如圖2所示)的位置,並讓耳機裝置1、2及3與功率放大器92電性連接,如此功率放大器92便可分別驅動耳機裝置1、2及3產生檢測聲波。Please refer to FIG. 5A . FIG. 5A is a frequency response measurement graph. During the frequency response detection, the tester will place the earphone devices 1 (as shown in Figure 4), 2 and 3 (as shown in Figure 1) on the position of the earphone T (as shown in Figure 2) to be tested, and The
於圖5A中,X軸表示HATS收音麥克風94自耳機裝置1、2及3之揚聲單元10、20及30所接收到檢測聲波的聲音頻率(單位:Hz);而Y軸則表示HATS收音麥克風94自耳機裝置1、2及3之揚聲單元10、20及30所接收到檢測聲波的聲音強度(單位:dB)。由圖5A的曲線圖可以明顯看出,在20Hz至200Hz的低頻區段,耳機裝置1及3之聲音強度的表現均優於具封閉式音腔室C2的耳機裝置2,且耳機裝置1之聲音強度的表現優於耳機裝置3,或與耳機裝置3之聲音強度的表現近似。In FIG. 5A, the X axis represents the sound frequency (unit: Hz) of the detected sound waves received by the HATS
由前述內容可知,相較於耳機裝置3之直通型氣體通道P3,耳機裝置1中具有彎折部B的氣體通道P1亦可有效地將外界環境的氣流導入音腔室C1中,讓揚聲單元10的振膜形成更大擺盪,使得揚聲單元10的聲音發射端產生更多的低頻音壓。It can be seen from the foregoing that, compared with the straight-through gas channel P3 of the
請參閱圖5B,圖5B係為被動隔音抗噪衰減曲線圖。於進行被動隔音抗噪衰減檢測時,測試者會分別將耳機裝置1(如圖4所示)、2及3(如圖1所示)放置於待測耳機T(如圖3所示)的位置,而功率放大器82則是驅動檢測用揚聲單元85,使檢測用揚聲單元85發射檢測聲波至耳機裝置1、2及3,來模擬外界環境中的聲響或雜音。Please refer to FIG. 5B . FIG. 5B is a graph of passive sound insulation and anti-noise attenuation. When conducting passive sound insulation and anti-noise attenuation test, the tester will place the headphone devices 1 (as shown in Figure 4), 2 and 3 (as shown in Figure 1) on the earphone T (as shown in Figure 3) to be tested. The
於圖5B中,X軸表示HATS收音麥克風84所接收到通過耳機裝置1、2及3之檢測聲波的聲音頻率(單位:Hz);而Y軸則表示HATS收音麥克風84所接收到通過耳機裝置1、2及3之檢測聲波的聲音衰減強度(單位:dB)。於圖5B中,由低頻100Hz至高頻2000Hz之區段的曲線圖可以明顯看出,經過耳機裝置1(具有彎折部B的氣體通道P1)的被動降噪後,其檢測聲波之聲音強度的衰減程度明顯大於耳機裝置3(直通型氣體通道P3),且耳機裝置1的降噪表現非常接近耳機裝置2(封閉型的音腔室C2,無任何氣體通道)。In FIG. 5B, the X-axis represents the sound frequency (unit: Hz) of the detected sound waves received by the HATS
由頻率響應量測曲線圖(圖5A)及被動隔音抗噪衰減曲線圖(圖5B)的實驗數據可得知,耳機裝置1(具有彎折部B的氣體通道P1) 其揚聲單元於低頻區段下之聲音強度的表現與耳機裝置3(直通型氣體通道P3)相若,但耳機裝置1被動降噪的效果卻明顯優於耳機裝置3。From the experimental data of the frequency response measurement curve (FIG. 5A) and the passive sound insulation and anti-noise attenuation curve (FIG. 5B), it can be known that the speaker unit of the earphone device 1 (the gas channel P1 with the bending part B) is at low frequencies. The performance of the sound intensity under the segment is similar to that of the earphone device 3 (the straight-through gas channel P3 ), but the passive noise reduction effect of the
請參閱圖6A、圖6B及圖6C。圖6A係為本創作所提供耳機裝置的立體示意圖;圖6B係為本創作所提供耳機裝置一視角的立體分解圖;圖6C係為本創作所提供耳機裝置另一視角的立體分解圖。Please refer to FIGS. 6A , 6B and 6C. 6A is a schematic perspective view of the earphone device provided by the author; FIG. 6B is an exploded perspective view of the earphone device provided by the author from a perspective; FIG. 6C is an exploded perspective view of the earphone device provided by the author from another perspective.
所述耳機裝置1包括:揚聲單元10、蓋體11、音腔殼12及外殼13。所述揚聲單元10具有聲音發射端101。所述蓋體11的外表面上具有呈碗形斷面的凹部111及凸起部112。其中,凸起部112設置於凹部111的中央,且凸起部112上設置有多個貫穿的出音孔1121,而凹部111則可用於設置耳罩或軟墊結構(未示於圖中)。The
另一方面,蓋體11的內表面上則設置有容置槽113(如圖5C所示),且容置槽113的設置位置係對應於外表面的凸起部112,使得出音孔1121會顯露於容置槽113的底面。所述揚聲單元10則安裝於容置槽113之中,且揚聲單元10的聲音發射端101朝向容置槽113底面的出音孔1121,如此聲音發射端101產生的聲波便可穿過出音孔1121而向外傳遞。On the other hand, the inner surface of the
所述音腔殼12包括:底部121、側壁部122、弧形基座123、第一通氣孔124及弧形蓋板125。所述側壁部122環繞地設置於底部121之上;而弧形基座123則設置於底部121與側壁部122的交界處。其中,弧形基座123具有凹槽1231,凹槽1231具有相對的第一端12311及第二端12312,且第一端12311與第二端12312間具有彎折部B。於本實施例中,第一端12311位於側壁部122之上;第二端12312則位於底部121之上。此外,凹槽1231的兩側分別具有呈階梯式設置的凸緣結構1232,且凸緣結構1232的高度高於凹槽1231的底面。The
所述第一通氣孔124貫穿地設置於凹槽1231的底面,且靠近凹槽1231的第一端12311。所述弧形蓋板125用以與弧形基座123相結合,以藉此封閉凹槽1231。於本實施例中,當將弧形蓋板125裝設於弧形基座123之上時,弧形蓋板125的側緣會與凸緣結構1232相密合,並封閉凹槽1231的第一端12311。The
所述外殼13用以包覆音腔殼12,並可與蓋體11相結合,且外殼13上具有對應於音腔殼12之第一通氣孔124的外部開孔131。另一方面,外殼13亦可用於連接頭戴式耳機的支架結構(為示於圖中)。The
請參閱圖7,圖7係為本創作所提供耳機裝置的局部剖面圖。於圖7中,所述音腔殼12與蓋體11的內表面相結合,以形成音腔室C1。所述弧形蓋板125與弧形基座123之凸緣結構1232相密合並封閉第一端12311後,便可於凹槽1231處形成具有彎折部B的氣體通道P1。另一方面,因弧形蓋板125未與弧形基座123的第二端12312密合,而可於第二端12312處形成氣體通道P1的第二通氣孔O。Please refer to FIG. 7 . FIG. 7 is a partial cross-sectional view of the earphone device provided by the present invention. In FIG. 7 , the
請繼續參閱圖7。外殼13與蓋體11相結合時,外部開孔131會與第一通氣孔124相對,如此外界環境中的氣流便可經由外部開孔131、第一通氣孔124、氣體通道P1及第二通氣孔O導入音腔室C1之中,讓揚聲單元10的振膜形成更大擺盪,使得揚聲單元10的聲音發射端101產生更多的低頻音壓。另一方面,外界環境中的聲響或雜音在通過氣體通道P1時,彎折部B會吸收部份的聲響、雜音,使得聲響、雜音的聲音強度逐漸衰減,而可有效隔絕外界環境的噪音。Proceed to Figure 7. When the
相較於現有的技術,本創作所提供之耳機裝置的音腔殼內具有音腔室及與音腔室相連通的氣體通道,如此外界環境的氣流便可經由氣體通道導入音腔室中以進行氣流的交換,讓揚聲單元的振膜形成更大擺盪,使得揚聲單元的聲音發射端產生更多的低頻音壓。另一方面,當外界的聲響或雜音通過氣體通道的彎折部時,聲響、雜音會被彎折部吸收並逐漸衰減,而可有效隔絕外界的噪音,讓使用者能獲得良好的聽覺體驗;故,本創作實為一極具產業價值之創作。Compared with the prior art, the sound chamber shell of the earphone device provided by the present invention has a sound chamber and a gas channel communicated with the sound chamber, so that the air flow of the external environment can be introduced into the sound chamber through the gas channel to prevent The exchange of air flow makes the diaphragm of the speaker unit oscillate more, so that the sound emitting end of the speaker unit generates more low-frequency sound pressure. On the other hand, when the external sound or noise passes through the bending part of the gas channel, the sound and noise will be absorbed by the bending part and gradually attenuated, which can effectively isolate the external noise and allow the user to obtain a good listening experience; Therefore, this work is a work of great industrial value.
本創作得由熟悉本技藝之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護。This creation can be modified in various ways by people who are familiar with the craftsmanship, but all of them are not out of the scope of the appended patent application.
B:彎折部
C1、C2、C3:音腔室
P1、P3:氣體通道
O:第二通氣孔
R:無響室
T:待測耳機
1、2、3:耳機裝置
10、20、30:揚聲單元
101:聲音發射端
11:蓋體
111:凹部
112:凸起部
1121:出音孔
12:音腔殼
121:底部
122:側壁部
123:弧形基座
1231:凹槽
12311:第一端
12312:第二端
1232:凸緣結構
124:第一通氣孔
125:弧形蓋板
113:容置槽
13:外殼
131:外部開孔
8:耳機被動隔音降噪測量系統
80、90:音訊分析裝置
81、91:音效卡
82、92:功率放大器
83、93:麥克風前置放大器
84、94:HATS收音麥克風
85:檢測用揚聲單元
9:耳機頻率響應測量系統B: Bending part
C1, C2, C3: sound chamber
P1, P3: gas channel
O: Second vent
R: anechoic room
T: Headphones to be tested
1, 2, 3:
圖1:係為習知耳機裝置的示意圖;FIG. 1 is a schematic diagram of a conventional earphone device;
圖2:係為耳機頻率響應測量系統;Figure 2: It is the frequency response measurement system of the earphone;
圖3:係為耳機被動隔音降噪測量系統;Figure 3: It is a passive sound insulation and noise reduction measurement system for headphones;
圖4:係為本創作所提供耳機裝置的示意圖;Figure 4: It is a schematic diagram of the headphone device provided by this creation;
圖5A:係為頻率響應量測曲線圖;Figure 5A: is a frequency response measurement curve;
圖5B:係為被動隔音抗噪衰減曲線圖;Figure 5B is a graph of passive sound insulation and anti-noise attenuation;
圖6A:係為本創作所提供耳機裝置的立體示意圖;FIG. 6A: is a three-dimensional schematic diagram of the earphone device provided by this creation;
圖6B:係為本創作所提供耳機裝置一視角的立體分解圖;FIG. 6B is an exploded perspective view of the headphone device provided by this creation from a perspective;
圖6C:係為本創作所提供耳機裝置另一視角的立體分解圖;以及FIG. 6C : is an exploded perspective view of the headphone device provided by the author from another perspective; and
圖7:係為本創作所提供耳機裝置的局部剖面圖。Figure 7: It is a partial cross-sectional view of the earphone device provided by this creation.
B:彎折部 B: Bending part
C1:音腔室 C1: sound chamber
P1:氣體通道 P1: Gas channel
O:第二通氣孔 O: Second vent
10:揚聲單元 10: Speaker unit
101:聲音發射端 101: Sound transmitter
11:蓋體 11: Cover
111:凹部 111: Recess
112:凸起部 112: Raised part
1121:出音孔 1121: Sound hole
12:音腔殼 12: Sound cavity shell
121:底部 121: Bottom
123:弧形基座 123: Curved base
1231:凹槽 1231: Groove
12311:第一端 12311: First end
12312:第二端 12312: Second end
124:第一通氣孔 124: First vent
125:弧形蓋板 125: Arc cover
113:容置槽 113: accommodating slot
13:外殼 13: Shell
131:外部開孔 131: External opening
Claims (5)
Priority Applications (1)
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TW111203144U TWM631775U (en) | 2022-03-29 | 2022-03-29 | Earphone device |
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TW111203144U TWM631775U (en) | 2022-03-29 | 2022-03-29 | Earphone device |
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TWM631775U true TWM631775U (en) | 2022-09-11 |
Family
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825641B (en) * | 2022-03-29 | 2023-12-11 | 致伸科技股份有限公司 | Earphone device |
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2022
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825641B (en) * | 2022-03-29 | 2023-12-11 | 致伸科技股份有限公司 | Earphone device |
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GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 |