TWM630924U - Chip testing equipment - Google Patents

Abstract

A chip testing equipment is provided, which is adapted to test a chip. The chip testing equipment includes a first vacuum holding unit, a second vacuum holding unit, a tray and a test head. The tray includes a chip receiving portion and a vacuum holding opening. The vacuum holding opening is disposed in the chip receiving portion. The second vacuum holding unit is communicated to the vacuum holding opening. When the chip is disposed in the chip receiving portion, the second vacuum holding unit holds the chip via the vacuum holding opening to keep the chip on the tray. The test head includes at least one vacuum nozzle. The first vacuum holding unit is communicated to the vacuum nozzle. The first vacuum holding unit holds the chip via the vacuum nozzle to remove the chip from the tray.

Description

Wafer Test Equipment

The embodiments of the present invention relate to a chip testing apparatus, and particularly relate to a chip testing apparatus having a vacuum adsorption positioning function.

A conventional wafer testing apparatus has a test head and a tray from which the wafers are transported. A test head is adapted to pick up the wafer from the tray for testing. In the prior art, during the movement of the tray, such as when starting and stopping, especially when suddenly stopped, excessive vibration is likely to occur, causing the wafer to shake out of the tray, resulting in product loss, and may even affect the production quality. rate and the operating efficiency of the production line.

The embodiment of the present invention provides a wafer testing apparatus to solve the problems of the prior art, which is suitable for testing a wafer, and includes a first vacuum suction unit, a second vacuum suction unit, a tray and a tester head. The tray includes a wafer accommodating portion and a vacuum suction port, the vacuum suction port is disposed in the wafer accommodating portion, and the second vacuum suction unit communicates with the vacuum suction port, wherein, when the wafer is placed in the wafer accommodating portion, The second vacuum suction unit is adapted to provide suction to the wafer through the vacuum suction port to limit the position of the wafer. The test head includes at least one vacuum suction nozzle, the first vacuum suction unit is connected with the vacuum suction nozzle, and the first vacuum suction unit is adapted to vacuum suction the wafer through the vacuum suction nozzle, so as to bring the wafer away from the tray.

In one embodiment, the wafer testing apparatus further includes a first sensing unit and a processing unit, the processing unit is coupled to the first sensing unit and the second vacuum suction unit, and the test head is suitable for a first Moves between a test head position and a second test head position, when the test head is in the second test head position, where the test head is adapted to pick up the wafer from the tray, and when the test head is at the second test head position During the process of moving the test head position to the second test head position, the first sensing unit is activated by the test head to transmit a first sensing signal, and the processing unit turns off the second sensing signal according to the first sensing signal Vacuum suction unit.

In one embodiment, the first sensing unit includes a first transmitting element and a first receiving element, the first transmitting element transmits a first sensing beam to the first receiving element, and the test head transmits a first sensing beam from the test head to the first receiving element. When the position of the first test head is moved to the position of the second test head, the first sensing beam is blocked by the test head, and the first sensing unit is thus activated to transmit the first sensing signal.

In one embodiment, the wafer testing apparatus further includes a second sensing unit, and the processing unit is coupled to the second sensing unit and the second vacuum suction unit, when the wafer is placed in the wafer accommodating portion , the second sensing unit is activated to transmit a second sensing signal, and the processing unit is adapted to turn on the second vacuum suction unit according to the second sensing signal.

In one embodiment, when the processing unit receives the second sensing signal but does not receive the first sensing signal, the processing unit turns on the second vacuum suction unit, and the second vacuum suction unit passes the The vacuum suction port provides suction to the wafer to restrain the wafer.

In one embodiment, when the processing unit receives the first sensing signal and the second sensing signal at the same time, the processing unit turns off the second vacuum suction unit, and the first vacuum suction unit passes through the vacuum suction unit. The nozzle vacuums the wafer to bring the wafer away from the tray.

In one embodiment, when the processing unit does not receive the second sensing signal, the processing unit turns off the second vacuum suction unit.

In one embodiment, the second sensing unit includes a second transmitting element and a second receiving element, the second transmitting element transmits a second sensing beam to the second receiving element, and when the wafer is placed on the When the chip accommodating portion is used, the second sensing beam is blocked by the chip, and the second sensing unit is thus activated to transmit the second sensing signal.

In one embodiment, the tray moves along a tray track, and the second sending element and the second receiving element are respectively disposed on two sides of the tray track.

In one embodiment, the test head moves along a first direction to pick and place the wafer on the tray, and the tray moves along a second direction to transport the wafer, the first direction being perpendicular to the second direction.

In the embodiment of the present invention, the second vacuum suction unit is adapted to provide suction to the wafer through the vacuum suction port to limit the position of the wafer, so that the wafer can stay on the tray stably. By applying the chip testing equipment of this creative embodiment, during the movement of the tray, for example, when the tray is started and stopped, especially when suddenly stopped, the chip can stably stay on the tray to avoid product loss, thus improving the production yield. And maintain the operating efficiency of the production line.

FIG. 1 shows the chip testing equipment of the inventive embodiment. Referring to FIG. 1, the embodiment of the present invention provides a chip testing apparatus E to solve the problems of the prior art, which is suitable for testing a chip C, including a first vacuum suction unit (not shown), A second vacuum suction unit (not shown), a tray 2 and a test head 1 .

Figures 2A and 2B show the detailed structure of the tray of this creative embodiment. 2A, in one embodiment, the tray 2 includes a wafer accommodating portion 21 and a vacuum suction port 22, the vacuum suction port 22 is disposed in the wafer accommodating portion 21, and the second vacuum suction unit 29 communicates with the vacuum suction port 22, wherein, when the wafer C is placed in the wafer accommodating portion 21, the second vacuum suction unit 29 is adapted to provide suction to the wafer C through the vacuum suction port 22 to limit the position of the wafer C. Referring to FIG. 2B , in one embodiment, an annular groove 24 is formed on the tray 2 , and the annular groove 24 can be used to place the chip pins of the chip C therein.

Referring to FIG. 1 again, the test head 1 includes at least one vacuum suction nozzle 11, the first vacuum suction unit (not shown) communicates with the vacuum suction nozzle 11, and the first vacuum suction unit (not shown) is adapted to pass through the vacuum suction nozzle 11. The nozzle 11 performs vacuum suction on the wafer C to take the wafer C away from the tray 2 .

FIG. 3 is a block diagram of a system of this creative embodiment. Referring to FIG. 3, in one embodiment, the wafer testing apparatus further includes a first sensing unit 31 and a processing unit 4, and the processing unit 4 is coupled to the first sensing unit 31 and the second vacuum suction unit 29.

FIG. 4 shows the situation in which the test head of the inventive embodiment clamps the wafer. Referring to Figures 1, 3 and 4, in one embodiment, the test head 1 is adapted to move between a first test head position (Figure 1) and a second test head position (Figure 4). When the test head 1 is in the second test head position (FIG. 4), the test head 1 is adapted to pick up the wafer C from the tray 2, and the test head is in the first test head position (the first test head 1). In the process of moving to the second test head position (FIG. 4), the first sensing unit 31 is activated by the test head 1 to transmit a first sensing signal, and the processing unit 4 according to the first sensing The second vacuum suction unit 29 is closed by detecting the signal. Thereby, the test head 1 can smoothly pick up the wafer C from the tray 2 .

Referring to FIGS. 1 and 4 , in one embodiment, the first sensing unit 31 includes a first transmitting element 311 and a first receiving element 312 , and the first transmitting element 311 transmits to the first receiving element 312 A first sensing beam 313 as the test head 1 moves from the first test head position (FIG. 1) In the process of reaching the second test head position (FIG. 4), the first sensing beam 313 is blocked by the test head 1, and the first sensing unit 31 is thus activated to transmit the first sensing signal. In one embodiment, the first sending element 311 and the first receiving element 312 are disposed on the side posts on both sides of the test head 1 , and the above disclosure does not limit the invention.

Referring to FIGS. 1 , 2A and 3 again, in one embodiment, the wafer testing apparatus E further includes a second sensing unit 32 , and the processing unit 4 is coupled to the second sensing unit 32 and the second vacuum suction force The unit 29, when the chip C is placed in the chip accommodating portion 21, the second sensing unit 32 is activated to transmit a second sensing signal, and the processing unit 4 is adapted to respond to the second sensing unit 32 to turn on the second vacuum suction unit 29 .

Figures 5A and 5B show the control situation of the processing unit of the present creative embodiment. Referring to FIG. 5A, in one embodiment, when the processing unit 4 receives the second sensing signal but does not receive the first sensing signal (representing that a chip is placed in the chip accommodating portion and the test head has not Descending to positioning), the processing unit 4 turns on the second vacuum suction unit 29, and the second vacuum suction unit 29 provides suction to the wafer through the vacuum suction port to limit the position of the wafer. Referring to FIG. 5B, in one embodiment, when the processing unit 4 receives the first sensing signal and the second sensing signal at the same time (representing that a chip is placed in the chip accommodating portion and the test head is lowered to the position) ), the processing unit 4 closes the second vacuum suction unit 29, and the first vacuum suction unit 19 vacuum suctions the wafer through the vacuum suction nozzle to take the wafer away from the tray.

In one embodiment, when the processing unit 4 does not receive the second sensing signal (representing that no wafer is placed in the wafer receiving portion), the processing unit 4 turns off the second vacuum suction unit 29 .

Referring to FIG. 1 , in one embodiment, the second sensing unit includes a second sending element 321 and a second receiving element 322 , and the second sending element 321 sends a second sensing element to the second receiving element 322 The sensing beam 323, when the chip C is placed in the chip accommodating portion, the second sensing beam 323 is blocked by the chip C, and the second sensing unit 32 is thus activated to transmit the second sensing signal . In one embodiment, the surface of the tray 2 has straight grooves 23 for the second sensing beam 323 to pass through to detect the wafer C.

Referring to FIG. 1 , in one embodiment, the tray 2 moves along a tray track T, and the second sending element 321 and the second receiving element 322 are disposed on both sides of the tray track T, respectively.

Referring to FIG. 1, in one embodiment, the test head 1 moves along a first direction Z to pick and place the wafer C on the tray 2, the tray 2 moves along a second direction X to transport the wafer C, the The first direction Z is perpendicular to the second direction X.

Referring to FIG. 1, in one embodiment, the wafer testing equipment includes a feeding operation area A1, a testing area A2, and a material discharging operation area A3. The test head 1, the first sensing unit 31 and the second sensing unit 32 are located in the test area A2. The tray 2 moves along the track T between the feeding operation area A1 , the testing area A2 and the discharging operation area A3 . The clamping head 51 is set in the feeding operation area A1 to place the wafer C on the tray 2 . The clamping head 52 is arranged in the feeding and discharging work area A3 to pick up the wafer C from the tray 2 .

Referring to FIG. 1 , in one embodiment, the wafer testing apparatus E further includes a third sensing unit 33 , a fourth sensing unit 34 and a fifth sensing unit 35 . The third sensing unit 33 is located in the feeding operation area A1 to confirm whether there is a wafer C on the tray 2 . The fourth sensing unit 34 is located in the unloading operation area A3 to confirm whether there is a wafer C on the tray 2 . The fifth sensing unit 35 is located in the discharging operation area A3 to confirm whether the clamping head 52 is lowered to the position.

The testing process of the chip testing equipment E of the present invention is described below. First, the clamping head 51 is placed in the feeding operation area A1 to place the wafer C on the tray 2 . Next, the third sensing unit 33 detects the presence of the wafer C in the tray 2, and therefore notifies the processing unit to activate the second vacuum suction unit to limit the wafer. Next, the tray 2 is moved to the test area A2. Then, the test head 1 descends to the positioning position. At this time, the first sensing unit 31 detects the descending of the test head 1, so it notifies the processing unit to turn off the second vacuum suction unit, and the test head 1 can pick up the wafer C and move it. Test elsewhere. Then, the test head 1 puts the tested wafer back into the tray 2, and the second sensing unit 32 detects that there is a wafer C in the tray 2, and therefore notifies the processing unit to activate the second vacuum suction unit to limit the wafer. Next, the tray 2 is moved to the discharge operation area A3. Then, the gripper head 52 is lowered to the positioning position. At this time, the fifth sensing unit 35 detects the drop of the gripper head 52, so the processing unit is notified to turn off the second vacuum suction unit, and the gripper head 52 can pick up the wafer. C and send wafer C out. Finally, the fourth sensing unit 34 detects that there is no wafer C in the tray 2, so it notifies the processing unit to continue to turn off the second vacuum suction unit, and the tray 2 returns to the feeding operation area A1 for the next round of picking test action .

In the embodiment of the present invention, the second vacuum suction unit is adapted to provide suction to the wafer through the vacuum suction port to limit the position of the wafer, so that the wafer can stay on the tray stably. By applying the chip testing equipment of this creative embodiment, during the movement of the tray, for example, when the tray is started and stopped, especially when suddenly stopped, the chip can stably stay on the tray to avoid product loss, thus improving the production yield. And maintain the operating efficiency of the production line.

Although this creation has been disclosed above with specific preferred embodiments, it is not intended to limit this creation. Anyone who is familiar with this technology can still make some changes and modifications without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation should be determined by the scope of the appended patent application.

E: Wafer Test Equipment

C: wafer

1: Test head

11: Vacuum nozzle

19: The first vacuum suction unit

2: Tray

21: Chip accommodating part

22: Vacuum suction port

23: Straight groove

24: Annular groove

29: Second vacuum suction unit

31: The first sensing unit

311: First sending element

312: The first receiving element

313: First sensing beam

32: The second sensing unit

321: Second sending element

322: Second receiving element

323: Second sensing beam

33: The third sensing unit

34: Fourth sensing unit

35: Fifth sensing unit

4: Processing unit

51: Clamping head

52: Clamping head

T: Tray track

Z: the first direction

X: second direction

A1: Feeding operation area

A2: Test area

A3: discharge operation area

FIG. 1 shows the chip testing equipment of the inventive embodiment. Figures 2A and 2B show the detailed structure of the tray of this creative embodiment. FIG. 3 is a block diagram of a system of this creative embodiment. FIG. 4 shows the situation in which the test head of the inventive embodiment clamps the wafer. Figures 5A and 5B show the control situation of the processing unit of the present creative embodiment.

E: Wafer Test Equipment

C: wafer

1: Test head

11: Vacuum nozzle

2: Tray

23: Straight groove

31: The first sensing unit

311: First sending element

312: The first receiving element

313: First sensing beam

32: The second sensing unit

321: Second sending element

322: Second receiving element

323: Second sensing beam

33: The third sensing unit

34: Fourth sensing unit

35: Fifth sensing unit

51: Clamping head

52: Clamping head

T: Tray track

Z: the first direction

X: second direction

A1: Feeding operation area

A2: Test area

A3: discharge operation area

Claims (10)

A wafer testing equipment, suitable for testing a wafer, includes: a first vacuum suction unit; a second vacuum suction unit; A tray includes a wafer accommodating portion and a vacuum suction port, the vacuum suction port is disposed in the wafer accommodating portion, and the second vacuum suction unit communicates with the vacuum suction port, wherein when the wafer is placed in the wafer accommodating portion when the second vacuum suction unit is adapted to provide suction to the wafer through the vacuum suction port to limit the position of the wafer; and A test head includes at least one vacuum suction nozzle, the first vacuum suction unit is connected with the vacuum suction nozzle, and the first vacuum suction unit is suitable for vacuum suction of the wafer through the vacuum suction nozzle, so as to bring the wafer away from the vacuum suction nozzle. tray. The wafer testing apparatus of claim 1, further comprising a first sensing unit and a processing unit, the processing unit is coupled to the first sensing unit and the second vacuum suction unit, and the test head is suitable for Moves between a first test head position and a second test head position, when the test head is at the second test head position, where the test head is adapted to pick up the wafer from the tray, and when the test head is at the second test head position During the process of moving the position of the first test head to the position of the second test head, the first sensing unit is activated by the test head to transmit a first sensing signal, and the processing unit turns off the first sensing signal according to the first sensing signal The second vacuum suction unit. The wafer testing apparatus of claim 2, wherein the first sensing unit comprises a first transmitting element and a first receiving element, and the first transmitting element transmits a first sensing beam to the first receiving element , in the process of moving the test head from the first test head position to the second test head position, the first sensing beam is blocked by the test head, and the first sensing unit is thus activated to transmit the first sensing beam. a sensing signal. The wafer testing apparatus of claim 2, further comprising a second sensing unit, the processing unit is coupled to the second sensing unit and the second vacuum suction unit, when the wafer is placed in the wafer housing When the second sensing unit is activated, the second sensing unit transmits a second sensing signal, and the processing unit is adapted to turn on the second vacuum suction unit according to the second sensing signal. The chip testing apparatus of claim 4, wherein when the processing unit receives the second sensing signal but does not receive the first sensing signal, the processing unit turns on the second vacuum suction unit, and the processing unit The second vacuum suction unit provides suction to the wafer through the vacuum suction port to limit the position of the wafer. The chip testing apparatus of claim 5, wherein when the processing unit receives the first sensing signal and the second sensing signal simultaneously, the processing unit turns off the second vacuum suction unit, and the first The vacuum suction unit vacuum suctions the wafer through the vacuum suction nozzle, so as to bring the wafer away from the tray. The wafer testing apparatus of claim 6, wherein when the processing unit does not receive the second sensing signal, the processing unit turns off the second vacuum suction unit. The wafer testing apparatus of claim 4, wherein the second sensing unit comprises a second transmitting element and a second receiving element, and the second transmitting element transmits a second sensing beam to the second receiving element , when the chip is placed in the chip accommodating portion, the second sensing beam is blocked by the chip, and the second sensing unit is thus activated to transmit the second sensing signal. The wafer testing apparatus of claim 8, wherein the tray moves along a tray track, and the second sending element and the second receiving element are respectively disposed on two sides of the tray track. The wafer testing apparatus of claim 1, wherein the test head moves in a first direction to pick up and place the wafer on the tray, and the tray moves in a second direction to transport the wafer, the first direction being perpendicular to the second direction.

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