TWM630348U - Single Phase Immersion Cooling System - Google Patents

Abstract

The novel creation provides a single-phase immersion cooling system, which is suitable for at least one electronic device and includes a heat exchanger, an immersion unit, a dielectric circulation unit and a control unit. The immersion unit includes an immersion tank, the immersion tank is equipped with a dielectric liquid, the electronic device is disposed in the immersion tank and at least partially immersed in the dielectric liquid; the dielectric circulation unit includes an input pipeline, a return pipeline and an auxiliary pump, the input pipeline and the return pipeline are connected between the heat exchanger and the immersion tank, and the auxiliary pump is arranged on one of the input pipeline and the return pipeline; the control unit includes a main controller and a A temperature sensor, the main controller is electrically connected to the auxiliary pump, and the temperature sensor is electrically connected to the main controller and used to detect the temperature of the dielectric fluid.

Description

Single Phase Immersion Cooling System

The present invention provides a single-phase immersion cooling system, and particularly relates to a single-phase immersion cooling system that can automatically control the cooling of electronic devices.

The cooling system is a kind of mechanical equipment that is quite common in the industry. Generally speaking, electronic devices (such as computer hosts, servers, etc.) will generate a huge amount of heat during operation. If the heat is not dissipated or the electronic device is cooled, the computing performance of the electronic device will be reduced or even crashed. Therefore, how to effectively dissipate heat has become an important issue.

In the selection of cooling system, because the liquid cooling system has the advantages of high heat transfer, fast convection and high specific heat capacity compared with the air cooling system, it gradually replaces the traditional air cooling system in the market. The cooling system can store a large amount of dielectric fluid at one time and directly immerse the electronic device in it, which not only accelerates the heat transfer to the parts that are not in contact with the electronic device, but also saves the design process of local water channels, so it is widely used in the industry. favored by users.

However, during the heat dissipation process of the previous two-phase immersion cooling system, the dielectric liquid will boil or evaporate and form vapor, which will not only cause the loss of the dielectric liquid, but also the evaporated vapor may enter the factory staff. Corrosion or contamination in the body or condensation outside the device. For this reason, some users have changed to a single-phase immersion cooling system. However, the existing single-phase immersion cooling system lacks an effective cooling operation mechanism, so it does not perform well in cooling efficiency.

The creator then exhausted his mind and research, and then developed a single-phase immersion cooling system that can automatically control the cooling of electronic devices, in order to save monitoring manpower and quickly dissipate heat.

The novel creation provides a single-phase immersion cooling system, which is suitable for at least one electronic device and includes a heat exchanger, an immersion unit, a dielectric circulation unit and a control unit. The immersion unit includes an immersion tank, the immersion tank is equipped with a dielectric liquid, the electronic device is disposed in the immersion tank and at least partially immersed in the dielectric liquid; the dielectric circulation unit includes an input pipeline, a return pipeline and An auxiliary pump, the input pipeline is connected between the heat exchanger and the immersion tank, and is used to input the dielectric liquid cooled by the heat exchanger into the immersion tank, and the return pipeline is connected between the heat exchanger and the immersion tank, using so that the dielectric liquid flowing through the electronic device is returned to the heat exchanger for cooling; the auxiliary pump is arranged on one of the input pipeline and the return pipeline; the control unit includes a main controller and a temperature sensor, The main controller is electrically connected to the auxiliary pump, and the temperature sensor is electrically connected to the main controller for detecting the temperature of the dielectric fluid.

In one embodiment, the above-mentioned immersion unit further includes at least one branch pipe, and the branch pipe is arranged in the immersion tank and communicated with the input pipeline. At least one opening is formed on the branch pipe, and the pair of openings are located on the electronic device.

In one embodiment, the above-mentioned immersion unit further includes a flow mixing member, the flow mixing member is disposed between the electronic device and the branch pipe, and a plurality of through holes are formed on the flow mixing member.

In one embodiment, the above-mentioned electronic devices and openings are plural, and the immersion unit further includes plural branch pipes and plural regulating valves. The branched branch pipe is formed on the branched pipe and extends toward the electronic device; the regulating valve is used to adjust the flow rate of the dielectric liquid flowing into the branched branch pipe from the branched pipe, and the opening is formed at the end of the branched branch pipe.

In one embodiment, the above-mentioned control unit further includes a plurality of branched flowmeters, the branched flowmeters are arranged on the branched branch pipes, and a diversion side pipe is respectively formed on the side wall of the branched branch pipes.

In one embodiment, there are a plurality of the above-mentioned branch pipes, and the sizes of the openings on the branch pipes are gradually changed along the arrangement direction of the branch pipes.

In one embodiment, the above-mentioned dielectric circulation unit further includes a filter, and the filter is disposed on the return line.

In one embodiment, the above-mentioned input pipeline is connected to the bottom side of the immersion tank, and the return pipeline is connected to the top side of the immersion tank and is lower than the liquid level of the dielectric liquid.

In one embodiment, the above-mentioned heat exchanger is a plate heat exchanger.

In this way, the single-phase immersion cooling system of the novel creation can detect the temperature of the dielectric liquid through the temperature sensor, and drive the auxiliary pump through the main controller to make the dielectric liquid flow through the input pipeline and the immersion tank in sequence. , return pipeline and return to the heat exchanger for cooling, thereby achieving the effect of saving monitoring manpower and rapid heat dissipation.

In order to make the above-mentioned features and advantages of the novel creation more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

The aforementioned and other technical contents, features and effects of the novel creation will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Therefore, the directional terms used are intended to illustrate, rather than limit, the present invention. Furthermore, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.

Please refer to FIGS. 1 to 4 , wherein FIG. 1 is a three-dimensional schematic diagram of an embodiment of a single-phase immersion cooling system newly created, FIG. 2 is a right side view of FIG. 1 with some hidden components, and FIG. The block diagram of the components of the single-phase immersion cooling system, and FIG. 4 is a schematic diagram of the pipeline configuration of the single-phase immersion cooling system of FIG. 1 . The single-phase immersion cooling system 1 of this embodiment is suitable for at least one electronic device 2 , wherein the electronic device 2 is, for example, an industrial computer or a server that can be used in series, and the single-phase immersion cooling system 1 includes a heat exchanger 100 , an immersion unit 200 , a dielectric circulation unit 300 and a control unit 400 , wherein the immersion unit 200 is connected to the heat exchanger 100 through the dielectric circulation unit 300 , and the control unit 400 is electrically connected to the dielectric circulation unit 300 .

In detail, as shown in FIG. 2 , the immersion unit 200 includes an immersion tank 210 , wherein the immersion tank 210 is, for example, a box-shaped tank body, and a dielectric liquid D that can directly contact the electronic device 2 and does not leak or conduct electricity is configured inside. , and the electronic device 2 is disposed in the immersion tank 210 and at least a part of it is immersed in the dielectric liquid D. In this embodiment, the dielectric liquid D is, for example, a solution including fluorosilicon compounds, which has a high boiling point (about 100-150° C.) and a high specific heat capacity (about 1150 J/kg° C.) compared with the cooling liquids commonly used in general electronic components. And the advantage of high surface tension (about 15mN/m). Therefore, when the electronic device 2 is immersed therein, heat can be quickly and massively transferred to the dielectric liquid D, and the dielectric liquid D flowing through the electronic device 2 is less likely to remain on the surface of the electronic device 2 , thereby improving the heat dissipation effect. Preferably, a drain pipe 212 is arranged on the bottom side of the immersion tank 210, and a drain valve 214 is arranged on the drain pipe 212, whereby the immersion unit 200 can pass through when the single-phase immersion cooling system 1 is not in operation. The drain pipeline 212 and the drain valve 214 drain the accommodated dielectric fluid D, and replenish new dielectric fluid D.

Please refer to FIG. 2 and FIG. 4 together, the dielectric circulation unit 300 of this embodiment is connected to one side of the heat exchanger 100 and includes an input pipeline 310 , a return pipeline 320 and at least one auxiliary pump 330 , wherein The input pipeline 310 is connected between the heat exchanger 100 and the immersion tank 210 to input the dielectric liquid D cooled by the heat exchanger 100 into the immersion tank 210 ; the return pipeline 320 is connected to the heat exchanger 100 and the immersion tank 210 In between, the dielectric liquid D flowing through the electronic device 2 is returned to the heat exchanger 100 for cooling; and the auxiliary pump 330 is, for example, an electric pump in this embodiment and there are two in number, which are arranged in the return pipe The channel 320 is used to provide pressure to make the dielectric fluid D flow along the above-mentioned direction and form a circuit, but in other possible embodiments, the auxiliary pump 330 can also be configured on the input pipeline 310, and the present invention has this effect. Unrestricted. Preferably, the dielectric circulation unit 300 further includes at least one check valve 332 , wherein the check valve 332 is disposed at the downstream end of the auxiliary pump 330 and the number corresponds to the auxiliary pump 330 , so as to prevent the auxiliary pump 330 from being added. The pressed dielectric liquid D is reversely refluxed again.

Besides, as shown in FIG. 4 , the control unit 400 includes a main controller 410 and a temperature sensor 420 , wherein the main controller 410 is, for example, a Programmable Logic Controller (PLC) and is electrically The temperature sensor 420 is, for example, an electronic thermocouple, which is electrically connected to the main controller 410 and used to detect the temperature of the dielectric liquid D. In this embodiment, the temperature sensor 420 is, for example, connected to the pipe wall of the input pipeline 310 and detects whether the cooled dielectric fluid D is lower than a target temperature. However, according to actual requirements, the temperature sensor 420 is also It can be connected to the immersion tank 210 or the return line 320 to detect the temperature of the dielectric liquid D in different sections, or a plurality of temperature sensors 420 can be configured to achieve accurate temperature monitoring of the dielectric liquid D in each section. There are no restrictions on new creations.

With the above configuration, when the temperature sensor 420 detects that the temperature of the dielectric fluid D is higher than a threshold, the main controller 410 will drive the auxiliary pump 330 to provide pressure, so that the dielectric fluid D is passed through the input pipeline. 310 enters the immersion tank 210, flows through the electronic device 2 to receive sufficient heat, and then returns to the heat exchanger 100 through the return line 320 for cooling, which not only saves manpower for monitoring, but also achieves the effect of heat dissipation automatically.

Preferably, as shown in FIG. 3 and FIG. 4 , the single-phase immersion cooling system 1 further includes a cooling unit 500, wherein the cooling unit 500 is connected to the other side of the heat exchanger 100 relative to the dielectric circulation unit 300 and is electrically It is sexually connected to the control unit 400 . Specifically, the heat exchanger 100 of this embodiment is, for example, a plate heat exchanger, which can reduce the clogging of the working fluid inside and is easy to clean, and as long as the internal flow channel plates are increased or decreased, the electronic device 2 Changes in quantity change heat transfer requirements.

On the other hand, the cooling unit 500 includes a cooling input line 510, a cooling return line 520, a temperature control valve 530 and a regulating line 540, wherein the cooling input line 510 and the cooling return line 520 are connected to the heat exchange The temperature control valve 530 is arranged on the cooling return line 520; and the regulating line 530 is connected to the temperature control valve 530 and the cooling input line 510. In addition, the control unit 400 further includes a temperature control valve driver 412 , and the temperature control valve 530 is electrically connected to the main controller 410 through the temperature control valve driver 412 . Therefore, when the temperature of the dielectric fluid D in the dielectric circulation unit 300 and the immersion unit 200 is too high, the main controller 410 can drive the temperature control valve 530 through the temperature control valve driver 412 to adjust the flow of the low temperature working fluid through the heat exchange The flow rate of the device 100 can be adjusted dynamically to adjust the temperature of the dielectric liquid D in real time.

It is worth mentioning that, in some embodiments, the cooling unit 500 is connected to, for example, an ice water machine, and the temperature of the ice water is about 7-11°C. However, since the operating temperature of the electronic device 2 is relatively high, the cooling unit 500 can also be connected only to a general cooling water tower, using warm water of about 30° C. as the low-temperature working fluid for cooling, and cooling The dielectric liquid D is maintained at a temperature of about 45° C., which is not limited in the novel creation.

In order to avoid the high humidity of the working environment which would affect the operation power of the heat exchanger 100 , the immersion unit 200 , the dielectric circulation unit 300 , the control unit 400 and the cooling unit 500 , preferably, the control unit 400 as shown in FIG. 4 further includes a The humidity sensor 430, wherein the humidity sensor 430 is electrically connected to the main controller 410, is used for detecting the humidity of the working environment. On the other hand, since the dielectric liquid D may gradually decrease due to the wetting of the pipe joints during the circulation process, preferably, the dielectric circulation unit 300 further includes a dielectric liquid storage tank 350 in which the dielectric liquid D is stored. The electro-hydraulic storage tank 350 is, for example, disposed on the return line 320 and stores a sufficient amount of the dielectric fluid D, which can be used as a buffer for backup when the dielectric fluid D in the input line 310 and the return line 320 decreases. Preferably, an exhaust valve 352 is disposed on the dielectric liquid storage tank 350 , which can discharge the tiny air bubbles that may exist in the dielectric liquid D to avoid condensation inside the heat exchanger 100 or the surface of the electronic device 2 . Preferably, the control unit 400 further includes a dielectric side flowmeter 440 and a cooling side flowmeter 450, which are respectively disposed on the return line 320 and the cooling return line 520 and are electrically connected to the main controller 410 for use in Instantly monitor the flow of dielectric fluid D and cryogenic working fluid.

Since the single-phase immersion cooling system 1 of the present embodiment uses a single liquid-phase dielectric liquid D as the cooling fluid, considering the heating convection effect of the fluid, as shown in FIG. 2 and FIG. 4 , the input pipeline 310 is preferably The ground is connected to the bottom side of the immersion tank 210 , and the return line 320 is connected to the top side of the immersion tank 210 and is lower than the liquid level of the dielectric liquid D. Through such a configuration, the low-temperature dielectric liquid D injected from the bottom side of the immersion tank 210 will flow upward after being heated in contact with the electronic device 2, and will be guided back by the return line 320 connected to the top side of the immersion tank 210, which can further to improve convection efficiency. In addition, since there may be foreign objects such as dust or labels inside or on the surface of the electronic device 2 , the heat exchanger 100 may be damaged if it directly flows into the heat exchanger 100 . Therefore, as shown in FIG. 4, the dielectric circulation unit 300 preferably further includes a filter 340, wherein the filter 340 is, for example, the STRY25A screen of Sanju Corporation and is arranged on the return line 320, which can effectively filter the above-mentioned The foreign matter thus prolongs the service life of the heat exchanger 100 and other components in the pipeline.

Please refer to FIG. 4 and FIG. 5 together, wherein FIG. 5 is an enlarged schematic view of the area A in FIG. 4 . In this embodiment, there may be a plurality of electronic devices 2 configured in the immersion tank 210. In order to enable each electronic device 2 to evenly contact the low-temperature dielectric liquid D injected by the input pipeline 310, as shown in FIG. The unit 200 further includes at least one branch pipe 220 , wherein the branch pipe 220 is disposed in the immersion tank 210 and communicated with the input pipeline 310 . As shown in FIG. 5 , at least one opening O is formed on the branch pipe 220 , and each opening O is located on each electronic device 2 . In this way, the low-temperature dielectric liquid D can be injected into the immersion tank 210 through each opening O on the branch pipe 220 , so that the temperature distribution of the dielectric liquid D in the immersion tank 210 can be more uniform. Preferably, the immersion unit 200 further includes a flow mixing member 230 , wherein the flow mixing member 230 is, for example, a metal plate member disposed between the electronic device 2 and the branch pipe 220 , and a plurality of through holes 232 are formed on the flow mixing member 230 . Through such a configuration, the dielectric liquid D injected through the opening O will first flow through the flow mixing member 230 , and flow toward the electronic device 2 through each through hole 232 , so as to be more uniformly mixed.

Please refer to FIG. 6 and FIG. 7 together, wherein FIG. 6 is a three-dimensional schematic diagram of the branch pipe and the partial input pipeline in FIG. 4 , and FIG. 7 is a three-dimensional schematic diagram of the flow mixing element in FIG. 4 . In detail, the input pipeline 310 of the present embodiment is communicated with a plurality of branch pipes 220 , and a plurality of openings O are respectively formed on each branch pipe 220 . Since the heating conditions of the components of the electronic device 2 at different positions are different, in order to correspond to the heating conditions of different components, preferably, the openings O on the branch pipes 220 are gradually changed along the arrangement direction of the branch pipes 220 . As shown in FIG. 6 , a plurality of openings O ₁ , a plurality of openings O ₂ , a plurality of openings O ₃ and a plurality of openings O ₃ are respectively formed on the branch pipe 220 from the upper left to the lower right, and the openings O ₁ , the openings O _2. The size of the opening O ₃ and the opening O ₄ is gradually increased. Through such an arrangement, the user can arrange a plurality of electronic devices 2 at intervals along the extending direction of each branch pipe 220 , and extend each electronic device 2 along the arrangement direction of each branch pipe 220 (ie, the electronic device 2 and the branch pipe 220 are arranged perpendicular to each other), in this way, the amount of liquid contacted by the local positions of each electronic device 2 can be adjusted while maintaining the same flow of dielectric liquid D injection into each electronic device 2 . However, in other possible embodiments, openings O of different sizes may be arranged on the same branch pipe 220 instead, and the electronic device 2 and the branch pipe 220 may be arranged parallel to each other, and the same effect can also be achieved.

On the other hand, as shown in FIG. 7 , the shape of the through holes 232 on the flow mixing member 230 is, for example, a regular hexagon, and is evenly distributed on the flow mixing member 230 . Through such a configuration, a large amount of dielectric fluid D can be allowed to flow through the flow mixing member 230 while taking into account the structural strength of the flow mixing member 230 . However, according to actual processing requirements, the through holes 232 can also be circular or square, and the local distribution density can be changed according to the arrangement position of the electronic device 2 .

Please refer to FIG. 8 and FIG. 9 , wherein FIG. 8 is a schematic diagram of the pipeline configuration of another embodiment of the newly created single-phase immersion cooling system, and FIG. 9 is an enlarged schematic diagram of the area A' in FIG. 8 . The single-phase immersion cooling system 1' of this embodiment is similar to the single-phase immersion cooling system 1, and the main difference between the two is that the immersion unit 200' of the single-phase immersion cooling system 1' further includes a plurality of branch pipes 222 and A plurality of regulating valves 224 are respectively formed on the branch pipe 220 ′ and extend toward the electronic device 2 . The regulating valve 224 is arranged on the branch pipe 220 ′ and is electrically connected to the control unit 400 , and there is no inner surface of the submerged tank 210 . The flow mixing element 230 is configured.

In detail, the single-phase immersion cooling system 1' of the present embodiment can actively control the flow rate of the dielectric liquid D flowing to the branch pipe 222 of each electronic device 2. As shown in FIG. 9 , the regulating valve 224 is, for example, a three-way valve and is disposed at the connection between the branch pipe 220 ′ and the branch branch pipe 222 , and is used to adjust the flow rate of the dielectric liquid D flowing into the branch pipe 222 from the branch pipe 220 ′, and can even A specific branch pipe 222 is completely closed, and an opening O' is formed at the end of each branch pipe 222 . Through such a configuration, the control unit 400 can change the flow rate of the dielectric liquid D to each electronic device 2 according to the different heat dissipation requirements of the electronic devices 2 disposed in the immersion tank 210 , thereby adjusting the convection of the dielectric liquid D in the local area. rate. Preferably, the control unit 400 further includes a plurality of branch flow meters 460 , and the branch flow meters 460 are respectively disposed on each branch branch pipe 222 for detecting the flow rate of the dielectric liquid D flowing through the corresponding branch branch pipe 222 . In addition, a guide side pipe 222a may be formed on the side walls of the branched branch pipes 222, respectively. Through this configuration, the dielectric liquid D can not only flow directly to the electronic device 2 through the opening O' at the end of the branched branch pipe 222, but also through the The guide side pipe 222a flows in a direction parallel to the electronic device 2, so as to achieve the effect of local mixed flow.

The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the above embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. And it should be noted that, all the changes and substitutions equivalent to the above-mentioned embodiments should be considered to be included in the scope of the present invention. Therefore, the protection scope of the new creation should be defined by the scope of the patent application.

1: single-phase immersion cooling system 100: heat exchanger 200, 200': immersion unit 210: immersion tank 212: drain line 214: drain valve 220, 220': branch pipe 222: branch branch pipe 222a: diversion Side pipe 224: Regulating valve 230: Mixing part 232: Through hole 300: Dielectric circulation unit 310: Input pipeline 320: Return pipeline 330: Auxiliary pump 340: Filter 350: Dielectric fluid storage tank 352: Exhaust Valve 332: Check valve 400: Control unit 410: Main controller 412: Temperature control valve driver 420: Temperature sensor 430: Humidity sensor 440: Dielectric side flowmeter 450: Cooling side flowmeter 460: Branch flow Meter 500: Cooling unit 510: Cooling input line 520: Cooling return line 530: Temperature control valve 540: Adjustment line 2: Electronic device A, A': Zone D: Dielectric fluid O, O', O ₁ , O ₂ , O ₃ , O ₄ : opening

FIG. 1 is a schematic perspective view of an embodiment of a newly created single-phase immersion cooling system. FIG. 2 is a schematic right side view of the hidden parts of FIG. 1 . FIG. 3 is a schematic block diagram of components of the single-phase immersion cooling system of FIG. 1 . FIG. 4 is a schematic diagram of the pipeline configuration of the single-phase immersion cooling system of FIG. 1 . FIG. 5 is an enlarged schematic view of area A in FIG. 4 . FIG. 6 is a three-dimensional schematic diagram of the branch pipe and the partial input pipeline in FIG. 4 . FIG. 7 is a schematic perspective view of the flow mixing element in FIG. 4 . FIG. 8 is a schematic diagram of the pipeline configuration of another embodiment of the newly created single-phase immersion cooling system. Fig. 9 is an enlarged schematic view of the area A' in Fig. 8 .

1: Single-phase immersion cooling system

100: heat exchanger

200: Immersion unit

210: Immersion tank

300: Dielectric Cycle Unit

310: Input pipeline

320: Return line

2: Electronic device

D: Dielectric fluid

Claims (9)

A single-phase immersion cooling system suitable for at least one electronic device, and the single-phase immersion cooling system comprises: a heat exchanger; An immersion unit, including: an immersion tank, the immersion tank is equipped with a dielectric liquid, the at least one electronic device is disposed in the immersion tank and at least a part of it is immersed in the dielectric liquid; A dielectric circulation unit, including: an input pipeline, connected between the heat exchanger and the immersion tank, for inputting the dielectric liquid cooled by the heat exchanger into the immersion tank; a return line, connected between the heat exchanger and the immersion tank, for returning the dielectric fluid flowing through the at least one electronic device to the heat exchanger for cooling; and an auxiliary pump disposed on one of the input pipeline and the return pipeline; and a control unit, including: a main controller electrically connected to the auxiliary pump; and A temperature sensor is electrically connected to the main controller and used for detecting the temperature of the dielectric liquid. The single-phase immersion cooling system of claim 1, wherein the immersion unit further comprises: At least one branch pipe is disposed in the immersion tank and communicated with the input pipeline. At least one opening is formed on the at least one branch pipe, and the at least one opening is located on the at least one electronic device. The single-phase immersion cooling system according to claim 2, wherein the immersion unit further comprises a flow mixing member, the flow mixing member is disposed between the at least one electronic device and the at least one branch pipe, and the flow mixing member is formed with a a plurality of through holes. The single-phase immersion cooling system according to claim 2, wherein the at least one electronic device and the at least one opening are plural, and the submerged unit further includes a plurality of branch pipes and a plurality of regulating valves, and the plurality of branch pipes form a plurality of branch pipes. on the at least one branch pipe and extending toward the plurality of electronic devices, the plurality of regulating valves are used to adjust the flow rate of the dielectric liquid flowing into the plurality of branch pipes from the branch pipe, and the plurality of openings are formed in the plurality of branch pipes the end of a branch pipe. The single-phase immersion cooling system according to claim 4, wherein the control unit further comprises a plurality of branch flow meters, the plurality of branch flow meters are arranged on the plurality of branch branch pipes, and the side walls of the plurality of branch branch pipes are A guide side pipe is respectively formed. The single-phase immersion cooling system according to claim 2, wherein the at least one branch pipe has a plurality of, and the size of each of the at least one opening on the plurality of branch pipes changes along the arrangement direction of the plurality of branch pipes. The single-phase immersion cooling system according to claim 1, wherein the dielectric circulation unit further comprises a filter, and the filter is arranged on the return line. The single-phase immersion cooling system of claim 1, wherein the input line is connected to the bottom side of the immersion tank and the return line is connected to the top side of the immersion tank and is below the level of the dielectric fluid . The single-phase immersion cooling system of claim 1, wherein the heat exchanger is a plate heat exchanger.

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