TWM628419U - Improved structure of bus line - Google Patents
Improved structure of bus line Download PDFInfo
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- TWM628419U TWM628419U TW110210591U TW110210591U TWM628419U TW M628419 U TWM628419 U TW M628419U TW 110210591 U TW110210591 U TW 110210591U TW 110210591 U TW110210591 U TW 110210591U TW M628419 U TWM628419 U TW M628419U
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- 239000004020 conductor Substances 0.000 claims abstract description 42
- 239000006260 foam Substances 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- -1 polyethylene Polymers 0.000 claims abstract description 14
- 239000004698 Polyethylene Substances 0.000 claims abstract description 12
- 229920000573 polyethylene Polymers 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 74
- 230000002500 effect on skin Effects 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 210000005081 epithelial layer Anatomy 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
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Abstract
本新型係有關於一種排線改良結構,包含一排線,此排線依序層疊有一導體層、一發泡體層、一金屬層及一絕緣層,其中之導體層包含彼此間隔之複數條訊號線,且發泡體層係為聚乙烯層;據此,本創作之排線改良結構能夠使排線在厚度變薄的情況下仍舊可以維持高速之傳輸效率優勢。The present invention relates to an improved structure for an arrangement of wires, which comprises an arrangement of wires. The arrangement of wires is sequentially laminated with a conductor layer, a foam layer, a metal layer and an insulating layer, wherein the conductor layers include a plurality of signals spaced apart from each other. and the foam layer is a polyethylene layer; accordingly, the improved cable structure of the present invention can still maintain the advantage of high-speed transmission efficiency even when the thickness of the cable is reduced.
Description
本新型係為訊號傳輸的技術領域,尤指一種藉由改變排線之發泡體層的材質來使排線在厚度變薄的情況下仍舊可以維持高速之傳輸效率的排線改良結構。The present invention belongs to the technical field of signal transmission, and particularly refers to an improved cable structure that can maintain high-speed transmission efficiency even when the thickness of the cable is reduced by changing the material of the foam layer of the cable.
一般排線改良結構包含一排線(例如用於電腦之PCIE規格匯流排、SATA規格匯流排等訊號傳輸線)以及分別設置於排線兩端之連接器,連接器係與排線電性接合並連接至外部設備之對應的連接器(例如公、母對應之連接器),訊號則經由排線內之訊號線並透過連接器而於外部設備之間傳輸。The general improved structure of the cable includes a cable (such as a PCIE standard busbar, a SATA standard busbar and other signal transmission lines used in computers) and connectors arranged at both ends of the cable. The connectors are electrically connected to the cable. Connect to the corresponding connector of the external device (such as the corresponding male and female connectors), and the signal is transmitted between the external devices through the signal line in the cable and through the connector.
請同時參照第1圖及第2圖,其中之第1圖係為習知排線之平面圖,第2圖係為取自第3圖A-A截面之剖視圖。如第1圖及第2圖所示,習知之排線9層疊有導體層91、發泡體層92、金屬層93、絕緣層94等,且導體層91設有複數條訊號線911及複數條接地線912。於習知作法上,二條訊號線911會配合一條接地線912,以此重複設置成具有規格寬度之排線9,例如具有四十八條線路或七十二條線路之規格寬度的排線9。Please refer to Figure 1 and Figure 2 at the same time, wherein Figure 1 is a plan view of a conventional flat cable, and Figure 2 is a cross-sectional view taken from the section A-A of Figure 3 . As shown in FIG. 1 and FIG. 2, the conventional
如上所述,習知排線9之導體層91因具有接地線912,故在排線9具有規格寬度的條件限制下,訊號線911的寬度會因此受到限制,進而降低傳輸速率。因此,排線9之結構必須進行妥善設計,而其在設計上一般必須考慮到所謂的集膚效應與特性組抗。As mentioned above, since the
上述之集膚效應亦稱為趨膚效應,其係指導體(例如訊號線911)中有交流電或者交變電磁場時,導體內部的電流分布不均勻的一種現象,隨著與導體表面的距離逐漸增加,導體內的電流密度呈指數衰減,亦即導體內的電流會集中在導體的表面,當從與電流方向垂直的橫截面來看時,導體的中心部分幾乎沒有電流流過,只在導體邊緣的部分會有電流,簡單而言,就是電流集中在導體的皮膚部分。由於集膚效應係使得交變電流只通過導體的表面,因此電流只在導體的表面產生熱效應,故例如在鋼鐵工業中,可利用集膚效應來為鋼材進行表面淬火,使鋼材表面的硬度增大。減緩集膚效應的方法可例如採用所謂的利茲線,亦即將多條金屬導線相互纏繞,以使電磁場能夠比較均勻地分布;或者可將實心導線換成空心導線管,中間補上絕緣材料。The above-mentioned skin effect is also called the skin effect, which is a phenomenon in which the current distribution inside the conductor is not uniform when there is alternating current or alternating electromagnetic field in the conductor (such as the signal line 911). Increase, the current density in the conductor decays exponentially, that is, the current in the conductor will be concentrated on the surface of the conductor, when viewed from a cross-section perpendicular to the current direction, almost no current flows in the central part of the conductor, only in the conductor. There will be current in the edge part, in short, the current is concentrated in the skin part of the conductor. Because the skin effect system makes the alternating current only pass through the surface of the conductor, the current only produces a thermal effect on the surface of the conductor, so for example, in the iron and steel industry, the skin effect can be used to quench the steel surface to increase the hardness of the steel surface. big. The method of alleviating the skin effect can be, for example, using the so-called Litz wire, that is, a plurality of metal wires are intertwined with each other, so that the electromagnetic field can be distributed more evenly;
另外,上述之特性組抗係指高頻訊號或電磁波在導體中傳播時所遇到的阻力,以歐姆為單位。導體中的阻抗值的起伏差異必須加以控制,以使訊號可以正確的速度傳輸,而對於不同型態的導體所形成的傳輸線(例如同軸傳輸線、線條式傳輸線、微條傳輸線、共面傳輸線等),會有不同的阻抗計算公式。可以配合變更不同的設計條件來達成阻抗控制,例如改變傳輸線中發泡體層之使用材質、厚度及介電常數等。In addition, the above-mentioned characteristic impedance refers to the resistance encountered when a high-frequency signal or electromagnetic wave propagates in a conductor, measured in ohms. The fluctuation difference of the impedance value in the conductor must be controlled so that the signal can be transmitted at the correct speed. For transmission lines formed by different types of conductors (such as coaxial transmission lines, linear transmission lines, microstrip transmission lines, coplanar transmission lines, etc.) , there will be different impedance calculation formulas. Impedance control can be achieved by changing different design conditions, such as changing the material, thickness and dielectric constant of the foam layer in the transmission line.
然而,習知之排線9因為使用材質之影響,在為了遷就傳輸效率之情況下,例如為了控制阻抗,排線9會具有較厚之厚度。However, due to the influence of the material used in the conventional
為解決上述習知排線因為使用材質所造成為了遷就傳輸速率而使厚度增厚之問題,本新型所提出的排線改良結構係以改變排線之發泡體層的材質來使排線在厚度變薄的情況下仍舊可以維持高速之傳輸效率。In order to solve the problem of increasing the thickness of the conventional cable due to the use of materials in order to accommodate the transmission rate, the improved cable structure proposed by the present invention changes the material of the foam layer of the cable to increase the thickness of the cable. In the case of thinning, high-speed transmission efficiency can still be maintained.
本新型所提出之排線改良結構包含一排線,該排線依序層疊有一導體層、一發泡體層、一金屬層及一絕緣層,該導體層包含彼此間隔之複數條訊號線,且該發泡體層之材質係為聚乙烯(PE,Polyethylene)。The improved cable structure proposed by the present invention includes a cable, the cable is sequentially laminated with a conductor layer, a foam layer, a metal layer and an insulating layer, the conductor layer includes a plurality of signal lines spaced apart from each other, and The material of the foam layer is polyethylene (PE, Polyethylene).
如上所述,本新型所提出之排線改良結構在結構設計上是將排線之發泡體層係為聚乙烯層,由於聚乙烯之介電常數小,依照阻抗公式計算,所得到的阻抗值會變大,相對的排線之厚度就可變薄。換言之,排線在厚度變薄的情況下仍舊可以維持高速之傳輸效率。As mentioned above, in the structural design of the improved cable structure proposed by the present invention, the foam layer of the cable is a polyethylene layer. Since the dielectric constant of polyethylene is small, the impedance value obtained is calculated according to the impedance formula. It will become larger, and the thickness of the relative cable will become thinner. In other words, the high-speed transmission efficiency can still be maintained even when the thickness of the cable is reduced.
可選擇地,於一非限制性的例示實施態樣中,該排線更包含一皮膜層,其係層疊於該導體層與該發泡體層之間。Optionally, in a non-limiting exemplary embodiment, the cable further includes a film layer, which is laminated between the conductor layer and the foam layer.
可選擇地,於一非限制性的例示實施態樣中中該皮膜層之材質係為聚對苯二甲酸乙二酯(PET,Polyethylene Terephthalate)。Optionally, in a non-limiting exemplary embodiment, the material of the film layer is polyethylene terephthalate (PET, Polyethylene Terephthalate).
可選擇地,於一非限制性的例示實施態樣中,進一步地,該排線係由該導體層往上下兩側依序層疊有該皮膜層、該發泡體層、該金屬層及該絕緣層。Optionally, in a non-limiting exemplary embodiment, further, the cable is sequentially laminated with the film layer, the foam layer, the metal layer and the insulating layer from the conductor layer to the upper and lower sides. Floor.
可選擇地,於一非限制性的例示實施態樣中,該導體層與該皮膜層之間、該皮膜層 與該發泡體層之間、該發泡體層與該金屬層之間,以及該金屬層與該絕緣層之間係分別使用一膠層來接合。Optionally, in a non-limiting exemplary embodiment, between the conductor layer and the film layer, between the film layer and the foam layer, between the foam layer and the metal layer, and the A glue layer is used for bonding between the metal layer and the insulating layer.
可選擇地,於一非限制性的例示實施態樣中,該導體層更包含彼此間隔之複數條接地線。Optionally, in a non-limiting exemplary embodiment, the conductor layer further includes a plurality of ground lines spaced apart from each other.
可選擇地,於一非限制性的例示實施態樣中,該複數條訊號線係呈單排排列。Optionally, in a non-limiting exemplary embodiment, the plurality of signal lines are arranged in a single row.
可選擇地,於一非限制性的例示實施態樣中,該複數條訊號線係呈雙排排列。Optionally, in a non-limiting exemplary embodiment, the plurality of signal lines are arranged in a double row.
可選擇地,於一非限制性的例示實施態樣中,該排線係為一柔性扁平排線(FFC,Flexible Flat Cable)。Optionally, in a non-limiting exemplary embodiment, the flat cable is a Flexible Flat Cable (FFC).
以下配合隨附圖式,以較佳具體實施例之表達方式進一步說明本新型之技術內容及其所具有之優點和所能達成之功效,惟其目的僅是用於說明以利於更加瞭解,而非用於限制。In the following, the technical content of the present invention, its advantages and achievable effects will be further described in the form of preferred specific embodiments in conjunction with the accompanying drawings. used for restriction.
請參照第3圖,其係為本新型第一較佳具體實施例之立體圖。於第3圖中顯示有一訊號傳輸裝置7,其包含一排線改良結構1,且此排線改良結構1包含一排線2,於本實施例中,排線2係為一柔性扁平排線(FFC),當然並不以此為限,排線2例如亦可為柔性印刷電路(FPC,Flexible Printed Circuitry)。Please refer to FIG. 3 , which is a perspective view of the first preferred embodiment of the new type. In Figure 3, a
此外,訊號傳輸裝置7尚包含一連接器3以及一電路板5,其中,電路板5包含彼此間隔排列之複數條訊號傳導線51與複數條接地傳導線52,電路板5並與排線2電性連接,而連接器3接合於排線2與電路板5之連接處,並藉此與其它電氣設備(圖未示)電性連接。In addition, the
請參照第4圖,其係為本新型第一較佳具體實施例之剖視圖。如第4圖所示,排線2係由一導體層21往上下兩側依序層疊有一皮膜層26(例如PET材質)、一發泡體層24、一金屬層22及一絕緣層23,且前述各個層之間係分別使用一膠層25來接合;詳細來說,該導體層21與該皮膜層26之間、該皮膜層26 與該發泡體層24之間、該發泡體層24與該金屬層22之間,以及該金屬層22與該絕緣層23之間係分別使用該膠層25來接合。Please refer to FIG. 4 , which is a cross-sectional view of the first preferred embodiment of the new type. As shown in FIG. 4 , the
又如第4圖所示,排線2之導體層21包含彼此間隔之複數條訊號線211,於本實施例中,複數條訊號線211係呈單排排列。另外,排線2之發泡體層24係為聚乙烯層。As also shown in FIG. 4 , the
下式(I)為排線改良結構之傳輸特性阻抗公式: The following formula (I) is the transmission characteristic impedance formula of the improved structure of the cable:
其中
為特性阻抗(characteristic impedance)、
為介電常數、W為線寬、H為絕緣層高度、T為導電層的厚度。於上述之排線改良結構1中,係將排線2之發泡體層24改變為聚乙烯層,由聚乙烯層之材質特性可知,聚乙烯之介電常數小,依照對於排線2之阻抗公式計算,可得到變大的阻抗值,再依照計算公式可知,排線2之厚度相對地就會變薄(小)。換言之,將排線2之發泡體層24之材質改變為聚乙烯的設計方式可使排線2在厚度變薄的情況下仍舊可以維持高速之傳輸效率。
in is the characteristic impedance, is the dielectric constant, W is the line width, H is the height of the insulating layer, and T is the thickness of the conductive layer. In the above-mentioned
請參照第5圖,其係為本新型第二較佳具體實施例之剖視圖。於本實施例中,其主要結構皆與上述第一較佳具體實施例相同,惟差別在於排線2之導體層21的複數條訊號線211於本實施例中係呈雙排排列。Please refer to FIG. 5 , which is a cross-sectional view of the second preferred embodiment of the present invention. In this embodiment, the main structures thereof are the same as those of the first preferred embodiment, but the difference is that the plurality of
請參照第6圖,其係為本新型第三較佳具體實施例之剖視圖。於本實施例中,其主要結構皆與上述第一較佳具體實施例相同,惟差別在於排線2之導體層21更包含彼此間隔之複數條接地線212,且複數條接地線212係與呈單排排列之複數條訊號線211彼此間隔排列,亦即一條訊號線211、一條接地線212、再一條訊號線211等依序排列。Please refer to FIG. 6 , which is a cross-sectional view of the third preferred embodiment of the present invention. In this embodiment, its main structure is the same as the above-mentioned first preferred embodiment, but the difference is that the
請參照第7圖,其係為本新型第四較佳具體實施例之剖視圖。於本實施例中,其主要結構皆與上述第二較佳具體實施例相同,惟差別在於排線2之導體層21更包含彼此間隔之複數條接地線212,且複數條接地線212係與呈雙排排列之複數條訊號線211彼此間隔排列,亦即一對訊號線211、一條接地線212、再一對訊號線211等依序排列。Please refer to FIG. 7 , which is a cross-sectional view of the fourth preferred embodiment of the present invention. In this embodiment, its main structure is the same as the above-mentioned second preferred embodiment, but the difference is that the
以上所述僅為本新型的較佳具體實施例,其並不用以限制本新型,凡在本新型的精神和原則之內,所作的任何修改、等同替換、改進等,均應包含在本新型的保護範圍之內。The above are only preferred specific embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection.
1:排線改良結構 2:排線 21:導體層 211:訊號線 212:接地線 22:金屬層 23:絕緣層 24:發泡體層 25:膠層 26:皮膜層 3:連接器 5:電路板 51:訊號傳導線 52:接地傳導線 7:訊號傳輸裝置 9:排線 91:導體層 911:訊號線 912:接地線 92:發泡體層 93:金屬層 94:絕緣層1: Cable improvement structure 2: Cable 21: Conductor layer 211: Signal line 212: ground wire 22: Metal layer 23: Insulation layer 24: Foam layer 25: Adhesive layer 26: Epithelial layer 3: Connector 5: circuit board 51: Signal conduction line 52: Ground conductor 7: Signal transmission device 9: Cable 91: Conductor layer 911: Signal line 912: Ground wire 92: foam layer 93: Metal layer 94: Insulation layer
第1圖係為習知排線之平面圖。Figure 1 is a plan view of a conventional cable.
第2圖係為取自第1圖A-A截面之剖視圖。FIG. 2 is a cross-sectional view taken from the section A-A of FIG. 1 .
第3圖係為本新型第一較佳具體實施例之立體圖。FIG. 3 is a perspective view of the first preferred embodiment of the novel.
第4圖係為本新型第一較佳具體實施例之剖視圖。FIG. 4 is a cross-sectional view of the first preferred embodiment of the novel.
第5圖係為本新型第二較佳具體實施例之剖視圖。Fig. 5 is a cross-sectional view of the second preferred embodiment of the novel.
第6圖係為本新型第三較佳具體實施例之剖視圖。FIG. 6 is a cross-sectional view of the third preferred embodiment of the novel.
第7圖係為本新型第四較佳具體實施例之剖視圖。FIG. 7 is a cross-sectional view of the fourth preferred embodiment of the novel.
1:排線改良結構 1: Cable improvement structure
2:排線 2: Cable
21:導體層 21: Conductor layer
211:訊號線 211: Signal line
22:金屬層 22: Metal layer
23:絕緣層 23: Insulation layer
24:發泡體層 24: Foam layer
25:膠層 25: Adhesive layer
26:皮膜層 26: Epithelial layer
Claims (9)
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|---|---|---|---|
| TW110210591U TWM628419U (en) | 2021-09-07 | 2021-09-07 | Improved structure of bus line |
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| TW110210591U TWM628419U (en) | 2021-09-07 | 2021-09-07 | Improved structure of bus line |
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| TWM628419U true TWM628419U (en) | 2022-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110210591U TWM628419U (en) | 2021-09-07 | 2021-09-07 | Improved structure of bus line |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM628419U (en) |
-
2021
- 2021-09-07 TW TW110210591U patent/TWM628419U/en not_active IP Right Cessation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |


