TWM627658U - Antenna device - Google Patents

Antenna device Download PDF

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Publication number
TWM627658U
TWM627658U TW110214597U TW110214597U TWM627658U TW M627658 U TWM627658 U TW M627658U TW 110214597 U TW110214597 U TW 110214597U TW 110214597 U TW110214597 U TW 110214597U TW M627658 U TWM627658 U TW M627658U
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Taiwan
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metal layer
antenna device
electrically connected
ground portion
metal
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TW110214597U
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Chinese (zh)
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阮鵬豪
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華碩電腦股份有限公司
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Priority to TW110214597U priority Critical patent/TWM627658U/en
Publication of TWM627658U publication Critical patent/TWM627658U/en

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Abstract

本案揭露一種天線裝置,其係安裝於一電子裝置之殼體內,殼體包含一第一系統接地面及一第二系統接地面。在天線裝置中,介質基板包含第一表面至第五表面。第一金屬層位於第三表面,第二金屬層位於第四表面,第三金屬層位於第五表面,第四金屬層位於第二表面且電性連接第一金屬層、第二金屬層、第三金屬層及第一系統接地面。第一接地部位於第一表面之長側邊,第一接地部之一長邊電性連接第一金屬層,且第一接地部之二短邊分別電性連接第二金屬層及第三金屬層。在第一表面上設有一輻射部、一訊號源、一饋入部及一耦合金屬支路,饋入部與輻射部之間具有一第一耦合間距且耦合金屬支路與饋入部之間具有一第二耦合間距。This application discloses an antenna device, which is installed in a casing of an electronic device, and the casing includes a first system ground plane and a second system ground plane. In the antenna device, the dielectric substrate includes first to fifth surfaces. The first metal layer is located on the third surface, the second metal layer is located on the fourth surface, the third metal layer is located on the fifth surface, the fourth metal layer is located on the second surface and is electrically connected to the first metal layer, the second metal layer, and the third metal layer. Three metal layers and the first system ground plane. The first ground portion is located on the long side of the first surface, one long side of the first ground portion is electrically connected to the first metal layer, and two short sides of the first ground portion are electrically connected to the second metal layer and the third metal layer respectively Floor. A radiating portion, a signal source, a feeding portion and a coupling metal branch are arranged on the first surface, a first coupling distance is formed between the feeding portion and the radiating portion, and a first coupling distance is formed between the coupling metal branch and the feeding portion Two coupling spacing.

Description

天線裝置Antenna device

本案係有關一種天線裝置。This case relates to an antenna device.

在不考慮無線通訊模組或晶片的特性下,且在相同的使用情境之下,決定筆記型電腦的無線通訊品質以及無線訊號傳輸速度大致上有二個主要條件,一個是天線特性的優劣,特性良好的天線可以提供較遠的傳輸距離以及較高的訊號涵蓋範圍,另一個則是高速訊號所產生的系統雜訊,較低的系統雜訊表示無線訊號受到的干擾機率相對較低,則更有機會提供較佳的無線通訊品質與傳輸速度。Without considering the characteristics of the wireless communication module or chip, and under the same use situation, there are generally two main conditions that determine the wireless communication quality and wireless signal transmission speed of the notebook computer. One is the advantages and disadvantages of the antenna characteristics. Antennas with good characteristics can provide longer transmission distance and higher signal coverage, and the other is the system noise generated by high-speed signals. More opportunities to provide better wireless communication quality and transmission speed.

然而,隨著系統內高速訊號的種類愈來愈多,且速度也愈來愈快,伴隨而來的是系統雜訊的增加,導致無線通訊系統容易受到干擾,使通訊品質下降。為了解決雜訊干擾的問題,常見的作法會使用特定頻率的電磁波吸波材(EMI noise absorber)貼附在雜訊源上,以降低系統帶來的雜訊,避免雜訊輻射被天線所接收。但是,使用電磁波吸波材可能會使筆記型電腦的厚度增加以及成本上升。而另一種常見的作法則是在天線的周圍設計一些機構結構作為金屬屏蔽,此種作法必須與天線具有一定的距離,避免對天線特性產生影響,在產品設計上也必須增加一些空間設置這些金屬屏蔽。雖然金屬屏蔽的作法可以減少天線收到系統雜訊,但是同時也會佔用到相對較大的使用空間,在空間有限的情況之下,要使用此方法的困難度較高。However, as there are more and more types of high-speed signals in the system, and the speed is also getting faster and faster, the accompanying increase of system noise leads to the wireless communication system being susceptible to interference and degrading the communication quality. In order to solve the problem of noise interference, a common practice is to use an EMI noise absorber with a specific frequency to attach to the noise source to reduce the noise brought by the system and prevent the noise radiation from being received by the antenna. . However, the use of electromagnetic wave absorbers may increase the thickness and cost of the notebook computer. Another common practice is to design some mechanical structures around the antenna as metal shields. This method must have a certain distance from the antenna to avoid affecting the characteristics of the antenna. In product design, some space must be added to set these metals. shield. Although the method of metal shielding can reduce the system noise received by the antenna, it also occupies a relatively large space for use. In the case of limited space, it is more difficult to use this method.

本案提供一種天線裝置,其係安裝於一電子裝置之一殼體內,殼體包含一第一系統接地面及一第二系統接地面。天線裝置包含一介質基板、一第一金屬層、一第二金屬層、一第三金屬層、一第四金屬層、一第一接地部、一輻射部、一訊號源、一饋入部以及一耦合金屬支路。介質基板位於殼體內,介質基板包含相對之一第一表面及一第二表面,以及位於第一表面及第二表面之間的一第三表面、一第四表面及一第五表面,其中第四表面相對於第五表面,且第三表面鄰接第四表面及第五表面。第一金屬層位於第三表面上,第二金屬層位於第四表面上且電性連接第一金屬層,第三金屬層位於第五表面上且電性連接第一金屬層,第四金屬層位於第二表面上且電性連接第一金屬層、第二金屬層、第三金屬層及第一系統接地面。第一接地部位於第一表面之長側邊,第一接地部之一長邊電性連接第一金屬層,且第一接地部之二短邊分別電性連接第二金屬層及第三金屬層。輻射部位於第一表面上,輻射部之一端電性連接第三金屬層,另一端朝第二金屬層方向延伸。訊號源連接饋入部及第一接地部。饋入部位於第一表面上,饋入部之一端電性連接訊號源,另一端朝向遠離第一接地部的方向延伸,且饋入部與輻射部之間係具有一第一耦合間距。耦合金屬支路位於第一表面上,耦合金屬支路之一端電性連接第一接地部,另一端朝向遠離第一接地部的方向延伸,且耦合金屬支路與饋入部之間係具有一第二耦合間距。The present application provides an antenna device, which is installed in a casing of an electronic device, and the casing includes a first system ground plane and a second system ground plane. The antenna device includes a dielectric substrate, a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a first grounding part, a radiation part, a signal source, a feeding part and a Coupling metal branches. The dielectric substrate is located in the casing, and the dielectric substrate includes a first surface and a second surface opposite to each other, and a third surface, a fourth surface and a fifth surface located between the first surface and the second surface, wherein the first surface and the second surface are located. The four surfaces are opposite to the fifth surface, and the third surface is adjacent to the fourth surface and the fifth surface. The first metal layer is located on the third surface, the second metal layer is located on the fourth surface and is electrically connected to the first metal layer, the third metal layer is located on the fifth surface and is electrically connected to the first metal layer, and the fourth metal layer It is located on the second surface and is electrically connected to the first metal layer, the second metal layer, the third metal layer and the first system ground plane. The first ground portion is located on the long side of the first surface, one long side of the first ground portion is electrically connected to the first metal layer, and two short sides of the first ground portion are electrically connected to the second metal layer and the third metal layer respectively Floor. The radiation portion is located on the first surface, one end of the radiation portion is electrically connected to the third metal layer, and the other end extends toward the second metal layer. The signal source is connected to the feeding part and the first ground part. The feeding portion is located on the first surface, one end of the feeding portion is electrically connected to the signal source, the other end extends away from the first ground portion, and there is a first coupling distance between the feeding portion and the radiating portion. The coupling metal branch is located on the first surface, one end of the coupling metal branch is electrically connected to the first grounding portion, the other end extends away from the first grounding portion, and there is a first grounding portion between the coupling metal branch and the feeding portion. Two coupling spacing.

綜上所述,本案係為一種低雜訊干擾之天線裝置設計,其係可減少天線接收到系統輻射出的雜訊,並有效維持良好的無線通訊品質,使本案之天線裝置可以在不增加天線尺寸與空間的情況下,並可同時達成無線區域網路(WLAN)的低頻操作頻帶(2.41~2.480 GHz)及高頻操作頻帶(5.15~7.125 GHz)的操作頻寬,以滿足WiFi 6E的頻寬需求。To sum up, this case is designed for an antenna device with low noise interference, which can reduce the noise radiated by the antenna received by the system, and effectively maintain good wireless communication quality, so that the antenna device in this case can be used without increasing In the case of antenna size and space, it can simultaneously achieve the low-frequency operating frequency band (2.41-2.480 GHz) and the high-frequency operating frequency band (5.15-7.125 GHz) of the wireless local area network (WLAN) to meet the requirements of WiFi 6E. bandwidth requirements.

請同時參閱圖1、圖2、圖3及圖4所示,本案之一種天線裝置10係安裝於一電子裝置之殼體40內,此殼體40包含一第一系統接地面42以及一第二系統接地面44。此天線裝置10包含有一介質基板12、一第一金屬層14、一第二金屬層16、一第三金屬層18、一第四金屬層20、一第一接地部22、一第二接地部24、一第三接地部26、一輻射部28、一訊號源30、一饋入部32以及一耦合金屬支路34。Please refer to FIGS. 1 , 2 , 3 and 4 at the same time. An antenna device 10 of the present application is installed in a casing 40 of an electronic device. The casing 40 includes a first system ground plane 42 and a first system ground plane 42 . Two system ground plane 44 . The antenna device 10 includes a dielectric substrate 12 , a first metal layer 14 , a second metal layer 16 , a third metal layer 18 , a fourth metal layer 20 , a first ground portion 22 , and a second ground portion 24 . A third grounding portion 26 , a radiation portion 28 , a signal source 30 , a feeding portion 32 and a coupling metal branch 34 .

在一實施例中,電子裝置係為一筆記型電腦,此時殼體40係由一底座蓋體以及一鍵盤金屬蓋所組成,且鍵盤金屬蓋可以與底座蓋體組裝在一起,其中鍵盤金屬蓋係作為第一系統接地面42,底座蓋體係作為第二系統接地面44,使天線裝置10安裝在第一系統接地面42與第二系統接地面44之間,但本案不以此為限。In one embodiment, the electronic device is a notebook computer, and the casing 40 is composed of a base cover and a keyboard metal cover, and the keyboard metal cover can be assembled with the base cover, wherein the keyboard metal cover The cover system serves as the first system ground plane 42, and the base cover system serves as the second system ground plane 44, so that the antenna device 10 is installed between the first system ground plane 42 and the second system ground plane 44, but this case is not limited to this .

請同時參閱圖1至圖4所示,在此天線裝置10中,介質基板12位於殼體40內,介質基板12包含上下相對之一第一表面121及一第二表面122,以及位於第一表面121及第二表面122之間的一第三表面123、一第四表面124及一第五表面125,第四表面124相對於第五表面125,且第三表面123鄰接第四表面124及第五表面125。第一金屬層14位於第三表面123上,且覆蓋整個第三表面123。第二金屬層16位於第四表面124上且覆蓋整個第四表面124,第二金屬層16一側電性連接第一金屬層14。第三金屬層18位於第五表面125上且覆蓋整個第五表面125,第三金屬層18之一側電性連接第一金屬層14。第四金屬層20位於第二表面122上且覆蓋整個第二表面122,第四金屬層20電性連接第一金屬層14、第二金屬層16、第三金屬層18及第一系統接地面42,使天線裝置10透過第四金屬層20接觸第一系統接地面42並安裝於其上。第一接地部22位於第一表面121之長側邊,第一接地部22之一長邊電性連接第一金屬層14,且第一接地部22之二短邊則分別電性連接第二金屬層16及第三金屬層18。第二接地部24位於第一表面121的短側邊且鄰近第四表面124,第二接地部24電性連接第二金屬層16及第一接地部22。第三接地部26位於第一表面121的另一短側邊且鄰近第五表面125,第三接地部26電性連接第三金屬層18及第一接地部22。Please refer to FIG. 1 to FIG. 4 at the same time. In the antenna device 10, the dielectric substrate 12 is located in the casing 40. The dielectric substrate 12 includes a first surface 121 and a second surface 122 that are opposite to each other up and down. A third surface 123, a fourth surface 124 and a fifth surface 125 between the surface 121 and the second surface 122, the fourth surface 124 is opposite to the fifth surface 125, and the third surface 123 is adjacent to the fourth surface 124 and Fifth surface 125 . The first metal layer 14 is located on the third surface 123 and covers the entire third surface 123 . The second metal layer 16 is located on the fourth surface 124 and covers the entire fourth surface 124 , and one side of the second metal layer 16 is electrically connected to the first metal layer 14 . The third metal layer 18 is located on the fifth surface 125 and covers the entire fifth surface 125 , and one side of the third metal layer 18 is electrically connected to the first metal layer 14 . The fourth metal layer 20 is located on the second surface 122 and covers the entire second surface 122 , and the fourth metal layer 20 is electrically connected to the first metal layer 14 , the second metal layer 16 , the third metal layer 18 and the first system ground plane 42 , making the antenna device 10 contact the first system ground plane 42 through the fourth metal layer 20 and be mounted thereon. The first ground portion 22 is located on the long side of the first surface 121 , one long side of the first ground portion 22 is electrically connected to the first metal layer 14 , and two short sides of the first ground portion 22 are respectively electrically connected to the second The metal layer 16 and the third metal layer 18 . The second ground portion 24 is located on the short side of the first surface 121 and adjacent to the fourth surface 124 . The second ground portion 24 is electrically connected to the second metal layer 16 and the first ground portion 22 . The third ground portion 26 is located on the other short side of the first surface 121 and adjacent to the fifth surface 125 , and the third ground portion 26 is electrically connected to the third metal layer 18 and the first ground portion 22 .

輻射部28亦位於第一表面121上,輻射部28之一端電性連接至第三接地部26,另一端朝向第二金屬層16(第二接地部24)的方向延伸,且輻射部28之另一端的末端具有朝向第一接地部22彎折之一第一彎折段281。訊號源30位於第一表面121上,訊號源30之一端電性連接第一接地部22,另一端則電性連接饋入部32。饋入部32位於第一表面121上,饋入部32之一端電性連接訊號源30,另一端朝向遠離第一接地部22的方向延伸,且饋入部32之另一端係具有朝向第二金屬層16(第二接地部24)的方向彎折之一第二彎折段321,其中饋入部32與輻射部28之第一彎折段281之間係具有一第一耦合間距D1。耦合金屬支路34位於第一表面121上,耦合金屬支路34之一端電性連接第一接地部22,另一端朝向遠離第一接地部22的方向延伸,且耦合金屬支路34與饋入部32之間係具有一第二耦合間距D2。The radiation portion 28 is also located on the first surface 121 . One end of the radiation portion 28 is electrically connected to the third ground portion 26 , and the other end extends toward the direction of the second metal layer 16 (the second ground portion 24 ). The end of the other end has a first bending section 281 bent toward the first grounding portion 22 . The signal source 30 is located on the first surface 121 . One end of the signal source 30 is electrically connected to the first grounding portion 22 , and the other end is electrically connected to the feeding portion 32 . The feeding portion 32 is located on the first surface 121 . One end of the feeding portion 32 is electrically connected to the signal source 30 , the other end extends away from the first ground portion 22 , and the other end of the feeding portion 32 faces the second metal layer 16 . A second bending section 321 is bent in the direction of (the second grounding portion 24 ), wherein there is a first coupling distance D1 between the feeding portion 32 and the first bending section 281 of the radiating portion 28 . The coupling metal branch 34 is located on the first surface 121 , one end of the coupling metal branch 34 is electrically connected to the first grounding portion 22 , and the other end extends away from the first grounding portion 22 , and the coupling metal branch 34 and the feeding portion There is a second coupling distance D2 between 32 .

請同時參閱圖1至圖4所示,在天線裝置10中之第一接地部22、第二接地部24及第三接地部26係面對第二系統接地面44,並透過一導電材36電性連接第二系統接地面44,使天線裝置10安裝於第一系統接地面42與第二系統接地面44之間。在一實施例中,上述之導電材36係可以為任一具有電流可傳導之材料,例如常用的導電泡棉或是導電雙面背膠等。Please refer to FIGS. 1 to 4 at the same time, the first ground portion 22 , the second ground portion 24 and the third ground portion 26 in the antenna device 10 face the second system ground plane 44 and pass through a conductive material 36 The second system ground plane 44 is electrically connected, so that the antenna device 10 is installed between the first system ground plane 42 and the second system ground plane 44 . In one embodiment, the above-mentioned conductive material 36 may be any material capable of conducting current, such as a commonly used conductive foam or a conductive double-sided adhesive.

如圖1至圖4所示,第四金屬層20分別與第一金屬層14、第二金屬層16以及第三金屬層18電性連接,形成「ㄇ」字型的金屬屏蔽,並且與第一系統接地面42電性連接,以分別透過三個平面(第一金屬層14、第二金屬層16以及第三金屬層18)在垂直方向完整的搭接,可以減少天線接收到系統端所產生的雜訊。再者,為了達到較佳的屏蔽特性,在介質基板12之第一表面121上更設置有第一接地部22、第二接地部24與第三接地部26,分別與上述的「ㄇ」字型的金屬屏蔽電性連接,並透過導電材36搭接至上方而與第二系統接地面44電性連接。As shown in FIG. 1 to FIG. 4 , the fourth metal layer 20 is electrically connected to the first metal layer 14 , the second metal layer 16 and the third metal layer 18 respectively to form a “ㄇ”-shaped metal shield, and is connected to the first metal layer 14 , the second metal layer 16 and the third metal layer 18 respectively. A system ground plane 42 is electrically connected so that the three planes (the first metal layer 14 , the second metal layer 16 , and the third metal layer 18 ) are completely overlapped in the vertical direction, which can reduce the amount of noise received by the antenna from the system end. generated noise. Furthermore, in order to achieve better shielding properties, a first ground portion 22 , a second ground portion 24 and a third ground portion 26 are further provided on the first surface 121 of the dielectric substrate 12 , respectively corresponding to the above-mentioned “ㄇ” character. The metal shield of the type is electrically connected, and is connected to the second system ground plane 44 by overlapping the conductive material 36 to the top.

在一實施例中,請同時參閱圖5、圖6及圖7所示,介質基板12之第一表面121更可為一斜面126,此斜面126係配合第二系統接地面44之形狀,在此實施例中,第一接地部22係位在第一表面121最高的位置上,第二接地部24、第三接地部26、輻射部28、訊號源30、饋入部32以及耦合金屬支路34皆位在第一表面121的斜面126上。此時,第二系統接地面44之斜面441係對應此第一表面121的斜面126,讓天線裝置10仍可藉由導電材36的搭接與導電,使第一接地部22、第二接地部24及第三接地部26係透過導電材36電性連接第二系統接地面44。除了斜面126設計之外,其餘之結構與作用係與前述實施例相同,故可以參考前面說明,於此不再贅述。In one embodiment, please refer to FIG. 5 , FIG. 6 and FIG. 7 at the same time, the first surface 121 of the dielectric substrate 12 may further be an inclined surface 126 , and the inclined surface 126 is matched with the shape of the second system ground plane 44 . In this embodiment, the first grounding portion 22 is located at the highest position of the first surface 121 , the second grounding portion 24 , the third grounding portion 26 , the radiation portion 28 , the signal source 30 , the feeding portion 32 and the coupling metal branch 34 are all located on the inclined surface 126 of the first surface 121 . At this time, the inclined plane 441 of the second system ground plane 44 corresponds to the inclined plane 126 of the first surface 121 , so that the antenna device 10 can still conduct the first grounding portion 22 and the second grounding portion 22 and the second grounding portion 10 through the overlap and conduction of the conductive material 36 . The portion 24 and the third ground portion 26 are electrically connected to the second system ground plane 44 through the conductive material 36 . Except for the design of the inclined surface 126 , the other structures and functions are the same as those of the previous embodiment, so reference can be made to the previous description, which will not be repeated here.

在另一實施例中,請同時參閱圖8、圖9、圖10及圖11所示,天線裝置10包含有一介質基板12、一第一金屬層14、一第二金屬層16、一第三金屬層18、一第四金屬層20、一第一接地部22、一輻射部28、一訊號源30、一饋入部32以及一耦合金屬支路34。在此天線裝置10中,介質基板12位於殼體40內,介質基板12亦包含第一表面121、第二表面122、第三表面123、第四表面124及第五表面125。第一金屬層14位於第三表面123上,且覆蓋整個第三表面123。第二金屬層16位於第四表面124上且覆蓋整個第四表面124,第二金屬層16一側電性連接第一金屬層14。第三金屬層18位於第五表面125上且覆蓋整個第五表面125,第三金屬層18之一側電性連接第一金屬層14。第四金屬層20位於第二表面122上且覆蓋整個第二表面122,第四金屬層20電性連接第一金屬層14、第二金屬層16、第三金屬層18及第一系統接地面42,使天線裝置10透過第四金屬層20接觸第一系統接地面42並安裝於其上。第一接地部22位於第一表面121之長側邊,第一接地部22之一長邊電性連接第一金屬層14,且第一接地部22之二短邊則分別電性連接第二金屬層16及第三金屬層18。In another embodiment, please refer to FIG. 8 , FIG. 9 , FIG. 10 and FIG. 11 simultaneously, the antenna device 10 includes a dielectric substrate 12 , a first metal layer 14 , a second metal layer 16 , and a third metal layer 12 . The metal layer 18 , a fourth metal layer 20 , a first ground portion 22 , a radiation portion 28 , a signal source 30 , a feeding portion 32 and a coupling metal branch 34 . In the antenna device 10 , the dielectric substrate 12 is located in the casing 40 , and the dielectric substrate 12 also includes a first surface 121 , a second surface 122 , a third surface 123 , a fourth surface 124 and a fifth surface 125 . The first metal layer 14 is located on the third surface 123 and covers the entire third surface 123 . The second metal layer 16 is located on the fourth surface 124 and covers the entire fourth surface 124 , and one side of the second metal layer 16 is electrically connected to the first metal layer 14 . The third metal layer 18 is located on the fifth surface 125 and covers the entire fifth surface 125 , and one side of the third metal layer 18 is electrically connected to the first metal layer 14 . The fourth metal layer 20 is located on the second surface 122 and covers the entire second surface 122 , and the fourth metal layer 20 is electrically connected to the first metal layer 14 , the second metal layer 16 , the third metal layer 18 and the first system ground plane 42 , making the antenna device 10 contact the first system ground plane 42 through the fourth metal layer 20 and be mounted thereon. The first ground portion 22 is located on the long side of the first surface 121 , one long side of the first ground portion 22 is electrically connected to the first metal layer 14 , and two short sides of the first ground portion 22 are respectively electrically connected to the second The metal layer 16 and the third metal layer 18 .

輻射部28亦位於第一表面121上,輻射部28之一端電性連接至第三金屬層18,另一端朝向第二金屬層16的方向延伸,且輻射部28之另一端具有朝向第一接地部22彎折之一第一彎折段281。訊號源30位於第一表面121上,訊號源30之一端電性連接第一接地部22,另一端則電性連接饋入部32。饋入部32位於第一表面121上,饋入部32之一端電性連接訊號源30,另一端朝向遠離第一接地部22的方向延伸並具有朝向第二金屬層16的方向彎折之第二彎折段321,且饋入部32與輻射部28之第一彎折段281之間係具有第一耦合間距D1。耦合金屬支路34位於第一表面121上,耦合金屬支路34之一端電性連接第一接地部22,另一端朝向遠離第一接地部22的方向延伸,且耦合金屬支路34與饋入部32之間係具有第二耦合間距D2。The radiation portion 28 is also located on the first surface 121 , one end of the radiation portion 28 is electrically connected to the third metal layer 18 , the other end extends toward the direction of the second metal layer 16 , and the other end of the radiation portion 28 faces the first ground. The portion 22 is bent with a first bent section 281 . The signal source 30 is located on the first surface 121 . One end of the signal source 30 is electrically connected to the first grounding portion 22 , and the other end is electrically connected to the feeding portion 32 . The feeding portion 32 is located on the first surface 121 . One end of the feeding portion 32 is electrically connected to the signal source 30 , and the other end extends away from the first ground portion 22 and has a second bend that is bent in the direction of the second metal layer 16 . There is a first coupling distance D1 between the feeding portion 32 and the first bending portion 281 of the radiating portion 28 . The coupling metal branch 34 is located on the first surface 121 , one end of the coupling metal branch 34 is electrically connected to the first grounding portion 22 , and the other end extends away from the first grounding portion 22 , and the coupling metal branch 34 and the feeding portion There is a second coupling distance D2 between 32 .

如圖8至圖11所示,在天線裝置10中之第一接地部22係面對第二系統接地面44,並透過一導電材36電性連接第二系統接地面44,使天線裝置10安裝於第一系統接地面42與第二系統接地面44之間。由於第四金屬層20分別與第一金屬層14、第二金屬層16以及第三金屬層18電性連接,故可形成「ㄇ」字型的金屬屏蔽,並且與第一系統接地面42電性連接,在第一表面121上更設置有第一接地部22與上述的「ㄇ」字型的金屬屏蔽電性連接,並透過導電材36搭接至上方而與第二系統接地面44電性連接,基此,本案分別透過三個平面(第一金屬層14、第二金屬層16以及第三金屬層18)在垂直方向完整的搭接,可以減少天線接收到系統端所產生的雜訊。As shown in FIGS. 8 to 11 , the first ground portion 22 of the antenna device 10 faces the second system ground plane 44 and is electrically connected to the second system ground plane 44 through a conductive material 36 , so that the antenna device 10 is electrically connected to the second system ground plane 44 . Installed between the first system ground plane 42 and the second system ground plane 44 . Since the fourth metal layer 20 is electrically connected to the first metal layer 14 , the second metal layer 16 and the third metal layer 18 respectively, a “ㄇ”-shaped metal shield can be formed and is electrically connected to the first system ground plane 42 For electrical connection, the first ground portion 22 is further provided on the first surface 121 to be electrically connected to the above-mentioned “ㄇ”-shaped metal shield, and is connected to the top through the conductive material 36 to be electrically connected to the second system ground plane 44 Therefore, in this case, the three planes (the first metal layer 14, the second metal layer 16 and the third metal layer 18) are completely overlapped in the vertical direction, which can reduce the noise generated by the antenna receiving the system end. News.

在一實施例中,請同時參閱圖12、圖13及圖14所示,介質基板12之第一表面121更可為一斜面126,此斜面126係配合第二系統接地面44之形狀,在此實施例中,第一接地部22係位在第一表面121最高的位置上,輻射部28、訊號源30、饋入部32以及耦合金屬支路34皆位在第一表面121的斜面126上。此時,第二系統接地面44之斜面441係對應此第一表面121的斜面126,讓天線裝置10仍可藉由導電材36的搭接與導電,使第一接地部22係透過導電材36電性連接第二系統接地面44。除了斜面126設計之外,其餘之結構與作用係與前述實施例相同,故可以參考前面說明,於此不再贅述。In one embodiment, please refer to FIG. 12 , FIG. 13 and FIG. 14 at the same time, the first surface 121 of the dielectric substrate 12 may further be an inclined surface 126 , and the inclined surface 126 matches the shape of the second system ground plane 44 . In this embodiment, the first ground portion 22 is located at the highest position of the first surface 121 , and the radiation portion 28 , the signal source 30 , the feeding portion 32 and the coupling metal branch 34 are all located on the inclined surface 126 of the first surface 121 . At this time, the inclined surface 441 of the second system ground plane 44 corresponds to the inclined surface 126 of the first surface 121 , so that the antenna device 10 can still conduct electricity through the overlapping of the conductive material 36 , so that the first grounding portion 22 passes through the conductive material. 36 is electrically connected to the second system ground plane 44 . Except for the design of the inclined surface 126 , the other structures and functions are the same as those of the previous embodiment, so reference can be made to the previous description, which will not be repeated here.

在一實施例中,如圖1所示,第一金屬層14、第二金屬層16、第三金屬層18、第四金屬層20、第一接地部22、第二接地部24、第三接地部26、輻射部28(包含第一彎折段281)、饋入部32(包含第二彎折段321)以及耦合金屬支路34等元件係由導電性金屬材料製成,例如銀、銅、鋁、鐵或是其合金等,但本案不以此為限。In one embodiment, as shown in FIG. 1 , the first metal layer 14 , the second metal layer 16 , the third metal layer 18 , the fourth metal layer 20 , the first ground portion 22 , the second ground portion 24 , the third The grounding part 26 , the radiation part 28 (including the first bending section 281 ), the feeding part 32 (including the second bending section 321 ), and the coupling metal branch 34 are made of conductive metal materials, such as silver, copper , aluminum, iron or its alloys, etc., but this case is not limited to this.

請同時參閱圖1至圖4所示,以應用在無線區域網路(WLAN)之天線裝置10為例,饋入部32透過第一耦合間距D1將訊號電性耦合至輻射部28,在低頻頻帶2.44 GHz形成一個0.25λ的單極天線共振模態而操作於低頻頻帶,如圖15所示,且藉由調整第一耦合間距D1的大小可以控制低頻帶的阻抗匹配。在高頻頻帶5.25 GHz則是由饋入部32形成一個同樣是0.25λ的單極天線共振模態,如圖16所示。另一個高頻頻帶7.4 GHz則由輻射部28形成的0.75λ的高階共振模態,在輻射部28上具有一個電流零點,如圖17所示。另外,在距離饋入部32第二耦合間距D2的位置上增加耦合金屬支路34的設計,以藉由調整第二耦合間距D2與耦合金屬支路34的尺寸,可以調整高頻帶的阻抗匹配,以藉此操作在高頻頻帶。因此,本案可適用於低頻(2400-2480 MHz)的操作頻段以及高頻(5150-7150 MHz)的操作頻段。Please refer to FIG. 1 to FIG. 4 at the same time, taking the antenna device 10 applied in a wireless local area network (WLAN) as an example, the feeding part 32 electrically couples the signal to the radiating part 28 through the first coupling distance D1, and in the low frequency band 2.44 GHz forms a 0.25λ monopole antenna resonance mode to operate in the low frequency band, as shown in Figure 15, and the impedance matching of the low frequency band can be controlled by adjusting the size of the first coupling distance D1. In the high frequency band of 5.25 GHz, a monopole antenna resonance mode with the same 0.25λ is formed by the feeding part 32, as shown in FIG. 16 . In another high frequency band of 7.4 GHz, a high-order resonance mode of 0.75λ formed by the radiation portion 28 has a current zero point on the radiation portion 28, as shown in FIG. 17 . In addition, the design of the coupling metal branch 34 is added at a position away from the second coupling distance D2 of the feeding part 32, so that by adjusting the second coupling distance D2 and the size of the coupling metal branch 34, the impedance matching of the high frequency band can be adjusted, to operate in the high frequency band. Therefore, this case can be applied to the low frequency (2400-2480 MHz) operating frequency band and the high frequency (5150-7150 MHz) operating frequency band.

本案提出之天線裝置10確實具有良好的返回損失。請同時參閱圖1及圖18所示,以此天線裝置10於射頻訊號傳輸時,來進行S參數的模擬分析。天線裝置10在低頻操作頻帶(2.41~2.48 GHz)及高頻操作頻帶(5.15~7.125 GHz)時,其S參數模擬結果如圖18所示,於由圖式所顯示的曲線可知,本案在低頻操作頻帶及高頻操作頻帶內顯示天線共振頻帶返回損失(S參數)都具有大於5 dB(S參數<-5 dB)的表現,證明在低頻操作頻帶及高頻操作頻帶皆有良好返回損失,可有效適用於低頻操作頻帶(2.41~2.480 GHz)及高頻操作頻帶(5.15~7.125 GHz),也同時符合目前WiFi 6E的操作頻帶。The antenna device 10 proposed in this case does have good return loss. Please refer to FIG. 1 and FIG. 18 at the same time, the antenna device 10 is used to perform the simulation analysis of S-parameters when the radio frequency signal is transmitted. When the antenna device 10 operates in the low-frequency operating frequency band (2.41-2.48 GHz) and the high-frequency operating frequency band (5.15-7.125 GHz), the S-parameter simulation results of the antenna device 10 are shown in Fig. The return loss (S parameter) of the antenna resonance band in the operating frequency band and the high frequency operating frequency band is greater than 5 dB (S parameter <-5 dB), which proves that there is a good return loss in both the low frequency operating frequency band and the high frequency operating frequency band. It can be effectively applied to the low frequency operating frequency band (2.41-2.480 GHz) and the high-frequency operating frequency band (5.15-7.125 GHz), and also conforms to the current operating frequency band of WiFi 6E.

綜上所述,由於目前筆記型電腦以及無線通訊裝置受到系統雜訊干擾的情形愈來愈嚴重,因此本案提供一種低雜訊干擾之天線裝置設計,利用天線裝置在三個不同方向的垂直金屬面(第一金屬層、第二金屬層以及第三金屬層)與第一系統接地面及第二系統接地面完整搭接,形成一個「ㄇ」字型的金屬屏蔽,可減少天線接收到系統輻射出的雜訊,並有效維持良好的無線通訊品質,更使本案之天線裝置可以在不增加天線尺寸與空間的情況下,同時達成無線區域網路(WLAN)的低頻操作頻帶(2.41~2.480 GHz及高頻操作頻帶(5.15~7.125 GHz)的操作頻寬,滿足WiFi 6E的頻寬需求。To sum up, since the current situation of notebook computers and wireless communication devices being interfered by system noise is becoming more and more serious, this application provides a design of an antenna device with low noise interference, which utilizes the vertical metal elements of the antenna device in three different directions. The surface (the first metal layer, the second metal layer and the third metal layer) is completely overlapped with the first system ground plane and the second system ground plane to form a "ㄇ"-shaped metal shield, which can reduce the amount of antenna received by the system. The radiated noise can effectively maintain a good wireless communication quality, and the antenna device in this case can achieve the low-frequency operating frequency band (2.41 ~ 2.480 of the wireless local area network (WLAN) at the same time without increasing the size and space of the antenna. The operating bandwidth of GHz and high-frequency operating bands (5.15-7.125 GHz) meets the bandwidth requirements of WiFi 6E.

以上所述之實施例僅係為說明本案之技術思想及特點,其目的在使熟悉此項技術者能夠瞭解本案之內容並據以實施,當不能以之限定本案之專利範圍,即大凡依本案所揭示之精神所作之均等變化或修飾,仍應涵蓋在本案之申請專利範圍內。The above-mentioned embodiments are only intended to illustrate the technical ideas and features of this case, and their purpose is to enable those familiar with the art to understand the content of this case and implement them accordingly. Equivalent changes or modifications made to the disclosed spirit shall still be covered within the scope of the patent application in this case.

10:天線裝置 12:介質基板 121:第一表面 122:第二表面 123:第三表面 124:第四表面 125:第五表面 126:斜面 14:第一金屬層 16:第二金屬層 18:第三金屬層 20:第四金屬層 22:第一接地部 24:第二接地部 26:第三接地部 28:輻射部 281:第一彎折段 30:訊號源 32:饋入部 321:第二彎折段 34:耦合金屬支路 36:導電材 40:殼體 42:第一系統接地面 44:第二系統接地面 441:斜面 D1:第一耦合間距 D2:第二耦合間距 10: Antenna device 12: Dielectric substrate 121: First surface 122: Second Surface 123: Third Surface 124: Fourth Surface 125: Fifth Surface 126: Bevel 14: The first metal layer 16: Second metal layer 18: The third metal layer 20: Fourth metal layer 22: The first ground part 24: Second ground 26: The third ground 28: Radiation Department 281: The first bending segment 30: Signal source 32: Infeed 321: Second bending segment 34: Coupling metal branch 36: Conductive material 40: Shell 42: First system ground plane 44: Second system ground plane 441: Bevel D1: The first coupling distance D2: Second coupling pitch

圖1為根據本案一實施例之天線裝置的結構示意圖。 圖2為根據本案一實施例之天線裝置的部分結構分解示意圖。 圖3為根據本案一實施例之天線裝置設置於殼體上的結構示意圖。 圖4為根據本案一實施例之天線裝置設置於殼體上的結構剖視圖。 圖5為根據本案另一實施例之天線裝置的結構示意圖。 圖6為根據本案另一實施例之天線裝置設置於殼體上的結構示意圖。 圖7為根據本案另一實施例之天線裝置設置於殼體上的結構剖視圖。 圖8為根據本案再一實施例之天線裝置的結構示意圖。 圖9為根據本案再一實施例之天線裝置的部分結構分解示意圖。 圖10為根據本案再一實施例之天線裝置設置於殼體上的結構示意圖。 圖11為根據本案再一實施例之天線裝置設置於殼體上的結構剖視圖。 圖12為根據本案又一實施例之天線裝置的結構示意圖。 圖13為根據本案又一實施例之天線裝置設置於殼體上的結構示意圖。 圖14為根據本案又一實施例之天線裝置設置於殼體上的結構剖視圖。 圖15為根據本案一實施例之天線裝置之訊號源激發在2.44 GHz的電流分布圖。 圖16為根據本案一實施例之天線裝置之訊號源激發在5.25 GHz的電流分布圖。 圖17為根據本案一實施例之天線裝置之訊號源激發在7.4 GHz的電流分布圖。 圖18為根據本案之天線裝置產生的S參數模擬示意圖。 FIG. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present invention. FIG. 2 is an exploded schematic diagram of a partial structure of an antenna device according to an embodiment of the present invention. FIG. 3 is a schematic structural diagram of an antenna device disposed on a casing according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of the structure of the antenna device disposed on the casing according to an embodiment of the present invention. FIG. 5 is a schematic structural diagram of an antenna device according to another embodiment of the present invention. FIG. 6 is a schematic structural diagram of an antenna device disposed on a casing according to another embodiment of the present invention. FIG. 7 is a cross-sectional view of the structure of the antenna device disposed on the casing according to another embodiment of the present invention. FIG. 8 is a schematic structural diagram of an antenna device according to still another embodiment of the present application. FIG. 9 is an exploded schematic diagram of a partial structure of an antenna device according to still another embodiment of the present application. FIG. 10 is a schematic structural diagram of an antenna device disposed on a casing according to yet another embodiment of the present application. FIG. 11 is a cross-sectional view of the structure of the antenna device disposed on the casing according to still another embodiment of the present application. FIG. 12 is a schematic structural diagram of an antenna device according to yet another embodiment of the present application. FIG. 13 is a schematic structural diagram of an antenna device disposed on a casing according to yet another embodiment of the present application. FIG. 14 is a cross-sectional view of the structure of the antenna device disposed on the casing according to yet another embodiment of the present application. FIG. 15 is a current distribution diagram of the signal source excited at 2.44 GHz of the antenna device according to an embodiment of the present application. FIG. 16 is a current distribution diagram of the signal source excited at 5.25 GHz of the antenna device according to an embodiment of the present application. FIG. 17 is a current distribution diagram of the signal source excited at 7.4 GHz of the antenna device according to an embodiment of the present invention. FIG. 18 is a schematic diagram of S-parameter simulation generated by the antenna device according to the present application.

10:天線裝置 10: Antenna device

12:介質基板 12: Dielectric substrate

121:第一表面 121: First surface

14:第一金屬層 14: The first metal layer

16:第二金屬層 16: Second metal layer

18:第三金屬層 18: The third metal layer

20:第四金屬層 20: Fourth metal layer

22:第一接地部 22: The first ground part

24:第二接地部 24: Second ground

26:第三接地部 26: The third ground

28:輻射部 28: Radiation Department

281:第一彎折段 281: The first bending segment

30:訊號源 30: Signal source

32:饋入部 32: Infeed

321:第二彎折段 321: Second bending segment

34:耦合金屬支路 34: Coupling metal branch

D1:第一耦合間距 D1: The first coupling distance

D2:第二耦合間距 D2: Second coupling pitch

Claims (14)

一種天線裝置,安裝於一電子裝置之一殼體內,該殼體包含一第一系統接地面及一第二系統接地面,該天線裝置包含: 一介質基板,位於該殼體內,該介質基板包含相對之一第一表面及一第二表面,以及位於該第一表面及該第二表面之間的一第三表面、一第四表面及一第五表面,該第四表面相對於該第五表面,且該第三表面鄰接該第四表面及該第五表面; 一第一金屬層,位於該第三表面上; 一第二金屬層,位於該第四表面上且電性連接該第一金屬層; 一第三金屬層,位於該第五表面上且電性連接該第一金屬層; 一第四金屬層,位於該第二表面上且電性連接該第一金屬層、該第二金屬層、該第三金屬層及該第一系統接地面; 一第一接地部,位於該第一表面之長側邊,該第一接地部之一長邊電性連接該第一金屬層,且該第一接地部之二短邊分別電性連接該第二金屬層及該第三金屬層; 一輻射部,位於該第一表面上,該輻射部之一端電性連接該第三金屬層,另一端朝該第二金屬層方向延伸; 一訊號源,其電性連接該第一接地部; 一饋入部,位於該第一表面上,該饋入部之一端電性連接該訊號源,另一端朝向遠離該第一接地部的方向延伸,且該饋入部與該輻射部之間係具有一第一耦合間距;以及 一耦合金屬支路,位於該第一表面上,該耦合金屬支路之一端電性連接該第一接地部,另一端朝向遠離該第一接地部的方向延伸,且該耦合金屬支路與該饋入部之間係具有一第二耦合間距。 An antenna device is installed in a casing of an electronic device, the casing includes a first system ground plane and a second system ground plane, the antenna device includes: a dielectric substrate located in the casing, the dielectric substrate includes a first surface and a second surface opposite to each other, and a third surface, a fourth surface and a a fifth surface, the fourth surface is opposite to the fifth surface, and the third surface is adjacent to the fourth surface and the fifth surface; a first metal layer on the third surface; a second metal layer located on the fourth surface and electrically connected to the first metal layer; a third metal layer located on the fifth surface and electrically connected to the first metal layer; a fourth metal layer located on the second surface and electrically connected to the first metal layer, the second metal layer, the third metal layer and the first system ground plane; a first ground portion located on the long side of the first surface, one long side of the first ground portion is electrically connected to the first metal layer, and two short sides of the first ground portion are respectively electrically connected to the first metal layer two metal layers and the third metal layer; a radiation portion located on the first surface, one end of the radiation portion is electrically connected to the third metal layer, and the other end extends toward the second metal layer; a signal source electrically connected to the first ground portion; a feed-in portion located on the first surface, one end of the feed-in portion is electrically connected to the signal source, the other end extends away from the first ground portion, and there is a first a coupling distance; and A coupling metal branch is located on the first surface, one end of the coupling metal branch is electrically connected to the first ground portion, the other end extends away from the first ground portion, and the coupling metal branch is connected to the first ground portion. There is a second coupling distance between the feeding parts. 如請求項1所述之天線裝置,其中該輻射部之另一端更具有朝向該第一接地部彎折之一第一彎折段,使該饋入部與該第一彎折段之間具有該第一耦合間距。The antenna device of claim 1, wherein the other end of the radiating portion further has a first bending section bent toward the first ground portion, so that the feeding portion and the first bending section have the first coupling pitch. 如請求項1所述之天線裝置,其中該饋入部之另一端更具有朝向該第二金屬層方向彎折的一第二彎折段。The antenna device of claim 1, wherein the other end of the feeding portion further has a second bending section bent toward the direction of the second metal layer. 如請求項1所述之天線裝置,更包括一第二接地部,位於該第一表面的短側邊,且電性連接該第二金屬層及該第一接地部。The antenna device as claimed in claim 1, further comprising a second ground portion located on the short side of the first surface and electrically connected to the second metal layer and the first ground portion. 如請求項4所述之天線裝置,更包括一第三接地部,位於該第一表面的另一短側邊,且電性連接該第三金屬層及該第一接地部,該輻射部之一端電性連接至該第三接地部。The antenna device as claimed in claim 4, further comprising a third ground portion located on the other short side of the first surface and electrically connected to the third metal layer and the first ground portion, and the radiation portion is One end is electrically connected to the third ground portion. 如請求項5所述之天線裝置,其中該第一接地部、該第二接地部及該第三接地部係透過一導電材電性連接該第二系統接地面。The antenna device of claim 5, wherein the first ground portion, the second ground portion and the third ground portion are electrically connected to the second system ground plane through a conductive material. 如請求項6所述之天線裝置,其中該第一表面係為一斜面,以配合該第二系統接地面之形狀。The antenna device of claim 6, wherein the first surface is an inclined plane to match the shape of the second system ground plane. 如請求項1所述之天線裝置,其中該第一接地部係透過一導電材電性連接該第二系統接地面。The antenna device of claim 1, wherein the first ground portion is electrically connected to the second system ground plane through a conductive material. 如請求項8所述之天線裝置,其中該第一表面係為一斜面,以配合該第二系統接地面之形狀。The antenna device of claim 8, wherein the first surface is an inclined plane to match the shape of the second system ground plane. 如請求項1所述之天線裝置,其中該殼體更包含一底座蓋體以及一鍵盤金屬蓋,該第一系統接地面係為該鍵盤金屬蓋,該第二系統接地面係為該底座蓋體。The antenna device of claim 1, wherein the casing further comprises a base cover and a keyboard metal cover, the first system ground plane is the keyboard metal cover, and the second system ground plane is the base cover body. 如請求項1所述之天線裝置,其中該第一金屬層係覆蓋整個該第三表面。The antenna device of claim 1, wherein the first metal layer covers the entire third surface. 如請求項1所述之天線裝置,其中該第二金屬層係覆蓋整個該第四表面。The antenna device of claim 1, wherein the second metal layer covers the entire fourth surface. 如請求項1所述之天線裝置,其中該第三金屬層係覆蓋整個該第五表面。The antenna device of claim 1, wherein the third metal layer covers the entire fifth surface. 如請求項1所述之天線裝置,其中該第四金屬層係覆蓋整個該第二表面。The antenna device of claim 1, wherein the fourth metal layer covers the entire second surface.
TW110214597U 2021-12-07 2021-12-07 Antenna device TWM627658U (en)

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