TWM627658U - Antenna device - Google Patents
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Abstract
本案揭露一種天線裝置,其係安裝於一電子裝置之殼體內,殼體包含一第一系統接地面及一第二系統接地面。在天線裝置中,介質基板包含第一表面至第五表面。第一金屬層位於第三表面,第二金屬層位於第四表面,第三金屬層位於第五表面,第四金屬層位於第二表面且電性連接第一金屬層、第二金屬層、第三金屬層及第一系統接地面。第一接地部位於第一表面之長側邊,第一接地部之一長邊電性連接第一金屬層,且第一接地部之二短邊分別電性連接第二金屬層及第三金屬層。在第一表面上設有一輻射部、一訊號源、一饋入部及一耦合金屬支路,饋入部與輻射部之間具有一第一耦合間距且耦合金屬支路與饋入部之間具有一第二耦合間距。This application discloses an antenna device, which is installed in a casing of an electronic device, and the casing includes a first system ground plane and a second system ground plane. In the antenna device, the dielectric substrate includes first to fifth surfaces. The first metal layer is located on the third surface, the second metal layer is located on the fourth surface, the third metal layer is located on the fifth surface, the fourth metal layer is located on the second surface and is electrically connected to the first metal layer, the second metal layer, and the third metal layer. Three metal layers and the first system ground plane. The first ground portion is located on the long side of the first surface, one long side of the first ground portion is electrically connected to the first metal layer, and two short sides of the first ground portion are electrically connected to the second metal layer and the third metal layer respectively Floor. A radiating portion, a signal source, a feeding portion and a coupling metal branch are arranged on the first surface, a first coupling distance is formed between the feeding portion and the radiating portion, and a first coupling distance is formed between the coupling metal branch and the feeding portion Two coupling spacing.
Description
本案係有關一種天線裝置。This case relates to an antenna device.
在不考慮無線通訊模組或晶片的特性下,且在相同的使用情境之下,決定筆記型電腦的無線通訊品質以及無線訊號傳輸速度大致上有二個主要條件,一個是天線特性的優劣,特性良好的天線可以提供較遠的傳輸距離以及較高的訊號涵蓋範圍,另一個則是高速訊號所產生的系統雜訊,較低的系統雜訊表示無線訊號受到的干擾機率相對較低,則更有機會提供較佳的無線通訊品質與傳輸速度。Without considering the characteristics of the wireless communication module or chip, and under the same use situation, there are generally two main conditions that determine the wireless communication quality and wireless signal transmission speed of the notebook computer. One is the advantages and disadvantages of the antenna characteristics. Antennas with good characteristics can provide longer transmission distance and higher signal coverage, and the other is the system noise generated by high-speed signals. More opportunities to provide better wireless communication quality and transmission speed.
然而,隨著系統內高速訊號的種類愈來愈多,且速度也愈來愈快,伴隨而來的是系統雜訊的增加,導致無線通訊系統容易受到干擾,使通訊品質下降。為了解決雜訊干擾的問題,常見的作法會使用特定頻率的電磁波吸波材(EMI noise absorber)貼附在雜訊源上,以降低系統帶來的雜訊,避免雜訊輻射被天線所接收。但是,使用電磁波吸波材可能會使筆記型電腦的厚度增加以及成本上升。而另一種常見的作法則是在天線的周圍設計一些機構結構作為金屬屏蔽,此種作法必須與天線具有一定的距離,避免對天線特性產生影響,在產品設計上也必須增加一些空間設置這些金屬屏蔽。雖然金屬屏蔽的作法可以減少天線收到系統雜訊,但是同時也會佔用到相對較大的使用空間,在空間有限的情況之下,要使用此方法的困難度較高。However, as there are more and more types of high-speed signals in the system, and the speed is also getting faster and faster, the accompanying increase of system noise leads to the wireless communication system being susceptible to interference and degrading the communication quality. In order to solve the problem of noise interference, a common practice is to use an EMI noise absorber with a specific frequency to attach to the noise source to reduce the noise brought by the system and prevent the noise radiation from being received by the antenna. . However, the use of electromagnetic wave absorbers may increase the thickness and cost of the notebook computer. Another common practice is to design some mechanical structures around the antenna as metal shields. This method must have a certain distance from the antenna to avoid affecting the characteristics of the antenna. In product design, some space must be added to set these metals. shield. Although the method of metal shielding can reduce the system noise received by the antenna, it also occupies a relatively large space for use. In the case of limited space, it is more difficult to use this method.
本案提供一種天線裝置,其係安裝於一電子裝置之一殼體內,殼體包含一第一系統接地面及一第二系統接地面。天線裝置包含一介質基板、一第一金屬層、一第二金屬層、一第三金屬層、一第四金屬層、一第一接地部、一輻射部、一訊號源、一饋入部以及一耦合金屬支路。介質基板位於殼體內,介質基板包含相對之一第一表面及一第二表面,以及位於第一表面及第二表面之間的一第三表面、一第四表面及一第五表面,其中第四表面相對於第五表面,且第三表面鄰接第四表面及第五表面。第一金屬層位於第三表面上,第二金屬層位於第四表面上且電性連接第一金屬層,第三金屬層位於第五表面上且電性連接第一金屬層,第四金屬層位於第二表面上且電性連接第一金屬層、第二金屬層、第三金屬層及第一系統接地面。第一接地部位於第一表面之長側邊,第一接地部之一長邊電性連接第一金屬層,且第一接地部之二短邊分別電性連接第二金屬層及第三金屬層。輻射部位於第一表面上,輻射部之一端電性連接第三金屬層,另一端朝第二金屬層方向延伸。訊號源連接饋入部及第一接地部。饋入部位於第一表面上,饋入部之一端電性連接訊號源,另一端朝向遠離第一接地部的方向延伸,且饋入部與輻射部之間係具有一第一耦合間距。耦合金屬支路位於第一表面上,耦合金屬支路之一端電性連接第一接地部,另一端朝向遠離第一接地部的方向延伸,且耦合金屬支路與饋入部之間係具有一第二耦合間距。The present application provides an antenna device, which is installed in a casing of an electronic device, and the casing includes a first system ground plane and a second system ground plane. The antenna device includes a dielectric substrate, a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a first grounding part, a radiation part, a signal source, a feeding part and a Coupling metal branches. The dielectric substrate is located in the casing, and the dielectric substrate includes a first surface and a second surface opposite to each other, and a third surface, a fourth surface and a fifth surface located between the first surface and the second surface, wherein the first surface and the second surface are located. The four surfaces are opposite to the fifth surface, and the third surface is adjacent to the fourth surface and the fifth surface. The first metal layer is located on the third surface, the second metal layer is located on the fourth surface and is electrically connected to the first metal layer, the third metal layer is located on the fifth surface and is electrically connected to the first metal layer, and the fourth metal layer It is located on the second surface and is electrically connected to the first metal layer, the second metal layer, the third metal layer and the first system ground plane. The first ground portion is located on the long side of the first surface, one long side of the first ground portion is electrically connected to the first metal layer, and two short sides of the first ground portion are electrically connected to the second metal layer and the third metal layer respectively Floor. The radiation portion is located on the first surface, one end of the radiation portion is electrically connected to the third metal layer, and the other end extends toward the second metal layer. The signal source is connected to the feeding part and the first ground part. The feeding portion is located on the first surface, one end of the feeding portion is electrically connected to the signal source, the other end extends away from the first ground portion, and there is a first coupling distance between the feeding portion and the radiating portion. The coupling metal branch is located on the first surface, one end of the coupling metal branch is electrically connected to the first grounding portion, the other end extends away from the first grounding portion, and there is a first grounding portion between the coupling metal branch and the feeding portion. Two coupling spacing.
綜上所述,本案係為一種低雜訊干擾之天線裝置設計,其係可減少天線接收到系統輻射出的雜訊,並有效維持良好的無線通訊品質,使本案之天線裝置可以在不增加天線尺寸與空間的情況下,並可同時達成無線區域網路(WLAN)的低頻操作頻帶(2.41~2.480 GHz)及高頻操作頻帶(5.15~7.125 GHz)的操作頻寬,以滿足WiFi 6E的頻寬需求。To sum up, this case is designed for an antenna device with low noise interference, which can reduce the noise radiated by the antenna received by the system, and effectively maintain good wireless communication quality, so that the antenna device in this case can be used without increasing In the case of antenna size and space, it can simultaneously achieve the low-frequency operating frequency band (2.41-2.480 GHz) and the high-frequency operating frequency band (5.15-7.125 GHz) of the wireless local area network (WLAN) to meet the requirements of WiFi 6E. bandwidth requirements.
請同時參閱圖1、圖2、圖3及圖4所示,本案之一種天線裝置10係安裝於一電子裝置之殼體40內,此殼體40包含一第一系統接地面42以及一第二系統接地面44。此天線裝置10包含有一介質基板12、一第一金屬層14、一第二金屬層16、一第三金屬層18、一第四金屬層20、一第一接地部22、一第二接地部24、一第三接地部26、一輻射部28、一訊號源30、一饋入部32以及一耦合金屬支路34。Please refer to FIGS. 1 , 2 , 3 and 4 at the same time. An
在一實施例中,電子裝置係為一筆記型電腦,此時殼體40係由一底座蓋體以及一鍵盤金屬蓋所組成,且鍵盤金屬蓋可以與底座蓋體組裝在一起,其中鍵盤金屬蓋係作為第一系統接地面42,底座蓋體係作為第二系統接地面44,使天線裝置10安裝在第一系統接地面42與第二系統接地面44之間,但本案不以此為限。In one embodiment, the electronic device is a notebook computer, and the
請同時參閱圖1至圖4所示,在此天線裝置10中,介質基板12位於殼體40內,介質基板12包含上下相對之一第一表面121及一第二表面122,以及位於第一表面121及第二表面122之間的一第三表面123、一第四表面124及一第五表面125,第四表面124相對於第五表面125,且第三表面123鄰接第四表面124及第五表面125。第一金屬層14位於第三表面123上,且覆蓋整個第三表面123。第二金屬層16位於第四表面124上且覆蓋整個第四表面124,第二金屬層16一側電性連接第一金屬層14。第三金屬層18位於第五表面125上且覆蓋整個第五表面125,第三金屬層18之一側電性連接第一金屬層14。第四金屬層20位於第二表面122上且覆蓋整個第二表面122,第四金屬層20電性連接第一金屬層14、第二金屬層16、第三金屬層18及第一系統接地面42,使天線裝置10透過第四金屬層20接觸第一系統接地面42並安裝於其上。第一接地部22位於第一表面121之長側邊,第一接地部22之一長邊電性連接第一金屬層14,且第一接地部22之二短邊則分別電性連接第二金屬層16及第三金屬層18。第二接地部24位於第一表面121的短側邊且鄰近第四表面124,第二接地部24電性連接第二金屬層16及第一接地部22。第三接地部26位於第一表面121的另一短側邊且鄰近第五表面125,第三接地部26電性連接第三金屬層18及第一接地部22。Please refer to FIG. 1 to FIG. 4 at the same time. In the
輻射部28亦位於第一表面121上,輻射部28之一端電性連接至第三接地部26,另一端朝向第二金屬層16(第二接地部24)的方向延伸,且輻射部28之另一端的末端具有朝向第一接地部22彎折之一第一彎折段281。訊號源30位於第一表面121上,訊號源30之一端電性連接第一接地部22,另一端則電性連接饋入部32。饋入部32位於第一表面121上,饋入部32之一端電性連接訊號源30,另一端朝向遠離第一接地部22的方向延伸,且饋入部32之另一端係具有朝向第二金屬層16(第二接地部24)的方向彎折之一第二彎折段321,其中饋入部32與輻射部28之第一彎折段281之間係具有一第一耦合間距D1。耦合金屬支路34位於第一表面121上,耦合金屬支路34之一端電性連接第一接地部22,另一端朝向遠離第一接地部22的方向延伸,且耦合金屬支路34與饋入部32之間係具有一第二耦合間距D2。The
請同時參閱圖1至圖4所示,在天線裝置10中之第一接地部22、第二接地部24及第三接地部26係面對第二系統接地面44,並透過一導電材36電性連接第二系統接地面44,使天線裝置10安裝於第一系統接地面42與第二系統接地面44之間。在一實施例中,上述之導電材36係可以為任一具有電流可傳導之材料,例如常用的導電泡棉或是導電雙面背膠等。Please refer to FIGS. 1 to 4 at the same time, the
如圖1至圖4所示,第四金屬層20分別與第一金屬層14、第二金屬層16以及第三金屬層18電性連接,形成「ㄇ」字型的金屬屏蔽,並且與第一系統接地面42電性連接,以分別透過三個平面(第一金屬層14、第二金屬層16以及第三金屬層18)在垂直方向完整的搭接,可以減少天線接收到系統端所產生的雜訊。再者,為了達到較佳的屏蔽特性,在介質基板12之第一表面121上更設置有第一接地部22、第二接地部24與第三接地部26,分別與上述的「ㄇ」字型的金屬屏蔽電性連接,並透過導電材36搭接至上方而與第二系統接地面44電性連接。As shown in FIG. 1 to FIG. 4 , the
在一實施例中,請同時參閱圖5、圖6及圖7所示,介質基板12之第一表面121更可為一斜面126,此斜面126係配合第二系統接地面44之形狀,在此實施例中,第一接地部22係位在第一表面121最高的位置上,第二接地部24、第三接地部26、輻射部28、訊號源30、饋入部32以及耦合金屬支路34皆位在第一表面121的斜面126上。此時,第二系統接地面44之斜面441係對應此第一表面121的斜面126,讓天線裝置10仍可藉由導電材36的搭接與導電,使第一接地部22、第二接地部24及第三接地部26係透過導電材36電性連接第二系統接地面44。除了斜面126設計之外,其餘之結構與作用係與前述實施例相同,故可以參考前面說明,於此不再贅述。In one embodiment, please refer to FIG. 5 , FIG. 6 and FIG. 7 at the same time, the
在另一實施例中,請同時參閱圖8、圖9、圖10及圖11所示,天線裝置10包含有一介質基板12、一第一金屬層14、一第二金屬層16、一第三金屬層18、一第四金屬層20、一第一接地部22、一輻射部28、一訊號源30、一饋入部32以及一耦合金屬支路34。在此天線裝置10中,介質基板12位於殼體40內,介質基板12亦包含第一表面121、第二表面122、第三表面123、第四表面124及第五表面125。第一金屬層14位於第三表面123上,且覆蓋整個第三表面123。第二金屬層16位於第四表面124上且覆蓋整個第四表面124,第二金屬層16一側電性連接第一金屬層14。第三金屬層18位於第五表面125上且覆蓋整個第五表面125,第三金屬層18之一側電性連接第一金屬層14。第四金屬層20位於第二表面122上且覆蓋整個第二表面122,第四金屬層20電性連接第一金屬層14、第二金屬層16、第三金屬層18及第一系統接地面42,使天線裝置10透過第四金屬層20接觸第一系統接地面42並安裝於其上。第一接地部22位於第一表面121之長側邊,第一接地部22之一長邊電性連接第一金屬層14,且第一接地部22之二短邊則分別電性連接第二金屬層16及第三金屬層18。In another embodiment, please refer to FIG. 8 , FIG. 9 , FIG. 10 and FIG. 11 simultaneously, the
輻射部28亦位於第一表面121上,輻射部28之一端電性連接至第三金屬層18,另一端朝向第二金屬層16的方向延伸,且輻射部28之另一端具有朝向第一接地部22彎折之一第一彎折段281。訊號源30位於第一表面121上,訊號源30之一端電性連接第一接地部22,另一端則電性連接饋入部32。饋入部32位於第一表面121上,饋入部32之一端電性連接訊號源30,另一端朝向遠離第一接地部22的方向延伸並具有朝向第二金屬層16的方向彎折之第二彎折段321,且饋入部32與輻射部28之第一彎折段281之間係具有第一耦合間距D1。耦合金屬支路34位於第一表面121上,耦合金屬支路34之一端電性連接第一接地部22,另一端朝向遠離第一接地部22的方向延伸,且耦合金屬支路34與饋入部32之間係具有第二耦合間距D2。The
如圖8至圖11所示,在天線裝置10中之第一接地部22係面對第二系統接地面44,並透過一導電材36電性連接第二系統接地面44,使天線裝置10安裝於第一系統接地面42與第二系統接地面44之間。由於第四金屬層20分別與第一金屬層14、第二金屬層16以及第三金屬層18電性連接,故可形成「ㄇ」字型的金屬屏蔽,並且與第一系統接地面42電性連接,在第一表面121上更設置有第一接地部22與上述的「ㄇ」字型的金屬屏蔽電性連接,並透過導電材36搭接至上方而與第二系統接地面44電性連接,基此,本案分別透過三個平面(第一金屬層14、第二金屬層16以及第三金屬層18)在垂直方向完整的搭接,可以減少天線接收到系統端所產生的雜訊。As shown in FIGS. 8 to 11 , the
在一實施例中,請同時參閱圖12、圖13及圖14所示,介質基板12之第一表面121更可為一斜面126,此斜面126係配合第二系統接地面44之形狀,在此實施例中,第一接地部22係位在第一表面121最高的位置上,輻射部28、訊號源30、饋入部32以及耦合金屬支路34皆位在第一表面121的斜面126上。此時,第二系統接地面44之斜面441係對應此第一表面121的斜面126,讓天線裝置10仍可藉由導電材36的搭接與導電,使第一接地部22係透過導電材36電性連接第二系統接地面44。除了斜面126設計之外,其餘之結構與作用係與前述實施例相同,故可以參考前面說明,於此不再贅述。In one embodiment, please refer to FIG. 12 , FIG. 13 and FIG. 14 at the same time, the
在一實施例中,如圖1所示,第一金屬層14、第二金屬層16、第三金屬層18、第四金屬層20、第一接地部22、第二接地部24、第三接地部26、輻射部28(包含第一彎折段281)、饋入部32(包含第二彎折段321)以及耦合金屬支路34等元件係由導電性金屬材料製成,例如銀、銅、鋁、鐵或是其合金等,但本案不以此為限。In one embodiment, as shown in FIG. 1 , the
請同時參閱圖1至圖4所示,以應用在無線區域網路(WLAN)之天線裝置10為例,饋入部32透過第一耦合間距D1將訊號電性耦合至輻射部28,在低頻頻帶2.44 GHz形成一個0.25λ的單極天線共振模態而操作於低頻頻帶,如圖15所示,且藉由調整第一耦合間距D1的大小可以控制低頻帶的阻抗匹配。在高頻頻帶5.25 GHz則是由饋入部32形成一個同樣是0.25λ的單極天線共振模態,如圖16所示。另一個高頻頻帶7.4 GHz則由輻射部28形成的0.75λ的高階共振模態,在輻射部28上具有一個電流零點,如圖17所示。另外,在距離饋入部32第二耦合間距D2的位置上增加耦合金屬支路34的設計,以藉由調整第二耦合間距D2與耦合金屬支路34的尺寸,可以調整高頻帶的阻抗匹配,以藉此操作在高頻頻帶。因此,本案可適用於低頻(2400-2480 MHz)的操作頻段以及高頻(5150-7150 MHz)的操作頻段。Please refer to FIG. 1 to FIG. 4 at the same time, taking the
本案提出之天線裝置10確實具有良好的返回損失。請同時參閱圖1及圖18所示,以此天線裝置10於射頻訊號傳輸時,來進行S參數的模擬分析。天線裝置10在低頻操作頻帶(2.41~2.48 GHz)及高頻操作頻帶(5.15~7.125 GHz)時,其S參數模擬結果如圖18所示,於由圖式所顯示的曲線可知,本案在低頻操作頻帶及高頻操作頻帶內顯示天線共振頻帶返回損失(S參數)都具有大於5 dB(S參數<-5 dB)的表現,證明在低頻操作頻帶及高頻操作頻帶皆有良好返回損失,可有效適用於低頻操作頻帶(2.41~2.480 GHz)及高頻操作頻帶(5.15~7.125 GHz),也同時符合目前WiFi 6E的操作頻帶。The
綜上所述,由於目前筆記型電腦以及無線通訊裝置受到系統雜訊干擾的情形愈來愈嚴重,因此本案提供一種低雜訊干擾之天線裝置設計,利用天線裝置在三個不同方向的垂直金屬面(第一金屬層、第二金屬層以及第三金屬層)與第一系統接地面及第二系統接地面完整搭接,形成一個「ㄇ」字型的金屬屏蔽,可減少天線接收到系統輻射出的雜訊,並有效維持良好的無線通訊品質,更使本案之天線裝置可以在不增加天線尺寸與空間的情況下,同時達成無線區域網路(WLAN)的低頻操作頻帶(2.41~2.480 GHz及高頻操作頻帶(5.15~7.125 GHz)的操作頻寬,滿足WiFi 6E的頻寬需求。To sum up, since the current situation of notebook computers and wireless communication devices being interfered by system noise is becoming more and more serious, this application provides a design of an antenna device with low noise interference, which utilizes the vertical metal elements of the antenna device in three different directions. The surface (the first metal layer, the second metal layer and the third metal layer) is completely overlapped with the first system ground plane and the second system ground plane to form a "ㄇ"-shaped metal shield, which can reduce the amount of antenna received by the system. The radiated noise can effectively maintain a good wireless communication quality, and the antenna device in this case can achieve the low-frequency operating frequency band (2.41 ~ 2.480 of the wireless local area network (WLAN) at the same time without increasing the size and space of the antenna. The operating bandwidth of GHz and high-frequency operating bands (5.15-7.125 GHz) meets the bandwidth requirements of WiFi 6E.
以上所述之實施例僅係為說明本案之技術思想及特點,其目的在使熟悉此項技術者能夠瞭解本案之內容並據以實施,當不能以之限定本案之專利範圍,即大凡依本案所揭示之精神所作之均等變化或修飾,仍應涵蓋在本案之申請專利範圍內。The above-mentioned embodiments are only intended to illustrate the technical ideas and features of this case, and their purpose is to enable those familiar with the art to understand the content of this case and implement them accordingly. Equivalent changes or modifications made to the disclosed spirit shall still be covered within the scope of the patent application in this case.
10:天線裝置 12:介質基板 121:第一表面 122:第二表面 123:第三表面 124:第四表面 125:第五表面 126:斜面 14:第一金屬層 16:第二金屬層 18:第三金屬層 20:第四金屬層 22:第一接地部 24:第二接地部 26:第三接地部 28:輻射部 281:第一彎折段 30:訊號源 32:饋入部 321:第二彎折段 34:耦合金屬支路 36:導電材 40:殼體 42:第一系統接地面 44:第二系統接地面 441:斜面 D1:第一耦合間距 D2:第二耦合間距 10: Antenna device 12: Dielectric substrate 121: First surface 122: Second Surface 123: Third Surface 124: Fourth Surface 125: Fifth Surface 126: Bevel 14: The first metal layer 16: Second metal layer 18: The third metal layer 20: Fourth metal layer 22: The first ground part 24: Second ground 26: The third ground 28: Radiation Department 281: The first bending segment 30: Signal source 32: Infeed 321: Second bending segment 34: Coupling metal branch 36: Conductive material 40: Shell 42: First system ground plane 44: Second system ground plane 441: Bevel D1: The first coupling distance D2: Second coupling pitch
圖1為根據本案一實施例之天線裝置的結構示意圖。 圖2為根據本案一實施例之天線裝置的部分結構分解示意圖。 圖3為根據本案一實施例之天線裝置設置於殼體上的結構示意圖。 圖4為根據本案一實施例之天線裝置設置於殼體上的結構剖視圖。 圖5為根據本案另一實施例之天線裝置的結構示意圖。 圖6為根據本案另一實施例之天線裝置設置於殼體上的結構示意圖。 圖7為根據本案另一實施例之天線裝置設置於殼體上的結構剖視圖。 圖8為根據本案再一實施例之天線裝置的結構示意圖。 圖9為根據本案再一實施例之天線裝置的部分結構分解示意圖。 圖10為根據本案再一實施例之天線裝置設置於殼體上的結構示意圖。 圖11為根據本案再一實施例之天線裝置設置於殼體上的結構剖視圖。 圖12為根據本案又一實施例之天線裝置的結構示意圖。 圖13為根據本案又一實施例之天線裝置設置於殼體上的結構示意圖。 圖14為根據本案又一實施例之天線裝置設置於殼體上的結構剖視圖。 圖15為根據本案一實施例之天線裝置之訊號源激發在2.44 GHz的電流分布圖。 圖16為根據本案一實施例之天線裝置之訊號源激發在5.25 GHz的電流分布圖。 圖17為根據本案一實施例之天線裝置之訊號源激發在7.4 GHz的電流分布圖。 圖18為根據本案之天線裝置產生的S參數模擬示意圖。 FIG. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present invention. FIG. 2 is an exploded schematic diagram of a partial structure of an antenna device according to an embodiment of the present invention. FIG. 3 is a schematic structural diagram of an antenna device disposed on a casing according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of the structure of the antenna device disposed on the casing according to an embodiment of the present invention. FIG. 5 is a schematic structural diagram of an antenna device according to another embodiment of the present invention. FIG. 6 is a schematic structural diagram of an antenna device disposed on a casing according to another embodiment of the present invention. FIG. 7 is a cross-sectional view of the structure of the antenna device disposed on the casing according to another embodiment of the present invention. FIG. 8 is a schematic structural diagram of an antenna device according to still another embodiment of the present application. FIG. 9 is an exploded schematic diagram of a partial structure of an antenna device according to still another embodiment of the present application. FIG. 10 is a schematic structural diagram of an antenna device disposed on a casing according to yet another embodiment of the present application. FIG. 11 is a cross-sectional view of the structure of the antenna device disposed on the casing according to still another embodiment of the present application. FIG. 12 is a schematic structural diagram of an antenna device according to yet another embodiment of the present application. FIG. 13 is a schematic structural diagram of an antenna device disposed on a casing according to yet another embodiment of the present application. FIG. 14 is a cross-sectional view of the structure of the antenna device disposed on the casing according to yet another embodiment of the present application. FIG. 15 is a current distribution diagram of the signal source excited at 2.44 GHz of the antenna device according to an embodiment of the present application. FIG. 16 is a current distribution diagram of the signal source excited at 5.25 GHz of the antenna device according to an embodiment of the present application. FIG. 17 is a current distribution diagram of the signal source excited at 7.4 GHz of the antenna device according to an embodiment of the present invention. FIG. 18 is a schematic diagram of S-parameter simulation generated by the antenna device according to the present application.
10:天線裝置 10: Antenna device
12:介質基板 12: Dielectric substrate
121:第一表面 121: First surface
14:第一金屬層 14: The first metal layer
16:第二金屬層 16: Second metal layer
18:第三金屬層 18: The third metal layer
20:第四金屬層 20: Fourth metal layer
22:第一接地部 22: The first ground part
24:第二接地部 24: Second ground
26:第三接地部 26: The third ground
28:輻射部 28: Radiation Department
281:第一彎折段 281: The first bending segment
30:訊號源 30: Signal source
32:饋入部 32: Infeed
321:第二彎折段 321: Second bending segment
34:耦合金屬支路 34: Coupling metal branch
D1:第一耦合間距 D1: The first coupling distance
D2:第二耦合間距 D2: Second coupling pitch
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW110214597U TWM627658U (en) | 2021-12-07 | 2021-12-07 | Antenna device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW110214597U TWM627658U (en) | 2021-12-07 | 2021-12-07 | Antenna device |
Publications (1)
Publication Number | Publication Date |
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TWM627658U true TWM627658U (en) | 2022-06-01 |
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ID=83062966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW110214597U TWM627658U (en) | 2021-12-07 | 2021-12-07 | Antenna device |
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TW (1) | TWM627658U (en) |
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2021
- 2021-12-07 TW TW110214597U patent/TWM627658U/en unknown
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