TWM624678U - Integrated circuitry of speaker - Google Patents

Abstract

An integrated circuitry of speaker is provided. A wireless communication circuit, a speaker unit and an audio unit are horizontally or vertically integrated on a substrate for forming an integrated speaker device. A magnetic component of the speaker unit can be a single micro-segment element or an array-type micro-segment element. The micro-segment element is essentially consisting of a wiring layer and an electrode layer. The wiring layer includes multiple metal line segments. The electrode layer includes electrode zones that collect electrode ends of each of metal line segments. When designing the micro-segment element, parameters such as a total length of the multiple line segments, a line width, a line spacing of adjacent line segments and a length of each line segment, or further including turns of the micro-segment and a loop distance, are considered according to impedance requirement.

Description

Integrated circuit for loudspeaker

The utility model relates to a circuit of a loudspeaker, in particular to an integrated circuit integrating a communication circuit and a loudspeaker.

In the design of electronic products, various circuits are traditionally fabricated (such as soldering) on an electrical connection board. For example, a computer motherboard includes processor chips, memory chips, communication chips, etc. When fabricated on a printed circuit board On the circuit board, it is convenient to cooperate with each other to perform arithmetic work.

In response to the demand for miniaturized electronic circuits, the trend of integrating multiple electronic components into an electronic product is the development goal of many electronic manufacturers, and various technologies have also been produced, such as the integration of processors and memory into one. The design also uses advanced technologies such as chip set (chipset) and system on chip (SoC), so that in addition to miniaturization, it also has the advantages of reducing cost, increasing circuit performance, and low power consumption.

The disclosure proposes an integrated circuit of a speaker that integrates a peripheral circuit and a speaker. The integrated circuit of the speaker mainly integrates the circuit elements in the speaker in a horizontal or vertical structure, such as a wireless communication circuit and an antenna, a microphone unit, a speaker unit and The sound effect unit is on a substrate, wherein the wireless communication circuit, the microphone unit and the speaker unit are electrically connected to the sound effect circuit.

According to one embodiment, the integrated circuit of the speaker mainly includes a wireless communication circuit, an integrated antenna unit for receiving audio provided by an external device, an audio unit for processing the audio, and a speaker unit for broadcasting the sound effect. The audio processed by the unit, in particular, the magnetic element in the speaker unit may be a micro-segment element, or an array of micro-segment elements formed by a plurality of micro-segment elements. The wireless communication circuit, the speaker unit and the sound effect unit are integrated on a substrate in a horizontal or vertical structure to realize an integrated speaker device.

Further, the integrated circuit of the speaker further includes a microphone unit for inputting the received audio to the sound effect unit.

Further, the integrated speaker device realizes a small speaker device, the wireless communication circuit can use a Bluetooth communication module, and at the same time, the antenna unit is integrated on a printed circuit board.

Preferably, the antenna can be an F-shaped, inverted-F-shaped, meander-shaped, planar, bulk or multi-layer ceramic antenna.

Preferably, the Bluetooth communication module and the sound effect unit can be integrated into one chip; and the speaker unit and the microphone unit can also be integrated into one chip. The base material can be an electrical connection board, and the wireless communication circuit, the microphone unit and the speaker unit can be electrically connected to the sound effect circuit through the electrical connection board.

Preferably, the magnetic element in the speaker unit can be a micro-segment element, or an array of micro-segment elements formed by a plurality of micro-segment elements.

Further, a single micro-segment element includes a wiring layer with multiple metal segments. Taking a micro-segment element surrounding continuous metal segments as an example, starting from a starting point and encircling the starting point, multiple circles of continuous wiring metal segments are formed; For example, the micro-segment element of the linear metal segment has a plurality of parallel metal segments with the same direction.

Wherein the two ends of each metal line segment are the first electrode end and the second electrode end, wherein the starting position is the first electrode of the micro-line segment element, and the end position of the multi-segment metal line segment is the second electrode of the micro-line segment element; The electrode layer is provided with a first electrode area and a second electrode area. The first electrode area is used for collecting the first electrode ends of each metal line segment in the multi-segment metal line segment, and the second electrode area is used for collecting each metal line segment in the multi-segment metal line segment. the second electrode terminal. Determine a total length, line width, line spacing between adjacent metal line segments, a length of each metal line segment and/or metal line segment material according to impedance value, magnetic field or size requirements. The line segment element may also include a lap number and a lap distance.

In one embodiment, the integrated speaker device may be a vertically integrated integrated speaker device, wherein the wireless communication circuit, the microphone unit, the speaker unit and the sound effect unit may be vertically stacked on the substrate by a stacked die technique.

In another embodiment, the integrated speaker device can be a horizontally integrated integrated speaker device, wherein the wireless communication circuit, the microphone unit, the speaker unit and the sound effect unit can be planarly integrated with each circuit element disposed on the base on the material.

For a further understanding of the features and technical contents of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the implementation of the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

In addition to the traditional circuit integration technology, further, when the speaker needs to have a communication function, this disclosure further proposes an integrated circuit for the speaker, in which the component-level integration methods can be divided into two categories: vertical integration and planar integration.

FIG. 1 shows a schematic diagram of the design concept of an integrated circuit of a speaker, wherein a wireless communication circuit, a microphone unit and a speaker unit are provided, and a sound effect circuit is electrically connected. The embodiment can be integrated on a substrate in a horizontal or vertical structure to achieve An integrated speaker device.

Generally speaking, since the speaker unit cannot operate at high temperature and requires a certain volume, it cannot be directly soldered on the electrical connection board, but the integrated speaker device 10 is a semiconductor speaker, in which a semiconductor speaker is used. The magnetic element fabricated by the process can refer to the embodiments shown in FIG. 5 to FIG. 7. It has the characteristics of heat resistance and small size, so it can be directly integrated with other circuit elements on a substrate, such as the electrical connection board.

According to an embodiment, the integrated speaker device 10 can realize a small speaker device such as an earphone, and can receive audio provided by an external device (such as a mobile device, a personal computer, etc.) by wireless communication technology, wherein a Bluetooth communication module 101 can be used, and at the same time The antenna unit 103 is integrated, and the antenna unit 103 can be fabricated on the electrical connection board by a printing process. The sound effect unit 105 is an audio processing circuit, which can execute processing procedures such as audio decoding, encoding, compression, decompression, signal amplification, gain, and noise reduction. The audio processed by the sound effect unit 105 can be played through the speaker unit 109 . The microphone unit 107 can be additionally disposed in the speaker device to process the received audio, input the audio to the sound effect unit 105 , and output the encoded and compressed audio effect, which can also be played on the speaker unit 109 .

Taking the integrated speaker device 10 as an example, in one embodiment, the Bluetooth communication module 101 and the sound effect unit 105 can be integrated into one chip, and then electrically connected to an exposed antenna unit 103 in the form of the antenna unit 103 F-shaped, inverted-F-shaped, meander-shaped, planar, bulk or multi-layer ceramic antennas or other forms of antennas can be produced by printing process. Systems, MEMS) microphone integrated in a chip.

The technical effect of the integrated speaker device 10 shown in the embodiment is that a single device has a complete function of wireless communication to send and receive signals, the volume of the device can be only the size of a general Bluetooth audio module, and it can be connected to various mobile devices, notebooks, etc. computer and wearable devices to meet various usage needs. The speaker unit 109 can use a micro-segment circuit (the embodiments shown in FIGS. 5 to 9 ), which can overcome the problem of space, and the freed space can be used to expand other components to achieve higher performance. Furthermore, when the speaker unit 109 is miniaturized, more space for placing a larger capacity battery can be freed up, so as to achieve higher endurance.

The surrounding area of the antenna unit 103 should generally be a clear area, and the antenna manufactured by the printing process is a printed circuit board antenna (Printed circuit board Antenna). The antenna body of the inverted-F antenna can be linear or sheet-shaped, and the size of the Bluetooth antenna can be reduced when insulating materials with a high dielectric constant are used, which can be used as a kind of on-board antenna, and the design cost of the inverted-F antenna is low. But it increases a certain volume, which is the most common one in practical applications.

The meander antenna is a deformation of the inverted-F antenna. Since the space is not long enough, it is bent to obtain a higher length, which is generally slightly longer than a quarter wavelength, and its length is determined by its geometric topology space and application area. The meander type antenna is generally a printed circuit board package, that is, an on-board antenna. Like the inverted F type, the antenna is generally placed on the top layer of the device, and the surrounding area should be a clear area.

The planar antenna is also an inverted-F structure. In principle, a plane is connected to a ground plane feed point, which is composed of a radio frequency circuit feed point, and is usually used in mobile phones.

Ceramic Antenna includes a block ceramic antenna, which uses high temperature to sinter the entire ceramic body at one time and then prints the metal part of the antenna on the surface of the ceramic block. It can also be a multi-layer ceramic antenna. The multi-layer ceramics are laminated and aligned by low-temperature co-firing and then sintered at high temperature. Therefore, the metal conductor of the antenna can be printed on each ceramic dielectric layer according to the design requirements, which can effectively reduce the size of the antenna. Antenna size, and can achieve the purpose of hiding the antenna. Since the dielectric constant of ceramic itself is higher than that of printed circuit boards, the use of ceramic antennas can effectively reduce the size of the antenna.

According to the embodiment of the Bluetooth communication module 101 , after integrating the speaker unit 109 , the communication module can have complete signal transceiving and speaker functions, and only needs to provide radio signal and external power supply to operate. According to an embodiment, the antenna suitable for the Bluetooth communication module 101 can be a dipole antenna, a monopole antenna, a printed circuit board antenna, a micro ceramic antenna, or the like.

FIG. 2 shows a schematic diagram of an embodiment of an integrated circuit of a loudspeaker. This example shows a vertically integrated integrated loudspeaker device in which various circuit elements and chips are vertically stacked on a substrate by a stack die technique. Above, the shell 20 can be covered with colloid or a molded shell, and the antenna 213 can be formed externally by a printing process. The material is mainly made of materials that do not shield the magnetic field, and a sound hole 211 is formed on the casing 20 to allow sound waves to enter and exit.

This example shows that the casing 20 is provided with a base material 201, which can be an electrical connection board, through which the wireless communication circuit, the microphone unit and the speaker unit can be electrically connected to the sound effect circuit, so as to electrically connect each circuit element , other stacked elements include a microphone unit 203, a communication circuit (such as a Bluetooth communication circuit 205) that provides wireless communication functions, a sound effect circuit 207 for processing audio, and a speaker unit 209 with a single unit and a magnetic element, that is, through the electrical connection board The wireless communication circuit, the microphone unit 203 and the speaker unit 209 are electrically connected to the sound effect circuit 207 .

The integrated loudspeaker device in the form of vertical integration is a vertically integrated device at the wafer level, each circuit element is formed in one or multi-layer structure, and the overall volume is reduced. According to an embodiment, referring to the schematic diagram of the embodiment shown in FIG. 3 , the circuit elements in each vertically integrated speaker device are provided with a multi-layer circuit structure, for example, multiple layers of metal, polysilicon (poly) are formed on the substrate 301 Microphone unit 303 made of insulating layer, sound effect circuit 307 made of multilayer metal, polysilicon and insulating layer, Bluetooth communication circuit 305 made of multilayer metal, polysilicon and insulating layer, and speaker unit 309 made of multilayer metal, polysilicon and insulating layer , and other elements include multiple layers of electrical connection layers connecting various circuit elements and an antenna 311 . The upper and lower order of the circuit elements is not limited to the embodiment shown in the figure, but is mainly stacked in a manner that does not affect the performance of each other.

Compared with the planar integrated circuit shown in FIG. 4 , in which the modules are electrically connected through the circuit substrate, the electrical connection between the circuit elements in the integrated speaker device in the form of vertical integration can be performed by connecting each layer by wire bonding, Each layer is designed with an electrical contact (pad), which forms an electrical connection structure when superimposed, or forms an electrical connection through a via (via) between the layers.

FIG. 4 shows a schematic diagram of an embodiment of an integrated loudspeaker device in a planar integrated form.

It shows a flat-integrated loudspeaker device, in which a wireless communication circuit, an antenna, a sound effect circuit, a microphone circuit and a speaker are integrated, and each circuit element is arranged on a circuit plane in a plane-integrated manner. The embodiment is a substrate ( The integrated speaker device 400 is formed on the electrical connection board 40 , which includes a Bluetooth communication circuit 405 , an antenna 411 , a sound effect circuit 407 , a microphone unit 403 and a speaker unit 409 that are electrically connected to each other. Integrating the required circuits on the same plane can greatly reduce its thickness, and all parts are made separately. One of the embodiments is that they can be soldered on the same electrical connection board. The planar integrated circuit is an integration technology in which the plane is integrated into a system in a single package (SiP). In an embodiment, a surface mount technology (SMT) can be used to combine a plurality of circuit elements on a substrate. The thickness can be greatly reduced, all parts are made separately, and each circuit element is soldered on the electrical connection board. In another embodiment, the planar integrated circuit can also adopt a system on chip (SoC) technology, so that the above circuit units are integrated into an integrated circuit of a single chip.

Further, the Bluetooth communication circuit 405 can also be integrated with the sound effect circuit 407 in one chip, and is provided with an antenna 411. The form of the antenna 411 can be F-shaped, inverted F-shaped, meander-shaped, flat-shaped, or block-shaped. The speaker unit 109 can also be integrated with a Micro-electromechanical Systems (MEMS) microphone in a chip.

The above embodiments show a planar or vertically integrated loudspeaker device, wherein the embodiment can adopt a single micro-segment unit with multiple surrounding continuous metal segments as shown in FIG. 5 to FIG. The embodiment of the line segment element to make the magnetic element in the speaker unit, or the micro-segment element with a plurality of straight metal line segments as shown in FIG. 8 and FIG. 9 can be used, which can effectively reduce the volume of the speaker unit and combine it with other circuit elements. .

According to the embodiment disclosed in the disclosure, the magnetic element in the speaker unit adopts a micro-segment element (as shown in FIG. 5 , FIG. 7 to FIG. 9 ), an array type micro-segment element formed by a plurality of micro-segment elements (as shown in FIG. 6 ) , and a device in which a magnetic element is realized by combining a single micro-segment element and an arrayed micro-segment element.

The basic structure of a single micro-segment element is shown in the embodiment diagram shown in Figure 5 or 7. The micro-segment element can be formed by a plating or metallization process, or a photomask and an etching process to form multiple continuous segments on a substrate (such as an insulator). A metal line segment is formed, and electrical contacts are formed at both ends of the metal line segment. The first electrode 51 at one end can be the negative electrode of the micro segment element, and the second electrode 52 at the other end can be the positive electrode of the micro segment element.

After the micro-segment element is connected to the power supply and energized, the stable current flowing through it can form a uniform magnetic field on the micro-segment element. The material, line width, length, number of turns, etc. of the metal wire forming the micro-segment unit 50 all determine the overall The parameters of the impedance value of the micro-segment element, so when designing this micro-segment element, it is necessary to know the impedance and the magnetic field conditions to be formed.

According to the main implementation of the micro-segment device proposed in the disclosure, multiple breakpoints are formed on the metal lines on the micro-segment device as required, as shown in FIG.

The figure shows a micro-segment element 50 with multiple segments surrounding continuous metal segments. The main structure includes a wiring layer as shown in the figure and an electrode layer. The wiring layer is provided with multiple segments starting from a starting point and forming multiple circles around the starting point. The metal line segments (501, 502, . . . , 510 ) for continuous wiring can be set at any position of the micro-segment element, preferably close to the central area of the micro-segment element, but not limited to this. , the starting position can be determined according to actual needs. This starting position forms the first electrode 51 , for example, the negative electrode of the micro-segment element, and the end position of the metal segment, that is, the end of the metal segment of the multi-segment continuous wiring, is the second electrode 52 of the micro-segment element, which can be the micro-segment element. the positive pole.

Each metal line segment in the multi-segment metal line segments (501, 502, ..., 510) has two end points, one of which is the first electrode end, such as one end of the first electrode 51 formed closer to the starting point; the other end is the second electrode end, and is the end point closer to the end of the metal line segment.

According to the structural features of the wiring layer in the micro-segment element shown in Figure 5, it can be seen that the design of the proposed micro-segment element can determine the total length, line width, A distance between adjacent metal line segments, a length of each metal line segment, the number of turns, a turn distance, and/or the material of the metal line segments, etc. The actual requirement is mainly the requirement of the applied micro-segment element. According to this requirement, a single micro-segment element or an embodiment of forming an array of micro-segment element as shown in FIG. 6 can also be determined.

6 shows an arrayed micro-segment element 60 composed of a plurality of micro-segment elements 50 arranged in an array. The illustrated shape of the arrayed micro-segment element 60 and the number of the micro-segment elements are not intended to limit its implementation range.

Similarly, the single micro-segment element 50 in the figure still has the wiring layer described in the above-mentioned embodiment, wherein there are multiple metal segments starting from a starting point and forming multiple circles of continuous wiring around the starting position, and an electrode layer, wherein There are at least one first electrode area and at least one second electrode area that respectively gather the first electrode end and the second electrode end of each metal line segment. According to actual needs and designs, there can be one or more first electrode areas and second electrode areas. electrode area. It is worth mentioning that the first electrode area and the second electrode area that gather the first electrode end and the second electrode end of each metal line segment can realize the function of gathering each electrode end through the electrical connection layer in another element. For example, here In the electrical connection layer, a plurality of metal wires can be used to guide the first electrode end of each metal wire segment on the wiring layer to the first electrode region of the electrode layer through vias or wires on the base material, and also connect each metal wire segment to the first electrode region of the electrode layer. The second electrode end of the metal line segment is led to the second electrode region of the electrode layer.

In addition to the above embodiments, the array-type micro-segment element may be provided with a plurality of micro-segment elements of different shapes or sizes according to actual requirements (eg, magnetic field requirements).

FIG. 7 shows a schematic diagram of an embodiment of a single micro-segment device 70 with multiple metal segments surrounding a continuous metal segment. The multiple metal segments in the micro-coil device 70 encircle a starting point. This example is shown as a concentric circle, wherein the starting points of the multiple metal segments are formed. The first electrode, and the end forms the second electrode.

When designing the micro-segment element or the array-type micro-segment element, the size and shape of each micro-segment element can be customized according to the product, and because of the miniature and multi-segment design, it is more flexible to follow the impedance value , magnetic field, product size and shape and other requirements determine the total length, line width, line spacing between adjacent metal line segments, length of each metal line segment, number of turns, turn distance and/ Or even the material of the metal segments, the pitch of adjacent micro segment elements and/or the number of all micro segment elements can also be considered.

Since each single micro-segment element shown in Figure 5, Figure 6 and Figure 7 (but not limited to) will form a magnetic field formed by an equivalent multi-turn coil after being energized, the magnetic field strength can be determined according to the passing current, but The edge of a single micro-segment element may have a large magnetic field change. Generally, the intensity of the middle is the largest and the edge is weaker. If a large and uniform magnetic field is to be generated, multiple micro-segment elements can be used, and the overall generated uniform magnetic field The magnetic field can eliminate the weak non-uniform magnetic field at the edges of individual micro-segment elements, and a plurality of micro-segment elements are uniformized as a whole to form an equivalent magnetic field covering a wide range after being energized.

In addition to the above-mentioned embodiment describing a micro-segment element with multiple surrounding continuous metal line segments, FIGS. 8 and 9 show an embodiment of a linear micro-segment element that can be applied to the magnetic element used in the speaker unit in the integrated circuit described in the above-mentioned embodiment. .

FIG. 8 shows a micro-segment device 80 having a plurality of linear metal segments 801, 803 and 805 formed on a substrate 800. The substrate may be an insulator, preferably a semiconductor silicon substrate, and may also be glass. , sapphire, laser direct structuring (LDS) plastic, germanium wafer (Ge), gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC) or zinc selenide (ZnSe) ) is made of materials, of which the laser direct structuring (LDS) material is a modified plastic containing organometallic composites, which can release metal particles from the organometallic composites after being irradiated by a laser. In this example, the micro-segment element 80 is composed of a plurality of line-segment units with a distance from each other (three are shown in this example), and each line-segment unit is composed of a plurality of linear metal line segments 801, 803 and 805. The starting positions of the metal line segments It is composed of several conducting holes 81, 82, 83, 84, 85 and 86 at the end position. The conducting holes 81, 82, 83, 84, 85 and 86 are used to electrically connect the positive and negative electrodes of the power supply in the integrated circuit. For example, the starting position of each metal line segment forms the first electrode of the micro-segment element 80 and the ending position of each metal line segment forms the second electrode of the micro-segment element 80, and the described design allows electric current to pass through these linear metal line segments 801, 803 and 805, in addition to the magnetic field formed by the current itself, also interact with an external magnetic field (such as a fixed magnetic field formed by the magnet N and the S pole). Can be used to drive the diaphragm in the speaker unit, thus producing sound.

When designing multiple linear metal line segments 801 , 803 and 805 that are parallel and have the same direction, for example, a semiconductor process (such as lithography and etching) can be used to form metal line segments with maximized length in the limited area of the substrate 800 with the same direction. , and the line segment gap 807 between adjacent metal line segments can be minimized, so that the metal line segments 801, 803 and 805 forming the magnetic field have the largest area and can withstand higher current.

FIG. 9 shows another embodiment of a micro-segment element with a plurality of linear metal line segments. The figure shows that a micro-segment element 90 is formed on a substrate 900, which includes a plurality of parallel metal line segments 901 with small spacing. The semiconductor process can make the adjacent metal line segments 901 have a minimized line segment gap 903 . Similarly, the starting positions of a plurality of metal line segments form the first electrodes of the micro-line segment element 90 , and the end positions of each metal line segment form the micro-line segment element 90 . The second electrode is electrically connected to the power supply in the integrated circuit through a plurality of conductive holes 91, 92, 93, 94, 95 and 96 respectively, so that the current passing through the metal line segment 901 can interact with the external magnetic field through the current that repeatedly changes direction A force acts to drive the micro-segment element 90 in a particular direction.

The design of the micro-segment element 80 or the micro-segment element 90 described in the above embodiments can determine the total length, line width, line spacing between adjacent metal line segments, and length of each metal line segment according to impedance value, magnetic field or size requirements. and/or the material of the metal wire segment.

To sum up, the disclosure proposes an integrated speaker circuit, in which a planar or vertical chip-level integrated speaker device can be realized, and a wireless communication circuit, an audio circuit, an audio circuit, a wireless communication circuit, an audio circuit, a Microphone and speaker, or vertically integrating the circuit on the substrate by stacking chip technology, can enable a single device to have the function of receiving and transmitting signals, and effectively reduce the overall volume to achieve the goal of miniaturization. In addition to overcoming the problem of space, Tencent The space out can expand other components, such as putting in larger capacity batteries.

The contents disclosed above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Integrated speakers 101: Bluetooth communication module 103: Antenna unit 105: Sound effect unit 107: Microphone unit 109: Speaker unit 20: Shell 201: Substrate 203: Microphone unit 205: Bluetooth communication circuit 207: Audio circuit 209: Speaker unit 211: Sound hole 213: Antenna 301: Substrate 303: Microphone unit 305: Bluetooth communication circuit 307: Audio circuit 309: Speaker unit 311: Antenna 40: Electrical connection board 400: Integrated speaker unit 411: Antenna 403: Microphone unit 405: Bluetooth communication circuit 407: Audio circuit 409: Speaker unit 50: Micro segment element 51: The first electrode 52: Second electrode 501, 502, 503, 504, 505, 506, 507, 508, 509, 510: Metal segments 60: Arrayed micro-segment element 70: Micro segment element 80: Micro segment element 800: Substrate 801, 803, 805: Metal Wire Segments 81, 82, 83, 84, 85, 86: Pilot holes 807: Segment Gap 90: Micro Segment Components 900: Substrate 901: Metal segment 903: segment gap 91, 92, 93, 94, 95, 96: Pilot Holes

FIG. 1 shows a schematic diagram of a design concept of an integrated circuit of a loudspeaker;

FIG. 2 shows a schematic diagram of an integrated circuit embodiment of a speaker;

FIG. 3 shows a schematic diagram of the second embodiment of the integrated circuit of the speaker;

FIG. 4 shows a schematic diagram of the third embodiment of the integrated circuit of the speaker;

5 shows a schematic diagram of an embodiment of a magnetic element used in a speaker unit in an integrated circuit;

6 shows a schematic diagram of the second embodiment of the magnetic element used in the speaker unit in the integrated circuit;

FIG. 7 shows a schematic diagram of the third embodiment of the magnetic element used in the speaker unit in the integrated circuit;

FIG. 8 shows a schematic diagram of the fourth embodiment of the magnetic element used in the speaker unit in the integrated circuit; and

Fig. 9 is a schematic diagram of the fifth embodiment of the magnetic element used in the speaker unit in the circuit of type 9.

10: Integrated speakers

101: Bluetooth communication module

103: Antenna unit

105: Sound effect unit

107: Microphone unit

109: Speaker unit

Claims (10)

An integrated circuit of a loudspeaker, comprising: a wireless communication circuit integrating an antenna unit for receiving audio provided by an external device; a sound effect unit electrically connected to the wireless communication circuit, wherein the sound effect unit is an audio processing circuit; a speaker unit, electrically connected to the sound effect unit, for playing the audio processed by the sound effect unit, wherein a magnetic element in the speaker unit is a micro-segment element or formed by a plurality of micro-segment elements an array of micro-segment elements; Wherein the wireless communication circuit, the speaker unit and the sound effect unit are integrated on a substrate in a horizontal or vertical structure to realize an integrated speaker device. The integrated circuit of the speaker according to claim 1, wherein the antenna unit is a printed circuit board antenna fabricated by a printing process, and the antenna type is F type, inverted F type, meander type, flat type, block type or multilayer ceramic antennas. The integrated circuit of a speaker according to claim 1, further comprising a microphone unit for inputting the received audio to the sound effect unit. The integrated circuit of a loudspeaker as claimed in claim 1, wherein the single micro-segment element comprises: a wiring layer provided with a plurality of metal line segments, and two ends of each metal line segment are a first electrode terminal and a second electrode terminal; and an electrode layer provided with at least one first electrode region and at least one second electrode region, the at least one first electrode region is used for collecting the first electrode end of each metal line segment in the plurality of metal line segments, and the at least one first electrode region The two electrode regions are used for collecting the second electrode ends of each metal line segment of the plurality of metal line segments. The integrated circuit of a loudspeaker as claimed in claim 4, wherein the micro-segment element is a micro-segment element having a plurality of surrounding continuous metal segments, wherein there is a starting point, and the starting point forms the first electrode of the micro-segment element , the surrounding continuous metal line segment forms a concentric circle or a concentric polygon surrounding the starting point, wherein a total length, a line width, and a distance between adjacent metal line segments of the multiple surrounding continuous metal line segments are determined according to impedance value, magnetic field or size requirements A line pitch, a length of each metal wire segment, a number of turns, a turn distance and/or the material of the metal wire segment. The integrated circuit of a speaker according to claim 4, wherein the micro-segment element is a micro-segment element having a plurality of linear metal segments, wherein the initial position of each metal segment forms the first electrode of the micro-segment element, The end position of each metal line segment forms the second electrode of the micro-line segment element, wherein a total length, line width, line spacing between adjacent metal line segments of the plurality of linear metal line segments are determined according to impedance value, magnetic field or size requirements, A length of each metal wire segment and/or the material of the metal wire segment. The integrated circuit of a speaker according to claim 1, wherein the integrated speaker device realizes a small speaker device, the wireless communication circuit adopts a Bluetooth communication module, and at the same time integrates the antenna unit on a printed circuit board superior. The integrated loudspeaker circuit of any one of claims 1 to 7, wherein the integrated loudspeaker device is a vertically integrated integrated loudspeaker device, wherein the wireless communication circuit, the loudspeaker unit and the The sound unit is vertically stacked on the substrate using a stacked chip technique. The integrated circuit of a loudspeaker according to claim 8, wherein in the vertically integrated integrated loudspeaker device, each circuit element is electrically connected to each other by connecting each layer by wire bonding, and each layer is designed with electrical contacts so as to overlap each other. At the same time, an electrical connection structure is formed, or an electrical connection is formed by a via hole between each layer. The integrated speaker circuit of any one of claims 1 to 7, wherein the integrated speaker device is a horizontally integrated integrated speaker device, wherein the wireless communication circuit, the speaker unit and the The sound effect unit is provided with each circuit element on the substrate in a planar integration manner, and the integrated speaker device in the horizontal form is made by a system-in-package or a system-in-chip integration technology, or is combined with a surface mount technology The wireless communication circuit, the speaker unit and the sound effect unit are on the substrate.

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