TWM624092U - Fully automatic packaging system - Google Patents
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本創作公開一種全自動包裝系統,能用來分類並包裝多個電路板,全自動包裝系統包括一自動分類機、一密著包裝機以及一真空包裝機。自動分類機包含一第一分類設備、間隔地設置於第一分類設備的一第二分類設備及電性耦接於第一分類設備及第二分類設備的一資訊處理器。密著包裝機包含一封膜設備及間隔地設置於封膜設備的一切割設備。真空包裝機包含一供袋設備、位置對應於供袋設備的一裝袋設備及間隔地設置於裝袋設備的一封袋設備。自動分類機能用來轉移、辨識並分類多個電路板,密著包裝機能用來將一膠膜設置於多個電路板。The present invention discloses a fully automatic packaging system, which can be used to classify and package a plurality of circuit boards. The fully automatic packaging system includes an automatic sorting machine, a close-fitting packaging machine and a vacuum packaging machine. The automatic sorting machine includes a first sorting device, a second sorting device arranged at intervals in the first sorting device, and an information processor electrically coupled to the first sorting device and the second sorting device. The airtight packaging machine includes a film sealing device and a cutting device arranged at intervals in the sealing film device. The vacuum packaging machine includes a bag feeding device, a bag filling device positioned corresponding to the bag feeding device, and a bag sealing device arranged at intervals in the bag filling device. The automatic sorting machine can be used to transfer, identify and sort a plurality of circuit boards, and the adhesive packaging machine can be used to place a film on a plurality of circuit boards.
Description
本創作涉及一種包裝系統,特別是涉及一種全自動包裝系統。This creation relates to a packaging system, especially a fully automatic packaging system.
現有的電路板通常使用人工進行包裝,然而上述人工包裝的方法不僅耗時費力且容易發生包裝錯誤。此外,在人工包裝的過程中往往更加容易由於操作失誤而使電路板發生損傷或損毀,進而增加電路板產生二次缺陷的風險。Existing circuit boards are usually packaged manually. However, the above manual packaging method is not only time-consuming and labor-intensive, but also prone to packaging errors. In addition, it is often easier to damage or destroy the circuit board due to operational errors during the manual packaging process, thereby increasing the risk of secondary defects of the circuit board.
故,如何通過機械取代人力,來提升電路板的包裝效率並降低電路板產生二次缺陷的風險,已成為該項事業所欲解決的重要課題之一。Therefore, how to improve the packaging efficiency of circuit boards and reduce the risk of secondary defects of circuit boards by replacing manpower with machinery has become one of the important issues to be solved by this business.
本創作實施例針對現有技術的不足提供一種全自動包裝系統,其能有效地改善現有包裝系統所可能產生的缺陷。Aiming at the deficiencies of the prior art, the present creative embodiment provides a fully automatic packaging system, which can effectively improve the possible defects of the existing packaging system.
本創作實施例公開一種全自動包裝系統,能用來分類並包裝多個電路板,並且多個所述電路板分別形成有至少一個二維碼,所述全自動包裝系統包括:一自動分類機,包含一第一分類設備、間隔地設置於所述第一分類設備的一第二分類設備及電性耦接於所述第一分類設備及所述第二分類設備的一資訊處理器;其中,所述自動分類機能用來轉移、辨識並分類多個所述電路板;一密著包裝機,間隔地設置於所述自動分類機,並且所述密著包裝機包含一封膜設備及間隔地設置於所述封膜設備的一切割設備;其中,所述封膜設備能用來將一膠膜設置於多個所述電路板,並且所述切割設備能用來間隔地同時沿多個所述電路板的相互呈平行的兩個側邊切割多餘的所述膠膜;以及一真空包裝機,間隔地設置於所述密著包裝機,並且所述真空包裝機包含一供袋設備、位置對應於所述供袋設備的一裝袋設備及間隔地設置於所述裝袋設備的一封袋設備;其中,所述供袋設備能用來將一包裝袋移動至所述裝袋設備上,並且所述裝袋設備能用來將切割完多餘的所述膠膜的多個所述電路板推入所述包裝袋中,而所述封袋設備能用來對所述包裝袋抽真空並封閉所述包裝袋的一裝袋口。The embodiment of the present invention discloses a fully automatic packaging system, which can be used to classify and package a plurality of circuit boards, and at least one two-dimensional code is respectively formed on the plurality of circuit boards. The fully automatic packaging system includes: an automatic sorting machine , comprising a first classification device, a second classification device disposed at intervals in the first classification device, and an information processor electrically coupled to the first classification device and the second classification device; wherein , the automatic sorting machine can be used to transfer, identify and sort a plurality of the circuit boards; an adhesive packaging machine is arranged on the automatic sorting machine at intervals, and the adhesive packaging machine includes a film device and a spacer A cutting device disposed in the film sealing device; wherein, the film sealing device can be used to set a film on a plurality of the circuit boards, and the cutting device can be used to simultaneously cut a plurality of circuit boards at intervals. The two sides of the circuit board are parallel to each other to cut the redundant adhesive film; and a vacuum packaging machine is arranged at intervals in the adhesive packaging machine, and the vacuum packaging machine includes a bag supply device, A bagging device located at a position corresponding to the bagging device and a bagging device spaced apart from the bagging device; wherein the bagging device can be used to move a package to the bagging device and the bagging device can be used to push a plurality of the circuit boards after cutting the excess adhesive film into the packaging bag, and the bag sealing device can be used to pump the packaging bag The one-pack mouth of the package is vacuumed and closed.
本創作的其中一有益效果在於,本創作所提供的所述全自動包裝系統,其能通過“所述自動分類機能用來轉移、辨識並分類多個所述電路板”、“所述封膜設備能用來將所述膠膜設置於多個所述電路板,並且所述切割設備能用來間隔地同時沿多個所述電路板的相互呈平行的兩個側邊切割多餘的所述膠膜”以及“所述供袋設備能用來將所述包裝袋移動至所述裝袋設備上,並且所述裝袋設備能用來將切割完多餘的所述膠膜的多個所述電路板推入所述包裝袋中,而所述封袋設備能用來對所述包裝袋抽真空並封閉所述包裝袋的所述裝袋口”的技術方案,提升多個所述電路板的包裝效率並降低多個所述電路板產生二次缺陷的風險。One of the beneficial effects of the present invention is that the fully automatic packaging system provided by the present invention can pass through “the automatic sorting machine can be used to transfer, identify and sort a plurality of the circuit boards”, “the sealing film” The device can be used to apply the adhesive film to a plurality of the circuit boards, and the cutting device can be used to cut the excess said film" and "the bag feeding device can be used to move the packaging bag onto the bagging device, and the bagging device can be used to cut a plurality of the excess adhesive film. The circuit board is pushed into the packaging bag, and the bag sealing device can be used to vacuum the packaging bag and close the bag opening of the packaging bag" technical solution, lifting a plurality of the circuit boards improve packaging efficiency and reduce the risk of secondary defects for multiple said circuit boards.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, however, the provided drawings are only for reference and description, and are not intended to limit this creation.
以下是通過特定的具體實施例來說明本創作所公開有關“全自動包裝系統”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。此外,以下如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,所述及的相關內容大部份出現於該特定圖式中,但不限制該後續說明中僅可參考所述特定圖式。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。The following are specific specific examples to illustrate the implementation of the "automatic packaging system" disclosed in the present creation, and those skilled in the art can understand the advantages and effects of the present creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. In addition, if it is indicated below to refer to a specific figure or as shown in a specific figure, it is only used for emphasis in the subsequent description, and most of the relevant content mentioned appears in the specific figure, but not Reference in this subsequent description is limited to the specific drawings. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.
請參閱圖1至圖12所示,其為本創作的實施例,需先說明的是,本實施例所對應到的附圖及其所提及的相關數量與外形,僅用來具體地說明本創作的實施方式,以便於了解本創作的內容,而非用來侷限本創作的保護範圍。Please refer to FIG. 1 to FIG. 12 , which are embodiments of the creation. It should be noted that the drawings corresponding to this embodiment and the related quantities and shapes mentioned in this embodiment are only used for specific description. The implementation of this creation is to facilitate the understanding of the content of this creation, rather than to limit the protection scope of this creation.
如圖1所示,本創作第一實施例提供一種全自動包裝系統100,能用來分類並包裝多個電路板200。進一步地說,如圖1及圖3所示,所述全自動包裝系統100能用來區分多個所述電路板200及設置於多個所述電路板200(Printed circuit board,PCB)之間的多個隔離紙300,並將區分完畢的多個所述電路板200進行包裝。As shown in FIG. 1 , the first embodiment of the present invention provides a fully
需要說明的是,於本實施例中,多個所述電路板200相互重疊地設置,並且多個所述電路板200上分別形成有至少一個二維碼,而每個所述電路板200較佳為多層電路板(Multi-Layer PCB),但本創作不限於此。舉例來說,於本創作未繪示的其他實施例中,每個所述電路板200也可以為單面電路板(Single-Layer PCB)或雙面電路板(Double-Layer PCB)。It should be noted that, in this embodiment, a plurality of the
如圖1所示,所述全自動包裝系統100包括一自動分類機1、一密著包裝機2、一真空包裝機3以及一回收機4,所述自動分類機1間隔地設置於所述密著包裝機2,並且所述真空包裝機3間隔地設置於所述密著包裝機2,而所述回收機4位於所述自動分類機1以及所述密著包裝機2的共同側。其中,所述自動分類機1能用來轉移、辨識並分類多個所述電路板200。As shown in FIG. 1 , the fully
以下為更進一步幫助理解上述各機台的結構,於此將依序介紹所述自動分類機1、所述密著包裝機2、所述回收機4以及所述真空包裝機3,並適時地說明上述各機台之間的相對位置關係及作動關係。The following is a further help to understand the structure of the above machines. Here, the
如圖1及圖2所示,所述自動分類機1包含一第一分類設備11、一第二分類設備12、一資訊處理器13以及一供給設備14,所述第一分類設備11間隔地設置於所述第二分類設備12,所述資訊處理器13電性耦接於所述第一分類設備11及所述第二分類設備12,所述供給設備14間隔地設置於所述第二分類設備12。As shown in FIGS. 1 and 2 , the
需要說明的是,為更進一步幫助理解上述各設備之間的相對位置關係,於此將先依序介紹所述第一分類設備11、所述第二分類設備12、所述資訊處理器13及所述供給設備14,並適時地說明上述各設備之間的相對位置關係及作動關係。It should be noted that, in order to further help understand the relative positional relationship between the above-mentioned devices, the
如圖1所示,所述第一分類設備11包含一第一分類手臂111、一第一輸送裝置112及一掃描裝置113,並且所述第一輸送裝置112間隔地設置於所述第一分類手臂111,而所述掃描裝置113間隔地設置於所述第一輸送裝置112。其中,所述第一輸送裝置112為一滾輪輸送帶,並且所述掃描裝置113橫跨於所述第一輸送裝置112。As shown in FIG. 1 , the
需要說明的是,如圖1至圖3所示,所述第一分類手臂111能用來轉移多個所述電路板200,所述第一輸送裝置112能用來接收並輸送所述第一分類手臂111轉移的多個所述電路板200,而所述掃描裝置113能用來掃描位於所述第一輸送裝置112上的多個所述電路板200的多個所述二維碼,並對應輸出多個目標資訊1131或多個非目標資訊1132。It should be noted that, as shown in FIGS. 1 to 3 , the
具體來說,如圖3所示,所述第一分類手臂111包含彼此間隔地設置的兩個吸盤組1111,並且兩個所述吸盤組1111分別能用來吸取並放置多個所述電路板200及多個所述隔離紙300。其中,當所述第一分類手臂111運作時,兩個所述吸盤組1111將同時被移動。Specifically, as shown in FIG. 3 , the
所述第一分類設備11介紹至此,以下將開始介紹所述第二分類設備12。如圖1所示,所述第二分類設備12包含一第二分類手臂121及一第二輸送裝置122,並且所述第二分類手臂121位置鄰近於所述第一輸送裝置112,而所述第二輸送裝置122間隔地設置於所述第二分類手臂121。其中,所述第二分類手臂121為一四軸機械手臂,並且如圖1及圖4所示,所述第二輸送裝置122包含有一限制框台1221及位置鄰近於所述限制框台1221的一輸送帶1222。The
所述第二分類設備12介紹至此,以下將開始介紹所述資訊處理器13。如圖1及圖2所示,所述資訊處理器13電性耦接於所述掃描裝置113以及所述第二分類手臂121,並且所述資訊處理器13能用來接收多個所述目標資訊1131並對應輸出多個主分類資訊131控制所述第二分類手臂121,將位於所述第一輸送裝置112上且對應於多個所述目標資訊1131的多個所述電路板200搬運至所述第二輸送裝置122的所述限制框台1221。The
此外,所述資訊處理器13也能用來接收多個所述非目標資訊1132並對應輸出多個次分類資訊132以控制所述第二分類手臂121,將位於所述第一輸送裝置112上且對應於多個所述非目標資訊1132的多個所述電路板200搬運至他處儲存。In addition, the
承上所述,當檢測人員於後端發現部分所述電路板200於製作時有瑕疵卻來不及挑出時,檢測人員能對應有瑕疵的所述電路板200的所述二維碼,利用所述資訊處理器13及所述第二分類手臂121將有瑕疵的所述電路板200挑出,以避免後續的錯誤包裝,有效節省後續包裝製程的費用。Continuing from the above, when the inspector finds at the back end that some of the
所述資訊處理器13介紹至此,以下將開始介紹所述供給設備14。如圖1及圖4所示,所述供給設備14間隔地設置於所述第二分類設備12的所述第二輸送裝置122,並且所述供給設備14包含相互鄰近設置的一乾燥劑供給裝置141、一濕度卡供給裝置142及一供給手臂143。The
進一步地說,所述供給手臂143包含一夾取器1431及鄰近設置於所述夾取器1431的一吸取器1432,所述夾取器1431能用來自所述乾燥劑供給裝置141夾取一乾燥劑1411並將其放置於所述第二輸送裝置122上的多個所述電路板200旁,而所述吸取器1432能用來自所述濕度卡供給裝置142吸取一濕度卡1421並將其放置於所述第二輸送裝置122上的多個所述電路板200上。其中,於本實施例中,每個所述乾燥劑1411較佳為矽膠乾燥劑,並且每個所述濕度卡421較佳為六點式濕度卡,但本創作不限於此。Further, the
所述自動分類機1介紹至此,以下將開始介紹所述密著包裝機2。如圖1所示,所述密著包裝機2包含一封膜設備21及間隔地設置於所述封膜設備21的一切割設備22。其中,如圖5至圖8所示,所述封膜設備21能用來將一膠膜400設置於多個所述電路板200,並且所述切割設備22能用來間隔地同時沿多個所述電路板200的相互呈平行的兩個側邊切割多餘的所述膠膜400。The
以下為方便理解與說明,將依序說明所述封膜設備21及所述切割設備22。如圖5及圖6所示,所述封膜設備21包含一封膜裝置211及間隔地設置於所述封膜裝置211的一輸送帶212,並且所述輸送帶212於本實施例中位於所述封膜裝置211下方,而所述輸送帶212能用來承載自所述自動分類機1轉移的多個所述電路板200。For the convenience of understanding and description below, the
具體來說,所述封膜裝置211包含一封膜機構2111及安裝於所述封膜機構2111的兩個升降機構2112,兩個所述升降機構2112能用來使所述封膜機構2111相對於所述輸送帶212上的多個所述電路板200移動,而所述封膜機構2111能用來對所述膠膜400加熱以使其軟化,而後配合所述升降機構2112使軟化的所述膠膜400接近並貼合設置於多個所述電路板200上,並在所述膠膜400設置完畢後將部分所述膠膜400與多個所述電路板200分離。Specifically, the
所述封膜設備21介紹至此,以下將開始介紹所述切割設備22。如圖7及圖8所示,所述切割設備22包含一限制框台221、一切割裝置222及兩個固定臂223,並且所述切割裝置222間隔地設置於所述限制框台221,兩個所述固定臂223位置鄰近於所述切割設備22的所述限制框台221的邊緣。The
進一步地說,所述切割裝置222包含彼此間隔地設置的兩個切割機構2221、安裝於兩個所述切割機構2221的一轉動機構2222及連接於所述轉動機構2222的一升降機構2223,並且兩個所述切割機構2221之間的距離不小於任一個所述電路板200的任一邊長。其中,所述切割設備22的所述限制框台221能用來接收並固定來自所述封膜設備21的所述輸送帶212輸送的多個所述電路板200,所述升降機構2223能用來使兩個所述切割機構2221相對於所述限制框台221上的多個所述電路板200移動,並且所述轉動機構2222能用來同時轉動兩個所述切割機構2221,而兩個所述切割機構2221能用來間隔地同時沿多個所述電路板200的相互呈平行的兩個所述側邊切割所述膠膜400。Further, the
需要說明的是,如圖7及圖8所示,兩個所述固定臂223分別位置鄰近於所述限制框台221的相鄰兩側,並且兩個所述固定臂223的兩個長度方向相互垂直,而每個所述固定臂223的一端包含有一緩衝墊2231。其中,兩個所述固定臂223能輪流用來固定多個所述電路板200,並且所述緩衝墊2231能用來避免傷害多個所述電路板200。It should be noted that, as shown in FIG. 7 and FIG. 8 , the two fixing
需要說明的是,如圖7及圖8所示,當所述切割設備22運作時,一個所述固定臂223固定多個所述電路板200,另一個所述固定臂223則移動至多個所述電路板200的一側以讓出空間,使兩個所述切割機構2221能跨設於固定多個所述電路板200的所述固定臂223,並沿固定多個所述電路板200的所述固定臂223的所述長度方向對所述膠膜400進行切割。It should be noted that, as shown in FIG. 7 and FIG. 8 , when the cutting
所述密著包裝機2介紹至此,以下將開始介紹所述回收機4。如圖1所示,所述回收機4包含彼此間隔地設置的兩個限制框台41、分別安裝於兩個所述限制框台41的兩個移動平台42、位於兩個所述限制框台41之間的一輸送帶43及間隔地設置於一個所述限制框台41的一回收手臂44。其中,所述回收機4的兩個所述限制框台41分別間隔地設置於所述第二輸送裝置122的所述限制框台1221及所述切割設備22的所述限制框台221。The
需要說明的是,所述回收機4的兩個所述限制框台41能用來回收或提供一運輸板500,並且兩個所述移動平台42分別能用來搬運所述運輸板500,而所述輸送帶43能用來將所述運輸板500自一個所述限制框台41輸送至另一個所述限制框台41。It should be noted that, the two confinement frames 41 of the
進一步地說,在所述第一分類設備11將多個所述電路板200設置於所述第二輸送裝置122的所述限制框台1221前,所述回收機4的其中一個所述限制框台41會先設置有一個所述運輸板500,並且對應上述限制框台41的一個所述移動平台42會將上述運輸板500移動至所述第二輸送裝置122的所述限制框台1221中,而後所述第一分類設備11才會將多個所述電路板200設置於所述第二輸送裝置122的所述限制框台1221上的所述運輸板500。Further, before the
承上所述,當多個所述電路板200自所述第二輸送裝置122輸送至所述密著包裝機2的所述封膜設備21及所述切割設備22時,多個所述電路板200下方皆設置有一個所述運輸板500。As mentioned above, when a plurality of the
當所述密著包裝機2對多個所述電路板200包裝並切割所述膠膜400完成後,位於所述切割設備22的所述限制框台221上的多個所述電路板200及所述運輸板500將被一個所述移動平台42移動至所述回收機4的一個所述限制框台41,而後如圖1及圖9所示,所述回收手臂44將移動多個所述電路板200至所述真空包裝機3,而所述運輸板500將被所述回收機4的所述輸送帶43自一個所述限制框台41運往另一個所述限制框台41。藉此,所述運輸板500回收完成。After the
所述回收機4介紹至此,以下將開始介紹所述真空包裝機3。如圖1所示,所述真空包裝機3包含一供袋設備31、一裝袋設備32及一封袋設備33,並且所述裝袋設備32位置對應於所述供袋設備31,而所述封袋設備33間隔地設置於所述裝袋設備32。The
需要說明的是,如圖1及圖10至圖12所示,所述供袋設備31能用來將一包裝袋600移動至所述裝袋設備32上,並且所述裝袋設備32能用來將切割完多餘的所述膠膜400的多個所述電路板200推入所述包裝袋600中,而所述封袋設備33能用來對所述包裝袋600抽真空並封閉所述包裝袋600的一裝袋口601。It should be noted that, as shown in FIG. 1 and FIG. 10 to FIG. 12 , the
具體來說,如圖10至圖12所示,所述裝袋設備32包含兩個承載平台321、一開袋手臂322、一推入手臂323及兩個撐袋裝置324,兩個所述承載平台321彼此間隔地設置,所述開袋手臂322間隔地設置於兩個所述承載平台321,並且所述推入手臂323間隔地設置於所述開袋手臂322,而兩個所述撐袋裝置324位於兩個所述承載平台321之間。Specifically, as shown in FIGS. 10 to 12 , the
需要說明的是,兩個所述承載平台321分別能用來接收並承載所述包裝袋600及設置有所述膠膜400的多個所述電路板200,並且所述開袋手臂322能用來打開所述包裝袋600並使其對應形成有所述裝袋口601,而所述推入手臂323能用來將設置有所述膠膜400的多個所述電路板200推入所述包裝袋600中。It should be noted that the two carrying
更詳細地說,兩個所述撐袋裝置324位置相互對應且彼此間隔地設置,而兩個所述撐袋裝置324分別包含一擴張板3241及設置於所述擴張板3241的一側的一移動板3242。其中,所述擴張板3241的長度方向垂直於一垂直方向P,並且兩個所述擴張板3241能用來放入所述裝袋口601,而兩個所述移動板3242能用來相互遠離,以擴大所述裝袋口601的開口面積。More specifically, the positions of the two bag-stretching
需要說明的是,為方便說明與理解,所述撐袋裝置324於圖10至圖12中僅繪示有一個,但實際上仍有兩個所述撐袋裝置324,為避免誤會,特此說明。It should be noted that, for the convenience of description and understanding, only one
[實施例的有益效果][Advantageous effects of the embodiment]
本創作的其中一有益效果在於,本創作所提供的所述全自動包裝系統100,其能通過“所述自動分類機1能用來轉移、辨識並分類多個所述電路板200”、“所述封膜設備21能用來將所述膠膜400設置於多個所述電路板200,並且所述切割設備22能用來間隔地同時沿多個所述電路板200的相互呈平行的兩個所述側邊切割多餘的所述膠膜400”以及“所述供袋設備31能用來將所述包裝袋600移動至所述裝袋設備32上,並且所述裝袋設備32能用來將切割完多餘的所述膠膜400的多個所述電路板200推入所述包裝袋600中,而所述封袋設備33能用來對所述包裝袋600抽真空並封閉所述包裝袋600的所述裝袋口601”的技術方案,提升多個所述電路板200的包裝效率並降低多個所述電路板200產生二次缺陷的風險。One of the beneficial effects of the present invention is that the fully
以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiment of this creation, and is not intended to limit the scope of the patent application of this creation. Therefore, any equivalent technical changes made by using the description and drawings of this creation are included in the application for this creation. within the scope of the patent.
100:全自動包裝系統 1:自動分類機 11:第一分類設備 111:第一分類手臂 1111:吸盤組 112:第一輸送裝置 113:掃描裝置 1131:目標資訊 1132:非目標資訊 12:第二分類設備 121:第二分類手臂 122:第二輸送裝置 1221:限制框台 1222:輸送帶 13:資訊處理器 131:主分類資訊 132:次分類資訊 14:供給設備 141:乾燥劑供給裝置 1411:乾燥劑 142:濕度卡供給裝置 1421:濕度卡 143:供給手臂 1431:夾取器 1432:吸取器 2:密著包裝機 21:封膜設備 211:封膜裝置 2111:封膜機構 2112:升降機構 212:輸送帶 22:切割設備 221:限制框台 222:切割裝置 2221:切割機構 2222:轉動機構 2223:升降機構 223:固定臂 2231:緩衝墊 3:真空包裝機 31:供袋設備 32:裝袋設備 321:承載平台 322:開袋手臂 323:推入手臂 324:撐袋裝置 3241:擴張板 3242:移動板 33:封袋設備 4:回收機 41:限制框台 42:移動平台 43:輸送帶 44:回收手臂 200:電路板 300:隔離紙 400:膠膜 500:運輸板 600:包裝袋 601:裝袋口 P:垂直方向 100: Fully automatic packaging system 1: Automatic sorting machine 11: The first classification equipment 111: The first classification arm 1111: Suction Cup Group 112: The first conveying device 113: Scanning device 1131: Target Information 1132: Non-target information 12: Second classification equipment 121: Second Category Arm 122: Second conveying device 1221: Limit frame 1222: Conveyor Belt 13: Information processor 131: Main Category Information 132: Sub-category information 14: Supply equipment 141: Desiccant supply device 1411: Desiccant 142: Humidity card supply device 1421: Humidity card 143: Supply Arm 1431: Gripper 1432: Extractor 2: Adhesive packaging machine 21: Film sealing equipment 211: Film sealing device 2111: Membrane sealing mechanism 2112: Lifting mechanism 212: Conveyor Belt 22: Cutting Equipment 221: Limit frame 222: Cutting device 2221: Cutting mechanism 2222: Turning mechanism 2223: Lifting mechanism 223: Fixed Arm 2231: Buffer 3: Vacuum packaging machine 31: Bag supply equipment 32: Bagging equipment 321: Bearing Platform 322: Open bag arm 323: Push Arm 324: Bag support device 3241: Expansion Plate 3242: Mobile Board 33: Bag sealing equipment 4: Recycling machine 41: Limit frame 42: Mobile Platforms 43: Conveyor belt 44: Recycle Arm 200: circuit board 300:Isolation paper 400: film 500: Shipping Plate 600: packing bag 601: bag mouth P: vertical direction
圖1為本創作實施例的全自動包裝系統的俯視示意圖。FIG. 1 is a schematic top view of a fully automatic packaging system according to an embodiment of the invention.
圖2為本創作實施例的資訊處理器、掃描裝置及第二分類設備的方塊示意圖。FIG. 2 is a schematic block diagram of an information processor, a scanning device, and a second classification device according to an embodiment of the invention.
圖3為本創作實施例的第一分類設備的側視示意圖。FIG. 3 is a schematic side view of a first classification device according to an embodiment of the present invention.
圖4為本創作實施例的供給設備的側視示意圖。FIG. 4 is a schematic side view of a supply device according to an embodiment of the present invention.
圖5為本創作實施例的封膜設備的動作示意圖(一)。FIG. 5 is a schematic diagram (1) of the action of the film sealing device according to the creative embodiment.
圖6為本創作實施例的封膜設備的動作示意圖(二)。FIG. 6 is a schematic diagram (2) of the action of the film sealing device according to the creative embodiment.
圖7為本創作實施例的切割設備的動作示意圖(一)。FIG. 7 is a schematic action diagram (1) of the cutting device according to the creative embodiment.
圖8為本創作實施例的切割設備的動作示意圖(二)。FIG. 8 is a schematic action diagram (2) of the cutting device according to the creative embodiment.
圖9為本創作實施例的回收機的側視示意圖。FIG. 9 is a schematic side view of a recycling machine according to an embodiment of the present invention.
圖10為本創作實施例的供袋設備及裝袋設備的動作示意圖(一)。FIG. 10 is a schematic action diagram (1) of the bag feeding device and the bag filling device according to the creative embodiment.
圖11為本創作實施例的供袋設備及裝袋設備的動作示意圖(二)。FIG. 11 is a schematic action diagram (2) of the bag feeding device and the bag filling device according to the creative embodiment.
圖12為本創作實施例的供袋設備及裝袋設備的動作示意圖(三)。FIG. 12 is a schematic action diagram (3) of the bag feeding device and the bag filling device according to the creative embodiment.
100:全自動包裝系統 100: Fully automatic packaging system
1:自動分類機 1: Automatic sorting machine
11:第一分類設備 11: The first classification equipment
111:第一分類手臂 111: The first classification arm
112:第一輸送裝置 112: The first conveying device
113:掃描裝置 113: Scanning device
12:第二分類設備 12: Second classification equipment
121:第二分類手臂 121: Second Category Arm
122:第二輸送裝置 122: Second conveying device
1221:限制框台 1221: Limit frame
1222:輸送帶 1222: Conveyor Belt
14:供給設備 14: Supply equipment
141:乾燥劑供給裝置 141: Desiccant supply device
142:濕度卡供給裝置 142: Humidity card supply device
143:供給手臂 143: Supply Arm
2:密著包裝機 2: Adhesive packaging machine
21:封膜設備 21: Film sealing equipment
22:切割設備 22: Cutting Equipment
221:限制框台 221: Limit frame
3:真空包裝機 3: Vacuum packaging machine
31:供袋設備 31: Bag supply equipment
32:裝袋設備 32: Bagging equipment
33:封袋設備 33: Bag sealing equipment
4:回收機 4: Recycling machine
41:限制框台 41: Limit frame
42:移動平台 42: Mobile Platforms
43:輸送帶 43: Conveyor belt
44:回收手臂 44: Recycle Arm
200:電路板 200: circuit board
500:運輸板 500: Shipping Plate
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW110212876U TWM624092U (en) | 2021-11-02 | 2021-11-02 | Fully automatic packaging system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW110212876U TWM624092U (en) | 2021-11-02 | 2021-11-02 | Fully automatic packaging system |
Publications (1)
Publication Number | Publication Date |
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TWM624092U true TWM624092U (en) | 2022-03-01 |
Family
ID=81747302
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Application Number | Title | Priority Date | Filing Date |
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TW110212876U TWM624092U (en) | 2021-11-02 | 2021-11-02 | Fully automatic packaging system |
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TW (1) | TWM624092U (en) |
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2021
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