TWM622919U - Far infrared ray heating pad control apparatus - Google Patents

Abstract

A far-infrared thermal pad control device is applied to a far-infrared thermal pad, the far-infrared thermal pad control device comprises a microprocessor, a far-infrared thermal pad heating circuit, a temperature sensor, a short circuit detection circuit and An open circuit detection circuit. The short-circuit detection circuit notifies the microprocessor to stop driving the far-infrared thermal pad heating circuit when detecting that the far-infrared thermal pad heating circuit or the temperature sensor is short-circuited, so as to ensure that the far-infrared thermal pad heating circuit is used. Safety; the open-circuit detection circuit notifies the microprocessor to stop driving the far-infrared heating pad heating circuit when it detects that the far-infrared heating pad heating circuit, the temperature sensor or the far-infrared heating pad is open-circuited, In order to ensure the safety of using this far-infrared thermal pad.

Description

Far infrared heating pad control device

This creation is about a control device, especially a far-infrared heating pad control device.

Far-infrared rays can penetrate deep into the skin and subcutaneous tissue of the human body, thereby promoting blood circulation. There are many products using far-infrared rays on the market, such as far-infrared thermal pads. The user can cover or wrap the sore or uncomfortable places on the body with the far-infrared heat compress to perform heat compress.

The disadvantage of the current far-infrared heating pad is that the safety of using the far-infrared heating pad is not high enough; when the associated heating circuit, temperature sensor or the heating pad itself of the far-infrared heating pad is short-circuited or open, it will affect the The safety of using far-infrared thermal pads needs to be dealt with and paid attention to.

In order to solve the above problems, the purpose of this creation is to provide a far-infrared thermal pad control device.

In order to achieve the above-mentioned purpose of the present creation, the far-infrared thermal pad control device of the present creation is applied to a far-infrared thermal pad, the far-infrared thermal pad control device is electrically connected to the far-infrared thermal pad, and the far-infrared thermal pad controls The device includes: a microprocessor; a far-infrared thermal pad heating circuit, the far-infrared thermal pad heating circuit is electrically connected to the microprocessor and the far-infrared thermal pad; a temperature sensor, the temperature sensor is electrically connected to the microprocessor; a short circuit detection circuit is electrically connected to the microprocessor, the far-infrared heating pad heating circuit and the temperature sensor; and an open circuit detection circuit a circuit, the open circuit detection circuit is electrically connected to the microprocessor, the far-infrared thermal pad heating circuit, the temperature sensor and the far-infrared thermal pad, wherein the short-circuit detection circuit is configured to detect When the far-infrared heating pad heating circuit is short-circuited, a heating circuit short-circuit signal is generated, and the heating circuit short-circuit signal is sent to the microprocessor; the short-circuit detection circuit is configured to generate when the temperature sensor is detected to be short-circuited a temperature sensor short circuit signal and transmit the temperature sensor short circuit signal to the microprocessor; the open circuit detection circuit is configured to generate a heating circuit open circuit signal when detecting that the far infrared heating pad heating circuit is open circuit and transmit the heating circuit open circuit signal to the microprocessor; the open circuit detection circuit is configured to generate a temperature sensor open circuit signal and transmit the temperature sensor open circuit signal when detecting that the temperature sensor is open circuit to the microprocessor; the open-circuit detection circuit is configured to generate a far-infrared thermal pad open-circuit signal and transmit the far-infrared thermal pad open-circuit signal to the microprocessor when detecting that the far-infrared thermal pad is open; the The microprocessor is configured to stop driving the far infrared rays when receiving the heating circuit short-circuit signal, the temperature sensor short-circuit signal, the heating circuit open-circuit signal, the temperature sensor open-circuit signal or the far-infrared heating pad open-circuit signal Heat pad heating circuit.

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad control device further includes: a buzzer, and the buzzer is electrically connected to the microcomputer. processor.

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad control device further includes: a vibrator, and the vibrator is electrically connected to the microprocessor .

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad controller further includes: a display, which is electrically connected to the microprocessor.

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the display is an organic light emitting diode display.

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad control device further includes: a power adapter, which is electrically connected to the the microprocessor.

Furthermore, in a specific embodiment of the far-infrared heating pad control device of the present invention, the power adapter is an AC to DC adapter.

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad control device further includes: a heating time setting button group, and the heating time setting button group is electrical connected to the microprocessor.

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad control device further comprises: a power button, the power button is electrically connected to the microprocessor .

Furthermore, in a specific embodiment of the far-infrared thermal pad control device of the present invention, the far-infrared thermal pad control device further includes: a temperature setting button group, the temperature setting button group is electrically connected to the the microprocessor.

The effect of this creation is to ensure the safety of using the far-infrared heat pad.

In order to have a better understanding of the techniques, means and effects of this creation to achieve the intended purpose, please refer to the following detailed descriptions and accompanying drawings of this creation. It is believed that the purpose, features and characteristics of this creation can be obtained in-depth and specific. However, the accompanying drawings are only provided for reference and description, and are not intended to limit the present creation.

In this disclosure, numerous specific details are provided in order to provide a thorough understanding of specific embodiments of the present invention; however, it should be understood by those skilled in the art that in the absence of one or more of these specific details, the able to practice the creation; in other instances, well-known details are not shown or described to avoid obscuring the main technical characteristics of the creation. The technical content and detailed description of this creation are described as follows in conjunction with the drawings:

Please refer to FIG. 1 , which is a block diagram of an embodiment of the far-infrared thermal pad control device of the present invention. A far-infrared thermal pad control device 10 of the present invention is applied to a far-infrared thermal pad 20. The far-infrared thermal pad control device 10 includes a microprocessor 102, a far-infrared thermal pad heating circuit 104, and a temperature sensor 106. A short circuit detection circuit 110 and an open circuit detection circuit 112, the above-mentioned components are electrically connected to each other.

The short circuit detection circuit 110 is configured to generate a heating circuit short circuit signal 114 and transmit the heating circuit short circuit signal 114 to the microprocessor 102 when detecting that the far infrared thermal pad heating circuit 104 is short circuited; the short circuit detection The circuit 110 is configured to generate a temperature sensor short circuit signal 116 and transmit the temperature sensor short circuit signal 116 to the microprocessor 102 when the temperature sensor 106 is detected to be short circuited.

The open circuit detection circuit 112 is configured to generate a heating circuit open circuit signal 118 and transmit the heating circuit open circuit signal 118 to the microprocessor 102 when detecting that the far infrared thermal pad heating circuit 104 is open circuit; the open circuit detection The circuit 112 is configured to generate a temperature sensor open circuit signal 120 when detecting that the temperature sensor 106 is open circuit and transmit the temperature sensor open circuit signal 120 to the microprocessor 102; the open circuit detection circuit 112 It is configured to generate a far-infrared thermal pad open-circuit signal 122 and transmit the far-infrared thermal pad open-circuit signal 122 to the microprocessor 102 when it is detected that the far-infrared thermal pad 20 is open.

The microprocessor 102 is configured to receive the heating circuit short signal 114, the temperature sensor short signal 116, the heating circuit open signal 118, the temperature sensor open signal 120 or the far infrared heating pad open signal At 122 hours, stop driving the far-infrared thermal pad heating circuit 104 so that the far-infrared thermal pad heating circuit 104 stops heating the far-infrared thermal pad 20 to ensure the safety of using the far-infrared thermal pad 20 .

Please refer to FIG. 2 , which is a block diagram of another embodiment of the far-infrared thermal pad control device of the present invention; the components shown in FIG. 2 are the same as those shown in FIG. Its narration is repeated. The far-infrared heating pad control device 10 further includes a buzzer 128, a vibrator 130, a display 132, a power adapter 134, a heating time setting button group 136, a power button 138 and a temperature setting button group 140, the above-mentioned elements are electrically connected to each other.

The display 132 can be, for example, but not limited to, an organic light emitting diode display. The power adapter 134 can be, for example, but not limited to, an AC-to-DC power adapter, such as converting an AC 110 volt or 220 volt into a DC 24 volt. The microprocessor 102 also has several analog-to-digital converters (not shown in FIG. 2 ) inside the microprocessor 102 to process the signals from the temperature sensor 106 or other components. The power button 138 is pressed to turn on or off the power, and each time the power is turned on, the far-infrared thermal pad control device 10 will be reset.

Please refer to FIG. 3 , which is an external view of an embodiment of the far-infrared thermal pad control device of the present invention; the components shown in FIG. 3 are the same as those shown in FIGS. The description thereof will not be repeated; please refer to FIG. 1 and FIG. 2 together. The display 132 displays a first display area 142 , a second display area 144 , a third display area 146 and a fourth display area 148 .

The heating time setting button group 136 is configured to be pressed to adjust the heating time of the far-infrared heating pad 20; for example, each time the upper button in the heating time setting button group 136 is pressed once, the heating time increases by fifteen minutes, and each time the lower button in the heating time setting button group 136 is pressed once, the heating time is reduced by 15 minutes, and the heating time of the present invention can be, for example, but not limited to be between 15 minutes and 15 minutes. between sixty minutes. The first display area 142 is used to display the remaining heating time of the far-infrared thermal pad 20, and when the remaining heating time is zero, the power is turned off.

The temperature setting button group 140 is configured to be pressed to adjust a set heating temperature of the far-infrared thermal pad 20; for example, each time the left button in the temperature setting button group 140 is pressed once, the set heating temperature increases 1 degree Celsius, and each time the right button in the temperature setting button group 140 is pressed once, the preset heating temperature is reduced by 1 degree Celsius, and the preset heating temperature in this creation can be, for example, but this creation is not limited to a medium Between 40°C and 65°C. The second display area 144 is used to display the set heating temperature and a current temperature of the far-infrared thermal pad 20 in turn, and can be displayed in degrees Celsius or Fahrenheit; when the heating of this creation is turned on, the third display area 146 will display Flashes to alert the user. When the current temperature reaches the set heating temperature, the creation will maintain a constant temperature state.

This creation can also have a vibration function while heating; the activation method of the vibration function of this creation is: first press and hold the left button in the temperature setting button group 140, and then press the power button 138 to activate In the vibration function of the present invention, the fourth display area 148 will display a vibration symbol and flash to remind the user.

The display 132 can also display various fault text messages, such as "heating pad fault", "heating control fault", "thermometer short circuit" or "thermometer open circuit" and the like. The fault text message "heating pad fault" is used when the heating wire of the heating pad is broken or the heating switch of the controller is short-circuited, then the operation will stop at this time and this abnormal message will be displayed. The fault text message "heating control fault" is used when the heating switch of the controller is damaged and open, then the operation will stop at this time and this abnormal message will be displayed. The fault text message "thermometer short circuit" is used when the temperature detection resistance value of the heating pad is not within the range, and the reading temperature is abnormal, then the operation will stop at this time and the abnormal message will be displayed. The fault text message "thermometer open circuit" is used when the temperature detection resistor of the heating pad is damaged and open, and the temperature cannot be read, then the operation will stop at this time and this abnormal message will be displayed.

In other words, the microprocessor 102 is configured to receive the heating circuit short signal 114, the temperature sensor short signal 116, the heating circuit open signal 118, the temperature sensor open signal 120 or the far infrared ray When the heating pad open signal 122 is activated, the display 132 is driven to display the above-mentioned fault text messages, so that the user can clearly understand the cause of the fault. When any of the above-mentioned fault text messages are displayed, the creation will stop all work and settings, and at this time, it is necessary to press the power button 138 to turn it on again to cancel.

After the power button 138 of the present creation is pressed, the present creation will first confirm whether the above-mentioned fault text messages exist. If the above-mentioned fault text messages exist, the heating will not be performed. The startup screen is displayed first, for example, for 3 seconds, then the creation starts to heat up and the set heating temperature and heating time can be set at the same time, and then it can also be set whether to add the vibration function. The buzzer 128 will beep three times to alert the user.

The effect of the present invention is to ensure the safety of using the far-infrared thermal pad 20 .

However, the above are only the preferred embodiments of this creation, and should not limit the scope of implementation of this creation, that is, all equivalent changes and modifications made in accordance with the requirements of this creation should still fall within the scope of the patent for this creation. Scope of intended protection. This creation can also have other various embodiments, without departing from the spirit and essence of this creation, those skilled in the art can make various corresponding changes and deformations according to this creation, but these corresponding changes and deformations are all shall fall within the scope of protection of the claims attached to this creation. To sum up, when it is known that this creation has industrial utilization, novelty and progress, and the structure of this creation has never been seen in similar products or used publicly, it fully meets the requirements for a new type of patent application, and the application is filed in accordance with the Patent Law.

10: Far infrared heating pad control device 20: Far infrared heat pad 102: Microprocessor 104: far infrared heating pad heating circuit 106: Temperature sensor 110: Short circuit detection circuit 112: Open circuit detection circuit 114: Heating circuit short circuit signal 116: Temperature sensor short circuit signal 118: Heating circuit open circuit signal 120: Temperature sensor open circuit signal 122: Far-infrared heat pad open circuit signal 128: Buzzer 130: Vibrator 132: Display 134: Power adapter 136: Heating time setting button group 138: Power button 140: Temperature setting button group 142: The first display area 144: Second display area 146: The third display area 148: Fourth display area

FIG. 1 is a block diagram of an embodiment of a control device for a far-infrared heating pad created by the invention.

FIG. 2 is a block diagram of another embodiment of the created far-infrared thermal pad control device.

FIG. 3 is an external view of an embodiment of the far-infrared thermal pad control device of the creation.

10: Far infrared heating pad control device

20: Far infrared heat pad

102: Microprocessor

104: far infrared heating pad heating circuit

106: Temperature sensor

110: Short circuit detection circuit

112: Open circuit detection circuit

114: Heating circuit short circuit signal

116: Temperature sensor short circuit signal

118: Heating circuit open circuit signal

120: Temperature sensor open circuit signal

122: Far-infrared heat pad open circuit signal

Claims (10)

A far-infrared thermal pad control device is applied to a far-infrared thermal pad, the far-infrared thermal pad control device is electrically connected to the far-infrared thermal pad, and the far-infrared thermal pad control device comprises: a microprocessor; a far-infrared thermal pad heating circuit, the far-infrared thermal pad heating circuit is electrically connected to the microprocessor and the far-infrared thermal pad; a temperature sensor electrically connected to the microprocessor; a short-circuit detection circuit, the short-circuit detection circuit is electrically connected to the microprocessor, the far-infrared heating pad heating circuit and the temperature sensor; and an open circuit detection circuit, the open circuit detection circuit is electrically connected to the microprocessor, the far-infrared heating pad heating circuit, the temperature sensor and the far-infrared heating pad, Wherein the short circuit detection circuit is configured to generate a heating circuit short circuit signal and transmit the heating circuit short circuit signal to the microprocessor when detecting that the far infrared heating pad heating circuit is short circuited; the short circuit detection circuit is configured as When detecting that the temperature sensor is short-circuited, a temperature sensor short-circuit signal is generated and sent to the microprocessor; the open-circuit detection circuit is configured to detect the far infrared rays When the heating circuit of the heating pad is open, it generates a heating circuit open signal and transmits the heating circuit open signal to the microprocessor; the open detection circuit is configured to generate a temperature sensor when it is detected that the temperature sensor is open. the open circuit signal of the detector and transmit the open circuit signal of the temperature sensor to the microprocessor; the open circuit detection circuit is configured to generate a far infrared thermal compress pad open circuit signal and transmit the open circuit signal when detecting that the far infrared thermal compress pad is open circuit The far-infrared thermal pad open signal is sent to the microprocessor; the microprocessor is configured to receive the heating circuit short signal, the temperature sensor short signal, the heating circuit open signal, the temperature sensor open signal or When the far-infrared thermal pad open-circuit signal stops driving the far-infrared thermal pad heating circuit. The far-infrared heating pad control device according to claim 1, further comprising: a buzzer, the buzzer is electrically connected to the microprocessor. The far-infrared heating pad control device according to claim 2, further comprising: a vibrator, the vibrator is electrically connected to the microprocessor. The far-infrared heating pad control device according to claim 3, further comprising: a display, the display is electrically connected to the microprocessor. The far-infrared heating pad control device according to claim 4, wherein the display is an organic light emitting diode display. The far-infrared heating pad control device according to claim 5, further comprising: A power adapter, the power adapter is electrically connected to the microprocessor. The far-infrared thermal pad control device as claimed in claim 6, wherein the power adapter is an AC to DC adapter. The far-infrared heating pad control device according to claim 7, further comprising: A heating time setting button group, the heating time setting button group is electrically connected to the microprocessor. The far-infrared heating pad control device according to claim 8, further comprising: A power button, the power button is electrically connected to the microprocessor. The far-infrared heating pad control device according to claim 9, further comprising: A temperature setting button group, the temperature setting button group is electrically connected to the microprocessor.

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