TWM622811U - Optical material detection device and detection module thereof - Google Patents

Optical material detection device and detection module thereof Download PDF

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Publication number
TWM622811U
TWM622811U TW110208817U TW110208817U TWM622811U TW M622811 U TWM622811 U TW M622811U TW 110208817 U TW110208817 U TW 110208817U TW 110208817 U TW110208817 U TW 110208817U TW M622811 U TWM622811 U TW M622811U
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Taiwan
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temperature
optical
appearance information
detection device
state
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TW110208817U
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Chinese (zh)
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陳俊宏
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光宇生醫科技股份有限公司
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Publication of TWM622811U publication Critical patent/TWM622811U/en

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Abstract

An optical material detection device is provided. The optical material detection device includes: a detection part, a heater, a thermal sensor and a material status monitor. The detection part includes a material entrance and an optical detector for detecting a first visual feature information. The heater is for heating the material. The thermal sensor is for measuring a thermal variation of the material. The material status monitor is for determining the status of the material according to the thermal variation and the first visual feature information.

Description

光學式材料檢測裝置及其偵測模組 Optical material detection device and detection module thereof

本創作關聯於檢測技術,特別是材料狀態的檢測技術。 This creation is related to detection technology, especially the detection technology of material state.

現有的積層製造(包括3D、4D~nD空間列印等)技術日益成熟,甚至可應用於醫療領域上。現有技術是使用者在積層製造的機台上設定好列印環境、列印的材料、成品形狀等資料,再讓機台根據這些設定值來進行積層製造。然而列印的材料的控管仍有諸多問題,例如盜版的材料、變質的材料或錯誤的材料都可能造成列印任務的失敗,若列印的成品是應用於醫療領域,更可能造成醫療糾紛。 Existing multilayer manufacturing (including 3D, 4D~nD space printing, etc.) technologies are becoming more and more mature, and can even be applied to the medical field. In the prior art, the user sets the printing environment, the material to be printed, the shape of the finished product and other information on the lamination machine, and then the machine performs lamination according to these set values. However, there are still many problems in the control of printed materials. For example, pirated materials, deteriorated materials or wrong materials may cause the failure of the printing task. If the printed product is used in the medical field, it is more likely to cause medical disputes. .

有鑑於此,本創作提供一種光學式材料檢測裝置及其偵測模組,來解決上述的問題。 In view of this, the present invention provides an optical material detection device and a detection module thereof to solve the above problems.

本創作的一目的是提供一種光學式材料檢測裝置,包含:偵測模組、加熱器、溫度感應器及材料狀態監控器。偵測模組包含材料入口及光學偵測器,其中材料入口供材料進入,光學偵測器用於偵測材料的第一外觀資訊。 加熱器用於對材料進行加熱。溫度感應器用於偵測材料的溫度變化量。材料狀態監控器用於根據溫度變化量及第一外觀資訊判斷材料的狀態。 An object of this creation is to provide an optical material detection device, including a detection module, a heater, a temperature sensor and a material state monitor. The detection module includes a material inlet and an optical detector, wherein the material inlet is used for the material to enter, and the optical detector is used for detecting the first appearance information of the material. The heater is used to heat the material. The temperature sensor is used to detect the temperature change of the material. The material state monitor is used for judging the state of the material according to the temperature change amount and the first appearance information.

本創作的另一目的是提供一種偵測模組,用於光學式材料檢測裝置,包含材料入口及光學偵測器。材料入口用於供材料進入。光學偵測器用於偵測材料的第一外觀資訊。其中,光學式材料檢測裝置更包含加熱器、溫度感應器及材料狀態監控器,加熱器用於對材料進行加熱,溫度感應器用於偵測材料的溫度變化量,材料狀態監控器用於根據溫度變化量及第一外觀資訊判斷材料的狀態。 Another object of the present invention is to provide a detection module for an optical material detection device, which includes a material inlet and an optical detector. The material inlet is used for material entry. The optical detector is used for detecting the first appearance information of the material. Among them, the optical material detection device further includes a heater, a temperature sensor and a material state monitor. The heater is used to heat the material, the temperature sensor is used to detect the temperature change of the material, and the material state monitor is used to measure the temperature change. and the first appearance information to judge the state of the material.

1:光學式材料檢測裝置 1: Optical material detection device

10:偵測模組 10: Detection module

20:材料 20: Materials

30:加熱器 30: Heater

40:溫度感應器 40: temperature sensor

50:光學偵測器 50: Optical detector

52:硬度檢測模組 52: Hardness detection module

60:材料狀態監控器 60:Material Condition Monitor

14:加熱喉管 14: Heating the throat

121:外殼 121: Shell

121a:前外殼 121a: Front housing

121b:後外殼 121b: Rear shell

122:側框 122: side frame

124:轉輪 124: runner

126:轉動馬達 126: Turn the motor

128:間隔區域 128: Interval area

123a:材料入口 123a: Material Entry

123b:材料出口 123b: Material export

62:第二微處理器 62: Second microprocessor

64:電腦程式產品 64: Computer Program Products

70:記憶體 70: memory

80:標籤編碼 80: label encoding

90:顯示器 90: Monitor

S41~S47:步驟 S41~S47: Steps

S431~S433:步驟 S431~S433: Steps

S441~S446:步驟 S441~S446: Steps

S451~S453:步驟 S451~S453: Steps

圖1是本創作一實施例的光學式材料檢測裝置的示意圖;圖2(A)是本創作一實施例的偵測模組的示意圖;圖2(B)是本創作一實施例的偵測模組的內部結構示意圖;圖2(C)是本創作一實施例的偵測模組的分解圖;圖2(D)是本創作一實施例的偵測模組的剖面圖;圖3是本創作一實施例的材料狀態監控器的細部結構示意圖;圖4是本創作一實施例的一光學式材料檢測裝置的運作流程圖;圖5是本創作一實施例的步驟S43的細部流程示意圖;圖6(A)是本創作一實施例的步驟S44的細部流程示意圖;圖6(B)是本創作另一實施例的步驟S44的細部流程示意圖;圖7(A)是本創作一實施例的步驟S45的細部流程示意圖; 圖7(B)是本創作另一實施例的步驟S45的細部流程示意圖。 FIG. 1 is a schematic diagram of an optical material detection device according to an embodiment of the present invention; FIG. 2(A) is a schematic diagram of a detection module according to an embodiment of the present invention; FIG. 2(B) is a detection method of an embodiment of the present invention. Schematic diagram of the internal structure of the module; Figure 2 (C) is an exploded view of the detection module of an embodiment of the creation; Figure 2 (D) is a cross-sectional view of the detection module of an embodiment of the creation; Figure 3 is a A schematic diagram of a detailed structure of a material state monitor according to an embodiment of the present invention; FIG. 4 is a flow chart of the operation of an optical material detection device according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a detailed flow chart of step S43 of an embodiment of the present invention Figure 6 (A) is a detailed flow diagram of step S44 of an embodiment of this creation; Figure 6 (B) is a detailed flow diagram of step S44 of another embodiment of this creation; Figure 7 (A) is an implementation of this creation The detailed flow chart of step S45 of the example; FIG. 7(B) is a detailed flowchart of step S45 in another embodiment of the present invention.

以下係藉由特定的具體實施例說明本創作之實施方式。本創作亦可藉由其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可針對不同觀點與應用,在不悖離本創作之精神下進行各種修飾與變更。 The following describes the implementation of the present invention by means of specific embodiments. This creation can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed for different viewpoints and applications without departing from the spirit of this creation.

再者,說明書與請求項中所使用的序數例如“第一”、“第二”等之用詞,以修飾請求項之元件,其本身並不意含及代表該請求元件有任何之前的序數,也不代表某一請求元件與另一請求元件的順序、或是製造方法上的順序,該些序數的使用僅用來使具有某命名的一請求元件得以和另一具有相同命名的請求元件能作出清楚區分。 Furthermore, the ordinal numbers used in the description and the claims, such as "first", "second", etc., are used to modify the elements of the claim, which themselves do not imply and represent that the claimed elements have any previous ordinal numbers, Nor does it represent the order of a request element and another request element, or the order of the manufacturing method, and the use of these ordinal numbers is only used to enable a request element with a certain name to be able to have the same name as another request element with the same name. make a clear distinction.

本文中關於“當…”或“…時”等描述表示”當下、之前或之後”等態樣,而不限定為同時發生之情形,在此先行敘明。此外,本文中記載多個功效時,若在功效之間使用“或”一詞,係表示功效可獨立存在,但不排除多個功效可同時存在。再者,本創作記載一元件進行特殊運作時,是表示該元件不僅能夠執行該特殊運作,且亦可執行其它運作。 The descriptions of "when..." or "when" in this document represent aspects such as "now, before, or after", and are not limited to situations that occur at the same time, which are described in advance. In addition, when multiple effects are described in this article, if the word "or" is used between the effects, it means that the effects can exist independently, but it does not exclude that multiple effects can exist simultaneously. Furthermore, when an element is described in the present invention to perform a special operation, it means that the element can not only perform the special operation, but also perform other operations.

圖1是本創作一實施例的光學式材料檢測裝置1的系統架構示意圖,光學式材料檢測裝置1可用於檢測一材料20的狀態。如圖1所示,光學式材料檢測裝置1可包含一偵測模組10、一加熱器30、一溫度感應器40及一材料狀態監控器60。在一實施例中,光學式材料檢測裝置1可更包含一顯示器90。在一實施例中,偵測模組10可包含一光學偵測器50(標示於圖2(A)至圖2(D))。偵測模組10可與一加熱喉管14連接。材料20可放置於偵測模組10之中。此外,加熱器30可對 位於偵測模組10中的材料20進行加熱,其中加熱器30可透過加熱喉管14對材料20進行加熱。溫度感應器40可偵測材料20的一溫度變化量。光學偵測器50(標示於圖2(A)至圖2(D))可用於偵測材料20的一第一外觀資訊。材料狀態監控器60可用於根據溫度變化量及第一外觀資訊判斷材料20的狀態,例如判斷材料20為一正常狀態或一異常狀態。顯示器90可顯示材料20為正常狀態或異常狀態。 FIG. 1 is a schematic diagram of a system structure of an optical material detection device 1 according to an embodiment of the present invention. The optical material detection device 1 can be used to detect the state of a material 20 . As shown in FIG. 1 , the optical material detection device 1 may include a detection module 10 , a heater 30 , a temperature sensor 40 and a material state monitor 60 . In one embodiment, the optical material detection apparatus 1 may further include a display 90 . In one embodiment, the detection module 10 may include an optical detector 50 (marked in FIGS. 2(A) to 2(D) ). The detection module 10 can be connected with a heating pipe 14 . The material 20 may be placed in the detection module 10 . In addition, the heater 30 may The material 20 in the detection module 10 is heated, wherein the heater 30 can heat the material 20 through the heating pipe 14 . The temperature sensor 40 can detect a temperature change of the material 20 . The optical detector 50 (marked in FIG. 2(A) to FIG. 2(D) ) can be used to detect a first appearance information of the material 20 . The material state monitor 60 can be used for judging the state of the material 20 according to the temperature change and the first appearance information, for example, judging whether the material 20 is in a normal state or an abnormal state. The display 90 may display whether the material 20 is in a normal state or an abnormal state.

在一實施例中,外觀資訊可例如是材料20的顏色、形狀、大小等,且不限於此。為方便說明,下文將以材料20的顏色做為舉例。在一實施例中,材料20為於不同溫度時,可能會產生外觀資訊改變的情況,而根據外觀資訊,可判斷材料20是否異常(例如經加熱或冷卻後,正常材料20的顏色與異常材料20的顏色可能不同)。 In one embodiment, the appearance information may be, for example, the color, shape, size, etc. of the material 20, but is not limited thereto. For the convenience of description, the color of the material 20 will be used as an example below. In one embodiment, when the material 20 is at different temperatures, the appearance information may change, and according to the appearance information, it can be determined whether the material 20 is abnormal (for example, after heating or cooling, the color of the normal material 20 and the abnormal material 20 colors may vary).

藉此,本創作的光學式材料檢測裝置1可檢測材料20是否異常。 Thereby, the optical material detection device 1 of the present invention can detect whether the material 20 is abnormal.

接著說明各元件的細節。 Next, the details of each element will be described.

首先說明材料20。在一實施例中,材料20可以是線材,其於加熱前可維持固體型態,而加熱至特定溫度時可軟化形成軟性物質,並於加熱至完全融化後可形成液體型態,但不限於此。材料20可適用於一二維平面列印裝置、一三維空間積層製造裝置或一n維空間積層製造裝置,其中n為大於3的正整數;換言之,材料20可用於二維平面列印機台或各種多維空間積層製造的機台的噴頭裝置,機台可例如是3D列印機台、4D列印機台、機器手臂等,但並非限定。 First, the material 20 will be described. In one embodiment, the material 20 can be a wire, which can maintain a solid state before heating, and can soften to form a soft substance when heated to a specific temperature, and can form a liquid state after heating to complete melting, but not limited to this. The material 20 can be used in a two-dimensional planar printing device, a three-dimensional spatial build-up manufacturing device or an n-dimensional spatial build-up manufacturing device, where n is a positive integer greater than 3; in other words, the material 20 can be used in a two-dimensional planar printing machine Or the nozzle device of various multi-dimensional space lamination machines, the machine can be, for example, a 3D printing machine, a 4D printing machine, a robotic arm, etc., but not limited.

此外,光學式材料檢測裝置1可包含一微控制器(圖未顯示),用以控制偵測模組10的內部元件的運作。在一實施例中,微控制器可設置於偵測模組10之中,但在另一實施例中,微控制器亦可與材料狀態監控器60整合在一起。本創作不限於此。 In addition, the optical material detection device 1 may include a microcontroller (not shown) for controlling the operation of the internal components of the detection module 10 . In one embodiment, the microcontroller may be disposed in the detection module 10 , but in another embodiment, the microcontroller may also be integrated with the material state monitor 60 . This creation is not limited to this.

接著說明偵測模組10,請同時參考圖1至圖2(D),其中圖2(A)是本創作一實施例的偵測模組10的示意圖,圖2(B)是本創作一實施例的偵測模組10的內部結構示意圖(例如將偵測模組10的前外殼121a移除的情形),圖2(C)是本創作一實施例的偵測模組10的分解圖,圖2(D)是本創作一實施例的偵測模組的剖面圖(例如圖2(A)中沿著A-A’剖線的偵測模組10的剖面情形)。 Next, the detection module 10 will be described. Please refer to FIG. 1 to FIG. 2(D) at the same time, wherein FIG. 2(A) is a schematic diagram of the detection module 10 according to an embodiment of the present invention, and FIG. 2(B) is the first embodiment of the present invention. A schematic diagram of the internal structure of the detection module 10 of the embodiment (for example, when the front casing 121a of the detection module 10 is removed), FIG. 2(C) is an exploded view of the detection module 10 according to an embodiment of the present invention 2(D) is a cross-sectional view of the detection module according to an embodiment of the present invention (for example, the cross-sectional situation of the detection module 10 along the AA' section in FIG. 2(A) ).

如圖2(A)所示,偵測模組10包含一外殼121、一側框122、一材料入口123a、一材料出口123b。外殼121可包含前外殼121a及一後外殼121b。材料20可透過材料入口123a進入偵測模組10之中,並自材料出口123b伸出而進入與材料出口123b連接的加熱喉管14。一轉動馬達126可設置於後外殼121b。 As shown in FIG. 2(A), the detection module 10 includes a casing 121, a side frame 122, a material inlet 123a, and a material outlet 123b. The casing 121 may include a front casing 121a and a rear casing 121b. The material 20 can enter the detection module 10 through the material inlet 123a, and extends from the material outlet 123b to enter the heating pipe 14 connected to the material outlet 123b. A rotation motor 126 may be disposed on the rear casing 121b.

如圖2(B)及圖2(C)所示,當前外殼121a移除時,偵測模組10內部可包含複數個轉輪124及一光學偵測器50。光學偵測器50可設置於側框122中的一容納空間中。此外,前外殼121a上可具有至少二孔洞,用以容納及保持材料20,其中孔洞可以是材料入口123a及材料出口123b。該等轉輪124可設置於材料20周圍,例如其中一個轉輪124可位於材料20的左側,而另一個轉輪124可位於材料20的右側,並各自貼靠材料20。在一實施例中,該等轉輪124可具備不同大小或形狀。此外,至少一轉輪124可連接轉動馬達126,而轉動馬達126可帶動該至少一轉輪124轉動,藉此使材料20可在偵測模組10中移動。在一實施例中,該等轉輪124可依照轉動方向的不同而改變材料20的移動方向,因此材料20可在偵測模組10中往不同方向移動。 As shown in FIG. 2(B) and FIG. 2(C) , when the front casing 121a is removed, the detection module 10 may include a plurality of rotating wheels 124 and an optical detector 50 inside. The optical detector 50 can be disposed in a receiving space in the side frame 122 . In addition, the front housing 121a may have at least two holes for accommodating and retaining the material 20, wherein the holes may be the material inlet 123a and the material outlet 123b. The wheels 124 can be disposed around the material 20 , for example, one of the wheels 124 can be located on the left side of the material 20 , and the other wheel 124 can be located on the right side of the material 20 , and each abuts the material 20 . In one embodiment, the wheels 124 may have different sizes or shapes. In addition, at least one rotating wheel 124 can be connected to a rotating motor 126 , and the rotating motor 126 can drive the at least one rotating wheel 124 to rotate, thereby enabling the material 20 to move in the detection module 10 . In one embodiment, the rotating wheels 124 can change the moving direction of the material 20 according to different rotation directions, so the material 20 can move in different directions in the detection module 10 .

又如圖2(D)所示,部分轉輪124之間可具有間隔區域128,而材料20於間格區域128處可露出,而光學偵測器50可設置於鄰近於間隔區域128處,因此光學偵測器50可偵測材料20的外觀資訊。 As shown in FIG. 2(D), a spaced area 128 may be provided between some of the rotating wheels 124, and the material 20 may be exposed at the spaced area 128, and the optical detector 50 may be disposed adjacent to the spaced area 128, Therefore, the optical detector 50 can detect the appearance information of the material 20 .

在一實施例中,偵測模組10可以是各種形狀,例如矩形或管狀,且不限於此。在一實施例中,外殼121可以包含各種材料,例如金屬、陶瓷等,且不限於此。在一實施例中,材料入口123(a)及材料出口123(b)之間可具有一傳遞長度(可視為材料20的傳遞路徑)。在一實施例中,材料入口123(a)或材料出口123(b)的外徑可介於1毫米(mm)至3毫米之間(亦即1mm≦L1≦3mm),且不限於此。在一實施例中,材料入口123(a)或材料入口123(b)的外徑是介於1.75毫米至2.85毫米之間(亦即1.75mm≦L1≦2.85mm),且不限於此。 In one embodiment, the detection module 10 may have various shapes, such as a rectangle or a tube, but is not limited thereto. In one embodiment, the housing 121 may include various materials, such as metal, ceramic, etc., but is not limited thereto. In one embodiment, there may be a transfer length between the material inlet 123(a) and the material outlet 123(b) (which can be regarded as a transfer path of the material 20). In one embodiment, the outer diameter of the material inlet 123(a) or the material outlet 123(b) may be between 1 millimeter (mm) and 3 mm (ie, 1 mm≦L1≦3 mm), but is not limited thereto. In one embodiment, the outer diameter of the material inlet 123(a) or the material inlet 123(b) is between 1.75mm and 2.85mm (ie, 1.75mm≦L1≦2.85mm), but not limited thereto.

在一實施例中,光學偵測器50可以是攝影機、錄影機或鏡頭,且不限於此。光學偵測器50可包含一感光耦合元件(charge coupled device,CCD)。 In one embodiment, the optical detector 50 may be a camera, a video recorder or a lens, but is not limited thereto. The optical detector 50 may include a charge coupled device (CCD).

藉此,偵測模組10的特徵已可被理解。 Thereby, the characteristics of the detection module 10 can be understood.

請再次參考圖1。接著說明加熱器30。在一實施例中,加熱器30可設置鄰近加熱喉管14處,以根據微控制器的命令而對加熱喉管14進行加熱,進而使材料20加熱。在一實施例中,加熱器30亦可改為設置於偵測模組10內部。在一實施例中,加熱器30可由各式加熱器、加熱管、可升溫的電子元件、熱敏電阻加熱元件、可升溫且耐高溫的陶瓷元件、可升溫且耐高溫的非金屬元件、遠紅外線加熱元件、半導體元件等方式來實現,但不限於此。 Please refer to Figure 1 again. Next, the heater 30 will be described. In one embodiment, the heater 30 may be positioned adjacent to the heating throat 14 to heat the heating throat 14 and thereby heat the material 20 according to commands from the microcontroller. In one embodiment, the heater 30 can also be disposed inside the detection module 10 instead. In one embodiment, the heater 30 can be composed of various types of heaters, heating tubes, electronic components that can be heated, thermistor heating elements, ceramic components that can be heated and resistant to high temperature, non-metallic components that can be heated and resistant to high temperature, remote It can be realized by means of infrared heating elements, semiconductor elements, etc., but not limited to this.

接著說明溫度感應器40。在一實施例中,溫度感應器40可用於感測材料20的溫度,此處「材料20的溫度」可例如是材料20上的一特定位置的溫度或材料20的平均溫度,且不限於此。在一實施例中,溫度感應器40可設定為預先偵測材料20在加熱前的一原始溫度,並將材料20加熱前後的溫度資訊進行比較,進而取得溫度變化量。在一實施例中,溫度感應器40可透過熱電偶技術、RTD技術或熱敏電阻器技術來實現,但不限於此。在一實施例中,偵測模組10中可 設置多個溫度感應器40,例如一個溫度感應器40可設置於材料入口123(a)、鄰近材料入口123(a)等,用以偵測材料20加熱前的起始溫度,而另一個溫度感應器40可設置於遠離材料入口123(a),用以偵測材料20經由加熱器30加熱後的溫度,本創作不限於此。在另一實施例中,偵測模組10中亦可以僅設置一個溫度感應器40(例如設置於材料入口123(a)或鄰近材料入口123(a)),溫度感應器40可於不同時間量測材料20的溫度;本創作不限於此。在一實施例中,溫度變化量亦可以轉換為熱含量(enthalpy,熱焓),本創作不限於此。 Next, the temperature sensor 40 will be described. In one embodiment, the temperature sensor 40 can be used to sense the temperature of the material 20, where the "temperature of the material 20" can be, for example, the temperature of a specific position on the material 20 or the average temperature of the material 20, and is not limited thereto . In one embodiment, the temperature sensor 40 can be set to detect an original temperature of the material 20 before heating, and compare the temperature information of the material 20 before and after heating to obtain the temperature change. In one embodiment, the temperature sensor 40 may be implemented by thermocouple technology, RTD technology or thermistor technology, but not limited thereto. In one embodiment, the detection module 10 may A plurality of temperature sensors 40 are provided, for example, one temperature sensor 40 can be provided at the material inlet 123(a), adjacent to the material inlet 123(a), etc., to detect the initial temperature of the material 20 before heating, and another temperature The sensor 40 may be disposed away from the material inlet 123(a) to detect the temperature of the material 20 heated by the heater 30, but the present invention is not limited thereto. In another embodiment, only one temperature sensor 40 may be provided in the detection module 10 (for example, provided at the material inlet 123(a) or adjacent to the material inlet 123(a)), and the temperature sensor 40 may be arranged at different times The temperature of the material 20 is measured; the present invention is not so limited. In one embodiment, the temperature change amount can also be converted into heat content (enthalpy, enthalpy), but the present invention is not limited to this.

在一實施例中,偵測模組10可更包含一硬度檢測模組52(非限定)。 In one embodiment, the detection module 10 may further include a hardness detection module 52 (not limited).

接著說明微控制器。在一實施例中,微控制器是偵測模組10或材料狀態監控器60內部的一控制器,但不限於此。在一實施例中,微控制器可包括一微處理器(圖未顯示),因此微控制器可具備資料處理的功能,例如對資料進行分析,但並非限定。在一實施例中,微控制器的微處理器可執行一電腦程式產品,用以使微控制器實現特殊功能,例如控制偵測模組10的內部元件之功能。本創作不限於此。 Next, the microcontroller will be described. In one embodiment, the microcontroller is a controller inside the detection module 10 or the material status monitor 60, but is not limited thereto. In one embodiment, the microcontroller may include a microprocessor (not shown in the figure), so the microcontroller may have a data processing function, such as analyzing data, but not limited thereto. In one embodiment, the microprocessor of the microcontroller can execute a computer program product for enabling the microcontroller to perform special functions, such as controlling the functions of the internal components of the detection module 10 . This creation is not limited to this.

接著說明材料狀態監控器60。圖3是本創作一實施例的材料狀態監控器60的細部結構示意圖,並請同時參考圖1及圖2。在一實施例中,材料狀態監控器60可包含一第二微處理器62,因此材料狀態監控器60可具備資料處理的功能。在一實施例中,第二處理器62可執行一電腦程式產品64,電腦程式產品64可包含複數指令,用以使材料狀態監控器60實現特殊功能,例如判斷材料是否異常或控制噴頭裝置10運作等功能。 Next, the material state monitor 60 will be described. FIG. 3 is a schematic diagram of a detailed structure of the material state monitor 60 according to an embodiment of the present invention, and please refer to FIG. 1 and FIG. 2 at the same time. In one embodiment, the material status monitor 60 may include a second microprocessor 62, so the material status monitor 60 may have a data processing function. In one embodiment, the second processor 62 can execute a computer program product 64, and the computer program product 64 can include a plurality of instructions for enabling the material status monitor 60 to implement special functions, such as determining whether the material is abnormal or controlling the nozzle device 10 function, etc.

在一實施例中,材料狀態監控器60可設置於偵測模組10外部,例如可設置於一電子裝置、一電腦裝置或一伺服器上,而偵測模組10可具備一有 線/無線通訊設備,用以與電腦裝置進行資料傳輸。在另一實施例中,偵測模組10亦可組裝於電子裝置或電腦裝置上,以直接將資料傳送至材料狀態監控器60。在另一實施例中,材料狀態監控器60亦可與顯示器90(顯示於圖1)的整合在一起。本創作不限於此。 In one embodiment, the material state monitor 60 may be disposed outside the detection module 10, for example, may be disposed on an electronic device, a computer device or a server, and the detection module 10 may have a Wired/wireless communication equipment for data transmission with computer devices. In another embodiment, the detection module 10 can also be assembled on an electronic device or a computer device to directly transmit data to the material status monitor 60 . In another embodiment, the material condition monitor 60 may also be integrated with the display 90 (shown in FIG. 1 ). This creation is not limited to this.

在一實施例中,材料狀態監控器60可連接至一記憶體70,用以取得記憶體70所儲存的資料。記憶體70可以是一儲存裝置,例如硬碟、隨身碟等,或者記憶體70可透過電子電路實現。在一實施例中,記憶體70可儲存複數個標籤編碼80,其中每個標籤編碼80可對應一溫度變化量範圍及至少一外灣資訊,且每個標籤編碼80代表一正常狀態或一異常狀態;換言之,正常狀態的材料20所對應的溫度變化量範圍及外觀資訊將被設定成其中一個標籤編碼80,而各種異常狀態的材料20所對應的溫度變化量範圍及外觀資訊亦將被設定成其餘的標籤編碼80。在一實施例中,每個標籤編碼80可對應更多物理特性,例如不同環境條件下的硬度範圍等,且不限於此。 In one embodiment, the material status monitor 60 may be connected to a memory 70 for obtaining data stored in the memory 70 . The memory 70 may be a storage device, such as a hard disk, a flash drive, etc., or the memory 70 may be implemented through electronic circuits. In one embodiment, the memory 70 can store a plurality of label codes 80, wherein each label code 80 can correspond to a temperature variation range and at least one outer bay information, and each label code 80 represents a normal state or an abnormality In other words, the temperature change range and appearance information corresponding to the material 20 in normal state will be set to one of the label codes 80, and the temperature change range and appearance information corresponding to the material 20 in various abnormal states will also be set Encode 80 into the rest of the tags. In one embodiment, each label code 80 may correspond to more physical properties, such as hardness range under different environmental conditions, etc., but is not limited thereto.

藉此,材料狀態監控器60可將噴頭裝置10所量測到的溫度變化值及第一外觀資訊與該等標籤編碼80的各種溫度變化量範圍及外觀資訊進行比對(例如找出最相近的外觀資訊所對應的標籤編碼80),以找出相對應的一特定標籤編碼80,並根據特定標籤編碼80決定材料的狀態。 In this way, the material state monitor 60 can compare the temperature change value and the first appearance information measured by the nozzle device 10 with the various temperature change amount ranges and appearance information of the label codes 80 (for example, find the most similar The corresponding label code 80) of the appearance information of the device can find out a corresponding specific label code 80, and determine the state of the material according to the specific label code 80.

接著將說明光學式材料檢測裝置1的運作。圖4是本創作一實施例的光學式材料檢測裝置1的運作流程圖,並請同時參考圖1至圖3。 Next, the operation of the optical material detection apparatus 1 will be described. FIG. 4 is a flow chart of the operation of the optical material detection device 1 according to an embodiment of the present invention, and please refer to FIGS. 1 to 3 at the same time.

首先,步驟S41被執行,材料20進入偵測模組10。之後步驟S42被執行,對位於偵測模組10的材料20進行加熱。之後步驟S43被執行,偵測材料20的溫度變化量。之後步驟S44被執行,偵測材料20的第一外觀資訊。之後步驟 S45被執行,根據溫度變化量及第一外觀資訊判斷材料20的狀態。進一步地,步驟S46可被執行,當材料20為正常狀態時,顯示材料20為正常狀態。進一步地,步驟S47可被執行,當材料20為異常狀態時,顯示材料20為異常狀態。 First, step S41 is executed, and the material 20 enters the detection module 10 . After that, step S42 is executed to heat the material 20 in the detection module 10 . After that, step S43 is executed to detect the temperature change of the material 20 . After that, step S44 is executed to detect the first appearance information of the material 20 . next steps S45 is executed, and the state of the material 20 is determined according to the temperature change amount and the first appearance information. Further, step S46 may be performed, when the material 20 is in a normal state, displaying that the material 20 is in a normal state. Further, step S47 may be performed, when the material 20 is in an abnormal state, displaying that the material 20 is in an abnormal state.

關於步驟S41,材料20可透過使用者安裝於偵測模組10中或者外部機器自動輸送至偵測模組10之中,且不限於此。在一實施例中,當材料20進入偵測模組10時,溫度感應器40可偵測材料20的一原始溫度。 Regarding step S41, the material 20 may be installed in the detection module 10 by the user or automatically delivered to the detection module 10 by an external machine, and is not limited thereto. In one embodiment, when the material 20 enters the detection module 10 , the temperature sensor 40 can detect an original temperature of the material 20 .

關於步驟S42,其可透過加熱器30來達成。在一實施例中,微控制器可控制加熱器30對材料20進行加熱。在一實施例中,加熱器30是以一預設加熱溫度對材料20進行加熱,其中該預設加熱溫度可預先被設定,並且可依照需求而更改。在一實施例中,該預設加熱溫度是設定為比材料20的一軟化溫度點高於N度,其中N為正整數。在一實施例中,N至少為10。在一實施例中,該預設加熱溫度介於40至60度之間,且不限於此。在一實施例中,該預設加熱溫度可為50度。在一實施例中,當材料20被加熱時,一部分的材料20可位於偵測模組10之外(例如僅有5mm的材料20進入偵測模組10中),但並非限制。 Regarding step S42 , it can be achieved by the heater 30 . In one embodiment, the microcontroller can control the heater 30 to heat the material 20 . In one embodiment, the heater 30 heats the material 20 at a predetermined heating temperature, wherein the predetermined heating temperature can be preset and can be changed according to requirements. In one embodiment, the preset heating temperature is set to be N degrees higher than a softening temperature point of the material 20 , where N is a positive integer. In one embodiment, N is at least ten. In one embodiment, the predetermined heating temperature is between 40 and 60 degrees, but not limited thereto. In one embodiment, the predetermined heating temperature may be 50 degrees. In one embodiment, when the material 20 is heated, a portion of the material 20 may be located outside the detection module 10 (eg, only 5 mm of the material 20 enters the detection module 10 ), but is not limited.

關於步驟S43,其可透過溫度感應器40來達成。在一實施例中,微控制器可控制溫度感應器40偵測材料20的溫度變化量。 Regarding step S43 , it can be achieved through the temperature sensor 40 . In one embodiment, the microcontroller can control the temperature sensor 40 to detect the temperature change of the material 20 .

關於步驟S44,其可透過光學偵測器50來達成。在一實施例中,微控制器可控制光學偵測器50偵測材料20的第一外觀資訊。 Regarding step S44 , it can be achieved through the optical detector 50 . In one embodiment, the microcontroller can control the optical detector 50 to detect the first appearance information of the material 20 .

關於步驟S45,其可透過材料狀態監控器60來達成。在一實施例中,材料狀態監控器60可根據電腦程式產品64的指令,使用溫度變化量及第一外觀資訊從記憶體70中找出相對應的標籤編碼80,以判斷出材料20的狀態。 With regard to step S45, it can be achieved through the material condition monitor 60. In one embodiment, the material state monitor 60 can find out the corresponding label code 80 from the memory 70 according to the instruction of the computer program product 64 using the temperature change amount and the first appearance information, so as to determine the state of the material 20 .

而步驟S46及S47可透過材料狀態監控器60及顯示器90來達成。在一實施例中,當材料20為正常狀態時,材料狀態監控器60可傳送一指令至顯示器90,顯示器90可將材料狀態監控器60的判斷結果顯出來。但本創作不限於此。 And steps S46 and S47 can be achieved through the material state monitor 60 and the display 90 . In one embodiment, when the material 20 is in a normal state, the material state monitor 60 can send an instruction to the display 90 , and the display 90 can display the judgment result of the material state monitor 60 . But this creation is not limited to this.

本創作的特色之一在於,根據材料20在加熱後的外觀特性來判斷材料20的狀態。為了使精準度提升,在一實施例中,溫度變化量的偵測(例如步驟S43)及第外觀資訊的偵測(例如步驟S44)是各自在特定條件下進行。 One of the features of the present invention is that the state of the material 20 is judged according to the appearance characteristics of the material 20 after heating. In order to improve the accuracy, in one embodiment, the detection of the temperature variation (eg, step S43 ) and the detection of the first appearance information (eg, step S44 ) are performed under specific conditions.

圖5是本創作一實施例的步驟S43的細部流程示意圖,其用於說明溫度變化量的偵測的細節,並請同時參考圖1至圖4。如圖5所示,當步驟S41及S42執行時(例如材料20進行加熱後),步驟S431被執行,當材料20被持續加熱一段預設期間時,溫度感應器40開始偵測溫度變化量。之後步驟S432被執行,溫度感應器40比較材料20的原始溫度與目前的溫度,以取得材料20的溫度變化量。之後步驟S433被執行,材料狀態監控器60取得溫度變化量的資訊。藉此,溫度變化量的偵測可被完成。 FIG. 5 is a detailed flowchart of step S43 according to an embodiment of the present invention, which is used to describe the details of the detection of the temperature change, and please refer to FIGS. 1 to 4 at the same time. As shown in FIG. 5 , when steps S41 and S42 are performed (eg, after the material 20 is heated), step S431 is performed. When the material 20 is continuously heated for a predetermined period, the temperature sensor 40 starts to detect the temperature change. After that, step S432 is executed, and the temperature sensor 40 compares the original temperature of the material 20 with the current temperature to obtain the temperature change amount of the material 20 . After that, step S433 is executed, and the material state monitor 60 obtains the information of the temperature change. Thereby, the detection of the temperature change amount can be completed.

步驟S431至S433的目的是為了分析材料20的吸熱能力,亦即材料20的吸熱能力是作為判斷材料20的狀態的依據之一。 The purpose of steps S431 to S433 is to analyze the heat absorption capability of the material 20 , that is, the heat absorption capability of the material 20 is used as one of the basis for judging the state of the material 20 .

在一實施例中,該預設期間可預先被設定,並且可依照需求而更改。在一實施例中,該預設期間可介於50至70秒,且不限於此。在一實施例中,該預設期間可為60秒。 In one embodiment, the preset period can be preset and can be changed according to requirements. In one embodiment, the predetermined period may be between 50 and 70 seconds, but is not limited thereto. In one embodiment, the predetermined period may be 60 seconds.

圖6(A)是本創作一實施例的步驟S44的細部流程示意圖,其用於說明第一外觀資訊的偵測的細節,並請同時參考圖1至圖5。如圖6(A)所示,當步驟S41及S42執行後(即材料20被加熱後),步驟S441被執行,溫度感應器40持續偵測材料20的溫度。之後步驟S442被執行,當材料20被加熱至一第一預設溫度時, 光學偵測器50偵測材料20的第一外觀資訊;換言之,當溫度感應器40偵測到材料20的溫度為第一預設溫度時,光學偵測器50偵測材料20的外觀資訊(例如此時材料20的顏色),並將偵測結果設定為第一外觀資訊。之後步驟S443被執行,材料狀態監控器60取得第一外觀資訊。藉此,第一外觀資訊的偵測可被完成。 FIG. 6(A) is a detailed flowchart of step S44 in an embodiment of the present invention, which is used to describe the details of the detection of the first appearance information, and please refer to FIGS. 1 to 5 at the same time. As shown in FIG. 6(A) , after steps S41 and S42 are performed (ie, after the material 20 is heated), step S441 is performed, and the temperature sensor 40 continues to detect the temperature of the material 20 . Then step S442 is executed, when the material 20 is heated to a first preset temperature, The optical detector 50 detects the first appearance information of the material 20; in other words, when the temperature sensor 40 detects that the temperature of the material 20 is the first preset temperature, the optical detector 50 detects the appearance information of the material 20 ( For example, the color of the material 20 at this time), and the detection result is set as the first appearance information. After that, step S443 is executed, and the material state monitor 60 obtains the first appearance information. Thereby, the detection of the first appearance information can be completed.

步驟S441至S443的目的是為了分析材料20於加熱後的外觀變化,亦即材料20於加熱後的外觀變化作為判斷材料20的狀態的依據之一。 The purpose of steps S441 to S443 is to analyze the appearance change of the material 20 after heating, that is, the appearance change of the material 20 after heating is used as one of the basis for judging the state of the material 20 .

在一實施例中,「持續偵測材料20的溫度」包含了間隔偵測的態樣,且不限於此。 In one embodiment, "continuously detecting the temperature of the material 20" includes the aspect of interval detection, but is not limited thereto.

在一實施例中,第一預設溫度可預先被設定,並且可依照需求而更改。在一實施例中,第一預設溫度為30度,且不限於此。 In one embodiment, the first preset temperature can be preset and can be changed according to requirements. In one embodiment, the first preset temperature is 30 degrees, but not limited thereto.

此外,在一些實施例中,為了使材料狀態監控器60判斷更為精準,光學式材料檢測裝置1可使用材料20的更多物理特性作為依據。圖6(B)是本創作另一實施例的步驟S44的細部流程示意圖,其用於說明第一外觀資訊與一第二外觀資訊的偵測的細節,並請同時參考圖1至圖6(A)。如圖6(B)所示,本實施例亦執行步驟S441至S443,由於步驟S441至S443的細節已於圖6(A)的實施例中說明,故在此不再詳述。 In addition, in some embodiments, in order to make the determination of the material state monitor 60 more accurate, the optical material detection device 1 may use more physical properties of the material 20 as a basis. FIG. 6(B) is a detailed flowchart of step S44 in another embodiment of the present invention, which is used to describe the details of the detection of the first appearance information and a second appearance information, and please refer to FIGS. 1 to 6 ( A). As shown in FIG. 6(B), this embodiment also executes steps S441 to S443. Since the details of steps S441 to S443 have been described in the embodiment of FIG. 6(A), they are not described in detail here.

當步驟S441至S443執行後,步驟S444被執行,加熱器30停止加熱或持續加熱一段期間。之後步驟S445被執行,當材料20由第一預設溫度改變(冷卻或加熱)至一第二預設溫度時,光學偵測器50偵測第二外觀資訊(例如此時材料20的顏色);換言之,當溫度感應器40量測到材料20的溫度為第二預設溫度時,光學偵測器50將再次偵測材料20的外觀資訊,並將量測偵測到的外觀資訊設定為 第二外觀資訊。之後步驟S446被執行,材料狀態監控器60取得第二外觀資訊。藉此,第二外觀資訊的偵測可被完成。 After steps S441 to S443 are performed, step S444 is performed, and the heater 30 stops heating or continues heating for a period of time. Then step S445 is executed. When the material 20 is changed (cooled or heated) from the first predetermined temperature to a second predetermined temperature, the optical detector 50 detects the second appearance information (such as the color of the material 20 at this time) In other words, when the temperature sensor 40 measures the temperature of the material 20 as the second preset temperature, the optical detector 50 will detect the appearance information of the material 20 again, and set the measured appearance information as Second appearance information. After that, step S446 is executed, and the material state monitor 60 obtains the second appearance information. Thereby, the detection of the second appearance information can be completed.

步驟S444至S446的目的是為了分析材料20於溫度改變(例如冷熱交替)的環境下的外觀變化,亦即材料20於加熱或冷卻後的外觀特性作為判斷材料20的狀態的依據之一。 The purpose of steps S444 to S446 is to analyze the appearance change of the material 20 under the environment of temperature change (eg, alternating hot and cold), that is, the appearance characteristics of the material 20 after heating or cooling as one of the basis for judging the state of the material 20 .

在一實施例中,當材料20於步驟S444為持續加熱時,第二預設溫度可大於第一預設溫度,且不限於此。在一實施例中,當材料20於步驟S444為停止加熱時(例如材料20冷卻的情況),第二預設溫度可小於第一預設溫度,且不限於此。在一實施例中,第二預設溫度可預先被設定及儲存於噴頭裝置10中,並且可依照需求而更改。在一實施例中,第二預設溫度可為45度,且不限於此。 In one embodiment, when the material 20 is continuously heated in step S444, the second predetermined temperature may be greater than the first predetermined temperature, but is not limited thereto. In one embodiment, when the heating of the material 20 is stopped in step S444 (for example, when the material 20 is cooled), the second predetermined temperature may be lower than the first predetermined temperature, but is not limited thereto. In one embodiment, the second preset temperature can be preset and stored in the shower head device 10, and can be changed according to requirements. In one embodiment, the second preset temperature may be 45 degrees, but is not limited thereto.

在一實施例中,當材料20被冷卻時,「第一預設溫度改變至第二預設溫度」可透過持續移動材料20進出偵測模組10的材料入口123(a)而實現,舉例來說,該等轉輪124可持續地以不同方向轉動,使得材料20的至少一部分可持續地進出材料入口123(a),進而材料20的溫度可迅速下降。 In one embodiment, when the material 20 is cooled, "change from the first preset temperature to the second preset temperature" can be achieved by continuously moving the material 20 in and out of the material inlet 123(a) of the detection module 10, for example In other words, the wheels 124 can be continuously rotated in different directions so that at least a portion of the material 20 can be continuously moved in and out of the material inlet 123(a), and the temperature of the material 20 can drop rapidly.

在一實施例中,當材料20被冷卻時,「第一預設溫度改變至第二預設溫度」可透過在噴頭裝置10中設置一冷卻裝置來達成。在一實施例中,冷卻裝置可設置於外殼121周圍或埋入於外殼121之中,並根據微控制器的命令而對外殼121及外殼121內的材料20進行冷卻,但不限於此。在一實施例中,冷卻裝置可由冷卻器、可降溫的電子元件、可降溫的氣體供應元件(例如壓縮氣體或低溫氣體)、可降溫的熱源分散元件(例如風扇)等來實現,且不限於此。 In one embodiment, when the material 20 is cooled, the "change from the first preset temperature to the second preset temperature" can be achieved by providing a cooling device in the shower head device 10 . In one embodiment, the cooling device may be disposed around the casing 121 or embedded in the casing 121, and cool the casing 121 and the material 20 in the casing 121 according to the commands of the microcontroller, but not limited thereto. In one embodiment, the cooling device can be implemented by a cooler, a temperature-reducing electronic component, a cooling-cooling gas supplying component (such as compressed gas or low-temperature gas), a cooling-cooling heat source dispersing component (such as a fan), etc., and are not limited to this.

此外,若第二外觀資訊被作為光學式材料檢測裝置1的一依據,則每個標籤編碼80可進一步包含一第二外觀資訊的資料。 In addition, if the second appearance information is used as a basis for the optical material detection device 1, each label code 80 may further include data of the second appearance information.

藉此,當材料狀態監控器60接收到溫度變化量、第一外觀資訊及第二外觀資訊時,即可執行步驟S45來判斷材料20的狀態。 In this way, when the material state monitor 60 receives the temperature change amount, the first appearance information and the second appearance information, step S45 can be executed to determine the state of the material 20 .

圖7(A)是本創作一實施例的步驟S45的細部流程示意圖,其用於說明材料20的狀態的判斷的細節,並請同時參考圖1至圖6(B)。首先步驟S451被執行,材料狀態監控器60取得溫度變化量及第一外觀資訊。之後步驟S452被執行,材料狀態監控器60找出溫度變化量及第一外觀資訊所對應的標籤編碼80。之後步驟S453被執行,材料狀態監控器60根據標籤編碼80判斷材料20為正常狀態或異常狀態。 FIG. 7(A) is a detailed flowchart of step S45 in an embodiment of the present invention, which is used to explain the details of the determination of the state of the material 20 , and please refer to FIGS. 1 to 6(B) at the same time. First, step S451 is executed, and the material state monitor 60 obtains the temperature change amount and the first appearance information. After that, step S452 is executed, and the material state monitor 60 finds out the temperature change amount and the label code 80 corresponding to the first appearance information. After that, step S453 is executed, and the material state monitor 60 determines whether the material 20 is in a normal state or an abnormal state according to the label code 80 .

圖7(B)是本創作另一實施例的步驟S45的細部流程示意圖,並請同時參考圖1至圖7(A)。首先步驟S451被執行,材料狀態監控器60取得溫度變化量、第一外觀資訊及第二外觀資訊。之後步驟S452被執行,材料狀態監控器60找出溫度變化量、第一外觀資訊及第二外觀資訊所對應的標籤編碼80。之後步驟S453被執行,材料狀態監控器60根據標籤編碼80決定材料20為正常狀態或異常狀態。 FIG. 7(B) is a schematic diagram of a detailed flow of step S45 in another embodiment of the present invention, and please refer to FIGS. 1 to 7(A) at the same time. First, step S451 is executed, and the material state monitor 60 obtains the temperature change amount, the first appearance information and the second appearance information. After that, step S452 is executed, and the material state monitor 60 finds out the temperature change amount, the label codes 80 corresponding to the first appearance information and the second appearance information. After that, step S453 is executed, and the material state monitor 60 determines whether the material 20 is in a normal state or an abnormal state according to the label code 80 .

藉此,當材料20為異常狀態時,材料狀態監控器60可立即告知使用者,因此可避免盜版或錯誤規格材料被使用。此外,本創作亦可確保列印任務的材料的正確性,例如當錯誤的材料被使用時,光學式材料檢測裝置1亦可即時察覺,避免列印任務失敗。另外,本創作亦具備使用上的方便性,使用者隨時可進行材料的檢測。 In this way, when the material 20 is in an abnormal state, the material state monitor 60 can immediately notify the user, thereby preventing pirated or wrong-standard materials from being used. In addition, the present invention can also ensure the correctness of the materials of the printing task. For example, when the wrong materials are used, the optical material detection device 1 can also detect immediately, so as to avoid the failure of the printing task. In addition, this creation is also convenient to use, and users can test materials at any time.

上述實施例僅係為了方便說明而舉例而已,本創作所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are only examples for the convenience of description, and the scope of rights claimed in this creation should be based on the scope of the patent application, rather than being limited to the above-mentioned embodiments.

1:光學式材料檢測裝置 1: Optical material detection device

10:偵測模組 10: Detection module

14:加熱喉管 14: Heating the throat

20:材料 20: Materials

30:加熱器 30: Heater

40:溫度感應器 40: temperature sensor

60:材料狀態監控器 60:Material Condition Monitor

90:顯示器 90: Monitor

Claims (10)

一種光學式材料檢測裝置(1),包含:一偵測模組(10),包含一材料人口(123a)及一光學偵測器(50),其中該材料入口(123a)供一材料(20)進入,該光學偵測器(50)用於偵測該材料(20)的一第一外觀資訊;一加熱器(30),用於對該材料(20)進行加熱;一溫度感應器(40),用於偵測該材料(20)的一溫度變化量;以及一材料狀態監控器(60),用於根據該溫度變化量及該第一外觀資訊判斷該材料(20)的狀態。 An optical material detection device (1), comprising: a detection module (10), comprising a material inlet (123a) and an optical detector (50), wherein the material inlet (123a) supplies a material (20) ) enters, the optical detector (50) is used to detect a first appearance information of the material (20); a heater (30) is used to heat the material (20); a temperature sensor ( 40) for detecting a temperature change of the material (20); and a material state monitor (60) for judging the state of the material (20) according to the temperature change and the first appearance information. 如請求項1所述的光學式材料檢測裝置(1),其中該溫度感應器(40)是配置為當該材料(20)被持續加熱一段預設期間時,偵測該溫度變化量。 The optical material detection device (1) according to claim 1, wherein the temperature sensor (40) is configured to detect the temperature change when the material (20) is continuously heated for a predetermined period of time. 如請求項1所述的光學式材料檢測裝置(1),其中該光學偵測器(50)是配置為當該材料(20)被加熱至一第一預設溫度時,偵測該第一外觀資訊。 The optical material detection device (1) according to claim 1, wherein the optical detector (50) is configured to detect the first predetermined temperature when the material (20) is heated to a first predetermined temperature Appearance information. 如請求項3所述的光學式材料檢測裝置(1),其中該光學偵測器(50)更配置為當該材料(20)由該第一預設溫度改變至一第二預設溫度時,偵測一第二外觀資訊,並且該材料狀態監控器(60)更根據該溫度變化量、該第一外觀資訊及該第二外觀資訊判斷該材料(20)的狀態。 The optical material detection device (1) according to claim 3, wherein the optical detector (50) is further configured when the material (20) changes from the first predetermined temperature to a second predetermined temperature , detecting a second appearance information, and the material state monitor (60) further judges the state of the material (20) according to the temperature change amount, the first appearance information and the second appearance information. 如請求項4所述的光學式材料檢測裝置(1),其中該第一預設溫度改變至該第二預設溫度的實現方式是透過持續移動該材料(20)進出該材料入口(123a)而實現。 The optical material detection device (1) according to claim 4, wherein the change from the first preset temperature to the second preset temperature is achieved by continuously moving the material (20) into and out of the material inlet (123a) and realize. 如請求項1所述的光學式材料檢測裝置(1),其中該偵測模組(10)更包含複數個轉輪(124),用於輸送該材料(20),部分該等轉輪(124)之間具有一間隔區域(128),其中該材料(20)露出於該間隔區域(128),且該光學偵測器(50)設置於鄰近該間隔區域(128)。 The optical material detection device (1) according to claim 1, wherein the detection module (10) further comprises a plurality of runners (124) for conveying the material (20), and some of the runners ( 124) there is a spacer region (128), wherein the material (20) is exposed in the spacer region (128), and the optical detector (50) is disposed adjacent to the spacer region (128). 如請求項1所述的光學式材料檢測裝置(1),其中該偵測模組(10)包含一材料出口(123b),且該材料出口(123b)連接一加熱喉管(14)。 The optical material detection device (1) according to claim 1, wherein the detection module (10) comprises a material outlet (123b), and the material outlet (123b) is connected to a heating pipe (14). 如請求項1所述的光學式材料檢測裝置(1),其中更包含一記憶體(70),用於儲存複數個標籤編碼(80)·其中每個標籤編碼(80)對應一溫度變化量範圍及一外觀資訊,且每個標籤編碼(80)代表一正常狀態或一異常狀態,並且該材料狀態監控器(60)找出與該溫度變化值及該第一外觀資訊相對應的一標籤編碼(80)進行比對,並根據該標籤編碼(80)判斷該材料(20)的狀態。 The optical material detection device (1) according to claim 1, further comprising a memory (70) for storing a plurality of label codes (80), wherein each label code (80) corresponds to a temperature change range and an appearance information, and each label code (80) represents a normal state or an abnormal state, and the material state monitor (60) finds a label corresponding to the temperature change value and the first appearance information The code (80) is compared, and the state of the material (20) is judged according to the label code (80). 如請求項1所述的光學式材料檢測裝置(1),其中該材料(20)是一線材,適用於一二維平面列印裝置、一三維空間積層製造裝置或一n維空間積層製造裝置,其中n為大於3的正整數。 The optical material detection device (1) according to claim 1, wherein the material (20) is a wire, which is suitable for a two-dimensional plane printing device, a three-dimensional spatial layer manufacturing device or an n-dimensional spatial layer manufacturing device , where n is a positive integer greater than 3. 一種偵測模組(10),用於一光學式材料檢測裝置(1),包含:一材料入口(123a),用於供一材料(20)進入;一光學偵測器(50),用於偵測該材料(20)的一第一外觀資訊;其中,該光學式材料檢測裝置(1)更包含一加熱器(30)、一溫度感應器(40)及一材料狀態監控器(60),該加熱器(30)用於對該材料(20)進行加熱,該溫度感應器(40)用於偵測該材料(20)的一溫度變化量,該材料狀態監控器(60)用於根據該溫度變化量及該第一外觀資訊判斷該材料(20)的狀態。 A detection module (10) for an optical material detection device (1), comprising: a material inlet (123a) for entering a material (20); an optical detector (50) for for detecting a first appearance information of the material (20); wherein, the optical material detection device (1) further comprises a heater (30), a temperature sensor (40) and a material state monitor (60) ), the heater (30) is used to heat the material (20), the temperature sensor (40) is used to detect a temperature change of the material (20), and the material state monitor (60) uses The state of the material (20) is judged according to the temperature change amount and the first appearance information.
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