TWM621523U - Compound metal lid for semiconductor chip package - Google Patents

Abstract

A compound metal lid for semiconductor chip package includes a first cover and a second cover. The first cover has a first frame body, a plurality of riveting holes and an upper opening. The riveting holes pass through the first frame body and are distributed symmetrically on the first frame body. The upper opening is formed in the first frame body and at inner side of the riveting holes. The second cover has a second frame body, a plurality of riveting protrusions and a lower opening. The riveting protrusions are formed on the upper surface of the second frame body. The lower opening is formed in and through the second frame body. The first cover is disposed on the second cover. The riveting protrusions are riveted in the riveting holes correspondingly.

Description

Composite metal cover for semiconductor wafer packaging

The present invention relates to a composite metal cover plate for semiconductor chip packaging, in particular to a composite metal cover plate, which is formed by combining two metal plates of different materials or the same material, and is arranged on the surface of the semiconductor chip packaging structure. on the carrier board.

After the wafer is fabricated, the wafer needs to be cut into small dies or bare chips, such as processor cores, and then the dies are packaged on a semiconductor substrate. , the carrier board can be regarded as a smaller and more precise printed circuit board. Dies are usually packaged on a substrate by flip-chip technology. In order to avoid warpage of the carrier board in the subsequent process, and to enhance the heat dissipation function of the die, a top cover is usually provided above the carrier board, which is called an integrated heat spreader (IHS).

However, as the size of the wafer becomes larger, the size of the substrate also becomes larger. At present, the single-piece top cover cannot prevent the warpage of the carrier board. On the other hand, some top covers are square-shaped, so that the surface of the die is directly exposed.

Therefore, how to improve the structural strength of the composite metal cover for semiconductor chip packaging to prevent the carrier from warping has become an issue to be solved in this technical field.

The technical problem to be solved by this creation is to provide a composite metal cover plate for semiconductor chip packaging in view of the shortcomings of the prior art, which can be applied to larger-sized semiconductor chips and their carrier boards, so as to improve the overall structural strength of the carrier board. And prevent the carrier from warping.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted in this creation is to provide a composite metal cover plate for semiconductor chip packaging, which includes a first cover plate and a second cover plate. The first cover plate has a first frame-shaped body, a plurality of riveting holes, and an upper opening, and the plurality of riveting holes penetrate the first frame-shaped body and are relatively symmetrically distributed in the first frame-shaped body a body, the upper opening is formed inside the first frame-shaped body and is located inside the plurality of riveting holes. The second cover plate has a second frame-shaped body, a plurality of riveting protrusions, and a lower opening, the plurality of riveting protrusions are distributed on the upper surface of the second frame-shaped body, and the lower opening penetrates through the ground is formed inside the second frame-shaped body. The first cover plate is placed on the upper surface of the second cover plate, and the plurality of riveting protrusions are correspondingly riveted in the plurality of riveting holes.

One of the beneficial effects of the present invention is that the composite metal cover plate for semiconductor chip packaging provided by the present invention can be placed on the upper surface of the second cover plate through the first cover plate, and uses a plurality of riveting protrusions The technical solution that parts are riveted to a plurality of riveting holes correspondingly can be applied to larger-sized semiconductor chips and their carriers, so as to improve the overall structural strength of the carrier, prevent the warpage of the carrier, and promote the function of heat dissipation.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, however, the provided drawings are only for reference and description, and are not intended to limit this creation.

The following are specific specific examples to illustrate the embodiments disclosed in the present creation, and those skilled in the art can understand the advantages and effects of the present creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present creation in detail, but the disclosed contents are not intended to limit the protection scope of the present creation.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Referring to FIG. 1 , a first embodiment of the present invention provides a composite metal cover plate 1 for semiconductor chip packaging, which includes a first cover plate 10 and a second cover plate 20 .

The first cover 10 has a first frame-shaped body 11 , a plurality of riveting holes 12 , and an upper opening 110 . The plurality of riveting holes 12 penetrate through the first frame-shaped body 11 and are symmetrically distributed in the first frame-shaped body 11 . The upper opening 110 is formed inside the first frame-shaped body 11 and located inside the plurality of riveting holes 12 .

The second cover plate 20 has a second frame-shaped body 21 , a plurality of riveting protrusions 22 , and a lower opening 210 . The plurality of riveting protrusions 22 are distributed on the upper surface of the second frame-shaped body 21 , and the lower opening 210 is formed through the second frame-shaped body 21 . The first cover plate 10 is placed on the upper surface of the second cover plate 20 , and the plurality of riveting protrusions 22 are correspondingly riveted in the plurality of riveting holes 12 .

The composite metal cover plate 1 of this embodiment is preferably, wherein the material of the first cover plate 10 is different from the material of the second cover plate 20 . For example, the first cover plate 10 is made of copper alloy or ceramics, and the second cover plate 20 is made of stainless steel. The stainless steel can enhance the structural strength of the integral composite metal cover plate 1, and the copper alloy can enhance the heat dissipation and heat conduction effect. However, the present invention is not limited thereto, and the material of the first cover plate 10 may also be the same as the material of the second cover plate 20 .

The number of the plurality of riveting holes 12 is the same as the number of the plurality of riveting protrusions 22 . Preferably, the positions of the plurality of riveting holes 12 are symmetrically distributed along any diagonal line of the first frame-shaped body 11 . In other words, taking the second cover plate 20 as an example, along the diagonal line X1 in FIG. 1 , the positions and numbers of the riveting protrusions 22 on both sides of the diagonal line X1 are relatively symmetrical. Along another diagonal line X2 in FIG. 1 , the positions and numbers of the riveting protrusions 22 on both sides of the diagonal line X2 are also relatively symmetrical. Described from another angle, the positions of the plurality of riveting holes 12 are symmetrically distributed along the vertical centerline of either side of the first frame-shaped body 11 . Therefore, the stress of the composite metal cover plate 1 of the present embodiment after being assembled is symmetrically distributed.

In this embodiment, the first frame-shaped body 11 has four inner edges 111 and four outer edges 112 , and each inner edge 111 has a protruding portion 113 protruding toward the center. The protruding portion 113 in this embodiment is a In a rectangular shape, the inner edge of the protruding portion 113 is aligned with the inner edge of the second frame-shaped body 21 . In proportion, preferably, the length of the inner edge of the protruding portion 113 is more than half of the length of the inner edge of the second frame-shaped body 21 . The four inner corners of the first frame-shaped body 11 each form a square notch 114 . This structure is beneficial to strengthen the structural strength of the integral composite metal cover plate 1 , can enhance the flatness, and avoid warping deformation. However, the present creation is not limited thereto, wherein the number of the protrusions may be at least one.

The second frame-shaped body 21 has four side frames of equal width. The second frame-shaped body 21 has four inner edges 211 and four outer edges 212 . The outer edge 112 of the first cover plate 10 is aligned with the outer edge 212 of the second cover plate 20 . In this embodiment, the width of the side frame is equal to the width between the inner edge of the protruding portion 113 of the first cover plate 10 and the outer edge of the first frame-shaped body 11 , and the plurality of riveting protruding portions 22 are located on the second frame. Each side frame of the shaped body 21 is distributed along at least two straight lines. For example, referring to the lower right side frame of the second frame-shaped body 21 in FIG. 1 , a plurality of riveting protrusions 22 are respectively distributed on the imaginary first straight line L1 , second straight line L2 and third straight line L3 . Three imaginary straight lines (L1, L2, L3) are parallel to each other.

Please refer to FIG. 2 to FIG. 4 , wherein the riveting hole 12 has an upper half hole 121 and a lower half hole 122 connected to the upper half hole 121 , the upper half hole 121 has the same diameter and is in the shape of a hollow cylinder, and the lower half hole 122 It tapers downward from the upper half hole 121 and is slightly tapered. The riveting protrusions 22 are cylindrical with equal diameters, and the diameters of the riveting protrusions 22 are smaller than or equal to the minimum diameter of the lower half hole 122 . As shown in FIG. 3 , after the first cover plate 10 and the second cover plate 20 are superimposed, before riveting, the height of the riveting convex portion 22 is approximately equal to the height of the lower half hole 122 , and the riveting convex portion 22 does not exceed the first The top surface of the frame-shaped body 11 .

As shown in FIG. 4 , during the riveting process, the center of the top surface of the riveting convex portion 22 is hammered with a pointed hammer, and the riveting convex portion 22 is concave downward from the center of the top surface and extends outward, and is approximately a bowl-shaped notch 220. The outer edge of the caulking convex portion 22 extends and abuts on the periphery of the lower half hole 122 . Thereby, the caulking convex portion 22 is caulked in the caulking hole 12 .

[Second Embodiment]

Please refer to FIG. 5 , which is an exploded view of the composite metal cover plate according to the second embodiment of the present invention. The composite metal cover plate 1a of this embodiment also has a first cover plate 10a and a second cover plate 20a, and the shapes thereof are substantially the same as those of the previous embodiment. The main difference is that the number of the riveting holes 12 and the riveting protrusions 22 is less than that of the previous embodiment.

Please refer to FIG. 6 , which is a schematic diagram of applying the composite metal cover plate of the present invention to a semiconductor chip packaging structure. The composite metal cover plate 1a is bonded to the carrier plate P, and the carrier plate P is provided with a semiconductor chip 9, which is usually a central processing unit chip. The composite metal cover plate 1 surrounds the semiconductor wafer 9 .

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the composite metal cover plate for semiconductor chip packaging provided by the present invention can be placed on the upper surface of the second cover plate through the first cover plate, and uses a plurality of riveting protrusions The technical solution that parts are riveted to a plurality of riveting holes correspondingly can be applied to larger-sized semiconductor chips and their carriers, so as to improve the overall structural strength of the carrier, prevent the warpage of the carrier, and promote the function of heat dissipation.

The contents disclosed above are only the preferred and feasible embodiments of this creation, and are not intended to limit the scope of the patent application of this creation. Therefore, any equivalent technical changes made by using the descriptions and drawings of this creation are included in the application for this creation. within the scope of the patent.

1. 1a: Composite metal cover 10, 10a: the first cover 11: The first frame body 110: upper opening 111: Inside edge 112: Outside edge 113: Projection 114: Square Notch 12: Riveting holes 121: upper half hole 122: Bottom half hole 20, 20a: Second cover 21: The second frame body 210: Lower opening 211: Inside edge 212: Outside edge 22: Riveting convex part 220: Bowl Notch X1, X2: Diagonal L1: The first straight line L2: Second straight line L3: The third straight line P: carrier board 9: Semiconductor wafer

FIG. 1 is an exploded perspective view of a composite metal cover plate for semiconductor chip packaging according to a first embodiment of the invention.

FIG. 2 is an exploded cross-sectional view of the composite metal cover according to the first embodiment of the invention.

FIG. 3 is a cross-sectional view of the composite metal cover plate according to the first embodiment of the invention before riveting.

FIG. 4 is a cross-sectional view of the composite metal cover plate according to the first embodiment of the invention after riveting.

FIG. 5 is an exploded perspective view of the composite metal cover plate according to the second embodiment of the invention before riveting.

FIG. 6 is a perspective view of the composite metal cover plate combined with the semiconductor chip package structure of the present invention.

1: Composite metal cover

10: The first cover

11: The first frame body

110: upper opening

111: Inside edge

112: Outside edge

12: Riveting holes

20: Second cover

21: The second frame body

22: Riveting convex part

210: Lower opening

211: Inside edge

212: Outside edge

X1, X2: Diagonal

L1: The first straight line

L2: Second straight line

L3: The third straight line

Claims (10)

A composite metal cover plate for semiconductor chip packaging, comprising: A first cover plate has a first frame-shaped body, a plurality of riveting holes, and an upper opening, the plurality of riveting holes penetrate the first frame-shaped body and are symmetrically distributed in the first frame-shaped body a body, the upper opening is formed inside the first frame-shaped body and located inside the plurality of riveting holes; and A second cover plate has a second frame-shaped body, a plurality of riveting protrusions, and a lower opening, the plurality of riveting protrusions are distributed on the upper surface of the second frame-shaped body, and the lower opening penetrates through the ground formed inside the second frame-shaped body; The first cover plate is placed on the upper surface of the second cover plate, and the plurality of riveting protrusions are correspondingly riveted in the plurality of riveting holes. The composite metal cover plate for semiconductor wafer packaging of claim 1, wherein the material of the first cover plate is different from the material of the second cover plate. The composite metal cover plate for semiconductor wafer packaging according to claim 2, wherein the first cover plate is made of copper alloy or ceramics, and the second cover plate is made of stainless steel. The composite metal cover plate for semiconductor wafer packaging according to claim 1, wherein the number of the plurality of riveting holes is the same as the number of the plurality of riveting protrusions, and the positions of the plurality of riveting holes are along the Any diagonal line of the first frame-shaped body is symmetrically distributed. The composite metal cover plate for semiconductor wafer packaging according to claim 1, wherein the number of the plurality of riveting holes is the same as the number of the plurality of riveting protrusions, and the positions of the plurality of riveting holes are along the The vertical centerlines of either side of the first frame-shaped body are symmetrically distributed. The composite metal cover plate for semiconductor chip packaging as claimed in claim 1, wherein the second frame-shaped body has four side frames of equal width, and the plurality of riveting protrusions are formed on the second frame-shaped body. Each of the side frames of the body is distributed along at least two straight lines. The composite metal cover plate for semiconductor chip packaging according to claim 1, wherein the riveting hole has an upper half hole and a lower half hole communicating with the upper half hole, and the upper half hole has the same The diameter of the lower half hole is tapered downward from the upper half hole, the riveting convex portion is cylindrical with equal diameter, and the diameter of the riveting convex portion is smaller than or equal to the minimum diameter of the lower half hole. The composite metal cover plate for semiconductor chip packaging according to claim 1, wherein the first frame-shaped body has four inner edges, and each of the inner edges has at least one protruding portion protruding toward the center, so The inner edge of the protruding portion is aligned with the inner edge of the second frame-shaped body. The composite metal cover plate for semiconductor chip packaging according to claim 8, wherein each of the four inner corners of the first frame-shaped body forms a square notch. The composite metal cover plate for semiconductor wafer packaging as claimed in claim 1, wherein the outer edge of the first cover plate is cut flush with the outer edge of the second cover plate.

Images