TWM620449U - Fingerprint recognition sensor - Google Patents
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Abstract
Description
本創作係指一種指紋辨識感測器,尤指一種整合顯示、觸控及指紋辨識之指紋辨識感測器。 This creation refers to a fingerprint recognition sensor, especially a fingerprint recognition sensor that integrates display, touch and fingerprint recognition.
現今的消費型電子產品功能日新月異,例如智慧型手機與平板上的顯示面板具有顯示、觸控與指紋辨識功能。然而,上述功能分別由不同的模組所組成,並且是以不同的積體電路(integrated circuit,IC)驅動對應的模組。在此情形下,製造商整合上述模組的複雜性較高,製造成本也隨之提高。因此,如何將上述功能整合在於同一顯示面板以及同一顆積體電路上,即成為一重要課題。 The functions of today's consumer electronic products are changing with each passing day. For example, the display panels on smartphones and tablets have display, touch, and fingerprint recognition functions. However, the above functions are composed of different modules, and different integrated circuits (ICs) drive the corresponding modules. Under this circumstance, it is more complicated for manufacturers to integrate the above-mentioned modules, and the manufacturing cost also increases accordingly. Therefore, how to integrate the above-mentioned functions on the same display panel and the same integrated circuit becomes an important issue.
因此,本創作提供一種指紋辨識感測器,以整合主動式矩陣有機發光(Active-matrix organic light-emitting diode,AMOLED)顯示器、觸控及指紋辨識之功能。 Therefore, the present invention provides a fingerprint recognition sensor to integrate the functions of an active-matrix organic light-emitting diode (AMOLED) display, touch and fingerprint recognition.
本創作實施例揭露一種指紋辨識感測器,其包含有一處理單元;以及複數個指紋辨識感測單元,其中每一指紋辨識感測單元包含有一像素發光區 域,包含至少一像素發光子區域;一金屬驅動電極層,用來產生一驅動訊號;以及一金屬接收電極層,用來接收該金屬驅動電極層所產生該驅動信號;其中該至少一像素發光子區域在一俯視圖下是由該金屬驅動電極層及該金屬接收電極層所包圍;其中當該處理單元將該複數個指紋辨識感測單元之至少一指紋辨識感測單元之金屬驅動電極層與金屬接收電極層短路時,該指紋辨識感測器被操作於一觸控模式。 This creative embodiment discloses a fingerprint recognition sensor, which includes a processing unit; and a plurality of fingerprint recognition sensing units, wherein each fingerprint recognition sensing unit includes a pixel light-emitting area The domain includes at least one pixel light-emitting sub-region; a metal driving electrode layer for generating a driving signal; and a metal receiving electrode layer for receiving the driving signal generated by the metal driving electrode layer; wherein the at least one pixel emits light The sub-area is surrounded by the metal driving electrode layer and the metal receiving electrode layer in a top view; wherein when the processing unit the metal driving electrode layer of at least one fingerprint recognition sensor unit of the plurality of fingerprint recognition sensor units and When the metal receiving electrode layer is short-circuited, the fingerprint recognition sensor is operated in a touch mode.
10:指紋辨識感測器 10: Fingerprint recognition sensor
102:處理單元 102: Processing Unit
104,304,404:指紋辨識感測單元 104, 304, 404: fingerprint recognition sensor unit
MDE:金屬驅動電極層 MDE: Metal drive electrode layer
MG:金屬斷點 MG: Metal breakpoint
MRE:金屬接收電極層 MRE: Metal receiving electrode layer
PLA:像素發光區域 PLA: pixel light emitting area
PLA_sub:像素發光子區域 PLA_sub: pixel light-emitting sub-area
PMDE_1:第一主要金屬驅動電極 PMDE_1: the first main metal drive electrode
PMDE_2:第二主要金屬驅動電極 PMDE_2: The second main metal drive electrode
PMRE_1:第一主要金屬接收電極 PMRE_1: The first main metal receiving electrode
PMRE_2:第二主要金屬接收電極 PMRE_2: The second main metal receiving electrode
R1-Rm,Rx:金屬接收電極 R1-Rm, Rx: Metal receiving electrode
SMDE:次要金屬驅動電極 SMDE: Secondary metal drive electrode
SMRE:次要金屬接收電極 SMRE: Secondary metal receiving electrode
S_1:第一邊 S_1: First side
S_2:第二邊 S_2: second side
S_3:第三邊 S_3: Third side
S_4:第四邊 S_4: Fourth side
T1-Tn,Tx:金屬驅動電極 T1-Tn, Tx: metal drive electrodes
第1圖為本創作實施例之一指紋辨識感測器之示意圖。 Figure 1 is a schematic diagram of a fingerprint recognition sensor according to one of the creative embodiments.
第2圖至第4圖為本創作實施例之一指紋辨識感測單元之示意圖。 Figures 2 to 4 are schematic diagrams of a fingerprint recognition sensing unit of one creative embodiment.
第5圖及第6圖為本創作實施例之指紋辨識感測器之堆疊示意圖。 Figures 5 and 6 are schematic diagrams of stacking the fingerprint recognition sensor of the creative embodiment.
請參考第1圖及第2圖,第1圖為本創作實施例之一指紋辨識感測器10之示意圖。指紋辨識感測器10包含有一處理單元102及複數個指紋辨識感測單元104。處理單元102可以是具有一運算功能且整合一積體電路(integrated circuit,IC)的裝置,以用來處理指紋辨識感測器10所接收的訊號,指紋辨識感測單元104耦接於處理單元102,可操作於一指紋辨識模式及可操作於一觸控模式。第2圖為指紋辨識感測器10之指紋辨識感測單元104之示意圖。指紋辨識感測單元104包含有一像素發光區域PLA、一金屬驅動電極層MDE及一金屬接收電極層MRE,其中像素發光區域PLA可以是一主動式矩陣有機發光(Active-matrix organic light-emitting diode,AMOLED)發光區域,並且包含至少一像素發光子區域PLA_sub,像素發光子區域PLA_sub可由一個發光像素或者一個以上的發光
像素所組成,並且可以是一四邊形。金屬驅動電極層MDE用來產生一驅動訊號,以及金屬接收電極層MRE用來接收金屬驅動電極層MDE所產生驅動信號。當指紋辨識感測器被處理單元102操作於一指紋辨識模式時,處理單元102可根據每一指紋辨識感測單元104之金屬接收電極層MRE所接收之來自金屬驅動電極層MDE的驅動信號,以判斷一指紋之一波峰及一波谷,並根據指紋波峰波谷的金屬驅動電極層MDE及金屬接收電極層MRE之間的電力線被破壞的程度達到指紋辨識的效果。另一方面,處理單元102也可應用於自容觸控辨識感測單元(即處理單元102可將金屬驅動電極層MDE和金屬接收電極層MRE視為同一單元,並統一進行自容觸控辨識)。如此一來,本創作實施例的指紋辨識感測器10即可將顯示、觸控及指紋辨識的功能整合於同一積體電路,並且在同一硬體架構下實現顯示、觸控及指紋辨識的功能。
Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic diagram of a
具體而言,如第2圖所示,金屬驅動電極層MDE包含有複數個金屬驅動電極T1-Tn(深色實線),而金屬接收電極層MRE包含有複數個金屬接收電極R1-Rm(淺色實線)。每一金屬驅動電極T1-Tn包含有一第一主要金屬驅動電極PMDE_1、一第二主要金屬驅動電極PMDE_2及複數個次要金屬驅動電極SMDE,其中第一主要金屬驅動電極PMDE_1沿著一第一方向設置,第二主要金屬驅動電極PMDE_2平行於第一主要金屬驅動電極PMDE_1,並且沿著第一方向設置。複數個次要金屬驅動電極SMDE沿著與第一方向垂直之一第二方向設置,並且次要金屬驅動電極SMDE之每一次要金屬驅動電極SMDE平行地設置於第一主要金屬驅動電極PMDE_1以及第二主要金屬驅動電極PMDE_2。值得注意的是,在第2圖的實施例中,第一方向與第二方向之一夾角之一內角度為90度。 Specifically, as shown in Figure 2, the metal driving electrode layer MDE includes a plurality of metal driving electrodes T1-Tn (dark solid lines), and the metal receiving electrode layer MRE includes a plurality of metal receiving electrodes R1-Rm ( Light solid line). Each metal driving electrode T1-Tn includes a first main metal driving electrode PMDE_1, a second main metal driving electrode PMDE_2, and a plurality of secondary metal driving electrodes SMDE, wherein the first main metal driving electrode PMDE_1 is along a first direction It is arranged that the second main metal driving electrode PMDE_2 is parallel to the first main metal driving electrode PMDE_1 and is arranged along the first direction. A plurality of secondary metal drive electrodes SMDE are arranged along a second direction perpendicular to the first direction, and each of the secondary metal drive electrodes SMDE is arranged in parallel to the first primary metal drive electrodes PMDE_1 and the first metal drive electrode SMDE. Two main metal driving electrode PMDE_2. It is worth noting that, in the embodiment of FIG. 2, the inner angle of the included angle between the first direction and the second direction is 90 degrees.
另一方面,每一金屬接收電極R1-Rm包含有一第一主要金屬接收電 極PMRE_1、一第二主要金屬接收電極PMRE_2及複數個次要金屬接收電極SMRE,其中第一主要金屬接收電極PMRE_1沿著第二方向設置,第二主要金屬接收電極PMRE_2平行於第一主要金屬接收電極PMRE_1,並且沿著第二方向設置。複數個次要金屬接收電極SMRE沿著第一方向設置,並且次要金屬接收電極SMRE之每一次要金屬接收電極SMRE平行地設置於第一主要金屬接收電極PMRE_1以及第二主要金屬接收電極PMRE_2。 On the other hand, each metal receiving electrode R1-Rm includes a first main metal receiving electrode Pole PMRE_1, a second primary metal receiving electrode PMRE_2, and a plurality of secondary metal receiving electrodes SMRE, wherein the first primary metal receiving electrode PMRE_1 is arranged along the second direction, and the second primary metal receiving electrode PMRE_2 is parallel to the first primary metal receiving electrode The electrode PMRE_1 is arranged along the second direction. The plurality of secondary metal receiving electrodes SMRE are arranged along the first direction, and each secondary metal receiving electrode SMRE of the secondary metal receiving electrodes SMRE is arranged in parallel on the first primary metal receiving electrode PMRE_1 and the second primary metal receiving electrode PMRE_2.
因此,在第2圖中的實施例,每一像素發光子區域PLA_sub在一俯視圖下是由金屬驅動電極層MDE及金屬接收電極層MRE所包圍。換句話說,在第2圖中的像素發光區域PLA為一矩形,每一像素發光子區域PLA_sub可由一第一邊S_1、一第二邊S_2、一第三邊S_3及一第四邊S_4所組成,並且第一邊S_1平行於第三邊S_3、第二邊S_2平行於第四邊S_4。金屬驅動電極層MDR之第一主要金屬驅動電極PMDE_1及第二主要金屬驅動電極PMDE_2分別與像素發光區域PLA之每一像素發光子區域PLA_sub之第一邊S_1及第三邊S_3平行,金屬驅動電極層MDE之次要金屬驅動電極SMDE分別與像素發光區域PLA之每一像素發光子區域PLA_sub之第二邊S_2及第四邊S_4平行。 Therefore, in the embodiment in FIG. 2, each pixel light-emitting sub-region PLA_sub is surrounded by the metal driving electrode layer MDE and the metal receiving electrode layer MRE in a top view. In other words, the pixel light-emitting area PLA in Figure 2 is a rectangle, and each pixel light-emitting sub-area PLA_sub can be defined by a first side S_1, a second side S_2, a third side S_3, and a fourth side S_4. The first side S_1 is parallel to the third side S_3, and the second side S_2 is parallel to the fourth side S_4. The first main metal driving electrode PMDE_1 and the second main metal driving electrode PMDE_2 of the metal driving electrode layer MDR are respectively parallel to the first side S_1 and the third side S_3 of each pixel light-emitting sub-region PLA_sub of the pixel light-emitting region PLA, and the metal driving electrode The secondary metal driving electrode SMDE of the layer MDE is respectively parallel to the second side S_2 and the fourth side S_4 of each pixel light-emitting sub-region PLA_sub of the pixel light-emitting region PLA.
相似地,金屬接收電極層MRE之第一主要金屬接收電極PMRE_1及第二主要金屬接收電極PMRE_2分別與像素發光區域PLA之每一像素發光子區域PLA_sub之第二邊S_2及第四邊S_4平行,金屬接收電極層MRE之次要金屬接收電極SMRE分別與像素發光區域PLA之每一像素發光子區域PLA_sub之第一邊S_1及第三邊S_3平行。 Similarly, the first main metal receiving electrode PMRE_1 and the second main metal receiving electrode PMRE_2 of the metal receiving electrode layer MRE are respectively parallel to the second side S_2 and the fourth side S_4 of each pixel light-emitting sub-region PLA_sub of the pixel light-emitting region PLA, The secondary metal receiving electrode SMRE of the metal receiving electrode layer MRE is respectively parallel to the first side S_1 and the third side S_3 of each pixel light-emitting sub-region PLA_sub of the pixel light-emitting region PLA.
除此之外,由第2圖中的實施例可以看出,每一金屬驅動電極T1-Tn 之間以及每一金屬接收電極R1-Rm之間皆包含金屬斷點MG。具體而言,金屬驅動電極T1的每一金屬驅動電極SMDE與金屬驅動電極T2的第一主要金屬驅動電極PMDE_1之間皆包含有金屬斷點MG。相似地,金屬接收電極R1的每一次要金屬接收電極SMRE與金屬接收電極R2的主要金屬接收電極PMRE_1之間包含有金屬線斷點MG。 In addition, it can be seen from the embodiment in Figure 2 that each metal driving electrode T1-Tn There is a metal break point MG therebetween and between each metal receiving electrode R1-Rm. Specifically, a metal break point MG is included between each metal driving electrode SMDE of the metal driving electrode T1 and the first main metal driving electrode PMDE_1 of the metal driving electrode T2. Similarly, each time the metal receiving electrode SMRE of the metal receiving electrode R1 and the main metal receiving electrode PMRE_1 of the metal receiving electrode R2 include a metal wire break point MG.
關於像素發光子區域PLA_sub的一形狀不限於第2圖中的矩形,在另一實施例中,像素發光子區域PLA_sub可以是一菱形。請參考第3圖,第3圖為本創作實施例之一指紋辨識感測單元304之示意圖,由於指紋辨識感測單元304為指紋辨識感測單元104的變化實施例,因此指紋辨識感測單元304沿用指紋辨識感測單元104的元件符號。與指紋辨識感測單元104不同的地方在於,指紋辨識感測單元304的每一像素發光子區域PLA_sub為菱形。
The shape of the pixel light-emitting sub-region PLA_sub is not limited to the rectangle in Figure 2. In another embodiment, the pixel light-emitting sub-region PLA_sub may be a rhombus. Please refer to Figure 3. Figure 3 is a schematic diagram of the fingerprint
值得注意的是,第一方向與第二方向之夾角之一內角度並不限於第2圖及第3圖中的實施例,而可以是任意角度。舉例來說,第一方向與第二方向之夾角之內角度可以是45度,因此第一主要金屬驅動電極PMDE_1、一第二主要金屬驅動電極PMDE_2分別與次要金屬驅動電極SMDE的夾角的內角度為45度;第一主要金屬接收電極PMRE_1、一第二主要金屬接收電極PMRE_2分別與次要金屬接收電極SMRE的夾角的內角度為45度。 It should be noted that the inner angle of the included angle between the first direction and the second direction is not limited to the embodiment shown in FIG. 2 and FIG. 3, and may be any angle. For example, the inner angle between the first direction and the second direction may be 45 degrees. Therefore, the inner angle between the first main metal driving electrode PMDE_1 and the second main metal driving electrode PMDE_2 and the secondary metal driving electrode SMDE is within 45 degrees. The angle is 45 degrees; the inner angle between the first main metal receiving electrode PMRE_1, the second main metal receiving electrode PMRE_2 and the secondary metal receiving electrode SMRE is 45 degrees.
又或者,請參考第4圖,第4圖為本創作實施例之一指紋辨識感測單元404之示意圖。在第4圖的實施例中,每一像素發光子區域PLA_sub在俯視圖下是由金屬驅動電極層MDE的金屬驅動電極Tx及金屬接收電極層MRE的金屬接收電極Rx所包圍,並根據指紋波峰波谷的金屬驅動電極層MDE及金屬接收電極
層MRE之間的電力線被破壞的程度達到指紋辨識的效果。在第4圖的實施例中,金屬驅動電極層MDE的每一金屬驅動電極Tx圍繞像素發光子區域PLA_sub,沿著第一方向連接設置、金屬接收電極層MRE的金屬接收電極Rx圍繞像素發光子區域PLA_sub,沿著第二方向連接設置,並且在俯視圖下,金屬驅動電極Tx及金屬接收電極Rx圍繞每一像素發光子區域PLA_sub呈現一平行四邊形。
Or, please refer to FIG. 4, which is a schematic diagram of a fingerprint recognition and
請參考第5圖及第6圖,第5圖及第6圖為本創作實施例之指紋辨識感測器10之堆疊示意圖。在一實施例中,本創作的指紋辨識感測器10可設置於一發光二極體的封裝層之上,並且如第5圖所示金屬驅動電極層MDE的金屬驅動電極Tx與金屬接收電極層MRE的金屬接收電極Rx可形成於同一堆疊層(即一絕緣層),或者如第6圖所示金屬驅動電極層MDE的金屬驅動電極Tx與金屬接收電極層MRE的金屬接收電極Rx可形成於不同堆疊層(即不同的絕緣層)。
Please refer to FIG. 5 and FIG. 6. FIG. 5 and FIG. 6 are schematic diagrams of stacking the
上述內容為關於本創作的指紋辨識感測器10的處理單元102將指紋辨識感測器10操作於指紋辨識模式時的實施例,由於指紋辨識感測單元的金屬驅動電極層MDE及金屬接收電極層MRE分別用來產生驅動訊號以及接收感測訊號,以實現互容式的指紋辨識感測器。
The above content is related to the embodiment when the
另一方面,當處理單元102可以分時多工方式,透過一多工器將指紋辨識感測器10操作於觸控模式,並且當指紋辨識感測器10之所有的指紋辨識感測單元之金屬驅動電極層MDE與金屬接收電極層MRE被短路時,指紋辨識感測器10之觸控模式屬於自容式。舉例而言,處理單元102可將積體電路中接收金屬驅動電極層MDE與金屬接收電極層MRE的迴路短路,以實現自容式的觸控模式。或者,當處理單元102將指紋辨識感測單元之中之至少一指紋辨識感測單元
之金屬驅動電極層MDE與金屬接收電極層MRE短路時,指紋辨識感測器10之觸控模式屬於一互容式。例如,以第3圖的實施例為例,處理單元102可以將金屬驅動電極層MDE的金屬驅動電極T1、T2短路、金屬驅動電極T3、T4短路,以實現分區互容的觸控模式。如此一來,處理單元102即可分時地控制時脈以透過同一積體電路實現顯示、觸控及指紋辨識的功能。
On the other hand, when the
值得注意的是,上述實施例描述本創作的概念,本領域的技術人員可以相應地作出適當修改並且不限於此,舉例而言,設置金屬驅動電極層與金屬接收電極層的第一方向與第二方向並不限於上述實施例的態樣、指紋辨識感測單元所包含的像素發光區域範圍或像素發光子區域的形狀等,皆可根據使用者或電子裝置的需求以進行調整。 It is worth noting that the above embodiments describe the concept of this creation. Those skilled in the art can make appropriate modifications accordingly and are not limited to this. For example, the first direction and the second direction of the metal driving electrode layer and the metal receiving electrode layer are provided. The two directions are not limited to the aspect of the above-mentioned embodiment, the range of the pixel light-emitting area or the shape of the pixel light-emitting sub-area included in the fingerprint recognition sensing unit, etc., can be adjusted according to the needs of the user or the electronic device.
綜上所述,本創作實施例提供一種指紋辨識感測器,以整合主動式矩陣有機發光顯示器、觸控及指紋辨識之功能。 In summary, this creative embodiment provides a fingerprint recognition sensor to integrate the functions of an active matrix organic light emitting display, touch control, and fingerprint recognition.
10:指紋辨識感測器 10: Fingerprint recognition sensor
102:處理單元 102: Processing Unit
104:指紋辨識感測單元 104: Fingerprint recognition sensor unit
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TWI773388B (en) * | 2021-06-17 | 2022-08-01 | 奕力科技股份有限公司 | Fingerprint recognition sensor |
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