TWM618089U - Programming and testing system for memory module - Google Patents

Programming and testing system for memory module Download PDF

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TWM618089U
TWM618089U TW110204405U TW110204405U TWM618089U TW M618089 U TWM618089 U TW M618089U TW 110204405 U TW110204405 U TW 110204405U TW 110204405 U TW110204405 U TW 110204405U TW M618089 U TWM618089 U TW M618089U
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motherboard
memory module
burning
module
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連世雄
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連世雄
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Abstract

本創作係揭露一種記憶體模組燒錄測試系統,其包括:一主機板,該主機板上設有複數主機板記憶體模組插槽,並於該些主機板記憶體模組插槽插設一轉接座,且該轉接座係供一待燒待測模組插設;以及一燒錄單元,該燒錄單元係與該轉接座透過一控制排線電性連接,且該燒錄單元係電性連接一供電單元。因此,使用者可將該待燒待測模組插設於該轉接座,先利用該燒錄單元將已儲存於該燒錄單元的SPD資料燒錄於該待燒待測模組,在不用將該待燒待測模組拔除的狀況下,直接利用該主機板進行測試。This creation discloses a memory module burning test system, which includes: a motherboard, the motherboard is provided with a plurality of motherboard memory module slots, and the motherboard memory module slots are inserted Set up an adapter, and the adapter is for a module to be burned to be tested; and a programming unit, the programming unit is electrically connected to the adapter through a control cable, and the The burning unit is electrically connected to a power supply unit. Therefore, the user can insert the module to be burned under test in the adapter, and first use the burning unit to burn the SPD data stored in the burning unit to the module under test to be burned. Without unplugging the module to be burned to be tested, directly use the motherboard for testing.

Description

記憶體模組燒錄測試系統Memory module burning test system

本創作係關於一種記憶體模組燒錄與測試之技術領域,特別係指一種可以縮短記憶體模組燒錄與測試時間之記憶體模組燒錄測試系統。This creation is related to a technical field of memory module programming and testing, especially a memory module programming and testing system that can shorten the time of memory module programming and testing.

按,記憶體模組是電腦系統正常運作的必要元件,為使記憶體模組能夠正常運作,則需要將關於記憶體模組的配置資訊(Serial Presence Detect,SPD)燒錄於記憶體模組上之電子式可清除程式化唯讀記憶體(Electrically Erasable Programmable Read-Only Memory,EEPROM)。Click, the memory module is a necessary component for the normal operation of the computer system. In order for the memory module to operate normally, it is necessary to burn the configuration information (Serial Presence Detect, SPD) of the memory module into the memory module The electronically erased programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, EEPROM).

其中,習知技術是先將待測之記憶體模組安裝在燒錄器進行對記憶體模組上之EEPROM寫入SPD資料,待燒錄完成後,需將該待測之記憶體模組自該燒錄器拔除,再插設安裝於一用於測試之主機板上進行測試。Among them, the conventional technology is to first install the memory module to be tested on the writer to write SPD data to the EEPROM on the memory module. After the programming is completed, the memory module to be tested needs to be Unplug from the writer, then plug it in and install it on a motherboard for testing for testing.

然而,在採用習知技術的過程中,作業人員需要多次的插拔待測之記憶體模組,不僅容易在插拔的過程中造成記憶體模組的損壞,尤其當待測之記憶體模組數量龐大時,確實相當費時費力。However, in the process of adopting the conventional technology, the operator needs to plug and unplug the memory module to be tested many times, which not only easily causes damage to the memory module in the process of plugging and unplugging, especially when the memory module to be tested When the number of modules is large, it is really time-consuming and laborious.

因此,綜觀以上所述,本創作之創作人歷經多年苦心潛心研究、思索並設計出一種記憶體模組燒錄測試系統,以期針對習知技術之缺失加以改善,進而增進產業上之實施利用。Therefore, in view of the above, the creator of this creation has painstakingly researched, thought about and designed a memory module burning test system for many years, hoping to improve the lack of conventional technology, and further enhance the implementation and utilization in the industry.

本創作的主要目的在於提供一種記憶體模組燒錄測試系統,將燒錄單元與插設結合於主機板之轉接座電性連接,使用者可將待燒待測模組插設於轉接座先利用燒錄單元將已儲存於燒錄單元的SPD資料燒錄於待燒待測模組,在不用將待燒待測模組拔除的狀況下,直接利用主機板進行測試,藉此減少作業人員多次插拔的過程,如此一來,不僅可提升作業效率,更能降低待燒待測模組與主機板記憶體模組插槽的損壞程度。再者,由於可利用將來作為產品的主機板進行測試,藉以達到模擬使用狀態的功效,進而提升待燒待測模組與主機板的相容性。The main purpose of this creation is to provide a memory module burning test system, which electrically connects the burning unit and the plug-in adapter on the motherboard. The user can plug the module to be tested into the switch. The socket first uses the burning unit to burn the SPD data stored in the burning unit to the module to be burned, and directly uses the motherboard for testing without removing the module to be burned. The process of multiple insertion and removal by the operator is reduced. In this way, not only can the work efficiency be improved, but also the damage degree of the module to be tested and the memory module slot of the motherboard can be reduced. Furthermore, since the motherboard that will be used as a product in the future can be used for testing, the effect of simulating the use state can be achieved, and the compatibility between the module to be tested and the motherboard can be improved.

因此,為達上述目的,本創作提供一種記憶體模組燒錄測試系統,其包括:一主機板,該主機板上設有複數主機板記憶體模組插槽,並於該些主機板記憶體模組插槽插設一轉接座,且該轉接座係供一待燒待測模組插設;以及一燒錄單元,該燒錄單元係與該轉接座透過一控制排線電性連接,且該燒錄單元係電性連接一供電單元。Therefore, in order to achieve the above objective, this invention provides a memory module burning test system, which includes: a motherboard with a plurality of motherboard memory module slots, and memory modules on the motherboard The body module slot is inserted with an adapter, and the adapter is for a module to be burned to be tested; and a programming unit, the programming unit and the adapter are connected through a control cable It is electrically connected, and the burning unit is electrically connected to a power supply unit.

承上所述之記憶體模組燒錄測試系統,其中該主機板係設置於一主機設備,且該供電單元係為該主機設備之電源供應器並與該主機板電性連接。Following the above-mentioned memory module burning test system, the motherboard is arranged in a host device, and the power supply unit is the power supply of the host device and is electrically connected to the motherboard.

承上所述之記憶體模組燒錄測試系統,其中該主機板係設有一I/O連接埠,該燒錄單元係與該I/O連接埠電性連接,藉由該I/O連接埠將該電源供應器所供應之電力傳輸至該燒錄單元。Continuing from the above-mentioned memory module burning test system, the motherboard is provided with an I/O port, the burning unit is electrically connected to the I/O port, and the I/O is connected The port transmits the power supplied by the power supply to the programming unit.

承上所述之記憶體模組燒錄測試系統,其中當該I/O連接埠係為一USB連接埠時,該燒錄單元係設置於該主機設備外部,並透過一USB傳輸線與該USB連接埠電性連接,進而令該電源供應器所供應之電力透過該USB連接埠傳輸至該燒錄單元。Continuing from the above-mentioned memory module burning test system, when the I/O port is a USB port, the burning unit is set outside the host device and communicates with the USB through a USB cable The port is electrically connected, so that the power supplied by the power supply is transmitted to the burning unit through the USB port.

承上所述之記憶體模組燒錄測試系統,其中當該I/O連接埠係為設置於該主機設備內部之連接埠時,該燒錄單元係插設結合於該I/O連接埠並電性連接,進而使該燒錄單元與該主機板電性連接,且令該電源供應器所供應之電力透過該I/O連接埠傳輸至該燒錄單元。Continuing from the above-mentioned memory module burning test system, when the I/O port is a port set inside the host device, the burning unit is plugged in and combined with the I/O port And electrically connected, so that the burning unit is electrically connected to the motherboard, and the power supplied by the power supply is transmitted to the burning unit through the I/O port.

承上所述之記憶體模組燒錄測試系統,其中該主機設備更設有一啟動單元,且該啟動單元係與該該主機板及該燒錄單元電性連接。Following the above-mentioned memory module burning test system, the host device is further provided with a starting unit, and the starting unit is electrically connected to the motherboard and the burning unit.

承上所述之記憶體模組燒錄測試系統,其中該供電單元更可為一外部電源。Following the above-mentioned memory module burning test system, the power supply unit can be an external power supply.

承上所述之記憶體模組燒錄測試系統,其中該燒錄單元更設有供一標準模組插設之燒錄單元記憶體模組插槽。Following the above-mentioned memory module burning test system, the burning unit is further provided with a burning unit memory module slot for inserting a standard module.

綜上所述,本案不但在空間型態上確屬創新,並能較習用物品增進上述多項功效,應已充分符合新穎性及進步性之法定新型專利要件,爰依法提出申請,懇請 貴局核准本件新型專利申請案,以勵創作,至感德便。To sum up, this case is not only innovative in terms of spatial form, but also can improve the above-mentioned multiple functions compared with conventional items. It should fully meet the new and progressive statutory new patent requirements. An application is filed in accordance with the law, and you are requested to approve it. This new type patent application is to encourage creation, and it is easy to feel the virtue.

以下根據第1至7圖,而說明本創作的實施方式。該說明並非為限制本創作的實施方式,而為本創作之實施例的一種,且於圖式及實施例中,相同或相似的圖式標號在所有圖式中皆指相同、實質相同、或功能相同的部件和元件。圖式為一簡化形式,且於所有實施例中,圖式不是依照精確的尺寸所繪製。The following describes the implementation of this creation based on Figures 1 to 7. This description is not intended to limit the implementation of this creation, but is a kind of embodiment of the creation, and in the drawings and embodiments, the same or similar drawing symbols in all drawings refer to the same, substantially the same, or Parts and components with the same function. The drawing is a simplified form, and in all the embodiments, the drawing is not drawn according to precise dimensions.

首先,請同時參閱第1至6圖所示,本創作係提供一種記憶體模組燒錄測試系統10,其包括:一主機板11,該主機板11上設有複數主機板記憶體模組插槽111,並於該些主機板記憶體模組插槽111插設一轉接座12,且該轉接座12係供一待燒待測模組13插設;以及一燒錄單元14,該燒錄單元14係與該轉接座12透過一控制排線15電性連接,且該燒錄單元14係電性連接一供電單元16。First of all, please refer to Figures 1 to 6 at the same time. The author provides a memory module burning test system 10, which includes: a motherboard 11 on which a plurality of motherboard memory modules are arranged Slot 111, and insert an adapter 12 into the motherboard memory module slots 111, and the adapter 12 is for inserting a test module 13 to be burned; and a programming unit 14 The burning unit 14 is electrically connected to the adapter 12 through a control cable 15, and the burning unit 14 is electrically connected to a power supply unit 16.

其中,又如第3至6圖所示,該轉接座12之一側具有一插設於該主機板11之主機板記憶體模組插槽111之連接介面121,而另一側具有一供該待燒待測模組13插設之轉接座記憶體模組插槽122。Wherein, as shown in Figures 3 to 6, one side of the adapter 12 has a connection interface 121 inserted into the motherboard memory module slot 111 of the motherboard 11, and the other side has a connection interface 121 The adapter memory module slot 122 for the module 13 to be burnt to be tested is inserted into.

再者,該主機板11係設置於一主機設備(圖未示),且該供電單元16係為該主機設備之電源供應器(圖未示)並與該主機板11電性連接,藉以提供電源,而該主機板11係設有一I/O連接埠,該燒錄單元14係與該I/O連接埠電性連接,藉由該I/O連接埠將該電源供應器所供應之電力傳輸至該燒錄單元14,其中當該I/O連接埠係為一USB連接埠112時,該燒錄單元14係以一獨立設備之形式電性連接於該主機設備外部,並透過一USB傳輸線與該USB連接埠112電性連接,進而令該電源供應器所供應之電力透過該USB連接埠112傳輸至該燒錄單元14;或者,當該I/O連接埠係為設置於該主機設備內部之連接埠(例如:PCI連接座113、PCIe連接座、M.2連接座…等)時,該燒錄單元14係以一板體形式直接插設於該I/O連接埠電性連接,進而使該燒錄單元14與該主機板11電性連接,且令該電源供應器所供應之電力透過該PCI連接座113傳輸至該燒錄單元14。然而,不論是何種形式之燒錄單元14,更可與一作為供電單元16之外部電源(例如:市電)電性連接,如此一來,即使在該主機板11未進行工作時,仍可將該燒錄單元14所存有之SPD資料燒錄至該待燒待測模組13進行燒錄程序,而不進行測試程序。Furthermore, the motherboard 11 is set in a host device (not shown), and the power supply unit 16 is a power supply (not shown) of the host device and is electrically connected to the motherboard 11 to provide Power, and the motherboard 11 is provided with an I/O port, the programming unit 14 is electrically connected to the I/O port, and the power supplied by the power supply is provided through the I/O port It is transmitted to the burning unit 14. When the I/O port is a USB port 112, the burning unit 14 is electrically connected to the outside of the host device in the form of an independent device, and through a USB The transmission line is electrically connected to the USB port 112, so that the power supplied by the power supply is transmitted to the burning unit 14 through the USB port 112; or, when the I/O port is set to the host When the internal ports of the device (for example: PCI connector 113, PCIe connector, M.2 connector... etc.), the programming unit 14 is directly plugged into the I/O port in the form of a board. The connection further makes the burning unit 14 and the motherboard 11 electrically connected, and the power supplied by the power supply is transmitted to the burning unit 14 through the PCI connector 113. However, no matter what type of programming unit 14 is, it can also be electrically connected to an external power supply (for example: mains) as the power supply unit 16. In this way, even when the motherboard 11 is not working, it can still be The SPD data stored in the burning unit 14 is burned to the module to be tested 13 to be burned to perform the burning process instead of the test process.

此外,該主機設備更設有一啟動單元(圖未示),且該啟動單元係與該主機板及該燒錄單元14電性連接,尤其當該燒錄單元14完成燒錄程序後,係可傳送一開機指令至該啟動單元,使該主機板11取得該電源供應器之電力並開始運作。In addition, the host device is further provided with an activation unit (not shown), and the activation unit is electrically connected to the motherboard and the programming unit 14, especially after the programming unit 14 completes the programming process, it can be A boot command is sent to the boot unit, so that the motherboard 11 obtains the power from the power supply and starts to operate.

另外,不論是上述何種實施例,其中該燒錄單元14更設有供一標準模組17插設之燒錄單元記憶體模組插槽141,以利該燒錄單元14讀取該標準模組17所具有之SPD資料並儲存。In addition, regardless of the above-mentioned embodiments, the programming unit 14 is further provided with a programming unit memory module slot 141 for inserting a standard module 17 to facilitate the programming unit 14 to read the standard The SPD data possessed by the module 17 is stored.

最後,請參閱第7圖並同時參閱第1至6圖所示,使用本創作之記憶體模組燒錄測試系統的方法,其包括:步驟S1:將該轉接座12插設於設置於該主機板11之主機板記憶體模組插槽111;步驟S2:將該待燒待測模組13插設於該轉接座12;步驟S3:進行一燒錄程序,將該燒錄單元14與該供電單元16電性連接並將所存有之SPD資料透過該控制排線15燒錄至該待燒待測模組13;以及步驟S4:進行一測試程序,透過該主機板11測試該待燒待測模組13的功能是否正常。Finally, please refer to Figure 7 and refer to Figures 1 to 6 at the same time. The method of using the memory module of this creation to burn the test system includes: Step S1: Insert the adapter 12 into the The motherboard memory module slot 111 of the motherboard 11; Step S2: Insert the test module 13 to be burned into the adapter 12; Step S3: Perform a burning process to burn the unit 14 is electrically connected to the power supply unit 16 and the stored SPD data is burned to the module to be tested 13 through the control cable 15; and step S4: a test procedure is performed to test the module through the motherboard 11 Whether the function of the test module 13 to be burned is normal.

其中,該待燒待測模組13可透過不同方式存有SPD資料,如第3及4圖所示,當燒錄單元14並未設有供該標準模組17插設之燒錄單元記憶體模組插槽141時,在將該待燒待測模組13插設於該轉接座12前,可先將一標準模組17插設於該轉接座12,並將該標準模組17所具有之SPD資料透過該控制排線15傳到該燒錄單元14儲存,而該燒錄單元14存有該SPD資料後,再將該標準模組17由該轉接座12拔除;若如第5及6圖所示,該燒錄單元14設有供該標準模組17插設之燒錄單元記憶體模組插槽141,則是在進行該燒錄程序前,可將一標準模組17插設於該燒錄單元14之插槽141,以供該燒錄單元14讀取該標準模組17所具有之SPD資料並儲存。Among them, the test module 13 to be burned can store SPD data in different ways. As shown in Figures 3 and 4, when the burning unit 14 is not equipped with a burning unit memory for the standard module 17 to plug in. When inserting the module slot 141, before inserting the module to be tested 13 into the adaptor 12, a standard module 17 can be inserted into the adaptor 12, and the standard module The SPD data of the group 17 is transmitted to the burning unit 14 through the control cable 15 for storage, and after the burning unit 14 stores the SPD data, the standard module 17 is removed from the adapter 12; If, as shown in Figures 5 and 6, the programming unit 14 is provided with a programming unit memory module slot 141 for the standard module 17 to insert, then before the programming process, a The standard module 17 is inserted into the slot 141 of the burning unit 14 for the burning unit 14 to read and store the SPD data of the standard module 17.

但不論是以上述何種方式將SPD資料儲存於該待燒待測模組13,在完成該燒錄程序後,該燒錄單元14可傳送一指令至一與該主機板11及該燒錄單元14電性連接之啟動單元(圖未示),並透過該啟動單元使該主機板11開始運作,以進行該測試程序,其中,當首次進行該測試程序前,可透過該啟動單元使該主機板11開始運作,以進行該測試程序,完成該測試程序後,可將已完成該測試程序之該待燒待測模組13自該轉接座12移除並插設未經該燒錄程序及該測試程序的該待燒待測模組13,再透過一與該燒錄單元14及該主機板11電性連接之重置單元(圖未示)再次進行該燒錄程序及該測試程序;也就是說,當完成燒錄程序及該測試程序之該待燒待測模組13自該轉接座12移除後,使用者可將未經該燒錄程序及該測試程序的該待燒待測模組13插設於該轉接座12,並按下該重置單元,以再次進行該燒錄程序及該測試程序。However, no matter what method is used to store the SPD data in the test module 13 to be burned, after the burning process is completed, the burning unit 14 can send a command to the motherboard 11 and the burning The unit 14 is electrically connected to the activation unit (not shown), and the motherboard 11 is started to operate through the activation unit to perform the test procedure. Before the test procedure is performed for the first time, the activation unit can be used to enable the The motherboard 11 starts to operate to perform the test procedure. After the test procedure is completed, the module to be tested 13 that has completed the test procedure can be removed from the adapter 12 and inserted without the programming The program and the test program of the module 13 to be burned are then used to perform the burning process and the test again through a reset unit (not shown) electrically connected to the burning unit 14 and the motherboard 11 Program; that is, when the module to be tested 13 to be burned is removed from the adapter 12 after the completion of the burning process and the test process, the user can remove the burning process and the test process without the The module to be tested 13 to be burned is inserted into the adapter 12, and the reset unit is pressed to perform the burn procedure and the test procedure again.

故本創作確實提供一種記憶體模組燒錄測試系統,將燒錄單元與插設結合於主機板之轉接座電性連接,使用者可將待燒待測模組插設於轉接座先利用燒錄單元將已儲存於燒錄單元的SPD資料燒錄於待燒待測模組,在不用將待燒待測模組拔除的狀況下,直接利用主機板進行測試,藉此減少作業人員多次插拔的過程,如此一來,不僅可提升作業效率,更能降低待燒待測模組與主機板記憶體模組插槽的損壞程度。再者,由於可利用將來作為產品的主機板進行測試,藉以達到模擬使用狀態的功效,進而提升待燒待測模組與主機板的相容性。Therefore, this creation does provide a memory module burning test system, which electrically connects the burning unit and the plug-in adapter to the socket of the motherboard, and the user can plug the module to be burned into the socket. First use the burning unit to burn the SPD data stored in the burning unit to the module to be tested, and directly use the motherboard for testing without removing the module to be tested, thereby reducing work The process of multiple insertion and removal by personnel, in this way, not only improves work efficiency, but also reduces the damage to the module to be tested and the motherboard memory module slot. Furthermore, since the motherboard that will be used as a product in the future can be used for testing, the effect of simulating the use state can be achieved, and the compatibility between the module to be tested and the motherboard can be improved.

惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍,即凡依本創作申請專利範圍及創作說明內容所作簡單的等效變化與修飾,皆仍屬本創作專利涵蓋之範圍內。However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation, that is, all simple equivalent changes and modifications made according to the scope of patent application and creation description of this creation are all It is still within the scope of this creation patent.

10:記憶體模組燒錄測試系統 11:主機板 111:主機板記憶體模組插槽 112:USB連接埠 113:PCI連接座 12:轉接座 121:連接介面 122:轉接座記憶體模組插槽 13:待燒待測模組 14:燒錄單元 141:燒錄單元記憶體模組插槽 15:控制排線 16:供電單元 17:標準模組 S1~S4:步驟10: Memory module burning test system 11: Motherboard 111: Motherboard memory module slot 112: USB port 113: PCI connector 12: Adapter 121: connection interface 122: Adapter memory module slot 13: Module to be burned and tested 14: Burning unit 141: Burning unit memory module slot 15: Control cable 16: power supply unit 17: Standard module S1~S4: steps

第1圖為本創作之記憶體模組燒錄測試系統之第一架構示意圖。 第2圖為本創作之記憶體模組燒錄測試系統之第二架構示意圖。 第3圖為本創作之記憶體模組燒錄測試系統的第一分解示意圖。 第4圖為本創作之記憶體模組燒錄測試系統的第二分解示意圖。 第5圖為本創作之記憶體模組燒錄測試系統的第三分解示意圖。 第6圖為本創作之記憶體模組燒錄測試系統的第四分解示意圖。 第7圖為本創作之記憶體模組燒錄測試系統的使用方法流程圖。 Figure 1 is a schematic diagram of the first architecture of the created memory module burning test system. Figure 2 is a schematic diagram of the second architecture of the created memory module burning test system. Figure 3 is the first exploded schematic diagram of the created memory module burning test system. Figure 4 is the second exploded schematic diagram of the created memory module burning test system. Figure 5 is the third exploded schematic diagram of the created memory module burning test system. Figure 6 is the fourth exploded schematic diagram of the created memory module burning test system. Figure 7 is a flow chart of how to use the created memory module burning test system.

10:記憶體模組燒錄測試系統 10: Memory module burning test system

11:主機板 11: Motherboard

111:主機板記憶體模組插槽 111: Motherboard memory module slot

112:USB連接埠 112: USB port

12:轉接座 12: Adapter

121:連接介面 121: connection interface

122:轉接座記憶體模組插槽 122: Adapter memory module slot

13:待燒待測模組 13: Module to be burned and tested

14:燒錄單元 14: Burning unit

15:控制排線 15: Control cable

Claims (8)

一種記憶體模組燒錄測試系統,其包括:一主機板,該主機板上設有複數主機板記憶體模組插槽,並於該些主機板記憶體模組插槽插設一轉接座,且該轉接座係供一待燒待測模組插設;以及一燒錄單元,該燒錄單元係與該轉接座透過一控制排線電性連接,且該燒錄單元係電性連接一供電單元。 A memory module burning test system, comprising: a motherboard, the motherboard is provided with a plurality of motherboard memory module slots, and a transfer is inserted into the motherboard memory module slots Socket, and the adapter socket is for inserting a module to be tested; and a programming unit, the programming unit is electrically connected to the adapter socket through a control cable, and the programming unit is Electrically connected to a power supply unit. 如請求項1所述之記憶體模組燒錄測試系統,其中該主機板係設置於一主機設備,且該供電單元係為該主機設備之電源供應器並與該主機板電性連接。 The memory module burning test system according to claim 1, wherein the motherboard is set in a host device, and the power supply unit is a power supply of the host device and is electrically connected to the motherboard. 如請求項2所述之記憶體模組燒錄測試系統,其中該主機板係設有一I/O連接埠,該燒錄單元係與該I/O連接埠電性連接,藉由該I/O連接埠將該電源供應器所供應之電力傳輸至該燒錄單元。 The memory module programming test system of claim 2, wherein the motherboard is provided with an I/O port, the programming unit is electrically connected to the I/O port, and the I/O port is electrically connected through the I/O port. The O port transmits the power supplied by the power supply to the programming unit. 如請求項3所述之記憶體模組燒錄測試系統,其中當該I/O連接埠係為一USB連接埠時,該燒錄單元係設置於該主機設備外部,並透過一USB傳輸線與該USB連接埠電性連接,進而令該電源供應器所供應之電力透過該USB連接埠傳輸至該燒錄單元。 The memory module burning test system according to claim 3, wherein when the I/O port is a USB port, the burning unit is set outside the host device, and is connected to the host device through a USB transmission line The USB port is electrically connected, so that the power supplied by the power supply is transmitted to the burning unit through the USB port. 如請求項3所述之記憶體模組燒錄測試系統,其中當該I/O連接埠係為設置於該主機設備內部之連接埠時,該燒錄單元係插設結合於該I/O連接埠並電性連接,進而使該燒錄單元與該主機板電性連接,且令該電源供應器所供應之電力透過該I/O連接埠傳輸至該燒錄單元。 The memory module programming test system of claim 3, wherein when the I/O port is a port set inside the host device, the programming unit is plug-in and combined with the I/O The connection port is electrically connected in parallel, so that the burning unit is electrically connected to the motherboard, and the power supplied by the power supply is transmitted to the burning unit through the I/O connection port. 如請求項2所述之記憶體模組燒錄測試系統,其中該主機設備更設有一啟動單元,且該啟動單元係與該主機板及該燒錄單元電性連接。 The memory module programming test system according to claim 2, wherein the host device is further provided with an activation unit, and the activation unit is electrically connected to the motherboard and the programming unit. 如請求項1所述之記憶體模組燒錄測試系統,其中該供電單元更可為一外部電源。 The memory module programming test system according to claim 1, wherein the power supply unit can be an external power supply. 如請求項1至7中任一項所述之記憶體模組燒錄測試系統,其中該燒錄單元更設有供一標準模組插設之插槽。 The memory module burning test system according to any one of claims 1 to 7, wherein the burning unit is further provided with a slot for inserting a standard module.
TW110204405U 2021-04-21 2021-04-21 Programming and testing system for memory module TWM618089U (en)

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