TWM616887U - System chassis and electronic device using the same - Google Patents
System chassis and electronic device using the same Download PDFInfo
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- TWM616887U TWM616887U TW110204635U TW110204635U TWM616887U TW M616887 U TWM616887 U TW M616887U TW 110204635 U TW110204635 U TW 110204635U TW 110204635 U TW110204635 U TW 110204635U TW M616887 U TWM616887 U TW M616887U
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本創作是有關於一種電腦系統機箱,且特別是有關於一種具有更大可用的內部空間的電腦系統機箱。This creation is about a computer system case, and especially about a computer system case with a larger usable internal space.
用於計算應用的雲(也稱為資料中心)的出現,增加了對異地(off-site)安裝的需求。這些資料中心儲存資料,並運行由遠端連接電腦設備用戶存取的應用程式。這種資料中心通常具有大量的伺服器、交換機和儲存裝置來儲存和管理資料。典型的資料中心具有實體機架結構並伴隨電源和通訊連接。機架在整個資料中心的一個或多個房間內排列成行。每個機架都包含一個框架,此框架具有在兩個側壁之間垂直定向的插槽或機箱,插槽可以容納多個網絡設備,例如伺服器、交換機和儲存設備。在現代資料中心,這種機架結構中堆疊了許多這樣的網路設備。例如,一些資料中心擁有數以萬計的伺服器並伴隨儲存裝置和網路交換機。The emergence of clouds (also known as data centers) for computing applications has increased the demand for off-site installations. These data centers store data and run applications that are accessed by users of remotely connected computer devices. Such data centers usually have a large number of servers, switches, and storage devices to store and manage data. A typical data center has a physical rack structure and is accompanied by power and communication connections. The racks are arranged in rows in one or more rooms throughout the data center. Each rack contains a frame with slots or chassis oriented vertically between two side walls. The slots can accommodate multiple network devices, such as servers, switches, and storage devices. In modern data centers, many such network devices are stacked in this rack structure. For example, some data centers have tens of thousands of servers accompanied by storage devices and network switches.
通常,傳統的伺服器機箱在伺服器機箱的底部處連接至一對滑軌。例如,第1圖繪示習知伺服器機箱10的頂部透視圖。伺服器機箱10包括底板12、第一側板14及第二側板16。第一側板14包括沿著第一側板14的長度延伸的第一凹槽(recess)24以及從第一凹槽24突出的第一唇部(lip)25。第二側板16包括沿著第二側板16的長度延伸的第二凹槽26以及從第二凹槽26突出的第二唇部27。主機板50安裝在伺服器機箱10的底板12上。因此,伺服器機箱10可以容納寬度達到底板12的寬度18的主機板。Generally, a traditional server case is connected to a pair of slide rails at the bottom of the server case. For example, FIG. 1 shows a top perspective view of a
第2圖繪示安裝在伺服器機架30中的伺服器機箱10的正視圖。伺服器機架30具有第一機架壁34和相對的第二機架壁36。第一滑軌44由第一機架壁34支撐,而第二滑軌46由第二機架壁36支撐在與第一滑軌44平行的位置。第一滑軌44裝配在第一凹槽24(第1圖)內,而第二滑軌46裝配在第二凹槽26(第1圖)內,進而允許伺服器機箱10安裝在伺服器機架30中。為了容納第一滑軌44和第二滑軌46,伺服器機箱10的底板12的寬度18必須小於伺服器機架30的第一機架壁34和第二機架壁36之間的空間的寬度38。FIG. 2 shows a front view of the
存在對機箱空間的更有效利用的需求,將隨著更多組件可以插入機箱空間,以允許更快的計算性能。本公開旨在解決這些問題。There is a demand for more efficient use of chassis space, as more components can be inserted into the chassis space to allow faster computing performance. The present disclosure aims to solve these problems.
術語實施例和類似術語旨在廣義地指代本公開和以下請求項的所有主題。應當理解,包含這些術語的陳述不應限制本文該的主題或限制以下請求項的含義或範圍。本文所涵蓋的本公開的實施例由以下申請專利範圍定義而非本創作內容定義。本創作內容是本公開的各個方面的上位概述,並且介紹了一些概念,這些概念在下面的詳細描述部分中進一步描述。本創作內容並非旨在確定所要求保護的主題的關鍵或必要特徵;也不應將其單獨用於確定所要求保護的主題的範圍。透過參考本公開的整個說明書、任何或所有附圖以及每個請求項的適當部分,應當理解本主題。The terms embodiment and similar terms are intended to broadly refer to all the subjects of this disclosure and the following claims. It should be understood that statements containing these terms should not limit the subject matter herein or limit the meaning or scope of the following claims. The embodiments of the present disclosure covered herein are defined by the scope of the following patent applications instead of the creation content. This creation is a high-level overview of various aspects of the present disclosure and introduces some concepts, which are further described in the detailed description section below. This creation is not intended to determine the key or necessary features of the claimed subject matter; nor should it be used alone to determine the scope of the claimed subject matter. The subject matter should be understood by referring to the entire specification of the present disclosure, any or all drawings, and appropriate parts of each claim.
根據本公開的一些實施方式,系統機箱包括底板、第一側壁及第二側壁。底板定義系統機箱的寬度。第一側壁從底板的第一端實質上垂直地延伸。第一側壁包括從底板垂直偏移(vertically offset)的第一通道。第一通道用以與設備機架的第一導軌匹配。第二側壁從底板的第二端實質上垂直地延伸,並與第一側壁相對。第二側壁包括第二通道,該第二通道用以與設備機架的相對導軌匹配。According to some embodiments of the present disclosure, the system chassis includes a bottom plate, a first side wall, and a second side wall. The bottom plate defines the width of the system chassis. The first side wall extends substantially perpendicularly from the first end of the bottom plate. The first side wall includes a first channel vertically offset from the bottom plate. The first channel is used to match the first guide rail of the equipment rack. The second side wall extends substantially perpendicularly from the second end of the bottom plate and is opposite to the first side wall. The second side wall includes a second channel for matching with the opposite guide rail of the equipment rack.
在一些實施方式中,第一側壁定義系統機箱的高度。在一些實施方式中,第一側壁具有大約兩個機架單元的高度。在一些實施方式中,第一側壁具有約84.2mm的高度。在一些實施方式中,第一側壁的第一通道從系統機箱的底板垂直偏移約22mm。在一些實施方式中,第一側壁的第一通道相對於系統機箱的底板的第一端凹入約5mm。在一些實施方式中,第二側壁的第二通道從系統機箱的底板垂直偏移。在一些實施方式中,系統機箱經由第一通道和第二通道滑入設備機架。In some embodiments, the first side wall defines the height of the system chassis. In some embodiments, the first side wall has a height of about two rack units. In some embodiments, the first side wall has a height of about 84.2 mm. In some embodiments, the first channel of the first side wall is vertically offset from the bottom plate of the system chassis by about 22 mm. In some embodiments, the first channel of the first side wall is recessed by about 5 mm relative to the first end of the bottom plate of the system chassis. In some embodiments, the second channel of the second side wall is vertically offset from the bottom plate of the system chassis. In some embodiments, the system chassis slides into the equipment rack via the first channel and the second channel.
根據本公開的一些實施方式,一種電子系統包括第一系統機箱和設備機架。第一系統機箱包括底板、第一側壁及第二側壁。第一系統機箱的底板定義第一系統機箱的寬度。第一系統機箱的第一側壁從第一系統機箱的底板的第一端基本垂直地延伸。第一系統機箱的第一側壁包括從第一系統機箱的底板垂直偏移的第一通道。第一系統機箱的第二側壁從第一系統機箱的底板的第二端基本垂直地延伸。第一系統機箱的第二側壁與第一系統機箱的第一側壁相對。第一系統機箱的第二側壁包括從第一系統機箱的底板垂直偏移的第二通道。設備機架在第一高度具有第一對相對的導軌。第一對相對的導軌用以經由第一系統機箱的第一通道和第二通道支撐第一系統機箱。According to some embodiments of the present disclosure, an electronic system includes a first system chassis and an equipment rack. The first system chassis includes a bottom plate, a first side wall, and a second side wall. The bottom plate of the first system chassis defines the width of the first system chassis. The first side wall of the first system chassis extends substantially perpendicularly from the first end of the bottom plate of the first system chassis. The first side wall of the first system cabinet includes a first channel that is vertically offset from the bottom plate of the first system cabinet. The second side wall of the first system chassis extends substantially perpendicularly from the second end of the bottom plate of the first system chassis. The second side wall of the first system chassis is opposite to the first side wall of the first system chassis. The second side wall of the first system chassis includes a second channel that is vertically offset from the bottom plate of the first system chassis. The equipment rack has a first pair of opposed guide rails at a first height. The first pair of opposite guide rails are used for supporting the first system chassis via the first channel and the second channel of the first system chassis.
在一些實施方式中,第一系統機箱的第一側壁和第二側壁定義第一系統機箱的高度。在一些實施方式中,第一系統機箱的高度為大約兩個機架單元。在一些實施方式中,第一系統機箱的第一側壁和第二側壁中的每一個具有大約84.2mm的高度。In some embodiments, the first side wall and the second side wall of the first system chassis define the height of the first system chassis. In some embodiments, the height of the first system chassis is about two rack units. In some embodiments, each of the first side wall and the second side wall of the first system chassis has a height of about 84.2 mm.
在一些實施方式中,第一系統機箱的第一通道和第二通道從第一系統機箱的底板垂直偏移約22mm。在一些實施方式中,第一系統機箱的第一通道相對於第一系統機箱的底板的第一端凹入約5mm,且第一系統機箱的第二通道相對於第一系統機箱的底板的第二端凹入約5mm。In some embodiments, the first channel and the second channel of the first system chassis are vertically offset from the bottom plate of the first system chassis by about 22 mm. In some embodiments, the first channel of the first system chassis is recessed by about 5 mm relative to the first end of the bottom plate of the first system chassis, and the second channel of the first system chassis is relative to the first end of the bottom plate of the first system chassis. The two ends are recessed by about 5mm.
在一些實施方式中,電子系統更包括位於第一系統機箱的底板上的主機板。在一些實施方式中,主機板具有與第一系統機箱的寬度大約相同的寬度。In some embodiments, the electronic system further includes a motherboard located on the bottom plate of the first system chassis. In some embodiments, the motherboard has a width that is approximately the same as the width of the first system chassis.
在一些實施方式中,電子系統更包括第二系統機箱以及第二對相對的導軌。第二系統機箱包括底板,該底板定義第二系統機箱的底部寬度。第二對相對的導軌在第二高度處連接至設備機架。第二對相對的導軌用以支撐第二系統機箱。在一些實施方式中,第二系統機箱的底部寬度小於第一系統機箱的寬度。在一些實施方式中,第二系統機箱的底部寬度等於第一系統機箱的寬度。在一些實施方式中,第一系統機箱和第二系統機箱是相同的。In some embodiments, the electronic system further includes a second system chassis and a second pair of opposite guide rails. The second system chassis includes a bottom plate, which defines the bottom width of the second system chassis. The second pair of opposed guide rails are connected to the equipment rack at a second height. The second pair of opposite guide rails are used for supporting the second system chassis. In some embodiments, the bottom width of the second system chassis is smaller than the width of the first system chassis. In some embodiments, the bottom width of the second system chassis is equal to the width of the first system chassis. In some embodiments, the first system chassis and the second system chassis are the same.
以上創作內容並非旨在表示本公開的每個實施例或每個方面。而是,前述創作內容僅提供本文闡述的一些新穎方面和特徵的示例。當結合附圖和所附請求項來考慮時,根據用於實施本創作的代表性實施例和方式的以下詳細描述,本公開的以上特徵和優點以及其他特徵和優點將變得顯而易見。The above creation content is not intended to represent every embodiment or every aspect of the present disclosure. Rather, the foregoing creation content only provides examples of some of the novel aspects and features set forth herein. When considered in conjunction with the accompanying drawings and the appended claims, the above features and advantages and other features and advantages of the present disclosure will become apparent from the following detailed description of representative embodiments and ways for implementing the present creation.
為了對本創作之上述及其他方面有更佳的瞭解,下文特舉實施例,並匹配所附圖式詳細說明如下:In order to have a better understanding of the above-mentioned and other aspects of this creation, the following examples are specially cited and matched with the accompanying drawings to describe in detail as follows:
參考附圖描述本公開的各種實施例,其中在所有附圖中使用相似的附圖標記來表示相似或等同的元件。這些附圖未按比例繪製,且附圖僅用於說明本創作。下面參考示例性應用來描述本創作的幾個方面以進行說明。應當理解,所闡述之許多具體細節、關係和方法係用以提供完整的理解。然而,相關領域的具有通常知識者將很快體認到,可以在沒有一個或多個具體細節的情況下或者利用其他方法來實踐各種實施例。在其他情況下,未詳細示出公知的結構或操作以避免模糊各種實施例的某些方面。各種實施例不受所示出的動作或事件的排序的限制,因為一些動作可以以不同的順序發生及/或與其他動作或事件同時發生。Various embodiments of the present disclosure are described with reference to the drawings, in which like reference numerals are used in all the drawings to denote similar or equivalent elements. These drawings are not drawn to scale, and the drawings are only used to illustrate the creation. The following describes several aspects of this creation with reference to exemplary applications for illustration. It should be understood that many of the specific details, relationships and methods described are intended to provide a complete understanding. However, those with ordinary knowledge in related fields will soon realize that various embodiments can be practiced without one or more specific details or by other methods. In other cases, well-known structures or operations are not shown in detail to avoid obscuring certain aspects of the various embodiments. The various embodiments are not limited by the ordering of the actions or events shown, as some actions may occur in a different order and/or concurrently with other actions or events.
例如在新型摘要、新型內容和具體實施方式部分中揭露但未在請求項中明確闡述的元件和限制,不應通過暗示、推斷或其他方式,而被單獨或共同地併入請求項中。出於本詳細描述的目的,除非特別聲明,否則單數包括複數,反之亦然。“包括”一詞的意思是“包括但不限於此”。此外,近似的詞語,例如“大約”、“幾乎”、“基本上”、“大約”等,在本文中可例如用於表示“在”、“接近”、“接近於”、或“在3-5%內”、或“在可接受的製造公差範圍內”、或其任何邏輯組合。For example, elements and limitations disclosed in the new abstract, new content and specific implementations but not explicitly stated in the claim shall not be incorporated into the claim individually or collectively by implication, inference or other means. For the purpose of this detailed description, unless specifically stated otherwise, the singular includes the plural, and vice versa. The word "including" means "including but not limited to". In addition, approximate words, such as "about", "almost", "substantially", "approximately", etc., may be used herein, for example, to mean "at", "close to", "close to", or "at 3 -Within 5%", or "within acceptable manufacturing tolerance", or any logical combination thereof.
關於本文的揭露,術語“電腦設備”或“計算機系統”或“電腦系統”或“電腦”是指具有硬體、軟體及/或韌體的任何電子供電或電池供電的設備,其中可以將軟體及/或韌體配置為裝置上的操作功能。Regarding the disclosure of this article, the term "computer equipment" or "computer system" or "computer system" or "computer" refers to any electronic or battery-powered device with hardware, software, and/or firmware. And/or the firmware is configured as an operating function on the device.
本公開是關於一種相對於系統機箱的底板具有升高的通道(raised channel)的系統機箱。例如,當以伺服器機箱實現時,與類似尺寸的傳統伺服器機箱相比,本公開的系統機箱可以容納更寬的主機板和/或更多的電纜佈線空間。The present disclosure relates to a system chassis having a raised channel relative to the bottom plate of the system chassis. For example, when implemented as a server chassis, the system chassis of the present disclosure can accommodate a wider motherboard and/or more cable routing space than a conventional server chassis of similar size.
參照第3圖,其繪示根據本公開的一些實施方式的電子系統100的頂部透視圖。例如,電子系統100可以是伺服器、儲存設備、路由器、交換機等。電子系統100包括系統機箱110,系統機箱110具有底板112、第一側壁114及第二側壁116。底板112定義系統機箱110的寬度(由線118表示)。Referring to FIG. 3, it shows a top perspective view of the
第一側壁114從底板112的第一端111基本垂直地延伸。第一側壁114包括從底板112垂直偏移的第一通道124。在一些實施方式中,第一側壁114包括在第一通道124上方的第一上唇部125與在第一通道124下方的第一下唇部123。第一上唇部125和第一下唇部123相對於第一通道124向外(例如,朝向第一側壁114的外表面,並且遠離電子系統100的內部組件)突出。The
第二側壁116從底板的第二端113基本垂直地延伸,並與第一側壁114相對。第二側壁116包括從底板112垂直偏移的第二通道126。在一些實施方式中,第二側壁116包括在第二通道126上方的第二上唇部127與在第二通道126下方的第二下唇部129。在一些實施方式中,第二側壁116是第一側壁114的鏡像。第二上唇部127與第二下唇部129相對於第二通道126向外(例如,朝向第二側壁116的外表面,並且遠離電子系統100的內部組件)突出。The
在一些實施方式中,電子系統100包括位於系統機箱110的底板112上的主機板150。在此示例中,電子系統100可以是包括在第一散熱器152下方的第一中央處理單元(central processing unit, CPU)及在第二散熱器154下方的第二中央處理單元的伺服器。第一多個雙列直插式記憶體模組(dual in-line memory modules, DIMM)160安裝在第一散熱器152和第二散熱器154之間。第二多個DIMM 162安裝在第一散熱器152和第一側壁114之間。第三多個DIMM 164安裝在第二散熱器154和第二側壁116之間。在一些實施方式中,電子系統100更包括第一電源供應單元(power supply unit, PSU)156和第二電源供應單元 158。In some embodiments, the
參考第4圖,其繪示根據本公開的一些實施方式的安裝在設備機架230中的系統機箱110的正視圖。多組件系統(multiple component system) 200包括設備機架230和系統機箱110。設備機架230可以容納具有機箱的多個電子系統,該機箱類似於系統機箱110或其他不同尺寸的機箱。例如,設備機架230可容納十六個設備,每個設備具有類似於系統機箱110的機箱。設備機架230包括第一機架壁234和相對的第二機架壁236。系統機箱110的第一通道124用以與設備機架230的第一導軌244匹配。系統機箱110的第二通道126用以與設備機架230的相對的第二導軌246匹配。在一些實施方式中,系統機箱110用以經由第一導軌244和第二導軌246滑入設備機架230中。其他導軌可支撐在側壁114和116的其他高度,以允許安裝其他組件。Referring to FIG. 4, it shows a front view of the
透過使系統機箱110的第一通道124和第二通道126與底板112偏移(例如,升高),可以提供額外的空間來容納第一導軌244和第二導軌246以及不會影響底板112的寬度。因此,系統機箱110的底板112的寬度118可佔據設備機架230的第一機架壁234和第二機架壁236之間的空間的寬度(以線238表示)。因此,由於主機板150位於系統機箱110的底板112上,系統機箱110可以容納任何主機板,達到由底板112的線118所表示的寬度,因此可達到第一機架壁234和第二機架壁236之間的空間的線238所表示的寬度。By offsetting (for example, raising) the
在一些實施方式中,系統機箱110的第一側壁114和/或第二側壁116定義系統機箱的高度。在此示例中,系統機箱110的高度約為兩個標準機架單元。在一些實施方式中,第一側壁114和/或第二側壁116具有大約84.2mm的高度(即,H1+H2)。在一些實施方式中,第一側壁114的第一通道124與系統機箱110的底板112垂直偏移約22mm(即H1)。另外地或可替代地,在一些實施方式中,第二側壁116的第二通道126與系統機箱110的底板112垂直偏移約22mm。In some embodiments, the
與傳統的伺服器機箱(例如,第1至2圖中的伺服器機箱10)相比,為相同設備機架230設計尺寸的系統機箱110可以容納更大的主機板,因為主機板150上的有效的空間分配由於升高的通道124、126。參照第5圖,其繪示根據本公開的一些實施方式的系統機箱110的前示意圖。例如,在一些實施方式中,第一側壁114的第一通道124相對於系統機箱110的底板112的第一端111凹入(例如,側向偏移)約5mm(即A1)。或者,在一些實施方式中,第二側壁116的第二通道126相對於系統機箱110的底板112的第二端113凹入(例如,橫向偏移)約5mm(即A2)。Compared with the traditional server chassis (for example, the
通常,諸如設備機架230(第4圖)之類的單個機架,具有諸如電源供應器之類的組件以及將聯網設備保持在由導軌(例如,第一導軌244與第二導軌246)定義的插槽中的實體組件。網絡設備需要將電纜連接到通常安裝在頂部或底部插槽中的交換機或路由器上,以最大程度地簡化電纜連接。由於有大量電纜用於連接機架中的網絡設備,因此每個網絡設備的系統機箱內的額外空間在高效路由中可能是有利的。Typically, a single rack, such as the equipment rack 230 (Figure 4), has components such as power supplies and holds the networked equipment on the rails (for example, the
因此,仍參照第5圖,對於系統機箱110,在一些實施方式中,第一通道124與第一側壁114的第一下唇部123之間的輪廓差提供第一內部凹穴(interior pocket) 134。類似地,第二通道126與第二側壁116的第二下唇129之間的輪廓差也可提供第二內部凹穴136。第一內部凹穴134和/或第二內部凹穴136在主機板150上方提供附加空間,該附加空間可用於容納用於多組件系統200的附加組件,例如附加電纜、連接器、VR組件或電容器。此外,與傳統伺服器機箱相比,系統機箱110具有較低的重心,因此系統機箱110具有更好的結構穩定性。Therefore, still referring to Figure 5, for the
在一些實施方式中,系統機箱110可以用在已經具有與系統機箱110相同或不同的現有系統機箱的設備機架中。第6圖繪示根據本公開的一些實施方式的安裝在具有現有伺服器機箱310的設備機架230中的系統機箱110的前視圖。In some embodiments, the
多組件系統300包括與第4圖中的設備機架230相同或相似的設備機架230。多組件系統300更包括在第一高度處連接到設備機架230的第一對相對的導軌344和346。第一對相對的導軌344和346用以支撐系統機箱110,該系統機箱110與第3至5圖中的系統機箱110相同或相似。The
在一些實施方式中,系統機箱110安裝在多組件系統300的現有伺服器機箱310上方。在一些這樣的實施方式中,現有伺服器機箱310與第1圖所示的伺服器機箱10相同或相似。如第6圖所示,系統機箱110可以容納比現有伺服器機箱310的主機板350更寬的主機板150。因此,可以將系統機箱110引入仍然採用傳統伺服器機箱的較舊的電子系統。在一些其他實施方式中,電子系統可以包括僅具有與第3圖中的系統機箱110相同或相似的系統機箱的設備機架。In some embodiments, the
雖然示例系統100、200和300包括系統機箱110,但是垂直偏移的(例如,升高)通道(例如,第3圖中的標號124和126)可以內置在任何電子系統的任何機箱中。這樣的電子系統可以包括例如任何類型的伺服器、儲存設備、網絡交換機、通信設備等。Although the
來自以下請求項1-10中任一項的一個或多個的一個或多個元件或方面或步驟或其任何部分可以與一個或多個元件或方面或步驟或任何部分進行組合,從其他請求項1-10中的任何一個或多個或它們的組合中形成,以形成本公開的一個或多個其他實施方式及/或申請專利範圍。One or more elements or aspects or steps or any part thereof from any one or more of the following claims 1-10 can be combined with one or more elements or aspects or steps or any part, from other requests Any one or more of items 1-10 or a combination thereof are formed to form one or more other embodiments of the present disclosure and/or the scope of the patent application.
儘管上面已經描述了本創作的各種實施例,但是應可理解,它們僅以示例而非限制的方式示出。在不脫離本創作的精神或範圍的情況下,可以根據本文的公開內容對所公開的實施例進行多種改變。因此,本創作的廣度和範圍不應受到任何上述實施例的限制。而是,本創作的範圍應根據所附申請專利範圍及其等同物來定義。Although various embodiments of the present creation have been described above, it should be understood that they are only shown by way of example and not limitation. Without departing from the spirit or scope of the present creation, various changes can be made to the disclosed embodiments based on the disclosure herein. Therefore, the breadth and scope of this creation should not be limited by any of the above-mentioned embodiments. Rather, the scope of this creation should be defined in accordance with the scope of the attached patent application and its equivalents.
儘管已經相對於一個或多個實施例揭露本創作,但是在閱讀和理解本案說明書和附圖之後,本領域的其他技術人員將知道等效的改變和修改可以發生。另外,儘管可能已經揭露關於幾個實施例中的創作的特定特徵,但是根據任何已定的或特定的應用可能是期望的和有利的,這種特徵可以與其他實施例的一個或多個其他特徵組合。Although the creation has been disclosed with respect to one or more embodiments, after reading and understanding the specification and drawings of this case, other skilled in the art will know that equivalent changes and modifications can occur. In addition, although specific features related to the creation in several embodiments may have been disclosed, it may be desirable and advantageous according to any defined or specific application. This feature may be combined with one or more other features of other embodiments. Feature combination.
這裡使用的術語僅出於描述特定實施例的目的,而不是用來限制本創作。如本文所使用的,單數形式“一”、“一個”和“該”也旨在包括複數形式,除非上下文另有明確指出。此外,在詳細說明及/或請求項中使用術語“包括”、“包含”、“具有”、“具備”、“有”或其變體的範圍,這些術語旨在於與類似於術語“包含”的方式包含在內。The terms used here are only for the purpose of describing specific embodiments, and are not used to limit the creation. As used herein, the singular forms "a," "an," and "the" are also intended to include the plural forms, unless the context clearly dictates otherwise. In addition, in the detailed description and/or claims, the terms "include", "include", "have", "have", "have" or their variants are used. These terms are intended to be similar to the term "includes". The way is included.
除非另有定義,否則本文中使用的所有術語(包括技術和科學術語)具有的含義相同於本創作所屬領域之具有通常知識者一般所理解的含義。再者,例如在常用字典中所定義的那些術語應當被解釋為具有與其在相關領域的上下文中的含義一致的含義,並且除非在本文中明確地如此定義,否則將不被理解為理想化或過於正式的含義。Unless otherwise defined, all terms (including technical and scientific terms) used in this article have the same meanings as commonly understood by those with ordinary knowledge in the field to which this creation belongs. Furthermore, for example, those terms defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant field, and unless explicitly defined as such in this document, they will not be understood as idealized or Too formal meaning.
綜上所述,雖然本創作已以實施例揭露如上,然其並非用以定義本創作。本創作所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾。因此,本創作之保護範圍當視後附之申請專利範圍所界定者為準。To sum up, although this creation has been disclosed as above in an embodiment, it is not used to define this creation. Those with ordinary knowledge in the technical field to which this creation belongs can make various changes and modifications without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.
10:伺服器機箱 12:底板 14:第一側板 16:第二側板 18:寬度 24:第一凹槽 25:第一唇部 26:第二凹槽 27:第二唇部 30:伺服器機架 34:第一機架壁 36:第二機架壁 38:寬度 44:第一滑軌 46:第二滑軌 50:主機板 100:電子系統 110:系統機箱 111:第一端 112:底板 113:第二端 114:第一側壁 116:第二側壁 118,238:寬度 123:第一下唇部 124:第一通道 125:第一上唇部 126:第二通道 127:第二上唇部 129:第二下唇部 134:第一內部凹穴 136:第二內部凹穴 150:主機板 152:第一散熱器 154:第二散熱器 160,162,164:雙列直插式記憶體模組 156:第一電源供應單元 158:第二電源供應單元 200:多組件系統 230:設備機架 234:第一機架壁 236:第二機架壁 244:第一導軌 246:第二導軌 H1,H2:高度 300:多組件系統 310:伺服器機箱 344,346:第一對相對的導軌 350:主機板 10: Server case 12: bottom plate 14: The first side panel 16: second side panel 18: width 24: The first groove 25: first lip 26: second groove 27: second lip 30: Server rack 34: The first rack wall 36: second rack wall 38: width 44: The first slide 46: second slide 50: Motherboard 100: electronic system 110: system chassis 111: first end 112: bottom plate 113: second end 114: first side wall 116: second side wall 118,238: width 123: First lower lip 124: First channel 125: first upper lip 126: Second channel 127: second upper lip 129: second lower lip 134: The first internal cavity 136: The second internal cavity 150: Motherboard 152: The first radiator 154: second radiator 160,162,164: Dual in-line memory module 156: The first power supply unit 158: The second power supply unit 200: Multi-component system 230: equipment rack 234: first rack wall 236: second rack wall 244: first rail 246: second rail H1, H2: height 300: Multi-component system 310: Server Chassis 344,346: The first pair of opposite rails 350: Motherboard
第1圖繪示習知伺服器機箱的頂部透視圖; 第2圖繪示第1圖的習知伺服器機箱安裝在伺服器機架中的前視圖; 第3圖繪示根據本公開的一些實施方式的系統機箱的頂部透視圖; 第4圖繪示根據本公開的一些實施方式的安裝在設備機架中之第3圖的系統機箱的前視圖; 第5圖繪示根據本公開的一些實施方式的第3圖的系統機箱的前示意圖; 第6圖繪示根據本公開的一些實施方式的安裝在具有現有伺服器機箱的設備機架中第3圖的系統機箱的前視圖。 Figure 1 shows a top perspective view of the conventional server chassis; Figure 2 shows a front view of the conventional server chassis of Figure 1 installed in the server rack; Figure 3 shows a top perspective view of a system chassis according to some embodiments of the present disclosure; Figure 4 shows a front view of the system chassis of Figure 3 installed in an equipment rack according to some embodiments of the present disclosure; Figure 5 shows a front schematic diagram of the system chassis of Figure 3 according to some embodiments of the present disclosure; FIG. 6 shows a front view of the system chassis of FIG. 3 installed in an equipment rack with an existing server chassis according to some embodiments of the present disclosure.
100:電子系統 100: electronic system
110:系統機箱 110: system chassis
111:第一端 111: first end
112:底板 112: bottom plate
113:第二端 113: second end
114:第一側壁 114: first side wall
116:第二側壁 116: second side wall
118:寬度 118: width
123:第一下唇部 123: First lower lip
124:第一通道 124: First channel
125:第一上唇部 125: first upper lip
126:第二通道 126: Second channel
127:第二上唇部 127: second upper lip
129:第二下唇部 129: second lower lip
150:主機板 150: Motherboard
152:第一散熱器 152: The first radiator
154:第二散熱器 154: second radiator
160,162,164:雙列直插式記憶體模組 160,162,164: Dual in-line memory module
156:第一電源供應單元 156: The first power supply unit
158:第二電源供應單元 158: The second power supply unit
Claims (10)
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