TWM616473U - Touch panel capable of enhancing curing of adhesive at shading place of circuit board - Google Patents

Touch panel capable of enhancing curing of adhesive at shading place of circuit board Download PDF

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Publication number
TWM616473U
TWM616473U TW110204902U TW110204902U TWM616473U TW M616473 U TWM616473 U TW M616473U TW 110204902 U TW110204902 U TW 110204902U TW 110204902 U TW110204902 U TW 110204902U TW M616473 U TWM616473 U TW M616473U
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Taiwan
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reflective layer
circuit board
touch panel
ultraviolet light
optical glue
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TW110204902U
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Chinese (zh)
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蔡哲旭
汪政仕
張聖輝
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全台晶像股份有限公司
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Priority to TW110204902U priority Critical patent/TWM616473U/en
Publication of TWM616473U publication Critical patent/TWM616473U/en

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Abstract

本新型揭露一種能加強電路板遮光處膠體固化之觸控面板,包含:一保護面板,其含四個側邊;一第一反射層,其設置於該保護面板上,且鄰近於該保護面板的其中一個側邊,該第一反射層用以反射外加的一紫外光;一電路板,其包含一壓著部及一控制部,該壓著部透過一光學膠設置於該第一反射層上;一感應模組,其透過該光學膠貼設於該第一反射層及該電路板的該壓著部上;本新型藉由該第一反射層反射該紫外光,使得反射的紫外光持續照射該光學膠,有效使該光學膠完全且均勻凝固。The present invention discloses a touch panel capable of strengthening the curing of gel at the shading area of the circuit board. The touch panel comprises: a protective panel with four sides; a first reflective layer arranged on the protective panel and adjacent to the protective panel One of the sides, the first reflective layer is used to reflect an applied ultraviolet light; a circuit board, which includes a pressing part and a control part, the pressing part is disposed on the first reflective layer through an optical glue On; a sensor module, which passes through the optical glue and is attached to the first reflective layer and the pressing portion of the circuit board; the present invention reflects the ultraviolet light by the first reflective layer, so that the reflected ultraviolet light Continuously irradiating the optical glue can effectively solidify the optical glue completely and uniformly.

Description

能加強電路板遮光處膠體固化之觸控面板Touch panel that can strengthen the curing of the gel at the shading part of the circuit board

一種觸控面板,尤其是指一種能加強電路板遮光處膠體固化之觸控面板。A touch panel, in particular, refers to a touch panel that can strengthen the curing of the gel at the shading area of the circuit board.

請參見圖8,習用觸控面板在製作時,會將控制用的電路板83設置於保護蓋板81(cover lens)及觸控模組84之間,且電路板83的壓著部、保護蓋板81及觸控模組84會利用光學膠85、86(OCR)黏貼固定,其中該保護蓋板81的上方會鋪設有一黑色的油墨層87,而在該油墨層87上方進一步鋪設一透光層82。而為了加速光學膠85、86固化的時程,一般會使用紫外光模組90發出紫外光照射光學膠85、86,能讓光學膠85、86快速固化,該電路板83的壓著部、保護蓋板81及觸控模組84能在較短的時間完成組裝。Please refer to FIG. 8, when the conventional touch panel is manufactured, the circuit board 83 for control is arranged between the cover lens 81 and the touch module 84, and the pressing part of the circuit board 83 protects The cover 81 and the touch module 84 will be glued and fixed with optical glues 85 and 86 (OCR). A black ink layer 87 is laid on the protective cover 81, and a transparent ink layer 87 is further laid on the ink layer 87.光层82。 Light layer 82. In order to accelerate the curing time of the optical adhesives 85 and 86, the ultraviolet light module 90 is generally used to emit ultraviolet light to irradiate the optical adhesives 85 and 86, so that the optical adhesives 85 and 86 can be cured quickly. The pressing part of the circuit board 83, The protective cover 81 and the touch module 84 can be assembled in a relatively short time.

一般而言,由於該觸控模組84包含多個可透光的感應電極,因此該觸控模組84為可透光的,而由於紫外光模組90會放置於觸控面板的上方,由紫外光模組90朝觸控面板的方向發出紫外光,紫外光穿透觸控模組84並照射光學膠85、86,使光學膠85、86能在較短的時間內固化。但如圖8所示,由於電路板83非可透光的,且電路板83的壓著部與保護蓋板81之間同樣存在有光學膠86,電路板83的壓著部與保護蓋板81之間的光學膠86無法受紫外光照射,使得電路板83的壓著部與保護蓋板81之間的光學膠86其固化效果不佳,導致結構強度不足,以及未固化的光學膠86外流附著在該保護蓋板81上,影響視覺觀感。Generally speaking, since the touch module 84 includes a plurality of light-permeable sensing electrodes, the touch module 84 is light-permeable, and since the ultraviolet light module 90 is placed above the touch panel, The ultraviolet light module 90 emits ultraviolet light toward the touch panel, and the ultraviolet light penetrates the touch module 84 and irradiates the optical glues 85 and 86, so that the optical glues 85 and 86 can be cured in a relatively short time. However, as shown in FIG. 8, since the circuit board 83 is not light-transmissive, and there is also an optical glue 86 between the pressing part of the circuit board 83 and the protective cover 81, the pressing part of the circuit board 83 and the protective cover The optical glue 86 between 81 cannot be irradiated by ultraviolet light, so that the curing effect of the optical glue 86 between the pressing part of the circuit board 83 and the protective cover 81 is not good, resulting in insufficient structural strength and uncured optical glue 86 The external flow is attached to the protective cover 81 and affects the visual perception.

請參見圖9,為解決電路板83的壓著部與保護蓋板81之間的光學膠86無法有效固化的問題,現有存在兩種解決方案,一種是採用可反射紫外光的反射元件91(例如鏡子),在固化流程時將電路板83彎折而露出電路板83下方的光學膠86,並透過鏡子將紫外光反射至電路板83下方的光學膠86,使電路板83下方的光學膠86同樣能受紫外光照射而固化。但此種方式必須在製程中增加反射元件91,且必須計算反射元件91與紫外光模組90之間的距離、角度,以及反射元件91與觸控面板之間的距離,致使增加使用的零件成本及時間成本。Referring to FIG. 9, in order to solve the problem that the optical glue 86 between the pressing portion of the circuit board 83 and the protective cover 81 cannot be effectively cured, there are two existing solutions. One is to use a reflective element 91 that can reflect ultraviolet light. For example, a mirror). During the curing process, the circuit board 83 is bent to expose the optical glue 86 under the circuit board 83, and ultraviolet light is reflected to the optical glue 86 under the circuit board 83 through the mirror, so that the optical glue under the circuit board 83 86 can also be cured by ultraviolet light. However, in this way, the reflective element 91 must be added in the manufacturing process, and the distance and angle between the reflective element 91 and the ultraviolet light module 90, and the distance between the reflective element 91 and the touch panel must be calculated, resulting in increased parts used Cost and time cost.

請參見圖10,另一種方式則是在觸控面板的側邊安裝另一紫外光模組93,由該紫外光模組93直接照射電路板83下方的光學膠85、86,使電路板83下方的光學膠85、86同樣能受紫外光照射而固化。但同樣地,此種方式必須在製程中增加另一紫外光模組93,且必須計算紫外光模組93與紫外光模組90之間的距離、角度,以及紫外光模組93與觸控面板之間的距離,同樣會增加使用的零件成本及架設模組的時間成本。Please refer to Figure 10, another way is to install another ultraviolet light module 93 on the side of the touch panel. The optical glues 85 and 86 below can also be cured by ultraviolet light. But in the same way, in this way, another ultraviolet light module 93 must be added in the process, and the distance and angle between the ultraviolet light module 93 and the ultraviolet light module 90 must be calculated, and the ultraviolet light module 93 and the touch control module must be calculated. The distance between the panels will also increase the cost of parts used and the time cost of installing the module.

本新型提供一種能加強電路板遮光處膠體固化之觸控面板,藉由第一反射層反射光照模組的紫外光,使光學膠能受紫外光均勻照射而固化,在無增加光照模組的數量及增加製程工序的情況下使該光學膠均勻凝固。This model provides a touch panel that can strengthen the curing of the gel at the shading area of the circuit board. The first reflective layer reflects the ultraviolet light of the illumination module, so that the optical adhesive can be uniformly irradiated and cured by the ultraviolet light. In the case of increasing the number and manufacturing process, the optical glue will be uniformly solidified.

為達上述目的,本新型提供能加強電路板遮光處膠體固化之觸控面板包含: 一保護面板,其含四個側邊; 一第一反射層,其設置於該保護面板上,且鄰近於該保護面板的其中一個側邊,該第一反射層用以反射外加的一紫外光; 一電路板,其包含一壓著部及一控制部,該壓著部透過一光學膠設置於該第一反射層上; 一感應模組,其透過該光學膠貼設於該第一反射層及該電路板的該壓著部上。 In order to achieve the above-mentioned purpose, the present invention provides a touch panel that can strengthen the curing of the gel at the shading area of the circuit board, including: A protection panel with four sides; A first reflective layer disposed on the protective panel and adjacent to one of the sides of the protective panel, and the first reflective layer is used to reflect an applied ultraviolet light; A circuit board comprising a pressing part and a control part, the pressing part is arranged on the first reflective layer through an optical glue; A sensor module is pasted on the first reflective layer and the pressing part of the circuit board through the optical glue.

本新型藉由該第一反射層反射該紫外光,使得反射的紫外光持續照射該光學膠,有效使該光學膠完全且均勻凝固,在無增加光照模組的數量及增加製程工序的狀況下,皆能使該光學膠均勻固化,減少該光學膠固化的時間,增加製程效率以及製作的良率,減少因固化不完全導致觸控面板結構強度不足的問題,以及避免未固化的該光學膠外流至該保護面板而影響使用者視覺體驗的缺點。The present invention uses the first reflective layer to reflect the ultraviolet light, so that the reflected ultraviolet light continuously irradiates the optical glue, which effectively solidifies the optical glue completely and uniformly, without increasing the number of light modules and increasing the manufacturing process. , Can make the optical glue uniformly cure, reduce the curing time of the optical glue, increase the process efficiency and production yield, reduce the problem of insufficient strength of the touch panel structure due to incomplete curing, and avoid the uncured optical glue The disadvantage that the external flow to the protective panel affects the user's visual experience.

為能詳細瞭解本新型的技術特徵及實用功效,並可依照新型內容來實現,茲進一步以圖式所示的較佳實施例,詳細說明如後:In order to understand the technical features and practical effects of the present invention in detail, and to implement it in accordance with the new content, the preferred embodiments shown in the drawings are further described in detail as follows:

請參見圖1,本新型提供一種能加強電路板遮光處膠體固化之觸控面板,其能配合一光照模組進行固化流程,該光照模組能產生一紫外光至本新型,使觸控面板中的光學膠能快速且均勻固化,該光照模組可為發光二極體模組或水銀燈模組。該能加強電路板遮光處膠體固化之觸控面板包含:一保護面板10、一第一反射層20、一透光層30、一電路板40、一感應模組50。Please refer to Figure 1. The present invention provides a touch panel that can strengthen the curing of the gel at the shading area of the circuit board. It can cooperate with a light module to perform the curing process. The optical glue in can be quickly and uniformly cured, and the illumination module can be a light-emitting diode module or a mercury lamp module. The touch panel capable of strengthening the gel curing at the shading area of the circuit board includes: a protective panel 10, a first reflective layer 20, a light-transmitting layer 30, a circuit board 40, and a sensing module 50.

該保護面板10呈矩形,且包含兩長邊及兩短邊,其中該保護面板10可為玻璃材質(即為保護玻璃,cover lens,C/L),或是由其他材質製成的保護板材,例如採用聚碳酸酯(Polycarbonate,PC)或聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)等材料,在該保護面板10其中一面的周圍形成一圈的遮蔽層11,該遮蔽層11是以不透光的油墨構成。The protective panel 10 is rectangular and includes two long sides and two short sides. The protective panel 10 can be made of glass (namely, cover lens, C/L), or a protective plate made of other materials. For example, using materials such as polycarbonate (PC) or polymethylmethacrylate (PMMA), a circle of shielding layer 11 is formed around one surface of the protective panel 10, and the shielding layer 11 is not Transparent ink composition.

該第一反射層20設置於該遮蔽層11上,且位於該保護面板10上的其中一長邊或其中一短邊,以及能反射該紫外光71。該第一反射層20可為一鏡面膜。如圖1所示,在本新型的第一較佳實施例中,該第一反射層20的長度與該感應模組50的寬度相近(以下簡稱短版);或者,如圖2所示,在本新型的第二較佳實施例中,該第一反射層20的長度與該保護面板10的寬度相近(以下簡稱長版)。The first reflective layer 20 is disposed on the shielding layer 11 and is located on one of the long sides or one of the short sides of the protective panel 10 and can reflect the ultraviolet light 71. The first reflective layer 20 can be a mirror film. As shown in FIG. 1, in the first preferred embodiment of the present invention, the length of the first reflective layer 20 is similar to the width of the sensing module 50 (hereinafter referred to as a short version); or, as shown in FIG. 2, In the second preferred embodiment of the present invention, the length of the first reflective layer 20 is similar to the width of the protective panel 10 (hereinafter referred to as the long version).

該透光層30設置於該第一反射層20上,且覆蓋該第一反射層20。The light-transmitting layer 30 is disposed on the first reflective layer 20 and covers the first reflective layer 20.

該電路板40包含一壓著部41與一控制部43,該壓著部41透過一光學膠31、33黏貼於該透光層30,該控制部43與該壓著部41一體成形,且可設置多個能控制該感應模組50的零件;在實際進行光學膠31、33的固化製程時,該控制部43會朝該光照模組70的方向彎折,使該光照模組70產生的該紫外光71能照設置該第一反射層20。其中該光學膠31、33可為可透光的光學膠(Optical Clear Resin,OCR,又稱水膠)。The circuit board 40 includes a pressing portion 41 and a control portion 43, the pressing portion 41 is adhered to the light-transmitting layer 30 through an optical glue 31, 33, the control portion 43 and the pressing portion 41 are integrally formed, and A number of parts that can control the sensing module 50 can be provided; when the actual curing process of the optical glue 31, 33 is carried out, the control part 43 will bend in the direction of the light module 70 to cause the light module 70 to produce The ultraviolet light 71 can illuminate the first reflective layer 20. The optical glues 31 and 33 can be optical clear resins (Optical Clear Resin, OCR, also called water glue).

該感應模組50的其中一側邊的邊緣設置於該電路板40的該壓著部41上,且透過該光學膠31、33黏貼於該透光層30及該電路板40的該壓著部41上,使該電路板40的該壓著部41介於該感應模組50及該透光層30之間。該感應模組50可包含複數感應電極,該複數感應電極以矩陣的方式排列,且能感測手指或觸控筆在感應模組50觸控的位置,實現觸控功能。The edge of one side of the sensing module 50 is set on the pressing portion 41 of the circuit board 40, and is adhered to the transparent layer 30 and the pressing portion of the circuit board 40 through the optical glue 31, 33 On the portion 41, the pressing portion 41 of the circuit board 40 is interposed between the sensing module 50 and the light-transmitting layer 30. The sensing module 50 may include a plurality of sensing electrodes, which are arranged in a matrix, and can sense the touch position of a finger or a stylus on the sensing module 50 to achieve a touch function.

請參見圖3,在本新型的第三較佳實施例中,更包含一第二反射層60,該第二反射層60設置於該電路板40的該壓著部41下方,且位於該保護面板10的其中一長邊或其中一短邊,該第二反射層60相對位於該第一反射層20的上方。該第二反射層60與該第一反射層20相同,能反射由該第一反射層20反射的該紫外光71,其中該第二反射層60可為一鏡面膜。Referring to FIG. 3, in the third preferred embodiment of the present invention, a second reflective layer 60 is further included. The second reflective layer 60 is disposed under the pressing portion 41 of the circuit board 40 and is located on the protection On one of the long sides or one of the short sides of the panel 10, the second reflective layer 60 is relatively located above the first reflective layer 20. The second reflective layer 60 is the same as the first reflective layer 20 and can reflect the ultraviolet light 71 reflected by the first reflective layer 20, wherein the second reflective layer 60 can be a mirror film.

請參見圖6,當本新型的第一較佳實施例受該紫外光71照射時,該紫外光71會先照射至該第一反射層20,並由該第一反射層20反射。從第一反射層20反射的該紫外光71穿透該透光層30並照射該電路板40的該壓著部41,該壓著部41會再次反射該紫外光71,使該紫外光71持續在該第一反射層20與該壓著部41之間重複反射,藉此使該壓著部41與該透光層30之間的該光學膠31能均勻受該紫外光71照射,減少該光學膠31固化的時間及提高該光學膠31固化的均勻程度。同時,由於該感應模組50亦為可透光的,因此該紫外光71能直接穿透該感應模組50照射未被該壓著部41遮蔽的該光學膠33,使被壓著部41遮擋的該光學膠31及未被該壓著部41遮蔽的該光學膠33皆能受該紫外光71照射而固化。Please refer to FIG. 6, when the first preferred embodiment of the present invention is irradiated by the ultraviolet light 71, the ultraviolet light 71 will first irradiate the first reflective layer 20 and be reflected by the first reflective layer 20. The ultraviolet light 71 reflected from the first reflective layer 20 penetrates the light-transmitting layer 30 and irradiates the pressing portion 41 of the circuit board 40, and the pressing portion 41 will reflect the ultraviolet light 71 again to make the ultraviolet light 71 Continue to repeat the reflection between the first reflective layer 20 and the pressing portion 41, so that the optical glue 31 between the pressing portion 41 and the light-transmitting layer 30 can be uniformly irradiated by the ultraviolet light 71, reducing The curing time of the optical glue 31 and the uniformity of curing of the optical glue 31 are improved. At the same time, since the sensing module 50 is also light-transmissive, the ultraviolet light 71 can directly penetrate the sensing module 50 to irradiate the optical glue 33 that is not shielded by the pressing portion 41, so that the pressed portion 41 Both the shielded optical glue 31 and the optical glue 33 not shielded by the pressing portion 41 can be irradiated by the ultraviolet light 71 to be cured.

而本新型的第二較佳實施例與第一較佳實施例的差異在於該第一反射層20的長度與該保護面板10的寬度相近,本新型的第二較佳實施例同樣能提供反射該紫外光71的功能,使該紫外光71持續在該第一反射層20與該壓著部41之間重複反射,以固化被壓著部41遮擋的該光學膠31。The difference between the second preferred embodiment of the present invention and the first preferred embodiment is that the length of the first reflective layer 20 is similar to the width of the protective panel 10. The second preferred embodiment of the present invention can also provide reflection. The function of the ultraviolet light 71 makes the ultraviolet light 71 continue to be repeatedly reflected between the first reflective layer 20 and the pressing portion 41 to cure the optical glue 31 blocked by the pressing portion 41.

請參見圖7,當本新型的第三較佳實施例受該紫外光71照射時,該紫外光71會先照射至該第一反射層20,並由該第一反射層20反射。從第一反射層20反射的該紫外光71穿透該透光層30並照射該第二反射層60,該第二反射層60會再次反射該紫外光71,使該紫外光71持續在該第一反射層20與該第二反射層60之間重複反射,藉此使該壓著部41與該透光層30之間的該光學膠31能均勻受該紫外光71照射,減少該光學膠31固化的時間及提高該光學膠31固化的均勻程度。由於該第二反射層60的反射效果比該電路板40的該壓著部41佳,因此該光學膠31的固化效果更佳均勻且固化時間更短。Please refer to FIG. 7, when the third preferred embodiment of the present invention is irradiated by the ultraviolet light 71, the ultraviolet light 71 will first irradiate the first reflective layer 20 and be reflected by the first reflective layer 20. The ultraviolet light 71 reflected from the first reflective layer 20 penetrates the light-transmitting layer 30 and irradiates the second reflective layer 60. The second reflective layer 60 will reflect the ultraviolet light 71 again, so that the ultraviolet light 71 continues to stay at the Repeated reflection between the first reflective layer 20 and the second reflective layer 60, so that the optical glue 31 between the pressing portion 41 and the transparent layer 30 can be uniformly irradiated by the ultraviolet light 71, reducing the optical The curing time of the glue 31 and the uniformity of curing of the optical glue 31 are improved. Since the reflection effect of the second reflective layer 60 is better than that of the pressing portion 41 of the circuit board 40, the curing effect of the optical glue 31 is more uniform and the curing time is shorter.

更進一步,創作人經實際實驗發現,在使用該第一反射層20及進一步使用該第二反射層60後,該光學膠33的固化效果有所提升。請參考圖4、圖5,在實際實驗中,創作人採用銀漿40A作為該電路板40的替代材料,且分別以2mm寬的銀漿40A、6mm寬的銀漿40A作為不同遮蔽大小的該電路板40,其中圖4為第二較佳實施例的實驗態樣,圖5為第一較佳實施例的實驗態樣,請參見下表1: 態樣 銀漿寬度 第一反射層 第二反射層 光照模組照射 第一實施例 6mm 短版 全凝固 第二實施例 6mm 長版 全凝固 第三實施例 2mm 長版 全凝固 表1 Furthermore, the creator found through actual experiments that after using the first reflective layer 20 and further using the second reflective layer 60, the curing effect of the optical glue 33 is improved. Please refer to Figures 4 and 5. In actual experiments, the creator used silver paste 40A as an alternative material for the circuit board 40, and used silver paste 40A with a width of 2mm and silver paste 40A with a width of 6mm as the different shielding sizes. Circuit board 40, in which FIG. 4 is the experimental state of the second preferred embodiment, and FIG. 5 is the experimental state of the first preferred embodiment, please refer to Table 1 below: State Silver paste width First reflective layer Second reflective layer Illumination module illumination The first embodiment 6mm Short version without Fully solidified Second embodiment 6mm Long version without Fully solidified The third embodiment 2mm Long version Have Fully solidified Table 1

由表1可知,無論銀漿40A遮蔽的寬度多寡、該第一反射層20的長短、是否設置該第二反射層60等條件下,在實際固化該光學膠31的製程中,該第一反射層20皆能反射該紫外光71,使該紫外光71不停照射該銀漿40A下方的該光學膠31,有效使該光學膠31完全且均勻凝固。也就是說,無論該電路板40的該壓著部41遮蔽多少的該光學膠31,只要有設置該第一反射層20(或進一步設置該第二反射層60),在無增加光照模組70的數量及增加製程工序的狀況下,皆能使該光學膠31均勻固化,減少該光學膠31固化的時間,增加製程效率以及製作的良率,減少因固化不完全導致觸控面板結構強度不足的問題,同時避免未固化的該光學膠31外流而影響視覺觀感的缺點。It can be seen from Table 1 that regardless of the width of the silver paste 40A, the length of the first reflective layer 20, whether the second reflective layer 60 is provided, etc., in the actual curing process of the optical glue 31, the first reflective layer The layer 20 can reflect the ultraviolet light 71, so that the ultraviolet light 71 continuously irradiates the optical glue 31 under the silver paste 40A, which effectively solidifies the optical glue 31 completely and uniformly. That is to say, no matter how much the optical glue 31 is shielded by the pressing portion 41 of the circuit board 40, as long as the first reflective layer 20 is provided (or the second reflective layer 60 is further provided), there is no increase in the illumination module. The number of 70 and the increase in the manufacturing process can uniformly cure the optical glue 31, reduce the curing time of the optical glue 31, increase the process efficiency and production yield, and reduce the structural strength of the touch panel due to incomplete curing. The problem of insufficient, and at the same time, the disadvantage of avoiding the outflow of the uncured optical glue 31 and affecting the visual perception.

以上所述僅是本新型的較佳實施例而已,並非對本新型做任何形式上的限制,雖然本新型已以較佳實施例揭露如上,然而並非用以限定本新型,任何熟悉本專業的技術人員,在不脫離本新型技術方案的範圍內,當可利用上述揭示的技術內容做出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本新型技術方案的內容,依據本新型的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本新型技術方案的範圍內。The above are only the preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed in the preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not deviate from the technical solution of the present invention is based on the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the new technical solution.

10:保護面板 11:遮蔽層 20:第一反射層 30:透光層 31,33:光學膠 40:電路板 40A:銀漿 41:壓著部 43:控制部 50:感應模組 60:第二反射層 70:光照模組 71:紫外光 81:保護蓋板 82:透光層 83:電路板 84:觸控模組 85,86:光學膠 87:油墨層 90,93:紫外光模組 91:反射元件 10: Protection panel 11: Masking layer 20: The first reflective layer 30: light-transmitting layer 31, 33: Optical glue 40: circuit board 40A: Silver paste 41: Crimping part 43: Control Department 50: Induction module 60: second reflective layer 70: Illumination Module 71: Ultraviolet light 81: Protective cover 82: light-transmitting layer 83: circuit board 84: Touch module 85, 86: Optical glue 87: Ink layer 90, 93: UV module 91: reflective element

圖1:本新型之第一較佳實施例側視剖面圖。 圖2:本新型之第二較佳實施例側視剖面圖。 圖3:本新型之第三較佳實施例側視剖面圖。 圖4:本新型之第一較佳實施例實驗示意圖。 圖5:本新型之第二較佳實施例實驗示意圖。 圖6:本新型之第一較佳實施例實際受光照模組照射之示意圖。 圖7:本新型之第三較佳實施例實際受光照模組照射之示意圖。 圖8:習用之觸控模組受紫外光模組示意圖。 圖9:習用之觸控模組製程時搭配反射元件示意圖。 圖10:習用之觸控模組製程時搭配兩紫外光模組示意圖。 Figure 1: A side cross-sectional view of the first preferred embodiment of the present invention. Figure 2: A cross-sectional side view of the second preferred embodiment of the present invention. Figure 3: A cross-sectional side view of the third preferred embodiment of the present invention. Figure 4: Experimental schematic diagram of the first preferred embodiment of the present invention. Figure 5: Experimental schematic diagram of the second preferred embodiment of the present invention. Fig. 6: A schematic diagram of the first preferred embodiment of the present invention being actually illuminated by the light module. Fig. 7: A schematic diagram of the third preferred embodiment of the present invention actually being illuminated by the light module. Figure 8: A schematic diagram of a conventional touch module receiving ultraviolet light. Figure 9: Schematic diagram of the conventional touch module with reflective components during the manufacturing process. Figure 10: Schematic diagram of the conventional touch module manufacturing process with two UV modules.

10:保護面板 10: Protection panel

11:遮蔽層 11: Masking layer

20:第一反射層 20: The first reflective layer

30:透光層 30: light-transmitting layer

31,33:光學膠 31, 33: Optical glue

40:電路板 40: circuit board

41:壓著部 41: Crimping part

43:控制部 43: Control Department

50:感應模組 50: Induction module

Claims (10)

一種能加強電路板遮光處膠體固化之觸控面板,包含: 一保護面板,其含四個側邊; 一第一反射層,其設置於該保護面板上,且鄰近於該保護面板的其中一個側邊,該第一反射層用以反射外加的一紫外光; 一電路板,其包含一壓著部及一控制部,該壓著部透過一光學膠設置於該第一反射層上; 一感應模組,其透過該光學膠貼設於該第一反射層及該電路板的該壓著部上。 A touch panel that can strengthen the curing of the gel at the shading area of the circuit board, including: A protection panel with four sides; A first reflective layer disposed on the protective panel and adjacent to one of the sides of the protective panel, and the first reflective layer is used to reflect an applied ultraviolet light; A circuit board comprising a pressing part and a control part, the pressing part is arranged on the first reflective layer through an optical glue; A sensor module is pasted on the first reflective layer and the pressing part of the circuit board through the optical glue. 如請求項1所述能加強電路板遮光處膠體固化之觸控面板,於該電路板的該壓著部下方進一步設置一第二反射層,該第二反射層相對位於該第一反射層的上方。As described in claim 1 for the touch panel capable of strengthening the gel curing at the shading area of the circuit board, a second reflective layer is further provided under the pressing portion of the circuit board, and the second reflective layer is located opposite to the first reflective layer. Above. 如請求項1或2所述能加強電路板遮光處膠體固化之觸控面板,其中該第一反射層的長度與該感應模組的寬度相近。According to claim 1 or 2, the touch panel capable of strengthening the gel curing at the shading area of the circuit board, wherein the length of the first reflective layer is similar to the width of the sensing module. 如請求項3所述能加強電路板遮光處膠體固化之觸控面板,其中該第一反射層為鏡面膜。According to claim 3, the touch panel capable of strengthening the gel curing at the shading area of the circuit board, wherein the first reflective layer is a mirror film. 如請求項2所述能加強電路板遮光處膠體固化之觸控面板,其中該第二反射層為鏡面膜。According to claim 2, the touch panel capable of strengthening the gel curing of the shading part of the circuit board, wherein the second reflective layer is a mirror film. 如請求項4所述能加強電路板遮光處膠體固化之觸控面板,於該第一反射層上方進一步設置一透光層。According to claim 4, the touch panel capable of strengthening the gel curing at the shading area of the circuit board is further provided with a light-transmitting layer above the first reflective layer. 如請求項6所述能加強電路板遮光處膠體固化之觸控面板,於該保護面板其中一面的周圍形成一圈的遮蔽層,該第一反射層設置於該遮蔽層上。For the touch panel capable of strengthening the gel curing of the shading area of the circuit board as described in claim 6, a circle of shielding layer is formed around one surface of the protective panel, and the first reflective layer is disposed on the shielding layer. 如請求項1或2所述能加強電路板遮光處膠體固化之觸控面板,其中該第一反射層的長度與該保護面板的寬度相近。According to claim 1 or 2, the touch panel capable of strengthening the gel curing at the shading area of the circuit board, wherein the length of the first reflective layer is similar to the width of the protective panel. 如請求項8所述能加強電路板遮光處膠體固化之觸控面板,於該第一反射層上方進一步設置一透光層。As described in claim 8 for the touch panel capable of strengthening the gel curing at the shading area of the circuit board, a light-transmitting layer is further provided above the first reflective layer. 如請求項9所述能加強電路板遮光處膠體固化之觸控面板,於該保護面板其中一面的周圍形成一圈的遮蔽層,該第一反射層設置於該遮蔽層上。According to claim 9 of the touch panel capable of strengthening the gel curing at the shading area of the circuit board, a circle of shielding layer is formed around one surface of the protective panel, and the first reflective layer is disposed on the shielding layer.
TW110204902U 2021-04-30 2021-04-30 Touch panel capable of enhancing curing of adhesive at shading place of circuit board TWM616473U (en)

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