TWM616449U - High speed connector - Google Patents

High speed connector Download PDF

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Publication number
TWM616449U
TWM616449U TW110204653U TW110204653U TWM616449U TW M616449 U TWM616449 U TW M616449U TW 110204653 U TW110204653 U TW 110204653U TW 110204653 U TW110204653 U TW 110204653U TW M616449 U TWM616449 U TW M616449U
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Taiwan
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terminal
terminals
boss
conductive adhesive
differential
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TW110204653U
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Chinese (zh)
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黃聖原
林俊甫
李雲謙
林佩誼
許益菁
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正崴精密工業股份有限公司
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Priority to TW110204653U priority Critical patent/TWM616449U/en
Publication of TWM616449U publication Critical patent/TWM616449U/en

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Abstract

本創作公開一種高速連接器,包括:一絕緣本體及一第一端子組,第一端子組設有複數第一端子、一第一基體及一第一導電膠模,複數第一端子設置於第一基體內,複數第一端子設有複數第一接地端子及複數第一差動端子,第一基體設有至少一第一凹槽,第一導電膠膜設置於第一凹槽內,第一凹槽內設有一體成型的至少一第一凸台,第一凸台阻隔於第一差動端子與第一導電膠膜之間,第一導電膠膜設有一第一金屬層,第一金屬層電性連接第一接地端子以形成一串地結構。因此本創作高速連接器不易產生諧振點且能改善遠端串音、近端串音、插入損失及反射損失。This creation discloses a high-speed connector, comprising: an insulating body and a first terminal group, the first terminal group is provided with a plurality of first terminals, a first substrate and a first conductive rubber mold, and the plurality of first terminals are arranged on the first terminal group. In a base body, a plurality of first terminals are provided with a plurality of first ground terminals and a plurality of first differential terminals, the first base body is provided with at least one first groove, the first conductive adhesive film is arranged in the first groove, and the first The groove is provided with at least one first boss formed integrally. The first boss is blocked between the first differential terminal and the first conductive adhesive film. The first conductive adhesive film is provided with a first metal layer. The layer is electrically connected to the first ground terminal to form a series of ground structures. Therefore, the creative high-speed connector is not easy to produce resonance points and can improve far-end crosstalk, near-end crosstalk, insertion loss and reflection loss.

Description

高速連接器High-speed connector

本創作涉及一種高速連接器,尤其是涉及一種不易產生諧振點且能改善串音、插入損失及反射損失的高速連接器。This creation relates to a high-speed connector, in particular to a high-speed connector that is not easy to generate resonance points and can improve crosstalk, insertion loss and reflection loss.

現有的高速連接器通常以接地片連接數個接地端子,以降低插入損失和串音干擾。其中,現有的接地片是由一片狀主體以及自上述片狀主體所延伸出的多個彈臂所組成,並且上述彈臂大都以懸臂樑的形式與片狀主體一體沖壓製成。然而,現有接地片的結構強度不高,並且現有接地片無法用來屏蔽高速連接器的差分信號端子,所以現有的接地片還具有能夠進一步改良的空間存在,以利於提升現有高速連接器的性能。Existing high-speed connectors usually connect several grounding terminals with grounding strips to reduce insertion loss and crosstalk interference. Among them, the existing grounding sheet is composed of a sheet-shaped main body and a plurality of elastic arms extending from the sheet-shaped main body, and the elastic arms are mostly formed by stamping integrally with the sheet-shaped main body in the form of a cantilever beam. However, the structural strength of the existing grounding lug is not high, and the existing grounding lug cannot be used to shield the differential signal terminals of the high-speed connector, so the existing grounding lug still has room for further improvement to help improve the performance of the existing high-speed connector .

台灣專利證書第I635677號揭露了「一種高速連接器及其傳輸模組」,包括殼體、插設於殼體內的絕緣膠芯、固定於絕緣膠芯的多個第一導電端子與多個第二導電端子、及屏蔽件。多個第一導電端子沿寬度方向排列並包含有兩個差分信號端子及分別位於上述兩個差分信號端子的相反兩個外側的兩個接地端子。屏蔽件包含可分離地組裝於殼體的基材及鍍設於基材的金屬鍍層,並且金屬鍍層接觸上述兩個接地端子,以使兩個接地端子電性連接。金屬鍍層位於兩個差分信號端子的相反兩個外側,以使金屬鍍層能在寬度方向上對兩個差分信號端子進行屏蔽。此外,本發明另提供一種高速連接器的傳輸模組。Taiwan Patent Certificate No. I635677 discloses "a high-speed connector and its transmission module", which includes a housing, an insulating rubber core inserted in the housing, a plurality of first conductive terminals fixed to the insulating rubber core, and a plurality of first conductive terminals. Two conductive terminals and shields. The plurality of first conductive terminals are arranged in the width direction and include two differential signal terminals and two ground terminals respectively located on two opposite outer sides of the two differential signal terminals. The shield includes a base material detachably assembled on the casing and a metal plating layer plated on the base material, and the metal plating layer contacts the two grounding terminals, so that the two grounding terminals are electrically connected. The metal plating layer is located on two opposite outer sides of the two differential signal terminals, so that the metal plating layer can shield the two differential signal terminals in the width direction. In addition, the present invention also provides a high-speed connector transmission module.

然,上述高速連接器整面鋪滿金屬鍍層以達到屏蔽作用,此設計之缺點在於訊號碰到金屬鍍層會容易造成震盪反射,此震盪會產生很多諧振點,當高速連接器在更高速訊號傳遞時反而會使其高頻特性變差。高頻訊號傳輸在相鄰的端子時,很難避免串音干擾的產生,然而,上述高速連接器因鋪滿整面金屬鍍層,使高頻特性變差進而影響串音效果。上述高速連接器因鋪滿整面金屬鍍層而造成震盪反射,震盪反射造成插入損失及反射損失的損耗較大。However, the entire surface of the above-mentioned high-speed connector is covered with metal coating to achieve shielding effect. The disadvantage of this design is that the signal will easily cause vibration reflection when the signal touches the metal coating. This vibration will generate many resonance points. When the high-speed connector transmits signals at higher speeds Sometimes it will worsen its high-frequency characteristics. When high-frequency signals are transmitted to adjacent terminals, it is difficult to avoid crosstalk interference. However, the high-speed connectors described above are covered with metal plating on the entire surface, which deteriorates high-frequency characteristics and affects the crosstalk effect. The above-mentioned high-speed connector causes oscillating reflection due to the metal coating on the entire surface, and the oscillating reflection causes a large loss of insertion loss and reflection loss.

因此,有必要提供一種不易產生諧振點且能改善遠端串音、近端串音、插入損失及反射損失的高速連接器。Therefore, it is necessary to provide a high-speed connector that does not easily generate resonance points and can improve far-end crosstalk, near-end crosstalk, insertion loss, and reflection loss.

本創作之目的提供一種高速連接器,包括:一絕緣本體;及一第一端子組,所述第一端子組設有複數第一端子、一第一基體及一第一導電膠模,複數所述第一端子設置於所述第一基體內,複數所述第一端子設有複數第一接地端子及複數第一差動端子,兩所述第一差動端子設置於兩所述第一接地端子之間,所述第一基體設有至少一第一凹槽,所述第一導電膠膜設置於所述第一凹槽內,所述第一基體之所述第一凹槽內設有一體成型的至少一第一凸台,所述第一凸台阻隔於兩所述第一差動端子與所述第一導電膠膜之間,所述第一凸台之左右兩側分別形成一第一凹口,兩所述第一接地端子設置於兩所述第一凹口內,所述第一導電膠膜覆蓋所述第一凸台並伸入兩所述第一凹口內,所述第一導電膠膜設有一第一金屬層,所述第一金屬層為複數孔隙的一圖形,複數所述孔隙之間形成複數條連續且交錯的線條,所述第一金屬層電性連接兩所述第一接地端子以形成一串地結構。The purpose of this creation is to provide a high-speed connector, which includes: an insulating body; The first terminal is disposed in the first base body, the plurality of first terminals are provided with a plurality of first ground terminals and a plurality of first differential terminals, and the two first differential terminals are disposed on the two first grounds. Between the terminals, the first base body is provided with at least one first groove, the first conductive adhesive film is arranged in the first groove, and the first groove of the first base body is provided with At least one first boss is integrally formed, and the first boss is blocked between the two first differential terminals and the first conductive adhesive film. The left and right sides of the first boss are respectively formed with a The first notch, the two first ground terminals are arranged in the two first notches, the first conductive adhesive film covers the first boss and extends into the two first notches, so The first conductive adhesive film is provided with a first metal layer, the first metal layer is a pattern of a plurality of pores, a plurality of continuous and staggered lines are formed between the plurality of pores, and the first metal layer is electrically connected The two first ground terminals form a series of ground structures.

選擇性地,所述第一凹槽內設有複數所述第一凸台,複數所述第一凸台橫向排列並設置於所述第一凹槽之前後兩端,複數所述第一凸台延伸方向與所述第一端子延伸方向彼此垂直,每一所述第一凸台之位置對應兩所述第一差動端子之位置,兩所述第一凸台之間設有所述第一凹口,所述第一凹口之位置對應所述第一接地端子之位置,所述第一接地端子卡固於所述第一凹口,所述第一導電膠膜沿著所述第一凸台與所述第一凹口之形狀設置於所述第一凸台之下表面並覆蓋於所述第一凹口。Optionally, the first groove is provided with a plurality of the first bosses, the plurality of first bosses are arranged laterally and are arranged at the front and back ends of the first groove, and the plurality of first bosses The extending direction of the platform and the extending direction of the first terminal are perpendicular to each other, the position of each of the first bosses corresponds to the position of the two first differential terminals, and the first boss is provided between the two first bosses. A notch, the position of the first notch corresponds to the position of the first ground terminal, the first ground terminal is clamped in the first notch, the first conductive adhesive film is along the first The shape of a boss and the first recess is arranged on the lower surface of the first boss and covers the first recess.

選擇性地,所述第一凹槽內設有複數所述第一凸台,複數所述第一凸台縱向排列並延伸於所述第一凹槽中,複數所述第一凸台之前後兩端分別連接所述第一凹槽之前後兩端,所述第一凸台延伸方向與所述第一端子延伸方向一樣,每一所述第一凸台之左右兩側分別形成一第一阻隔部,兩所述第一阻隔部中間形成一第一斷開空間,每一所述第一阻隔部設置於一所述第一接地端子與一所述第一差動端子之間,兩所述第一差動端子設置在所述第一斷開空間,每一所述第一阻隔部一側皆設有向下凹陷的一第一凹部,所述第一差動端子設置於所述第一凹部一側,所述第一差動端子設置於所述第一凹部上,所述第一接地端子設置於所述第一凹部另一側,所述第一導電膠膜沿著所述第一接地端子與所述第一凸台之形狀黏貼所述第一凸台之下表面,複數所述第一凹部阻隔於所述第一導電膠膜與複數所述第一差動端子之間。Optionally, a plurality of the first bosses are arranged in the first groove, the first bosses are arranged longitudinally and extend in the first groove, and the first bosses are in front and back The two ends are respectively connected to the front and back ends of the first groove, the extension direction of the first boss is the same as the extension direction of the first terminal, and the left and right sides of each first boss respectively form a first A barrier portion, a first disconnection space is formed between the two first barrier portions, each of the first barrier portions is disposed between a first ground terminal and a first differential terminal, and two The first differential terminal is arranged in the first disconnection space, one side of each of the first blocking portions is provided with a first recess recessed downward, and the first differential terminal is arranged in the first On one side of a concave portion, the first differential terminal is disposed on the first concave portion, the first ground terminal is disposed on the other side of the first concave portion, and the first conductive adhesive film is along the first concave portion. The shape of a ground terminal and the first boss is adhered to the lower surface of the first boss, and the plurality of first recesses are blocked between the first conductive adhesive film and the plurality of first differential terminals.

選擇性地,每一所述第一端子皆設有一第一固定部、一第一台階部、一第一接觸部、一第一彎折部及一第一焊接部,所述第一固定部前端向下彎折形成所述第一台階部,所述第一台階部設置於所述第一基體之前端內,所述第一台階部前端往前延伸出所述第一基體之前端面後向下彎折形成所述第一接觸部,所述第一固定部後端延伸出所述第一基體後端面後向下傾斜延伸後再彎折向下延伸形成所述第一彎折部,所述第一彎折部底端往後彎折延伸形成所述第一焊接部。Optionally, each of the first terminals is provided with a first fixing portion, a first step portion, a first contact portion, a first bending portion, and a first welding portion, and the first fixing portion The front end is bent downward to form the first step portion, the first step portion is disposed in the front end of the first base, and the front end of the first step portion extends forward from the front end surface of the first base. Bending downward to form the first contact portion, the rear end of the first fixing portion extends out of the rear end surface of the first base body and then extends obliquely downwards and then bends and extends downward to form the first bending portion, so The bottom end of the first bending portion is bent backward and extends to form the first welding portion.

選擇性地,所述第一基體兩側分別設有貫穿所述第一基體上、下表面的複數第一開口,複數所述第一接地端子之所述第一固定部及複數所述第一差動端子之所述第一固定部外露於所述第一開口。Optionally, a plurality of first openings penetrating through the upper and lower surfaces of the first substrate are respectively provided on both sides of the first base, and the first fixing portions of the first grounding terminals and the first The first fixing portion of the differential terminal is exposed outside the first opening.

選擇性地,所述第一金屬層具有形狀相同的複數所述孔隙的所述圖形。Optionally, the first metal layer has a plurality of the patterns of the pores with the same shape.

選擇性地,所述第一金屬層具有形狀不同的複數所述孔隙的所述圖形。Optionally, the first metal layer has the pattern of a plurality of the pores with different shapes.

選擇性地,還包括一第二端子組,所述第二端子組與所述第一端子組上下相對應,所述第二端子組設有複數第二端子、一第二基體、一第二導電膠膜,複數所述第二端子設置於所述第二基體內,複數所述第二端子設有複數第二接地端子及複數第二差動端子,兩所述第二差動端子設置於兩所述第二接地端子之間,所述第二基體設有一第二凹槽、複數第二開口及至少一第二凸台,所述第二基體上表面設有向下凹陷的所述第二凹槽,所述第二導電膠膜設置於所述第二凹槽內,所述第二基體之所述第二凹槽設有一體成型的至少一所述第二凸台,所述第二凸台阻隔於所述第二差動端子與所述第二導電膠膜之間,所述第二凸台之左右兩側分別形成一第二凹口,兩所述第二接地端子設置於兩所述第二凹口內,所述第二導電膠膜覆蓋所述第二凸台並伸入兩所述第二凹口內,所述第二導電膠膜設有一第二金屬層,第二金屬層為複數所述孔隙的所述圖形,複數所述孔隙之間形成複數條連續且交錯的線條,所述第二金屬層電性連接所述第二接地端子以形成所述串地結構。Optionally, it further includes a second terminal group, the second terminal group corresponding to the first terminal group up and down, and the second terminal group is provided with a plurality of second terminals, a second base, and a second terminal group. A conductive adhesive film, a plurality of the second terminals are arranged in the second base body, a plurality of the second terminals are provided with a plurality of second ground terminals and a plurality of second differential terminals, and the two second differential terminals are arranged in Between the two second ground terminals, the second base body is provided with a second groove, a plurality of second openings, and at least one second boss, and the upper surface of the second base body is provided with the first recessed downwards. Two grooves, the second conductive adhesive film is arranged in the second groove, the second groove of the second base body is provided with at least one of the second bosses integrally formed, the first Two bosses are blocked between the second differential terminal and the second conductive adhesive film, a second notch is formed on the left and right sides of the second boss respectively, and the two second ground terminals are arranged at In the two second recesses, the second conductive adhesive film covers the second boss and extends into the two second recesses, the second conductive adhesive film is provided with a second metal layer, the first The two metal layers are the patterns of the plurality of pores, a plurality of continuous and interlaced lines are formed between the plurality of pores, and the second metal layer is electrically connected to the second ground terminal to form the series ground structure .

選擇性地,所述第二凹槽內設有複數所述第二凸台,複數所述第二凸台橫向排列並設置於所述第二凹槽之前後兩端,複數所述第二凸台延伸方向與所述第二端子延伸方向彼此垂直,每一所述第二凸台之位置對應兩所述第二差動端子之位置,兩所述第二凸台之間設有所述第二凹口,所述第二凹口之位置對應所述第二接地端子之位置,所述第二接地端子卡固於所述第二凹口,所述第二導電膠膜沿著所述第二凸台與所述第二凹口之形狀設置於所述第二凸台之上表面並覆蓋於所述第二凹口。Optionally, a plurality of the second bosses are arranged in the second groove, the second bosses are arranged laterally and are arranged at the front and back ends of the second groove, and the second bosses are arranged horizontally. The extending direction of the platform and the extending direction of the second terminal are perpendicular to each other, the position of each of the second bosses corresponds to the position of the two second differential terminals, and the first boss is provided between the two second bosses. Two notches, the position of the second notch corresponds to the position of the second ground terminal, the second ground terminal is clamped in the second notch, and the second conductive adhesive film is along the first The shapes of the two bosses and the second recess are arranged on the upper surface of the second boss and cover the second recess.

選擇性地,所述第二凹槽內設有複數所述第二凸台,複數所述第二凸台縱向排列並延伸於所述第二凹槽中,複數所述第二凸台之前後兩端分別連接所述第二凹槽之前後兩端,複數所述第二凸台延伸方向與所述第二端子延伸方向一樣,每一所述第二凸台之左右兩側分別形成一第二阻隔部,兩所述第二阻隔部中間形成一第二斷開空間,每一所述第二阻隔部設置於一所述第二接地端子與一所述第二差動端子之間,兩所述第二差動端子設置在所述第二斷開空間,每一所述第二阻隔部一側皆設有向上凹陷的一第二凹部,所述第二差動端子設置於所述第二凹部一側,所述第二差動端子設置於所述第二凹部上,所述第二接地端子設置於所述第二凹部另一側,所述第二導電膠膜沿著所述第二接地端子與所述第二凸台之形狀黏貼所述第二凸台之上表面,複數所述第二凹部阻隔於所述第二導電膠膜與複數所述第二差動端子之間。Optionally, a plurality of the second bosses are arranged in the second groove, the second bosses are arranged longitudinally and extend in the second groove, and the second bosses are in front and back The two ends are respectively connected to the front and back ends of the second groove, the extension direction of the plurality of second bosses is the same as the extension direction of the second terminal, and the left and right sides of each second boss respectively form a first Two blocking parts, a second disconnected space is formed between the two second blocking parts, each of the second blocking parts is disposed between a second ground terminal and a second differential terminal, two The second differential terminal is arranged in the second disconnection space, a second recessed portion recessed upward is provided on one side of each second blocking portion, and the second differential terminal is arranged in the first On one side of the two recesses, the second differential terminal is provided on the second recess, the second ground terminal is provided on the other side of the second recess, and the second conductive adhesive film is along the first recess. The shapes of the two ground terminals and the second boss are adhered to the upper surface of the second boss, and the plurality of second recesses are blocked between the second conductive adhesive film and the plurality of second differential terminals.

為詳細說明本創作高速連接器100之技術內容、構造特徵、所達成的目的及功效,以下茲例舉實施例並配合圖式詳予說明。In order to describe in detail the technical content, structural features, achieved objectives and effects of the high-speed connector 100 of the present invention, the following examples are given with examples and detailed descriptions in conjunction with the drawings.

請參閱第一圖與第二圖所示,本創作高速連接器100,包括一絕緣本體1及一端子模組2,本創作高速連接器100設置於一電路板3上,所述絕緣本體1固定在所述電路板3上,所述端子模組2設置於所述絕緣本體1內,所述端子模組2焊接在所述電路板3。Please refer to the first and second figures. The creative high-speed connector 100 includes an insulating body 1 and a terminal module 2. The creative high-speed connector 100 is disposed on a circuit board 3, and the insulating body 1 It is fixed on the circuit board 3, the terminal module 2 is arranged in the insulating body 1, and the terminal module 2 is welded to the circuit board 3.

請參閱第二十三圖所示,所述電路板3設有一第一焊接區31、一第二焊接區32、一第三焊接區33及一第四焊接區34,所述第一焊接區31、所述第二焊接區32、所述第三焊接區33及所述第四焊接區34分別與所述端子模組2之對應機構焊接以實現所述電路板3與所述端子模組2定位固持及訊號傳輸。Please refer to Figure 23, the circuit board 3 is provided with a first welding area 31, a second welding area 32, a third welding area 33 and a fourth welding area 34, the first welding area 31. The second welding area 32, the third welding area 33, and the fourth welding area 34 are respectively welded to the corresponding mechanism of the terminal module 2 to realize the circuit board 3 and the terminal module 2 Positioning holding and signal transmission.

請參閱第三圖與第四圖所示,所述絕緣本體1設有一本體部11,所述本體部11內形成有一插接通道12及連通於所述插接通道的數排端子槽13,並且數排所述端子槽13分別位於所述插接通道12的上方與下方。所述本體部11的前端形成有一插接口14,而所述本體部11的末端形成有一安裝槽15,並且所述插接口14與所述安裝槽15分別位於插接通道12的前側與後側並且連通於所述插接通道12。在本實施例中,所述本體部11內形成兩排所述端子槽13,所述兩排端子槽13分別形成於所述插接通道12前端之上表面與下表面,所述兩排端子槽13之前端連通所述插接口14。Referring to the third and fourth figures, the insulating body 1 is provided with a body portion 11, and the body portion 11 is formed with an insertion channel 12 and several rows of terminal grooves 13 connected to the insertion channel. In addition, rows of the terminal slots 13 are respectively located above and below the insertion channel 12. The front end of the main body portion 11 is formed with an insertion port 14 and the end of the main body portion 11 is formed with an installation slot 15 and the insertion port 14 and the installation slot 15 are respectively located at the front and rear sides of the insertion channel 12 And it is connected to the insertion channel 12. In this embodiment, two rows of the terminal grooves 13 are formed in the body portion 11, and the two rows of terminal grooves 13 are respectively formed on the upper surface and the lower surface of the front end of the insertion channel 12, and the two rows of terminals The front end of the slot 13 communicates with the insertion port 14.

請參閱第三圖至第五圖所示,所述端子模組2由所述絕緣本體1之後方插設於所述絕緣本體1之所述安裝槽15內。在本實施例中,所述端子模組2由一第一端子組21、一第二端子組22、一第三端子組23及一第四端子組24組成,在具體實施時則不限於此。所述第一端子組21與所述第二端子組22相對應,所述第三端子組23與所述第四端子組24相對應。在本實施例中,所述第一端子組21與所述第二端子組22構成一QSFP端子組,所述第三端子組23與所述第四端子組24構成另一QSFP端子組。在具體實施時,本創作高速連接器100設置所述第一端子組21、所述第二端子組22、所述第三端子組23及所述第四端子組24以構成一QSFP-DD高速連接器,亦可僅設置所述第一端子組21及所述第二端子組22以構成一QSFP高速連接器。Referring to FIGS. 3 to 5, the terminal module 2 is inserted into the mounting groove 15 of the insulating body 1 from behind the insulating body 1. In this embodiment, the terminal module 2 is composed of a first terminal group 21, a second terminal group 22, a third terminal group 23, and a fourth terminal group 24, and it is not limited to this in specific implementation. . The first terminal group 21 corresponds to the second terminal group 22, and the third terminal group 23 corresponds to the fourth terminal group 24. In this embodiment, the first terminal group 21 and the second terminal group 22 form a QSFP terminal group, and the third terminal group 23 and the fourth terminal group 24 form another QSFP terminal group. In specific implementation, the creative high-speed connector 100 is provided with the first terminal group 21, the second terminal group 22, the third terminal group 23, and the fourth terminal group 24 to form a QSFP-DD high-speed For the connector, only the first terminal set 21 and the second terminal set 22 may be provided to form a QSFP high-speed connector.

請參閱第七圖至第十圖所示,所述第一端子組21設有複數第一端子211、一第一基體212、一第一導電膠膜213及一第一固持體214,所述第一導電膠膜213設置於所述第一基體212下方,所述第一基體212包覆複數所述第一端子211。每一所述第一端子211皆設有一第一固定部2111、一第一台階部2112、一第一接觸部2113、一第一彎折部2114及一第一焊接部2115。所述第一固定部2111暴露於所述第一基體212之下表面,所述第一固定部2111前端向下彎折形成所述第一台階部2112,所述第一台階部2112設置於所述第一基體212之前端內,所述第一台階部2112前端往前延伸出所述第一基體212之前端面後向下彎折形成所述第一接觸部2113,所述第一接觸部2113設置於所述插接通道12前端之上表面之所述端子槽13,且每一所述第一接觸部2113之下表面凸出所述端子槽13並伸入所述插接通道12中。所述第一固定部2111後端延伸出所述第一基體212後端面後向下傾斜延伸後再彎折向下延伸形成所述第一彎折部2114,所述第一彎折部2114底端往後彎折延伸形成所述第一焊接部2115,所述第一焊接部2115焊接於所述電路板3之所述第一焊接區31。複數所述第一端子211設有複數第一接地端子2116及複數第一差動端子2117,在本實施例中,兩所述第一差動端子2117設置於兩所述第一接地端子2116之間。在本實施例中,複數所述第一接地端子2116設有六支,複數所述第一差動端子2117設有十二支,所述第一差動端子2117用於訊號傳輸。Please refer to Figures 7 to 10, the first terminal set 21 is provided with a plurality of first terminals 211, a first substrate 212, a first conductive adhesive film 213 and a first holding body 214, the The first conductive adhesive film 213 is disposed under the first base 212, and the first base 212 covers the plurality of first terminals 211. Each of the first terminals 211 is provided with a first fixing portion 2111, a first step portion 2112, a first contact portion 2113, a first bending portion 2114 and a first welding portion 2115. The first fixing portion 2111 is exposed on the lower surface of the first base body 212, the front end of the first fixing portion 2111 is bent downward to form the first step portion 2112, and the first step portion 2112 is disposed on the bottom surface of the first base body 212. In the front end of the first base body 212, the front end of the first step portion 2112 extends forward from the front end surface of the first base body 212 and then bends downward to form the first contact portion 2113. The first contact portion 2113 The terminal groove 13 is disposed on the upper surface of the front end of the insertion channel 12, and the lower surface of each first contact portion 2113 protrudes from the terminal groove 13 and extends into the insertion channel 12. The rear end of the first fixing portion 2111 extends beyond the rear end surface of the first base body 212, and then extends downwardly and obliquely, and then bends and extends downward to form the first bending portion 2114. The bottom of the first bending portion 2114 The end is bent back and extends to form the first welding portion 2115, and the first welding portion 2115 is welded to the first welding area 31 of the circuit board 3. The plurality of first terminals 211 are provided with a plurality of first ground terminals 2116 and a plurality of first differential terminals 2117. In this embodiment, the two first differential terminals 2117 are provided between the two first ground terminals 2116. between. In this embodiment, the plurality of first ground terminals 2116 are provided with six, the plurality of first differential terminals 2117 are provided with twelve, and the first differential terminals 2117 are used for signal transmission.

所述第一基體212包覆所述第一固定部2111之後端及所述第一台階部2112,所述第一固持體214包覆所述第一彎折部2114底端。所述第一基體212設有一凸扣2121、一第一凹槽2122、複數第一開口2123及複數第一凸台2124。所述第一基體212下表面設有向下延伸的所述凸扣2121,所述凸扣2121固定於所述第三端子組23之對應機構以實現所述第一端子組21與所述第三端子組23定位固持。所述第一基體212下表面設有向上凹陷的所述第一凹槽2122,所述第一導電膠膜213設置於所述第一凹槽2122內。所述第一基體212兩側分別設有貫穿所述第一基體212上、下表面的複數所述第一開口2123,複數所述第一接地端子2116之所述第一固定部2111及複數所述第一差動端子2117之所述第一固定部2111外露於所述第一開口2123。所述第一基體212下表面設有向下延伸的複數所述第一凸台2124,在所述第一端子組21之第一實施例中,所述第一凸台2124一體成型於所述第一凹槽2122內。複數所述第一凸台2124橫向排列並設置於所述第一凹槽2122之前後兩端,所述第一凸台2124延伸方向與所述第一端子211延伸方向彼此垂直。在本實施例中,每一所述第一凸台2124之位置對應兩所述第一差動端子2117之位置,複數所述第一差動端子2117之所述第一固定部2111之下表面之一部分被複數所述第一凸台2124所包覆。兩所述第一凸台2124之間設有一第一凹口2125,在本實施例中,所述第一凹口2125之位置對應所述第一接地端子2116之位置,所述第一接地端子2116卡固於所述第一凹口2125,複數所述第一接地端子2116之所述第一固定部2111之下表面之一部分外露於複數所述第一凹口2125。請參閱第六圖、第八圖及第九圖所示,所述第一導電膠膜213沿著所述第一凸台2124與所述第一凹口2125之形狀黏貼所述第一凸台2124之下表面並覆蓋於所述第一凹口2125,所述第一導電膠膜213之對應機構伸入複數所述第一凹口2125並電連接於所述第一接地端子2116之所述第一固定部2111,使複數所述第一接地端子2116形成一串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。複數所述第一凸台2124阻隔於所述第一導電膠膜213與複數所述第一差動端子2117之所述第一固定部2111之間,避免所述第一導電膠膜213接觸複數所述第一差動端子2117之所述第一固定部2111。The first base body 212 covers the rear end of the first fixing part 2111 and the first step part 2112, and the first holding body 214 covers the bottom end of the first bending part 2114. The first base body 212 is provided with a convex button 2121, a first groove 2122, a plurality of first openings 2123 and a plurality of first bosses 2124. The lower surface of the first base body 212 is provided with the protruding buckle 2121 extending downward, and the protruding buckle 2121 is fixed to the corresponding mechanism of the third terminal set 23 to realize the first terminal set 21 and the second terminal set 21. The three-terminal group 23 is positioned and held. The lower surface of the first base body 212 is provided with the first groove 2122 recessed upward, and the first conductive adhesive film 213 is disposed in the first groove 2122. Both sides of the first base body 212 are respectively provided with a plurality of the first openings 2123 penetrating the upper and lower surfaces of the first base body 212, the first fixing portions 2111 of the plurality of first ground terminals 2116, and the plurality of locations. The first fixing portion 2111 of the first differential terminal 2117 is exposed outside the first opening 2123. The lower surface of the first base body 212 is provided with a plurality of the first bosses 2124 extending downward. In the first embodiment of the first terminal set 21, the first bosses 2124 are integrally formed on the Inside the first groove 2122. A plurality of the first bosses 2124 are arranged horizontally and disposed at the front and back ends of the first groove 2122, and the extending direction of the first boss 2124 and the extending direction of the first terminal 211 are perpendicular to each other. In this embodiment, the position of each of the first bosses 2124 corresponds to the position of the two first differential terminals 2117, and the bottom surface of the first fixing portion 2111 of the plurality of first differential terminals 2117 A part is covered by the plurality of first bosses 2124. A first notch 2125 is provided between the two first bosses 2124. In this embodiment, the position of the first notch 2125 corresponds to the position of the first ground terminal 2116. 2116 is clamped in the first recess 2125, and a part of the lower surface of the first fixing portion 2111 of the plurality of first ground terminals 2116 is exposed in the plurality of first recesses 2125. Please refer to the sixth, eighth and ninth figures, the first conductive adhesive film 213 adheres to the first boss along the shape of the first boss 2124 and the first recess 2125 The lower surface of 2124 covers the first recess 2125, and the corresponding mechanism of the first conductive adhesive film 213 extends into the plurality of first recesses 2125 and is electrically connected to the first ground terminal 2116. The first fixing portion 2111 makes the plurality of first ground terminals 2116 form a series of ground structures 26, so that signal noise can be effectively absorbed and suppressed and the quality of high-frequency signal transmission is improved. The plurality of first bosses 2124 are blocked between the first conductive adhesive film 213 and the first fixing portion 2111 of the plurality of first differential terminals 2117 to prevent the first conductive adhesive film 213 from contacting the plurality of The first fixing portion 2111 of the first differential terminal 2117.

請參閱第二十四圖及第二十五圖所示,係本創作第二實施例之所述第一端子組21之分解圖,所述第一端子組21之第二實施例與第一實施例之差異主要在於所述第一凸台2124’,在第二實施例中,所述第一凸台2124’一體成型於所述第一凹槽2122內。複數所述第一凸台2124’縱向排列並延伸於所述第一凹槽2122中,複數所述第一凸台2124’之前後兩端分別連接所述第一凹槽2122之前後兩端,所述第一凸台2124’延伸方向與所述第一端子211延伸方向一樣。在本實施例中,每一所述第一凸台2124’之左右兩側分別形成一第一阻隔部2127,兩所述第一阻隔部2127中間形成一第一斷開空間2128,每一所述第一阻隔部2127設置於一所述第一接地端子2116與一所述第一差動端子2117之間,兩所述第一差動端子2117設置在所述第一斷開空間2128。每一所述第一阻隔部2127一側皆設有向下凹陷的一第一凹部2126,在本實施例中,所述第一差動端子2117設置於所述第一凹部2126一側,所述第一差動端子2117設置於所述第一凹部2126上,所述第一接地端子2116設置於所述第一凹部2126另一側。複數所述第一差動端子2117之所述第一固定部2111之下表面之一部分被複數所述第一凹部2126所阻隔。所述第一導電膠膜213沿著所述第一接地端子2116與所述第一凸台2124’之形狀黏貼所述第一凸台2124’之下表面。複數所述第一凹部2126阻隔於所述第一導電膠膜213與複數所述第一差動端子2117之所述第一固定部2111之間,避免所述第一導電膠膜213接觸複數所述第一差動端子2117之所述第一固定部2111。所述第一導電膠膜213之對應機構電連接於所述第一接地端子2116之所述第一固定部2111,使複數所述第一接地端子2116形成所述串地結構26。Please refer to Figure 24 and Figure 25, which are the exploded views of the first terminal set 21 of the second embodiment of the present creation. The second embodiment of the first terminal set 21 and the first The main difference between the embodiments lies in the first boss 2124 ′. In the second embodiment, the first boss 2124 ′ is integrally formed in the first groove 2122. The plurality of first bosses 2124' are arranged longitudinally and extend in the first groove 2122, the front and back ends of the plurality of first bosses 2124' are respectively connected to the front and back ends of the first groove 2122, The extending direction of the first boss 2124 ′ is the same as the extending direction of the first terminal 211. In this embodiment, a first blocking portion 2127 is formed on the left and right sides of each first boss 2124', and a first disconnected space 2128 is formed between the two first blocking portions 2127, and each The first blocking portion 2127 is disposed between the first ground terminal 2116 and the first differential terminal 2117, and the two first differential terminals 2117 are disposed in the first disconnected space 2128. Each side of the first blocking portion 2127 is provided with a first recess 2126 recessed downward. In this embodiment, the first differential terminal 2117 is provided on the side of the first recess 2126, so The first differential terminal 2117 is disposed on the first recess 2126, and the first ground terminal 2116 is disposed on the other side of the first recess 2126. A part of the lower surface of the first fixing portion 2111 of the plurality of first differential terminals 2117 is blocked by the plurality of first recesses 2126. The first conductive adhesive film 213 is adhered to the lower surface of the first boss 2124' along the shape of the first ground terminal 2116 and the first boss 2124'. The plurality of first recesses 2126 are blocked between the first conductive adhesive film 213 and the first fixing portions 2111 of the plurality of first differential terminals 2117, so as to prevent the first conductive adhesive film 213 from contacting the plurality of locations. The first fixing portion 2111 of the first differential terminal 2117. The corresponding mechanism of the first conductive adhesive film 213 is electrically connected to the first fixing portion 2111 of the first ground terminal 2116, so that a plurality of the first ground terminals 2116 form the string ground structure 26.

所述第一導電膠膜213設有一第一金屬層2131,所述第一金屬層2131設置於所述第一導電膠膜213上表面,在本實施例中,所述第一金屬層2131設計成有複數孔隙25的一圖形28,所述第一金屬層2131具有形狀相同的複數所述孔隙25,複數所述孔隙25之間形成複數條連續且交錯的線條27,因此所述第一金屬層2131之複數所述孔隙25可使部分訊號從其穿透所述第一金屬層2131,僅有部分訊號被所述第一金屬層2131反射。相比於先前技術之金屬鍍層為整片無孔隙之設計,訊號在碰到無孔隙之金屬鍍層容易造成震盪反射,此震盪會產生許多不必要的諧振點。在本實施例中,複數所述孔隙25為正方形。在具體實施時,複數所述孔隙25可為任意形狀,亦可以由兩組以上形狀不同的所述孔隙25組成所述圖形28,例如第一組所述孔隙25之形狀為正方形,第二組所述孔隙25之形狀為L型。具體實施時,所述第一金屬層2131可採用蒸鍍、電鍍、雷射雕刻等方式形成於所述第一導電膠模213上。The first conductive adhesive film 213 is provided with a first metal layer 2131, and the first metal layer 2131 is provided on the upper surface of the first conductive adhesive film 213. In this embodiment, the first metal layer 2131 is designed A pattern 28 with a plurality of pores 25 is formed. The first metal layer 2131 has a plurality of the pores 25 with the same shape. A plurality of continuous and interlaced lines 27 are formed between the plurality of pores 25. Therefore, the first metal The plurality of pores 25 of the layer 2131 can allow part of the signal to penetrate the first metal layer 2131 therefrom, and only part of the signal is reflected by the first metal layer 2131. Compared with the metal coating of the prior art, which is a whole piece of non-porous design, when the signal encounters the non-porous metal coating, it is easy to cause oscillating reflection, and this oscillation will generate many unnecessary resonance points. In this embodiment, the plurality of pores 25 are square. In specific implementation, the plurality of pores 25 can be of any shape, and the pattern 28 can also be composed of more than two groups of pores 25 with different shapes. For example, the shape of the pores 25 in the first group is square, and the shape of the pores 25 in the second group is square. The shape of the pore 25 is L-shaped. In specific implementation, the first metal layer 2131 may be formed on the first conductive rubber mold 213 by evaporation, electroplating, laser engraving, or the like.

本創作高速連接器100透過有所述孔隙25的所述圖形28之所述第一金屬層2131,在高頻特性中不易產生諧振點,使震盪反射影響較小,遠端串音、近端串音、插入損失及反射損失之性能比起先前技術更佳。在具體實施時,所述第一金屬層2131之所述圖形28不限於此形狀。請參閱第六圖、第八圖及第九圖所示,所述第一導電膠膜213黏貼於所述第一凸台2124,所述第一導電膠膜213之所述第一金屬層2131接觸於所述第一接地端子2116之所述第一固定部2111,使複數所述第一接地端子2116形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。The high-speed connector 100 of the present invention penetrates the first metal layer 2131 of the pattern 28 with the aperture 25, and it is not easy to produce resonance points in the high-frequency characteristics, so that the impact of the vibration reflection is small, and the far-end crosstalk, the near-end The performance of crosstalk, insertion loss and reflection loss is better than the previous technology. In specific implementation, the pattern 28 of the first metal layer 2131 is not limited to this shape. Please refer to the sixth, eighth and ninth figures, the first conductive adhesive film 213 is adhered to the first boss 2124, and the first metal layer 2131 of the first conductive adhesive film 213 The first fixing portion 2111 contacting the first ground terminal 2116 makes a plurality of the first ground terminals 2116 form the series ground structure 26, so that the signal noise can be effectively absorbed and suppressed and the height is improved. The quality of frequency signal transmission.

請參閱第十一圖至第十四圖所示,所述第二端子組22與所述第一端子組21上下相對應,所述第二端子組22設有複數第二端子221、一第二基體222及一第二導電膠膜223,所述第二導電膠膜223設置於所述第二基體222上方,所述第二基體222固持複數所述第二端子221。每一所述第二端子221皆設有一第二固定部2211、一第二台階部2212、一第二接觸部2213及一第二焊接部2214,所述第二固定部2211前端向上彎折形成所述第二台階部2212,所述第二台階部2212設置於所述第二基體222前端內,所述第二台階部2212前端往前延伸出所述第二基體222前端面後向上彎折形成所述第二接觸部2213,所述第二接觸部2213設置於所述插接通道12前端之下表面之所述端子槽13,且每一所述第二接觸部2213之上表面凸出所述端子槽13並伸入所述插接通道12中。所述第二固定部2211後端往下彎折並後延伸形成所述第二焊接部2214,所述第二焊接部2214焊接於所述電路板3之所述第二焊接區32。複數所述第二端子221設有複數第二接地端子2215及複數第二差動端子2216,在本實施例中,兩所述第二差動端子2216設置於兩所述第二接地端子2215之間。在本實施例中,複數所述第二接地端子2215設有六支,複數所述第二差動端子2216設有十二支,所述第二差動端子2216用於訊號傳輸。Please refer to the eleventh to fourteenth figures, the second terminal set 22 corresponds to the first terminal set 21 up and down, and the second terminal set 22 is provided with a plurality of second terminals 221, a first Two substrates 222 and a second conductive adhesive film 223. The second conductive adhesive film 223 is disposed above the second substrate 222, and the second substrate 222 holds a plurality of the second terminals 221. Each of the second terminals 221 is provided with a second fixing portion 2211, a second step portion 2212, a second contact portion 2213, and a second welding portion 2214. The front end of the second fixing portion 2211 is bent upward to form The second step portion 2212, the second step portion 2212 is disposed in the front end of the second base body 222, and the front end of the second step portion 2212 extends forward from the front end surface of the second base body 222 and then bends upward The second contact portion 2213 is formed. The second contact portion 2213 is disposed on the terminal groove 13 on the lower surface of the front end of the insertion channel 12, and the upper surface of each second contact portion 2213 protrudes The terminal slot 13 extends into the insertion channel 12. The rear end of the second fixing portion 2211 is bent downward and then extends to form the second welding portion 2214, and the second welding portion 2214 is welded to the second welding area 32 of the circuit board 3. The plurality of second terminals 221 are provided with a plurality of second ground terminals 2215 and a plurality of second differential terminals 2216. In this embodiment, the two second differential terminals 2216 are provided between the two second ground terminals 2215. between. In this embodiment, the plurality of second ground terminals 2215 are provided with six, the plurality of second differential terminals 2216 are provided with twelve, and the second differential terminals 2216 are used for signal transmission.

在本實施例中,請參閱第五圖所示,所述第一固定部2111之長度大於所述第二固定部2211之長度,所述第一台階部2112之長度等於所述第二台階部2212之長度,所述第一接觸部2113之長度等於所述第二接觸部2213之長度。In this embodiment, referring to the fifth figure, the length of the first fixing portion 2111 is greater than the length of the second fixing portion 2211, and the length of the first step portion 2112 is equal to the length of the second step portion The length of 2212, the length of the first contact portion 2113 is equal to the length of the second contact portion 2213.

所述第二基體222固持所述第二固定部2211及所述第二台階部2212。所述第二基體222設有一第二凹槽2221、複數第二開口2222及複數第二凸台2223。所述第二基體222上表面設有向下凹陷的所述第二凹槽2221,所述第二導電膠膜223設置於所述第二凹槽2221內。所述第二基體222兩側分別設有貫穿所述第二基體222上、下表面的複數所述第二開口2222,複數所述第二接地端子2115之所述第二固定部2211及複數所述第二差動端子2216之所述第二固定部2211外露於所述第二開口2222。所述第二基體222上表面設有向上延伸的複數所述第二凸台2223,在所述第二端子組22之第一實施例中,所述第二凸台2223一體成型於所述第二凹槽2221內。複數所述第二凸台2223橫向排列並設置於所述第二凹槽2221之前後兩端,所述第二凸台2223延伸方向與所述第二端子221延伸方向彼此垂直。在本實施例中,每一所述第二凸台2223之位置對應兩所述第二差動端子2216之位置,複數所述第二差動端子2216之所述第二固定部2211之上表面之一部分被複數所述第二凸台2223所包覆。兩所述第二凸台2223之間設有一第二凹口2224,在本實施例中,所述第二凹口2224之位置對應所述第二接地端子2215之位置,所述第二接地端子2215卡固於所述第二凹口2224,複數所述第二接地端子2215之所述第二固定部2211之上表面之一部分外露於複數所述第二凹口2224。請參閱第六圖、第十二圖及第十三圖所示,所述第二導電膠膜223沿著所述第二凸台2223與所述第二凹口2224之形狀黏貼所述第二凸台2223之上表面並覆蓋於所述第二凹口2224,所述第二導電膠膜223之對應機構伸入複數所述第二凹口2224並電連接於所述第二接地端子2215之所述第二固定部2211,使複數所述第二接地端子2215形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。複數所述第二凸台2223阻隔於所述第二導電膠膜223與複數所述第二差動端子2216之所述第二固定部2211之間,避免所述第二導電膠膜223接觸複數所述第二差動端子2216之所述第二固定部2211。The second base 222 holds the second fixing portion 2211 and the second step portion 2212. The second base 222 is provided with a second groove 2221, a plurality of second openings 2222 and a plurality of second bosses 2223. The upper surface of the second base 222 is provided with the second groove 2221 recessed downward, and the second conductive adhesive film 223 is disposed in the second groove 2221. The two sides of the second base 222 are respectively provided with a plurality of the second openings 2222 penetrating the upper and lower surfaces of the second base 222, the second fixing portion 2211 and the plurality of the second ground terminals 2115 The second fixing portion 2211 of the second differential terminal 2216 is exposed outside the second opening 2222. The upper surface of the second base 222 is provided with a plurality of the second bosses 2223 extending upward. In the first embodiment of the second terminal set 22, the second bosses 2223 are integrally formed on the first Inside the two grooves 2221. A plurality of the second bosses 2223 are arranged horizontally and disposed at the front and back ends of the second groove 2221, and the extension direction of the second boss 2223 and the extension direction of the second terminal 221 are perpendicular to each other. In this embodiment, the position of each of the second bosses 2223 corresponds to the position of the two second differential terminals 2216, and the upper surface of the second fixing portion 2211 of the plurality of second differential terminals 2216 A part is covered by the plurality of second bosses 2223. A second notch 2224 is provided between the two second bosses 2223. In this embodiment, the position of the second notch 2224 corresponds to the position of the second ground terminal 2215, and the second ground terminal 2215 is clamped to the second notch 2224, and a part of the upper surface of the second fixing portion 2211 of the plurality of second ground terminals 2215 is exposed from the plurality of second notches 2224. Please refer to the sixth, twelfth and thirteenth figures, the second conductive adhesive film 223 is pasted along the shape of the second boss 2223 and the second recess 2224. The upper surface of the boss 2223 covers the second recess 2224, and the corresponding mechanism of the second conductive adhesive film 223 extends into the plurality of second recesses 2224 and is electrically connected to the second ground terminal 2215. The second fixing portion 2211 makes the plurality of second ground terminals 2215 form the series ground structure 26, so that signal noise can be effectively absorbed and suppressed and the quality of high-frequency signal transmission can be improved. The plurality of second bosses 2223 are blocked between the second conductive adhesive film 223 and the second fixing portion 2211 of the plurality of second differential terminals 2216 to prevent the second conductive adhesive film 223 from contacting the plurality of The second fixing portion 2211 of the second differential terminal 2216.

請參閱第二十四圖及第二十六圖所示,係本創作第二實施例之所述第二端子組22之分解圖,所述第二端子組22之第二實施例與第一實施例之差異主要在於所述第二凸台2223’,在第二實施例中,所述第二凸台2223’一體成型於所述第二凹槽2221內。複數所述第二凸台2223’縱向排列並延伸於所述第二凹槽2221中,複數所述第二凸台2223’之前後兩端分別連接所述第二凹槽2221之前後兩端,所述第二凸台2223’延伸方向與所述第二端子221延伸方向一樣。在本實施例中,每一所述第二凸台2223’之左右兩側分別形成一第二阻隔部2226,兩所述第二阻隔部2226中間形成一第二斷開空間2227,每一所述第二阻隔部2226設置於一所述第二接地端子2215與一所述第二差動端子2216之間,兩所述第二差動端子2216設置在所述第二斷開空間2227。每一所述第二阻隔部2226一側皆設有向上凹陷的一第二凹部2225,在本實施例中,所述第二差動端子2216設置於所述第二凹部2225一側,所述第二差動端子2216設置於所述第二凹部2225上,所述第二接地端子2215設置於所述第二凹部2225另一側。複數所述第二差動端子2216之所述第二固定部2211之上表面之一部分被複數所述第二凹部2225所阻隔。所述第二導電膠膜223沿著所述第二接地端子2215與所述第二凸台2223’之形狀黏貼所述第二凸台2223’之上表面。複數所述第二凹部2225阻隔於所述第二導電膠膜223與複數所述第二差動端子2216之所述第二固定部2211之間,避免所述第二導電膠膜223接觸複數所述第二差動端子2216之所述第二固定部2211。所述第二導電膠膜223之對應機構電連接於所述第二接地端子2215之所述第二固定部2211,使複數所述第二接地端子2215形成所述串地結構26。Please refer to Figure 24 and Figure 26, which are the exploded views of the second terminal set 22 of the second embodiment of the present creation. The second embodiment of the second terminal set 22 and the first The main difference between the embodiments lies in the second boss 2223 ′. In the second embodiment, the second boss 2223 ′ is integrally formed in the second groove 2221. The plurality of second bosses 2223' are arranged longitudinally and extend in the second groove 2221, and the front and back ends of the plurality of second bosses 2223' are respectively connected to the front and back ends of the second groove 2221, The extension direction of the second boss 2223 ′ is the same as the extension direction of the second terminal 221. In this embodiment, a second blocking portion 2226 is formed on the left and right sides of each second boss 2223', and a second disconnected space 2227 is formed between the two second blocking portions 2226. The second blocking portion 2226 is disposed between the second ground terminal 2215 and the second differential terminal 2216, and the two second differential terminals 2216 are disposed in the second disconnected space 2227. Each side of the second blocking portion 2226 is provided with a second recess 2225 recessed upward. In this embodiment, the second differential terminal 2216 is provided on the side of the second recess 2225. The second differential terminal 2216 is disposed on the second concave portion 2225, and the second ground terminal 2215 is disposed on the other side of the second concave portion 2225. A part of the upper surface of the second fixing portion 2211 of the plurality of second differential terminals 2216 is blocked by the plurality of second recesses 2225. The second conductive adhesive film 223 is adhered to the upper surface of the second boss 2223' along the shape of the second ground terminal 2215 and the second boss 2223'. The plurality of second concave portions 2225 are blocked between the second conductive adhesive film 223 and the second fixing portion 2211 of the plurality of second differential terminals 2216, so as to prevent the second conductive adhesive film 223 from contacting the plurality of locations. The second fixing portion 2211 of the second differential terminal 2216. The corresponding mechanism of the second conductive adhesive film 223 is electrically connected to the second fixing portion 2211 of the second ground terminal 2215 so that a plurality of the second ground terminals 2215 form the string ground structure 26.

所述第二導電膠膜223設有一第二金屬層2231,所述第二金屬層2231設置於所述第二導電膠膜223下表面,在本實施例中,所述第二金屬層2231設計成有複數所述孔隙25的所述圖形28,所述第二金屬層2231具有形狀相同的複數所述孔隙25,複數所述孔隙25之間形成複數條連續且交錯的所述線條27,因此所述第二金屬層2231之複數所述孔隙25可使部分訊號從其穿透所述第二金屬層2231,僅有部分被所述第二金屬層2231反射。相比於先前技術之金屬鍍層為整片無孔隙之設計,訊號在碰到無孔隙之金屬鍍層容易造成震盪反射,此震盪會產生許多不必要的諧振點。本創作高速連接器100透過有所述孔隙25的所述圖形28,在高頻特性中不易產生諧振點,使震盪反射影響較小,遠端串音、近端串音、插入損失及反射損失之性能比起先前技術更佳。在具體實施時,所述第二金屬層2231之所述圖形28不限於此形狀。請參閱第六圖、第十二圖及第十三圖所示,所述第二導電膠膜223黏貼於所述第二凸台2223,所述第二導電膠膜223之所述第二金屬層2231接觸於所述第二接地端子2215之所述第二固定部2211,使複數所述第二接地端子2215形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。The second conductive adhesive film 223 is provided with a second metal layer 2231, and the second metal layer 2231 is provided on the lower surface of the second conductive adhesive film 223. In this embodiment, the second metal layer 2231 is designed The pattern 28 is formed with a plurality of the pores 25, the second metal layer 2231 has a plurality of the pores 25 with the same shape, and a plurality of continuous and interlaced lines 27 are formed between the plurality of pores 25, so The plurality of pores 25 of the second metal layer 2231 can allow part of the signal to penetrate the second metal layer 2231 therefrom, and only part of the signal is reflected by the second metal layer 2231. Compared with the metal coating of the prior art, which is a whole piece of non-porous design, when the signal encounters the non-porous metal coating, it is easy to cause oscillating reflection, and this oscillation will generate many unnecessary resonance points. The creative high-speed connector 100 through the pattern 28 with the aperture 25 is not easy to produce resonance points in high-frequency characteristics, so that the impact of oscillation reflection is small, and the far-end crosstalk, near-end crosstalk, insertion loss and reflection loss The performance is better than the previous technology. In a specific implementation, the pattern 28 of the second metal layer 2231 is not limited to this shape. Please refer to the sixth, twelfth and thirteenth figures, the second conductive adhesive film 223 is adhered to the second boss 2223, and the second metal of the second conductive adhesive film 223 The layer 2231 is in contact with the second fixing portion 2211 of the second ground terminal 2215, so that a plurality of the second ground terminals 2215 form the series ground structure 26, so that the signal noise can be effectively absorbed and suppressed. Improve the quality of high-frequency signal transmission.

在本實施例中,複數所述孔隙25為正方形。在具體實施時,複數所述孔隙25可為任意形狀,亦可以由兩組以上形狀不同的所述孔隙25組成所述圖形28,例如第一組所述孔隙25之形狀為正方角形,第二組所述孔隙25之形狀為凸字形,第三組所述孔隙25之形狀為十字形。在具體實施時,所述第二金屬層2231可採用蒸鍍、電鍍、雷射雕刻等方式形成於所述第二導電膠模223上。再者,所述第一金屬層2131之圖形可不同於所述第二金屬層2231之圖形,所述第一金屬層2131之圖形可配合所述第一端子組21之整體結構進行設計,所述第二金屬層2231之圖形可配合所述第二端子組22之整體結構進行設計。In this embodiment, the plurality of pores 25 are square. In specific implementation, the plurality of pores 25 can be of any shape, and the pattern 28 can also be composed of more than two groups of pores 25 with different shapes. The shape of the holes 25 in the group is convex, and the shape of the holes 25 in the third group is a cross. In specific implementation, the second metal layer 2231 may be formed on the second conductive rubber mold 223 by evaporation, electroplating, laser engraving, or the like. Furthermore, the pattern of the first metal layer 2131 can be different from the pattern of the second metal layer 2231, and the pattern of the first metal layer 2131 can be designed to match the overall structure of the first terminal group 21, so The pattern of the second metal layer 2231 can be designed to match the overall structure of the second terminal set 22.

請參閱第十五圖至第十八圖所示,所述第三端子組23設有複數第三端子231、一第三基體232、一第三導電膠膜233及一第二固持體234,所述第三導電膠膜233設置於所述第三基體232下方,所述第三基體232固持複數所述第三端子231。每一所述第三端子231皆設有一第三固定部2311、一第三接觸部2312、一第三彎折部2313及一第三焊接部2314,所述第三固定部2311前端往前延伸出所述第三基體232前端面後向下彎折形成所述第三接觸部2313。所述第三固定部2311後端延伸出所述第三基體232後端面後彎折向下並傾斜延伸,再彎折向下延伸形成所述第三彎折部2314,所述第三彎折部2314底端往後彎折延伸形成所述第三焊接部2315,所述第三焊接部2315焊接於所述電路板3之所述第三焊接區33。複數所述第三端子231設有複數第三接地端子2315及複數第三差動端子2316,在本實施例中,兩所述第三差動端子2316設置於兩所述第三接地端子2315之間。在本實施例中,複數所述第三接地端子2315設有六支,複數所述第三差動端子2316設有十二支,所述第三差動端子2316用於訊號傳輸。Please refer to the fifteenth to eighteenth figures, the third terminal set 23 is provided with a plurality of third terminals 231, a third base body 232, a third conductive adhesive film 233 and a second holding body 234, The third conductive adhesive film 233 is disposed under the third base 232, and the third base 232 holds a plurality of the third terminals 231. Each of the third terminals 231 is provided with a third fixing portion 2311, a third contact portion 2312, a third bending portion 2313, and a third welding portion 2314, and the front end of the third fixing portion 2311 extends forward After exiting the front end surface of the third base body 232, bend downward to form the third contact portion 2313. The rear end of the third fixing portion 2311 extends beyond the rear end of the third base body 232, and then it is bent downward and extends obliquely, and then it is bent and extends downward to form the third bending portion 2314. The bottom end of the portion 2314 is bent back and extends to form the third welding portion 2315, and the third welding portion 2315 is welded to the third welding area 33 of the circuit board 3. The plurality of third terminals 231 are provided with a plurality of third ground terminals 2315 and a plurality of third differential terminals 2316. In this embodiment, the two third differential terminals 2316 are provided between the two third ground terminals 2315 between. In this embodiment, the plurality of third ground terminals 2315 are provided with six, the plurality of third differential terminals 2316 are provided with twelve, and the third differential terminals 2316 are used for signal transmission.

所述第三基體232固持所述第三固定部2311,所述第二固持體234固持所述第三彎折部2314底端。所述第三基體232設有一缺口2321、複數定位孔2322、一第三凹槽2323、複數第三開口2324及複數第三凸台2325。所述第三基體232上表面設有向下凹陷的所述缺口2321,所述缺口2321用於與所述第一端子組21之所述第一基體212之所述凸扣2121卡固以實現所述第三端子組23與所述第一端子組21定位固持。所述第三基體232下表面設有向上凹陷的複數定位孔2322,所述定位孔2322用於與所述第四端子組24之對應機構卡固以實現所述第三端子組23與所述第四端子組24定位固持。所述第三基體232下表面設有向上凹陷的所述第三凹槽2323,所述第三導電膠膜233設置於所述第三凹槽2323內。所述第三基體232兩側分別設有貫穿所述第三基體232上、下表面的複數所述第三開口2324,複數所述第三接地端子2315之所述第三固定部2311及複數所述第三差動端子2316之所述第三固定部2311外露於所述第三開口2324。所述第三基體232下表面設有向下延伸的複數所述第三凸台2325,在所述第三端子組23之第一實施例中,所述第三凸台2325一體成型於所述第三凹槽2323內。複數所述第三凸台2325橫向排列並設置於所述第三凹槽2323之前後兩端,所述第三凸台2325延伸方向與所述第三端子231延伸方向彼此垂直,在本實施例中,每一所述第三凸台2325之位置對應兩所述第三差動端子2316之位置,複數所述第三差動端子2316之所述第三固定部2311之下表面之一部分被複數所述第三凸台2325所包覆。兩所述第三凸台2325之間設有一第三凹口2326,在本實施例中,所述第三凹口2326之位置對應所述第三接地端子2315之位置,所述第三接地端子2315卡固於所述第三凹口2326,複數所述第三接地端子2315之所述第三固定部2311之下表面之一部分外露於複數所述第三凹口2326。請參閱第六圖、第十六圖及第十七圖所示,所述第三導電膠膜233沿著所述第三凸台2325與所述第三凹口2326之形狀黏貼所述第三凸台2325之下表面並覆蓋於所述第三凹口2326,所述第三導電膠膜233之對應機構伸入複數所述第三凹口2326並電連接於所述第三接地端子2315之所述第三固定部2311,使複數所述第三接地端子2315形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。複數所述第三凸台2325阻隔於所述第三導電膠膜233與複數所述第三差動端子2316之所述第三固定部2311之間,避免所述第一導電膠膜213接觸複數所述第三差動端子2316之所述第三固定部2311。The third base body 232 holds the third fixing portion 2311, and the second holding body 234 holds the bottom end of the third bending portion 2314. The third base body 232 is provided with a notch 2321, a plurality of positioning holes 2322, a third groove 2323, a plurality of third openings 2324, and a plurality of third bosses 2325. The upper surface of the third base body 232 is provided with a downwardly recessed notch 2321, and the notch 2321 is used to fasten with the protruding buckle 2121 of the first base body 212 of the first terminal set 21 to achieve The third terminal group 23 and the first terminal group 21 are positioned and held. The lower surface of the third base body 232 is provided with a plurality of positioning holes 2322 recessed upward, and the positioning holes 2322 are used to fasten with the corresponding mechanism of the fourth terminal set 24 to realize the connection between the third terminal set 23 and the The fourth terminal group 24 is positioned and held. The lower surface of the third base body 232 is provided with the third groove 2323 recessed upward, and the third conductive adhesive film 233 is disposed in the third groove 2323. Both sides of the third base body 232 are respectively provided with a plurality of the third openings 2324 penetrating through the upper and lower surfaces of the third base body 232, the third fixing portions 2311 and the plurality of points of the plurality of third ground terminals 2315 The third fixing portion 2311 of the third differential terminal 2316 is exposed outside the third opening 2324. The lower surface of the third base body 232 is provided with a plurality of the third bosses 2325 extending downward. In the first embodiment of the third terminal set 23, the third bosses 2325 are integrally formed on the Inside the third groove 2323. A plurality of the third bosses 2325 are arranged horizontally and arranged at the front and back ends of the third groove 2323, and the extension direction of the third boss 2325 and the extension direction of the third terminal 231 are perpendicular to each other. In this embodiment Wherein, the position of each of the third bosses 2325 corresponds to the position of the two third differential terminals 2316, and a part of the lower surface of the third fixing portion 2311 of the plurality of third differential terminals 2316 is plural The third boss 2325 is covered. A third notch 2326 is provided between the two third bosses 2325. In this embodiment, the position of the third notch 2326 corresponds to the position of the third ground terminal 2315, and the third ground terminal 2315 is clamped in the third notch 2326, and a part of the lower surface of the third fixing portion 2311 of the plurality of third ground terminals 2315 is exposed from the plurality of third notches 2326. Please refer to Figures 6, 16, and 17, the third conductive adhesive film 233 is pasted along the shape of the third boss 2325 and the third recess 2326. The lower surface of the boss 2325 covers the third recess 2326, and the corresponding mechanism of the third conductive adhesive film 233 extends into the plurality of third recesses 2326 and is electrically connected to the third ground terminal 2315 The third fixing portion 2311 makes the plurality of third ground terminals 2315 form the series ground structure 26, so that signal noise can be effectively absorbed and suppressed and the quality of high-frequency signal transmission can be improved. The plurality of third bosses 2325 are blocked between the third conductive adhesive film 233 and the third fixing portion 2311 of the plurality of third differential terminals 2316 to prevent the first conductive adhesive film 213 from contacting the plurality of The third fixing portion 2311 of the third differential terminal 2316.

請參閱第二十四圖及第二十七圖所示,係本創作第二實施例之所述第三端子組23之分解圖,所述第三端子組23之第二實施例與第一實施例之差異主要在於所述第三凸台2325’,在第二實施例中,所述第三凸台2325’一體成型於所述第三凹槽2323內,複數所述第三凸台2325’縱向排列並延伸於所述第三凹槽2323中,複數所述第三凸台2325’之前後兩端分別連接所述第三凹槽2323之前後兩端,所述第三凸台2325’延伸方向與所述第三端子231延伸方向一樣。在本實施例中,每一所述第三凸台2325’之左右兩側分別形成一第三阻隔部2328,兩所述第三阻隔部2328中間形成一第三斷開空間2329,每一所述第三阻隔部2328設置於一所述第三接地端子2315與一所述第三差動端子2316之間,兩所述第三差動端子2316設置在所述第三斷開空間2329。每一所述第三阻隔部2328一側皆設有向下凹陷的一第三凹部2327,在本實施例中,所述第三差動端子2316設置於所述第三凹部2327一側,所述第三差動端子2316設置於所述第三凹部2327上,所述第三接地端子2315設置於所述第三凹部2327另一側。複數所述第三差動端子2316之所述第三固定部2311之下表面之一部分被複數所述第三凹部2327所阻隔。所述第三導電膠膜233沿著所述第三接地端子2315與所述第三凸台2325’之形狀黏貼所述第三凸台2325’之下表面。複數所述第三凹部2327阻隔於所述第三導電膠膜233與複數所述第三差動端子2316之所述第三固定部2311之間,避免所述第三導電膠膜233接觸複數所述第三差動端子2316之所述第三固定部2311之間。所述第三導電膠膜233之對應機構電連接於所述第三接地端子2315之所述第三固定部2311,使複數所述第三接地端子2315形成所述串地結構26。Please refer to Figure 24 and Figure 27, which are the exploded views of the third terminal set 23 of the second embodiment of the present creation. The second embodiment and the first embodiment of the third terminal set 23 The difference between the embodiments is mainly the third boss 2325'. In the second embodiment, the third boss 2325' is integrally formed in the third groove 2323, and the third boss 2325 is plural. 'Longitudinal arrangement and extending in the third groove 2323, the front and rear ends of the plurality of third bosses 2325' are respectively connected to the front and back ends of the third groove 2323, the third boss 2325' The extension direction is the same as the extension direction of the third terminal 231. In this embodiment, a third blocking portion 2328 is formed on the left and right sides of each third boss 2325', and a third disconnected space 2329 is formed between the two third blocking portions 2328. The third blocking portion 2328 is disposed between the third ground terminal 2315 and the third differential terminal 2316, and the two third differential terminals 2316 are disposed in the third disconnected space 2329. Each side of the third blocking portion 2328 is provided with a third recess 2327 recessed downward. In this embodiment, the third differential terminal 2316 is provided on the side of the third recess 2327, so The third differential terminal 2316 is provided on the third recess 2327, and the third ground terminal 2315 is provided on the other side of the third recess 2327. A part of the lower surface of the third fixing portion 2311 of the plurality of third differential terminals 2316 is blocked by the plurality of third recesses 2327. The third conductive adhesive film 233 is adhered to the lower surface of the third boss 2325' along the shape of the third ground terminal 2315 and the third boss 2325'. The plurality of third concave portions 2327 are blocked between the third conductive adhesive film 233 and the third fixing portion 2311 of the plurality of third differential terminals 2316, so as to prevent the third conductive adhesive film 233 from contacting the plurality of locations. Between the third fixed portion 2311 of the third differential terminal 2316. The corresponding mechanism of the third conductive adhesive film 233 is electrically connected to the third fixing portion 2311 of the third ground terminal 2315, so that a plurality of the third ground terminals 2315 form the string ground structure 26.

所述第三導電膠膜233設有一第三金屬層2331,所述第三金屬層2331設置於所述第三導電膠膜233上表面,在本實施例中,所述第三金屬層2331設計成有複數所述孔隙25的所述圖形28,所述第三金屬層2331具有形狀相同的複數所述孔隙25,複數所述孔隙25之間形成複數條連續且交錯的所述線條27,因此所述第三金屬層2331之複數所述孔隙25可使部分訊號從其穿透所述第三金屬層2331,僅有部分被所述第三金屬層2331反射。相比於先前技術之金屬鍍層為整片無孔隙之設計,訊號在碰到無孔隙之金屬鍍層容易造成震盪反射,此震盪會產生許多不必要的諧振點。本創作高速連接器100透過有所述孔隙25的所述圖形28,在高頻特性中不易產生諧振點,使震盪反射影響較小,遠端串音、近端串音、插入損失及反射損失之性能比起先前技術更佳。在具體實施時,所述第三金屬層2331之所述圖形28不限於此形狀。請參閱第六圖、第十六圖及第十七圖所示,所述第三導電膠膜233黏貼於所述第三凸台2325,所述第三導電膠膜233之所述第三金屬層2331接觸於所述第三接地端子2315之所述第三固定部2311,使複數所述第三接地端子2315形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。The third conductive adhesive film 233 is provided with a third metal layer 2331, and the third metal layer 2331 is provided on the upper surface of the third conductive adhesive film 233. In this embodiment, the third metal layer 2331 is designed The pattern 28 is formed with a plurality of the pores 25, the third metal layer 2331 has a plurality of the pores 25 with the same shape, and a plurality of continuous and interlaced lines 27 are formed between the plurality of pores 25, so The plurality of pores 25 of the third metal layer 2331 can allow part of the signal to penetrate the third metal layer 2331, and only part of the signal is reflected by the third metal layer 2331. Compared with the metal coating of the prior art, which is a whole piece of non-porous design, when the signal encounters the non-porous metal coating, it is easy to cause oscillating reflection, and this oscillation will generate many unnecessary resonance points. The creative high-speed connector 100 through the pattern 28 with the aperture 25 is not easy to produce resonance points in high-frequency characteristics, so that the impact of oscillation reflection is small, and the far-end crosstalk, near-end crosstalk, insertion loss and reflection loss The performance is better than the previous technology. In specific implementation, the pattern 28 of the third metal layer 2331 is not limited to this shape. Please refer to Figures 6, 16, and 17, the third conductive adhesive film 233 is adhered to the third boss 2325, and the third metal of the third conductive adhesive film 233 The layer 2331 is in contact with the third fixing portion 2311 of the third ground terminal 2315, so that a plurality of the third ground terminals 2315 form the series ground structure 26, so that the signal noise can be effectively absorbed and suppressed. Improve the quality of high-frequency signal transmission.

在本實施例中,複數所述孔隙25為正方形。在具體實施時,複數所述孔隙25可為任意形狀,亦可以由兩組以上形狀不同的所述孔隙25組成所述圖形28,例如第一組所述孔隙25之形狀為扇形,第二組所述孔隙25之形狀為三角形,第三組所述孔隙25之形狀為橢圓形。在具體實施時,所述第三金屬層2331可採用蒸鍍、電鍍、雷射雕刻等方式形成於所述第三導電膠模233上。再者,所述第一金屬層2131之圖形與所述第二金屬層2231之圖形可不同於所述第三金屬層2331之圖形,所述第三金屬層2331之圖形可配合所述第三端子組23之整體結構進行設計。In this embodiment, the plurality of pores 25 are square. In specific implementation, the plurality of pores 25 can be of any shape, and the pattern 28 can also be composed of more than two groups of pores 25 with different shapes. For example, the shape of the pores 25 in the first group is fan-shaped, and the shape of the pores 25 in the second group The shape of the pores 25 is a triangle, and the shape of the pores 25 of the third group is an ellipse. In specific implementation, the third metal layer 2331 may be formed on the third conductive rubber mold 233 by evaporation, electroplating, laser engraving, or the like. Furthermore, the pattern of the first metal layer 2131 and the pattern of the second metal layer 2231 may be different from the pattern of the third metal layer 2331, and the pattern of the third metal layer 2331 may match the pattern of the third metal layer 2331. The overall structure of the terminal set 23 is designed.

請參閱第十九圖至第二十二圖所示,所述第四端子組24與所述第三端子組23上下相對應,所述第四端子組24設有複數第四端子241、一第四基體242及一第四導電膠膜243,所述第四導電膠膜243設置於所述第四基體242下方,所述第四基體242固持複數所述第四端子241。每一所述第四端子241皆設有一第四固定部2411、一第四接觸部2412及一第四焊接部2413,所述第四固定部2411前端延伸出所述第四基體242前端面並向上彎折形成所述第四接觸部2412。所述第四固定部2411後端往後延伸出所述第四基體242後端面,並下向彎折後再向後彎折以形成所述第四焊接部2413,所述第四焊接部2413焊接於所述電路板3之所述第四焊接區34。所述第四端子241設有複數第四接地端子2414及複數第四差動端子2415,在本實施例中,兩所述第四差動端子2415設置於兩所述第四接地端子2414之間。在本實施例中,複數所述第四接地端子2414設有六支,複數所述第四差動端子2415設有十二支,所述第四差動端子2415用於訊號傳輸。Please refer to Figures 19 to 22, the fourth terminal set 24 corresponds to the third terminal set 23 up and down, and the fourth terminal set 24 is provided with a plurality of fourth terminals 241, one The fourth base 242 and a fourth conductive adhesive film 243 are disposed under the fourth base 242, and the fourth base 242 holds a plurality of the fourth terminals 241. Each of the fourth terminals 241 is provided with a fourth fixing portion 2411, a fourth contact portion 2412, and a fourth welding portion 2413. The front end of the fourth fixing portion 2411 extends out of the front surface of the fourth base 242 and The fourth contact portion 2412 is formed by bending upward. The rear end of the fourth fixing portion 2411 extends rearward from the rear end surface of the fourth base body 242, and is bent downward and then bent backward to form the fourth welding portion 2413, and the fourth welding portion 2413 is welded On the fourth soldering area 34 of the circuit board 3. The fourth terminal 241 is provided with a plurality of fourth ground terminals 2414 and a plurality of fourth differential terminals 2415. In this embodiment, the two fourth differential terminals 2415 are arranged between the two fourth ground terminals 2414 . In this embodiment, the plurality of fourth ground terminals 2414 are provided with six branches, the plurality of fourth differential terminals 2415 are provided with twelve branches, and the fourth differential terminals 2415 are used for signal transmission.

所述第四基體242固持所述第四固定部2411。所述第四基體242設有複數凸柱2421、一第四凹槽2422、複數第四開口2423及複數第四凸台2424。所述第四基體242上表面設有向上凸伸的複數凸柱2421,所述凸柱2421用於卡固於所述第三端子組23之所述第三基體232之所述定位孔2322以實現所述第四端子組24與所述第三端子組23定位固持。所述第四基體242下表面設有向上凹陷的所述第四凹槽2422,所述第四導電膠膜243設置於所述第四凹槽2422內。所述第四基體242兩側分別設有貫穿所述第四基體242上、下表面的複數所述第四開口2423,複數所述第四接地端子2414之所述第四固定部2411及複數所述第四差動端子2415之所述第四固定部2411外露於所述第四開口2423。所述第四基體242下表面設有向下延伸的複數所述第四凸台2424,在所述第四端子組24之第一實施例中,所述第四凸台2424一體成型於所述第四凹槽2422內,複數所述第四凸台2424橫向排列並設置於所述第四凹槽2422之前後兩端,所述第四凸台2424延伸方向與所述第四端子241延伸方向彼此垂直,在本實施例中,每一所述第四凸台2424之位置對應兩所述第四差動端子2415之位置。複數所述第四差動端子2415之所述第四固定部2411之下表面之一部分被複數所述第四凸台2424所包覆,在本實施例中,所述第四凹口2425之位置對應所述第四接地端子2414之位置,所述第四接地端子2414卡固於所述第四凹口2425,複數所述第四接地端子2414之所述第四固定部2411之下表面之一部分外露於複數所述第四凹口2425。請參閱第六圖、第二十圖及第二十一圖所示,所述第四導電膠膜243沿著所述第四凸台2424與所述第四凹口2425之形狀黏貼所述第四凸台2424之下表面並覆蓋於所述第四凹口2425,所述第四導電膠膜243之對應機構伸入複數所述第四凹口2425並電連接於所述第四接地端子2414之所述第四固定部2411,使複數所述第四接地端子2414形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。複數所述第四凸台2424阻隔於所述第四導電膠膜243與複數所述第四差動端子2415之所述第四固定部2411之間,避免所述第四導電膠膜243接觸複數所述第四差動端子2415之所述第四固定部2411。The fourth base 242 holds the fourth fixing portion 2411. The fourth base 242 is provided with a plurality of protrusions 2421, a fourth groove 2422, a plurality of fourth openings 2423, and a plurality of fourth protrusions 2424. The upper surface of the fourth base body 242 is provided with a plurality of protruding posts 2421 protruding upward, and the protruding posts 2421 are used to be clamped to the positioning holes 2322 of the third base body 232 of the third terminal set 23. The positioning and holding of the fourth terminal group 24 and the third terminal group 23 is achieved. The lower surface of the fourth base 242 is provided with the fourth groove 2422 recessed upward, and the fourth conductive adhesive film 243 is disposed in the fourth groove 2422. Both sides of the fourth base 242 are respectively provided with a plurality of the fourth openings 2423 penetrating the upper and lower surfaces of the fourth base 242, the fourth fixing portions 2411 and the plurality of the plurality of the fourth ground terminals 2414. The fourth fixing portion 2411 of the fourth differential terminal 2415 is exposed outside the fourth opening 2423. The lower surface of the fourth base 242 is provided with a plurality of the fourth bosses 2424 extending downward. In the first embodiment of the fourth terminal set 24, the fourth bosses 2424 are integrally formed on the In the fourth groove 2422, a plurality of the fourth bosses 2424 are arranged laterally and arranged at the front and back ends of the fourth groove 2422, and the extension direction of the fourth boss 2424 is the same as the extension direction of the fourth terminal 241 They are perpendicular to each other. In this embodiment, the position of each of the fourth bosses 2424 corresponds to the position of the two fourth differential terminals 2415. A part of the lower surface of the fourth fixing portion 2411 of the plurality of fourth differential terminals 2415 is covered by the plurality of fourth bosses 2424. In this embodiment, the position of the fourth notch 2425 is Corresponding to the position of the fourth ground terminal 2414, the fourth ground terminal 2414 is clamped in the fourth notch 2425, a part of the lower surface of the fourth fixing portion 2411 of the fourth ground terminal 2414 Exposed in the plurality of fourth recesses 2425. Please refer to the sixth, twentieth, and twenty-first figures, the fourth conductive adhesive film 243 is pasted along the shape of the fourth boss 2424 and the fourth recess 2425. The lower surface of the four bosses 2424 covers the fourth recess 2425, and the corresponding mechanism of the fourth conductive adhesive film 243 extends into the plurality of fourth recesses 2425 and is electrically connected to the fourth ground terminal 2414 The fourth fixing portion 2411 makes the plurality of fourth ground terminals 2414 form the series ground structure 26, so that signal noise can be effectively absorbed and suppressed and the quality of high-frequency signal transmission can be improved. The plurality of fourth bosses 2424 are blocked between the fourth conductive adhesive film 243 and the fourth fixing portion 2411 of the plurality of fourth differential terminals 2415, so as to prevent the fourth conductive adhesive film 243 from contacting the plurality of The fourth fixing portion 2411 of the fourth differential terminal 2415.

請參閱第二十四圖及第二十八圖所示,係本創作第二實施例之所述第四端子組24之分解圖,在本實施例中,所述第四導電膠膜243設置於所述第四基體242上方,在具體實施時,則不限於此。所述第四端子組24之第二實施例與第一實施例之差異主要在於所述第四凸台2424’,在第二實施例中,所述第四凸台2424’一體成型於所述第四凹槽2422內,複數所述第四凸台2424’縱向排列並延伸於所述第四凹槽2422中,複數所述第四凸台2424’之前後兩端分別連接所述第四凹槽2422之前後兩端,所述第四凸台2424’延伸方向與所述第四端子241延伸方向一樣。在本實施例中,每一所述第四凸台2424’之左右兩側分別形成一第四阻隔部2427,兩所述第四阻隔部2427中間形成一第四斷開空間2428,每一所述第四阻隔部2427設置於一所述第四接地端子2414與一所述第四差動端子2415之間,兩所述第四差動端子2415設置在所述第四斷開空間2428。每一所述第四阻隔部2427一側皆設有向上凹陷的一第四凹部2426,在本實施例中,所述第四差動端子2415設置於所述第四凹部2126一側,所述第四差動端子2415設置於所述第四凹部2426上,所述第四接地端子2414設置於所述第四凹部2426另一側。複數所述第四差動端子2415之所述第四固定部2411之下表面之一部分被複數所述第四凹部2426所阻隔。所述第四導電膠膜243沿著所述第四接地端子2414與所述第四凸台2424’之形狀黏貼所述第四凸台2424’之下表面。複數所述第四凹部2426阻隔於所述第四導電膠膜243與複數所述第四差動端子2415之所述第四固定部2411之間,避免所述第四導電膠膜243接觸複數所述第四差動端子2415之所述第四固定部2411。所述第四導電膠膜243之對應機構電連接於所述第四接地端子2414之所述第四固定部2411,使複數所述第四接地端子2414形成所述串地結構26。Please refer to Figure 24 and Figure 28, which are exploded views of the fourth terminal set 24 of the second embodiment of the present creation. In this embodiment, the fourth conductive adhesive film 243 is provided Above the fourth base 242, in specific implementation, it is not limited to this. The difference between the second embodiment of the fourth terminal set 24 and the first embodiment is mainly the fourth boss 2424'. In the second embodiment, the fourth boss 2424' is integrally formed on the In the fourth groove 2422, a plurality of the fourth bosses 2424' are arranged longitudinally and extend in the fourth groove 2422, and the front and back ends of the fourth bosses 2424' are respectively connected to the fourth concave At the front and back ends of the groove 2422, the extending direction of the fourth boss 2424' is the same as the extending direction of the fourth terminal 241. In this embodiment, a fourth blocking portion 2427 is formed on the left and right sides of each fourth boss 2424', and a fourth disconnected space 2428 is formed between the two fourth blocking portions 2427. Each The fourth blocking portion 2427 is disposed between the fourth ground terminal 2414 and the fourth differential terminal 2415, and the two fourth differential terminals 2415 are disposed in the fourth disconnected space 2428. Each side of the fourth blocking portion 2427 is provided with a fourth recess 2426 recessed upward. In this embodiment, the fourth differential terminal 2415 is provided on the side of the fourth recess 2126. The fourth differential terminal 2415 is disposed on the fourth concave portion 2426, and the fourth ground terminal 2414 is disposed on the other side of the fourth concave portion 2426. A part of the lower surface of the fourth fixing portion 2411 of the plurality of fourth differential terminals 2415 is blocked by the plurality of fourth recesses 2426. The fourth conductive adhesive film 243 is adhered to the lower surface of the fourth boss 2424' along the shape of the fourth ground terminal 2414 and the fourth boss 2424'. The plurality of fourth concave portions 2426 are blocked between the fourth conductive adhesive film 243 and the fourth fixing portion 2411 of the plurality of fourth differential terminals 2415, so as to prevent the fourth conductive adhesive film 243 from contacting the plurality of locations. The fourth fixing portion 2411 of the fourth differential terminal 2415. The corresponding mechanism of the fourth conductive adhesive film 243 is electrically connected to the fourth fixing portion 2411 of the fourth ground terminal 2414, so that a plurality of the fourth ground terminals 2414 form the series ground structure 26.

所述第四導電膠膜243設有一第四金屬層2431,所述第四金屬層2431設置於所述第四導電膠膜243上表面,在本實施例中,所述第四金屬層2431設計成有複數所述孔隙25的所述圖形28,所述第四金屬層2431具有形狀相同的複數所述孔隙25,複數所述孔隙25之間形成複數條連續且交錯的所述線條27,因此所述第四金屬層2431之複數所述孔隙25可使部分訊號從其穿透所述第四金屬層2431,僅有部分被所述第四金屬層2431反射。相比於先前技術之金屬鍍層為整片無孔隙之設計,訊號在碰到無孔隙之金屬鍍層容易造成震盪反射,此震盪會產生許多不必要的諧振點。本創作高速連接器100透過有所述孔隙25的所述圖形28,在高頻特性中不易產生諧振點,使震盪反射影響較小,遠端串音、近端串音、插入損失及反射損失之性能比起先前技術更佳。The fourth conductive adhesive film 243 is provided with a fourth metal layer 2431, and the fourth metal layer 2431 is provided on the upper surface of the fourth conductive adhesive film 243. In this embodiment, the fourth metal layer 2431 is designed The pattern 28 is formed with a plurality of the pores 25, the fourth metal layer 2431 has a plurality of the pores 25 with the same shape, and a plurality of continuous and interlaced lines 27 are formed between the plurality of pores 25, so The plurality of pores 25 of the fourth metal layer 2431 can allow part of the signal to penetrate the fourth metal layer 2431 therefrom, and only part of the signal is reflected by the fourth metal layer 2431. Compared with the metal coating of the prior art, which is a whole piece of non-porous design, when the signal encounters the non-porous metal coating, it is easy to cause oscillating reflection, and this oscillation will generate many unnecessary resonance points. The creative high-speed connector 100 through the pattern 28 with the aperture 25 is not easy to produce resonance points in high-frequency characteristics, so that the impact of oscillation reflection is small, and the far-end crosstalk, near-end crosstalk, insertion loss and reflection loss The performance is better than the previous technology.

在具體實施時,所述第四金屬層2431之所述圖形28不限於此形狀。請參閱第六圖、第二十圖及第二十一圖所示,所述第四導電膠膜243黏貼於所述第四凸台2424,所述第四導電膠膜243之所述第四金屬層2431接觸於所述第四接地端子2414之所述第四固定部2411,使複數所述第四接地端子2414形成所述串地結構26,如此一來訊號雜訊可有效的被吸收抑制並提高高頻訊號傳輸的品質。In specific implementation, the pattern 28 of the fourth metal layer 2431 is not limited to this shape. Please refer to the sixth, twentieth and twenty-first figures, the fourth conductive adhesive film 243 is adhered to the fourth boss 2424, the fourth conductive adhesive film 243 The metal layer 2431 is in contact with the fourth fixing portion 2411 of the fourth ground terminal 2414, so that a plurality of the fourth ground terminals 2414 form the series ground structure 26, so that the signal noise can be effectively absorbed and suppressed And improve the quality of high-frequency signal transmission.

在本實施例中,複數所述孔隙25為正方形。在具體實施時,複數所述孔隙25可為任意形狀,亦可以由兩組以上形狀不同的所述孔隙25組成所述圖形28,例如第一組所述孔隙25之形狀為橢圓形,第二組所述孔隙25之形狀為菱形。在具體實施時,所述第四金屬層2431可採用蒸鍍、電鍍、雷射雕刻等方式形成於所述第四導電膠模243上。再者,所述第一金屬層2131之圖形、所述第二金屬層2231之圖形與所述第三金屬層2331之圖形可不同於所述第四金屬層2431之圖形,所述第四金屬層2431之圖形可配合所述第四端子組24之整體結構進行設計。In this embodiment, the plurality of pores 25 are square. In specific implementation, the plurality of pores 25 can be of any shape, and the pattern 28 can also be composed of more than two groups of pores 25 with different shapes. For example, the shape of the pores 25 of the first group is elliptical, and the shape of the second group The shape of the pores 25 is a rhombus. In specific implementation, the fourth metal layer 2431 may be formed on the fourth conductive rubber mold 243 by evaporation, electroplating, laser engraving, or the like. Furthermore, the pattern of the first metal layer 2131, the pattern of the second metal layer 2231, and the pattern of the third metal layer 2331 may be different from the pattern of the fourth metal layer 2431. The pattern of the layer 2431 can be designed to match the overall structure of the fourth terminal set 24.

在本實施例中,所述第三焊接部2314與所述第四焊接部2413設置在所述第一焊接部2115與所述第二焊接部2214之間,所述第三焊接部2314設置在所述第一焊接部2115與所述第四焊接部2413之間,所述第四焊接部2413設置在所述第二焊接部2214與所述第三焊接部2314之間。在本實施例中,所述第一端子組21之所述第一固持體214抵頂於所述第三端子組23之所述第二固持體234一側,所述第三端子組23之所述第三基體2321抵頂於所述第四端子組24之所述第四基體242一側,所述第四端子組24之所述第四基體242抵頂於所述第二端子組22之所述第二基體222一側。In this embodiment, the third welding portion 2314 and the fourth welding portion 2413 are disposed between the first welding portion 2115 and the second welding portion 2214, and the third welding portion 2314 is disposed between Between the first welding part 2115 and the fourth welding part 2413, the fourth welding part 2413 is disposed between the second welding part 2214 and the third welding part 2314. In this embodiment, the first holding body 214 of the first terminal set 21 abuts against the side of the second holding body 234 of the third terminal set 23, and the third terminal set 23 The third base 2321 abuts against the side of the fourth base 242 of the fourth terminal set 24, and the fourth base 242 of the fourth terminal set 24 abuts against the second terminal set 22 On the side of the second substrate 222.

在本實施例中,所述第一金屬層2131、所述第二金屬層2231、所述第三金屬層2331及所述第四金屬層2431為相同有所述孔隙25的所述圖形28。在具體實施時,上述第一金屬層2131、所述第二金屬層2231、所述第三金屬層2331及所述第四金屬層2431之形狀可不受限。In this embodiment, the first metal layer 2131, the second metal layer 2231, the third metal layer 2331, and the fourth metal layer 2431 are the same patterns 28 with the pores 25. In a specific implementation, the shape of the first metal layer 2131, the second metal layer 2231, the third metal layer 2331, and the fourth metal layer 2431 may not be limited.

綜上所述,本創作高速連接器100藉由創新的結構設計,在所述端子模組2中的所述第一導電膠膜213、所述第二導電膠膜223、所述第三導電膠膜233及所述第四導電膠膜243分別黏貼於所述第一端子組21之所述第一凸台2124及所述第一凹口2125、所述第二端子組22之所述第二凸台2223及所述第二凹口2224、所述第三端子組23之所述第三凸台2325及所述第三凹口2326及所述第四端子組24之所述第四凸台2424及所述第四凹口2425,並設置所述第一金屬層2131、所述第二金屬層2231、所述第三金屬層2331及所述第四金屬層2431,所述第一金屬層2131、所述第二金屬層2231、所述第三金屬層2331及所述第四金屬層2431分別與所述第一接地端子2116、所述第二接地端子2215、所述第三接地端子2315及所述第四接地端子2414接觸,使其形成所述串地結構26,所述第一金屬層2131、所述第二金屬層2231、所述第三金屬層2331及所述第四金屬層2431皆可以為相同的有所述孔隙25的所述圖形28,亦可為不同的所述孔隙25的所述圖形28,使訊號會部分穿透所述第一導電膠膜213、所述第二導電膠膜223、所述第三導電膠膜233及所述第四導電膠膜243,部分被所述第一導電膠膜213、所述第二導電膠膜223、所述第三導電膠膜233及所述第四導電膠膜243反射,相比於先前技術之金屬鍍層為整片無孔隙之設計,訊號在碰到無孔隙之金屬鍍層容易造成震盪反射,此震盪會產生許多不必要的諧振點。因此本創作高速連接器100不易產生諧振點且遠端串音、近端串音、插入損失及反射損失之性能比起先前技術更佳。In summary, the high-speed connector 100 of the present invention adopts an innovative structural design. The first conductive adhesive film 213, the second conductive adhesive film 223, and the third conductive adhesive film 223 in the terminal module 2 The adhesive film 233 and the fourth conductive adhesive film 243 are respectively adhered to the first boss 2124 and the first recess 2125 of the first terminal group 21, and the second terminal group 22 Two bosses 2223 and the second notch 2224, the third boss 2325 and the third notch 2326 of the third terminal group 23, and the fourth boss of the fourth terminal group 24 The table 2424 and the fourth notch 2425 are provided with the first metal layer 2131, the second metal layer 2231, the third metal layer 2331, and the fourth metal layer 2431. The first metal layer 2131 is The layer 2131, the second metal layer 2231, the third metal layer 2331, and the fourth metal layer 2431 are connected to the first ground terminal 2116, the second ground terminal 2215, and the third ground terminal, respectively. 2315 is in contact with the fourth ground terminal 2414 to form the string ground structure 26, the first metal layer 2131, the second metal layer 2231, the third metal layer 2331, and the fourth metal The layers 2431 can all be the same pattern 28 with the pores 25, or different patterns 28 with the pores 25, so that the signal will partially penetrate the first conductive adhesive film 213, the The second conductive adhesive film 223, the third conductive adhesive film 233, and the fourth conductive adhesive film 243 are partially covered by the first conductive adhesive film 213, the second conductive adhesive film 223, and the third conductive adhesive film. The reflection of the adhesive film 233 and the fourth conductive adhesive film 243 is compared with the metal coating of the prior art, which is a whole piece of non-porous design. When the signal encounters the non-porous metal coating, it is easy to cause vibration reflection, and this vibration will cause a lot of non-porous reflections. The necessary resonance point. Therefore, the creative high-speed connector 100 is not easy to generate resonance points and the performance of far-end crosstalk, near-end crosstalk, insertion loss, and reflection loss is better than that of the prior art.

100:高速連接器 1:絕緣本體 11:本體部 12:插接通道 13:端子槽 14:插接口 15:安裝槽 2:端子模組 21:第一端子組 211:第一端子 2111:第一固定部 2112:第一台階部 2113:第一接觸部 2114:第一彎折部 2115:第一焊接部 2116:第一接地端子 2117:第一差動端子 212:第一基體 2121:凸扣 2122:第一凹槽 2123:第一開口 2124、2124’:第一凸台 2125:第一凹口 2126:第一凹部 2127:第一阻隔部 2128:第一斷開空間 213:第一導電膠膜 2131:第一金屬層 214:第一固持體 22:第二端子組 221:第二端子 2211:第二固定部 2212:第二台階部 2213:第二接觸部 2214:第二焊接部 2215:第二接地端子 2216:第二差動端子 222:第二基體 2221:第二凹槽 2222:第二開口 2223、2223’:第二凸台 2224:第二凹口 2225:第二凹部 2226:第二阻隔部 2227:第二斷開空間 223:第二導電膠膜 2231:第二金屬層 23:第三端子組 231:第三端子 2311:第三固定部 2312:第三接觸部 2313:第三彎折部 2314:第三焊接部 2315:第三接地端子 2316:第三差動端子 232:第三基體 2321:缺口 2322:定位孔 2323:第三凹槽 2324:第三開口 2325、2325’:第三凸台 2326:第三凹口 2327:第三凹部 2328:第三阻隔部 2329:第三斷開空間 233:第三導電膠膜 2331:第三金屬層 234:第二固持體 24:第四端子組 241:第四端子 2411:第四固定部 2412:第四接觸部 2413:第四焊接部 2414:第四接地端子 2415:第四差動端子 242:第四基體 2421:凸柱 2422:第四凹槽 2423:第四開口 2424、2424’:第四凸台 2425:第四凹口 2426:第四凹部 2427:第四阻隔部 2428:第四斷開空間 243:第四導電膠膜 2431:第四金屬層 25:孔隙 26:串地結構 27:線條 28:圖形 3:電路板 31:第一焊接區 32:第二焊接區 33:第三焊接區 34:第四焊接區100: High-speed connector 1: Insulating body 11: Body part 12: plug-in channel 13: terminal slot 14: plug interface 15: installation slot 2: Terminal module 21: The first terminal group 211: The first terminal 2111: The first fixed part 2112: The first step 2113: first contact 2114: The first bending part 2115: The first welding department 2116: The first ground terminal 2117: First differential terminal 212: The first substrate 2121: Convex buckle 2122: first groove 2123: first opening 2124, 2124’: First boss 2125: first notch 2126: first recess 2127: The first barrier 2128: The first disconnected space 213: The first conductive adhesive film 2131: first metal layer 214: The first holding body 22: The second terminal group 221: second terminal 2211: The second fixed part 2212: second step 2213: second contact 2214: The second welding part 2215: second ground terminal 2216: second differential terminal 222: second substrate 2221: second groove 2222: second opening 2223, 2223’: Second boss 2224: second notch 2225: second recess 2226: The second blocking part 2227: second disconnected space 223: second conductive adhesive film 2231: second metal layer 23: The third terminal group 231: third terminal 2311: third fixed part 2312: third contact 2313: third bending part 2314: Third welding department 2315: third ground terminal 2316: Third differential terminal 232: Third Substrate 2321: gap 2322: positioning hole 2323: third groove 2324: third opening 2325, 2325’: Third boss 2326: third notch 2327: third recess 2328: The third barrier 2329: third disconnected space 233: The third conductive adhesive film 2331: third metal layer 234: second holding body 24: The fourth terminal group 241: Fourth terminal 2411: The fourth fixed part 2412: fourth contact 2413: Fourth Welding Department 2414: Fourth ground terminal 2415: Fourth differential terminal 242: The fourth substrate 2421: convex column 2422: fourth groove 2423: fourth opening 2424, 2424’: Fourth boss 2425: fourth notch 2426: fourth recess 2427: The fourth blocking part 2428: fourth disconnected space 243: The fourth conductive adhesive film 2431: fourth metal layer 25: Porosity 26: String ground structure 27: Line 28: Graphics 3: circuit board 31: The first welding zone 32: The second welding zone 33: The third welding zone 34: The fourth welding zone

[第一圖]係本創作高速連接器固定於電路板之立體圖。 [第二圖]係本創作高速連接器固定於電路板之另一角度立體圖。 [第三圖]係本創作高速連接器之部分分解圖。 [第四圖]係本創作高速連接器之另一角度之部分分解圖。 [第五圖]係本創作高速連接器沿著第三圖之V-V線之剖面圖。 [第六圖]係本創作高速連接器之第一實施例之端子模組沿著第五圖之VI-VI線之剖面圖。 [第七圖]係本創作高速連接器之第一實施例之端子模組之第一端子組之立體圖。 [第八圖]係本創作高速連接器之第一實施例之端子模組之第一端子組之分解圖。 [第九圖]係本創作高速連接器之第一實施例之端子模組之第一端子組之另一角度分解圖。 [第十圖]係本創作高速連接器沿著第八圖中X之局部放大圖。 [第十一圖]係本創作高速連接器之第一實施例之端子模組之第二端子組之立體圖。 [第十二圖]係本創作高速連接器之第一實施例之端子模組之第二端子組之分解圖。 [第十三圖]係本創作高速連接器之第一實施例之端子模組之第二端子組之另一角度分解圖。 [第十四圖]係本創作高速連接器沿著第十三圖中XIV之局部放大圖。 [第十五圖]係本創作高速連接器之第一實施例之端子模組之第三端子組之立體圖。 [第十六圖]係本創作高速連接器之第一實施例之端子模組之第三端子組之分解圖。 [第十七圖]係本創作高速連接器之第一實施例之端子模組之第三端子組之另一角度分解圖。 [第十八圖]係本創作高速連接器沿著第十六圖中XVIII之局部放大圖。 [第十九圖]係本創作高速連接器之第一實施例之端子模組之第四端子組之立體圖。 [第二十圖]係本創作高速連接器之第一實施例之端子模組之第四端子組之分解圖。 [第二十一圖]係本創作高速連接器之第一實施例之端子模組之第四端子組之另一角度分解圖。 [第二十二圖]係本創作高速連接器沿著第二十圖中XXII之局部放大圖。 [第二十三圖]係本創作高速連接器之電路板之立體圖。 [第二十四圖]係本創作高速連接器之第二實施例之端子模組沿著第五圖之VI-VI線之剖面圖。 [第二十五圖]係本創作高速連接器之第二實施例之端子模組之第一端子組之分解圖。 [第二十六圖]係本創作高速連接器之第二實施例之端子模組之第二端子組之分解圖。 [第二十七圖]係本創作高速連接器之第二實施例之端子模組之第三端子組之分解圖。 [第二十八圖]係本創作高速連接器之第二實施例之端子模組之第四端子組之分解圖。 [The first picture] is a three-dimensional view of the high-speed connector of this creation fixed on the circuit board. [Second Picture] is another perspective view of the high-speed connector of this creation fixed on the circuit board. [The third picture] is a partial exploded view of the high-speed connector of this creation. [Picture 4] is a partial exploded view of the high-speed connector of this creation from another angle. [Fifth picture] is a cross-sectional view of the high-speed connector of this creation along the line V-V in the third picture. [Picture 6] is a cross-sectional view of the terminal module of the first embodiment of the creative high-speed connector along the VI-VI line of the fifth diagram. [The seventh figure] is a three-dimensional view of the first terminal group of the terminal module of the first embodiment of the high-speed connector of this creation. [The eighth figure] is an exploded view of the first terminal group of the terminal module of the first embodiment of the creative high-speed connector. [Figure 9] is another perspective exploded view of the first terminal group of the terminal module of the first embodiment of the high-speed connector of this creation. [The tenth picture] is a partial enlarged view of the high-speed connector of this creation along X in the eighth picture. [The eleventh figure] is a three-dimensional view of the second terminal group of the terminal module of the first embodiment of the high-speed connector of this creation. [Figure Twelfth] is an exploded view of the second terminal group of the terminal module of the first embodiment of the high-speed connector of this creation. [Figure 13] is another perspective exploded view of the second terminal group of the terminal module of the first embodiment of the creative high-speed connector. [The fourteenth picture] is a partial enlarged view of the high-speed connector of this creation along XIV in the thirteenth picture. [Figure 15] is a three-dimensional view of the third terminal group of the terminal module of the first embodiment of the creative high-speed connector. [Figure 16] is an exploded view of the third terminal group of the terminal module of the first embodiment of the creative high-speed connector. [Figure 17] is another perspective exploded view of the third terminal group of the terminal module of the first embodiment of the high-speed connector of this creation. [The eighteenth picture] is a partial enlarged view of the high-speed connector of this creation along XVIII in the sixteenth picture. [Figure 19] is a three-dimensional view of the fourth terminal group of the terminal module of the first embodiment of the creative high-speed connector. [Figure 20] is an exploded view of the fourth terminal group of the terminal module of the first embodiment of the high-speed connector of this creation. [Figure 21] is another perspective exploded view of the fourth terminal group of the terminal module of the first embodiment of the creative high-speed connector. [Picture 22] is a partial enlarged view of the high-speed connector of this creation along XXII in the twentieth picture. [Picture 23] is a three-dimensional diagram of the circuit board of the high-speed connector of this creation. [Picture 24] is a cross-sectional view of the terminal module of the second embodiment of the creative high-speed connector along the VI-VI line of the fifth diagram. [Figure 25] is an exploded view of the first terminal group of the terminal module of the second embodiment of the creative high-speed connector. [Figure 26] is an exploded view of the second terminal group of the terminal module of the second embodiment of the high-speed connector of this creation. [Figure 27] is an exploded view of the third terminal group of the terminal module of the second embodiment of the creative high-speed connector. [Figure 28] is an exploded view of the fourth terminal group of the terminal module of the second embodiment of the creative high-speed connector.

21:第一端子組 21: The first terminal group

211:第一端子 211: The first terminal

2111:第一固定部 2111: The first fixed part

2112:第一台階部 2112: The first step

2113:第一接觸部 2113: first contact

2114:第一彎折部 2114: The first bending part

2115:第一焊接部 2115: The first welding department

2116:第一接地端子 2116: The first ground terminal

2117:第一差動端子 2117: First differential terminal

212:第一基體 212: The first substrate

2124:第一凸台 2124: The first boss

2125:第一凹口 2125: first notch

213:第一導電膠膜 213: The first conductive adhesive film

2131:第一金屬層 2131: first metal layer

25:孔隙 25: Porosity

214:第一固持體 214: The first holding body

Claims (10)

一種高速連接器,包括:一絕緣本體;及一第一端子組,所述第一端子組設有複數第一端子、一第一基體及一第一導電膠模,複數所述第一端子設置於所述第一基體內,複數所述第一端子設有複數第一接地端子及複數第一差動端子,兩所述第一差動端子設置於兩所述第一接地端子之間,所述第一基體設有至少一第一凹槽,所述第一導電膠膜設置於所述第一凹槽內,所述第一基體之所述第一凹槽內設有一體成型的至少一第一凸台,所述第一凸台阻隔於兩所述第一差動端子與所述第一導電膠膜之間,所述第一凸台之左右兩側分別形成一第一凹口,兩所述第一接地端子設置於兩所述第一凹口內,所述第一導電膠膜覆蓋所述第一凸台並伸入兩所述第一凹口內,所述第一導電膠膜設有一第一金屬層,所述第一金屬層為複數孔隙的一圖形,複數所述孔隙之間形成複數條連續且交錯的線條,所述第一金屬層電性連接兩所述第一接地端子以形成一串地結構。A high-speed connector, comprising: an insulating body; and a first terminal group, the first terminal group is provided with a plurality of first terminals, a first base and a first conductive rubber mold, the plurality of first terminals are provided In the first base body, a plurality of the first terminals are provided with a plurality of first ground terminals and a plurality of first differential terminals, the two first differential terminals are arranged between the two first ground terminals, so The first base body is provided with at least one first groove, the first conductive adhesive film is arranged in the first groove, and the first groove of the first base body is provided with at least one integrally formed groove. A first boss, the first boss is blocked between the two first differential terminals and the first conductive adhesive film, and a first notch is formed on the left and right sides of the first boss, respectively, The two first ground terminals are arranged in the two first recesses, the first conductive adhesive film covers the first boss and extends into the two first recesses, the first conductive adhesive The film is provided with a first metal layer, the first metal layer is a pattern of a plurality of pores, a plurality of continuous and interlaced lines are formed between the plurality of pores, and the first metal layer is electrically connected to the two first Ground terminals to form a string of ground structure. 如請求項1所述之高速連接器,其中所述第一凹槽內設有複數所述第一凸台,複數所述第一凸台橫向排列並設置於所述第一凹槽之前後兩端,複數所述第一凸台延伸方向與所述第一端子延伸方向彼此垂直,每一所述第一凸台之位置對應兩所述第一差動端子之位置,兩所述第一凸台之間設有所述第一凹口,所述第一凹口之位置對應所述第一接地端子之位置,所述第一接地端子卡固於所述第一凹口,所述第一導電膠膜沿著所述第一凸台與所述第一凹口之形狀設置於所述第一凸台之下表面並覆蓋於所述第一凹口。The high-speed connector according to claim 1, wherein the first groove is provided with a plurality of the first bosses, and the plurality of first bosses are arranged horizontally and arranged two before and after the first groove End, the extending direction of the plurality of first bosses and the extending direction of the first terminal are perpendicular to each other, the position of each of the first bosses corresponds to the position of the two first differential terminals, and the two first bosses The first notch is provided between the tables, the position of the first notch corresponds to the position of the first ground terminal, the first ground terminal is clamped in the first notch, and the first A conductive adhesive film is disposed on the lower surface of the first boss along the shape of the first boss and the first recess and covers the first recess. 如請求項1所述之高速連接器,其中所述第一凹槽內設有複數所述第一凸台,複數所述第一凸台縱向排列並延伸於所述第一凹槽中,複數所述第一凸台之前後兩端分別連接所述第一凹槽之前後兩端,所述第一凸台延伸方向與所述第一端子延伸方向一樣,每一所述第一凸台之左右兩側分別形成一第一阻隔部,兩所述第一阻隔部中間形成一第一斷開空間,每一所述第一阻隔部設置於一所述第一接地端子與一所述第一差動端子之間,兩所述第一差動端子設置在所述第一斷開空間,每一所述第一阻隔部一側皆設有向下凹陷的一第一凹部,所述第一差動端子設置於所述第一凹部一側,所述第一差動端子設置於所述第一凹部上,所述第一接地端子設置於所述第一凹部另一側,所述第一導電膠膜沿著所述第一接地端子與所述第一凸台之形狀黏貼所述第一凸台之下表面,複數所述第一凹部阻隔於所述第一導電膠膜與複數所述第一差動端子之間。The high-speed connector according to claim 1, wherein the first groove is provided with a plurality of the first bosses, and the plurality of first bosses are arranged longitudinally and extend in the first groove, and The front and back ends of the first boss are respectively connected to the front and back ends of the first groove. The extension direction of the first boss is the same as the extension direction of the first terminal. A first blocking portion is formed on the left and right sides, a first disconnected space is formed between the two first blocking portions, and each of the first blocking portions is disposed on a first ground terminal and a first ground terminal. Between the differential terminals, two of the first differential terminals are arranged in the first disconnection space, and one side of each of the first blocking portions is provided with a first concave portion recessed downward, and the first The differential terminal is provided on one side of the first recess, the first differential terminal is provided on the first recess, the first ground terminal is provided on the other side of the first recess, and the first A conductive adhesive film is adhered to the lower surface of the first boss along the shape of the first ground terminal and the first boss, and the plurality of first recesses are blocked by the first conductive adhesive film and the plurality of Between the first differential terminals. 如請求項2或請求項3所述之高速連接器,其中每一所述第一端子皆設有一第一固定部、一第一台階部、一第一接觸部、一第一彎折部及一第一焊接部,所述第一固定部前端向下彎折形成所述第一台階部,所述第一台階部設置於所述第一基體之前端內,所述第一台階部前端往前延伸出所述第一基體之前端面後向下彎折形成所述第一接觸部,所述第一固定部後端延伸出所述第一基體後端面後向下傾斜延伸後再彎折向下延伸形成所述第一彎折部,所述第一彎折部底端往後彎折延伸形成所述第一焊接部。The high-speed connector according to claim 2 or claim 3, wherein each of the first terminals is provided with a first fixing portion, a first step portion, a first contact portion, a first bending portion, and A first welding part, the front end of the first fixing part is bent downward to form the first step part, the first step part is arranged in the front end of the first base body, and the front end of the first step part faces The front end surface of the first base body is extended forward and then bent downward to form the first contact portion. The first bending portion is formed by extending downward, and the bottom end of the first bending portion is bent and extended backward to form the first welding portion. 如請求項4所述之高速連接器,其中所述第一基體兩側分別設有貫穿所述第一基體上、下表面的複數第一開口,複數所述第一接地端子之所述第一固定部及複數所述第一差動端子之所述第一固定部外露於所述第一開口。The high-speed connector according to claim 4, wherein a plurality of first openings penetrating through the upper and lower surfaces of the first substrate are respectively provided on both sides of the first substrate, and the first ground terminals of the plurality of first ground terminals The fixing portion and the first fixing portions of the plurality of first differential terminals are exposed outside the first opening. 如請求項1所述之高速連接器,其中所述第一金屬層具有形狀相同的複數所述孔隙的所述圖形。The high-speed connector according to claim 1, wherein the first metal layer has the pattern of a plurality of the pores with the same shape. 如請求項1所述之高速連接器,其中所述第一金屬層具有形狀不同的複數所述孔隙的所述圖形。The high-speed connector according to claim 1, wherein the first metal layer has the pattern of a plurality of the pores with different shapes. 如請求項1所述之高速連接器,還包括一第二端子組,所述第二端子組與所述第一端子組上下相對應,所述第二端子組設有複數第二端子、一第二基體、一第二導電膠膜,複數所述第二端子設置於所述第二基體內,複數所述第二端子設有複數第二接地端子及複數第二差動端子,兩所述第二差動端子設置於兩所述第二接地端子之間,所述第二基體設有一第二凹槽、複數第二開口及至少一第二凸台,所述第二基體上表面設有向下凹陷的所述第二凹槽,所述第二導電膠膜設置於所述第二凹槽內,所述第二基體之所述第二凹槽設有一體成型的至少一所述第二凸台,所述第二凸台阻隔於所述第二差動端子與所述第二導電膠膜之間,所述第二凸台之左右兩側分別形成一第二凹口,兩所述第二接地端子設置於兩所述第二凹口內,所述第二導電膠膜覆蓋所述第二凸台並伸入兩所述第二凹口內,所述第二導電膠膜設有一第二金屬層,第二金屬層為複數所述孔隙的所述圖形,複數所述孔隙之間形成複數條連續且交錯的線條,所述第二金屬層電性連接所述第二接地端子以形成所述串地結構。The high-speed connector according to claim 1, further comprising a second terminal group, the second terminal group corresponding to the first terminal group up and down, the second terminal group is provided with a plurality of second terminals, one A second substrate, a second conductive adhesive film, a plurality of the second terminals are arranged in the second substrate, a plurality of the second terminals are provided with a plurality of second ground terminals and a plurality of second differential terminals, two The second differential terminal is arranged between the two second ground terminals, the second base is provided with a second groove, a plurality of second openings and at least one second boss, and the upper surface of the second base is provided with The second groove recessed downward, the second conductive adhesive film is disposed in the second groove, and the second groove of the second base body is provided with at least one of the first grooves integrally formed Two bosses, the second boss is blocked between the second differential terminal and the second conductive adhesive film, a second notch is formed on the left and right sides of the second boss, two The second ground terminal is arranged in the two second recesses, the second conductive adhesive film covers the second boss and extends into the two second recesses, and the second conductive adhesive film is provided There is a second metal layer, the second metal layer is the pattern of the plurality of pores, a plurality of continuous and interlaced lines are formed between the plurality of pores, and the second metal layer is electrically connected to the second ground terminal To form the string-to-ground structure. 如請求項8所述之高速連接器,其中所述第二凹槽內設有複數所述第二凸台,複數所述第二凸台橫向排列並設置於所述第二凹槽之前後兩端,複數所述第二凸台延伸方向與所述第二端子延伸方向彼此垂直,每一所述第二凸台之位置對應兩所述第二差動端子之位置,兩所述第二凸台之間設有所述第二凹口,所述第二凹口之位置對應所述第二接地端子之位置,所述第二接地端子卡固於所述第二凹口,所述第二導電膠膜沿著所述第二凸台與所述第二凹口之形狀設置於所述第二凸台之上表面並覆蓋於所述第二凹口。The high-speed connector according to claim 8, wherein the second groove is provided with a plurality of the second bosses, and the plurality of second bosses are arranged laterally and are arranged two before and after the second groove End, the extending direction of the plurality of second bosses and the extending direction of the second terminal are perpendicular to each other, the position of each of the second bosses corresponds to the position of the two second differential terminals, and the two second bosses The second notch is provided between the tables, the position of the second notch corresponds to the position of the second ground terminal, the second ground terminal is clamped in the second notch, and the second A conductive adhesive film is disposed on the upper surface of the second boss along the shape of the second boss and the second recess and covers the second recess. 如請求項8所述之高速連接器,其中所述第二凹槽內設有複數所述第二凸台,複數所述第二凸台縱向排列並延伸於所述第二凹槽中,複數所述第二凸台之前後兩端分別連接所述第二凹槽之前後兩端,複數所述第二凸台延伸方向與所述第二端子延伸方向一樣,每一所述第二凸台之左右兩側分別形成一第二阻隔部,兩所述第二阻隔部中間形成一第二斷開空間,每一所述第二阻隔部設置於一所述第二接地端子與一所述第二差動端子之間,兩所述第二差動端子設置在所述第二斷開空間,每一所述第二阻隔部一側皆設有向上凹陷的一第二凹部,所述第二差動端子設置於所述第二凹部一側,所述第二差動端子設置於所述第二凹部上,所述第二接地端子設置於所述第二凹部另一側,所述第二導電膠膜沿著所述第二接地端子與所述第二凸台之形狀黏貼所述第二凸台之上表面,複數所述第二凹部阻隔於所述第二導電膠膜與複數所述第二差動端子之間。The high-speed connector according to claim 8, wherein the second groove is provided with a plurality of the second bosses, and the plurality of second bosses are arranged longitudinally and extend in the second groove, and The front and back ends of the second boss are respectively connected to the front and back ends of the second groove, and the extension direction of the plurality of second bosses is the same as the extension direction of the second terminal, and each second boss A second blocking portion is formed on the left and right sides, a second disconnected space is formed between the two second blocking portions, and each of the second blocking portions is disposed on a second ground terminal and a first ground terminal. Between the two differential terminals, the two second differential terminals are arranged in the second disconnection space, and one side of each of the second blocking portions is provided with a second concave portion recessed upward, and the second The differential terminal is provided on one side of the second recess, the second differential terminal is provided on the second recess, the second ground terminal is provided on the other side of the second recess, and the second A conductive adhesive film is adhered to the upper surface of the second boss along the shape of the second ground terminal and the second boss, and the plurality of second recesses are blocked by the second conductive adhesive film and the plurality of Between the second differential terminals.
TW110204653U 2021-04-26 2021-04-26 High speed connector TWM616449U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116111402A (en) * 2021-11-10 2023-05-12 东莞富强电子有限公司 High-speed connector
US20240128674A1 (en) * 2022-10-14 2024-04-18 Te Connectivity Belgium Bv Card edge connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116111402A (en) * 2021-11-10 2023-05-12 东莞富强电子有限公司 High-speed connector
US20240128674A1 (en) * 2022-10-14 2024-04-18 Te Connectivity Belgium Bv Card edge connector
TWI865092B (en) * 2022-10-14 2024-12-01 瑞士商太谷康奈特提威提索洛訊有限公司 Contact assembly

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