TWM611634U - Partition and apparatus for holding computer components - Google Patents
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- TWM611634U TWM611634U TW109215388U TW109215388U TWM611634U TW M611634 U TWM611634 U TW M611634U TW 109215388 U TW109215388 U TW 109215388U TW 109215388 U TW109215388 U TW 109215388U TW M611634 U TWM611634 U TW M611634U
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Abstract
Description
本揭露大致有關建構電腦構件之外殼的系統及方法。更特定地,本揭露之型態有關於形成一支架(scaffold)之隔板及框架的設計,支撐伺服器不同尺寸的儲存驅動機(storage drives)。 This disclosure generally relates to a system and method for constructing a shell of a computer component. More specifically, the type of this disclosure relates to the design of a partition and a frame forming a scaffold to support storage drives of different sizes of servers.
計算機系統(例如:桌上型電腦、刀鋒型伺服器、機架式伺服器等)係大量地運用在多種應用中。通常電腦伺服器設計用以容置數個相同型態的構件,舉例來說:數個處理器、數個記憶體模組、數個硬碟、數個風扇等。由於數個相同型態的構件可安裝在電腦伺服器中,電腦伺服器的設計者通常將上述構件有系統地安排在刀鋒型伺服器(blade server)或機架式伺服器(rack-mount server)內。因此,刀型伺服器內的記憶體模組皆在相同位置、用於伺服器的硬碟皆在相同位置、且處理器皆在相同位置。此系統設置具有提供用於刀型伺服器或機架式伺服器直覺式佈置之優點。 Computer systems (such as desktop computers, blade servers, rack-mounted servers, etc.) are widely used in a variety of applications. Generally, a computer server is designed to accommodate several components of the same type, for example: several processors, several memory modules, several hard disks, several fans, and so on. Since several components of the same type can be installed in a computer server, the designer of a computer server usually arranges the above components systematically in a blade server or a rack-mount server. )Inside. Therefore, the memory modules in the blade server are all in the same position, the hard disks used in the server are all in the same position, and the processors are all in the same position. This system setup has the advantage of providing an intuitive layout for knife-type servers or rack-type servers.
在考慮伺服器之佈置時,獨立的處理器模組與記憶體 模組相較於獨立的硬碟佔據較小體積。因此,伺服器的架構係受減少硬碟之截面積及/或體積的技術影響。舉例來說,3.5吋的硬磁碟驅動機(hard disk drive,HDD)相較於2.5吋的硬磁碟驅動機具有較大長度、較大高度、及較大寬度。2.5吋的硬磁碟驅動機之規格尺寸(form factor)較3.5吋的硬磁碟驅動機新穎。存在其他更大的規格尺寸,但已在現今的硬磁碟驅動機市場中被淘汰。 When considering the layout of the server, separate processor modules and memory The module occupies a smaller volume than an independent hard disk. Therefore, the architecture of the server is affected by technologies that reduce the cross-sectional area and/or volume of the hard disk. For example, a 3.5-inch hard disk drive (HDD) has a larger length, a larger height, and a larger width than a 2.5-inch hard disk drive. The form factor of the 2.5-inch hard disk drive is newer than that of the 3.5-inch hard disk drive. There are other larger specifications, but they have been eliminated in the current hard disk drive market.
伺服器的設計者可能想要在伺服器中容置盡可能多的硬磁碟驅動機。2.5吋的硬磁碟驅動機相較於3.5吋的硬磁碟驅動機具有尺寸的優勢,更多數量之2.5吋的硬磁碟驅動機可被容許整合在伺服器中。另一方面,3.5吋的硬磁碟驅動機具有容量的優勢,且可儲存幾乎為2.5吋的硬磁碟驅動機之兩倍的資訊。3.5吋的硬磁碟驅動機的此優勢使其可在小型化為趨勢的時代仍為可行的。 The designer of the server may want to accommodate as many hard disk drives as possible in the server. The 2.5-inch hard disk drive has a size advantage compared to the 3.5-inch hard disk drive, and a larger number of 2.5-inch hard disk drives can be allowed to be integrated into the server. On the other hand, the 3.5-inch hard disk drive has the advantage of capacity, and can store almost twice the information of the 2.5-inch hard disk drive. This advantage of the 3.5-inch hard disk drive makes it feasible in an era when miniaturization is a trend.
新穎的儲存技術規格尺寸現今仍在發展中。舉例來說,固態磁碟(solid state drive,SSD)或混合式驅動機(hybrid drive)可被包裝成2.5吋的硬磁碟驅動機之規格尺寸。固態磁碟或混合式驅動機可被包裝成更小的規格尺寸(例如:Ruler SSD),或者固態磁碟可捨棄包裝(package)而被直接裝設在伺服器的擴充槽中(例如:M.2槽)。當新的規格尺寸出現時,伺服器的設計及製造過程可能會改變以適應新的規格尺寸。新的規格尺寸可能容許硬碟更高的整合度,從而限制了先前可用於將拴件或固定件安裝在容納硬碟之框架中的空間。因此,本揭露旨在解決有關於組裝框架的問題,用於使用更小規格尺寸的硬碟之伺服器。 Novel storage specifications and dimensions are still under development. For example, a solid state drive (SSD) or a hybrid drive (hybrid drive) can be packaged into a 2.5-inch hard disk drive size. The solid-state disk or hybrid drive can be packaged into a smaller size (for example: Ruler SSD), or the solid-state disk can be directly installed in the expansion slot of the server without the package (for example: M .2 slots). When a new specification size appears, the design and manufacturing process of the server may be changed to adapt to the new specification size. The new size may allow for a higher degree of integration of the hard disk, thereby limiting the space previously available for mounting the bolts or fasteners in the frame that accommodates the hard disk. Therefore, this disclosure aims to solve the problem of assembling the frame for a server that uses a smaller size hard disk.
本揭露之一些實施例提供一種隔板(partition),用於在承載數個電腦構件的一設備中分隔上述電腦構件。隔板包括:一隔板本體、一或多個頂調整片(tab)、一或多個底調整片、以及一或多個底突出件。隔板本體包含一第一側及一第二側。一或多個頂調整片從隔板本體之第一側及第二側伸出。一或多個底調整片從隔板本體之第一側伸出。一或多個底突出件從隔板本體之第二側伸出。一或多個頂調整片係以一第一方式固定至設備的一第一面板。一或多個底調整片係以第一方式固定至設備的一第二面板。一或多個底突出件係以一第二方式固定至設備的第二面板。第一方式與第二方式不同。 Some embodiments of the present disclosure provide a partition for separating the computer components in a device that carries several computer components. The partition includes: a partition body, one or more top tabs, one or more bottom tabs, and one or more bottom protrusions. The partition body includes a first side and a second side. One or more top adjusting pieces protrude from the first side and the second side of the partition body. One or more bottom adjusting pieces protrude from the first side of the partition body. One or more bottom protrusions protrude from the second side of the partition body. One or more top adjustment pieces are fixed to a first panel of the device in a first manner. One or more bottom adjustment sheets are fixed to a second panel of the device in a first manner. One or more bottom protrusions are fixed to the second panel of the device in a second manner. The first method is different from the second method.
本揭露之一些實施例提供一種框架面板(cage panel),在承載電腦構件的一設備中。框架面板可操作以形成包含數個隔板以承載電腦構件的一框架(cage)。框架面板包括:複數個區域(overhanging region)以及複數個第一凹區。上述第一凹區的一分別的第一凹區包括一或多個孔洞,用於固定一第一隔板。框架面板更包括複數個止動件。一分別的止動件係配置以藉由接合隔板的一突出件,在突出件被塞進一分別的區域下方時,限制第一隔板在一單一方向上的運動。 Some embodiments of the present disclosure provide a cage panel in a device that carries computer components. The frame panel is operable to form a cage including a plurality of partitions for carrying computer components. The frame panel includes a plurality of overhanging regions and a plurality of first concave regions. A respective first recessed area of the first recessed area includes one or more holes for fixing a first partition. The frame panel further includes a plurality of stoppers. A separate stopper is configured to restrict the movement of the first partition in a single direction when the protrusion is inserted under a separate area by engaging a protrusion of the partition.
本揭露之一些實施例提供一種用於承載數個電腦構件的設備。上述設備包括:複數個框架面板以及複數個隔板。複數個框架面板包括一第一框架面板及一第二框架面板。一分別的隔板 包括一隔板本體,包含一第一側及一第二側。分別的隔板更包括一或多個頂調整片,從隔板本體之第一側及第二側伸出。分別的隔板更包括一或多個底調整片,從隔板本體之第一側伸出。分別的隔板更包括一或多個底突出件,從隔板本體之該第二側伸出。一或多個頂調整片係以一第一方式固定至設備之第一框架面板。一或多個底調整片係以第一方式固定至設備之第二框架面板。一或多個底突出件係以一第二方式固定至設備的第二框架面板。第一方式與第二方式不同。 Some embodiments of the present disclosure provide a device for carrying several computer components. The above-mentioned equipment includes: a plurality of frame panels and a plurality of partitions. The plurality of frame panels includes a first frame panel and a second frame panel. A separate partition It includes a partition body, including a first side and a second side. The respective partitions further include one or more top adjustment pieces, which extend from the first side and the second side of the partition body. The respective partitions further include one or more bottom adjusting pieces, which extend from the first side of the partition body. The respective partitions further include one or more bottom protrusions, which protrude from the second side of the partition body. One or more top adjustment pieces are fixed to the first frame panel of the device in a first manner. One or more bottom adjustment sheets are fixed to the second frame panel of the device in the first way. One or more bottom protrusions are fixed to the second frame panel of the device in a second manner. The first method is different from the second method.
上述新型內容並非意欲代表各個實施例或本揭露之每種型態。反而,前述新型內容僅提供闡述之一些新穎的型態及特徵的其中一種範例。上述的特徵及優點以及本揭露之其他特徵及優點將從以下說明書之代表實施例及模式以及附圖及所附申請專利範圍變得全然地明顯。 The above new content is not intended to represent each embodiment or every type of this disclosure. Instead, the aforementioned new content only provides an example of some of the novel types and features described. The above-mentioned features and advantages, as well as other features and advantages of the present disclosure, will become fully apparent from the representative embodiments and modes in the following description, the drawings, and the scope of the attached patent application.
100:伺服器 100: server
102:伺服器外殼 102: server shell
104:埠 104: Port
106:控制面板 106: Control Panel
108-1,108-2:儲存驅動機(硬碟) 108-1, 108-2: storage drive (hard disk)
108h:高度 108h: height
108w:寬度 108w: width
110-1,110-2,110-3:隔板 110-1, 110-2, 110-3: bulkhead
110w:寬度 110w: width
300:伺服器 300: server
304:埠 304: Port
306:控制面板 306: Control Panel
308-1,308-2,308-11,308-12:儲存驅動機 308-1, 308-2, 308-11, 308-12: storage drive
308h:高度 308h: height
308w:寬度 308w: width
310-1,310-2,310-3:隔板 310-1, 310-2, 310-3: Partition
310w:寬度 310w: width
401:儲存驅動機框架 401: storage drive frame
405a:第一列 405a: first column
405b:第二列 405b: second column
420:頂框架面板 420: Top frame panel
422:中框架面板 422: middle frame panel
424:底框架面板 424: bottom frame panel
500:框架面板及隔板設計 500: Frame panel and partition design
501:配置 501: configuration
505a:底列 505a: bottom column
505b:頂列 505b: Top column
508w:間隔 508w: interval
510-1,510-2,510-11,510-12:隔板 510-1, 510-2, 510-11, 510-12: partition
510w:寬度 510w: width
511:凹區 511: concave area
512a:頂調整片 512a: Top adjustment piece
512b:底調整片 512b: Bottom adjustment film
513:面板開孔 513: Panel cutout
522:中框架面板 522: middle frame panel
524:框架面板(底框架面板) 524: frame panel (bottom frame panel)
530:鉚釘槍 530: Rivet Gun
610:隔板 610: Partition
610w:寬度 610w: width
612a:頂調整片 612a: Top adjustment piece
612b:底調整片 612b: Bottom adjustment film
614:底突出件(突出件) 614: Bottom protruding piece (protruding piece)
638:U型金屬片 638: U-shaped metal sheet
640:通孔 640: Through hole
642:側輪廓 642: side profile
643:中線面 643: midline surface
644a:頂擋板 644a: top baffle
644b:底擋板 644b: bottom baffle
646:孔洞 646: hole
648:通孔 648: Through Hole
700:框架面板 700: frame panel
711a,711b:第一凹區 711a, 711b: the first concave area
713a,713b:孔洞 713a, 713b: holes
715:止動件 715: stop
715a:區域 715a: area
717:第二凹區 717: second concave area
719:止動件 719: Stop
719a:區域 719a: area
750:端部特徵 750: End Features
800:局部組件 800: partial components
808w:間隔 808w: interval
810-1,810-2,810-3:隔板 810-1, 810-2, 810-3: partition
811a,811b:第一凹區 811a, 811b: the first concave area
812a:頂調整片 812a: Top adjustment piece
812b:底調整片 812b: Bottom adjustment film
813a,813b:孔洞 813a, 813b: holes
814:底突出件 814: bottom protrusion
815:止動件 815: stop
815a:區域 815a: area
817:第二凹區 817: second concave area
819:止動件 819: Stop
819a:區域 819a: area
820:頂框架面板 820: Top frame panel
822:中框架面板 822: middle frame panel
824:底框架面板 824: bottom frame panel
830:鉚釘槍 830: Rivet Gun
846:孔洞 846: hole
900:製程 900: Process
901,902,903,904,905,906,907,908:步驟 901,902,903,904,905,906,907,908: steps
910-1,910-2,910-3:隔板 910-1,910-2,910-3: partition
920:頂蓋 920: top cover
1001,1003,1005,1007:放大部 1001, 1003, 1005, 1007: Enlargement section
1030:鉚釘槍 1030: Rivet Gun
1080,1082:隔板-面板結合 1080, 1082: partition-panel combination
1084,1086:組合位置 1084, 1086: combined position
1088:框架 1088: frame
本揭露將由以下描述的範例實施例並參照附圖而被更佳地理解。 The present disclosure will be better understood by the exemplary embodiments described below with reference to the accompanying drawings.
第1圖繪示包含標準規格尺寸的儲存驅動機之伺服器的立體圖。 Figure 1 shows a three-dimensional view of a server including a storage driver with standard specifications and dimensions.
第2圖繪示第1圖之伺服器的前視圖。 Figure 2 shows the front view of the server of Figure 1.
第3圖繪示根據本揭露之一些實施例,包含規格尺寸相較第1圖及第2圖之標準規格尺寸更小的儲存驅動機之伺服器的前視圖。 FIG. 3 shows a front view of a server with a storage driver having a smaller size than the standard size of FIG. 1 and FIG. 2 according to some embodiments of the present disclosure.
第4圖繪示第3圖之伺服器的局部前視圖。 Figure 4 shows a partial front view of the server shown in Figure 3.
第5A圖繪示已知的框架面板及隔板的設計。 Figure 5A shows the design of a known frame panel and partition.
第5B圖繪示根據第5A圖,用於組裝框架面板及隔板的設計之第一組合位置。 Figure 5B shows the first combination position of the design for assembling the frame panel and the partition according to Figure 5A.
第5C圖繪示根據第5A圖,用於組裝框架面板及隔板的設計之第二組合位置。 Figure 5C shows the second combination position of the design for assembling the frame panel and the partition according to Figure 5A.
第5D圖繪示根據第5A圖,組裝框架面板及隔板的設計中妨礙使用鉚釘槍(rivet gun)的間隔(spacing)。 Figure 5D shows the spacing that prevents the use of rivet guns in the design of the assembled frame panels and partitions according to Figure 5A.
第6A圖繪示根據本揭露之一些實施例,隔板的立體圖。 FIG. 6A is a perspective view of a partition board according to some embodiments of the present disclosure.
第6B圖繪示第6A圖之隔板的頂視圖。 Figure 6B shows a top view of the partition of Figure 6A.
第7A圖繪示根據本揭露之一些實施例的框架面板。 FIG. 7A shows a frame panel according to some embodiments of the present disclosure.
第7B圖繪示第7A圖之隔板的局部圖。 Figure 7B shows a partial view of the partition of Figure 7A.
第8A圖繪示根據本揭露之一些實施例,安裝在底框架面板上的數個隔板。 FIG. 8A shows several partitions installed on the bottom frame panel according to some embodiments of the present disclosure.
第8B圖繪示根據本揭露之一些實施例,用於將隔板安裝在第8A圖之底框架面板的第一組合位置。 FIG. 8B shows the first assembly position of the bottom frame panel of FIG. 8A for installing the partition board according to some embodiments of the present disclosure.
第9圖為根據本揭露之一些實施例,組裝隔板在框架面板上之製程的流程圖。 Figure 9 is a flow chart of the process of assembling the partition on the frame panel according to some embodiments of the present disclosure.
第10A圖繪示根據本揭露之一些實施例,儲存驅動機框架在組裝期間的第一狀態。 FIG. 10A illustrates the first state of the storage driver frame during assembly according to some embodiments of the present disclosure.
第10B圖繪示第10A圖之儲存驅動機框架的局部放大圖。 Fig. 10B shows a partial enlarged view of the storage driver frame of Fig. 10A.
第10C圖繪示根據本揭露之一些實施例,儲存驅動機框架在組裝期間的第二狀態。 FIG. 10C illustrates the second state of the storage driver frame during assembly according to some embodiments of the present disclosure.
第10D圖繪示第10C圖之儲存驅動機框架的局部放大圖。 Figure 10D shows a partial enlarged view of the storage driver frame of Figure 10C.
第10E圖繪示根據本揭露之一些實施例,鉚釘槍定位在儲存驅動機框架上方。 FIG. 10E illustrates that according to some embodiments of the present disclosure, the rivet gun is positioned above the storage driver frame.
第10F圖繪示第10E圖之儲存驅動機框架的局部放大圖。 Figure 10F shows a partial enlarged view of the storage driver frame of Figure 10E.
第10G圖繪示根據本揭露之一些實施例,儲存驅動機框架在組裝期間的第三狀態。 FIG. 10G illustrates the third state of the storage driver frame during assembly according to some embodiments of the present disclosure.
第10H圖繪示第10G圖之儲存驅動機框架的局部放大圖。 Figure 10H shows a partial enlarged view of the storage driver frame of Figure 10G.
第10I圖繪示根據本揭露之一些實施例,儲存驅動機框架在組裝期間的第四狀態。 FIG. 10I illustrates a fourth state of the storage driver frame during assembly according to some embodiments of the present disclosure.
第10J圖繪示根據本揭露之一些實施例,鉚釘槍定位在儲存驅動機框架上方的立體圖。 FIG. 10J shows a perspective view of the rivet gun positioned above the storage driver frame according to some embodiments of the present disclosure.
第10K圖繪示根據本揭露之一些實施例,儲存驅動機框架在組裝期間的第五狀態。 FIG. 10K illustrates the fifth state of the storage driver frame during assembly according to some embodiments of the present disclosure.
第10L圖繪示第10K圖之儲存驅動機框架的放大圖。 Figure 10L shows an enlarged view of the storage driver frame of Figure 10K.
第10M圖繪示根據本揭露之一些實施例,組裝之後的儲存驅動機框架。 FIG. 10M illustrates the storage driver frame after assembly according to some embodiments of the present disclosure.
本揭露容許各種變更及替代形式。一些代表的實施例已在圖式中以範例呈現並在本文詳細地描述。然而,可以瞭解的是,並無意限制本新型於所揭露的特定形式。反而,在所附申請專利範圍定義的本揭露之精神及範疇之中,本揭露係涵蓋所有變更、等效及替代物。 This disclosure allows various changes and alternative forms. Some representative embodiments have been presented as examples in the drawings and described in detail herein. However, it can be understood that there is no intention to limit the invention to the specific form disclosed. On the contrary, in the spirit and scope of the present disclosure as defined by the scope of the appended application, the present disclosure covers all changes, equivalents and alternatives.
本新型可以多種不同形式實施。代表性實施例係以圖式呈現,且將在本文詳細描述。本揭露為本揭露之原理的範例或說明,且無意將本揭露之廣泛型態限制於在此說明的實施例。在這程度上,在例如摘要、新型內容、說明書中揭露但在申請專利範圍中無明確闡述的元件及限制,不應藉由暗示、推斷等,單獨地、或集體地被包含在申請專利範圍中。就本說明書而言,除非特別排除,單數形包括複數形,且反之亦然。字詞「包括」意即「包括但不限於」。此外,近似的字詞如「大約(about)」、「幾乎(almost)」、「實質上(substantially)」、「近乎(approximately)」等,在此可意即例如:「在(at)」、「附近(near)」、或「在附近(near at)」、或「在3到5百分比之內」、或「在可接受的製造公差之內」或上述任意合理的組合。 The present invention can be implemented in many different forms. Representative embodiments are presented in diagrams and will be described in detail herein. The present disclosure is an example or description of the principles of the disclosure, and it is not intended to limit the broad aspects of the disclosure to the embodiments described herein. To this extent, elements and limitations that are disclosed in, for example, the abstract, new content, and specification, but are not explicitly stated in the scope of the patent application, should not be included in the scope of the patent application individually or collectively by suggestion, inference, etc. in. For the purposes of this specification, unless specifically excluded, the singular form includes the plural form, and vice versa. The word "include" means "including but not limited to." In addition, similar words such as "about", "almost", "substantially", "approximately", etc., here can mean for example: "在(at)" , "Near", or "near at", or "within 3 to 5 percent", or "within acceptable manufacturing tolerances" or any reasonable combination of the above.
最常見的伺服器架構為搭配3.5吋的硬磁碟驅動機、2.5吋的硬磁碟驅動機、或3.5吋的硬磁碟驅動機及2.5吋的硬磁碟驅動機之組合。最近,新釋出的硬磁碟驅動機具有與常見的3.5吋的硬磁碟驅動機或2.5吋的硬磁碟驅動機不同之規格尺寸。與常見的3.5吋的硬磁碟驅動機或2.5吋的硬磁碟驅動機之規格尺寸相異的範例硬磁碟驅動機為「規尺(Ruler)」固態磁碟(SSD)。規尺固態磁碟具有較2.5吋的硬磁碟驅動機更小的寬度。雖然規尺固態磁碟具有較小的寬度,規尺固態磁碟之儲存容量可較2.5吋的硬磁碟驅動機更大。因此,具有較小規格尺寸的規尺固態磁碟可顯著地增加伺服器的總儲存容量。本揭露之一些實施例提供一種框架,用於承載計算 機裝置(例如:伺服器)之數個儲存驅動機。本揭露之一些實施例提供一種組裝框架的方法,以承載計算機裝置之數個儲存驅動機。本揭露之一些實施例提供一種隔板設計,用於承載儲存驅動機的框架。根據一些實施例的隔板設計可提升結構強度且提高承載儲存驅動機之設備的穩定性。在一些本揭露之實施例中,用於承載儲存驅動機的框架減少對儲存驅動機的電磁干擾(electromagnetic interference,EMI)及靜電放電(electrostatic discharge,ESD)引發故障的風險。減少電磁干擾及靜電放電可藉由框架之雙邊隔板限制每個儲存驅動機之移動而達成。上述隔板可包括固定在隔板之溝槽中的電磁干擾彈簧(EMI springs),用於減少電磁干擾及靜電放電 The most common server architecture is with a 3.5-inch hard disk drive, a 2.5-inch hard disk drive, or a combination of a 3.5-inch hard disk drive and a 2.5-inch hard disk drive. Recently, newly released hard disk drives have different specifications and sizes from common 3.5-inch hard disk drives or 2.5-inch hard disk drives. An example hard disk drive with different specifications and dimensions from a common 3.5-inch hard disk drive or 2.5-inch hard disk drive is a "Ruler" solid state drive (SSD). The solid-state disk of the ruler has a smaller width than a 2.5-inch hard disk drive. Although the solid-state disk of the ruler has a smaller width, the storage capacity of the solid-state disk of the ruler can be larger than that of a 2.5-inch hard disk drive. Therefore, a solid state disk with a smaller size can significantly increase the total storage capacity of the server. Some embodiments of the present disclosure provide a framework for carrying calculations Several storage drives of a machine device (such as a server). Some embodiments of the present disclosure provide a method of assembling a frame to carry several storage drives of a computer device. Some embodiments of the present disclosure provide a partition design for carrying the frame of the storage drive machine. The partition design according to some embodiments can improve the structural strength and the stability of the equipment carrying the storage driver. In some embodiments of the present disclosure, the frame used to carry the storage driver reduces the risk of malfunctions caused by electromagnetic interference (EMI) and electrostatic discharge (ESD) to the storage driver. Reducing electromagnetic interference and electrostatic discharge can be achieved by restricting the movement of each storage driver by the bilateral partitions of the frame. The above-mentioned partition may include electromagnetic interference springs (EMI springs) fixed in the groove of the partition to reduce electromagnetic interference and electrostatic discharge
第1圖繪示包含標準規格尺寸的儲存驅動機(storage drive)108-1、108-2、108-3等之習知伺服器100的立體圖。上述標準規格尺寸為2.5吋的硬磁碟驅動機之規格尺寸或3.5吋的硬磁碟驅動機之規格尺寸。伺服器100包括伺服器外殼102、包含一或多個按鈕的控制面板106、一或多個埠104。硬碟108-1、108-2、108-3等係藉由隔板110-1、110-2、110-3等分隔。
FIG. 1 shows a perspective view of a
請參閱第2圖,提供第1圖之伺服器100的前視圖。伺服器100之每個儲存驅動機及每個隔板皆具有限定的高度及寬度。舉例來說,儲存驅動機108-1具有高度108h及寬度108w。隔板110-1的高度亦為高度108h。隔板110-1的寬度110w小於儲存驅動機108-1之寬度108w。高度108h可為大約2.6吋至約4.1吋。寬度
108w可為大約1吋。寬度110w可為大約0.2至2毫米。
Please refer to Fig. 2 to provide a front view of the
請參閱第3圖,提供包含規格尺寸相較第1圖之儲存驅動機108-1、108-2、108-3等更小規格尺寸的儲存驅動機(例如:儲存驅動機308-1、308-2、308-3等)之伺服器300的前視圖。伺服器300包括包含一或多個按鈕的控制面板306及一或多個埠304。一或多個埠304可為通用序列匯流排(universal serial bus,USB)埠、串聯埠、平行埠等。儲存驅動機308-1具有高度308h及寬度308w。儲存驅動機308-1的高度308h小於第1圖中儲存驅動機108-1之高度108h。在一些實施例中,高度308h大約為高度108h的一半。由於高度308h可小於第1圖中高度108h的一半,第3圖之伺服器300包括兩列儲存驅動機(例如:儲存驅動機308-1及308-2在第一列上,儲存驅動機308-11及308-12在第二列上)。伺服器300及伺服器100大約為相同尺寸,因此相較於伺服器100,更多的儲存驅動機308-X可被包括在伺服器300中。儲存驅動機308-1之寬度308w小於或等於儲存驅動機108-1的寬度108w。寬度308w可為大約9.5毫米或可為大約15毫米,且高度308h可為大約33.75毫米。
Please refer to Figure 3 to provide storage drives with smaller specifications (such as storage drives 308-1, 308), including the storage drives 108-1, 108-2, 108-3, etc., compared with those in Figure 1. -2, 308-3, etc.) the front view of the
伺服器300包括隔板310-1、310-2、310-3等。每一隔板(例如:隔板310-1)具有與高度308h相同的高度。每一隔板(例如:隔板310-1)具有寬度310w。每一隔板310-X之寬度310w皆小於每一隔板110-X之寬度110w。隔板310-1、310-2、310-3...之寬度310w可為大約3毫米至大約8毫米。由於相較於高度108h更小的高度308h,二或多個儲存驅動機308-X可堆疊在彼此上方。第4
圖繪示第3圖之伺服器300的局部,具有第一列405a儲存驅動機及堆疊在第一列405a上的第二列405b儲存驅動機。伺服器300繪示為包括三個框架面板(例如:頂框架面板420、中框架面板422、及底框架面板424),將儲存驅動機框架401部分地界定為包含儲存驅動機308-X之第一列405a及第二列405b。
The
第5A圖繪示已知的框架面板及隔板設計500。框架面板及隔板設計500包括框架面板524及至少一隔板,例如:隔板510-1或隔板510-2。框架面板524包括凹區511,凹區511包含數個面板開孔513。在一些實施例中,面板開孔513為鉚釘開孔,提供以將隔板(例如:隔板510-1)固定至框架面板524。每一隔板(例如:隔板510-1及510-2)包括一或多個突出件(protrusion)或調整片(tab),可被固定至分別的面板開孔513。舉例來說,隔板510-1及隔板510-2包括數個頂調整片512a及數個底調整片512b。底調整片512b可在凹區511中對齊,實質上地配合至少一面板開孔513。底調整片512b可被固定至面板框架524。頂調整片512a可被固定至面板框架524上的面板框架(圖未示)。以此方式,兩個面板框架可平行彼此排列,且藉由隔板(請見例如:第4圖之底框架面板424與中框架面板422)分隔。
Figure 5A shows a known frame panel and
框架面板524之數個凹區511係週期地間隔,使得具有寬度510w的隔板510-1及510-2可以間隔508w分隔。間隔508w為提供以容納儲存驅動機(例如:第2圖之寬度108w與間隔508w類似)。在組裝第5A圖之框架面板及隔板設計500時,相鄰隔板之間的
間隔508w可為限制的因素。對常見的儲存驅動機來說,間隔508w可為足夠大以容置將隔板固定至框架面板的鉚釘槍。但在考慮較小規格尺寸的儲存驅動機時,間隔508w可能不夠寬來容置鉚釘槍(請見例如:第5C圖)。
The recessed
第5B圖繪示第5A圖中用於組裝框架面板及隔板設計500之第一組合位置。第5C圖繪示第5A圖中用於組裝框架面板及隔板設計500之第二組合位置。在第5B圖中,鉚釘槍530定位在框架面板524下方,且接著使用鉚釘將隔板(例如:隔板510-1)固定至框架面板524。在第5C圖中,因為用於容置較小規格尺寸的隔板510-1與510-2之間的較窄間隔,鉚釘槍530無法進入框架面板524以將隔板510-1及510-2固定至框架面板524。在伺服器僅包括一列儲存驅動機(例如:第2圖之伺服器100)時,第5B圖之第一組合位置用於組裝承載一列儲存驅動機的儲存驅動機框架是可接受的。另一方面,在伺服器包括兩列儲存驅動機(例如:第4圖之伺服器300)時,第5C圖所示的第二組合位置對於快速組裝來說是限制的因素。
Figure 5B shows the first combination position for assembling the frame panel and
第5D圖繪置配置501,配置501可在二或多列(例如:頂列505b及底列505a)儲存驅動機被儲存框架容置時適用。藉由使用第5B圖之第一組合位置,底列505a中的隔板(例如:隔板510-11及510-12)可被固定至底框架面板524及中框架面板522。在隔板510-1及510-2被固定至中框架面板522時,可呈現第5C圖中的第二組合位置。鉚釘槍530無法從中框架面板522下方的方向或從中框架面板522上方的方向接近中框架面板522。因此,包含多列的儲存
驅動機框架可能無法使用常見的框架面板、隔板、及組裝方法。本揭露之實施例提供一種框架面板、隔板設計、及組裝方法,用於使包含多列之儲存驅動機框架的建構變得可行,藉此克服第5D圖中所繪示的情況。
Figure 5D depicts a
請參閱第6A圖,根據本揭露之一些實施例,提供隔板610之立體圖。隔板610可具有寬度610w,類似或相同於第3圖之寬度310w。隔板610包括隔板本體。在一些實施例中,隔板本體為U型金屬片638。U型金屬片638包括一或多個頂調整片612a。每一頂調整片612a具有一穿孔或一孔洞646,用於將隔板610固定至框架面板(圖未示)。繪示的隔板610包含四個頂調整片612a,但應理解可在隔板610上提供多於或少於四個頂調整片612a。進一步地,繪示的隔板610在U型金屬片638之每一側上包括一對兩個頂調整片612a。在一些實施例中,在U型金屬片638左側上的頂調整片612a數量可與在U型金屬片638右側上的頂調整片612a數量不同。
Please refer to FIG. 6A. According to some embodiments of the present disclosure, a perspective view of the
在一些實施例中,U型金屬片638更包括一或多個底調整片612b,其中一或多個底調整片612b每一者皆具有孔洞646,用於將隔板610固定至框架面板(圖未示)。U型金屬片638可更包括一或多個底突出件614,用於將隔板610固定至框架面板。在一些實施例中,一或多個底突出件614不包括孔洞,與一或多個底調整片612b不同。在一些實施例中,一或多個底調整片612b係提供在隔板610之第一側上(例如:在U型的左側),且一或多個底突出件614係提供在隔板610之第二側上(例如:在U型的右側)。在一些實施例
中,一或多個底突出件614中的部分亦提供在隔板610之第一側上。
In some embodiments, the
在一些實施例中,U型金屬片638包括一或多個開口或通孔640及648。通孔640及648之形狀可包括圓形、六角形、五角型、多邊形、或上述之組合。通孔640及648促進氣流通過隔板610。
In some embodiments, the
在一些實施例中,U型金屬片638包括在隔板610之第一側及第二側上的一或多個擋板(bumper)(例如:頂擋板644a及底擋板644b)。擋板644a及644b可為襯墊(padding)或可為金屬。擋板644a及644b有助於在安裝或移除儲存驅動機期間,將儲存驅動機(圖未示)靠著隔板610滑動。在一些實施例中,儲存驅動機安置在第6A圖中頂擋板644a與底擋板644b之間,其中底擋板644b部分地承載儲存驅動機之重量。在一些實施例中,不管是頂擋板644a或底擋板644b皆未部分地承載儲存驅動機之重量,且儲存驅動機只有接觸或碰觸擋板644a、644b。
In some embodiments, the
在一些實施例中,U型金屬片638可包括一或多個側輪廓(side contour)642。一或多個側輪廓642可提供在隔板610之第一側上、隔板610之第二側上、或隔板610之第一側及第二側上。一或多個側輪廓642繪示為在中線面643交會,在隔板610之第一側及隔板610之第二側之間提供數個額外的接觸點。在一些實施例中,一或多個側輪廓642為中空的以支持氣流,使得空氣可從隔板610第一側上之側輪廓流至隔板610第二側之側輪廓,反之亦然。
In some embodiments, the
請參閱第7A圖,根據本揭露之一些實施例,提供框架面板700。框架面板700大致為平面的,具有矩形的長寬比。在一些實施例中,框架面板700可包括兩端部特徵750。框架面板700可為底框架面板、中框架面板、或頂框架面板,如第4圖中定義與伺服器300分別連接的框架面板424、422、或420。第7B圖繪示隔板700的局部放大圖。框架面板700可形成為片狀的材料或基板,舉例來說:一金屬片。框架面板700可在一平面表面上包括一定數量的第一凹區(例如:第一列第一凹區711a及第二列第一凹區711b)。第一凹區711a及711b可分別地包括穿孔或孔洞713a及713b,用於固定隔板(例如:用於固定第6A圖之隔板610)。雖然在第7A圖及第7B圖中所示的每個第一凹區711a、711b皆具有一孔洞713a、713b,在每個第一凹區711a、711b中可提供多於一個孔洞。在此範例中,提供了足夠的凹區711a、711b給至多24個隔板。在一些實施例中,為改變承載儲存裝置之框架的寬度,隔板並未附接至所有凹區711a、711b。
Please refer to FIG. 7A. According to some embodiments of the present disclosure, a
框架面板700更包括一或多個止動件(例如:頂列的止動件715及底列的止動件719)。在一些實施例中,一或多個止動件715、719為框架面板700的刻痕(cut),使得區域715a、719a界定為與一或多個止動件715、719相鄰。區域715a、719a係指框架面板700之平面表面下方的區域,在隔板之突出件(例如:隔板610之突出件614)被一或多個止動件715、719擋住時,突出件係位於
此區域中。當固定時,隔板之突出件塞進框架面板700之區域715a、719a下方。在第7A圖及第7B圖中,頂列的止動件715係提供在框架面板700之頂緣,且底列的止動件719係提供在框架面板700之頂緣與框架面板700之底緣之間。在一些實施例中,止動件之列的數量與隔板610之突出件614的數量相同(如第6B圖所示)。
The
框架面板700可更包括一系列第二凹區717。每個第二凹區717提供隔板之突出件調動(maneuvering)的空間,使得突出件可被塞入區域719a下方。在一些實施例中,區域719a懸伸(overhang)在第二凹區717上。在第7B圖中,第二列的止動件719定位在第二凹區717旁。頂列的止動件715係在框架面板700之邊緣旁,且因此具有足夠的鄰近空間以調動隔板。因此,沒有凹區定位在頂列的止動件715旁。第7B圖之每一底列止動件719及分別的頂列止動件715係配置以限制隔板在單一方向上的運動。
The
請參閱第8A圖,根據本揭露之一些實施例,提供底框架面板824上兩隔板810-1及810-2的局部組件800之局部圖。底框架面板824類似或相同於第7A圖及第7B圖之框架面板700。隔板810-1及810-2類似或相同於第6A圖及第6B圖之隔板610,且包括底調整片812b及頂調整片812a。底框架面板824包括一系列第一凹區811a及811b,一系列孔洞813a及813b,一系列止動件819、及一系列第二凹區817。底框架面板824亦包括區域819a,隔板(例如:隔板810-2)之突出件可被塞進此區域下方。
Please refer to FIG. 8A. According to some embodiments of the present disclosure, a partial view of the
將隔板810-1及810-2固定至底框架面板824時,隔板810-1及810-2之底調整片812b與孔洞813b對齊,使得可使用鉚釘槍來插入鉚釘,以將隔板810-1及810-2固定至底框架面板824。第8B圖繪示底框架面板824的組合位置,顯示用於進入第一凹區811b以將隔板810-2固定至底框架面板824的鉚釘槍830。隔板810-1與810-2之間的分隔或間隔808w大約與第5B圖中間隔508w的距離相同。再次參閱第8A圖,底調整片812b可具有與頂調整片812a不同的長寬比。在一些實施例中,底調整片812b比頂調整片812a更長,使得提供在底調整片812b上的孔洞較遠離隔板810-2。將底調整片812b之孔洞定位離隔板810-2較遠提供了額外的空間,用於容置鉚釘槍(例如:鉚釘槍830)。在第8A圖及第8B圖的實施例中,隔板810-2係經由孔洞813a、813b而在第一側固定,且經由隔板810-2之突出件塞進區域819a下方而在第二側固定。
When the partitions 810-1 and 810-2 are fixed to the
比較第5A圖、第5B圖與第8A圖、第8B圖,第5A圖及第5B圖中的隔板510-2太靠近隔板510-1,阻礙了隔板510-2與510-1之間進入鉚釘孔洞的通道。相反地,第8A圖及第8B圖所示,一次安裝一個隔板810-1及810-2,使得鉚釘槍不需要被定位在隔板810-1與810-2之間。然而,如果相似的流程使用在隔板510-1及510-2上,使用鉚釘槍一次安裝一個隔板510-1及510-2,隔板510-1及510-2只有一側會被固定。相反地,隔板810-2具有塞進底框架面板824下方的突出件,使得隔板810-2的兩側皆固定至底框架面板
824。增加隔板與框架面板之間接觸點的數量提升了組件結構的結構完整性。用於承載儲存驅動機的框架通常會承受衝擊及震動驗證測試。因此,所揭露組件提升的結構完整性對於提高框架構成的耐用性是必要的。
Compare Figures 5A and 5B with Figures 8A and 8B. The partition 510-2 in Figures 5A and 5B is too close to the partition 510-1, blocking the partitions 510-2 and 510-1 Between the channels into the rivet holes. In contrast, as shown in Figures 8A and 8B, the partitions 810-1 and 810-2 are installed one at a time, so that the rivet gun does not need to be positioned between the partitions 810-1 and 810-2. However, if a similar process is used on the partitions 510-1 and 510-2, using a rivet gun to install the partitions 510-1 and 510-2 at a time, only one side of the partitions 510-1 and 510-2 will be fixed. . On the contrary, the partition 810-2 has protruding pieces inserted under the
請參閱第9圖,根據本揭露之一些實施例,提供組裝隔板在框架面板上之製程900的流程圖。製程900可被用以製造用於承載儲存驅動機的框架。製程900中不同的步驟係在以下段落參照第10A圖至第10M圖描述。在一些實施例中,製程900可在工廠內自動化進行。製程900包括一起始條件,其中佔位符(placeholder)變數i等於1。變數i僅用以標示列的數量(例如:第5D圖中的頂列505b及底列505a)。
Please refer to FIG. 9, according to some embodiments of the present disclosure, a flow chart of a
步驟901涉及將第i層的隔板放置在目前的框架面板上。舉例來說,底框架面板可為目前的框架面板,且第i層的隔板可為將被放置在框架之底列的隔板。請參閱第10A圖,根據一些實施例,第一張快照(snapshot)顯示將隔板810-2放置在底框架面板824上。在第10A圖中,第8A圖之隔板810-2及底框架面板824在此作為範例使用。隔板810-2被放置在底框架面板824上,使得隔板810-2的底調整片812b處於兩個第一凹區811a與811b中。隔板810-2的一系列底突出件814之其中一者係定位在其中一個第二凹區817中。如第10A圖所示,隔板810-2的底調整片812b之孔洞846與底框架面板824之孔洞813a、813b不對齊。第10B圖繪示第10A
圖之第一張快照之放大部1001的立體圖。在一些實施例中,底調整片812b的厚度小於或等於第一凹區811a、811b內垂直壁的厚度。
Step 901 involves placing the i-th layer of partitions on the current frame panel. For example, the bottom frame panel may be the current frame panel, and the partition of the i-th layer may be the partition to be placed in the bottom row of the frame. Please refer to FIG. 10A. According to some embodiments, the first snapshot shows that the partition 810-2 is placed on the
步驟902涉及將第i層的隔板滑動至目前框架面板的停止位置。請參閱第10C圖,根據一些實施例,第二張快照顯示隔板810-2在底框架面板824之停止位置。在停止位置中,隔板810-2之底調整片812b的孔洞846與底框架面板824之孔洞813b對齊。在第10C圖中,隔板810-2之底突出件814(請見第10A圖)被塞進底框架面板824之頂表面下方,且定位在區域815a、819a中。止動件815、819阻礙底突出件814繼續在第一方向上滑動,因此阻礙了隔板810-2在停止位置在第一方向上的滑動運動。第10D圖繪示第10C圖之放大部1003。相較於第10B圖,在停止位置中已看不見底突出件814。在一些實施例中,隔板810-2係與底框架面板824之至少一個邊緣齊平(flush)。
Step 902 involves sliding the partition of the i-th layer to the current stop position of the frame panel. Please refer to FIG. 10C. According to some embodiments, the second snapshot shows the partition 810-2 at the stopping position of the
步驟903涉及將第i層的隔板固定至目前的框架面板。請參閱第10E圖及第10F圖,鉚釘槍1030可用以將隔板810-2固定至底框架面板824。鉚釘槍1030顯示為將鉚釘施加到底調整片812b。隔板810-2之所有底調整片812b係使用鉚釘槍1030而透過鉚釘固定。
Step 903 involves fixing the partition of the i-th layer to the current frame panel. Please refer to FIG. 10E and FIG. 10F. The
步驟904涉及重複步驟901至步驟903,以將所有第i層的隔板固定至目前的框架面板。舉例來說,在隔板810-2被固定至底框架面板824之後,第10G圖及第10H圖顯示一隔板810-3以與
步驟901相關而類似上述的方式被放置到底框架面板824上的過程。第10G圖及第10H圖繪示隔板-面板結合1080,包含兩個已安裝的隔板810-1及810-2,以及正在被安裝的一個隔板810-3。放大部1005顯示,一旦隔板810-2被安裝,下一步就是安裝隔板810-3。第10I圖繪示隔板-面板結合1082,隔板-面板結合1082為使用上述製程安裝完底框架面板824之所有隔板的最終成果。
Step 904 involves repeating
步驟905涉及將新的框架面板固定至已安裝的第i層隔板。請參閱第10J圖,新的框架面板(中框架面板822)被放置在隔板(例如:底框架面板824之隔板810-1至810-3)頂部。第10J圖繪示組合位置1084,其中鉚釘槍1030係用以插入鉚釘,以將隔板固定至中框架面板822。中框架面板822係在對應至至少一些頂調整片812a的位置(請見例如:第10A圖)而被固定至隔板。
Step 905 involves fixing the new frame panel to the installed i-th layer of partition. Please refer to Figure 10J, a new frame panel (middle frame panel 822) is placed on top of the partitions (for example: partitions 810-1 to 810-3 of the bottom frame panel 824). FIG. 10J shows a
步驟906涉及決定隔板是否要被安裝在新的框架面板上。若隔板要被安裝在新的框架面板上,接著執行步驟907。但若不,可選地,可執行步驟908。
Step 906 involves deciding whether the partition is to be installed on the new frame panel. If the partition is to be installed on the new frame panel, then step 907 is executed. But if not, optionally,
步驟907涉及增加i且將新的框架面板設定為目前的框架面板。步驟907僅為敘述性的步驟,使得步驟901至906的遞迴可以再次使用。請參閱第10A圖至第10J圖之範例,在第10J圖中,組合位置1084繪示完成的一列框架。第10K圖繪示組合位置1086,在此隔板910-1及910-2已依照步驟901至步驟903而安裝,且隔板910-3係在被安裝至中框架面板822上的過程中。第10L圖繪
示第10K圖之放大部1007,顯示隔板910-3係在安裝隔板910-2之後而被安裝。
Step 907 involves adding i and setting the new frame panel as the current frame panel. Step 907 is only a narrative step, so that the recursion of
在將所有隔板(例如:隔板910-1、910-2、及910-3)安裝在中框架面板822上之後,頂框架面板820係在步驟905中被固定至中框架面板822上的隔板(請見第10M圖)。將頂框架面板820固定至中框架面板822完成了包含兩列的框架1088。若需要兩列,那可選地,頂蓋920可被放置在頂框架面板820上。頂蓋920僅為裝飾性且可在一些實施例中被省略。
After all partitions (for example, partitions 910-1, 910-2, and 910-3) are installed on the
製程900容許一次一層或一列地組裝用於承載電腦構件的框架。製程900容許以單一方向的方式,一次一隔板地固定每一層。組裝框架的方向係依據隔板之底調整片的位置而決定。因此,對每一層來說,下一隔板係安裝在前一隔板的底調整片旁,直到那層的所有隔板皆被安裝。在本文使用的儲存裝置僅為範例,所組裝的框架可被用於承載其他種類的電腦構件。
在本文中,所使用的用語「構件(component)」、「模組(module)」、「系統(system)」或其類似者,大致係指電腦相關的實體,可為硬體(例如:電路)、硬體及軟體的組合、軟體、或與具有一或多個特定功能之操作性機器有關的實體。舉例來說,一構件可為,但非限制於,在處理器上運行的處理(process)、處理器、物體、可執行指令(executable)、一連串執行指令、程式、及/或電腦。舉例說明,在控制器上運行的應用程式及控制器皆可為一構件。 一或多個構件可歸屬在一處理及/或一連串執行指令內,且一構件可位於一電腦上及/或分配在二或多個電腦之間。進一步,一「裝置」可為特別設計之硬體形式、藉由執行其上之軟體以使硬體可執行特定功能而特殊化的廣義的硬體、儲存在電腦可讀媒體上的軟體、或上述之組合。 In this article, the terms "component", "module", "system" or the like used in this article generally refer to computer-related entities, which can be hardware (for example: circuit ), a combination of hardware and software, software, or an entity related to an operational machine with one or more specific functions. For example, a component may be, but is not limited to, a process, a processor, an object, an executable instruction (executable), a series of execution instructions, a program, and/or a computer running on the processor. For example, both the application program and the controller running on the controller can be a component. One or more components can belong to a process and/or a series of execution instructions, and a component can be located on one computer and/or distributed between two or more computers. Further, a "device" may be a specially designed hardware form, a broadly-specified hardware specialized by executing software on it to enable the hardware to perform specific functions, software stored on a computer-readable medium, or The combination of the above.
在此使用的用語僅為了描述特定實施例之目的,並非意欲限制本新型。除非上下文清楚地指出,在此所使用的單數形式「一」、「一個」以及「該」亦意欲包括複數形式。除此之外,在某種程度上,不管是在說明書及/或申請專利範圍中所使用的用語「包括(including、includes)」、「具有(having、has)」、「包含(with)」或其變異,這樣的用語係意欲以類似於用語「包括(comprising)」的方式包含在內。 The terms used here are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates, the singular forms "a", "an" and "the" used herein are also intended to include plural forms. In addition, to a certain extent, regardless of the terms "including", "having, has" and "with" used in the specification and/or the scope of the patent application Or its variations, such terminology is intended to be included in a manner similar to the term "comprising".
除非另有定義,在此使用的所有用語(包括技術用語以及科學用語)具有與本新型所屬技術領域中具有通常知識者通常理解的相同意義。除此之外,用語(例如,在常用字典中所定義的用語)應當被解釋為具有在相關領域之上下文的意義一致的意義,且除非在此明確地定義,並不會以理想化或過於正式的理解解釋。 Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those with ordinary knowledge in the technical field to which the present invention belongs. In addition, terms (for example, terms defined in commonly used dictionaries) should be interpreted as having a meaning consistent with the context of the relevant field, and unless clearly defined here, they should not be idealized or overly Formal understanding and explanation.
雖然前文已經描述了本新型之多種實施例,應該瞭解的是,它們僅作為呈現範例,而並非限制。儘管已經圖示並描述了本新型之一或多個實施例,不過對本技術領域具有通常知識者在閱讀及瞭解此說明書(specification)及所附圖式的情形下,可進行均等的改變及修改。此外,本新型之一特定特徵雖然可能只在幾個實 施例之一中揭露,在任意期望及有利的給定或特定應用中,此特徵可與其他實施例之一或多個特徵組合。因此,本新型之廣度及範疇不應受任何上述之實施例所限制。反而,本新型的範疇應由所附申請專利範圍以及其均等範圍(equivalents)而定義。 Although various embodiments of the present invention have been described in the foregoing, it should be understood that they are merely presented as examples and are not limiting. Although one or more embodiments of the present invention have been illustrated and described, those with ordinary knowledge in the technical field can make equal changes and modifications after reading and understanding this specification and the accompanying drawings. . In addition, although one of the specific features of this new model may only be implemented in a few In one of the embodiments, it is disclosed that in any desired and advantageous given or specific application, this feature can be combined with one or more features of other embodiments. Therefore, the breadth and scope of the present invention should not be limited by any of the above-mentioned embodiments. Instead, the scope of the present model should be defined by the scope of the attached patent application and its equivalents.
610:隔板 610: Partition
610w:寬度 610w: width
612a:頂調整片 612a: Top adjustment piece
612b:底調整片 612b: Bottom adjustment film
614:底突出件(突出件) 614: Bottom protruding piece (protruding piece)
638:U型金屬片 638: U-shaped metal sheet
640:通孔 640: Through hole
642:側輪廓 642: side profile
644a:頂擋板 644a: top baffle
644b:底擋板 644b: bottom baffle
646:孔洞 646: hole
648:通孔 648: Through Hole
Claims (9)
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| TW109215388U TWM611634U (en) | 2020-11-23 | 2020-11-23 | Partition and apparatus for holding computer components |
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| Application Number | Priority Date | Filing Date | Title |
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| TW109215388U TWM611634U (en) | 2020-11-23 | 2020-11-23 | Partition and apparatus for holding computer components |
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| TWM611634U true TWM611634U (en) | 2021-05-11 |
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