TWM609451U - Electronic device with touch sensing function - Google Patents
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本揭示文件有關一種具觸控功能的電子裝置,尤指一種內嵌式觸控電子裝置。This disclosure relates to an electronic device with touch function, especially an in-cell touch electronic device.
內嵌式觸控技術能將觸控模組製作於顯示器內部,以使裝置整體具有輕薄化與高亮度的優點。市面上常見的內嵌式觸控顯示器的運作原理,是透過其內部矩陣排列的多個矩形觸控電極進行自容式觸控感測,而每個觸控電極都需要單獨的一條走線以傳輸其感測結果至觸控晶片。不過,隨著觸控解析度的需求逐漸提高,常見的觸控晶片之通道數量不足以支援這種設計方式,且觸控電極之間也容易因大量且密集的走線而互相短路。另外,使用自容式觸控感測技術的裝置也不適於使用觸控筆操作。The in-cell touch technology can fabricate the touch module inside the display, so that the overall device has the advantages of lightness and high brightness. The operating principle of the common in-cell touch display on the market is to perform self-capacitive touch sensing through multiple rectangular touch electrodes arranged in a matrix, and each touch electrode needs a separate trace to Transmit its sensing results to the touch chip. However, as the demand for touch resolution gradually increases, the number of channels of common touch chips is not enough to support this design method, and the touch electrodes are also prone to short-circuit due to a large number of dense wiring. In addition, devices using self-capacitive touch sensing technology are not suitable for operation with a stylus.
本揭示文件提供一種具觸控功能的電子裝置,其包含多個第一觸控電極、多個第二觸控電極與多個畫素電路。多個第一觸控電極平行於Y軸。每個第一觸控電極包含多個第一電極塊與多個橋接圖案,且多個第一電極塊與多個橋接圖案串聯。多個第二觸控電極平行於X軸。每個第二觸控電極包含多個第二電極塊與多個連接圖案,多個第二電極塊與多個連接圖案串聯,且X軸實質上正交於Y軸。多個畫素電路投影對應於多個第一觸控電極與多個第二觸控電極,用於自多個第一觸控電極與多個第二觸控電極接收一或多個電壓。The present disclosure provides an electronic device with touch function, which includes a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of pixel circuits. The plurality of first touch electrodes are parallel to the Y axis. Each first touch electrode includes a plurality of first electrode blocks and a plurality of bridge patterns, and the plurality of first electrode blocks are connected in series with the plurality of bridge patterns. The plurality of second touch electrodes are parallel to the X axis. Each second touch electrode includes a plurality of second electrode blocks and a plurality of connection patterns, the plurality of second electrode blocks are connected in series with the plurality of connection patterns, and the X axis is substantially orthogonal to the Y axis. The plurality of pixel circuit projections correspond to the plurality of first touch electrodes and the plurality of second touch electrodes, and are used to receive one or more voltages from the plurality of first touch electrodes and the plurality of second touch electrodes.
上述實施例的優點之一,是能精確判斷觸控筆的移動軌跡。One of the advantages of the above embodiment is that it can accurately determine the movement track of the stylus.
上述實施例的另一優點,是大幅減少了觸控電極接收與輸出訊號所需的走線數量。Another advantage of the above embodiment is that the number of traces required for the touch electrodes to receive and output signals is greatly reduced.
以下將配合相關圖式來說明本揭示文件的實施例。在圖式中,相同的標號表示相同或類似的元件或方法流程。The embodiments of the present disclosure will be described below in conjunction with related drawings. In the drawings, the same reference numerals indicate the same or similar elements or method flows.
第1圖為依據本揭示文件一實施例的電子裝置100簡化後的功能方塊圖。電子裝置100具有互容式觸控功能,且包含多個第一觸控電極110_1~110_5、多個第二觸控電極120_1~120_4、控制電路130與基板SB。第一觸控電極110_1~110_5平行於Y軸,且於X軸方向上依序排列。第二觸控電極120_1~120_4平行於X軸,且於Y軸方向上依序排列,其中X軸實質上正交於Y軸。第一觸控電極110_1~110_5與第二觸控電極120_1~120_4彼此交錯排列,亦即第一觸控電極110_1~110_5的每一者與第二觸控電極120_1~120_4交叉,而第二觸控電極120_1~120_4的每一者也與第一觸控電極110_1~110_5交叉。FIG. 1 is a simplified functional block diagram of the
控制電路130用於分別傳送多個掃描訊號Tx1~Tx5至第一觸控電極110_1~110_5,並用於自第二觸控電極120_1~120_4分別接收多個感測訊號Rx1~Rx4。當觸控輸入(例如,使用者的手指或觸控筆)靠近電子裝置100時,第一觸控電極110_1~110_5與第二觸控電極120_1~120_4之間的互電容值(Mutual Capacitance)會改變,而感測訊號Rx1~Rx4的大小則會反映這些互電容值的變化。因此,控制電路130可以依據感測訊號Rx1~Rx4計算出觸控輸入於X軸與Y軸上的位置。The control circuit 130 is used for respectively transmitting a plurality of scanning signals Tx1~Tx5 to the first touch electrodes 110_1~110_5, and is used for respectively receiving a plurality of sensing signals Rx1~Rx4 from the second touch electrodes 120_1~120_4. When a touch input (for example, a user's finger or a stylus) approaches the
在一些實施例中,電子裝置100還包含用於實現顯示功能的多種元件,例如掃描驅動電路、背光模組與多個畫素電路中的一或多者,為簡潔起見,這些元件與其連接關係並未繪示於第1圖中。當以Z軸的方向俯視電子裝置100時,第一觸控電極110_1~110_5、第二觸控電極120_1~120_4與多個畫素電路是位於基板SB上方的一主動區AA中,其中Z軸實質上正交於X軸與Y軸。主動區AA可以是電子裝置100用於提供顯示畫面給使用者的區域,而基板SB中圍繞於主動區AA的其他區域則為周邊區PA。周邊區PA可用於設置掃描驅動電路以提供畫素電路運作所需的控制訊號,掃描驅動電路的相關技術為所屬技術領域具有通常知識者所熟知,為簡潔起見,在此不再贅述。In some embodiments, the
在一些實施例中,電子裝置100可以是智慧型手機、平板電腦或筆記型電腦,也可以是設置於前述裝置中的內嵌式觸控顯示面板。In some embodiments, the
值得注意的是,第1圖中第一觸控電極110_1~110_5與第二觸控電極120_1~120_4的數量僅為示範性的實施例。在一些實施例中,第一觸控電極與第二觸控電極的數量可以依據實際的設計需求而調整,以適應不同尺寸的面板,或適應不同的解析度需求。It should be noted that the number of the first touch electrodes 110_1 to 110_5 and the second touch electrodes 120_1 to 120_4 in Figure 1 is only an exemplary embodiment. In some embodiments, the number of the first touch electrode and the second touch electrode can be adjusted according to actual design requirements to adapt to panels of different sizes or to adapt to different resolution requirements.
在第1圖的實施例中,控制電路130是設置於基板SB之外,且可透過晶粒軟模接合(Chip on Film,簡稱COF)技術連接於基板SB,但本揭示文件不以此為限。在另一些實施例中,控制電路130亦可以採用晶粒玻璃接合(Chip on Glass,簡稱COG)技術而直接設置於基板SB上。In the embodiment of FIG. 1, the control circuit 130 is disposed outside the substrate SB, and can be connected to the substrate SB through Chip on Film (COF) technology, but this disclosure does not take this as limit. In some other embodiments, the control circuit 130 can also be directly disposed on the substrate SB by using Chip on Glass (COG) technology.
請再參考第1圖,第一觸控電極110_1~110_5的每一者包含多個第一電極塊112與多個橋接圖案114。多個第一電極塊112與多個橋接圖案114串聯,亦即相鄰的兩個第一電極塊112透過一個橋接圖案114互相耦接。第二觸控電極120_1~120_4的每一者包含多個第二電極塊122與多個連接圖案124。多個第二電極塊122與多個連接圖案124串聯,亦即相鄰的兩個第二電極塊122透過一個連接圖案124互相耦接。每個橋接圖案114於Z軸方向上交叉於一個對應的連接圖案124,且第一電極塊112、第二電極塊122與連接圖案124設置於基板SB上的同一層,而橋接圖案114則設置於基板SB上不同的另一層。在後述的第2圖中,第1圖中的區域140將被放大來詳細說明上述的層疊關係。Please refer to FIG. 1 again, each of the first touch electrodes 110_1 to 110_5 includes a plurality of
每個第一電極塊112與每個第二電極塊122實質上為矩形或菱形,但本揭示文件不以此為限。在一些實施例中,第一觸控電極110_1~110_5每一者兩端(例如,頭端和末端)的第一電極塊112可以實質上為三角形,而第二觸控電極120_1~120_4每一者兩端(例如,頭端和末端)的第二電極塊122也可以實質上為三角形。在另一些實施例中,多個第一電極塊112與多個第二電極塊122彼此電性隔離。在又一些實施例中,多個第一電極塊112與多個第二電極塊122可以用各種合適的透明導電薄膜來實現,例如氧化銦錫(Indium Tin Oxide,簡稱ITO)薄膜或氧化鋅鋁(Al-doped Zno,簡稱AZO)薄膜。Each
在第1圖的實施例中,電子裝置100還包含多個訊號傳輸圖案150。第一觸控電極110_1~110_5的每一者透過其末端的第一電極塊112耦接於訊號傳輸圖案150,並透過訊號傳輸圖案150接收掃描訊號Tx1~Tx5的其中之一。第二觸控電極120_1~120_4的每一者則可透過一對應的第二電極塊122耦接於訊號傳輸圖案150,並透過訊號傳輸圖案150傳送感測訊號Rx1~Rx5的其中之一。例如,第二觸控電極120_1是透過其自第1圖右方數來第二個第二電極塊122耦接於訊號傳輸圖案150。又例如,第二觸控電極120_2是透過其自第1圖右方數來第三個第二電極塊122耦接於訊號傳輸圖案150,其餘依此類推。不過,第二觸控電極120_1~120_4與訊號傳輸圖案150的連接方式並不以上述為限。在一些實施例中,第二觸控電極120_1~120_4的每一者也可以透過其頭端或末端的第二電極塊122來耦接於訊號傳輸圖案150。在後述的第5圖中,第1圖的區域160將被放大,以進一步說明第一觸控電極110_1~110_5和第二觸控電極120_1~120_4電性連接於訊號傳輸圖案150的方式。In the embodiment of FIG. 1, the
第2圖為第1圖的區域140放大後的示意圖。在一些實施例中,多個畫素電路PX用於自第一觸控電極110_1~110_5和第二觸控電極120_1~120_4接收運作所需的一或多個電壓。因此,第一電極塊112的至少一邊緣為鋸齒狀,且第二電極塊122的至少一邊緣也為鋸齒狀,以投影對應於多個畫素電路PX。第2圖中每個畫素電路PX方塊中的符號R、G和B分別代表畫素電路PX是用於發出紅光、綠光和藍光,但本揭示文件的畫素電路PX之顏色排列方式與組合不以此為限。Figure 2 is an enlarged schematic view of the
詳細而言,在X軸與Y軸所在的平面上,第一電極塊112的至少一邊緣包含多個第一突出部210,第二電極塊122的至少一邊緣包含多個第二突出部220。這些第一突出部210和第二突出部220的每一者重疊於對應的一或多個畫素電路PX在Z軸方向上的投影。In detail, on the plane where the X axis and the Y axis are located, at least one edge of the
另外,在一些實施例中,多個第一電極塊112與多個第二電極塊122之間的縫隙不重疊於畫素電路PX於該Z軸的方向上的投影。In addition, in some embodiments, the gaps between the plurality of
如第2圖所示,橋接圖案114包含多個橋接線230a和230b。橋接線230a和230b與第一電極塊112、第二電極塊122以及連接圖案124位於基板SB上的不同層。因此,橋接線230a和230b各自透過兩個貫孔(Via Hole)240分別電性連接於兩個相鄰的第一電極塊112,且橋接線230a和230b會交叉於連接圖案124。在一些實施例中,橋接線230a和230b各自設置於對應的兩行畫素電路PX之間,而且不重疊於畫素電路PX於Z軸方向上的投影。在另一些實施例中,橋接線230a和230b不會設置於相同的兩行畫素電路PX之間,且彼此之間至少間隔一行畫素電路PX。值得注意的是,第2圖中橋接線的數量僅為示範性的實施例,橋接圖案114可以依據實際設計需求包含一或多個橋接線。As shown in FIG. 2, the
另外,連接圖案124用於耦接兩個相鄰的第二電極塊122,且其邊緣可不具有突出部,而使得連接圖案124實質上為矩形。連接圖案124重疊於多個畫素電路PX於Z軸的方向上的投影。In addition, the
第3A圖為沿第2圖中剖線A-A’於一實施例中簡化後的剖面示意圖。在本實施例中,畫素電路PX為液晶畫素電路,電子裝置100由下至上依序包含了下玻璃基板310、透明導電薄膜層(包含第一電極塊112、第二電極塊122以及連接圖案124)、絕緣層320、薄膜電晶體層330(包含橋接圖案114)、液晶層340以及上玻璃基板350。貫孔240穿過絕緣層320而使得橋接圖案114能電性連接於第一電極塊112。第一觸控電極110_1~110_5與第二觸控電極120_1~120_4共同形成畫素電路PX的共同電極層,並用於為畫素電路PX提供一或多個共同電壓,其中該一或多個共同電壓可用於進行極性反轉操作,且可以關聯於畫素電路PX所提供的灰階。Figure 3A is a simplified cross-sectional view taken along the section line A-A' in Figure 2 in an embodiment. In this embodiment, the pixel circuit PX is a liquid crystal pixel circuit, and the
畫素電路PX可以包含一或多個開關電晶體與亮度決定電路,其中亮度決定電路用於決定畫素電路PX所提供的灰階並耦接於第一觸控電極110_1~110_5中的對應一者或第二觸控電極120_1~120_4中的對應一者。例如,在一些實施例中,畫素電路PX可以用第3B圖的畫素電路300來實現。畫素電路300包含一或多個開關電晶體Ms與亮度決定電路360,其中亮度決定電路360包含儲存電容Cs與液晶電容Clc。開關電晶體Ms用於依據控制訊號Sc選擇性地導通或關斷,以將資料電壓Vdata寫入儲存電容Cs與液晶電容Clc。儲存電容Cs的第一端耦接於液晶電容Clc與開關電晶體Ms,儲存電容Cs的第二端則耦接於第一觸控電極110_1~110_5中的對應一者或第二觸控電極120_1~120_4中的對應一者。為簡潔起見,在第3B圖中分別以標號110與120表示第一觸控電極110_1~110_5的其中之一與第二觸控電極120_1~120_4的其中之一。The pixel circuit PX may include one or more switching transistors and a brightness determination circuit, wherein the brightness determination circuit is used to determine the gray scale provided by the pixel circuit PX and is coupled to a corresponding one of the first touch electrodes 110_1~110_5 Or the corresponding one of the second touch electrodes 120_1~120_4. For example, in some embodiments, the pixel circuit PX may be implemented by the
在前述第2圖的實施例中,當由Z軸方向俯視電子裝置100時,橋接圖案114是位於第一電極塊112、第二電極塊122與連接圖案124上方,但本揭示文件不以此為限。In the embodiment of FIG. 2 described above, when the
在一些實施例中,當由Z軸方向俯視電子裝置100時,橋接圖案114是位於第一電極塊112、第二電極塊122與連接圖案124下方。在此情況下,沿第2圖中剖線A-A’所得到的剖面圖如會如第4A圖所示。在第4A圖的實施例中,畫素電路PX為有機發光二極體畫素電路,且電子裝置100由下至上依序包含了下基板410、薄膜電晶體層420(包含橋接圖案114)、絕緣層430、透明導電薄膜層(包含第一電極塊112、第二電極塊122與連接圖案124)以及上基板440。貫孔240穿過絕緣層430而使得橋接圖案114能電性連接於第一電極塊112。第一觸控電極110_1~110_5與第二觸控電極120_1~120_4耦接於多個畫素電路PX的有機發光二極體(未繪示於第4A圖)的陰極或陽極,並用於提供一或多個工作電壓至畫素電路PX,其中該一或多個工作電壓可以關聯於畫素電路PX提供的灰階。In some embodiments, when the
例如,在一些實施例中,畫素電路PX可以用第4B圖的畫素電路400來實現。畫素電路400包含一或多個開關電晶體Ms與亮度決定電路450,其中亮度決定電路450包含驅動電晶體Md、儲存電容Cs與有機發光二極體Ld。驅動電晶體Md的第一端用於接收工作電壓VDD,其第二端耦接於有機發光二極體Ld的陽極端,其控制端則耦接於開關電晶體Ms與儲存電容Cs。開關電晶體Ms用於依據控制訊號Sc選擇性地導通或關斷以將資料電壓Vdata寫入儲存電容Cs。有機發光二極體Ld的陰極端耦接於第一觸控電極110_1~110_5中的對應一者或第二觸控電極120_1~120_4中的對應一者,以接收工作電壓VSS。為簡潔起見,在第4B圖中分別以標號110與120表示第一觸控電極110_1~110_5的其中之一與第二觸控電極120_1~120_4的其中之一。For example, in some embodiments, the pixel circuit PX may be implemented by the
在另一些實施例中,畫素電路400亦可以改為以有機發光二極體Ld的陽極端耦接於第一觸控電極110_1~110_5中的對應一者或第二觸控電極120_1~120_4中的對應一者,以接收工作電壓VDD。在此情況下,有機發光二極體Ld的陰極端耦接於驅動電晶體Md的第一端,且驅動電晶體Md的第二端是用於接收工作電壓VSS。In other embodiments, the
請同時參考第1圖和第5圖。第5圖為第1圖中區域160放大後的示意圖。由第5圖可知,訊號傳輸圖案150包含多個訊號傳輸線510a和510b。訊號傳輸線510a和510b與第二電極塊122(以及第一電極塊112和連接圖案124)設置於不同層,因而各自透過貫孔520耦接於第二電極塊122。在一些實施例中,訊號傳輸線510a和510b各自設置於對應的兩行畫素電路PX之間,而且不重疊於畫素電路PX於Z軸方向上的投影。在另一些實施例中,訊號傳輸線510a和510b不會設置於相同的兩行畫素電路PX之間,且彼此之間至少間隔一行畫素電路PX。值得注意的是,第5圖中訊號傳輸線的數量僅為示範性的實施例,訊號傳輸圖案150可以依據實際設計需求包含一或多個訊號傳輸線。Please refer to Figure 1 and Figure 5 at the same time. Figure 5 is an enlarged schematic view of
前述第二電極塊122與訊號傳輸圖案150之間的耦接方式,亦適用於第一電極塊112與訊號傳輸圖案150之間的耦接方式,為簡潔起見,在此不重複贅述。The foregoing coupling manner between the
第6圖為電子裝置100接收到觸控輸入時的波形示意圖。為方便說明,第6圖中僅繪示了部分的觸控電極。在本實施例中,觸控輸入由接近電子裝置100的觸控筆610所產生。觸控筆610在第二觸控電極120_1上移動,且由接近於第一觸控電極110_1的位置移動往接近於第一觸控電極110_2的另一位置。FIG. 6 is a schematic diagram of waveforms when the
在觸控筆610較接近於第一觸控電極110_1的情況下,當控制電路130依序傳送掃描訊號Tx1和Tx2至第一觸控電極110_1和110_2時,控制電路130會依序接收到感測訊號Rx1具有較高強度的脈波和較低強度的脈波。另一方面,在觸控筆610較接近於第一觸控電極110_2的情況下,當控制電路130再次依序傳送掃描訊號Tx1和Tx2至第一觸控電極110_1和110_2時,控制電路130會依序接收到感測訊號Rx1具有較低強度的脈波和較高強度的脈波。因此,控制電路130能依據感測訊號Rx1的波形精確判斷觸控筆610的移動軌跡。In the case that the
由上述可知,電子裝置100的優點之一,是克服了傳統具有矩陣排列的多個矩形觸控電極的內嵌式觸控顯示器不適用觸控筆的問題。電子裝置100另一優點,是大幅減少了觸控電極至控制電路130的訊號傳輸圖案150數量,因而有助於簡化觸控晶片之設計,且有助於降低觸控電極之間的短路風險而提升產品可靠度。It can be seen from the above that one of the advantages of the
在說明書及申請專利範圍中使用了某些詞彙來指稱特定的元件。然而,所屬技術領域中具有通常知識者應可理解,同樣的元件可能會用不同的名詞來稱呼。說明書及申請專利範圍並不以名稱的差異做為區分元件的方式,而是以元件在功能上的差異來做為區分的基準。在說明書及申請專利範圍所提及的「包含」為開放式的用語,故應解釋成「包含但不限定於」。另外,「耦接」在此包含任何直接及間接的連接手段。因此,若文中描述第一元件耦接於第二元件,則代表第一元件可通過電性連接或無線傳輸、光學傳輸等信號連接方式而直接地連接於第二元件,或者通過其他元件或連接手段間接地電性或信號連接至該第二元件。In the specification and the scope of the patent application, certain words are used to refer to specific elements. However, a person with ordinary knowledge in the relevant technical field should understand that the same element may be called by different terms. The specification and the scope of patent application do not use differences in names as a way to distinguish components, but use differences in functions of components as a basis for distinction. The "including" mentioned in the specification and the scope of the patent application is an open term, so it should be interpreted as "including but not limited to". In addition, "coupling" here includes any direct and indirect connection means. Therefore, if it is described in the text that the first element is coupled to the second element, it means that the first element can be directly connected to the second element through electrical connection, wireless transmission, optical transmission, or other signal connection methods, or through other elements or connections. The means is indirectly connected to the second element electrically or signally.
圖示的某些元件的尺寸及相對大小會被加以放大,或者某些元件的形狀會被簡化,以便能更清楚地表達實施例的內容。因此,除非申請人有特別指明,圖示中各元件的形狀、尺寸、相對大小及相對位置等僅是便於說明,而不應被用來限縮本揭示文件的專利範圍。此外,本揭示文件可用許多不同的形式來體現,在解釋本揭示文件時,不應侷限於本說明書所提出的實施例態樣。The size and relative size of some elements in the illustration will be enlarged, or the shape of some elements will be simplified, so as to more clearly express the content of the embodiment. Therefore, unless otherwise specified by the applicant, the shape, size, relative size, and relative position of each element in the figure are only for convenience of description, and should not be used to limit the patent scope of this disclosure. In addition, the present disclosure can be embodied in many different forms, and when interpreting the present disclosure, it should not be limited to the embodiments presented in this specification.
另外,除非說明書中特別指明,否則任何單數格的用語都同時包含複數格的涵義。In addition, unless otherwise specified in the specification, any term in the singular case also includes the meaning of the plural case.
以上僅為本揭示文件的較佳實施例,凡依本揭示文件請求項所做的均等變化與修飾,皆應屬本揭示文件的涵蓋範圍。The above are only preferred embodiments of the present disclosure, and all equal changes and modifications made in accordance with the requirements of the present disclosure should fall within the scope of the disclosure.
100:電子裝置
110_1~110_5:第一觸控電極
112:第一電極塊
114:橋接圖案
120_1~120_4:第二觸控電極
122:第二電極塊
124:連接圖案
130:控制電路
140:區域
150:訊號傳輸圖案
160:區域
AA:主動區
PA:周邊區
X,Y,Z:座標軸
Tx1~Tx5:掃描訊號
Rx1~Rx4:感測訊號
SB:基板
210:第一突出部
220:第二突出部
230a,230b:橋接線
240:貫孔
PX:畫素電路
A-A’:剖線
300:畫素電路
310:下玻璃基板
320:絕緣層
330:薄膜電晶體層
340:液晶層
350:上玻璃基板
360:亮度決定電路
Ms:開關電晶體
Cs:儲存電容
Clc:液晶電容
Vdata:資料電壓
400:畫素電路
410:下基板
420:薄膜電晶體層
430:絕緣層
440:上基板
450:亮度決定電路
Md:驅動電晶體
Ld:有機發光二極體
VDD,VSS:工作電壓
510a,510b:訊號傳輸線
520:貫孔
610:觸控筆
100: electronic device
110_1~110_5: the first touch electrode
112: The first electrode block
114: Bridge pattern
120_1~120_4: the second touch electrode
122: second electrode block
124: Connection pattern
130: control circuit
140: area
150: Signal transmission pattern
160: area
AA: active area
PA: Peripheral area
X, Y, Z: coordinate axis
Tx1~Tx5: Scan signal
Rx1~Rx4: sense signal
SB: Substrate
210: The first protrusion
220:
第1圖為依據本揭示文件一實施例的電子裝置簡化後的功能方塊圖。 第2圖為第1圖的部分放大示意圖。 第3A圖為沿第2圖中剖線A-A’於一實施例中簡化後的剖面示意圖。 第3B圖為依據本揭示文件一實施例的畫素電路的示意圖。 第4A圖為沿第2圖中剖線A-A’於另一實施例中簡化後的剖面示意圖。 第4B圖為依據本揭示文件一實施例的畫素電路的示意圖。 第5圖為第1圖的部分放大示意圖。 第6圖為第1圖的電子裝置接收到觸控輸入時的波形示意圖。 FIG. 1 is a simplified functional block diagram of an electronic device according to an embodiment of the present disclosure. Figure 2 is a partially enlarged schematic diagram of Figure 1. Figure 3A is a simplified cross-sectional view taken along the section line A-A' in Figure 2 in an embodiment. FIG. 3B is a schematic diagram of a pixel circuit according to an embodiment of the present disclosure. Figure 4A is a simplified cross-sectional view taken along the line A-A' in Figure 2 in another embodiment. FIG. 4B is a schematic diagram of a pixel circuit according to an embodiment of the present disclosure. Figure 5 is a partially enlarged schematic diagram of Figure 1. FIG. 6 is a schematic diagram of waveforms when the electronic device of FIG. 1 receives a touch input.
100:電子裝置 100: electronic device
110_1~110_5:第一觸控電極 110_1~110_5: the first touch electrode
112:第一電極塊 112: The first electrode block
114:橋接圖案 114: Bridge pattern
120_1~120_4:第二觸控電極 120_1~120_4: the second touch electrode
122:第二電極塊 122: second electrode block
124:連接圖案 124: Connection pattern
130:控制電路 130: control circuit
140:區域 140: area
150:訊號傳輸圖案 150: Signal transmission pattern
160:區域 160: area
AA:主動區 AA: active area
PA:周邊區 PA: Peripheral area
X,Y,Z:座標軸 X, Y, Z: coordinate axis
Tx1~Tx5:掃描訊號 Tx1~Tx5: Scan signal
Rx1~Rx4:感測訊號 Rx1~Rx4: sense signal
SB:基板 SB: Substrate
Claims (12)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI765405B (en) * | 2020-11-09 | 2022-05-21 | 大陸商宸鴻科技(廈門)有限公司 | Electronic device with touch sensing function |
US11416106B2 (en) | 2020-12-15 | 2022-08-16 | Tpk Touch Solutions (Xiamen) Inc. | Electronic device with touch sensing function and electrode structure for touch sensing |
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2020
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI765405B (en) * | 2020-11-09 | 2022-05-21 | 大陸商宸鴻科技(廈門)有限公司 | Electronic device with touch sensing function |
US11416106B2 (en) | 2020-12-15 | 2022-08-16 | Tpk Touch Solutions (Xiamen) Inc. | Electronic device with touch sensing function and electrode structure for touch sensing |
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