TWM606879U - Modular combination of endoscope light source and image capturing module - Google Patents

Abstract

A modular combination of an endoscope light source and an image capturing module includes: a circuit board with a lower plate and a raised platform, the bottom of the lower plate has a plurality of bottom electrode sheets, and the raised platform is located on the lower plate The top surface has a predetermined height, the top of the raised platform is provided with a plurality of light source electrode sheets, and the plurality of light source electrode sheets are electrically connected to the plurality of bottom electrode sheets by a plurality of wires passing through the raised platform and the lower plate; The diode chips are all covered with a phosphor glue and fixed on the top surface of the elevated platform; an image capturing module with a plurality of contacts at the bottom connected to the plurality of top electrode plates on the top surface of the lower plate, and the The top of the imaging module is higher than the top of the plurality of light-emitting diode chips; and a fixing glue is cured and attached to the imaging module, the elevated stage and the phosphor glue.

Description

Modular combination of endoscope light source and imaging module

This creation is related to endoscopes, especially a modular combination of endoscope light source and imaging module.

At present, in the field of endoscopes, a metal tube is usually used at the end of the endoscope, and a combination of an image capturing module and a light source is installed in the metal tube. Since the image sensor (usually a CCD charge-coupled device) and the lens group are combined to form an imaging module, the light-emitting diode (i.e., light source) is a light-emitting diode chip, fluorescent The glue and the substrate are combined into a finished product separately. Therefore, in assembly, the imaging module is usually mounted on a circuit board, and then the light-emitting diode is mounted on another circuit board, and then assembled , And finally installed in the metal tube at the end of the endoscope.

In order to solve the above problems, the applicant in this case applied for the ROC No. M601086 "Endoscopic Photography and Light Source Structure" patent. The technical focus of this case is to install the imaging module and the light-emitting diode chip on a circuit board. , And use fluorescent powder glue to combine all the components and fix them together to form an integral structure, thereby reducing the installation process in the metal tube of the endoscope, and also achieving a small overall structure Effect. However, in actual use of this case, it was found that due to the relative relationship between the light source and the imaging module, the light emitted by the light source would have shadows on the shape of the illuminated area (that is, the light shape), that is, the light shape was different. Therefore, the height of the light source must be increased to be close to the front end of the image capturing module in order to eliminate shadows and obtain a better light shape, and it also has the effect of increasing brightness. However, this will involve the problem of how to raise the light source and connect it to the circuit board below.

US Patent No. 9,572,482 discloses an endoscope using a flexible circuit board. The light source is designed to be closer to the head end of the imaging module. However, it mainly uses a U-shaped base frame 20 (base mounting frame) is used as a plastic base, and then a flexible circuit board 30 is placed on the base frame to present a U-shaped structure, and finally the imaging module is placed on the bottom of the U-shaped structure. Although this method achieves the effect of bringing the light source closer to the head of the imaging module, there is no lower circuit board. The main function of the lower circuit board is to provide contacts on its bottom surface to electrically connect other components. In this way, other components such as the main body of the endoscope or the operating handle can be electrically connected to achieve the function of operation or control. Therefore, the US Patent No. 9,572,482 does not disclose the technology for overcoming this problem. In addition, when the flexible circuit board and the rigid base frame are formed in a consistent manner to be combined, there are still problems that must be shaped first and assembly is difficult.

The main purpose of this creation is to provide a modular combination of endoscope light source and imaging module. In addition to integrating the circuit board, light source and imaging module into one module, it can also integrate the light source from the circuit board. It is raised and closer to the top of the image capturing module, and can be electrically connected to the contacts on the bottom of the circuit board below.

Based on the above objectives, this creation proposes a modular combination of an endoscope light source and an image capturing module, which includes: a circuit board with a lower plate and a raised platform, the bottom surface of the lower plate has a plurality of bottom electrode plates, and The top surface of the lower plate defines a main element area and a plateau area that do not overlap each other. The bumper is located on the top surface of the lower plate and is located in the plateau area and has a predetermined height. The top surface of the lower plate has A plurality of top electrode sheets are located in the main element area, the plurality of top electrode sheets are electrically connected to the plurality of bottom electrode sheets, the top of the raised platform is provided with a plurality of light source electrode sheets, and the plurality of light source electrode sheets are passed through by a plurality of wires The elevated platform and the lower plate are electrically connected to the plurality of bottom electrode plates; a plurality of light-emitting diode chips are directly or indirectly arranged on the top surface of the elevated platform and are electrically connected to the plurality of light source electrode plates, and each The light-emitting diode chip is covered with a phosphor glue and fixed on the top surface of the elevated platform; an image capturing module has an image sensor and a lens group located above the image sensor, and the image sensor The bottom of the detector is provided with a plurality of contacts connected to the plurality of top electrode plates, the imaging module is cylindrical and located in the main element area, and the imaging module is separated from the elevated platform by a predetermined distance, the lens The top of the group is higher than the top of the plurality of light-emitting diode chips; and a fixing glue is cured and attached to the imaging module and the elevated platform, and covers the phosphors on each of the light-emitting diode chips Glue, the fixing glue fixes the spatial relationship between the imaging module, the elevated platform and the plurality of light-emitting diode chips.

With the above structure, this creation is to use the fixing glue to integrate the circuit board, the light source and the image capturing module into one module. In addition, in this creation, the plural light-emitting diode chips are raised from the lower plate and closer to the top of the image capturing module, and the plural light-emitting diode chips can be combined with the bottom electrode at the bottom of the circuit board. The chips are electrically connected to facilitate assembly and connection with other components.

In order to explain in detail the technical features of this creation, the following preferred embodiments are given in conjunction with the diagrams described below, among which:

As shown in Figures 1 to 5, a preferred embodiment of the present creation proposes a modular combination 10 of an endoscope light source and an imaging module, which is mainly composed of a circuit board 11, a plurality of light-emitting diode chips 21, a The image capturing module 31 and a fixing glue 41 are composed of:

The circuit board 11 has a bottom plate 12 and a raised platform 14. The bottom surface of the bottom plate 12 has a plurality of bottom electrode sheets 121, and the top surface of the bottom plate 12 defines a main component area 12A and a The elevated platform 12B, the elevated platform 14 is located on the top surface of the lower plate 12 and is located in the elevated platform area 12B and has a predetermined height. The top surface of the lower plate 12 has a plurality of top electrode sheets 122 and is located in the main element area 12A. A plurality of top electrode sheets 122 are electrically connected to the plurality of bottom electrode sheets 121, a plurality of light source electrode sheets 141 are provided on the top of the raised platform 14, and the plurality of light source electrode sheets 141 pass through the raised platform 14 and the The lower plate 12 is electrically connected to the plurality of bottom electrode sheets 121. In this embodiment, the lower plate 12 is a rigid circuit board that cannot be bent.

In the first embodiment, the plateau area 12B is located on one side of the main device area 12A, and the other side relative to the main device area 12A further includes another plateau area 12B on the other plateau area 12B. There is another elevated platform 15 inside. The top of the other elevated platform 15 is provided with a plurality of light source electrode sheets 151. The plurality of light source electrode sheets 151 are passed through the other elevated platform 15 and the lower plate 12 by a plurality of wires 149 It is electrically connected to the plurality of bottom electrode sheets 121. In actual implementation, the elevated platform 14 or the other elevated platform 15 can be constructed by stacking one or more layers of rigid circuit boards depending on its thickness to form a structure that is electrically conductive up and down according to requirements. The aforementioned plural wires 149 pass through the actual implementation structure of the elevated platform 14. In addition, since the lower plate 12 itself is a rigid circuit board, it is a very well-known technology that the wires inside it can form the electrodes on the top and bottom surfaces. Therefore, in this case, the wires of the lower plate 12 are no longer used. The representation on the diagram, so as to avoid the diagram line is too complicated.

In addition, in practice, the lower plate 12, the elevated platform 14 and the other elevated platform 15 can be an integrated ceramic substrate, or an integrated three-dimensional circuit board, or a combination of multiple rigid circuit boards. It is formed, and the electrode sheets are combined between each circuit board through surface adhesion technology or welding technology. That is, the joining technology between the lower plate 12 and the elevated platform 14 and the other elevated platform 15 can be combined separately, or can be integrally formed.

The plurality of light-emitting diode chips 21 are arranged on the top surface of the elevated platform 14 and electrically connected to the plurality of light source electrode sheets 141, and each of the light-emitting diode chips 21 is covered by a phosphor glue 22 and fixed to the On the top surface of the elevated platform 14, in addition, the plurality of light-emitting diode chips 21 are also arranged on the top of the other elevated platform 15 and are electrically connected to the plurality of light source electrode sheets 151 on the other elevated platform 15.

The image capturing module 31 has an image sensor 32 and a lens group 34 located above the image sensor 32, and the bottom of the image sensor 32 has a plurality of contacts 321 connected to the plurality of top electrode sheets 122 In practice, welding can be used to connect. The image capturing module 31 is cylindrical as a whole and is located in the main element area 12A, and the image capturing module 31 is separated from the elevated platform 14 by a predetermined distance. The top end of the lens group 34 is higher than the plurality of light emitting diodes. The top of the pole body chip 21. In actual implementation, the top surface of the plurality of light-emitting diode chips 21 is higher than one-half of the height of the imaging module 31, preferably higher than two-thirds of the height of the imaging module 31. The closer to the top of the image capturing module 31 is better.

The fixing glue 41 is cured and attached to the imaging module 31 and the elevated platform 14, and covers the phosphor glue 22 on each of the light-emitting diode chips 21, and the fixing glue 41 fixes the imaging The spatial relationship between the module 31, the elevated platform 14 and the plurality of LED chips 21. The fixing glue 41 may be transparent, or may be a material that is not completely transparent but can transmit light.

As shown in FIG. 2, a transparent protective layer 42 can be further provided on the top surface of the fixing glue 41 as required. The material can use a known resin material as the transparent protective layer 42 to further fix the glue. Glue 41 provides additional protection. However, if the whole of the creation is set in the metal tube at the end of the inner view lens and there are other protection mechanisms, the transparent protective layer 42 may not be provided. That is, this creation does not limit the scope of the patent by setting the transparent protective layer 42. The structure of the transparent protective layer 42 is not shown in FIG. 1, but only the figure number 42 and the fixing glue 41 are shown together to prevent the lines from being too confusing.

The above is the structure of the first embodiment, and in actual installation, because the fixing glue 41 fixes the image capturing module 31, the space relationship between the raised platform 14 and the plurality of light emitting diode chips 21 Therefore, the whole is formed as a modular component, which can be conveniently assembled in the metal tube 99 at the end of the inner view lens as shown in Figure 5, and can be used as a single component, using the bottom surface of the lower plate 12 The plurality of bottom electrode sheets 121 are electrically connected with other components (such as the endoscope main body or the operating handle) through a circuit (not shown in the figure). For the convenience of presentation, the lower plate 12 is shown as a circle in FIG. 5 to make the whole conform to the actual installation state. In addition, this creation also achieves the result that the light source (ie, the plurality of light-emitting diode chips 21) is raised from the circuit board 11 and is closer to the top of the imaging module 31, and can be in contact with the bottom surface of the circuit board 11. The plurality of bottom electrode sheets 121 are electrically connected for other components to connect and control.

As shown in FIGS. 6 to 8, the second preferred embodiment of the present creation proposes a modular combination 10' of an endoscope light source and image capturing module, which is mainly the same as the first embodiment disclosed above, with the difference Lies in:

In the second embodiment, two light-emitting diode substrates 18' are further included. In actual implementation, a ceramic substrate is selected. The plurality of light-emitting diode chips 21' are disposed on the two light-emitting diode substrates 18'. The two light-emitting diode substrates 18' are respectively disposed on the top surfaces of the elevated platform 14' and the other elevated platform 15' to be electrically connected to the plurality of light source electrode sheets 141', 151', and the plurality of light-emitting diodes The bulk chip 21' is thus electrically connected to the plurality of light source electrode plates 141', 151', and each of the phosphor glue 22' covering each of the light-emitting diode chips 21' is fixed to each of the light-emitting diodes The top surface of the bulk substrate 18', and each of the light-emitting diode chips 21' is indirectly disposed on the top surface of the elevated platform 14' and the other elevated platform 15'.

The two light-emitting diode substrates 18' used in the second embodiment provide the effect of additionally heightening the plurality of light-emitting diode chips 21', and the use of ceramic substrates can facilitate chip-size packaging ( Chip Scale Package, CSP) process the multiple light-emitting diode chips 21' on the two light-emitting diode substrates 18', and pre-cover each of the phosphor glue 22' to facilitate subsequent contact with the pad The process of assembling the high platform 14'.

The rest of the structure and achievable effects of the second embodiment are all the same as those of the first embodiment disclosed above, and will not be repeated here.

As shown in Fig. 9, the third preferred embodiment of the present creation proposes a modular combination 10'’ of an endoscope light source and an imaging module, which is basically the same as the second embodiment disclosed above, with the difference:

There is only one elevated platform 14" without the aforementioned other elevated platform, and the elevated platform 14" is surrounded by a hollow ring column outside the main element area 12A", that is, it also surrounds the The peripheral side of the image capturing module 31", and the elevated platform area 12B" is equivalent to the area covered by the elevated platform 14", and it also surrounds the outside of the main element area 12A".

In the third embodiment, the elevated stage 14" is different from the previous second embodiment in form, and the surrounding manner can facilitate the arrangement of the plurality of light-emitting diode chips 21" in a surrounding manner, thereby The light source can be made more uniform, and the top surface of the elevated platform 14" also has a larger setting surface for setting more light-emitting diode chips 21" than in the foregoing second embodiment.

The rest of the structure and the achievable effects of the third embodiment are the same as those of the second embodiment disclosed above, and will not be repeated here.

10: Modular combination of endoscope light source and imaging module 11: circuit board 12: Lower plate 121: bottom electrode sheet 122: top electrode sheet 12A: Main component area 12B: High Terrace 14: Raised platform 141: Light source electrode sheet 149: Wire 15: Another elevated platform 151: Light source electrode sheet 21: LED chip 22: Fluorescent powder glue 31: Acquisition module 32: image sensor 321: Contact 34: lens group 41: fixed glue 42: Transparent protective layer 99: metal pipe body 10’: Modular combination of endoscope light source and imaging module 14’: Raised platform 141’: Light source electrode sheet 15’: Another elevated platform 151’: Light source electrode sheet 18’: Light-emitting diode substrate 21’: LED chip 22’: Fluorescent powder glue 10’’: Modular combination of endoscope light source and imaging module 12A’’: Main component area 12B’’: Gaotai District 14’’: Elevated Platform 21’’: LED chip 31’’: Image capture module

FIG. 1 is a combined perspective view of the first preferred embodiment of the invention, in which the fixing glue and the phosphor glue are shown in a transparent state. Figure 2 is a front view of the first preferred embodiment of this creation. 3 is a perspective view of partial components of the first preferred embodiment of the invention, showing the state after removing the fixing glue and the phosphor glue. Figure 4 is an exploded view of Figure 3. Figure 5 is an assembly diagram of the first preferred embodiment of the present creation. FIG. 6 is a combined perspective view of the second preferred embodiment of the invention, in which the fixing glue and the phosphor glue are shown in a transparent state. FIG. 7 is a perspective view of partial components of the second preferred embodiment of the invention, showing the state after the fixing glue and the phosphor glue are removed. Figure 8 is an exploded view of Figure 7. Figure 9 is a top view of the third preferred embodiment of the present creation.

11: circuit board

12: Lower plate

121: bottom electrode sheet

122: top electrode sheet

12A: Main component area

12B: High Terrace

14: Raised platform

141: Light source electrode sheet

149: Wire

15: Another elevated platform

151: Light source electrode sheet

21: LED chip

31: Acquisition module

32: image sensor

34: lens group

Claims (9)

A modular combination of an endoscope light source and image capturing module, including: A circuit board has a lower plate and a raised platform. The bottom surface of the lower plate has a plurality of bottom electrode plates, and the top surface of the lower plate defines a main component area and a raised platform area that do not overlap with each other. The raised platform is Located on the top surface of the lower plate in the high platform area and having a predetermined height, the top surface of the lower plate has a plurality of top electrode plates and is located in the main element area, and the plurality of top electrode plates are electrically connected to the plurality of bottom electrode plates A plurality of light source electrode sheets are provided on the top of the raised platform, and the plurality of light source electrode sheets are electrically connected to the plurality of bottom electrode sheets by passing a plurality of wires through the raised platform and the lower plate; A plurality of light-emitting diode chips are directly or indirectly arranged on the top surface of the elevated platform and electrically connected to the plurality of light source electrode sheets, and each of the light-emitting diode chips is covered by a phosphor glue and fixed on the elevated platform Top surface An image capturing module has an image sensor and a lens group located above the image sensor, and the bottom of the image sensor has a plurality of contacts connected to the plurality of top electrode sheets, the entire image capturing module It is columnar and is located in the main element area, and the imaging module is separated from the elevated platform by a predetermined distance, and the top of the lens group is higher than the top of the plurality of light-emitting diode chips; and A fixing glue is cured and attached to the imaging module and the elevated platform, and covers the phosphor glue on each of the light-emitting diode chips, and the fixing glue fixes the imaging module and the elevated platform The spatial relationship with the plurality of light-emitting diode chips. According to the modular combination of the endoscope light source and the imaging module according to claim 1, wherein: the lower plate is a rigid circuit board that cannot be bent. The modular combination of the light source of the endoscope and the imaging module according to claim 1, wherein: the top surface of the plurality of light-emitting diodes is higher than half the height of the imaging module. The modular combination of the endoscope light source and the imaging module according to claim 1, wherein: the top surface of the plurality of light-emitting diodes is higher than two-thirds of the height of the imaging module. According to the modular combination of the endoscope light source and the image capturing module according to claim 1, wherein: a transparent protective layer is further provided on the top surface of the fixing glue. According to the modular combination of the light source of the endoscope and the imaging module according to claim 1, wherein: the elevated platform is in the shape of a hollow ring column, and surrounds the outside of the main element area. The modular combination of the endoscope light source and the imaging module according to claim 1, wherein: the plateau area is located on one side of the main element area, and the other side relative to the main element area further includes In another elevated platform area, another elevated platform is arranged in the other elevated platform, and a plurality of light source electrode sheets are arranged on the top of the other elevated platform, and the plurality of light source electrode sheets pass through the other elevated platform through a plurality of wires And the lower plate is electrically connected to the plurality of bottom electrode sheets, and the plurality of light-emitting diode chips are arranged on the raised stage and the top of the other raised stage, and are electrically connected with the plurality of light source electrode sheets. The modular combination of an endoscope light source and an imaging module according to claim 1, wherein: it further comprises a light emitting diode substrate, and the plurality of light emitting diode chips are arranged on the light emitting diode substrate, The light-emitting diode substrate is disposed on the top surface of the elevated platform and is electrically connected to the plurality of light source electrode sheets, and the plurality of light-emitting diode chips are thereby electrically connected to the plurality of light source electrode sheets to cover each of the light-emitting diodes. Each of the phosphor glue of the diode chip is fixed on the top surface of the light emitting diode substrate, and each of the light emitting diode chips is indirectly arranged on the top surface of the elevated platform. The modular combination of the endoscope light source and the imaging module according to claim 8, wherein: the plateau area is located on one side of the main element area, and the other side relative to the main element area further includes In another elevated platform area, another elevated platform is arranged in the other elevated platform, and a plurality of light source electrode sheets are arranged on the top of the other elevated platform, and the plurality of light source electrode sheets pass through the other elevated platform through a plurality of wires And the lower plate is electrically connected to the plurality of bottom electrode sheets, and the plurality of light-emitting diode substrates are arranged on the raised stage and the top of the other raised stage, and are electrically connected with the plurality of light source electrode sheets.

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