TWM605882U - Gas/liquid phase flow heat exchange unit - Google Patents
Gas/liquid phase flow heat exchange unit Download PDFInfo
- Publication number
- TWM605882U TWM605882U TW109212717U TW109212717U TWM605882U TW M605882 U TWM605882 U TW M605882U TW 109212717 U TW109212717 U TW 109212717U TW 109212717 U TW109212717 U TW 109212717U TW M605882 U TWM605882 U TW M605882U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat exchange
- gas
- liquid
- outlet
- exchange unit
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一種氣液相流熱交換單元,係包含一第一蓋體,具有一第一側、一第二側、一蒸汽出口及一液體入口,該蒸汽出口及該液體入口連通該第一、二側;一第二蓋體,具有一第三側、一第四側,該第一、二蓋體對應蓋合並共同界定一熱交換空間,該熱交換空間內設有一工作流體及一分流單元,該分流單元係用以將該熱交換空間區隔為一蒸發區及一回水區,該蒸發區對應該蒸汽出口,該回水區對應該液體入口;藉此透過汽液循環原理取代傳統馬達作為工作流體之驅動源,進而縮小整體之體積,並減少設計及製造成本。A gas-liquid-flow heat exchange unit includes a first cover with a first side, a second side, a steam outlet, and a liquid inlet. The steam outlet and the liquid inlet communicate with the first and second sides ; A second cover with a third side and a fourth side, the first and second covers corresponding to the cover and jointly define a heat exchange space, the heat exchange space is provided with a working fluid and a shunt unit, the The splitter unit is used to divide the heat exchange space into an evaporation zone and a return water zone. The evaporation zone corresponds to the steam outlet and the backwater zone corresponds to the liquid inlet; thereby replacing the traditional motor as the principle of vapor-liquid circulation The driving source of the working fluid reduces the overall volume and reduces design and manufacturing costs.
Description
本創作係有關於熱交換單元及其熱交換模組,特別指一種氣液相流熱交換單元。This creation is about the heat exchange unit and its heat exchange module, especially a gas-liquid flow heat exchange unit.
按,由於計算技術的演進,各種電子裝置或電腦設備的內部的電子元件在運作時都會產生相當高的溫度,而高溫容易造成元件的損壞。因此,散熱機制便是維持這些電子元件正常運作相當重要且必須的設計。一般的散熱設計除了以風扇提供氣流作對流冷卻,或是以特殊材質的散熱裝置進行貼附而產生傳導降溫之外,水冷式機制亦是一種有效而常見的散熱設計。 水冷式散熱系統的原理簡單來說,一般是以液體(例如水或冷卻劑)作為散熱媒介,並利用一個持續運作的泵浦在水冷系統內形成不斷的循環。液體在密閉的管道內流動,而這些管道則分佈至系統內的各電子元件(例如中央處理單元)的表面上。當溫度相對較低的液體流經這些溫度相對較高的電子元件時,便會吸收其熱量以減緩其溫度的升高。接著,再隨著管路對外界或其他散熱機制進行熱交換來釋放熱量以降低液體的溫度,並再使液體重新回到系統內進行循環與散熱。然而,水冷式散熱系統必須設置泵浦,否則無法驅動液體循環流動,由於泵浦馬達具有一定體積,一般電子裝置或電腦設備的機體內部空間有限,難以設置水冷式散熱系統。此外,泵浦馬達在運轉過程也會產生熱量,故需另外設計泵浦馬達的散熱機制,一般是以水冷式散熱系統內部的液體對泵浦馬達進行散熱,另外,水冷裝置必須慎防漏水問題,一旦發生漏水將造成電子設備內部電子元件損毀。 因此,水冷式散熱系統在內部空間越來越小的電子裝置內的設計及製造成本越來越高,解決上述問題係為本領域研究人員所要努力的方向。 By the way, due to the evolution of computing technology, the internal electronic components of various electronic devices or computer equipment will generate a relatively high temperature during operation, and the high temperature is likely to cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design to maintain the normal operation of these electronic components. In addition to general heat dissipation design using fans to provide airflow for convection cooling, or attaching heat dissipation devices of special materials to conduct conduction cooling, water-cooling mechanisms are also an effective and common heat dissipation design. In simple terms, the principle of water-cooled heat dissipation system is generally to use liquid (such as water or coolant) as the heat dissipation medium, and use a continuously operating pump to form a continuous circulation in the water-cooling system. The liquid flows in closed pipes, and these pipes are distributed to the surface of the various electronic components in the system (such as the central processing unit). When the relatively low temperature liquid flows through these relatively high temperature electronic components, it will absorb its heat to slow down its temperature rise. Then, as the pipeline exchanges heat with the outside or other heat dissipation mechanisms to release heat to reduce the temperature of the liquid, the liquid is returned to the system for circulation and heat dissipation. However, the water-cooled heat dissipation system must be equipped with a pump, otherwise it cannot drive the liquid to circulate. Because the pump motor has a certain volume, the internal space of the body of general electronic devices or computer equipment is limited, and it is difficult to install a water-cooled heat dissipation system. In addition, the pump motor will also generate heat during operation, so it is necessary to design the heat dissipation mechanism of the pump motor. Generally, the liquid in the water cooling system is used to dissipate the pump motor. In addition, the water cooling device must be careful to prevent water leakage. , Once water leakage occurs, the internal electronic components of the electronic equipment will be damaged. Therefore, the design and manufacturing costs of water-cooled heat dissipation systems in electronic devices with smaller and smaller internal spaces are getting higher and higher. Solving the above-mentioned problems is the direction that researchers in the field should strive for.
本創作之一目的係為省略馬達的設置,縮小熱交換單元及散熱裝置的體積以便安裝在電子裝置內,同時降低設計及製造成本。 為達成上述之目的,本創作提供一種氣液相流熱交換單元,係包含:一第一蓋體,具有一第一側、一第二側、一蒸汽出口及一液體入口,該蒸汽出口及該液體入口分隔設置並連通該第一、二側;一第二蓋體,具有一第三側、一第四側,該第一、二蓋體對應蓋合並共同界定一熱交換空間設有一工作流體;及一分流單元,設於前述熱交換空間內並將該熱交換空間分隔為一蒸發區及一回水區,該蒸發區對應該蒸汽出口,該回水區對應該液體入口。 為達成上述之目的,本創作另外提供一種氣液相流熱交換裝置,係包含:一氣液相流熱交換單元,包含:一第一蓋體,具有一第一側、一第二側、一蒸汽出口及一液體入口,該蒸汽出口及該液體入口分隔設置並連通該第一、二側;一第二蓋體,具有一第三側、一第四側,該第一、二蓋體對應蓋合並共同界定一熱交換空間,該熱交換空間其內設有一工作流體及一分流單元,且該熱交換空間被所述之分流單元分隔為一蒸發區及一回水區,該蒸發區對應該蒸汽出口,該回水區對應該液體入口;及一散熱裝置,具有一散熱裝置出口及一散熱裝置入口,透過一第一管體連通該蒸汽出口及該散熱裝置入口,透過一第二管體連通該液體入口及該散熱裝置出口。 藉由本創作此設計,不需設置馬達,仍然能使工作流體驅動及循環,可以達到縮小熱交換單元及熱交換模組的體積,並減少設計及製造成本。 One purpose of this creation is to omit the installation of the motor, reduce the volume of the heat exchange unit and the heat dissipation device for installation in the electronic device, and reduce the design and manufacturing costs. In order to achieve the above objective, the present invention provides a vapor-liquid flow heat exchange unit, which includes: a first cover with a first side, a second side, a steam outlet and a liquid inlet, the steam outlet and The liquid inlet is arranged separately and communicates with the first and second sides; a second cover body has a third side and a fourth side; the first and second cover bodies correspond to the covers and jointly define a heat exchange space with a working Fluid; and a flow dividing unit arranged in the aforementioned heat exchange space and divide the heat exchange space into an evaporation zone and a backwater zone, the evaporation zone corresponds to the steam outlet, and the backwater zone corresponds to the liquid inlet. In order to achieve the above-mentioned purpose, the present invention additionally provides a vapor-liquid flow heat exchange device, which includes: a vapor-liquid flow heat exchange unit, including: a first cover having a first side, a second side, and a A steam outlet and a liquid inlet, the steam outlet and the liquid inlet are arranged separately and communicate with the first and second sides; a second cover has a third side and a fourth side, the first and second covers correspond to The cover merges and jointly defines a heat exchange space, the heat exchange space is provided with a working fluid and a branch unit, and the heat exchange space is divided into an evaporation zone and a return water zone by the branch unit, and the evaporation zone is opposite to Should the steam outlet, the backwater area corresponds to the liquid inlet; and a heat dissipation device with a heat dissipation device outlet and a heat dissipation device inlet, connected to the steam outlet and the heat dissipation device inlet through a first pipe body, through a second pipe The body communicates with the liquid inlet and the outlet of the heat sink. With this design, no motor is required, and the working fluid can still be driven and circulated, so that the volume of the heat exchange unit and the heat exchange module can be reduced, and the design and manufacturing costs can be reduced.
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。
請參考第1、2及3圖,係為本創作氣液相流熱交換單元之第一實施例之立體分解圖及立體組合圖及第2圖A-A線剖視圖,如圖所示,本創作所述氣液相流熱交換單元1係包含一第一蓋體11、一第二蓋體12、一分流單元13、一第一接頭14及一第二接頭15,於具體實施中,所述氣液相流熱交換單元1係用於貼設於一發熱元件(未繪示)上。
該第一蓋體11具有一第一側111、一第二側112、一蒸汽出口113及一液體入口114,該第一、二側111、112分設於該第一蓋體11上、下兩側,該蒸汽出口113及該液體入口114分隔設置並連通該第一、二側111、112。
該第二蓋體12具有一第三側121及一第四側122,該第三、四側121、122分設於該第二蓋體12上、下兩側,將上述之該第一、二蓋體11、12對應蓋合可共同界定一設有一工作流體17之熱交換空間16。
該分流單元13設於前述熱交換空間16內並將該熱交換空間16分(區)隔 為一蒸發區161及一回水區162,該蒸發區161係對應該蒸汽出口113,該回水區162則對應該液體入口114,該工作流體17在該蒸發區161蒸發後從該蒸氣出口113流出,該工作流體17於外界冷凝後從該液體入口114再流入該回水區162,並使該工作流體17從該回水區162回流到該蒸發區161。
本創作中該分流單元13係可為一毛細結構,用以分隔該蒸汽出口113及該液體入口114,該毛細結構可加速冷凝後的工作流體回流至該蒸發區161,並令該第二蓋體12的第四側122貼設於發熱元件時,可使該工作流體17受熱蒸發,由於該蒸發區161及該回水區162被該分流單元13分隔,故可防止蒸發後的工作流體17堵塞該液體入口114或往該液體入口114倒流。
該第一接頭14係接合該第一蓋體11或與該第一蓋體11一體成形,該第一接頭14具有一第一出口141、一第一入口142及一出氣腔室143,該第一出、入口141、142分別連通該出氣腔室143,該第一入口142對應連通該蒸汽出口131。在一替代實施例中,該第一接頭14還具有一除氣填水口(未繪示)連通該出氣腔室143,該除氣填水口係用以填入可進行氣液相變化的工作流體17,以及用以抽除該氣液相流熱交換單元1內部的非凝結氣體,在除氣填水結束後對該除氣填水口進行密封,所述工作流體17係例如為純水、甲醇等。
該第二接頭15係接合該第一蓋體11或與該第一蓋體11一體成形,該第二接頭15具有一第二出口151、一第二入口152及一回水腔室153,該第二出、入口151、152分別連通該回水腔室153,該第二出口151對應連通該液體入口114。
在一替代實施例中,所述的氣液相流熱交換單元1係可省略不設置該第一、二接頭14、15,而將管體直接接合在該第一蓋體11的蒸汽出口113及該液體入口114。
藉由本創作此設計,該蒸發區161的工作流體17受熱蒸發後(第3圖中的空心箭頭),該第一蓋體11具有聚集蒸汽的效果,因為蒸發後的工作流體17會往壓力較小的位置推動,故蒸發後的工作流體17會往該第一接頭14的出氣腔室143推動,並從該第一出口141流出,相反地,冷凝後的工作流體17受到蒸發後的工作流體17不斷推動,便會從該第二接頭15的第二入口152流入該集水腔室153,並流入該回水區162,故不需設置馬達則仍然能驅動工作流體驅動及循環,可以達到縮小熱交換單元的體積,並減少設計及製造成本。
請參閱第4圖,係為本創作氣液相流熱交換單元之第二實施例之立體分解圖,並輔以參閱第1、2、3圖,如圖所示,本實施例部分結構及功能係與上述第一實施例相同,故在此將不再贅述,惟本實施例與上述第一實施例之不同處係為,該毛細結構對應該蒸汽出口113開設一蒸汽空間136,該蒸汽空間136連通該蒸汽出口113及該蒸發區161。
藉此,令蒸發後的工作流體17可快速向該蒸汽出口113垂直方向導出,減少蒸發後的工作流體17堵塞在該液體入口114的機率。
請參閱第5、6、7圖,係為本創作氣液相流熱交換單元之第三實施例之立體分解圖及立體分解圖另一視角及組合剖視圖,並輔以參閱第1、2、3圖,如圖所示,本實施例部分結構及功能係與上述第一實施例相同,故在此將不再贅述,惟本實施例該分流單元13係選擇一鰭片組導流件來做說明,該鰭片組導流件係具有一上側面131、一下側面132、複數通道133、複數鰭片134及至少一槽道135。
該等鰭片134具有兩呈垂直之側邊,並相鄰之兩鰭片134透過相鄰之兩側邊相互搭接或扣接形成該上、下側面131、132,兩相鄰鰭片134之間界定所述通道133,該上側面131對應該蒸汽出口113開設一開口137與該等通道133及該等鰭片134之間界定所述連通,該槽道135開設於該下側面132,並貫通該等鰭片134及該等通道133令該回水區162連通該蒸發區161。在本實施例中,該槽道135係表示為兩個槽道135,但並不侷限於此,在其他實施例中,該槽道135的數量也可以為一個或三個以上的槽道,藉由該槽道135冷凝後的工作流體17可快速且平均的流入該等通道133,且該等鰭片134可加快工作流體17的吸熱速度。
藉由該上側面131及該等鰭片134限定了該開口137的方向,使蒸發後的工作流體17可快速向該蒸汽出口113垂直方向導出,減少蒸發後的工作流體17堵塞在該液體入口114的機率(第8圖中的箭頭)。
在另一替代實施例,該第二蓋體12的第三側121設置有一毛細結構層123,該毛細結構層123係設置於該分流單元13及該第二蓋體12之間,該毛細結構層123可令冷凝後的工作流體17快速回流至該槽道135及該等通道133(如第9圖所示)。
在另一替代實施例,該分流單元13也可以改設置為一鰭柱導流件(如第10圖所示)具有一上板139、複數通道133及複數鰭柱138,該上板139延伸設有所述鰭柱138,該等鰭柱138之間界定所述通道133,該上板131開設一開口137與該等通道133及該等鰭柱138連通,並該等鰭柱138係直接成型魚上板139上,或透過複數連接體1381相互連接,該等通道133令該回水區162連通該蒸發區161。
請參閱第11圖,係為本創作氣液相流熱交換單元之第四實施例之立體分解圖,並輔以參閱第5至10圖,如圖所示,本實施例部分結構及功能係與上述第三實施例相同,故在此將不再贅述,惟本實施例與上述第三實施例之不同處係為,該等鰭片134對應該開口137開設一蒸汽空間136,該蒸汽空間136連通該等通道133及該開口137,該蒸汽空間136連通該蒸汽出口113及該蒸發區161。
請參閱第12、13、14及15圖,係為本創作氣液相流熱交換裝置之第五實施例之散熱裝置立體分解圖、散熱裝置立體組合圖、立體組合圖及局部剖示圖,並輔以參閱第1至12圖,如圖所示,本實施例氣液相流熱交換裝置具有一氣液相流熱交換單元1,該氣液相流熱交換單元1連接一散熱裝置2,該氣液相流熱交換單元1部分結構及功能係與上述第一、二實施例相同,故在此將不再贅述,惟本實施例與上述第一、二實施例之不同處係為,該散熱裝置2具有一散熱裝置出口201及一散熱裝置入口202,透過一第一管體3連通該蒸汽出口113及該散熱裝置入口202,透過一第二管體4連通該液體入口114及該散熱裝置出口201。
在本實施例中,該散熱裝置2包含一冷凝器21、一集氣接頭22及一集水接頭23。該冷凝器21具有複數散熱鰭片組211,該等散熱鰭片組211係分別呈堆疊間隔排列,並兩相鄰散熱鰭片組211之間並排設有複數管道212。該冷凝器21上側設有一上保護板213,該冷凝器21下側設有一下保護板214。
該集氣接頭22具有複數第一穿孔221及一集氣腔室222,該散熱裝置入口202及該等第一穿孔221分別連通該集氣腔室222,為便於理解,在第11圖中該集氣接頭22係以局部剖視表示。
該集水接頭23具有複數第二穿孔231及一集水腔室232,該散熱裝置出口201及該等第二穿孔231分別連通該集水腔室,為便於理解,在第9圖中該集水接頭22係以局部剖視表示,該等管道212一端插設該等第一穿孔221並連通該集氣腔室222,及該等管道212另一端插設該等第二穿孔231並連通該集水腔室232,該等管道212內部分別設有複數子通道215連通該集氣腔室222及該集水腔室232。
請參考第15圖表示工作流體的箭頭方向,該熱交換空間16內的工作流體吸收發熱源的熱量後蒸發,蒸發後的工作流體通過該第一蓋體11的蒸汽出口113,並經過該第一接頭14的液體入口142進入該出氣腔室143,然後從該第一出口141通過該第一管體3傳輸到該散熱裝置2。
蒸發後的工作流體通過該散熱裝置2的散熱裝置入口202進入該集氣接頭22的集氣腔室222,接著透過該等管道212將工作流體17傳輸到該集水接頭23。在工作流體17通過該等管道212的過程中,工作流體17的熱量被該等散熱鰭片211吸收並輻射到外界環境達到散熱降溫的效果,進而使工作流體17冷凝。冷凝後的工作流體17進入該集水接頭23的集水腔室232,接著從該散熱裝置出口201通過該第二管體4傳輸到該氣液相流熱交換單元1。
冷凝後的工作流體17通過該氣液相流熱交換單元1的第二接頭15的第二入口152進入該回水腔室153,接著通過該第二出口151及該第一蓋體111的液體入口114進入該熱交換空間16。藉此,透過工作流體蒸發及冷凝產生的高低壓差推動工作流體不斷循環。
以上已將本創作做一詳細說明,惟以上所述者,僅為本創作之一較佳實施例而已,當不能限定本創作實施之範圍。即凡依本創作申請範圍所作之均等變化與修飾等,皆應仍屬本創作之專利涵蓋範圍。
The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.
Please refer to Figures 1, 2 and 3, which are the three-dimensional exploded view and the three-dimensional assembly view of the first embodiment of the creative gas-liquid flow heat exchange unit, and the cross-sectional view along line AA in Figure 2. The gas-liquid flow
1:氣液相流熱交換單元 11:第一蓋體 111:第一側 112:第二側 113:蒸汽出口 114:液體入口 12:第二蓋體 121:第三側 122:第四側 123:毛細結構層 13:分流單元 31:上側面 132:下側面 133:第一通道 134:第一鰭片 135:槽道 136:蒸汽空間 137:開口 138:鰭柱 1381:連接體 139:上板 14:第一接頭 141:第一出口 142:第一入口 143:出氣腔室 15:第二接頭 151:第二出口 152:第二入口 153:回水腔室 16:熱交換空間 161:蒸發區 162:回水區 17:工作流體 2:散熱裝置 201:散熱裝置出口 202:散熱裝置入口 21:冷凝器 211:散熱鰭片組 212:管道 213:上保護板 214:下保護板 215:子通道 22:集氣接頭 221:第一穿孔 222:集氣腔室 23:集水接頭 231:第二穿孔 232:集水腔室 3:第一管體 4:第二管體 1: Gas-liquid flow heat exchange unit 11: The first cover 111: first side 112: second side 113: Steam outlet 114: Liquid inlet 12: The second cover 121: third side 122: fourth side 123: Capillary structure layer 13: Shunt unit 31: upper side 132: lower side 133: First channel 134: First Fin 135: Channel 136: Steam Space 137: open 138: Fin Post 1381: connector 139: upper plate 14: The first joint 141: First Exit 142: First Entrance 143: Exhaust Chamber 15: Second connector 151: Second Exit 152: Second Entrance 153: Backwater Chamber 16: heat exchange space 161: Evaporation Zone 162: Backwater Area 17: working fluid 2: heat sink 201: Heat sink outlet 202: Heat sink entrance 21: Condenser 211: cooling fin set 212: pipe 213: Upper protection board 214: Lower protection board 215: sub channel 22: Gas gathering connector 221: First Piercing 222: Gathering Chamber 23: Water collecting joint 231: Second Piercing 232: Collection chamber 3: The first tube body 4: The second tube body
下列圖式之目的在於使本創作能更容易被理解,於本文中會詳加描述該些圖式,並使其構成具體實施例的一部份。透過本文中之具體實施例並參考相對應的圖式,俾以詳細解說本創作之具體實施例,並用以闡述創作之作用原理。 第1圖係為本創作氣液相流熱交換單元之第一實施例之立體分解圖; 第2圖係為本創作氣液相流熱交換單元之第一實施例之立體組合圖; 第3圖係為本創作氣液相流熱交換單元之第2圖A-A線剖視圖; 第4圖係為本創作氣液相流熱交換單元之第二實施例之立體分解圖; 第5圖係為本創作氣液相流熱交換單元之第三實施例之立體分解圖; 第6圖係為本創作氣液相流熱交換單元之第三實施例之立體分解圖另一視角; 第7圖係為本創作氣液相流熱交換單元之第三實施例之組合剖示圖; 第8圖係為本創作氣液相流熱交換單元之第三實施例之局部剖示圖; 第9圖係為本創作氣液相流熱交換單元之第三實施例之替代實施例示意圖; 第10圖係為本創作氣液相流熱交換單元之第三實施例之替代實施例示意圖; 第11圖係為本創作氣液相流熱交換單元之第四實施例之立體分解圖; 第12圖係為本創作氣液相流熱交換單元之第五實施例之散熱裝置立體分解圖; 第13圖係為本創作氣液相流熱交換單元之第五實施例之散熱裝置立體組合圖; 第14圖係為本創作氣液相流熱交換單元之第五實施例之立體組合圖; 第15圖係為本創作氣液相流熱交換單元之第五實施例之局部剖示圖。 The purpose of the following figures is to make this creation easier to understand, and these figures will be described in detail in this article, and they will constitute a part of the specific embodiments. Through the specific embodiments in this article and refer to the corresponding drawings, to explain the specific embodiments of the creation in detail, and to explain the principle of the creation. Figure 1 is a three-dimensional exploded view of the first embodiment of the creative gas-liquid flow heat exchange unit; Figure 2 is a three-dimensional assembly diagram of the first embodiment of the creative gas-liquid flow heat exchange unit; Figure 3 is a cross-sectional view along line A-A of Figure 2 of this creative gas-liquid flow heat exchange unit; Figure 4 is a three-dimensional exploded view of the second embodiment of the creative gas-liquid flow heat exchange unit; Figure 5 is a three-dimensional exploded view of the third embodiment of the creative gas-liquid flow heat exchange unit; Figure 6 is another perspective view of the three-dimensional exploded view of the third embodiment of the creative gas-liquid flow heat exchange unit; Figure 7 is a combined cross-sectional view of the third embodiment of the creative gas-liquid flow heat exchange unit; Figure 8 is a partial cross-sectional view of the third embodiment of the creative gas-liquid flow heat exchange unit; Figure 9 is a schematic diagram of an alternative embodiment of the third embodiment of the creative gas-liquid flow heat exchange unit; Figure 10 is a schematic diagram of an alternative embodiment of the third embodiment of the creative gas-liquid flow heat exchange unit; Figure 11 is a three-dimensional exploded view of the fourth embodiment of the creative gas-liquid flow heat exchange unit; Figure 12 is a three-dimensional exploded view of the heat dissipation device of the fifth embodiment of the creative gas-liquid flow heat exchange unit; Figure 13 is a three-dimensional assembly diagram of the heat dissipation device of the fifth embodiment of the creation of the gas-liquid flow heat exchange unit; Figure 14 is a three-dimensional assembly diagram of the fifth embodiment of the creative gas-liquid flow heat exchange unit; Figure 15 is a partial cross-sectional view of the fifth embodiment of the creative gas-liquid flow heat exchange unit.
1:氣液相流熱交換單元 1: Gas-liquid flow heat exchange unit
11:第一蓋體 11: The first cover
111:第一側 111: first side
112:第二側 112: second side
113:蒸汽出口 113: Steam outlet
114:液體入口 114: Liquid inlet
12:第二蓋體 12: The second cover
121:第三側 121: third side
122:第四側 122: fourth side
13:分流單元 13: Shunt unit
14:第一接頭 14: The first joint
141:第一出口 141: First Exit
142:第一入口 142: First Entrance
15:第二接頭 15: Second connector
151:第二出口 151: Second Exit
152:第二入口 152: Second Entrance
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109212717U TWM605882U (en) | 2020-09-25 | 2020-09-25 | Gas/liquid phase flow heat exchange unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109212717U TWM605882U (en) | 2020-09-25 | 2020-09-25 | Gas/liquid phase flow heat exchange unit |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM605882U true TWM605882U (en) | 2020-12-21 |
Family
ID=74671465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109212717U TWM605882U (en) | 2020-09-25 | 2020-09-25 | Gas/liquid phase flow heat exchange unit |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM605882U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI804756B (en) * | 2020-09-25 | 2023-06-11 | 奇鋐科技股份有限公司 | Vapor-phase/liquid-phase fluid heat exchange unit |
-
2020
- 2020-09-25 TW TW109212717U patent/TWM605882U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI804756B (en) * | 2020-09-25 | 2023-06-11 | 奇鋐科技股份有限公司 | Vapor-phase/liquid-phase fluid heat exchange unit |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7568518B2 (en) | Heat sink | |
US20060021737A1 (en) | Liquid cooling device | |
JP2003243590A (en) | Loop thermosyphon using microchannel etched semiconductor as evaporator | |
TW201641910A (en) | Coolant type heat dissipation device | |
JP2022153211A (en) | liquid cooling radiator | |
US10634434B2 (en) | Arrangement for cooling a closed cabinet | |
TWM246988U (en) | Water-cooling apparatus for electronic devices | |
US20080185129A1 (en) | Integrated liquid cooling unit for computers | |
CN115900405A (en) | Asymmetric vein type fin microchannel condenser and multi-evaporator loop heat pipe | |
CN107062963B (en) | A kind of alternating expression micro-channel condenser for hair cell regeneration | |
TWM605882U (en) | Gas/liquid phase flow heat exchange unit | |
CN213073456U (en) | Gas-liquid phase flow heat exchange unit | |
TWM554979U (en) | Phase-change evaporator and phase-change heat dissipation device | |
US20170181319A1 (en) | Cooling apparatus | |
TWI804756B (en) | Vapor-phase/liquid-phase fluid heat exchange unit | |
CN110953914B (en) | Evaporator structure | |
CN112272488B (en) | Gas-liquid phase flow heat exchange unit | |
CN215529706U (en) | Heat sink device | |
CN115857644A (en) | Cold plate type heat dissipation device for server | |
TWI719884B (en) | Gravity-type high-efficiency heat-exchange device | |
US20120255708A1 (en) | Heat exchange apparatus | |
US20220128311A1 (en) | Vapor-phase/liquid-phase fluid heat exchange uni | |
US11555653B2 (en) | Vapor/liquid condensation system | |
TWI625834B (en) | Water-cooling radiator unit and water-cooling module using same | |
CN111366018A (en) | Heat radiation assembly for semiconductor refrigeration and semiconductor refrigeration equipment |