TWM602198U - Capillary structure of heat sink - Google Patents

Abstract

The capillary structure of a heat sink is arranged on the surface of the carrier, and includes The formed copper layer is formed by sintering the cuprous oxide powder around the pure copper powder, and the capillary gap includes a large gap and a small gap. The large gap relies on the particle size of the pure copper powder to be larger than that of the cuprous oxide powder. The particle size is such that the large gap is formed between the particles of the pure copper powder of the copper laminate. The small gap is formed between the particles of the cuprous oxide powder in the dispersion, and the particles of the dispersion of the cuprous oxide powder Scattered around the copper build-up layer, partially filled in the large gap of the capillary gap.

Description

Capillary structure of radiator

A capillary structure of a heat sink, especially a capillary structure that uses two different copper powders to be sintered on a carrier to form a heat sink with high porosity.

According to the existing radiator devices, such as uniform temperature plates, heat dissipation pipes, etc., in order to conduct heat, there are various designs for the capillary structure. At present, there are mainly four common capillary structures, namely the groove type and the mesh type ( Weaving), fiber type and sintered type, of which sintered type is the most common.

The capillary structure of the radiator is mostly made of copper powder. The porous structure formed by sintering copper powder. The particle size, particle size distribution, sintering furnace temperature and time of copper powder will affect the porosity of the sintered layer. A common method is to use a hole forming agent to mix copper powder to increase the porosity of the capillary structure, which is complicated to make and the porosity is not easy to control. Furthermore, taking the capillary structure of the micro heat pipe of sintered copper powder as an example, a center rod is placed in the center of the copper tube body, and the copper powder is poured into the copper tube body for high-temperature sintering, and the sintering is completed and then cooled , And then pull out the copper tube body to form a capillary structure on the wall of the copper tube body. This production method requires the copper powder to be sintered into a copper tube body in a partially dissolved state, and also to avoid low porosity and deformation of the copper tube body. In practice, the sintering time and temperature must be precisely controlled, which is too complicated for the production process And with difficulty.

The main purpose of this creation is to use copper powder with no copper particle size to produce a capillary structure with high porosity for the heat sink, improve the heat dissipation efficiency of the capillary structure of the heat sink, and the porosity of the capillary structure can be easily controlled.

The secondary purpose of this creation is to use the slurry made of copper powder to sinter the capillary structure of the radiator, simplify the process required for the capillary structure of the radiator before sintering, and make it convenient and effective.

In order to achieve the above purpose, the capillary structure of the heat sink in this creation uses two different copper powders to be sintered on a carrier to form a capillary structure with high porosity for the heat sink. The capillary structure contains copper formed by sintering pure copper powder. Laminated layer, a dispersion formed by sintering cuprous oxide powder around the pure copper powder, and capillary gaps. The capillary gaps include large gaps and small gaps. The large gaps rely on the particle size of pure copper powder to be larger than that of cuprous oxide powder , The large gap is formed between the particles of the pure copper powder of the copper laminate. The small gap is formed between the particles of the cuprous oxide powder in the dispersion body. The particles of the cuprous oxide powder in the dispersion body are scattered around the copper laminate layer and Partly filled in the large gap of the capillary gap.

In the aforementioned capillary structure of the heat sink, the cuprous oxide powder of the dispersion body and the pure copper powder of the copper laminate layer are uniformly mixed with the cuprous oxide powder and the pure copper powder with a coating agent before sintering to form an adhesive body.

In the aforementioned capillary structure of the heat sink, the adhesive is coated on the carrier and sintered, so that the coating agent of the adhesive is volatilized during the sintering process, thereby forming the capillary structure of the heat sink.

In the aforementioned capillary structure of the radiator, the coating agent is formed by mixing resin, solvent, dispersant and printing auxiliary agent.

10: Capillary structure of radiator

1: Pure copper powder

2: Cuprous oxide powder

3: Adhesive body

4: carrier

The first picture is a flowchart of the steps of this creation.

The second figure is a schematic diagram of the capillary structure of the heat sink taken by the SEM.

The third figure is a schematic diagram of the adhesive applied to the carrier of this creation.

Please refer to FIG. 2, the capillary structure 10 of the heat sink of the present invention is set on the surface of the carrier, and includes a copper buildup layer formed by sintering pure copper powder 1, and the sintered cuprous oxide powder 2 is formed around the pure copper powder 1. Dispersion body, and capillary gap, the capillary gap includes a large gap and a small gap, the large gap by virtue of the particle size of the pure copper powder 1 is greater than the particle size of the cuprous oxide powder 2, so that the copper layer of the pure copper powder 1 particles This large gap is formed between the particles of the cuprous oxide powder 2 of the dispersion body, and the particles of the cuprous oxide powder 2 of the dispersion body are scattered around the copper laminate and partially filled in the capillary gap. Within a large gap.

Please refer to Figures 1 to 3, the capillary structure 10 of the heat sink of the present invention is manufactured according to the following steps:

Step S10: The adhesive 3 is prepared, the cuprous oxide powder 2, the pure copper powder 1 and the coating agent are uniformly mixed, wherein the particle size of the cuprous oxide powder 2 is smaller than that of the pure copper powder 1, and the coating agent includes resin, Solvent, dispersant and printing aid.

Step S12: Coating, the adhesive 3 prepared in step S10 is set on the surface of the carrier 4 where the capillary structure 10 of the heat sink needs to be generated by coating, printing, etc.

Step S14: Sintering, sintering in protective atmosphere and reducing atmosphere for about 1 to 8 hours. The sintering time can be adjusted appropriately according to the area or thickness of the adherend 3 on the surface of the carrier 4, and the sintering temperature is about 650~850 degrees, the coating agent of the adhesive body 3 will evaporate during the sintering process, and the pure copper powder 1 will be sintered to form a copper layer with large gaps, and the cuprous oxide powder 2 will be sintered to form a spread around the pure copper powder 1. The particles of the cuprous oxide powder 2 of the dispersed body are scattered around the copper build-up layer, and partially filled in the large gap of the capillary gap.

10: Capillary structure of radiator

1: Pure copper powder

2: Cuprous oxide powder

Claims (4)

A capillary structure of a heat sink, especially a capillary structure that uses two different copper powders to sinter on a carrier to form a heat sink with high porosity. It is characterized in that the capillary structure of the heat sink is arranged on the surface of the carrier and contains The copper layer formed by the sintering of pure copper powder, the dispersion formed by the sintering of the cuprous oxide powder around the pure copper powder, and the capillary gap. The capillary gap includes a large gap and a small gap. The large gap relies on the particle size of the pure copper powder to be larger than the oxide The particle size of the cuprous powder makes this large gap formed between the particles of the pure copper powder of the copper laminate. The small gap is formed between the particles of the cuprous oxide powder in the dispersion body. The particles are scattered around the copper build-up layer and partially filled in the large gap of the capillary gap. The capillary structure of the radiator according to claim 1, wherein the cuprous oxide powder of the dispersion body and the pure copper powder of the copper laminate are uniformly mixed with the coating agent to form an adhesive before sintering body. The capillary structure of the heat sink according to claim 2, wherein the adhesive is coated on the carrier and sintered, so that the coating agent of the adhesive is volatilized during the sintering process, thereby forming the capillary structure of the heat sink. The capillary structure of the radiator according to claim 3, wherein the coating agent is formed by mixing resin, solvent, dispersant and printing auxiliary agent.

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