TWM600481U - Modular LED heating device - Google Patents
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- TWM600481U TWM600481U TW109205108U TW109205108U TWM600481U TW M600481 U TWM600481 U TW M600481U TW 109205108 U TW109205108 U TW 109205108U TW 109205108 U TW109205108 U TW 109205108U TW M600481 U TWM600481 U TW M600481U
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Abstract
一種模組式LED加熱裝置,包括在一散熱結構表面貼合設置一LED發熱模組,LED發熱模組包含有多數LED燈板,所述LED燈板之間以可替換方式相互拼接、模組成一體,LED燈板頂面設有多數LED,底面接觸散熱結構表面,散熱結構內部設有至少一可容納冷卻用液體或氣體的冷卻流道或空間;藉此,模組式LED加熱裝置能夠用來烘烤電路板、晶圓等電子製品,或以LED之紫外光對個人衛生用品等醫療用品(例如:口罩)進行殺菌;當LED發熱模組中的任何一LED燈板損壞時,可直接更換該損壞之LED燈板,其他未損壞之LED燈板仍可繼續使用,據以節省LED裝置之建置或維修成本。 A module type LED heating device includes an LED heating module attached to a surface of a heat dissipation structure. The LED heating module includes a plurality of LED light panels, and the LED light panels are spliced with each other in a replaceable manner. The LED lamp board is provided with a large number of LEDs on the top surface, the bottom surface is in contact with the surface of the heat dissipation structure, and the heat dissipation structure is provided with at least one cooling channel or space that can contain cooling liquid or gas; thereby, the modular LED heating device can Used to bake electronic products such as circuit boards and wafers, or sterilize medical supplies such as personal hygiene products (such as masks) with the ultraviolet light of LED; when any LED lamp board in the LED heating module is damaged, it can Directly replace the damaged LED light board, and other undamaged LED light boards can still be used, thereby saving the construction or maintenance cost of the LED device.
Description
本創作涉及一種模組式LED加熱裝置之散熱結構、LED發熱模組和LED燈板,係有關於可用來烘烤電路板、晶圓等電子製品的LED加熱裝置,能夠以模組方式拼組並藉此替換損壞部分的LED,且可防止因為冷卻用之液體蒸發、滲出而造成LED損壞,進而節省替換生產及維修等成本。 This creation relates to the heat dissipation structure, LED heating module and LED light board of a modular LED heating device. It is related to LED heating devices that can be used to bake circuit boards, wafers and other electronic products, which can be assembled in modules The damaged part of the LED is replaced by this, and the damage of the LED caused by the evaporation and seepage of the cooling liquid can be prevented, thereby saving the cost of replacement production and maintenance.
現有之LED技術,除了採用LED之發光特性來提供照明以外,亦可利用LED所發出之高溫來加熱、烘烤電子製品,例如:烘乾電路板上之油墨、晶圓加工前之預先加熱、面板之老化測試…等等。 Existing LED technology, in addition to using the light-emitting characteristics of LEDs to provide lighting, it can also use the high temperature emitted by LEDs to heat and bake electronic products, such as drying ink on circuit boards, pre-heating before wafer processing, Panel burn-in test...etc.
習知採用LED之加熱裝置,通常是在上述加熱、烘烤設備內部之一大面積的基板上密集佈設多數LED,藉此可同時均勻加熱、烘烤大量電子製品;然而,當其中若干LED損壞時,會造成LED加熱裝置之部分區域加熱溫度不平均的狀況,容易影響電子製品之加工良率,因此必須更新整套LED加熱裝置,導致LED加熱裝置之建購成本難以降低的情形。 In the conventional heating device using LEDs, a large number of LEDs are usually densely arranged on a large-area substrate inside the heating and baking equipment, so that a large number of electronic products can be uniformly heated and baked at the same time; however, when some of the LEDs are damaged At this time, it will cause uneven heating temperature in some areas of the LED heating device, which easily affects the processing yield of electronic products. Therefore, the entire set of LED heating devices must be updated, resulting in the situation that it is difficult to reduce the construction and purchase cost of the LED heating device.
此外,上述LED基板的背面一般會導入冷卻水,用以冷卻LED運作時產生的高溫,一般主要的做法是將LED基板組合於一冷卻水道上,並於LED基板與冷卻水道邊緣之間填充止水膠條;但由於在LED產生之高溫的長期影響下,該止水膠條容易老化、碎裂,導致冷卻水道中的水氣蒸發、滲出至LED基板周圍,造成LED加熱裝置因受潮而損壞。 In addition, cooling water is generally introduced to the back of the above-mentioned LED substrate to cool the high temperature generated during the operation of the LED. The general method is to combine the LED substrate on a cooling water channel and fill the gap between the LED substrate and the edge of the cooling water channel. Water glue strip; but due to the long-term influence of the high temperature generated by the LED, the water stop glue strip is easy to age and break, causing the water vapor in the cooling water channel to evaporate and seep around the LED substrate, causing the LED heating device to be damaged by moisture .
有鑑於此,本創作人乃累積多年相關領域的研究以及實務經驗,特創作出一種模組式LED加熱裝置,藉以改善上述習知技術的缺失。 In view of this, the author has accumulated many years of research and practical experience in related fields, and specially created a modular LED heating device to improve the lack of the above-mentioned conventional technology.
爰是,本創作之主要目的,在於提供一種模組式LED加熱裝置,包括在一散熱結構表面貼合設置一LED發熱模組,其中:該LED發熱模組包含有多數LED燈板,所述LED燈板之間以可替換方式相互拼接、模組成一體,該LED燈板頂面設有多數LED,該LED燈板底面接觸該散熱結構表面。 The main purpose of this creation is to provide a modular LED heating device, which includes an LED heating module attached to the surface of a heat dissipation structure, wherein: the LED heating module includes a plurality of LED light panels, The LED light boards are mutually spliced and molded into a whole in a replaceable manner, the top surface of the LED light board is provided with a plurality of LEDs, and the bottom surface of the LED light board contacts the surface of the heat dissipation structure.
依據前述裝置之結構特徵,當LED發熱模組中的任何一LED燈板或任何一顆LED損壞時,可直接更換該損壞之LED燈板,其他未損壞之LED燈板仍可繼續使用,據以節省LED發熱模組之建購成本,並藉此改善習知LED加熱裝置在若干LED損壞時必須整套更新而造成建購或維修成本難以降低的問題。 According to the structural features of the aforementioned device, when any LED lamp board or any LED in the LED heating module is damaged, the damaged LED lamp board can be directly replaced, and other undamaged LED lamp boards can still be used. In order to save the construction and purchase cost of the LED heating module, and to improve the problem that the conventional LED heating device must be updated when several LEDs are damaged, which causes the construction, purchase or maintenance cost to be difficult to reduce.
依據前述裝置之結構特徵,該散熱結構內部設有至少一可容納冷卻用液體或氣體的冷卻流道,該散熱結構外壁設有一連通該冷卻流道的輸入口及一連通該冷卻流道的輸出口;使用時,所述冷卻用液體或氣體係透過該散熱結構對該LED發熱模組產生降溫作用,由於該散熱結構1上下左右係為一封閉狀態之殼體,故所述冷卻用液體與LED發熱模組不會直接接觸,可藉此改善習知冷卻水道中的水氣容易蒸發、滲出而造成LED加熱裝置因受潮而損壞的問題。
According to the structural features of the aforementioned device, the heat dissipation structure is provided with at least one cooling flow channel capable of containing cooling liquid or gas, and the outer wall of the heat dissipation structure is provided with an input port communicating with the cooling flow channel and a cooling channel communicating with the cooling flow channel. Output port; when in use, the cooling liquid or gas system produces a cooling effect on the LED heating module through the heat dissipation structure. Since the
依據前述裝置之結構特徵,該輸入口和輸出口分別設在該散熱結構兩端,所述冷卻流道設為複數條。 According to the structural features of the aforementioned device, the input port and the output port are respectively arranged at both ends of the heat dissipation structure, and the cooling channels are set to be plural.
依據前述裝置之技術特徵,該LED燈板上設有多數穿孔,該 散熱結構表面設有多數螺孔,所述螺孔與螺孔之間螺組有一螺栓。 According to the technical features of the aforementioned device, the LED light board is provided with a plurality of perforations, the The surface of the heat dissipation structure is provided with a plurality of screw holes, and a bolt is set between the screw holes and the screw holes.
依據前述裝置之技術特徵,該LED發熱模組可設為一電子製品烘烤加熱模組、一個人衛生用品紫外光殺菌模組或一醫療用品紫外光殺菌模組。 According to the technical characteristics of the aforementioned device, the LED heating module can be set as an electronic product baking heating module, a personal hygiene product ultraviolet light sterilization module, or a medical product ultraviolet light sterilization module.
依據前述裝置之技術特徵,該散熱結構內部及/或外部位置設有至少一風扇;該風扇可設於散熱結構內部,亦可鄰近於該輸出口的位置或其他任何位置。 According to the technical features of the aforementioned device, at least one fan is arranged inside and/or outside the heat dissipation structure; the fan can be arranged inside the heat dissipation structure, or adjacent to the position of the output port or any other position.
依據前述裝置之技術特徵,該LED燈板各自以一電源線外接至電源。 According to the technical features of the aforementioned device, each of the LED light boards is connected to the power source via a power cord.
依據前述裝置之技術特徵,該LED燈板彼此電連接,並以一電源線外接至電源。 According to the technical features of the aforementioned device, the LED light boards are electrically connected to each other and connected to the power source by a power cord.
以上所述技術手段及其產生效能的具體實施細節,請參照下列實施例及圖式加以說明。 Please refer to the following embodiments and drawings for specific implementation details of the above-mentioned technical means and their production efficiency.
1:散熱結構 1: Heat dissipation structure
11:表面 11: surface
12:螺孔 12: screw hole
13、14:冷卻流道 13, 14: cooling runner
15:輸入口 15: Input port
16:輸出口 16: output port
17:風扇 17: Fan
2、2a、2b:LED發熱模組 2, 2a, 2b: LED heating module
21:LED燈板 21: LED light board
22:電源線 22: Power cord
23:LED 23: LED
24:穿孔 24: Piercing
25:螺栓 25: Bolt
3:電路板 3: circuit board
4:口罩 4: Mask
〔第一圖〕係本創作較佳實施例的立體示意圖。 [The first figure] is a three-dimensional schematic diagram of a preferred embodiment of this creation.
〔第二圖〕係第一圖之立體分解示意圖。 [The second figure] is a three-dimensional exploded schematic view of the first figure.
〔第三圖〕係第一圖之散熱結構立體剖面示意圖。 [Third Figure] is a schematic three-dimensional cross-sectional view of the heat dissipation structure in Figure 1.
〔第四圖〕係第一圖之使用狀態立體示意圖。 [Fourth figure] is a three-dimensional schematic diagram of the first figure in use.
〔第五圖〕係第一圖之另一使用狀態側視示意圖。 [Figure 5] is a schematic side view of another state of use of Figure 1.
〔第六圖〕係第一圖之又一使用狀態側視示意圖。 [Figure 6] is a schematic side view of another state of use of Figure 1.
請參閱第一和二圖所示,係本創作模組式LED加熱裝置之較佳實施方式,包括在一散熱結構1表面設置一LED發熱模組2。
Please refer to Figures 1 and 2, which is a preferred embodiment of the modular LED heating device of this invention, which includes an
在所採較佳的實施例中,該散熱結構1係設呈一上下左右呈封閉狀態之殼體,該LED發熱模組2設在該散熱結構1頂部表面11;該LED發熱模組2包含有多數LED燈板21,所述LED燈板21各自以一電源線22外接至電源,且所述LED燈板21之間係以可替換方式相互拼接、模組成一體。該LED燈板21頂面設有多數LED 23,所述LED 23利用電路相互串聯,該LED燈板21底面接觸該散熱結構1頂部表面11,且該LED燈板21上設有多數穿孔24,該散熱結構1頂部表面11設有多數螺孔12,所述螺孔12與螺孔12之間螺組有一螺栓25,令該LED燈板21透過螺栓25鎖固在該散熱結構1頂部表面11。
In the preferred embodiment, the
在另一可行的實施例中,可將所述LED燈板彼此電連接,並以一電源線外接至電源。 In another feasible embodiment, the LED light boards can be electrically connected to each other and connected to the power source with a power cord.
請參閱第三圖所示,該散熱結構1內部設有至少一可容納冷卻用液體或氣體的冷卻流道13、14,該散熱結構1外壁設有一連通該冷卻流道13、14的輸入口15及一連通該冷卻流道13、14的輸出口16,所述輸入口15和輸出口16分別設在該散熱結構1兩端;此外,本實施例所述冷卻流道13、14亦可設為複數條
Please refer to the third figure, the
使用時,該外部冷卻用液體或氣體可經由該輸入口15進入該冷卻流道13、14,令冷卻用液體或氣體同時沿著兩側的冷卻流道13、14導流至該輸出口16,期間所述冷卻用液體或氣體係透過該散熱結構1頂部表面11與該LED發熱模組2發生熱交換並產生降溫作用,由於該散熱結構1係為封閉狀態,故該冷卻用液體與LED發熱模組2不會直接接觸,因此可改善習知冷
卻水道中的水氣容易蒸發、滲出而造成LED加熱裝置受潮、損壞的問題,藉此得以大幅延長LED發熱模組的耐久使用壽命。
When in use, the external cooling liquid or gas can enter the
請參閱第四圖所示,值得一提的是,由於該LED發熱模組2係以多數LED燈板21採用模組化方式相互拼接,並構成一大面積密集佈設多數LED 23的加熱、烘烤面,因此當LED發熱模組2中的任何一LED燈板21或任何一顆LED 23損壞時,只需單獨拆卸該損壞之LED燈板21的螺栓25,即可直接更換該損壞之LED燈板21,可達成簡便地替換、更新任何一LED燈板21之功效,至於其他未損壞之LED燈板21仍可繼續使用。據此,可大幅節省LED發熱模組2之建購成本,並改善習知LED加熱裝置於若干LED損壞時必須整套更新,因而造成建購成本難以降低等問題。
Please refer to the fourth figure. It is worth mentioning that because the
請參閱第五圖所示,該LED發熱模組2a可設為一電子製品烘烤加熱模組,使用時可利用夾具、輸送帶(圖中未示)來移載電路板3、晶圓等電子製品通過該電子製品烘烤加熱模組上方,以接受該電子製品烘烤加熱模組所產生之高溫的加熱、烘烤。
Please refer to the fifth figure, the
請參閱第六圖所示,該LED發熱模組2b亦可設為一用於醫療用品或個人衛生用品之紫外光殺菌模組,本實施例可採用冷卻用氣體,所述冷卻用氣體可透過至少一風扇17驅動,該風扇17可設於散熱結構1內、外的任何位置;如圖所示,該風扇17可設於該散熱結構1內部鄰近該輸出口16的位置,以驅使外部空氣經由輸入口15進入該散熱結構1內部,並驅使空氣經由該輸出口16排出至散熱結構1以外,藉以冷卻散熱結構1和LED發熱模組2b。使用時可利用夾具、承架(圖中未示)來固定或承載個人衛生用品,例如:口罩4,或可應用於其他醫療用品等,將其設置於在該醫療用品紫外光殺菌
模組上方,以接受該紫外光殺菌模組所發出之紫外光照射及殺菌。
Please refer to Figure 6, the
綜上所陳,相信已詳加揭示本創作的技術結構及可供實施的利用性,但本創作之技術並不局限於此,舉凡依據上述以及後述申請專利範圍等內容而作出簡略修飾的等效技術,均應隸屬於本創作之應用範疇,併予陳明。 In summary, I believe that the technical structure of this creation and the usability that can be implemented have been disclosed in detail, but the technology of this creation is not limited to this. Anything that is briefly modified based on the above and the scope of patent applications described later. The effective technology should belong to the scope of application of this creation and be described.
1:散熱結構 1: Heat dissipation structure
15:輸入口 15: Input port
16:輸出口 16: output port
2:LED發熱模組 2: LED heating module
21:LED燈板 21: LED light board
22:電源線 22: Power cord
23:LED 23: LED
25:螺栓 25: Bolt
Claims (10)
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