TWM600308U - Blind hole de-foaming electroplating device - Google Patents
Blind hole de-foaming electroplating device Download PDFInfo
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- TWM600308U TWM600308U TW109204639U TW109204639U TWM600308U TW M600308 U TWM600308 U TW M600308U TW 109204639 U TW109204639 U TW 109204639U TW 109204639 U TW109204639 U TW 109204639U TW M600308 U TWM600308 U TW M600308U
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Abstract
本新型公開了一種盲孔除泡電鍍裝置,包括一電鍍槽,其中該電鍍槽包括第一槽體和第二槽體,其中該第一槽體和第二槽體通過第一氣動閥連通,其中該第一槽體內設有第一液位感測器,其中該第二槽體內設有第二液位感應器,該第一槽體與水平面呈6°設置,該第一槽體的開口向上設置,該第一槽體的開口上設有工作臺面,該工作臺面與水平面呈6°設置,該工作臺面用於放置需要電鍍的產品。其能夠滿足單面生產,同時能夠將氣泡除盡。The model discloses a blind hole defoaming electroplating device, which comprises an electroplating tank, wherein the electroplating tank includes a first tank body and a second tank body, wherein the first tank body and the second tank body are connected through a first pneumatic valve, Wherein the first tank is provided with a first liquid level sensor, wherein the second tank is provided with a second liquid level sensor, the first tank is arranged at 6° from the horizontal plane, and the opening of the first tank It is arranged upward, and the opening of the first tank body is provided with a work surface, the work surface is arranged at 6° from the horizontal plane, and the work surface is used for placing the products that need to be electroplated. It can meet single-sided production and can remove all bubbles at the same time.
Description
本新型涉及了電鍍領域,具體的是一種盲孔除泡電鍍裝置。The new type relates to the field of electroplating, in particular to a blind hole defoaming electroplating device.
在現有電鍍工藝中,一般採用水平式浸泡電鍍和水平式單面電鍍,水平式浸泡電鍍即採用水平流水線的方式,將生產板整體放入水平流水線內,通過電流傳導至板面,使得藥液內的銅離子附著在生產板上,形成所需要的銅。浸泡式水平電鍍需將整片產品都要浸泡到藥液中去且需要相應的夾具來滿足導電的需要,一旦產能需求增加,只能重新購買整條產線。In the existing electroplating process, horizontal immersion electroplating and horizontal single-sided electroplating are generally used. Horizontal immersion electroplating adopts a horizontal pipeline method. The production board is put into the horizontal pipeline and the current is conducted to the board surface to make the liquid The copper ions inside adhere to the production board to form the required copper. Immersion-type horizontal electroplating requires the entire product to be immersed in the chemical solution and corresponding fixtures are needed to meet the needs of electrical conductivity. Once the production demand increases, the entire production line can only be purchased.
水平式單面電鍍,即將生產板水平放置於工作臺面上,依靠板面導電層導通陰極接點,待藥水全部覆蓋滿生產板板面後,開啟整流器,使得藥液內的銅離子附著在生產板上,形成所需要的銅。水平 式單面電鍍無法有效排盡氣泡,使得氣泡集聚在產品面上,造成漏鍍孔破等功能性異常。Horizontal single-sided electroplating, that is, the production board is placed horizontally on the worktable, and the cathode contact is conducted by the conductive layer on the board surface. After the liquid is completely covered on the production board, the rectifier is turned on to make the copper ions in the liquid adhere to the production On the board, the required copper is formed. Horizontal single-sided electroplating cannot effectively exhaust bubbles, causing bubbles to accumulate on the product surface, causing functional abnormalities such as leaked plating holes.
為了克服現有技術中的缺陷,本新型實施例提供了一種盲孔除泡電鍍裝置,其能夠滿足單面生產,同時能夠將氣泡除盡。In order to overcome the defects in the prior art, the embodiment of the present invention provides a blind hole defoaming electroplating device, which can satisfy single-sided production and at the same time remove all bubbles.
為實現上述目的,本申請實施例公開了一種盲孔除泡電鍍裝置,包括:電鍍槽,該電鍍槽包括第一槽體和第二槽體,該第一槽體和第二槽體通過第一氣動閥連通,該第一槽體內設有第一液位感測器,該第二槽體內設有第二液位感應器,該第一槽體與水平面呈6°設置,該第一槽體的開口向上設置,該第一槽體的開口上設有工作臺面,該工作臺面與水平面呈6°設置,該工作臺面用於放置需要電鍍的產品;In order to achieve the above objective, an embodiment of the present application discloses a blind hole defoaming electroplating device, comprising: an electroplating tank including a first tank body and a second tank body, the first tank body and the second tank body pass through the A pneumatic valve is connected, the first tank is provided with a first liquid level sensor, the second tank is provided with a second liquid level sensor, the first tank is arranged at 6° from the horizontal plane, the first tank The opening of the body is set upward, and the opening of the first tank body is provided with a work surface, the work surface is set at 6° from the horizontal plane, and the work surface is used for placing products that need to be electroplated;
噴盤,該噴盤設置在該第一槽體內部,該噴盤能夠在該第一槽體內搖擺,該噴盤上設有若干個管道,該管道上均勻設有若干個噴嘴,該管道通過軟管接入藥水,該軟管上設有第一泵;The spray disc is arranged inside the first tank, the spray disc can swing in the first tank, the spray disc is provided with a number of pipes, the pipe is evenly provided with a number of nozzles, and the pipe passes The hose is connected to the medicine, and the hose is provided with a first pump;
固定機構,該固定機構設置在該工作臺面的上方,該固定機構包括氣缸、與氣缸傳動連接的蓋體,該蓋體與該工作臺面互相平行設置,汽缸蓋能夠帶動該蓋體沿垂直於該工作臺面的方向移動。A fixing mechanism, the fixing mechanism is arranged above the working table, the fixing mechanism includes a cylinder, and a cover connected to the cylinder in transmission. The cover and the working table are arranged parallel to each other, and the cylinder head can drive the cover to be perpendicular to the The direction of the work surface moves.
在本創作一較佳實施例中,該噴嘴為扇形近接式噴嘴。In a preferred embodiment of the invention, the nozzle is a fan-shaped proximity nozzle.
在本創作一較佳實施例中,該噴盤與擺動電機傳動連接,該擺動電機能夠帶動該噴盤在該第一槽體內擺動。In a preferred embodiment of the present invention, the spray plate is drivingly connected with a swing motor, and the swing motor can drive the spray plate to swing in the first tank.
在本創作一較佳實施例中,該盲孔除泡電鍍裝置還包括固定裝置,該固定裝置用於固定該固定機構,該固定裝置包括第一固定板,該第一固定板上設有與該蓋體形狀相同且開口朝下的容納腔,該氣缸穿設在該容納腔的壁面上,該氣缸的本體固定在該第一固定板上,該氣缸的活塞杆能夠在該容納腔的內部和下方運動,該活塞杆帶動蓋體運動到容納腔內時,該蓋體能夠收納在該容納腔內。In a preferred embodiment of the present invention, the blind hole defoaming electroplating device further includes a fixing device for fixing the fixing mechanism, the fixing device includes a first fixing plate, and the first fixing plate is provided with The cover has a housing cavity with the same shape and the opening facing downward, the cylinder penetrates the wall of the housing cavity, the body of the cylinder is fixed on the first fixing plate, and the piston rod of the cylinder can be inside the housing cavity When the piston rod drives the cover to move into the containing cavity, the cover can be contained in the containing cavity.
在本創作一較佳實施例中,該蓋體上垂直設有5個導柱,該導柱的一端固定在該蓋體上,該導柱另一端穿設在第一固定板上。In a preferred embodiment of the present invention, five guide posts are vertically arranged on the cover body, one end of the guide post is fixed on the cover body, and the other end of the guide post penetrates the first fixing plate.
在本創作一較佳實施例中,該工作臺面上設有防滑機構,該防滑機構設置在該工作臺面最低的一端,該防滑機構能夠防止產品從該工作臺面上滑落。In a preferred embodiment of the present invention, a non-slip mechanism is provided on the work surface, and the non-slip mechanism is arranged at the lowest end of the work surface, and the non-slip mechanism can prevent products from slipping off the work surface.
本新型的有益效果如下:The beneficial effects of the present invention are as follows:
1、本新型提供的盲孔除泡電鍍裝置能夠滿足單面生產,不需要將產品整片浸泡到藥液中;1. The blind hole defoaming electroplating device provided by the new model can meet single-sided production without the need to immerse the entire product in the liquid chemical;
2、本新型提供的盲孔除泡電鍍裝置使用設置在該工作臺面上的陰極銅塊進行導電;2. The blind hole defoaming electroplating device provided by the present invention uses the cathode copper block set on the work surface to conduct electricity;
3、本新型提供的盲孔除泡電鍍裝置能夠適應不同規格的產品,根據產品的變化設計不同的工作臺面;3. The blind hole defoaming electroplating device provided by the new model can adapt to products of different specifications, and design different work surfaces according to product changes;
4、第一槽體、工作臺面以及蓋體傾斜設置,能夠快速引導藥水流向第一槽體的底部,同時能夠使盲孔內的氣泡排出,將氣泡剝離產品表面;4. The first tank, the working table and the cover are arranged obliquely, which can quickly guide the liquid medicine to flow to the bottom of the first tank, and at the same time allow the bubbles in the blind holes to be discharged, and the bubbles can be peeled off the product surface;
5、噴盤在工作時搖擺運動,配合扇形噴嘴,能夠加快藥液的置換,同時能夠清除產品板面上的氣泡。5. The spray plate oscillates when it is working, and the fan nozzle can speed up the replacement of the liquid medicine, and at the same time can remove the air bubbles on the product surface.
為讓本新型的上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and understandable, the following is a detailed description of preferred embodiments in conjunction with the accompanying drawings.
下面將結合本新型實施例中的附圖,對本新型實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本新型一部分實施例,而不是全部的實施例。基於本新型中的實施例,本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例,都屬於本新型保護的範圍。The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
在本新型的描述中,需要說明的是,術語 “上”、“下”、“底”、“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本實用新型和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本新型的限制。此外,術語“第一”、“第二”等僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”等的特徵可以明示或隱含地包括一個或者更多個該特徵。In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of these features.
為達到上述目的,本新型提供一種盲孔除泡電鍍裝置,包括:In order to achieve the above objective, the present invention provides a blind hole defoaming electroplating device, which includes:
電鍍槽1,該電鍍槽1包括第一槽體11和第二槽體12,該第一槽體11和第二槽體12通過第一氣動閥連通,該第一槽體11內設有第一液位感測器,該第二槽體12內設有第二液位感應器,該第一槽體11與水平面呈6°設置,該第一槽體11的開口向上設置,該第一槽體11的開口上設有工作臺面111,該工作臺面111與水平面呈6°設置,該工作臺面111用於放置需要電鍍的產品5;The
噴盤2,該噴盤2設置在該第一槽體11內部,該噴盤2能夠在該第一槽體11內搖擺,該噴盤2上設有若干個管道21,該管道21上均勻設有若干個噴嘴22,該管道21通過軟管23接入藥水,所述軟管23上設有第一泵;
固定機構3,所述固定機構3設置在所述工作臺面111的上方,所述固定機構3包括氣缸31、與氣缸31傳動連接的蓋體32,所述蓋體32與所述工作臺面111互相平行設置,所述汽缸蓋能夠帶動所述蓋體32沿垂直於所述工作臺面111的方向移動。The
進一步的,所述噴嘴22為扇形近接式噴嘴,即流體通過該噴嘴後,呈現扇形形狀。Further, the
進一步的,所述噴盤2與擺動電機傳動連接,所述擺動電機能夠帶動所述噴盤2在所述第一槽體11內擺動。Further, the
進一步的,所述盲孔除泡電鍍裝置還包括固定裝置4,所述固定裝置4用於固定所述固定機構3,所述固定裝置4包括第一固定板41,所述第一固定板41上設有與所述蓋體32形狀相同且開口朝下的容納腔43,所述氣缸31穿設在所述容納腔43的壁面上,所述氣缸31的本體固定在所述第一固定板41上,所述氣缸31的活塞杆能夠在所述容納腔43的內部和下方運動,所述活塞杆帶動蓋體32運動到容納腔43內時,所述蓋體32能夠收納在所述容納腔43內。Further, the blind hole defoaming electroplating device further includes a
進一步的,所述蓋體32上垂直設有5個導柱33,所述導柱33的一端固定在所述蓋體32上,所述導柱33另一端穿設在第一固定板41上。Further, the
進一步的,所述工作臺面111上設有防滑機構112,所述防滑機構112設置在所述工作臺面111最低的一端,所述防滑機構112能夠防止產品5從所述工作臺面111上滑落。Further, a
在本實施例中,請參考圖1,所述盲孔電鍍裝置包括固定機構3、固定裝置4、電鍍槽1以及設置在所述電鍍槽1內的噴盤2。In this embodiment, referring to FIG. 1, the blind hole electroplating device includes a
所述電鍍槽1中的第二槽體12設置在所述第一槽體11的下方,所述第二槽體12和所述第一槽體11通過循環系統連接,所述第一槽體11內設有噴盤2,所述噴盤2與搖擺電機傳動連接,使得所述噴盤2能夠在所述第一槽體11內前後擺動。The
請參考圖4,所述第一槽體11的開口上設有工作臺面111,所述工作臺面111上設有防滑機構112,所述噴盤2上的噴嘴22能夠通過開口對所述工作臺面111上的產品5噴射藥液。所述工作臺面111上還設有陰極銅塊,所述產品5放置在所述工作臺面111上時,所述產品5能夠與陰極銅塊接觸。4, the opening of the
請參考圖5,所述噴盤2為長方形框架結構,所述噴盤2內均勻排列有9個管道21,9個所述管道21平行設置,所述管道21上部均勻設有若干個噴嘴22。扇形噴嘴22的噴射範圍大配合噴盤2擺動,能夠將所述產品5板面上的氣泡剝離。Please refer to FIG. 5, the
請參考圖6,所述固定機構3包括垂直於所述工作臺面111設置的氣缸31,氣缸31的活塞杆下端連接有蓋體32,所述蓋體32為長方體,所述蓋體32與所述工作臺面111平行,所述蓋體32能夠在所述氣缸31的帶動下壓蓋在所述工作臺面111上的產品5上。Please refer to FIG. 6, the
請參考圖2,所述固定裝置4包括安裝在固定架上的第一固定板41,所述第一固定板41上設有開口朝下的容納腔43,所述容納腔43能夠容納所述蓋體32,當所述蓋體32隨所述活塞杆向上移動的時候,所述蓋體32能夠收納在所述容納腔43內。Please refer to FIG. 2, the fixing
在本實施例中,還包括傳輸機構機械手。In this embodiment, it also includes a transmission mechanism manipulator.
藉由上述結構,啟動所述盲孔除泡電鍍裝置,此時所述蓋體32收納在所述容納腔43內,所述機械手將需要電鍍的產品5放置在所述工作臺面111上,所述產品5需要電鍍的一面朝下設置,所述防滑機構112能夠抵持所述產品5,是所述產品5需要電鍍的部位處於第一槽體11開口的上方,此時所述產品5與水平面呈6度角。With the above structure, the blind hole defoaming electroplating device is activated. At this time, the
所述產品5放置好後,所述蓋體32在所述氣缸31的帶動下向下移動,與所述產品5貼合將所述產品5壓制在所述工作臺面111上。After the
啟動泵浦,藥水在泵浦的作用下進入所述第一槽體11和所述第二槽體12,待第一液位感應器感應到所述第一槽體11內的液位到達工作液位,第二液位感應器感應到所述第二槽體12內的液位到達工作液位時,啟動整流器,噴盤2開始搖擺,第一泵向所述噴盤2的管道21內泵入藥液,噴嘴22向所述噴盤2噴射藥液,電鍍開始作業。Start the pump, and the medicine will enter the
待達到電鍍時間後,關閉整流器,關閉泵浦,關閉搖擺電機,同時打開第一氣動閥,將第一槽體11內的藥液回流到第二槽體12,待所述第一感應器感應到第一槽體11內的液面達到較低位置時,啟動所述氣缸31,所述氣缸31將蓋體32待會到所述容納腔43內,所述機械手取走完成電鍍的產品5。After the plating time is reached, turn off the rectifier, turn off the pump, turn off the swing motor, and open the first pneumatic valve at the same time to return the liquid medicine in the
上列詳細說明係針對本創作之一可行實施例之具體說明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,例如:等變化之等效性實施例,均應包含於本案之專利範圍中。The above detailed description is a specific description of a feasible embodiment of this creation, but this embodiment is not used to limit the scope of the creation of the patent. Any equivalent implementation or modification that does not deviate from the spirit of the creation technique, such as: other changes The equivalent embodiments should all be included in the patent scope of this case.
本新型中應用了具體實施例對本新型的原理及實施方式進行了闡述,以上實施例的說明只是用於幫助理解本新型的方法及其核心思想;同時,對於本領域的一般技術人員,依據本新型的思想,在具體實施方式及應用範圍上均會有改變之處,綜上所述,本說明書內容不應理解為對本新型的限制。This new model uses specific examples to illustrate the principles and implementation of the present model. The descriptions of the above examples are only used to help understand the method and core ideas of the present model; at the same time, for those skilled in the art, according to this The ideas of the new type will have changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as a limitation of the new type.
1:電鍍槽 11:第一槽體 111:工作臺面 112:防滑機構 12:第二槽體 2:噴盤 21:管道 22:噴嘴 23:軟管 3:固定機構 31:氣缸 32:蓋體 33:導柱 4:固定裝置 41:第一固定板 43:容納腔 5:產品 1: Electroplating tank 11: The first tank 111: work surface 112: Anti-slip mechanism 12: The second tank 2: spray pan 21: Pipeline 22: Nozzle 23: hose 3: fixed mechanism 31: Cylinder 32: Lid 33: guide post 4: Fixing device 41: The first fixed plate 43: receiving cavity 5: product
圖1是本新型實施例中盲孔除泡電鍍裝置的結構示意圖; 圖2是本新型實施例中盲孔除泡電鍍裝置的中電鍍槽、噴盤、固定機構以及固定裝置的放大圖; 圖3是本新型實施例中電鍍槽的結構示意圖; 圖4是本新型實施例中第一槽體和噴盤的結構示意圖; 圖5是本新型實施例中噴盤的結構示意圖;以及 圖6是本新型實施例中固定機構和電鍍槽的結構示意圖。 Figure 1 is a schematic structural view of a blind hole defoaming electroplating device in an embodiment of the present invention; 2 is an enlarged view of the middle electroplating tank, spray plate, fixing mechanism and fixing device of the blind hole defoaming electroplating device in the embodiment of the present invention; Figure 3 is a schematic view of the structure of the electroplating tank in the embodiment of the present invention; 4 is a schematic diagram of the structure of the first tank and the spray plate in the embodiment of the present invention; Figure 5 is a schematic diagram of the structure of the spray plate in the embodiment of the present invention; and Fig. 6 is a structural diagram of the fixing mechanism and the electroplating tank in the embodiment of the present invention.
1:電鍍槽 1: Electroplating tank
11:第一槽體 11: The first tank
12:第二槽體 12: The second tank
2:噴盤 2: spray pan
3:固定機構 3: fixed mechanism
31:氣缸 31: Cylinder
32:蓋體 32: Lid
4:固定裝置 4: Fixing device
41:第一固定板 41: The first fixed plate
43:容納腔 43: receiving cavity
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921202406.2U CN210765570U (en) | 2019-07-29 | 2019-07-29 | Blind hole bubble-removing electroplating device |
CN201921202406.2 | 2019-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM600308U true TWM600308U (en) | 2020-08-21 |
Family
ID=71063254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109204639U TWM600308U (en) | 2019-07-29 | 2020-04-20 | Blind hole de-foaming electroplating device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN210765570U (en) |
TW (1) | TWM600308U (en) |
-
2019
- 2019-07-29 CN CN201921202406.2U patent/CN210765570U/en active Active
-
2020
- 2020-04-20 TW TW109204639U patent/TWM600308U/en unknown
Also Published As
Publication number | Publication date |
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CN210765570U (en) | 2020-06-16 |
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