TWM599984U - Mini light emitting diode (Mini LED) backlight module - Google Patents

Abstract

This creation provides a sub-millimeter light emitting diode (Mini LED) backlight module, which includes a direct-down light source and a light guide plate. The direct type light source has a substrate and a plurality of sub-millimeter light emitting diodes arranged on the substrate at intervals. The light guide plate is arranged above the direct-type light source and has a light-emitting surface and a light-incident surface disposed oppositely. The light-incident surface forms a plurality of light supply spaces relative to the direct-type light source for accommodating and receiving sub-millimeter light-emitting diodes. Light emitted by millimeter light-emitting diodes. According to this, the light from the sub-millimeter light-emitting diode can have sufficient light spreading space when it enters the light guide plate, effectively avoiding the lack of uneven brightness and darkness caused by the generation of light packets, thereby improving the light output efficiency of the light guide plate .

Description

Sub-millimeter light emitting diode (Mini LED) backlight module

This creation is related to the field of backlight modules, especially a sub-millimeter light emitting diode (Mini LED) backlight module.

The backlight module is intended to be used in various electronic display devices as an optical product that provides a light source to facilitate the display of pictures. With its excellent light guiding performance that can transform the light source into a uniform surface light, it has indeed become a display today. An indispensable component of the device.

The types of light sources used in backlight modules have gradually evolved from the early cold cathode tubes to light-emitting diodes (LEDs) with more excellent intensity, color rendering and adjustability to improve the efficiency of light. And with the growth of light-emitting diode technology, micro-light-emitting diodes (Micro LED) and sub-millimeter light-emitting diodes (Mini LED) have gradually become product categories that manufacturers are committed to developing and using, especially sub-millimeter light-emitting diodes. , As a relay product between mature light-emitting diodes and micro-light-emitting diodes, it has color saturation, reaction speed and smaller volume that surpass mature light-emitting diodes, and is compared with micro-light-emitting diodes It is also easier to manufacture, so it has gradually become the light source choice for display devices.

For display devices, the color and contrast of the screen are important considerations in product development. Based on this, how to make the backlight module used with sub-millimeter light-emitting diodes provide a more uniform surface with sufficient brightness The light source is an important factor in design. In view of this, the creator has gathered many years of rich experience in related industries and conceived and proposed a sub-millimeter light-emitting diode backlight module to provide more excellent optical products.

One purpose of this creation is to provide a sub-millimeter light-emitting diode backlight module, which allows the light of the sub-millimeter light-emitting diode to enter the light guide plate with sufficient light spreading space to diverge, and avoid the occurrence of such Problems such as bright package make the light from the light guide plate have better uniformity and brightness, which can improve the light supply efficiency of the direct-lit backlight module.

In order to achieve the above objective, this creation discloses in one embodiment a sub-millimeter light-emitting diode (Mini LED) backlight module, which includes: a straight-down light source with a substrate and multiple millimeter light-emitting diodes. The millimeter light emitting diode system is arranged at intervals on the substrate; and a light guide plate is arranged above the direct light source, the light guide plate has a light exit surface and a light entrance surface, and the light entrance surface and the light exit surface are arranged opposite to each other, And the light incident surface forms a plurality of light supply spaces relative to the direct light source for accommodating the sub-millimeter light-emitting diodes and receiving the light emitted by the sub-millimeter light-emitting diodes. In this way, sufficient light spreading space for sub-millimeter light-emitting diodes can be provided during application, avoiding uneven light output from the light guide plate, and greatly improving the light output efficiency of the backlight module.

，任二相鄰之該等V型溝槽之間距為a+2b

，據此係以具備較佳之入光調整效能。 In one embodiment, it is disclosed that the light supply spaces are respectively formed by a V-shaped groove frame, and when the width of the sub-millimeter light emitting diode is a and the height is b, the V-shaped grooves When the angle of the inclined plane is 2θ, the depth of the V-shaped grooves is

, The distance between any two adjacent V-shaped grooves is a+2b

According to this, it has better light-incidence adjustment performance.

In the next embodiment, the width a of the sub-millimeter light emitting diode is 0.11 to 0.24 mm, so as to have a better light supply efficiency.

In one embodiment, it is revealed that the height b of the sub-millimeter light-emitting diodes is 0.1 to 0.2 mm, and the height b of the sub-millimeter light-emitting diodes can be 0.15 mm, so as to meet the requirements of the thin structure .

In addition, in another embodiment, it is disclosed that the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5, or 0.7 mm, which is suitable for various needs.

In another embodiment, the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped groove accommodates the sub-millimeter light emitting Diode.

In yet another embodiment, it is disclosed that the light supply spaces are respectively formed by a trapezoidal groove frame, and when the width of the sub-millimeter light emitting diode is a and the height is b, the trapezoidal grooves The width of the bottom surface of the groove is at least 1.3a, and the depth of these trapezoidal grooves is at least 1.3b. Here, another groove shape and its corresponding rule limit are disclosed to provide sub-millimeter light emitting diodes. The exhibition light space.

Under the aforementioned structure state, further, in another embodiment, it is disclosed that the distance between any two adjacent trapezoidal grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each trapezoidal The grooves contain the sub-millimeter light-emitting diode.

In addition, in view of light adjustment requirements, in one embodiment, the depth of the trapezoidal grooves can be 1.3b-2.5b.

In another embodiment, it is disclosed that the light-incident surface has a plurality of supporting portions, and the supporting portions are arranged to protrude from the light-incident surface and arranged at intervals, so that the light-supplying spaces are separated from the light-incident surface. It is sandwiched and formed with the supporting parts, so that the light-supply space can be formed by supporting the light guide plate so that the light from the sub-millimeter light-emitting diode incident on the light-incident surface has enough light-spreading space to diverge.

Furthermore, in one embodiment, the width of the sub-millimeter light-emitting diodes can be 0.11 to 0.24 mm, so as to have better light supply efficiency.

In yet another embodiment, it is disclosed that the protruding length of the supporting parts is 0.1-0.3 mm, so that the backlight module has an excellent light spreading effect as a whole and can meet the requirements of thinning.

In order to facilitate the assembly, in one embodiment, the side of the supporting portions connected to the light incident surface is a flat surface to provide a more stable assembly state.

In addition, in one embodiment, it is disclosed that the distance between the supporting parts is 0.7-0.9 mm, so as to provide enough space for the arrangement and light spreading of the sub-millimeter light-emitting diodes.

In addition, in order to improve the scattering and fogging effect of light, in one embodiment, the light incident surface can be provided with a plurality of optical microstructures in the area where the light supply space should be provided.

In summary, the sub-millimeter light-emitting diode backlight module of this creation can effectively improve the use of sub-millimeter light-emitting diodes as the backlight module for the light source, and the uniformity of light output, etc., to provide more consistent performance The excellent optical products demanded by the market can not only improve the light output efficiency, but also meet the light and thin requirements of the current market. The specific structure implementation state can be as described in the previous embodiments, for example, the light guide plate has a recessed groove or the light guide plate has a protruding structure to form a light supply space for accommodating sub-millimeter light emitting diodes. The light from the sub-millimeter light-emitting diode can smoothly enter the light guide plate, and the light can be atomized and scattered in response to the light supply space, so that the light has sufficient light uniformity when it comes out of the light emitting surface.

As mentioned above, sub-millimeter light-emitting diodes are an emerging light source choice in the field of display devices. However, due to the limitation of the characteristics of light-emitting diodes, sub-millimeter light-emitting diodes still have excessive concentration of emitted light in use, which causes the light to be emitted. Prone to uneven brightness and darkness. In this regard, the light guide plate used with sub-micron light-emitting diodes must have a corresponding design that can improve the aforementioned over-collimated light output state, so that the sub-millimeter light-emitting diode has enough light spreading space when emitting light, so that The light incident on the light guide plate can be diverged to form a more uniform light incident state, so that the subsequent light guide and light exit can have a better presentation effect.

The following diagrams and text descriptions are used to describe the technical characteristics of this creation. The structure of each drawing is for illustration purposes only to facilitate the description of the technology of this creation. It does not indicate the actual structure, size, and other requirements. Explain first. Please refer to Figures 1, 2 and 3, which are the three-dimensional exploded schematic view, the assembly schematic diagram and the assembly schematic diagram of another implementation state of the first embodiment of the creation. This creation discloses a sub-millimeter light-emitting diode (Mini LED) backlight module 1, which can be used with display devices such as TV panels to provide uniform surface light on the display panel. The sub-millimeter light-emitting diode backlight module 1 includes a direct-type light source 10 and a light guide plate 11. The direct-type light source 10 has a substrate 101 and a plurality of sub-millimeter light-emitting diodes 102, and the sub-millimeter light-emitting diodes 102 are arranged at intervals It is arranged on the substrate 101, for example, in a matrix arrangement. The light guide plate 11 is arranged above the direct light source 10, and the light guide plate 11 has a light exit surface 111 and a light entrance surface 112. The light entrance surface 112 and the light exit surface 111 are arranged opposite to each other to receive and guide the light emitted by the direct light source 10 The light makes the light uniformly emitted from the light-emitting surface 111, and the light-emitting surface 111 of the light guide plate can be provided with a plurality of light extraction microstructures (not shown in the figure) to facilitate the light emission, and at the same time, it can be more atomized. As shown in Figure 1, the bottom side of the light guide plate 11 is the light incident surface 112, and the top side is the light exit surface 111, and the direct light source 10 is corresponding to the light incident surface 112 at the bottom side of the light guide plate 11. The light incident surface 112 of the light guide plate 11 forms a plurality of light supply spaces 12 relative to the direct light source 10 for accommodating the sub-millimeter light-emitting diode 102 and receiving the light emitted by the sub-millimeter light-emitting diode 102. Accordingly, the light emitted from the sub-micron light-emitting diode 102 to the light guide plate 11 can have a better light divergence effect in response to the light supply space 12, so that the light emitted from the light emitting surface 111 of the light guide plate 11 has a more uniform Light effect.

，任二相鄰之V型溝槽13之間距d為a+2b

。該些V型溝槽13結構係可依據次毫米發光二極體102之尺規結構予以定義，以框圍形成適於次毫米發光二極體102展光之供光空間12，讓自次毫米發光二極體102射出的光線能夠因應供光空間12發散而解決後續出光產生如光包等亮暗不均之問題。其中，各V型溝槽13係分別為長條狀之凹陷槽體，並可使各V型溝槽13之表面為粗糙面，以讓光線更易於散射霧化。 In this embodiment, as shown in Figures 1 and 2, the light supply spaces 12 are respectively framed by a V-shaped groove 13, and the width of the sub-millimeter light emitting diode 102 is a and the height is b. When the slope angle A of the V-shaped groove 13 is 2θ, the depth c of the V-shaped groove 13 is

, The distance d between any two adjacent V-shaped grooves 13 is a+2b

. The structure of the V-shaped grooves 13 can be defined according to the ruler structure of the sub-millimeter light-emitting diode 102, and the light-supply space 12 suitable for light spreading of the sub-millimeter light-emitting diode 102 is formed by the frame, so that the The light emitted by the light emitting diode 102 can diverge in response to the light supply space 12 to solve the problem of uneven brightness and darkness caused by subsequent light output such as light packets. Wherein, each V-shaped groove 13 is a long strip of concave groove body, and the surface of each V-shaped groove 13 can be made a rough surface, so that the light is more easily scattered and atomized.

In practical applications, the width a of the sub-millimeter light-emitting diode 102 can be 0.11 ~ 0.24 mm to have a sufficiently compact light supply efficiency, and the height b of the sub-millimeter light-emitting diode 102 can be 0.1 ~ 0.2 mm to allow The overall thickness of the assembled backlight module has the advantages of lightness and thinness. The light supply space 12 on the light incident surface 112 of the light guide plate 11 can be set according to the aforementioned ruler, so that the backlight module has better applicability and overall thickness. In an implementation state, the height b of the sub-millimeter light emitting diode 102 can be 0.15 mm. In another implementation state, the distance P ₁ between the sub-millimeter light-emitting diodes 102 is 0.2, 0.5, or 0.7 mm to provide a densely arranged or loose direct light source structure according to the needs of the display.

According to the specific implementation structure of the sub-millimeter light-emitting diode backlight module 1, the light-supply space 12 formed by the light-incident surface 112 of the light guide plate 11 relative to the direct-type light source 10 appears as a sub-millimeter light-emitting diode 102 In the setting state, even if the distance d between any two adjacent V-shaped grooves 13 is equal to the distance P ₁ between the sub-millimeter light-emitting diodes 102, the design is such that each V-shaped groove 13 is surrounded by The light spaces 12 all have sub-millimeter light-emitting diodes 102. Of course, as shown in Figure 3, the distance d between any two adjacent V-shaped grooves 13 and the distance P ₁ between the sub-millimeter light-emitting diodes 102 can have a certain proportional relationship, so that the matching distance of the light guide plate 11 is larger. Secondly, when the millimeter light-emitting diode 102 is assembled, the light supply space 12 can also be compatible with the direct-type light source 10, showing a state where the light guide plate 11 houses the sub-millimeter light-emitting diode 102 at intervals, so that it can also provide The sub-millimeter light-emitting diode 102 is enough to spread the light space.

Please continue to refer to Figure 4, which is the assembly diagram of the second embodiment of this creation, and please refer to Figure 1 together. Another embodiment of the sub-millimeter light-emitting diode backlight module 1 is that the light supply spaces 12 are respectively formed by a trapezoidal groove 14, and the sub-millimeter light-emitting diode 102 has a width a and a height b At this time, the bottom width e of the trapezoidal groove 14 is at least 1.3a, and the depth f of the trapezoidal groove 14 is at least 1.3b. In this embodiment, the sub-millimeter light-emitting diodes 102 of the direct-lit light source 10 are also arranged in a matrix on the substrate 101, as shown in Figure 1, and the trapezoidal grooves 14 can also be elongated depressions. Tank structure. Based on process considerations and actual application requirements, the light supply space 12 can also be designed as a trapezoid, which can also achieve the effect of diverging the incident light from the sub-millimeter light emitting diode 102 relative to the light incident surface 112 of the light guide plate 11. In order for the light to be able to change the incident angle according to the structure of the trapezoidal groove 14, the width e of the bottom surface of the trapezoid groove 14 must be at least 1.3a and the depth f must be at least 1.3b to provide enough space to adjust the sub-millimeter light emission. The incident light state of the polar body 102.

In practical applications, an implementation state is that the depth f of the trapezoidal groove 14 is 1.3b˜2.5b, so that the light guide plate 11 can reliably adjust and diverge the light of the sub-millimeter light emitting diode 102. With reference to the foregoing embodiment, in an application state, the width b of the sub-millimeter light-emitting diode 102 may be, for example, 0.12 mm or 0.22 mm.

Likewise, in the present embodiment can make the pitch of any two adjacent grooves 14 of the ladder with time P ₂ mm light-emitting diode 102 of the pitch is equal to P _1, the grooves 14 are each ladder receiving A sub-millimeter light-emitting diode 102 is placed, as shown in Figure 4. Of course, it is also possible to make the distance P ₂ between adjacent ladder grooves 14 and the distance between the sub-millimeter light-emitting diodes 102 form a certain proportional relationship, and let the sub-millimeter light-emitting diode backlight module 1 present part of the light supply space The assembly state of the sub-millimeter light-emitting diode 102 in 12 can refer to the arrangement of the sub-millimeter light-emitting diode 102 in FIG. 3.

Please continue to refer to Figures 5 and 6, which are the three-dimensional exploded schematic diagram and assembly schematic diagram of the third embodiment of this creation. Another embodiment of the sub-millimeter light-emitting diode backlight module 1 is that the light incident surface 112 has a plurality of supporting portions 15 which protrude from the light incident surface 112 and are arranged at intervals, so that the light supply space 12 is formed by sandwiching the light-incident surface 112 and the supporting part 15 respectively. In this way, the light guide plate 11 can be raised so that the sub-millimeter light-emitting diode 102 and the light-incident surface 112 have a sufficient distance to allow light to enter The light guide plate 11 is more divergent, so as to avoid being limited by the light-emitting angle of the sub-millimeter light-emitting diode 102 to form an uneven light-emitting phenomenon such as bright packets. The supporting portion 15 may be, for example, a V-shaped or ladder-shaped protruding structure, and may be a long strip structure parallel to one side of the light guide plate 11, or a block structure provided on the light incident surface 112. Through the structure of the supporting part 15, when the light guide plate 11 and the direct light source 10 are assembled with each other, a light supply space 12 can be formed between the light incident surface 112 and the sub-millimeter light emitting diode 102 to achieve the effect of astigmatism.

Similarly, in this embodiment, the width a of the sub-millimeter light emitting diode 102 may also be 0.11 to 0.24 mm. Considering the overall thickness performance of the backlight module and the factors of optical adjustment, the protruding length g of the supporting portion 15 is 0.1-0.3 mm, for example, it can be 0.2 mm, so that both the thickness and the light-incidence adjustment requirements are met. Furthermore, in practical applications, multiple rows of sub-millimeter light-emitting diodes 102 can be provided in the light supply space 12 at the same time, as shown in FIG. 6. In addition, a plurality of optical microstructures 1121 may be provided in the area corresponding to the light supply space 12 on the light incident surface 112 to facilitate the dispersion of the incident light from the sub-millimeter light emitting diode 102 to achieve a uniformly atomized incident light adjustment effect. Among them, the optical microstructures 1121 can be concave and convex dot structures, and their distribution density and dot ruler are designed according to the specifications of the sub-millimeter light emitting diode 102.

Please continue to refer to Figure 7, which is an assembly diagram of another implementation state of the third embodiment of this creation. As mentioned above, the light supply space 12 can accommodate multiple rows of sub-millimeter light-emitting diodes 102 at the same time. It is also possible to adjust the distance P ₃ between the supporting parts 15 so that the supporting parts 15 and Each light supply space 12 formed by sandwiching the light incident surface 112 accommodates a row of sub-millimeter light emitting diodes 102. In addition, in the present embodiment, the distance P ₃ between the elevated portions 15 may be 0.7-0.9 mm, for example 0.8 mm, so that the sub-millimeter light emitting diode 102 has enough light divergence space. In order to facilitate the assembly of the light guide plate 11 and the direct light source 10, the side of the supporting portion 15 opposite to the light incident surface 112 can be formed as a plane, and the supporting portion 15 can be a trapezoidal structure. When the aforementioned plane is in contact with the substrate 101, the overall structure of the backlight module can be made more stable.

To sum up, the sub-millimeter light-emitting diode backlight module of this creation belongs to the field of direct backlighting, and it effectively improves the problem of the bright package that the sub-millimeter light-emitting diode is limited by the spread angle. For the direct light source on the bottom side of the light guide plate, the corresponding light guide plate structure is designed and proposed to make the light emitted from the light emitting surface of the light guide plate more uniform, so as to provide more excellent backlight products used in the display field. The sub-millimeter light-emitting diode backlight module utilizes the setting of the light supply space, so that the light of the sub-millimeter light-emitting diode has enough light spreading space, so as to avoid the light from being too collimated and concentrated and causing the lack of uneven brightness and darkness. In specific implementation, as described in the previous embodiments, the structure of the light-incident surface of the light guide plate and the direct-lit light source with sub-millimeter light-emitting diodes are combined, so that the sub-millimeter light-emitting diodes can interact with each other through the light supply space. The light-incident surface has a sufficient light spreading distance, so that the incident light can be atomized and diffused, so that the subsequent light output is more uniform, and the picture quality of the display with the application can be improved.

1: Sub-millimeter light-emitting diode backlight module 10: Direct light source 101: Substrate 102: Sub-millimeter light-emitting diode 11: Light guide plate 111: Light exit surface 112: Light entrance surface 1121: Optical microstructure 12: Light supply space 13: V-shaped groove 14: Ladder-shaped groove 15: Supporting part A: The angle of the slope of the V-shaped groove a: The width of the sub-millimeter light-emitting diode b: The height of the sub-millimeter light-emitting diode c: V-shaped The depth of the groove d: the distance between the V-shaped grooves e: the width of the bottom of the trapezoidal groove f: the depth of the trapezoidal groove g: the protruding length of the supporting part P: ₁ mm distance between the light-emitting diodes P: ₂ Distance between trapezoidal grooves P: Distance between ₃ support heights

Figure 1 is a three-dimensional exploded schematic diagram of the first embodiment of the creation. Figure 2 is a partial assembly diagram of the first embodiment of the creation. Figure 3 is a partial assembly diagram of another implementation state of the first embodiment of the creation. Figure 4 is a partial assembly diagram of the second embodiment of the creation. Figure 5 is a three-dimensional exploded schematic diagram of the third embodiment of the creation. Figure 6 is a partial assembly diagram of the third embodiment of the creation. Figure 7 is a partial assembly diagram of another implementation state of the third embodiment of the creation.

1: Sub-millimeter light emitting diode backlight module

10: Direct light source

101: substrate

102: Sub-millimeter LED

11: Light guide plate

111: Glossy Surface

112: Glossy surface

12: Light supply space

13: V-shaped groove

Claims (40)

A sub-millimeter light emitting diode (Mini LED) backlight module, including: The straight-down light source has a substrate and a plurality of sub-millimeter light-emitting diodes, and the sub-millimeter light-emitting diode systems are arranged on the substrate in intervals; and A light guide plate is arranged above the direct-type light source, the light guide plate has a light-emitting surface and a light-incident surface, the light-incident surface is disposed opposite to the light-emitting surface, and the light-incident surface forms a plurality of light sources relative to the direct light source The light-supplying space is for accommodating the sub-millimeter light-emitting diodes and receiving the light emitted by the sub-millimeter light-emitting diodes. For example, the sub-millimeter light-emitting diode backlight module of claim 1, wherein the light supply spaces are respectively formed by a V-shaped groove frame, and when the width of the sub-millimeter light-emitting diode is a, the height Is b. When the angle between the inclined surfaces of the V-shaped grooves is 2θ, the depth of the V-shaped grooves is

, The distance between any two adjacent V-shaped grooves is a+2b

. For example, the sub-millimeter light-emitting diode backlight module of claim 2, wherein the width a of the sub-millimeter light-emitting diode is 0.11 to 0.24 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 3, wherein the height b of the sub-millimeter light-emitting diode is 0.1 to 0.2 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 4, wherein the height b of the sub-millimeter light-emitting diode is 0.15 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 5, wherein the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5 or 0.7 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 6, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 2, wherein the height b of the sub-millimeter light-emitting diode is 0.1 to 0.2 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 8, wherein the height b of the sub-millimeter light-emitting diode is 0.15 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 2, wherein the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5 or 0.7 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 3, wherein the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5 or 0.7 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 4, wherein the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5 or 0.7 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 8, wherein the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5 or 0.7 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 9, wherein the distance between the sub-millimeter light-emitting diodes is 0.2, 0.5 or 0.7 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 2, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 3, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 4, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 5, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 8, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 9, wherein the distance between any two adjacent V-shaped grooves is equal to the distance between the sub-millimeter light-emitting diodes, so that each V-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light-emitting diode backlight module of claim 1, wherein the light supply spaces are respectively formed by a trapezoidal groove frame, and when the width of the sub-millimeter light-emitting diode is a, the height When it is b, the width of the bottom surface of the trapezoidal grooves is at least 1.3a, and the depth of the trapezoidal grooves is at least 1.3b. For example, the sub-millimeter light-emitting diode backlight module of claim 21, wherein the distance between any two adjacent trapezoidal grooves is equal to the distance between the sub-millimeter light-emitting diodes, and each of the ladder-shaped The grooves contain the sub-millimeter light-emitting diode. For example, the sub-millimeter light emitting diode backlight module of claim 22, wherein the depth of the ladder-shaped grooves is 1.3b to 2.5b. For example, the sub-millimeter light emitting diode backlight module of claim 21, wherein the depth of the ladder-shaped grooves is 1.3b to 2.5b. For example, the sub-millimeter light-emitting diode backlight module of claim 1, wherein the light incident surface has a plurality of supporting heights, and the supporting heights protrude from the light incident surface and are arranged at intervals, so that the supply The light space is formed by sandwiching the light incident surface and the supporting parts. For example, the sub-millimeter light-emitting diode backlight module of claim 25, wherein the width of the sub-millimeter light-emitting diode is 0.11 to 0.24 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 26, wherein the protruding length of the supporting parts is 0.1-0.3 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 27, wherein the side of the supporting parts connected to the light incident surface is a flat surface. For example, the sub-millimeter light-emitting diode backlight module of claim 28, wherein the distance between the raised parts is 0.7-0.9 mm. For example, the sub-millimeter light emitting diode backlight module of claim 29, wherein the light incident surface is provided with a plurality of optical microstructures in the area where the light supply space should be provided. For example, the sub-millimeter light emitting diode backlight module of claim 25, wherein the protruding length of the supporting parts is 0.1-0.3 mm. For example, the sub-millimeter light-emitting diode backlight module of claim 25, wherein the side of the supporting parts connected to the light incident surface is a flat surface. For example, the sub-millimeter light-emitting diode backlight module of claim 26, wherein the side of the supporting parts connected to the light incident surface is a flat surface. For example, the sub-millimeter light emitting diode backlight module of claim 25, wherein the distance between the supporting parts is 0.7-0.9 mm. For example, the sub-millimeter light emitting diode backlight module of claim 26, wherein the distance between the raised parts is 0.7-0.9 mm. For example, the sub-millimeter light emitting diode backlight module of claim 27, wherein the distance between the raised parts is 0.7-0.9 mm. For example, the sub-millimeter light emitting diode backlight module of claim 25, wherein the light incident surface is provided with a plurality of optical microstructures in the area where the light supply space should be provided. For example, the sub-millimeter light-emitting diode backlight module of claim 26, wherein the light incident surface is provided with a plurality of optical microstructures in the area where the light supply space should be provided. For example, the sub-millimeter light emitting diode backlight module of claim 27, wherein the light incident surface is provided with a plurality of optical microstructures in the area where the light supply space should be provided. For example, the sub-millimeter light emitting diode backlight module of claim 28, wherein the light incident surface is provided with a plurality of optical microstructures in the area where the light supply space should be provided.

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