TWM598730U - Mixing chip - Google Patents

Mixing chip Download PDF

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TWM598730U
TWM598730U TW109204772U TW109204772U TWM598730U TW M598730 U TWM598730 U TW M598730U TW 109204772 U TW109204772 U TW 109204772U TW 109204772 U TW109204772 U TW 109204772U TW M598730 U TWM598730 U TW M598730U
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wafer
groove
injection
fluid
wafer body
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傅龍明
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國立成功大學
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Abstract

一種混合晶片,用以解決習知混合晶片使用步驟繁雜的問題。係包含:一第一晶片體,具有相對的一第一表面及一第二表面,數個注入槽分別貫穿於該第一表面及該第二表面,該第一晶片體具有數個第一微流道,該第一微流道連接任二個注入槽,該第二表面具有至少一緩衝槽;一第二晶片體,具有相對的一第一表面及一第二表面,該第二晶片體的第一表面結合於該第一晶片體的第二表面,該第二晶片體具有一匯集槽對位於該數個注入槽的其中之一,一第二微流道連接該匯集槽與該檢測槽;及一緩衝流道連接該檢測槽與該緩衝槽。A hybrid chip is used to solve the problem of complicated use steps of the conventional hybrid chip. It includes: a first chip body having a first surface and a second surface opposite to each other, a plurality of injection grooves respectively penetrate through the first surface and the second surface, the first chip body having a plurality of first micro A runner, the first micro runner is connected to any two injection grooves, the second surface has at least one buffer groove; a second wafer body having a first surface and a second surface opposite to each other, the second wafer body The first surface is combined with the second surface of the first wafer body, the second wafer body has a collection groove pair located in one of the plurality of injection grooves, and a second micro channel connects the collection groove and the detection Slot; and a buffer flow path connecting the detection slot and the buffer slot.

Description

混合晶片Hybrid chip

本創作係關於一種檢測用晶片,尤其是一種可混合多種流體以進行檢測的混合晶片。This creation is about a wafer for inspection, especially a hybrid wafer that can mix multiple fluids for inspection.

在生物、化學待測液檢驗過程中,係需要將例如樣品、測試液或反應液等多種液體進行混合以形成一待測液,再由儀器對該待測液進行檢測,一般而言,係將上述多種液體依序注入一容器後,再以振動或攪拌等方式進行混合形成該待測液,並將該待測液取至儀器上的測量位置,方能供儀器對該待測液進行檢測,而上述繁瑣的準備步驟將造成檢測上的不便。In the inspection process of biological and chemical test liquids, it is necessary to mix various liquids such as samples, test liquids or reaction liquids to form a test liquid, and then the test liquid is tested by the instrument. Generally speaking, the system After the above-mentioned liquids are sequentially poured into a container, they are mixed by vibrating or stirring to form the liquid to be measured, and the liquid to be measured is taken to the measuring position on the instrument before the instrument can perform the liquid to be measured. Detection, and the cumbersome preparation steps mentioned above will cause inconvenience in detection.

為此,係有一種習知的流體混合晶片,該流體混合晶片上具有多個試劑槽,該多個試劑槽經由數個流道連接一檢測槽,據此,使用者分別將數個反應液及樣品等各別注入於該數個試劑槽,並使該數個反應液及樣品藉由該數個流道匯流於該檢測槽內混合,以直接對該檢測槽內的流體進行檢測。惟,為了避免流體匯流至該檢測槽內時溢出,或者為了使該檢測槽內的流體形成定量,例如以光譜儀等儀器對該檢測槽的流體進行吸收光譜的檢測時,係通常會將待測溶液設定為1ml,此時,使用者必須對於注入該數個試劑槽的反應液及樣品的量進行控制,因而造成步驟繁雜,而無法有效提升作業效率。To this end, there is a conventional fluid mixing wafer. The fluid mixing wafer has a plurality of reagent tanks connected to a detection tank via a plurality of flow channels. According to this, the user separates the plurality of reaction solutions The reaction liquid and the sample are respectively injected into the plurality of reagent tanks, and the plurality of reaction liquids and samples are mixed in the detection tank through the plurality of flow channels to directly detect the fluid in the detection tank. However, in order to avoid overflow when the fluid converges into the detection tank, or to quantify the fluid in the detection tank, for example, when a spectrometer or other instrument is used to detect the absorption spectrum of the fluid in the detection tank, the system will usually The solution is set to 1ml. At this time, the user must control the amount of reaction solution and sample injected into the reagent tanks, which results in complicated steps and cannot effectively improve work efficiency.

有鑑於此,習知的流體混合晶片確實仍有加以改善之必要。In view of this, there is indeed a need to improve the conventional fluid mixing wafer.

為解決上述問題,本創作的目的是提供一種混合晶片,係能夠提升檢測效率者。In order to solve the above problems, the purpose of this creation is to provide a hybrid chip that can improve the inspection efficiency.

本創作全文所述方向性或其近似用語,例如「前」、「後」、「左」、「右」、「上(頂)」、「下(底)」、「內」、「外」、「側面」等,主要係參考附加圖式的方向,各方向性或其近似用語僅用以輔助說明及理解本創作的各實施例,非用以限制本創作。The directionality or similar terms used in the full text of this creation, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inner", "outer" , "Side", etc., mainly refer to the direction of the attached drawings. The directional or similar terms are only used to help explain and understand the embodiments of this creation, and are not used to limit this creation.

本創作全文所記載的元件及構件使用「一」或「一個」之量詞,僅是為了方便使用且提供本創作範圍的通常意義;於本創作中應被解讀為包括一個或至少一個,且單一的概念也包括複數的情況,除非其明顯意指其他意思。The elements and components described in the full text of this creation use the quantifier "一" or "one" only for the convenience of use and to provide the usual meaning of the scope of this creation; in this creation, it should be interpreted as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

本創作全文所述「結合」、「組合」或「組裝」等近似用語,主要包含連接後仍可不破壞構件地分離,或是連接後使構件不可分離等型態,係本領域中具有通常知識者可以依據欲相連之構件材質或組裝需求予以選擇者。The approximate terms such as "combination", "combination" or "assembly" mentioned in the full text of this creation mainly include the types that can be separated without destroying the components after being connected, or the components can be made inseparable after being connected, and have common knowledge in the field Those can be selected based on the materials of the components to be connected or assembly requirements.

本創作的混合晶片,包含:一第一晶片體,具有相對的一第一表面及一第二表面,數個注入槽分別貫穿於該第一表面及該第二表面,該第一晶片體具有數個第一微流道,該第一微流道連接任二個注入槽,該第二表面具有至少一緩衝槽;一第二晶片體,具有相對的一第一表面及一第二表面,該第二晶片體的第一表面結合於該第一晶片體的第二表面,該第二晶片體具有一匯集槽對位於該數個注入槽的其中之一,一第二微流道連接該匯集槽與該檢測槽;及一緩衝流道連接該檢測槽與該緩衝槽。The hybrid chip of the present invention includes: a first chip body having a first surface and a second surface opposite to each other, a plurality of injection grooves respectively penetrate through the first surface and the second surface, and the first chip body has A plurality of first micro flow channels, the first micro flow channel is connected to any two injection grooves, the second surface has at least one buffer groove; a second wafer body has a first surface and a second surface opposite to each other, The first surface of the second wafer body is bonded to the second surface of the first wafer body, the second wafer body has a collection groove pair located in one of the plurality of injection grooves, and a second micro channel is connected to the A collection tank and the detection tank; and a buffer flow channel connects the detection tank and the buffer tank.

據此,本創作的混合晶片,藉由該第二晶片體具有該檢測槽,該檢測槽經由該緩衝流道連接該緩衝槽,當流體填充至該檢測槽時,多餘的流體可以由該緩衝流道流至該緩衝槽,藉此,可以使該流體填充於該檢測槽內形成一預定量,使用者可以不須要精確的控制注入各該注入槽內的流體量即可準確的使該檢測槽內的流體量形成定量,係可以達到加速作業效率,提升使用便利性的功效。According to this, the hybrid chip of the present invention has the detection groove through the buffer flow channel through the second chip body. When the fluid is filled into the detection groove, the excess fluid can be buffered by the detection groove. The flow channel flows to the buffer tank, so that the fluid can be filled in the detection tank to form a predetermined amount. The user does not need to precisely control the amount of fluid injected into each injection tank to accurately make the detection The amount of fluid in the tank is quantified, which can achieve the effect of accelerating work efficiency and improving ease of use.

其中,該數個第一微流道位於該第一晶片體之該第二表面,各該第一微流道的兩端分別連接任二個該注入槽。如此,該第一微流道係可以位於該注入槽的底端,係可以確保所有的流體流至該第一微流道功效。Wherein, the plurality of first micro flow channels are located on the second surface of the first wafer body, and two ends of each of the first micro flow channels are respectively connected to any two injection grooves. In this way, the first microfluidic channel can be located at the bottom end of the injection groove, which can ensure that all the fluid flows to the first microfluidic channel.

其中,該第一微流道呈彎曲狀地連接於二個注入槽。如此,可以延長流體通過該第一微流道的時間,並可以減緩流體的流速,係具有提升流體混合均勻度的功效。Wherein, the first micro flow channel is connected to two injection grooves in a curved shape. In this way, the time for the fluid to pass through the first microchannel can be prolonged, and the flow rate of the fluid can be slowed down, which has the effect of improving the uniformity of fluid mixing.

其中,該第二微流道呈彎曲狀地連接於該匯集槽與該檢測槽。如此,可以延長流體通過該第二微流道的時間,並可以減緩流體的流速,係具有提升流體混合均勻度的功效。Wherein, the second micro flow channel is connected to the collecting groove and the detecting groove in a curved shape. In this way, the time for the fluid to pass through the second microchannel can be prolonged, and the flow rate of the fluid can be slowed down, which has the effect of improving the uniformity of fluid mixing.

其中,該匯集槽及該檢測槽係貫通該第二晶片體的第一表面及該第二表面,該第二晶片體的第二表面結合一封閉件。如此,該封閉件用以遮擋該匯集槽及該檢測槽位於該第二表面的開口,係具有使流體可以被容置於該匯集槽及該檢測槽內的功效。Wherein, the collecting groove and the detecting groove penetrate through the first surface and the second surface of the second wafer body, and the second surface of the second wafer body is combined with a closing member. In this way, the closing member is used to block the opening of the collecting groove and the detecting groove on the second surface, and has the function of enabling fluid to be contained in the collecting groove and the detecting groove.

其中,該第二微流道係位於該封閉件。如此,可以使該第二微流道位於該匯集槽的底端,係具有確保所有的流體可以流至該第二微流道的功效。Wherein, the second microfluidic channel is located in the sealing member. In this way, the second microfluidic channel can be located at the bottom end of the collecting tank, which has the effect of ensuring that all fluids can flow to the second microfluidic channel.

其中,該第二微流道係位於該第二晶片體的第二表面。如此,可以使該第二微流道位於該匯集槽的底端,係具有確保所有的流體可以流至該第二微流道的功效。Wherein, the second micro flow channel is located on the second surface of the second wafer body. In this way, the second microfluidic channel can be located at the bottom end of the collecting tank, which has the effect of ensuring that all fluids can flow to the second microfluidic channel.

其中,該緩衝流道位於該第一晶片體的第二表面。如此,可以使該緩衝流道位於該檢測槽的頂端,係具有確保該流體可以填滿該檢測槽的功效。Wherein, the buffer flow channel is located on the second surface of the first wafer body. In this way, the buffer flow channel can be located at the top of the detection groove, which has the effect of ensuring that the fluid can fill the detection groove.

其中,該緩衝流道位於該第二晶片體的第一表面。如此,可以使該緩衝流道位於該檢測槽的頂端,係具有確保該流體可以填滿該檢測槽的功效。Wherein, the buffer flow channel is located on the first surface of the second wafer body. In this way, the buffer flow channel can be located at the top of the detection groove, which has the effect of ensuring that the fluid can fill the detection groove.

其中,該第一晶片體的第二表面及該第二晶片體的第一表面各具有該緩衝流道。如此,可以使該緩衝流道位於該檢測槽的頂端,係具有確保該流體可以填滿該檢測槽的功效。Wherein, the second surface of the first wafer body and the first surface of the second wafer body each have the buffer flow channel. In this way, the buffer flow channel can be located at the top of the detection groove, which has the effect of ensuring that the fluid can fill the detection groove.

其中,另包含一蓋體,該蓋體結合於該第一晶片體的第一表面,該蓋體具有數個注液孔,各該注液孔係分別對位於該注入槽。如此,係可以避免該數個注入槽及該數個緩衝槽內的流體溢出,及使流體可以注入於該注入槽的功效。Wherein, a cover body is further included, and the cover body is combined with the first surface of the first chip body. The cover body has a plurality of liquid injection holes, and each of the liquid injection holes is located in the injection groove respectively. In this way, the overflow of the fluid in the plurality of injection tanks and the plurality of buffer tanks can be avoided, and the fluid can be injected into the injection tank.

其中,該注液孔的開口小於該注入槽位於該第一表面的開口。如此,該蓋體可以覆蓋於該第一表面之開口的部份面積,係具有避免流體從該第一表面之開口溢出的功效。Wherein, the opening of the liquid injection hole is smaller than the opening of the injection groove on the first surface. In this way, the cover can cover part of the area of the opening of the first surface, and has the effect of preventing fluid from overflowing from the opening of the first surface.

為讓本創作之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本創作之較佳實施例,並配合所附圖式,作詳細說明如下:In order to make the above and other purposes, features and advantages of this creation more obvious and understandable, the following is a detailed description of the preferred embodiments of this creation, together with the accompanying drawings:

請參照第1圖所示,其係本創作混合晶片的一較佳實施例,係包含一第一晶片體1及一第二晶片體2,該第一晶片體1疊於該第二晶片體2。Please refer to Fig. 1, which is a preferred embodiment of the creative hybrid chip, which includes a first chip body 1 and a second chip body 2, the first chip body 1 being stacked on the second chip body 2.

該第一晶片體1可以具有數個注入槽11,該數個注入槽11能夠用以各別注入反應液或樣品溶液等流體,且該第一晶片體1較佳能夠為玻璃或壓克力等可透光材質,以使該混合晶片可以應用於光譜儀等檢測儀器,係為本領域人員可以瞭解。該第一晶片體1可以具有相對的一第一表面1a及一第二表面1b,該數個注入槽11係貫通於該第一表面1a及該第二表面1b,如此,流體係可以由該第一表面1a注入於該數個注入槽11。較佳地,該數個注入槽11的容積係可以一致,或者彼此具有一定的容積比例,如此使用者係可以方便控制流體之注入量。該第一晶片體1係具有數個第一微流道12,該第一微流道12連接任二個注入槽11,以使其中之一注入槽11內的流體可以經由該第一微流道12流至另一注入槽11,藉此,可以將各該注入槽11內的流體進行混合。在本實施例中,該第一微流道12較佳以雷射燒蝕的方式形成於該第二表面1b,如此,該第一微流道12可以連通二個該注入槽11。較佳地,該第一微流道12可以呈彎曲狀地連接於二個注入槽11之間,藉此,可以延長流體通過該第一微流道12的時間,並可以減緩流體的流速,具有提升流體混合均勻度的作用。The first wafer body 1 may have a plurality of injection grooves 11, and the plurality of injection grooves 11 can be used to separately inject fluids such as reaction solution or sample solution, and the first wafer body 1 can preferably be glass or acrylic And other light-transmitting materials, so that the hybrid wafer can be applied to detection instruments such as spectrometers, which can be understood by those in the art. The first wafer body 1 may have a first surface 1a and a second surface 1b opposite to each other. The plurality of injection grooves 11 penetrate through the first surface 1a and the second surface 1b, so that the flow system can be The first surface 1a is injected into the plurality of injection grooves 11. Preferably, the volumes of the plurality of injection grooves 11 can be the same or have a certain volume ratio with each other, so that the user can conveniently control the injection volume of the fluid. The first wafer body 1 has a plurality of first micro-channels 12, and the first micro-channels 12 are connected to any two injection grooves 11, so that the fluid injected into one of the grooves 11 can pass through the first micro-channels. The channel 12 flows to another injection tank 11, whereby the fluids in each injection tank 11 can be mixed. In this embodiment, the first microfluidic channel 12 is preferably formed on the second surface 1b by laser ablation, so that the first microfluidic channel 12 can communicate with two injection grooves 11. Preferably, the first micro-channel 12 can be connected between the two injection grooves 11 in a curved shape, so that the time for the fluid to pass through the first micro-channel 12 can be prolonged, and the flow rate of the fluid can be reduced. It can improve the uniformity of fluid mixing.

該第一微流道12與該數個注入槽11的連接係可以串聯連接,以使分別注入於該數個注入槽11的流體可以依序混合,或可以經由該數個第一微流道12將一注入槽11分別連接於數個注入槽11,以使分別注入於該數個注入槽11的流體可以同時混合於一個注入槽11,本創作不予限制。例如,該數個注入槽11係可以分別注入相同或不同的反應液以及樣品容液,如此,可以使數個反應液同時與該樣品容液進行混合。該第一晶片體1另可以具有至少一緩衝槽13,該緩衝槽13可以貫穿該第一表面1a及該第二表面1b,以使多餘的流體能夠由該第二表面1b流入該緩衝槽13內(容後詳述)。The connection system of the first microchannel 12 and the plurality of injection grooves 11 can be connected in series, so that the fluids respectively injected into the plurality of injection grooves 11 can be mixed in sequence, or can pass through the plurality of first microchannels. 12 One injection tank 11 is connected to several injection tanks 11 respectively, so that the fluids respectively injected into the several injection tanks 11 can be mixed in one injection tank 11 at the same time, and this creation is not limited. For example, the several injection tanks 11 can respectively inject the same or different reaction liquids and sample containing liquids, so that several reaction liquids can be mixed with the sample containing liquids at the same time. The first wafer body 1 may additionally have at least one buffer groove 13 which can penetrate through the first surface 1a and the second surface 1b, so that excess fluid can flow into the buffer groove 13 from the second surface 1b Inside (detailed later).

該第二晶片體2具有一第一表面2a及一第二表面2b,該第一表面2a係可以與該第一晶片體1的第二表面1b相結合,藉此,該第一表面2a係可以遮擋該第一晶片體1的該數個注入槽11,如此,流體可以被容置於該注入槽11及該緩衝槽13內,並且可以確保流體循該第一微流道12流通。該第二晶片體2係具有一匯集槽21,該匯集槽21用以集收注入於該注入槽11的流體。詳言之,該匯集槽21係可以對位於該第一晶片體1的其中一注入槽11,如此,可以使該數個注入槽11內的流體通過該第一微流道12流入該匯集槽21,以使該數個注入槽11內的流體能夠混合集中於該匯集槽21內。The second wafer body 2 has a first surface 2a and a second surface 2b. The first surface 2a can be combined with the second surface 1b of the first wafer body 1, whereby the first surface 2a is The plurality of injection grooves 11 of the first wafer body 1 can be blocked. In this way, fluid can be contained in the injection groove 11 and the buffer groove 13, and the fluid can be ensured to circulate through the first micro channel 12. The second wafer body 2 has a collecting groove 21 for collecting the fluid injected into the injection groove 11. In detail, the collecting groove 21 can be opposed to one of the injection grooves 11 in the first wafer body 1, so that the fluid in the plurality of injection grooves 11 can flow into the collecting groove through the first microchannel 12 21, so that the fluids in the several injection tanks 11 can be mixed and concentrated in the collecting tank 21.

該第二晶片體2具有一檢測槽22,該檢測槽22係可以接收該匯集槽21的流體以供檢測,例如,係可以由習知光譜儀等對該檢測槽22內的流體進行光照以來進行檢測。詳言之,該匯集槽21及該檢測槽22之間能夠以一第二微流道23連接,使該匯集槽21的流體可以經由該第二微流道23流入該檢測槽22。在本實施例中,該匯集槽21及該檢測槽22係可以貫穿該第一表面2a及該第二表面2b,且該第二晶片體2的第二表面2b係可以結合一封閉件24,該封閉件24用以遮擋該匯集槽21及該檢測槽22位於該第二表面2b的開口,以使流體可以被容置於該匯集槽21及該檢測槽22內。舉例而言,該第二微流道23係可以位於該封閉件24,該第二微流道23的兩端可以分別對位於該匯集槽21及該檢測槽22位於該第二表面2b的開口,藉此,可以使該第二微流道位於該匯集槽21的底端,當流體流入該匯集槽21時,係可以確保流體可以流入匯集槽21底端的第二微流道23。該第二微流道23係可以由雷射燒蝕的方式形成於該封閉件24,或者,該第二微流道23亦可以雷射燒蝕形成於該第二晶片體2的第二表面2b,本創作不予限制。The second wafer body 2 has a detection groove 22, and the detection groove 22 can receive the fluid in the collecting tank 21 for detection. For example, it can be performed by illuminating the fluid in the detection groove 22 by a conventional spectrometer. Detection. In detail, the collection tank 21 and the detection tank 22 can be connected by a second micro flow channel 23, so that the fluid in the collection tank 21 can flow into the detection tank 22 through the second micro flow channel 23. In this embodiment, the collecting groove 21 and the detecting groove 22 can penetrate the first surface 2a and the second surface 2b, and the second surface 2b of the second wafer body 2 can be combined with a closing member 24, The closing member 24 is used to block the openings of the collecting groove 21 and the detecting groove 22 on the second surface 2 b, so that fluid can be contained in the collecting groove 21 and the detecting groove 22. For example, the second microfluidic channel 23 may be located on the closing member 24, and two ends of the second microfluidic channel 23 may be located at the openings of the collecting groove 21 and the detecting groove 22 on the second surface 2b, respectively. As a result, the second micro-channel can be located at the bottom end of the collecting tank 21, and when fluid flows into the collecting tank 21, it can be ensured that the fluid can flow into the second micro-channel 23 at the bottom end of the collecting tank 21. The second micro channel 23 can be formed on the sealing member 24 by laser ablation, or the second micro channel 23 can also be formed on the second surface of the second wafer body 2 by laser ablation 2b, this creation is not restricted.

至少一緩衝流道25可連接該緩衝槽13及該檢測槽22,使流入該檢測槽22中多餘的流體可以藉由該緩衝流道25導至該緩衝槽13,該緩衝流道25係能夠以雷射燒蝕的方式形成,該緩衝流道25可以位於該第二晶片體2,或可以位於該第一晶片體1的第二表面1b,或於該第一晶片體1的第二表面1b及該第二晶片體2的第一表面2a同具有該緩衝流道25,本創作不予限制,在本實施例中,該緩衝流道25係位於該第二晶片體2的第一表面2a。詳言之,當該第一晶片體1的第二表面1b結合於該第一表面2a時,該緩衝流道25係可以局部對位於該緩衝槽13,藉此,該檢測槽22被填滿流體後,該流體可以經由該緩衝流道25注入該緩衝槽13。At least one buffer flow channel 25 can be connected to the buffer tank 13 and the detection tank 22, so that excess fluid flowing into the detection tank 22 can be guided to the buffer tank 13 through the buffer flow channel 25, and the buffer flow channel 25 can Formed by laser ablation, the buffer channel 25 may be located on the second wafer body 2, or may be located on the second surface 1b of the first wafer body 1, or on the second surface of the first wafer body 1. 1b and the first surface 2a of the second wafer body 2 both have the buffer flow channel 25. The present invention is not limited. In this embodiment, the buffer flow channel 25 is located on the first surface of the second wafer body 2 2a. In detail, when the second surface 1b of the first wafer body 1 is bonded to the first surface 2a, the buffer flow channel 25 may be partially aligned with the buffer groove 13, whereby the detection groove 22 is filled After the fluid is filled, the fluid can be injected into the buffer tank 13 through the buffer channel 25.

請參照第3、4圖所示,據由前述結構,本創作混合晶片使用時,係可以將樣品流體或反應流體分別注入於該數個注入槽11,並可以將該混合晶片置於一檢測平台T,並由一流體加壓件P提供一穩定壓力來推動該混合晶片內的流體。例如,該流體加壓件P係可以同時對該數個注入槽11輸入氣壓,各該注入槽11內的流體受到氣壓的推動而流入該第一微流道12,藉此,迫使各該注入槽11內的流體經由該第一微流道12流入該第二晶片體2的匯集槽21進行混合,隨著該流體加壓件P持續輸入氣壓,該匯集槽21內的流體可以經由該第二微流道23流入該檢測槽22,及經由該緩衝流道25注入至該第一晶片體1的緩衝槽13內,如此,係能夠以習知光譜儀等吸光值檢測儀器,對該檢測槽22的位置進行光照來進行檢測。Please refer to Figures 3 and 4, according to the aforementioned structure, when the hybrid wafer is used in this invention, the sample fluid or the reaction fluid can be respectively injected into the plurality of injection grooves 11, and the hybrid wafer can be placed in a test The platform T is provided with a stable pressure by a fluid pressurizing member P to push the fluid in the mixed wafer. For example, the fluid pressurizing member P can simultaneously input air pressure to several injection grooves 11, and the fluid in each injection groove 11 is pushed by the air pressure to flow into the first microchannel 12, thereby forcing each injection The fluid in the tank 11 flows into the collecting tank 21 of the second wafer body 2 through the first microchannel 12 for mixing. As the fluid pressurizing member P continues to input air pressure, the fluid in the collecting tank 21 can pass through the first Two micro flow channels 23 flow into the detection tank 22, and are injected into the buffer tank 13 of the first wafer body 1 through the buffer flow channel 25. In this way, it is possible to use a conventional spectrometer or other absorbance detection instrument to control the detection tank. The position of 22 is illuminated for detection.

請續參照第1、5圖所示,本創作混合晶片還可以另包含一蓋體3,該蓋體3係可以結合於該第一晶片體1的第一表面1a,該蓋體3係可以避免該數個注入槽11內的流體溢出,該蓋體3還可以具有數個注液孔31,各該注液孔31係分別對位於該注入槽11,藉此,可以將流體經由該數個注液孔31注入於該注入槽11內,較佳地,該注液孔31的開口係可以小於該注入槽11位於該第一表面1a的開口,藉此,該蓋體3可以覆蓋於該第一表面1a之開口的部份面積,具有避免流體從該第一表面1a之開口溢出的作用。Please continue to refer to Figures 1 and 5, the creative hybrid chip may further include a cover 3 which can be combined with the first surface 1a of the first chip body 1, and the cover 3 can To prevent the fluid in the plurality of injection tanks 11 from overflowing, the cover 3 may also have a plurality of injection holes 31, and each of the injection holes 31 is located in the injection tank 11, so that the fluid can pass through the A liquid injection hole 31 is injected into the injection groove 11. Preferably, the opening of the injection hole 31 can be smaller than the opening of the injection groove 11 on the first surface 1a, whereby the cover 3 can cover The partial area of the opening of the first surface 1a has the effect of preventing fluid from overflowing from the opening of the first surface 1a.

綜上所述,本創作的混合晶片,藉由該第二晶片體具有該檢測槽,該檢測槽經由該緩衝流道連接該緩衝槽,當流體填充至該檢測槽時,多餘的流體可以由該緩衝流道流至該緩衝槽,藉此,可以使該流體填充於該檢測槽內形成一預定量,使用者可以不須要精確的控制注入各該注入槽內的流體量即可準確的使該檢測槽內的流體量形成定量,係可以達到加速作業效率,提升使用便利性的功效。To sum up, the hybrid chip of the present creation has the detection groove through the buffer flow channel through the second chip body. When the fluid is filled into the detection groove, the excess fluid can be The buffer flow channel flows to the buffer tank, so that the fluid can be filled in the detection tank to form a predetermined amount. The user can accurately use the fluid without accurately controlling the amount of fluid injected into each injection tank. The amount of fluid in the detection tank is quantified, which can achieve the effect of accelerating work efficiency and improving ease of use.

雖然本創作已利用上述較佳實施例揭示,然其並非用以限定本創作,任何熟習此技藝者在不脫離本創作之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本創作所保護之技術範疇,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Although this creation has been disclosed using the above-mentioned preferred embodiment, it is not intended to limit this creation. Anyone who is familiar with this technique does not depart from the spirit and scope of this creation and makes various changes and modifications relative to the above-mentioned embodiment. The technical scope protected by the creation, therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.

1:第一晶片體 1a,2a:第一表面 1b,2b:第二表面 11:注入槽 12:第一微流道 13:緩衝槽 2:第二晶片體 21:匯集槽 22:檢測槽 23:第二微流道 24:封閉件 25:緩衝流道 3:蓋體 31:注液孔 T:檢測平台 P:流體加壓件1: The first chip body 1a, 2a: first surface 1b, 2b: second surface 11: Injection slot 12: The first micro channel 13: buffer slot 2: Second chip body 21: Collection slot 22: detection slot 23: The second micro channel 24: closure 25: Buffer runner 3: cover 31: Injection hole T: Testing platform P: Fluid pressurized parts

[第1圖] 本創作一實施例的分解立體圖。 [第2圖] 本創作一實施例的俯視圖。 [第3圖] 本創作一實施例的檢測情形圖。 [第4圖] 沿第2圖的A-A線剖面圖。 [第5圖] 本創作第二實施例的剖面圖。 [Picture 1] An exploded perspective view of an embodiment of this creation. [Picture 2] A top view of an embodiment of this creation. [Picture 3] The detection situation diagram of an embodiment of this creation. [Picture 4] A cross-sectional view along the line A-A in Fig. 2. [Figure 5] A cross-sectional view of the second embodiment of this creation.

1:第一晶片體 1: The first chip body

1a,2a:第一表面 1a, 2a: first surface

1b,2b:第二表面 1b, 2b: second surface

11:注入槽 11: Injection slot

12:第一微流道 12: The first micro channel

13:緩衝槽 13: buffer slot

2:第二晶片體 2: Second chip body

21:匯集槽 21: Collection slot

22:檢測槽 22: detection slot

23:第二微流道 23: The second micro channel

24:封閉件 24: closure

25:緩衝流道 25: Buffer runner

3:蓋體 3: cover

31:注液孔 31: Injection hole

Claims (12)

一種混合晶片,包含: 一第一晶片體,具有相對的一第一表面及一第二表面,數個注入槽分別貫穿於該第一表面及該第二表面,該第一晶片體具有數個第一微流道,該第一微流道連接任二個注入槽,該第二表面具有至少一緩衝槽; 一第二晶片體,具有相對的一第一表面及一第二表面,該第二晶片體的第一表面結合於該第一晶片體的第二表面,該第二晶片體具有一匯集槽對位於該數個注入槽的其中之一,一第二微流道連接該匯集槽與該檢測槽;及 一緩衝流道連接該檢測槽與該緩衝槽。 A hybrid wafer containing: A first wafer body has a first surface and a second surface opposite to each other, a plurality of injection grooves respectively penetrate through the first surface and the second surface, the first wafer body has a plurality of first micro flow channels, The first micro flow channel is connected to any two injection grooves, and the second surface has at least one buffer groove; A second wafer body having a first surface and a second surface opposite to each other. The first surface of the second wafer body is bonded to the second surface of the first wafer body, and the second wafer body has a pair of collecting grooves Located in one of the several injection grooves, a second micro flow channel connects the collection groove and the detection groove; and A buffer flow channel connects the detection groove and the buffer groove. 如請求項1之混合晶片,其中,該數個第一微流道位於該第一晶片體之該第二表面,各該第一微流道的兩端分別連接任二個該注入槽。The hybrid wafer of claim 1, wherein the plurality of first micro-channels are located on the second surface of the first wafer body, and two ends of each of the first micro-channels are respectively connected to any two injection grooves. 如請求項1之混合晶片,其中,該第一微流道呈彎曲狀地連接於二個注入槽。The hybrid wafer of claim 1, wherein the first micro-channel is connected to two injection grooves in a curved shape. 如請求項1之混合晶片,其中,該第二微流道呈彎曲狀地連接於該匯集槽與該檢測槽。The hybrid wafer of claim 1, wherein the second micro flow channel is connected to the collecting groove and the detecting groove in a curved shape. 如請求項1之混合晶片,其中,該匯集槽及該檢測槽係貫通該第二晶片體的第一表面及該第二表面,該第二晶片體的第二表面結合一封閉件。The hybrid wafer of claim 1, wherein the collecting groove and the detecting groove penetrate the first surface and the second surface of the second wafer body, and the second surface of the second wafer body is coupled with a closing member. 如請求項5之混合晶片,其中,該第二微流道係位於該封閉件。Such as the hybrid wafer of claim 5, wherein the second micro flow channel is located in the sealing member. 如請求項1之混合晶片,其中,該第二微流道係位於該第二晶片體的第二表面。The hybrid wafer of claim 1, wherein the second micro flow channel is located on the second surface of the second wafer body. 如請求項1之混合晶片,其中,該緩衝流道位於該第一晶片體的第二表面。The hybrid wafer of claim 1, wherein the buffer flow channel is located on the second surface of the first wafer body. 如請求項1之混合晶片,其中,該緩衝流道位於該第二晶片體的第一表面。The hybrid wafer of claim 1, wherein the buffer flow channel is located on the first surface of the second wafer body. 如請求項1之混合晶片,其中,該第一晶片體的第二表面及該第二晶片體的第一表面各具有該緩衝流道。The hybrid wafer of claim 1, wherein the second surface of the first wafer body and the first surface of the second wafer body each have the buffer flow channel. 如請求項1至10中任一項之混合晶片,另包含一蓋體,該蓋體結合於該第一晶片體的第一表面,該蓋體具有數個注液孔,各該注液孔係分別對位於該注入槽。For example, the hybrid wafer according to any one of claims 1 to 10, further comprising a cover body bonded to the first surface of the first wafer body, the cover body having a plurality of liquid injection holes, each of the liquid injection holes The lines are located in the injection groove respectively. 如請求項11之混合晶片,其中,該注液孔的開口小於該注入槽位於該第一表面的開口。The hybrid wafer of claim 11, wherein the opening of the liquid injection hole is smaller than the opening of the injection groove on the first surface.
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