TWM597025U - Electroacoustic element structure suitable for being mounted on PCB - Google Patents
Electroacoustic element structure suitable for being mounted on PCB Download PDFInfo
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Abstract
本新型提供一種適於PCB上安裝的電聲元件結構,包括一殼座內部安裝有所述多個發聲組件,且安裝有所述至少二導電端子的基座預先擺放在迴流焊爐內,使所述至少二導電端子能和PCB上的至少二接點相互黏著而電性連接,其中該殼座一端形成有一連接部,該基座一端形成有一對接部,該殼座與基座能在所述迴流焊爐的外部,經由該連接部與該對接部的相互結合而成一體,使所述的至少二導電端子電性連接所述多個發聲組件中的至少其中之一,藉以可於迴流焊爐內、外分離組裝電聲元件,避免因迴流焊爐的高溫烘烤作用而影響電聲元件的電氣特性。 The present invention provides an electroacoustic component structure suitable for installation on a PCB, which includes a shell seat in which the plurality of sound generating components are installed, and a base on which the at least two conductive terminals are installed is placed in a reflow furnace in advance. The at least two conductive terminals can be adhered to at least two contacts on the PCB to be electrically connected to each other, wherein a connection portion is formed at one end of the shell base, a pair of connection portions are formed at one end of the base, the shell base and the base can be The outside of the reflow furnace is integrated with each other via the connecting portion and the butting portion, so that the at least two conductive terminals are electrically connected to at least one of the plurality of sound-emitting components, so that Separate and assemble electro-acoustic components inside and outside of the reflow furnace to avoid affecting the electrical characteristics of the electro-acoustic components due to the high temperature baking effect of the reflow furnace.
Description
本新型涉及電聲元件的結構及安裝技術,特別是有關一種適於PCB上安裝的電聲元件結構。 The present invention relates to the structure and installation technology of electroacoustic components, in particular to an electroacoustic component structure suitable for installation on a PCB.
一般所稱的電聲元件(electroacoustic component)包含壓電式蜂鳴器(piezoelectric buzzer)、電磁式蜂鳴器(magnetic buzzer)、動圈式喇叭(dynamic speaker)等。其中,壓電式蜂鳴器是利用壓電陶瓷的壓電效應來帶動振動膜產生振動進而發聲,電磁式蜂鳴器是利用電磁於通電與不通電過程中帶動金屬振動膜產生振動進而發聲,然而動圈式喇叭則是利用線圈通電生成的磁場效應來帶動膜片振動進而發聲。因此,所述電聲元件一般都是組裝在PCB上,透過PCB之線路層所提供的導電迴路的驅動而發聲。 The electroacoustic components generally referred to include piezoelectric buzzer, magnetic buzzer, dynamic speaker and the like. Among them, the piezoelectric buzzer uses the piezoelectric effect of piezoelectric ceramics to drive the vibrating membrane to generate vibration and sound, and the electromagnetic buzzer uses electromagnetic to drive the metal vibrating membrane to generate vibration and generate sound during energization and non-energization. However, the moving coil horn uses the magnetic field effect generated by the energization of the coil to drive the diaphragm to vibrate and then sound. Therefore, the electro-acoustic components are generally assembled on the PCB and emit sound through the driving of the conductive loop provided by the circuit layer of the PCB.
周知,在PCB上組裝IC、電聲元件等電子元件時,一般都仰賴表面黏著技術(SMT),先於PCB的電路層表面印上錫膏,而後藉助例如自動手臂上的吸盤吸附電子元件並插件於PCB上,隨後透過一種迴流焊爐(例如:IR oven)對已插件在PCB表面的電子元件及錫膏進行熔焊的動作,使電子元件能穩固地被黏著於PCB的電路層表面,以導通各該電子元件在PCB上的導電迴路。 It is well known that when assembling electronic components such as ICs and electroacoustic components on a PCB, they generally rely on surface mount technology (SMT), first printing solder paste on the surface of the circuit layer of the PCB, and then sucking the electronic components with the aid of a suction cup such as an automatic arm. Insert the PCB on the PCB, and then use a reflow oven (such as: IR oven) to solder the electronic components and solder paste that have been inserted on the PCB surface, so that the electronic components can be firmly adhered to the circuit layer surface of the PCB. In order to conduct the conductive circuit of each electronic component on the PCB.
對上述電子元件中的電聲元件而言,通常都是由一器殼內載組裝必要的發聲組件(sound assembly)而組成。該電聲元件例如是以壓電式蜂鳴器為例,需於其器殼內組載的發聲組件包含有壓電蜂鳴片(piezoelectric ceramic element)、振動膜(diaphragm)、線路板(circuit board)及導電端子(conductive terminals)等,這些發聲組件在通過上述迴流焊爐的熔焊過程中,必須承受 迴流焊爐大約245℃的高溫烘烤,在此種高溫環境下,除了考驗器殼材料的耐溫特性之外,亦會影響例如是壓電蜂鳴片、振動膜、線路板等發聲組件的電氣特性。 The electroacoustic components in the above electronic components are usually composed of a sound assembly necessary for assembling in a housing. The electroacoustic element is, for example, a piezoelectric buzzer as an example, and the sound-generating component to be mounted in the housing includes a piezoelectric buzzer (piezoelectric ceramic element), a diaphragm (diaphragm), and a circuit board (circuit board) and conductive terminals, etc. These sound-generating components must withstand The reflow oven is baked at a high temperature of about 245°C. In this high temperature environment, in addition to testing the temperature resistance characteristics of the shell material, it will also affect the sound components such as piezoelectric buzzers, diaphragms, circuit boards, etc. Electrical characteristics.
面對此問題,當今業者只能選用較能承受上述迴流焊爐之高溫的材料去製作所述電聲元件的器殼及發聲組件,但卻因此增加了電聲元件的產製成本,亟待加以改善。 Faced with this problem, today's industry can only use materials that are more able to withstand the high temperature of the above reflow soldering furnace to make the casing and sound-emitting components of the electro-acoustic element, but it increases the production cost of the electro-acoustic element improve.
本新型之目的旨在針對電聲元件的器殼及其內載組裝的發聲組件,儘量減少它們遭受迴流焊爐之高溫烘烤的影響,以維護該等構件的電氣特性。 The purpose of this new model is to minimize the effects of high-temperature baking of reflow ovens on the housing of electroacoustic components and their built-in sound-producing components to maintain the electrical characteristics of these components.
為此,本新型之一較佳實施例旨在提供一種適於PCB上安裝的電聲元件結構,包括所述殼座及基座;該殼座內部形成有一腔室,用以安裝所述多個發聲組件,且安裝有所述至少二導電端子的基座預先擺放在迴流焊爐內,使所述至少二導電端子能和PCB上的至少二接點相互黏著而電性連接;其中,該殼座一端形成有一連接部,該基座一端形成有用以結合所述連接部的一對接部,該殼座與基座能在所述迴流焊爐的外部,經由該連接部與該對接部的相互結合而成一體,使所述的至少二導電端子電性連接所述多個發聲組件中的至少其中之一。 To this end, a preferred embodiment of the present invention aims to provide an electroacoustic element structure suitable for mounting on a PCB, including the shell base and the base; a cavity is formed inside the shell base for mounting the multiple Sound-generating components, and the base on which the at least two conductive terminals are installed is placed in a reflow oven in advance, so that the at least two conductive terminals and at least two contacts on the PCB can be adhered to each other to be electrically connected; wherein, A connecting portion is formed at one end of the shell base, and a mating portion for coupling the connecting portion is formed at one end of the base, the shell base and the base can be outside the reflow furnace through the connecting portion and the butting portion Are integrated with each other, so that the at least two conductive terminals are electrically connected to at least one of the plurality of sound-emitting components.
在進一步實施中,該殼座包含一座體及一組設於該座體上的座蓋,該腔室形成於該座體內。如此實施,較能方便地在殼座內安裝發聲組件。 In a further implementation, the shell base includes a base body and a set of seat covers provided on the base body, and the cavity is formed in the base body. With such an implementation, it is easier to install the sound-generating component in the housing.
在進一步實施中,所述至少二導電端子分別彎折呈J形體顯露於基座的兩個相對端面,以便於電性連接PCB上的接點和多個發聲組件中的至少其中之一。 In a further implementation, the at least two conductive terminals are respectively bent into a J-shaped body and exposed on two opposite end surfaces of the base, so as to be electrically connected to at least one of the contacts on the PCB and the plurality of sound-emitting components.
在上述結構的實施之中,所述電聲元件可為壓電式蜂鳴器、電磁式蜂鳴器、動圈式喇叭的其中之一。此外,僅需基座使用耐熱性塑膠製成,而該殼座與所述發聲組件都可排除使用耐熱性塑膠製成。 In the implementation of the above structure, the electroacoustic element may be one of a piezoelectric buzzer, an electromagnetic buzzer, and a moving coil horn. In addition, only the base needs to be made of heat-resistant plastic, and both the base and the sound-emitting component can be excluded from being made of heat-resistant plastic.
根據上述技術手段,本新型整體上能據以增進的功效在於:維護已黏著安裝於PCB上之電聲元件的電氣特性,包括電聲元件之中的壓電蜂鳴片、振動膜及線路板等構件的電氣特性;此外,本新型還能藉此免除使用耐溫材料來製作電聲元件的器殼之殼座(包括座體與座蓋)、壓電蜂鳴片、振動膜及線路板等構件,因而降低了電聲元件的產製成本。 According to the above technical means, the overall effectiveness of the new model can be improved by maintaining the electrical characteristics of the electro-acoustic components that are adhesively mounted on the PCB, including the piezoelectric buzzer, vibrating membrane and circuit board among the electro-acoustic components The electrical characteristics of other components; in addition, the new model can also be used to eliminate the use of temperature-resistant materials to make the shell of the electroacoustic device (including the seat body and the cover), the piezoelectric buzzer, the diaphragm and the circuit board And other components, thus reducing the production cost of the electroacoustic element.
除此之外,有關本新型可供據以實施的相關技術細節,將在後續的實施方式及圖式中加以闡述。 In addition, the relevant technical details on which the new model can be implemented will be described in subsequent embodiments and drawings.
10、60、70‧‧‧器殼 10, 60, 70
11、61、71‧‧‧殼座 11, 61, 71
11a、61a、71a‧‧‧座體 11a, 61a, 71a
11b、61b、71b‧‧‧座蓋 11b, 61b, 71b seat cover
111‧‧‧腔室 111‧‧‧ chamber
112‧‧‧第一開口 112‧‧‧First opening
113‧‧‧連接部 113‧‧‧ Connection
114‧‧‧透音孔 114‧‧‧sound hole
115‧‧‧固定板 115‧‧‧Fixed board
116‧‧‧第二開口 116‧‧‧Second opening
117‧‧‧限位柱 117‧‧‧Limit post
118‧‧‧海棉 118‧‧‧ Sponge
12、62、72‧‧‧基座 12, 62, 72 ‧‧‧ base
12a‧‧‧外端面 12a‧‧‧Outer end
12b‧‧‧端壁 12b‧‧‧End wall
12c‧‧‧內端面 12c‧‧‧Inner end
121‧‧‧對接部 121‧‧‧ Docking Department
122‧‧‧缺口 122‧‧‧Notch
20‧‧‧發聲組件 20‧‧‧Sounding component
21‧‧‧壓電蜂鳴片 21‧‧‧ Piezoelectric buzzer
22、22a、22b‧‧‧振動膜 22, 22a, 22b
23、23a、23b‧‧‧線路板 23, 23a, 23b ‧‧‧ circuit board
231、311、321‧‧‧線路端子 231, 311, 321‧‧‧ line terminal
24‧‧‧線圈 24‧‧‧coil
25‧‧‧磁極 25‧‧‧ magnetic pole
26、261‧‧‧磁石 26、261‧‧‧Magnet
27‧‧‧印刷電路電極 27‧‧‧ Printed Circuit Electrode
281‧‧‧偏極線圈 281‧‧‧Polarized coil
282‧‧‧聲音線圈 282‧‧‧ voice coil
30、31、32‧‧‧導電端子 30, 31, 32 ‧‧‧ conductive terminals
40‧‧‧PCB 40‧‧‧PCB
41‧‧‧接點 41‧‧‧Contact
50‧‧‧迴流焊爐 50‧‧‧Reflow oven
S1至S3‧‧‧實施例之步驟說明 Steps from S1 to S3‧‧‧ Examples
圖1是本新型安裝方法的步驟程序圖。 Figure 1 is a step program diagram of the new installation method.
圖2a至圖2e分別是執行圖1安裝方法的動作示意圖。 2a to 2e are schematic diagrams of the operations of the installation method of FIG. 1 respectively.
圖3是本新型第一款結構實施例的立體分解圖,說明以壓電式蜂鳴器作為電聲元件的實施態樣。 FIG. 3 is an exploded perspective view of the first structural embodiment of the present invention, illustrating an implementation manner in which a piezoelectric buzzer is used as an electroacoustic element.
圖4是圖3中基座之另一視角的立體分解圖。 4 is an exploded perspective view of the base of FIG. 3 from another perspective.
圖5是圖3中構件組立後的立體示意圖。 FIG. 5 is a schematic perspective view of the components in FIG. 3 after being assembled.
圖6是圖5的放大剖示圖。 6 is an enlarged cross-sectional view of FIG. 5.
圖7是本新型第二款結構實施例的剖示圖,說明以電磁式蜂鳴器作為電聲元件的實施態樣。 7 is a cross-sectional view of the second structural embodiment of the present invention, illustrating the implementation of the electromagnetic buzzer as an electroacoustic element.
圖8是本新型第三款結構實施例的剖示圖,說明以動圈式喇叭作為電聲元件的實施態樣。 FIG. 8 is a cross-sectional view of the third structural embodiment of the present invention, illustrating an implementation manner in which a moving coil horn is used as an electroacoustic element.
請參閱圖1,說明本新型所提供的適於PCB上安裝的電聲元件結構是透過一種適於PCB上安裝電聲元件的方法可以容易地被實施,該適於PCB上安裝電聲元件的方法包括依序執行下列S1至S3步驟: Please refer to FIG. 1 to illustrate that the structure of the electro-acoustic element suitable for installation on the PCB provided by the present invention can be easily implemented through a method suitable for mounting the electro-acoustic element on the PCB. The method includes sequentially performing the following steps S1 to S3:
步驟S1:分離建構電聲元件的器殼 Step S1: Separate the housing of the electroacoustic component
請參閱圖2a,說明利用塑膠射出成型技術,將電聲元件的器殼10預先建構成,能事先各自獨立而後能結合成一體的
一殼座11與一基座12。其中,該殼座11內預先安裝包含易受高溫影響電氣特性的多個發聲組件20,所述多個發聲組件20之中至少包含一線路板23,且基座12上預先安裝包含至少二導電端子30。該基座12在實施上使用耐熱性塑膠製成,該殼座11與所述發聲組件20在實施上排除使用耐熱性塑膠製成。所述耐熱性塑膠是指能承受迴流焊爐大約245℃之高溫烘烤的塑膠。
Please refer to FIG. 2a to illustrate that the plastic injection molding technology is used to pre-construct the
步驟S2:黏著基座與PCB Step S2: Adhering the base and the PCB
請依序參閱圖2b及圖2c,說明在PCB 40的接點41印上錫膏,而後藉助例如是自動手臂來擷取基座12並擺放至PCB 40上(如圖2b所示),使基座12上的導電端子30與PCB 40上的接點41接觸,接著將PCB 40移動至一迴流焊爐50內(如圖2c所示),藉由迴流焊爐50內大約245℃之高溫烘烤而使錫膏熔化,令基座12上的導電端子30與PCB 40上的接點41能相互黏著而電性連接。
Please refer to FIG. 2b and FIG. 2c in order to illustrate that solder paste is printed on the
步驟S3:結合殼座與基座 Step S3: Combining the housing and the base
請依序參閱圖2d及圖2e,說明將已黏著基座12的PCB 40自迴流焊爐50內取出,使已黏著基座12的PCB 40遠離迴流焊爐50內的高溫,而能在常溫或室溫環境下,藉助例如是自動手臂來擷取殼座11,並且將殼座11壓扣或螺合於已黏著在PCB 40上的基座12上(如圖2d所示),且當殼座11與基座12結合成一體時,基座12上的導電端子30便能和殼座11內線路板23上的二線路端子231壓觸而成電性連接,進而構裝成黏著於PCB 40上的一體式電聲元件(如圖2e所示)。如此實施,可避免殼座11及殼座11內已安裝的多個發聲組件20在迴流焊爐50內遭受高溫的侵擾。
Please refer to FIG. 2d and FIG. 2e in order to illustrate that the
另一方面,請參閱圖3至圖6,揭露出本新型以壓電式蜂鳴器作為電聲元件的第一款結構實施例,說明該壓電式蜂鳴器的結構包含了上述的殼座11、基座12及多個發聲組件20。其中:
On the other hand, please refer to FIG. 3 to FIG. 6 to disclose the first structural embodiment of the present invention using a piezoelectric buzzer as an electroacoustic element, illustrating that the structure of the piezoelectric buzzer includes the above-mentioned shell The
該殼座11內形成有一用以安裝所述多個發聲組件20的腔室111,該殼座11之一端的殼壁上形成有一連接部113。在本實施中,所述發聲組件20包含周知的一壓電陶磁製成的壓電蜂鳴片21、一振動膜22及一線路板23等;其中,該振動膜22製成可往復振動之圓錐盆狀,且振動膜22的圓周邊緣固定於腔室111的壁面,該壓電蜂鳴片21的中央盆心區域貼固於振動膜22上,該壓電蜂鳴片21電性連接該線路板23進而外接供電端,以便利用壓電蜂鳴片21的壓電效應來帶動振動膜22振動進而發聲。
A
為了考量在殼座11內組裝發聲組件20的方便性,該殼座11可實施成包含一座體11a及一組設於座體11a上的座蓋11b;其中,該腔室111是形成於座體11a內,且該腔室111內具有一固定板115,該固定板115可以是以壓配方式固定於座體11a內,或者由座體11a的腔室111壁面一體延伸形成,以便利用腔室111內的固定板115來固定所述線路板23;該座體11a的雙端分別形成一第一開口112及一第二開口116,所述連接部113可以是單數個或多數個,並且以環狀形式或間隔開設形式形成於該第一開口112周圍的座體11a上;該座體11a的第二開口116連通腔室111,且該座蓋11b是以例如是壓扣的方式組設於第二開口116上,該振動膜23是配置於座體11a與座蓋11b之間而坐落於腔室111內;該座蓋11b上形成有至少一透音孔114,該壓電蜂鳴片21振動時所發出的聲音是通過透音孔114傳遞至外界。
In order to consider the convenience of assembling the sound-emitting
此外,該基座12形成為能罩合殼座11之一端部的盤蓋狀,且基座12之一端面形成有用以結合連接部113的對接部121。其中,該連接部113與對接部121可以實施成具有公、母卡扣能力的卡肋及卡槽相對嵌扣的結合形式,或者實施成螺牙相對鎖接的結合形式。
In addition, the
當連接部113與對接部121實施成如圖3至圖5所示的公、母卡扣的卡肋及卡槽結合形式時,上述用來擷取殼座11的自動手臂只需執行對位壓扣動作,即可將殼座11壓扣結合於
PCB 40的基座12上;換當連接部113與對接部121實施成螺牙相對鎖接的結合形式時(普通的螺接技術應用,故未繪示),上述用來擷取殼座11的自動手臂只需執行對位旋轉動作,即可將殼座11壓扣結合於PCB 40的基座12上。以現階段自動手臂的控制技術而言,上述兩種結合方式,皆能使殼座11在結合基座12時讓導電端子30和線路端子231能夠準確的對準正、負極向並且穩定的電性連接。
When the connecting
進一步的說,該對接部121上還形成有至少一缺口122。當殼座11與基座12結合成一體時,能以工具通過缺口122推動連接部113,令連接部113與對接部121不再維持結合狀態,進而使殼座11能與基座12分開。
Furthermore, at least one
更進一步的說,該基座12上組設有所述的二導電端子30,所述二導電端子30可由金屬片經過彎折後呈現J形體,使各該導電端子30能依序由基座12的外端面12a、端壁12b延伸至基座12的內端面12c而嵌扣固定在基座12上,因此所述導電端子30之雙端能夠分別顯露於基座12的兩相對端面(外端面12a與內端面12c)上,以便於所述導電端子30之雙端能夠分別電性連接線路板23的線路端子231及PCB 40上的接點41。據此,當PCB 40通電時,可經由壓電式蜂鳴器(即電聲元件)內的線路板23輸出一激勵電壓至該壓電蜂鳴片21,令貼設在可撓性振動膜22之盆心區域的蜂鳴片21產生振頻,進而發出聲響。
Furthermore, the two
上述線路板23上的二線路端子231可由例如是螺旋壓簧等彈性元件製成,且所述二線路端子231具有正、負極向之別。當殼座11與基座12結合成一體時,所述二線路端子231能依其正、負極向之導電通路上的需求而與基座12上的二導電端子30緊密接觸,以維持兩者之間的電性連接。
The two
請再合併參閱圖3及圖6,該座蓋11b上形成有一限位柱117,該限位柱117由座蓋11b延伸至座體11a內(也就是腔室111內),用以限制振動膜22的振幅。該固定板115上固置有一
海棉118,該海棉118可視為發聲組件20的配件,並且跟隨發聲組件20一同配置於殼座11內,進而免於遭受迴流焊爐的高溫侵擾,所述壓電蜂鳴片21是坐落於限位柱117與海棉118之間。藉此,壓電蜂鳴片21於振動時能憑藉海棉118及限位柱117的拘束而維持穩定振頻的安定性。
Please refer to FIG. 3 and FIG. 6 again. A
請續參閱圖7,揭露出本新型以電磁式蜂鳴器作為電聲元件的第二款結構實施例,說明該電磁式蜂鳴器的結構與上述第一款壓電式蜂鳴器的最大差異處,在於器殼60的殼座61內安裝的多個發聲組件20,改由周知的線路板23a電性連接線圈24及相應組配的磁極25、磁石26及振動膜22a等替換而成,且二線路端子311改由非螺旋壓簧的彈性元件製成,細微的說,二線路端子311是改由基座12上的導電端子30彎折形成為斜臂翹起形態,以便當殼座61與基座62結合成一體時,所述二線路端子311能依其正、負極向而與線路板23a上的正、負接點電性連接。此外,由座體61a與座蓋61b結合而成的殼座61的內部構造會作出相應的搭配來安裝上述的發聲組件20,使得電磁式蜂鳴器能夠利用線圈24於通電與不通電過程中經由磁極25與磁石26間的作動而帶動振動膜22a產生振動進而發聲。除此之外,本實施例其餘結構及安裝方式皆與第一實施例大致相同,特別的是,本實施例完全合適應用本新型之上述方法,來執行PCB上安裝電聲元件的步驟。
Please continue to refer to FIG. 7 to reveal the second structural embodiment of the present invention that uses an electromagnetic buzzer as an electroacoustic element, illustrating the structure of the electromagnetic buzzer and the maximum of the first piezoelectric buzzer described above The difference is that the multiple sound-emitting
請續參閱圖8,揭露出本新型以動圈式喇叭作為電聲元件的第三款結構實施例,說明該動圈式喇叭的結構與上述第一款壓電式蜂鳴器的最大差異處,在於器殼70的殼座71內安裝的多個發聲組件20,改由周知的印刷電路電極27、偏極線圈281、聲音線圈282之間的電性連接,及相應組配的磁石261、振動膜22b等替換而成。其中,印刷電路電極27用以替換上述第一及第二款實施例的線路板,且二線路端子321改由基座72上的導電端子32彎折形成為斜臂翹起形態,以便當殼座71與基座72結合成一體時,所述二線路端子321能與印刷電路電極27電性連接。此
外,由座體71a與座蓋71b結合而成的殼座71的內部構造會作出相應的搭配來安裝上述的發聲組件20,使得動圈式喇叭能夠利用印刷電路電極27激勵偏極線圈281與聲音線圈282生成磁場效應來帶動振動膜22b振動發聲。除此之外,本實施例其餘結構及安裝方式皆與第一實施例大致相同,特別的是,本實施例完全合適應用本新型之上述方法來執行PCB上安裝電聲元件的所述步驟。
Please continue to refer to FIG. 8 to reveal the third structural embodiment of the present invention that uses a moving coil horn as an electroacoustic element, illustrating the biggest difference between the structure of the moving coil horn and the first piezoelectric buzzer described above , A plurality of sound-generating
以上實施例僅為表達了本新型的較佳實施方式,但並不能因此而理解為對本新型專利範圍的限制。因此,本新型應以申請專利範圍中限定的請求項內容為準。 The above examples merely express the preferred embodiments of the present invention, but they should not be construed as limiting the scope of the patent of the present invention. Therefore, this new model shall be subject to the content of the claims defined in the scope of patent application.
10‧‧‧器殼 10‧‧‧Housing
11‧‧‧殼座 11‧‧‧Shell
11a‧‧‧座體 11a‧‧‧Body
11b‧‧‧座蓋 11b‧‧‧seat cover
111‧‧‧腔室 111‧‧‧ chamber
112‧‧‧第一開口 112‧‧‧First opening
113‧‧‧連接部 113‧‧‧ Connection
114‧‧‧透音孔 114‧‧‧sound hole
115‧‧‧固定板 115‧‧‧Fixed board
116‧‧‧第二開口 116‧‧‧Second opening
117‧‧‧限位柱 117‧‧‧Limit post
118‧‧‧海棉 118‧‧‧ Sponge
12‧‧‧基座 12‧‧‧Dock
12a‧‧‧外端面 12a‧‧‧Outer end
12b‧‧‧端壁 12b‧‧‧End wall
121‧‧‧對接部 121‧‧‧ Docking Department
122‧‧‧缺口 122‧‧‧Notch
20‧‧‧發聲組件 20‧‧‧Sounding component
21‧‧‧壓電蜂鳴片 21‧‧‧ Piezoelectric buzzer
22‧‧‧振動膜 22‧‧‧Vibrating membrane
23‧‧‧線路板 23‧‧‧ circuit board
231‧‧‧線路端子 231‧‧‧Line terminal
30‧‧‧導電端子 30‧‧‧Conductive terminal
Claims (10)
Priority Applications (1)
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TW108213944U TWM597025U (en) | 2019-10-23 | 2019-10-23 | Electroacoustic element structure suitable for being mounted on PCB |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW108213944U TWM597025U (en) | 2019-10-23 | 2019-10-23 | Electroacoustic element structure suitable for being mounted on PCB |
Publications (1)
Publication Number | Publication Date |
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TWM597025U true TWM597025U (en) | 2020-06-11 |
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