TWM596466U - Usb connector - Google Patents

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Publication number
TWM596466U
TWM596466U TW109200002U TW109200002U TWM596466U TW M596466 U TWM596466 U TW M596466U TW 109200002 U TW109200002 U TW 109200002U TW 109200002 U TW109200002 U TW 109200002U TW M596466 U TWM596466 U TW M596466U
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Taiwan
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terminal
signal
negative
welding
negative electrode
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TW109200002U
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Chinese (zh)
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楊裕林
劉豐田
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正崴精密工業股份有限公司
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Priority to TW109200002U priority Critical patent/TWM596466U/en
Publication of TWM596466U publication Critical patent/TWM596466U/en

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Abstract

本創作公開一種通用序列匯流排連接器,包含一絕緣本體、一積體電路芯片、一負極端子、一信號端子以及至少一傳輸端子,所述絕緣本體包含一接觸端、一固持端以及一凹槽,所述接觸端相對所述固持端,所述凹槽設置於所述固持端的上方;所述負極端子、信號端子、傳輸端子均包含一設置於所述絕緣本體中的端子本體,且所述傳輸端子設置於所述負極端子與所述信號端子之間,所述負極端子與所述信號端子均包含一設置於所述端子本體一側且高於全部所述端子本體的焊接部,且焊接部外露於所述凹槽與所述積體電路芯片直接連接,進而節省焊接電路板的製程。 The present invention discloses a universal serial bus connector, which includes an insulating body, an integrated circuit chip, a negative terminal, a signal terminal, and at least one transmission terminal. The insulating body includes a contact end, a holding end, and a recess Groove, the contact end is opposite to the holding end, the groove is provided above the holding end; the negative terminal, the signal terminal, and the transmission terminal all include a terminal body provided in the insulating body, and the The transmission terminal is disposed between the negative terminal and the signal terminal, and both the negative terminal and the signal terminal include a welding portion disposed on the side of the terminal body and higher than all of the terminal body, and The welding part is exposed to the groove and directly connected with the integrated circuit chip, thereby saving the manufacturing process of the welding circuit board.

Description

通用序列匯流排連接器 Universal serial bus connector

本創作涉及一種有效節約成本簡化製程的通用序列匯流排連接器。 This creation relates to a universal serial bus connector that effectively saves costs and simplifies the manufacturing process.

隨著智慧手機搭載著越來越多的重要功能,現有調查表明手機斷電或低電量的情況會讓大多數人感到焦慮。在兼顧手機輕薄的同時,要緩解現代人的這種焦慮症,實現手機快速充電已成為企業亟欲達成的目標。 As smartphones carry more and more important functions, existing surveys have shown that power outages or low battery levels can cause most people to feel anxious. While taking into account the thinness and thinness of mobile phones, to alleviate the anxiety of modern people, the realization of fast charging of mobile phones has become an urgent goal for enterprises.

為了達到快速充電效果,用以充電的通用序列匯流排連接器中設有識別各設備的積體電路芯片(Integrated Circuit Chip;IC)和電阻。如第十圖,習知的積體電路芯片20’以及電阻21’透過貼片製程設置於一電路板上70,並透過將通用序列匯流排連接器100b中的各端子與電路板70焊接連結的方式將通用序列匯流排連接器與積體電路芯片20’結合。其中,積體電路芯片透過識別各設備,對識別成功的設備則能實現手機快速充電的效果,對識別失敗的設備則手機會進行普通充電。 In order to achieve a fast charging effect, an integrated circuit chip (IC) and a resistor that identify each device are provided in the universal serial bus connector for charging. As shown in FIG. 10, the conventional integrated circuit chip 20' and the resistor 21' are provided on a circuit board 70 through a patch process, and are connected to the circuit board 70 by soldering each terminal in the universal serial bus connector 100b The combination of the universal serial bus connector and the integrated circuit chip 20'. Among them, the integrated circuit chip can realize the effect of rapid charging of the mobile phone for the devices that have been successfully identified by identifying each device, and the mobile phone will be charged normally for the devices that have failed to be identified.

然而,由習知通用序列匯流排連接器中包含電路板,因而使通用序列匯流排連接器佔據的體積增大;此外在通用序列匯流排連接器焊接電路板的製程中,時常會因機械應力導致端子與電路板焊盤斷開的風險,造成成本相對地提高且製程相對繁瑣。 However, the conventional universal serial bus connector includes a circuit board, which increases the volume occupied by the universal serial bus connector. In addition, in the process of soldering the circuit board of the universal serial bus connector, mechanical stress is often caused by The risk of disconnecting the terminal from the circuit board pad results in a relatively high cost and a relatively cumbersome manufacturing process.

由此可見,設計一種有效節約成本簡化製程的通用序列匯流排連接器尤其重要。 Thus, it is particularly important to design a universal serial bus connector that effectively saves costs and simplifies the manufacturing process.

本創作之目的在於克服上述有技術的不足,提供一種有效節約成本簡化製程的通用序列匯流排連接器。 The purpose of this creation is to overcome the above-mentioned technical shortcomings, and to provide a universal serial bus connector that can effectively save costs and simplify the manufacturing process.

為了實現以上目的,本創作提供一種通用序列匯流排連接器,包含一絕緣本體,所述絕緣本體包含一設置於所述絕緣本體一端的接觸端、一設置於所述絕緣本體另一端的固持端,所述固持端相對所述接觸端,以及一設置於所述固持端上方的凹槽;一接電源地線的負極端子,所述負極端子包含一設置於所述絕緣本體中的負極端子本體,以及一設置於所述負極端子本體一側的負極焊接部;一偵測不同設備的信號端子,所述信號端子包含一設置於所述絕緣本體中的信號端子本體,以及一設置於所述信號端子本體一側的焊接部;至少一傳輸數據的傳輸端子,所述傳輸端子設置於所述負極端子與所述信號端子之間,且所述傳輸端子包含一設置於所述絕緣本體中的傳輸端子本體,其中,所述信號端子與所述負極端子相對設置使所述信號焊接部與所述負極焊接部相鄰,且所述信號焊接部與所述負極焊接部位於同一水平面上,並高於所述傳輸端子本體,且外露於所述凹槽;以及一容置於所述凹槽中的積體電路芯片,所述積體電路芯片直接與所述信號焊接部、所述負極焊接部焊接結合,且不與所述傳輸端子本體接觸。 In order to achieve the above object, the present invention provides a universal serial bus connector including an insulating body, the insulating body includes a contact end provided at one end of the insulating body, and a holding end provided at the other end of the insulating body , The holding end is opposite to the contact end, and a groove provided above the holding end; a negative terminal connected to the power ground, the negative terminal includes a negative terminal body provided in the insulating body , And a negative electrode welding portion provided on one side of the negative electrode body; a signal terminal for detecting different devices, the signal terminal includes a signal terminal body provided in the insulating body, and a signal terminal body provided in the A welding part on one side of the signal terminal body; at least one transmission terminal for transmitting data, the transmission terminal is disposed between the negative terminal and the signal terminal, and the transmission terminal includes a A transmission terminal body, wherein the signal terminal and the negative electrode terminal are oppositely arranged such that the signal welding portion is adjacent to the negative electrode welding portion, and the signal welding portion and the negative electrode welding portion are located on the same horizontal plane, and Higher than the transmission terminal body and exposed in the groove; and an integrated circuit chip accommodated in the groove, the integrated circuit chip is directly welded to the signal welding part and the negative electrode Part is welded and does not contact the transmission terminal body.

於本創作中,一絕緣本體,所述絕緣本體包含一設置於所述絕緣本體一端的接觸端、一設置於所述絕緣本體另一端的固持端,所述固 持端相對所述接觸端,以及一設置於所述固持端上方的凹槽;一接電源地線的負極端子,所述負極端子設置於所述絕緣本體中,且所述負極端子包含一負極焊接部,所述負極焊接部外露於所述凹槽;一偵測不同設備的信號端子,所述信號端子設置於所述絕緣本體中,且所述負極端子亦包含一信號焊接部,所述信號焊接部外露於所述凹槽;至少一傳輸數據的傳輸端子,所述傳輸端子設置於所述負極端子與所述信號端子之間,且所述傳輸端子包含一設置於所述絕緣本體中的傳輸端子本體以及一設置於所述傳輸端子本體一端且外露於所述固持部的傳輸連結部,而所述傳輸連結部與所述負極焊接部、所述信號焊接部位於同一水平面上,並高於所述傳輸端子本體;以及一容置於所述凹槽中的積體電路芯片,所述積體電路芯片直接與所述信號焊接部、所述負極焊接部焊接結合,且所述傳輸端子本體不與所述積體電路芯片接觸。 In this creation, an insulating body includes a contact end provided at one end of the insulating body and a holding end provided at the other end of the insulating body. The holding end is opposite to the contact end, and a groove provided above the holding end; a negative terminal connected to the power ground, the negative terminal is provided in the insulating body, and the negative terminal includes a negative electrode A welding part, the negative electrode welding part is exposed in the groove; a signal terminal for detecting different devices, the signal terminal is provided in the insulating body, and the negative electrode terminal also includes a signal welding part, the The signal welding part is exposed in the groove; at least one transmission terminal for transmitting data, the transmission terminal is disposed between the negative terminal and the signal terminal, and the transmission terminal includes a transmission terminal disposed in the insulating body A transmission terminal body and a transmission connection portion provided at one end of the transmission terminal body and exposed to the holding portion, and the transmission connection portion is located on the same horizontal plane as the negative electrode welding portion and the signal welding portion, and Higher than the transmission terminal body; and an integrated circuit chip accommodated in the groove, the integrated circuit chip is directly welded to the signal welding portion and the negative electrode welding portion, and the transmission The terminal body is not in contact with the integrated circuit chip.

於本創作中,所述負極焊接部包含一由所述負極端子本體向上延伸的延伸段、一與所述延伸段連接的U型連接段,以及兩個焊接段,所述焊接段分別設置於所述U型連接段的兩條相互平行的邊上,並平行於所述負極端子本體,且所述U型連接段外露於所述凹槽。 In this creation, the negative electrode welding portion includes an extension section extending upward from the negative electrode terminal body, a U-shaped connection section connected to the extension section, and two welding sections, the welding sections are provided at Two mutually parallel sides of the U-shaped connecting section are parallel to the negative terminal body, and the U-shaped connecting section is exposed to the groove.

於本創作中,所述負極焊接部包含一由所述負極端子本體向上延伸的第一延伸段、一與所述負極端子本體平行的第一焊接段,所述第一焊接段外露於所述凹槽。 In this creation, the negative electrode welding portion includes a first extending section extending upward from the negative electrode terminal body, and a first welding section parallel to the negative electrode terminal body, the first welding section is exposed to the Groove.

於本創作中,所述信號焊接部包含一由所述信號端子本體向上延伸的第二延伸段以及一與所述信號端子本體平行的第二焊接段,所述第二焊接段外露於所述凹槽。 In the present creation, the signal welding portion includes a second extending section extending upward from the signal terminal body and a second welding section parallel to the signal terminal body, the second welding section is exposed to the Groove.

於本創作中,所述傳輸端子包含一由所述傳輸端子本體一端延伸且外露於所述接觸端的傳輸接觸部,且所述傳輸接觸部與所述傳輸連結部的位於同一水平面上,並高於所述傳輸端子本體,使所述傳輸端子呈凹面結構。 In this creation, the transmission terminal includes a transmission contact portion extending from one end of the transmission terminal body and exposed at the contact end, and the transmission contact portion and the transmission connection portion are located on the same horizontal plane and are high The transmission terminal body has a concave structure.

於本創作中,所述負極端子包含一負極端子本體以及一設置於所述負極端子本體一端且外露於所述固持端的負極連結部,且所述負極焊接部靠近所述負極連結部,並與所述負極連結部在同一水平面上。 In this creation, the negative electrode terminal includes a negative electrode body and a negative electrode connection portion provided at one end of the negative electrode body and exposed at the holding end, and the negative electrode welding portion is close to the negative electrode connection portion The negative electrode connecting portions are on the same horizontal plane.

於本創作中,所述信號端子包含一信號端子本體以及一設置於所述信號端子本體一端且外露於所述固持端的信號連結部,且所述信號焊接部靠近所述信號連結部,並與所述信號連結部在同一水平面上。 In the present creation, the signal terminal includes a signal terminal body and a signal connection portion provided at one end of the signal terminal body and exposed at the holding end, and the signal welding portion is close to the signal connection portion The signal connection parts are on the same horizontal plane.

100:通用序列匯流排連接器 100: universal serial bus connector

10:絕緣本體 10: Insulation body

11:接觸端 11: contact end

12:固持端 12: fixed end

13:凹槽 13: groove

20:積體電路芯片 20: Integrated circuit chip

21:積體電路芯片本體 21: Integrated circuit chip body

22:第一引腳 22: first pin

23:第二引腳 23: Second pin

24:第三引腳 24: third pin

30:負極端子 30: negative terminal

30a:負極端子本體 30a: negative terminal body

30b:負極接觸部 30b: negative contact

30c:負極連結部 30c: Negative electrode connection

31:負極焊接部 31: Negative electrode welding part

31a:延伸段 31a: Extension

31b:U型連接段 31b: U-shaped connecting section

31c:焊接段 31c: Welding section

31e:第一延伸段 31e: the first extension

31f:第一焊接段 31f: the first welding section

40:正極端子 40: positive terminal

50:信號端子 50: signal terminal

50a:信號端子本體 50a: Signal terminal body

50b:信號接觸部 50b: Signal contact

50c:信號連結部 50c: Signal connection part

51:信號焊接部 51: Signal welding department

51a:第二延伸段 51a: Second extension

51b:第二焊接段 51b: Second welding section

60:傳輸端子 60: Transmission terminal

60a:傳輸端子本體 60a: Transmission terminal body

60b:傳輸接觸部 60b: Transmission contact

60c:傳輸連結部 60c: Transmission link

61:第一傳輸端子 61: First transmission terminal

62:第二傳輸端子 62: Second transmission terminal

〔第一圖〕係本創作通用序列匯流排連接器之分解圖;〔第二圖〕係本創作通用序列匯流排連接器中負極端子、信號端子以及積體電路芯片之分解圖;〔第三圖〕係本創作通用序列匯流排連接器中負極端子一體成型之立體圖;〔第四圖〕係本創作通用序列匯流排連接器中負極端子在另一實施例之立體圖;〔第五圖〕係本創作通用序列匯流排連接器中負極端子在又另一實施例之立體圖;〔第六圖〕係本創作通用序列匯流排連接器中負極端子、信號端子以及積體電路芯片在另一實施例中連接之立體圖; 〔第七圖〕係本創作通用序列匯流排連接器中傳輸端子之立體圖;〔第八圖〕係本創作通用序列匯流排連接器中負極端子、信號端子以及傳輸端子之剖面圖;〔第九圖〕係本創作通用序列匯流排連接器中負極端子、信號端子以及積體電路芯片在另一實施例中連接之立體圖;〔第十圖〕係習知的通用序列匯流排連接器帶電路板之立體圖。 [The first picture] is an exploded view of the original universal serial bus connector; [The second picture] is an exploded view of the negative terminal, signal terminals and integrated circuit chip in the original universal serial bus connector; [third [Figure 4] is a perspective view of the negative terminal of the universal serial bus connector of the original creation; [Fourth figure] is a perspective view of the negative terminal of the creative universal serial bus connector in another embodiment; [fifth figure] is The perspective view of the negative terminal of the creative universal serial bus connector in yet another embodiment; [sixth figure] is the negative terminal, signal terminal and integrated circuit chip of the creative universal serial bus connector in another embodiment Connected perspective view; [Seventh figure] is a perspective view of the transmission terminal in the universal serial bus connector of this creation; [Eighth figure] is a sectional view of the negative terminal, signal terminal and transmission terminal in the universal serial bus connector of the creation; [Ninth Figure] is a perspective view of the connection of the negative terminal, the signal terminal and the integrated circuit chip of the original universal serial bus connector in another embodiment; [tenth figure] is a conventional universal serial bus connector with a circuit board Perspective view.

為詳細說明本創作之技術內容、構造特徵、所達成的目的及功效,以下茲例舉實施例並配合圖式詳予說明。 In order to explain in detail the technical content, structural features, achieved goals and effects of this creation, the following examples are given in conjunction with the drawings to explain in detail.

請參閱第一圖,本創作通用序列匯流排連接器100包含一絕緣本體10、一積體電路芯片(Integrated Circuit Chip;IC)20、一負極端子30、一正極端子40、一信號端子50以及至少兩個傳輸端子60。 Please refer to the first figure. The universal serial bus connector 100 of the present invention includes an insulating body 10, an integrated circuit chip (IC) 20, a negative terminal 30, a positive terminal 40, a signal terminal 50 and At least two transmission terminals 60.

請參閱第一圖和第二圖,所述絕緣本體10包含一設置於所述絕緣本體10一端的接觸端11,一設置於所述絕緣本體10另一端的固持端12,所述固持端12相對於所述接觸端11;以及一設置於所述固持端12上方的凹槽13。所述凹槽13為配合容置所述積體電路芯片20,所述凹槽13自所述絕緣本體10的表面向下凹陷,使所述積體電路芯片20容置於所述凹槽13中。所述積體電路芯片20包含一積體電路芯片本體21、一具有通信功能,識別各設備並與所述信號端子50連接的第一引腳22、一作為地線,並與設備的負極連接的第二引腳23,以及一作為地線,並與設備的負極連接的第三引腳24。所述第一引腳22與所述第二引腳23分別設置於所述積體電路芯片本體20的同一側面上,而所述第三引腳24設置於相對所述第一引腳22的側面上。 Referring to the first and second figures, the insulating body 10 includes a contact end 11 disposed at one end of the insulating body 10, a holding end 12 disposed at the other end of the insulating body 10, and the holding end 12 Relative to the contact end 11; and a groove 13 disposed above the holding end 12. The groove 13 is for accommodating the integrated circuit chip 20, and the groove 13 is recessed downward from the surface of the insulating body 10 so that the integrated circuit chip 20 is accommodated in the groove 13 in. The integrated circuit chip 20 includes an integrated circuit chip body 21, a first pin 22 having a communication function, identifying each device and connected to the signal terminal 50, and one as a ground wire, and connected to the negative electrode of the device The second pin 23, and a third pin 24 as a ground and connected to the negative terminal of the device. The first pin 22 and the second pin 23 are respectively disposed on the same side of the integrated circuit chip body 20, and the third pin 24 is disposed opposite to the first pin 22 On the side.

請在參閱第一圖,所述負極端子30與所述正極端子40分別設置於所述絕緣本體10的兩側,所述負極端子40為地線,所述正極端子40為所述通用序列匯流排連接器100的電源線,透過所述負極端子30與所述正極端子40,使所述通用序列匯流排連接器100構成一電路。所述傳輸端子60設置於所述負極端子30與所述正極端子40之間,而所述傳輸端子60分別為一第一傳輸端子61以及一第二傳輸端子62,其中,所述第一傳輸端子61為傳輸數據的負極與所述正極端子40相鄰,而所述第二傳輸端子62為傳輸數據的正極與所述負極端子30相鄰。所述信號端子50設置於所述第一傳輸端子61與所述第二傳輸端子62之間,設置為偵測不同設備。 Please refer to the first figure, the negative terminal 30 and the positive terminal 40 are respectively disposed on both sides of the insulating body 10, the negative terminal 40 is a ground wire, and the positive terminal 40 is the universal serial bus The power line of the row connector 100 passes through the negative terminal 30 and the positive terminal 40 to make the universal serial bus connector 100 constitute a circuit. The transmission terminal 60 is disposed between the negative terminal 30 and the positive terminal 40, and the transmission terminal 60 is respectively a first transmission terminal 61 and a second transmission terminal 62, wherein the first transmission The terminal 61 is a negative electrode for transmitting data and is adjacent to the positive terminal 40, and the second transmission terminal 62 is a positive electrode for transmitting data and adjacent to the negative terminal 30. The signal terminal 50 is disposed between the first transmission terminal 61 and the second transmission terminal 62 and is configured to detect different devices.

請一併參閱第一圖至第三圖,所述凹槽13設置於靠近所述負極端子30的一側,便於所述負極端30與所述信號端子50分別與所述積體電路芯片20焊接結合。此外,本創作採用增加所述積體電路芯片20與第二傳輸端子62的之間高度差方式以避免所述第二傳輸端子62誤與所述積體電路芯片20接觸,而影響所述積體電路芯片20的功能。增加所述積體電路芯片20與所述第二傳輸端子62之間的高度差的結構分別如下: 在第一較佳的實施例中,所述負極端子30包含一負極端子本體30a、一設置於所述負極端子本體30a一端且外露於所述接觸端11的負極接觸部30b、一設置於所述負極端子本體30a另一端且外露於所述固持端12的負極連結部30c,以及一設置於所述負極端子本體30a一側的負極焊接部31。所述信號端子50包含一信號端子本體50a、一設置於所述信號端子本體50a一端且外露於所述接觸端11的信號接觸部50b、一設置於所述信號端子 本體50a另一端且外露於所述固持端12的信號連結部50c、一設置於所述信號端子本體50a一側的信號焊接部51。 Please also refer to the first to third figures together, the groove 13 is disposed on a side close to the negative terminal 30, so that the negative terminal 30 and the signal terminal 50 are respectively connected to the integrated circuit chip 20 Welding combined. In addition, the author adopts a method of increasing the height difference between the integrated circuit chip 20 and the second transmission terminal 62 to avoid the second transmission terminal 62 from erroneously contacting the integrated circuit chip 20 and affecting the product Function of body circuit chip 20. The structures for increasing the height difference between the integrated circuit chip 20 and the second transmission terminal 62 are as follows: In the first preferred embodiment, the negative terminal 30 includes a negative terminal body 30a, a negative contact portion 30b disposed at one end of the negative terminal body 30a and exposed at the contact end 11, and a The negative electrode connecting portion 30c at the other end of the negative electrode terminal body 30a and exposed at the holding end 12, and a negative electrode welding portion 31 provided on the negative electrode terminal body 30a side. The signal terminal 50 includes a signal terminal body 50a, a signal contact portion 50b disposed at one end of the signal terminal body 50a and exposed at the contact end 11, and a signal terminal 50b disposed at the signal terminal The signal connecting portion 50c at the other end of the body 50a and exposed at the holding end 12, and a signal welding portion 51 provided on the signal terminal body 50a side.

所述負極端子30與所述信號端子50相對設置使所述負極焊接部31與信號焊接部51相鄰。且其中,所述負極焊接部31包含一由所述負極端子本體30a向上延伸的延伸段31a、一與所述延伸段31a連接的U型連接段31b,以及兩個焊接段31c,所述焊接段31c分別設置於所述U型連接段31b的兩條相互平行的邊上。具體地,所述延伸段31a較高的一端連接於所述U型連接段31b其中一端的所述焊接段31c,使所述U型連接段31b的開口朝向所述負極端子本體30a,並使所述U型連接段31b高於所述負極端子本體30a,且所述焊接段31c平行於所述負極端子本體30a,進而使所述所述U形連接段31b與所述焊接段31c位於同一水平面上,且高於所述負極端本體30a。且所述U型連接段31c外露於所述凹槽13,以利於所述積體電路芯片20中的所述第二引腳23與所述第三引腳24分別與所述焊接段31c連接。而所述信號焊接部51同樣外露於所述凹槽13,所述信號焊接部51包含一由所述信號端子本體50a向上延伸的第二延伸段51a以及一與所述信號端子本體50a平行的第二焊接段51b。所述第二焊接段51b的一端連接於所述第二延伸段51a較高的一端,使所述第二焊接段51b、所述U形連接段31b以及所述焊接段31c位於同一水平面上,並高於所述信號端子本體50a。且所述第二焊接段51b與所述第一引腳22連接。 The negative electrode terminal 30 is disposed opposite to the signal terminal 50 so that the negative electrode welding portion 31 is adjacent to the signal welding portion 51. And, wherein the negative electrode welding portion 31 includes an extension section 31a extending upward from the negative electrode terminal body 30a, a U-shaped connection section 31b connected to the extension section 31a, and two welding sections 31c, the welding The segments 31c are respectively disposed on two parallel sides of the U-shaped connecting segment 31b. Specifically, the higher end of the extension section 31a is connected to the welding section 31c at one end of the U-shaped connection section 31b, so that the opening of the U-shaped connection section 31b faces the negative electrode terminal body 30a, and The U-shaped connecting section 31b is higher than the negative terminal body 30a, and the welding section 31c is parallel to the negative terminal body 30a, so that the U-shaped connecting section 31b and the welding section 31c are located at the same On the horizontal plane, and higher than the negative terminal body 30a. And the U-shaped connecting section 31c is exposed in the groove 13 to facilitate the connection of the second pin 23 and the third pin 24 in the integrated circuit chip 20 to the soldering section 31c, respectively . The signal soldering portion 51 is also exposed in the groove 13. The signal soldering portion 51 includes a second extension 51 a extending upward from the signal terminal body 50 a and a parallel to the signal terminal body 50 a Second welding section 51b. One end of the second welding section 51b is connected to the higher end of the second extension section 51a, so that the second welding section 51b, the U-shaped connecting section 31b and the welding section 31c are located on the same horizontal plane, It is higher than the signal terminal body 50a. And the second welding section 51b is connected to the first pin 22.

藉由所述負極焊接部31和所述信號焊接部51分別由負極端子本體30a與所述信號端子本體50a向上延伸以致抬高了所述負極焊接部31與所述信號焊接部51到所述傳輸端子本體60a的距離,進而避免了所述 負極焊接部31與所述信號焊接部51分別與所述積體電路芯片20焊接接合時接觸到所述傳輸端子本體60a,而影響所述積體電路芯片20的功能。 With the negative electrode welding portion 31 and the signal welding portion 51 extending upward from the negative electrode terminal body 30a and the signal terminal body 50a, respectively, the negative electrode welding portion 31 and the signal welding portion 51 are raised to the The distance of the transmission terminal body 60a, thereby avoiding the The negative electrode welding portion 31 and the signal welding portion 51 are in contact with the transmission terminal body 60a when they are welded to the integrated circuit chip 20, respectively, and affect the function of the integrated circuit chip 20.

請參閱第三圖,為了確保所述U型連接段31b位在同一水平面上,以避免所述積體電路芯片20與所述第二傳輸端子62接觸。在第四圖的第二較佳的實施例中,所述負極焊接部31單獨一體成型再進一步與所述負極端子30焊接結合。在本實施例中,所述負極端子30包含一負極端子本體30a,一設置於所述負極端子本體30a一端且外露於所述接觸端11的負極接觸部30b,一設置於所述負極端子本體30a另一端且外露於所述固持端12的負極連結部30c以及一焊接區30d,所述焊接區30d設置於所述負極端子本體30a靠近所述負極連結部30c的一側。而所述負極焊接部31包含一向上延伸的延伸段31a、一與所述延伸段31a連接的U型連接段31b,以及兩個焊接段31c。所述焊接段31c分別設置於所述U型連接段31b的兩條相互平行的邊上。具體地,所述延伸段31a較高的一端連接於所述U型連接段31b其中一端的所述焊接段31c,使所述U型連接段31b的開口朝向所述負極端子本體30a,並使所述U型連接段31b高於所述負極端子本體30a,且所述焊接段31c平行於所述負極端子本體30a,進而使所述所述U形連接段31b與所述焊接段31c位於同一水平面上,並高於所述負極端本體30a。透過將所述延伸段31a較低的一端與所述焊接區30d焊接結合,使U型連接段31b始終位在同一水平面上,進而避免了所述積體電路晶片20在與所述負極焊接部31、所述信號焊接部51連接時接觸所述第二傳輸端子62。 Please refer to the third figure, in order to ensure that the U-shaped connecting section 31b is located on the same horizontal plane, so as to prevent the integrated circuit chip 20 from contacting the second transmission terminal 62. In the second preferred embodiment of the fourth drawing, the negative electrode welding portion 31 is integrally formed separately and then further welded and combined with the negative electrode terminal 30. In this embodiment, the negative electrode terminal 30 includes a negative electrode terminal body 30a, a negative electrode contact portion 30b disposed at one end of the negative electrode terminal body 30a and exposed at the contact end 11, and a negative electrode contact body 30b disposed at the negative electrode terminal body At the other end of 30a and exposed to the negative electrode connecting portion 30c of the holding end 12 and a welding area 30d, the welding area 30d is disposed on the side of the negative electrode terminal body 30a close to the negative electrode connecting portion 30c. The negative electrode welding portion 31 includes an upward extending portion 31a, a U-shaped connecting portion 31b connected to the extending portion 31a, and two welding portions 31c. The welding sections 31c are respectively disposed on two parallel sides of the U-shaped connecting section 31b. Specifically, the higher end of the extension section 31a is connected to the welding section 31c at one end of the U-shaped connection section 31b, so that the opening of the U-shaped connection section 31b faces the negative terminal body 30a, and The U-shaped connecting section 31b is higher than the negative terminal body 30a, and the welding section 31c is parallel to the negative terminal body 30a, so that the U-shaped connecting section 31b and the welding section 31c are located at the same On the horizontal plane, and higher than the negative electrode end body 30a. By welding the lower end of the extension section 31a to the welding zone 30d, the U-shaped connection section 31b is always located on the same horizontal plane, thereby avoiding the integrated circuit chip 20 from being welded to the negative electrode 31. The signal welding portion 51 contacts the second transmission terminal 62 when connected.

請參閱第一圖、第五圖和第六圖,為進一步簡化所述負極端子30的結構,在第三較佳的實施例中,所述第一引腳22和所述第二引腳23 為通信功能,識別各設備需與所述信號端子50連接;而所述第三引腳24為地線,需與設備的負極連接。所述負極端子30包含一負極端子本體30a、一設置於所述負極端子本體30a一端且外露於所述接觸端11的負極接觸部30b,一設置於所述負極端子本體30a另一端且外露於所述固持端12的負極連結端30c,以及一設置於所述負極端子本體30a一側的焊接部31。所述焊接部31外露於所述凹槽13,且所述焊接部31包含一由所述負極端子本體30a向上延伸的第一延伸段31e以及一與所述負極端子本體30a平行的第一焊接段31f。所述第一焊接段31f的一端連接於所述第一延伸段31e較高的一端,使所述第一焊接段31f高於所述負極端本體30a。藉由所述第一延伸段31e抬高了所述第一焊接段31f到所述傳輸端子本體60a的距離,使所述第一焊接段31f與所述第三引腳24連接,所述第一引腳22與所述第二引腳23分別連接於第二焊接段51b時,所述第一焊接段31c和所述第二焊接段51b分別抬高了所述積體電路芯片20到所述第二傳輸端子62的距離,避免了與所述積體電路芯片20與所述第二傳輸端子62接觸。 Please refer to the first, fifth and sixth figures, in order to further simplify the structure of the negative terminal 30, in the third preferred embodiment, the first pin 22 and the second pin 23 For the communication function, the identification of each device needs to be connected to the signal terminal 50; and the third pin 24 is a ground wire, which needs to be connected to the negative electrode of the device. The negative terminal 30 includes a negative terminal body 30a, a negative contact portion 30b disposed at one end of the negative terminal body 30a and exposed at the contact end 11, and a negative terminal contact 30b disposed at the other end of the negative terminal body 30a and exposed at The negative electrode connecting end 30c of the holding end 12 and a welding portion 31 provided on the side of the negative electrode terminal body 30a. The welding portion 31 is exposed from the groove 13, and the welding portion 31 includes a first extension 31 e extending upward from the negative terminal body 30 a and a first welding parallel to the negative terminal body 30 a Paragraph 31f. One end of the first welding section 31f is connected to the higher end of the first extension section 31e, so that the first welding section 31f is higher than the negative electrode end body 30a. The distance between the first welding section 31f and the transmission terminal body 60a is raised by the first extension section 31e, so that the first welding section 31f is connected to the third pin 24, and the first When a pin 22 and the second pin 23 are respectively connected to the second welding section 51b, the first welding section 31c and the second welding section 51b respectively raise the integrated circuit chip 20 to the The distance of the second transmission terminal 62 avoids contact with the integrated circuit chip 20 and the second transmission terminal 62.

請參閱第七圖至第九圖,為進一步簡化所述負極端子30與所述信號端子50的結構,在第四較佳的實施例中,所述負極端子30包含一負極端子本體30a、一設置於所述負極端子本體30a一端且外露於所述接觸端11的負極接觸部30b、一設置於所述負極端子本體30a另一端且外露於所述固持端12的負極連結部30c,以及一負極焊接部31,所述負極焊接部31靠近所述負極連結部30c,並與所述負極連結部30c在同一水平面上。所述信號端子50包含一信號端子本體50a、一設置於所述信號端子本體50a一端且外露於所述接觸端11的信號接觸部50b、一設置於所述信號端子本體50a另一 端且外露於所述固持端12的信號連結部50c、以及一信號焊接部51,所述信號焊接部51靠近所述信號連結部50c,並與所述信號連結部50c在同一水平面上。所述負極焊接部31與所述信號焊接部51分別外露於所述凹槽13。在這一實施例中,所述傳輸端子60包含一傳輸端子本體60a、一設置於所述傳輸端子本體60a一端且外露於所述接觸端11的傳輸接觸部60b、一設置於所述傳輸端子本體60a另一端且外露於所述固持端12的傳輸連結部60c。具體地,所述傳輸接觸部60b與所述傳輸連結部60c分別從所述傳輸端子本體60a的兩端先往上延伸再水準往外延伸,使所述傳輸接觸部60b與所述傳輸連結部60c位於同一水平面上,並高於所述傳輸端子本體60a,進而使所述傳輸端子60呈凹面結構。而所述負極焊接部31、信號焊接部51亦與所述傳輸連結部60c位於同一水平面上,並高於所述傳端子本體60a。藉由傳輸端子60呈凹面結構,使所述傳輸端子本體60a到所述負極焊接部31、所述信號焊接部51的距離增大,以避免了與所述積體電路芯片20接觸而影響其功能性。 Please refer to the seventh to ninth figures. In order to further simplify the structure of the negative terminal 30 and the signal terminal 50, in a fourth preferred embodiment, the negative terminal 30 includes a negative terminal body 30a, a A negative electrode contact portion 30b provided at one end of the negative electrode terminal body 30a and exposed at the contact end 11, a negative electrode connection portion 30c provided at the other end of the negative electrode terminal body 30a and exposed at the holding end 12, and a The negative electrode welding portion 31 is close to the negative electrode connecting portion 30c and is on the same horizontal plane as the negative electrode connecting portion 30c. The signal terminal 50 includes a signal terminal body 50a, a signal contact portion 50b disposed at one end of the signal terminal body 50a and exposed at the contact end 11, and another disposed at the signal terminal body 50a The signal connecting portion 50c at the end and exposed to the holding end 12 and a signal welding portion 51 are close to the signal connecting portion 50c and on the same horizontal plane as the signal connecting portion 50c. The negative electrode welding portion 31 and the signal welding portion 51 are exposed from the groove 13 respectively. In this embodiment, the transmission terminal 60 includes a transmission terminal body 60a, a transmission contact portion 60b disposed at one end of the transmission terminal body 60a and exposed at the contact end 11, and a transmission terminal 60b disposed at the transmission terminal The other end of the body 60a is exposed to the transmission link 60c of the holding end 12. Specifically, the transmission contact portion 60b and the transmission connection portion 60c respectively extend upward from the two ends of the transmission terminal body 60a and then extend outward horizontally, so that the transmission contact portion 60b and the transmission connection portion 60c It is located on the same horizontal plane and is higher than the transmission terminal body 60a, so that the transmission terminal 60 has a concave structure. The negative electrode welding portion 31 and the signal welding portion 51 are also located on the same horizontal plane as the transmission connection portion 60c and higher than the transmission terminal body 60a. Since the transmission terminal 60 has a concave structure, the distance from the transmission terminal body 60a to the negative electrode welding portion 31 and the signal welding portion 51 is increased to avoid contact with the integrated circuit chip 20 and affecting it Feature.

綜上所述,通過所述負極焊接部31與所述信號焊接部51的抬高至高於所述傳輸端子60,或者所述傳端子本體60a結構設計拉低於所述所述負極焊接部31與所述信號焊接部51,以致所述積體電路芯片20的引腳直接分別焊接於所述負極端子30與所述信號端子50,避免了與所述傳輸端子60接觸,影響所述積體電路芯片20的功能,進而能節省電路板焊接的製程,達到有效節約成本簡化製程的效果。 In summary, the elevation of the negative electrode welding portion 31 and the signal welding portion 51 is higher than the transmission terminal 60, or the structure design of the transmission terminal body 60a is lower than the negative electrode welding portion 31 And the signal welding portion 51, so that the pins of the integrated circuit chip 20 are directly welded to the negative terminal 30 and the signal terminal 50, respectively, to avoid contact with the transmission terminal 60 and affect the integrated body The function of the circuit chip 20 can further save the welding process of the circuit board, and achieve the effect of effectively saving costs and simplifying the manufacturing process.

100:通用序列匯流排連接器 100: universal serial bus connector

10:絕緣本體 10: Insulation body

11:接觸端 11: contact end

12:固持端 12: fixed end

13:凹槽 13: groove

20:積體電路芯片 20: Integrated circuit chip

30:負極端子 30: negative terminal

30a:負極端子本體 30a: negative terminal body

30b:負極接觸部 30b: negative contact

30c:負極連結部 30c: Negative electrode connection

31b:U型連接段 31b: U-shaped connecting section

40:正極端子 40: positive terminal

50:信號端子 50: signal terminal

50a:信號端子本體 50a: Signal terminal body

50c:信號連結部 50c: Signal connection part

60:傳輸端子 60: Transmission terminal

61:第一傳輸端子 61: First transmission terminal

62:第二傳輸端子 62: Second transmission terminal

Claims (8)

一種通用序列匯流排連接器,包含一絕緣本體,所述絕緣本體包含一設置於所述絕緣本體一端的接觸端、一設置於所述絕緣本體另一端的固持端,所述固持端相對所述接觸端,以及一設置於所述固持端上方的凹槽;一接電源地線的負極端子,所述負極端子包含一設置於所述絕緣本體中的負極端子本體,以及一設置於所述負極端子本體一側的負極焊接部;一偵測不同設備的信號端子,所述信號端子包含一設置於所述絕緣本體中的信號端子本體,以及一設置於所述信號端子本體一側的焊接部;至少一傳輸數據的傳輸端子,所述傳輸端子設置於所述負極端子與所述信號端子之間,且所述傳輸端子包含一設置於所述絕緣本體中的傳輸端子本體,其中,所述信號端子與所述負極端子相對設置使所述信號焊接部與所述負極焊接部相鄰,且所述信號焊接部與所述負極焊接部位於同一水平面上,並高於所述傳輸端子本體,且外露於所述凹槽;以及一容置於所述凹槽中的積體電路芯片,所述積體電路芯片直接與所述信號焊接部、所述負極焊接部焊接結合,且不與所述傳輸端子本體接觸。 A universal serial bus connector includes an insulating body, the insulating body includes a contact end disposed at one end of the insulating body, and a holding end disposed at the other end of the insulating body, the holding end is opposite to the A contact end, and a groove provided above the holding end; a negative terminal connected to the power ground, the negative terminal includes a negative terminal body provided in the insulating body, and a negative terminal provided in the negative electrode A negative electrode welding part on the side of the terminal body; a signal terminal for detecting different devices, the signal terminal including a signal terminal body provided in the insulating body, and a welding part provided on the signal terminal body side At least one transmission terminal that transmits data, the transmission terminal is disposed between the negative terminal and the signal terminal, and the transmission terminal includes a transmission terminal body disposed in the insulating body, wherein, the The signal terminal is arranged opposite to the negative terminal so that the signal welding portion is adjacent to the negative electrode welding portion, and the signal welding portion and the negative electrode welding portion are located on the same horizontal plane and higher than the transmission terminal body, And exposed to the groove; and an integrated circuit chip accommodated in the groove, the integrated circuit chip is directly welded to the signal welding portion and the negative electrode welding portion, and is not The transmission terminal body contacts. 一種通用序列匯流排連接器,包含一絕緣本體,所述絕緣本體包含一設置於所述絕緣本體一端的接觸端、一設置於所述絕緣本體另一端的固持端,所述固持端相對所述接觸端,以及一設置於所述固持端上方的凹槽;一接電源地線的負極端 子,所述負極端子設置於所述絕緣本體中,且所述負極端子包含一負極焊接部,所述負極焊接部外露於所述凹槽;一偵測不同設備的信號端子,所述信號端子設置於所述絕緣本體中,且所述負極端子亦包含一信號焊接部,所述信號焊接部外露於所述凹槽;至少一傳輸數據的傳輸端子,所述傳輸端子設置於所述負極端子與所述信號端子之間,且所述傳輸端子包含一設置於所述絕緣本體中的傳輸端子本體以及一設置於所述傳輸端子本體一端且外露於所述固持部的傳輸連結部,而所述傳輸連結部與所述負極焊接部、所述信號焊接部位於同一水平面上,並高於所述傳輸端子本體;以及一容置於所述凹槽中的積體電路芯片,所述積體電路芯片直接與所述信號焊接部、所述負極焊接部焊接結合,且所述傳輸端子本體不與所述積體電路芯片接觸。 A universal serial bus connector includes an insulating body, the insulating body includes a contact end disposed at one end of the insulating body, and a holding end disposed at the other end of the insulating body, the holding end is opposite to the A contact end and a groove provided above the holding end; a negative end connected to the power ground The negative terminal is provided in the insulating body, and the negative terminal includes a negative welding part, the negative welding part is exposed in the groove; a signal terminal for detecting different devices, the signal terminal It is disposed in the insulating body, and the negative electrode terminal also includes a signal welding portion, the signal welding portion is exposed to the groove; at least one transmission terminal for transmitting data, the transmission terminal is disposed at the negative terminal And the signal terminal, and the transmission terminal includes a transmission terminal body disposed in the insulating body and a transmission connection portion disposed at one end of the transmission terminal body and exposed to the holding portion, and The transmission connection part is on the same horizontal plane as the negative electrode welding part and the signal welding part and is higher than the transmission terminal body; and an integrated circuit chip accommodated in the groove, the integrated body The circuit chip is directly welded to the signal welding part and the negative electrode welding part, and the transmission terminal body is not in contact with the integrated circuit chip. 如申請專利範圍第1項所述之通用序列匯流排連接器,其中所述負極焊接部包含一由所述負極端子本體向上延伸的延伸段、一與所述延伸段連接的U型連接段,以及兩個焊接段,所述焊接段分別設置於所述U型連接段的兩條相互平行的邊上,並平行於所述負極端子本體,且所述U型連接段外露於所述凹槽。 The universal serial bus connector as described in item 1 of the patent scope, wherein the negative electrode welding portion includes an extension extending upward from the negative terminal body, and a U-shaped connection segment connected to the extension, And two welding sections, which are respectively disposed on two mutually parallel sides of the U-shaped connecting section and parallel to the negative terminal body, and the U-shaped connecting section is exposed to the groove . 如申請專利範圍第1項所述之通用序列匯流排連接器,其中所述負極焊接部包含一由所述負極端子本體向上延伸的第一延 伸段、一與所述負極端子本體平行的第一焊接段,所述第一焊接段外露於所述凹槽。 The universal serial bus connector as described in item 1 of the patent application scope, wherein the negative electrode welding portion includes a first extension extending upward from the negative electrode terminal body An extension section, a first welding section parallel to the negative terminal body, the first welding section is exposed to the groove. 如申請專利範圍第1項所述之通用序列匯流排連接器,其中所述信號焊接部包含一由所述信號端子本體向上延伸的第二延伸段以及一與所述信號端子本體平行的第二焊接段,所述第二焊接段外露於所述凹槽。 The universal serial bus connector as described in item 1 of the patent application scope, wherein the signal soldering portion includes a second extension extending upward from the signal terminal body and a second parallel to the signal terminal body In the welding section, the second welding section is exposed to the groove. 如申請專利範圍第2項所述之通用序列匯流排連接器,其中所述傳輸端子包含一由所述傳輸端子本體一端延伸且外露於所述接觸端的傳輸接觸部,且所述傳輸接觸部與所述傳輸連結部的位於同一水平面上,並高於所述傳輸端子本體,使所述傳輸端子呈凹面結構。 The universal serial bus connector as described in item 2 of the patent application scope, wherein the transmission terminal includes a transmission contact portion extending from one end of the transmission terminal body and exposed to the contact end, and the transmission contact portion is The transmission connection part is located on the same horizontal plane and is higher than the transmission terminal body, so that the transmission terminal has a concave structure. 如申請專利範圍第2項所述之通用序列匯流排連接器,其中所述負極端子包含一負極端子本體以及一設置於所述負極端子本體一端且外露於所述固持端的負極連結部,且所述負極焊接部靠近所述負極連結部,並與所述負極連結部在同一水平面上。 The universal serial bus connector as described in item 2 of the patent application scope, wherein the negative terminal includes a negative terminal body and a negative electrode connecting portion provided at one end of the negative terminal body and exposed at the holding end, and the The negative electrode welding portion is close to the negative electrode connecting portion and is on the same horizontal plane as the negative electrode connecting portion. 如申請專利範圍第2項所述之通用序列匯流排連接器,其中所述信號端子包含一信號端子本體以及一設置於所述信號端子本體一端且外露於所述固持端的信號連結部,且所述信號焊接部靠近所述信號連結部,並與所述信號連結部在同一水平面上。 The universal serial bus connector as described in item 2 of the patent application scope, wherein the signal terminal includes a signal terminal body and a signal connection portion provided at one end of the signal terminal body and exposed at the holding end, and the The signal welding portion is close to the signal connection portion and is on the same horizontal plane as the signal connection portion.
TW109200002U 2020-01-02 2020-01-02 Usb connector TWM596466U (en)

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