TWM595214U - Size measurement apparatus - Google Patents

Size measurement apparatus Download PDF

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Publication number
TWM595214U
TWM595214U TW109202050U TW109202050U TWM595214U TW M595214 U TWM595214 U TW M595214U TW 109202050 U TW109202050 U TW 109202050U TW 109202050 U TW109202050 U TW 109202050U TW M595214 U TWM595214 U TW M595214U
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Taiwan
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information
size
shooting
image
inspection
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TW109202050U
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Chinese (zh)
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林映碩
郭中夷
許毓婷
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鉅祥企業股份有限公司
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Publication of TWM595214U publication Critical patent/TWM595214U/en

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Abstract

A size measurement apparatus is provided. Multiple captured images are combined to form a whole-body image, size information of multiple check portions is determined according to inspection information, and whether the size information of the whole body image is conformed to the corresponding specification size is determined, so as to obtain an inspection result. The whole body includes the whole of the object under test. Each captured image is corresponding to one of capturing portions of the object under test. The inspection information includes those check portions and the corresponding specification size thereof. Accordingly, the measure and inspection procedures can be completed automatically, so as to reduce time and manpower.

Description

尺寸量測裝置Dimensional measuring device

本新型創作是有關於一種檢測技術,且特別是有關於一種尺寸量測裝置。This new creation is about a detection technique, and especially about a size measurement device.

現有對於產品的尺寸量測技術,一直都是使用傳統投影機來進行人工量測。可想而知,現有量測方式的量測時間相當長,且遇到要輸出製程能力指標(Process Capability Index,CPK)報表(連續量測20~50件數(pieces,PCS)不等的產品偏差值比較)的情況還會花費更多時間。人工量測數據、手工抄寫、數據統整等程序無限循環,不僅耗費大量工時,更造成人力成本。若不幸遇到檢測人員疲勞,將導致作業疏失及誤判發生。此外,若人員作業呆板,更可能造成人員流動快,教育訓練成本高,進而造成產品成本提高之窘境。The existing size measurement technology for products has always used traditional projectors for manual measurement. It is conceivable that the measurement time of the existing measurement method is quite long, and encounters products that need to output Process Capability Index (CPK) reports (continuous measurement of 20-50 pieces (PCS)) The deviation value comparison will also take more time. Manual measurement of data, manual copying, data integration and other procedures in an infinite loop not only consume a lot of man-hours, but also cause manpower costs. If unfortunately encounters the fatigue of the inspector, it will lead to operation negligence and misjudgment. In addition, if the personnel work is stiff, it is more likely to cause rapid staff turnover and high education and training costs, which will cause the dilemma of increasing product costs.

有鑑於此,本新型創作提供一種尺寸量測裝置,其可自動化控制拍攝、尺寸量測及驗證程序,不僅有效率更能避免人工問題。In view of this, the new creation provides a size measurement device, which can automatically control the shooting, size measurement and verification procedures, which is not only efficient but also avoids manual problems.

本新型創作的尺寸量測裝置,其用於檢測待測物。此尺寸量測裝置包括但不僅限於影像擷取裝置及處理器。影像擷取裝置分別對待測物的數個拍攝部分拍攝,以取得多張擷取影像。各擷取影像針對待測物的一個拍攝部分。處理器耦接影像擷取裝置,並經配置用以執行下列步驟:將那些擷取影像組合成一張整體影像;依據檢驗資訊判斷此整體影像中的數個檢測部分的尺寸資訊;判斷整體影像的尺寸資訊是否符合對應的那些規範尺寸,並據以得出檢驗結果。整體影像包括完整的待測物。檢驗資訊包括待測物的那些檢測部分及對應的數個規範尺寸。The size measuring device created by the new model is used to detect the object to be measured. The size measuring device includes but is not limited to an image capturing device and a processor. The image capturing device separately shoots several shooting parts of the object to be measured to obtain multiple captured images. Each captured image is directed to a shooting part of the object to be measured. The processor is coupled to the image capture device and is configured to perform the following steps: combine those captured images into a whole image; determine the size information of several detection parts in the whole image based on the inspection information; determine the size of the whole image Whether the size information conforms to the corresponding standard sizes, and the inspection results are obtained accordingly. The overall image includes the complete test object. The inspection information includes those test parts of the analyte and corresponding specifications.

基於上述,本新型創作實施例的尺寸量測裝置改變影像擷取裝置與待測物的相對位置以形成針對待測物上的數個拍攝部位的對應擷取影像,將這些擷取影像組合成涵蓋待測物整體的一張整體影像,並對此整體影像量測對應檢測部分的尺寸資訊,且據以驗證與規範尺寸的符合程度。藉此,可量測例如88×75公厘(mm)甚至更大尺寸的工業製品,並整合軟體及硬體控制,以自動化操作達到縮時省力的效果。Based on the above, the size measuring device of the novel creation embodiment changes the relative position of the image capturing device and the object to be measured to form corresponding captured images for several shooting parts on the object to be measured, and combines these captured images into A whole image covering the whole object to be measured, and measuring the size information of the corresponding detection part on the whole image, and verifying the conformity with the standard size based on this. In this way, industrial products such as 88×75 mm (mm) or even larger sizes can be measured, and software and hardware controls are integrated to achieve time-saving and labor-saving effects through automated operation.

為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the creation of the new model more obvious and understandable, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

圖1是依據本新型創作一實施例的尺寸量測裝置100的元件方塊圖。請參照圖1,尺寸量測裝置100包括但不僅限於影像擷取裝置110、光源120、移動機構130、儲存器140及處理器150。FIG. 1 is a block diagram of components of a size measurement device 100 according to an embodiment of the present invention. Please refer to FIG. 1, the size measuring device 100 includes but is not limited to an image capturing device 110, a light source 120, a moving mechanism 130, a storage 140 and a processor 150.

影像擷取裝置110可以是相機、攝影機等裝置,影像擷取裝置110並可以包括影像感測器(例如,電荷耦合裝置(Charge Coupled Device,CCD)、互補式金氧半導體(Complementary Metal-Oxide-Semiconductor,CMOS)等)、光學鏡頭、影像控制電路等元件。在一實施例中,影像擷取裝置110包括的鏡頭規格(例如,取像光圈、倍率、焦距、取像可視角度、影像感測器大小及畫素等)可能不同,且其數量可依據實際需求而調整。The image capturing device 110 may be a device such as a camera or a video camera. The image capturing device 110 may include an image sensor (for example, a charge coupled device (Charge Coupled Device, CCD), a complementary metal oxide semiconductor (Complementary Metal-Oxide- Semiconductor, CMOS, etc.), optical lens, image control circuit and other components. In one embodiment, the lens specifications included in the image capture device 110 (eg, aperture, magnification, focal length, viewing angle, image sensor size, pixels, etc.) may be different, and the number may be based on the actual Adjust to demand.

光源120可以是同軸光源、背光光源、環形罩光源、條形光源、點光源、條形光源所組成可旋轉邊框光源或其他類型光源。在一實施例中,光源120的數量可依據實際需求而調整,且這些光源120所提供的亮度分布也可能調整。The light source 120 may be a rotatable frame light source composed of a coaxial light source, a backlight light source, a ring-shaped light source, a bar light source, a point light source, a bar light source, or other types of light sources. In one embodiment, the number of light sources 120 may be adjusted according to actual needs, and the brightness distribution provided by these light sources 120 may also be adjusted.

移動機構130可以是機械手臂、高度調整台、滑軌、滑台、轉台、螺桿、馬達、或汽缸等各類型可驅動連接元件移動或旋轉的機械構件或其組合。在一實施例中,移動機構130可驅動放置的待測物(例如,各類型製品或產品)能升降、移動及/或旋轉。例如,移動機構130可提供平台放置待測物或夾持待測物。在另一實施例中,移動機構130耦接影像擷取裝置110及/或光源120,並使影像擷取裝置110及/或光源120可相對於尺寸量測裝置100的主體進行一軸、二軸或更多軸的運動。例如,影像擷取裝置110或光源120可升降、移動、及/或旋轉。The moving mechanism 130 may be a mechanical arm, a height adjustment table, a slide rail, a slide table, a turntable, a screw, a motor, or a cylinder, or other types of mechanical components that can drive the connecting element to move or rotate, or a combination thereof. In one embodiment, the moving mechanism 130 can drive the placed test object (for example, various types of products or products) to be able to move up, down, and/or rotate. For example, the moving mechanism 130 may provide a platform for placing the object under test or clamping the object under test. In another embodiment, the moving mechanism 130 is coupled to the image capturing device 110 and/or the light source 120, and enables the image capturing device 110 and/or the light source 120 to perform one axis and two axes relative to the main body of the size measuring device 100 Or more axis movements. For example, the image capturing device 110 or the light source 120 can be raised, lowered, moved, and/or rotated.

儲存器140可以是任何型態的固定或可移動隨機存取記憶體(Radom Access Memory,RAM)、唯讀記憶體(Read Only Memory,ROM)、快閃記憶體(flash memory)、傳統硬碟(Hard Disk Drive,HDD)、固態硬碟(Solid-State Drive,SSD)或類似元件,並用以記錄程式碼、軟體模組(例如,拍攝控制模組141、影像組合模組143、檢驗模組145等)、擷取影像、整體影像、檢驗資訊、影像辨識演算法、影像處理演算法、尺寸資訊、規範資訊、檢驗結果、移動機構130的驅動程式、移動機構130相關的移動資訊及其他資料或檔案,其詳細內容待後續實施例詳述。The storage 140 may be any type of fixed or removable random access memory (RAM), read only memory (Read Only Memory, ROM), flash memory (flash memory), or traditional hard disk (Hard Disk Drive, HDD), Solid-State Drive (SSD) or similar components, and used to record code, software modules (for example, shooting control module 141, image combination module 143, inspection module 145, etc.), captured images, overall images, inspection information, image recognition algorithms, image processing algorithms, size information, specification information, inspection results, drivers of mobile mechanism 130, mobile information related to mobile mechanism 130, and other data Or archives, the detailed content of which will be detailed in subsequent embodiments.

處理器150耦接影像擷取裝置110、光源120、移動機構130及儲存器140,處理器150並可以是中央處理器(Central Processing Unit,CPU)、微控制器、可程式化控制器、特殊應用積體電路(Application-Specific Integrated Circuit,ASIC)、晶片或其他類似元件或上述元件的組合。於本實施例中,處理器150控制尺寸量測裝置100的所有運作,例如,驅動移動機構130,控制影像擷取裝置110及光源120的功能(例如,開關、拍攝、明暗、至少一軸向的運動等)。此外,處理器150可存取並載入儲存器140所記錄的軟體、資料或檔案。The processor 150 is coupled to the image capturing device 110, the light source 120, the moving mechanism 130, and the storage 140. The processor 150 may also be a central processing unit (CPU), microcontroller, programmable controller, special Application Integrated Circuit (Application-Specific Integrated Circuit, ASIC), chip or other similar components or a combination of the above components. In this embodiment, the processor 150 controls all operations of the size measurement device 100, for example, drives the moving mechanism 130, and controls the functions of the image capturing device 110 and the light source 120 (eg, switching, shooting, shading, at least one axis Sports, etc.). In addition, the processor 150 can access and load the software, data, or files recorded in the storage 140.

為了方便理解本新型創作實施例的操作流程,以下將舉諸多實施例詳細說明本新型創作實施例中針對待測物的尺寸量測及檢驗的流程。下文中,將搭配尺寸量測裝置100中的各項裝置、元件及模組說明本新型創作實施例所述之方法。本方法的各個流程可依照實施情形而隨之調整,且並不僅限於此。In order to facilitate the understanding of the operation flow of the novel creation embodiment, a number of embodiments will be given below to describe in detail the flow of the size measurement and inspection of the object to be measured in the novel creation embodiment. In the following, the methods described in the new creative embodiment will be described with various devices, components and modules in the size measuring device 100. The various processes of the method can be adjusted according to the implementation situation, and it is not limited to this.

圖2是依據本新型創作一實施例的尺寸量測方法的流程圖。請參照圖2,影像組合模組143將多張擷取影像組合成整體影像(步驟S210)。具體而言,各擷取影像是針對一個待測物的數個拍攝部分中的一者。尺寸量測裝置100可提供使用者介面(例如,透過顯示器)供使用者輸入待測物的識別資訊(例如,料號、產編、序號、或型號等),處理器150可依據待測物的識別資訊而自儲存器140或自網路下載此待測物對應的檢驗資訊、移動資訊及/或拍攝參數。FIG. 2 is a flowchart of a size measurement method according to an embodiment of the novel creation. Referring to FIG. 2, the image combining module 143 combines multiple captured images into a whole image (step S210). Specifically, each captured image is directed to one of several shooting parts of a test object. The size measuring device 100 may provide a user interface (for example, through a display) for the user to input identification information of the object to be measured (for example, part number, production number, serial number, or model number, etc.), and the processor 150 may be based on the object to be tested Download the identification information, movement information, and/or shooting parameters corresponding to the test object from the storage 140 or from the Internet.

在一實施例中,檢驗資訊可以是待測物的檢測部分及對應的數個規範尺寸。例如,待測物中特定部分(即,需要檢驗的檢測部分)的長度、角度、弧度等用以表示形狀或大小的尺寸。需說明的是,規範尺寸代表待測物在正常狀態(例如,可出貨或容許誤差內)的尺寸,並相關於規格或自行定義,且其項目、數量及數值視應用者之需求而可變動。在一些實施例中,檢驗資訊中的規範尺寸可以是來自於諸如企業資源計畫(Enterprise Resource Planning,ERP)或其他系統編輯及/或輸出的資訊。In an embodiment, the inspection information may be the detection part of the object to be tested and the corresponding standard sizes. For example, the length, angle, radian, etc. of a specific part (ie, the detection part that needs to be inspected) in the object to be measured are used to express the shape or size. It should be noted that the standard size represents the size of the test object in a normal state (for example, it can be shipped or within the tolerance), and is related to the specification or self-defined, and its items, quantities and values can be based on the needs of the user. change. In some embodiments, the canonical size in the inspection information may come from information such as Enterprise Resource Planning (ERP) or other system editing and/or output.

在一實施例中,移動資訊相關於移動機構130的活動距離或方向,且移動資訊更相關於影像擷取裝置110分別朝向待測物的各拍攝部分(於此定義影像擷取裝置110對待測物拍攝的部分稱為拍攝部分)的相對位置。也就是說,移動資訊也相關於如何對待測物區分成一個或更多個拍攝部分。不同料號的待測物對應檢驗資訊對應的檢測部分或其形狀大小不同,而拍攝控制模組141可依據檢驗資訊(相關於檢測部分及待測物的形狀大小)產生移動資訊。例如,拍攝部分是5公厘×5公厘的拍攝範圍,且拍攝控制模組141依據此拍攝範圍對待測物切割(拍攝部分可能重疊),並據以規劃滑台的移動軌跡,使待測物的拍攝部位可依序移動至可被影像擷取裝置110拍攝的位置。也就是說,移動資訊用於指示移動機構130如何驅動影像擷取裝置110或待測物活動,並使影像擷取裝置110可朝向待測物的某一個拍攝部分。接著,拍攝控制模組141可依據移動資訊驅動移動機構130活動,並依序拍攝部分或全部的拍攝部分。例如,移動資訊是向左平移待測物3公分,或是影像擷取裝置110向上平移5公分,也可能是每隔特定時間移動待測物2公分。In one embodiment, the movement information is related to the moving distance or direction of the movement mechanism 130, and the movement information is more related to the image capturing device 110 respectively facing each shooting part of the object to be measured (the image capturing device 110 is defined here to be measured The part where the object is shot is called the relative position of the shooting part). In other words, the mobile information is also related to how to distinguish the object to be measured into one or more shooting parts. The detection part corresponding to the inspection information corresponding to the test material of different material numbers or its shape and size are different, and the shooting control module 141 can generate movement information according to the inspection information (relative to the detection part and the shape and size of the test object). For example, the shooting part is a shooting range of 5 mm × 5 mm, and the shooting control module 141 cuts the object to be measured according to the shooting range (the shooting parts may overlap), and accordingly plans the movement path of the slide to make the test to be measured The shooting part of the object can be sequentially moved to a position that can be shot by the image capturing device 110. That is to say, the movement information is used to instruct the mobile mechanism 130 how to drive the image capturing device 110 or the object to be measured, so that the image capturing device 110 can face a certain shooting part of the object to be measured. Next, the shooting control module 141 can drive the mobile mechanism 130 to move according to the movement information, and sequentially shoot part or all of the shooting part. For example, the movement information is to translate the object to be measured by 3 cm to the left, or the image capturing device 110 to move upward by 5 cm, or it may be to move the object to be measured by 2 cm every certain time.

在一實施例中,拍攝參數相關於影像擷取裝置110的曝光時間及焦距、以及光源(例如,光源類型、特定方向的亮度、或光源分佈等)。不同類型的待測物所合適的拍攝環境不同,且這些拍攝參數可事先定義或依據檢驗結果來調整。In one embodiment, the shooting parameters are related to the exposure time and focal length of the image capture device 110, and the light source (eg, light source type, brightness in a specific direction, or light source distribution, etc.). Different types of test objects are suitable for different shooting environments, and these shooting parameters can be defined in advance or adjusted according to the inspection results.

由此可知,拍攝控制模組141依據移動資訊控制移動機構130,並依據拍測參數透過影像擷取裝置110分別對待測物的一個或更多個拍攝部分拍攝,以取得多張擷取影像。而各擷取影像即可針對待測物的一個拍攝部分。舉例而言,圖3A是一範例說明針對不同拍攝部分的擷取影像CI。請參照圖3A,圖中所示是針對某一個製品拍攝三十張擷取影像CI,各擷取影像CI是針對某一個拍攝部分。It can be seen that the shooting control module 141 controls the moving mechanism 130 according to the movement information, and respectively shoots one or more shooting parts of the object to be measured through the image capturing device 110 according to the shooting parameters to obtain multiple captured images. And each captured image can be directed to a shooting part of the object to be measured. For example, FIG. 3A is an example illustrating captured images CI for different shooting parts. Please refer to FIG. 3A, which shows that 30 captured images CI are shot for a certain product, and each captured image CI is for a certain shooting part.

值得注意的是,各擷取影像可能是針對待測物的某一個部分,但單一拍攝部分不一定對應到檢驗資訊中的完整的檢測部分。在一實施例中,拍攝部分與至少另一個拍攝部分有部分區域重疊,且影像組合模組143可依據那些拍攝部分的重疊的部分區域將那些擷取影像組合成整體影像。在本新型創作實施例定義整體影像包括完整的待測物。拍攝部分的重疊的部分區域的大小及形狀可依據實際需求而自行調整。以圖3A為例,在圖中左上兩張擷取影像CI中,最左上方的擷取影像CI的右邊部分與其右方的擷取影像CI的左邊部分的影像內容相同。影像組合模組143可辨識重疊的部分區域的影像內容,並將這些擷取影像中的重疊區域配對以組合成整體影像。舉例而言,圖3B是一範例說明整體影像WI。請參照圖3A及3B,圖3B的整體影像WI是由圖3A的三十張擷取影像CI組合形成。It is worth noting that each captured image may be directed to a certain part of the object to be measured, but a single shot part does not necessarily correspond to the complete detection part in the inspection information. In one embodiment, the shooting section overlaps at least another shooting section with partial areas, and the image combination module 143 may combine those captured images into an overall image according to the overlapping partial areas of those shooting sections. In the new creative embodiment, it is defined that the overall image includes a complete object to be tested. The size and shape of the overlapping part of the shooting part can be adjusted according to actual needs. Taking FIG. 3A as an example, in the two upper left captured images CI, the right part of the leftmost captured image CI has the same content as the left side of the captured image CI on the right. The image combination module 143 can recognize the image content of the overlapping partial areas, and pair the overlapping areas in the captured images to combine to form an overall image. For example, FIG. 3B is an example illustrating the overall image WI. Please refer to FIGS. 3A and 3B. The overall image WI of FIG. 3B is formed by a combination of thirty captured images CI of FIG. 3A.

在另一實施例中,影像組合模組143也能事先透過機器學習法訓練待測物的辨識模型,且由此辨識模型判斷各擷取影像屬於待測物的哪一個部分及其位置,並依據這些擷取影像的位置相關關係組合成整體影像。In another embodiment, the image combination module 143 can also train the recognition model of the object under test through machine learning in advance, and from this recognition model determine which part of the object under test and the position of each object to be captured, and According to the position correlation of the captured images, the whole image is combined.

需說明的是,影像組合的手段還可能有其他變化。例如,可應用影像拼接(image stitching)、影像對齊等技術。此外,擷取影像及整體影像可記錄在儲存器140,並可供顯示器或其他外部裝置存取且呈現,以方便使用者檢視。It should be noted that there may be other changes in the means of image combination. For example, techniques such as image stitching and image alignment can be applied. In addition, the captured image and the overall image can be recorded in the storage 140, and can be accessed and presented by the display or other external devices to facilitate the user to view.

由此可知,即使待測物的大小過大而使得影像擷取裝置110無法一次拍攝到待測物的整體,本新型創作實施例可透過分別拍攝並加以組合的方式得到整體影像。此外,在一些應用中,影像擷取裝置110可設定為千萬畫素,使整體影像的細節能可相當清楚。It can be seen from this that even if the size of the object to be measured is too large to allow the image capturing device 110 to capture the entire object to be measured at once, the novel embodiment of the present invention can obtain the overall image by separately shooting and combining them. In addition, in some applications, the image capture device 110 can be set to 10 million pixels, so that the details of the overall image can be quite clear.

接著,檢驗模組145依據檢驗資訊判斷整體影像中的檢測部分的尺寸資訊(步驟S230)。具體而言,各待測物件的檢驗資訊記錄了所欲量測的檢測部位(可能是某一個邊緣、頂點或區域)及其標準的規範尺寸(可能是長度、厚度、角度、弧度、半徑、數量等度量標準)。Next, the inspection module 145 judges the size information of the detection portion in the overall image based on the inspection information (step S230). Specifically, the inspection information of each object to be tested records the inspection part to be measured (may be an edge, vertex or area) and its standard specification size (may be length, thickness, angle, radian, radius, Metric such as quantity).

舉例而言,表(1)是一範例說明規範尺寸: 表(1)

Figure 109202050-A0305-0001
For example, Table (1) is an example to explain the standard size: Table (1)
Figure 109202050-A0305-0001

另一方面,檢驗模組145可辨識整體影像中對應的檢測部分,並分別對這些檢測部分量測其尺寸以作為尺寸資訊。舉例而言,圖3C是一範例說明尺寸測量。請參照圖3C,整體影像WI中定義有檢測部分301、302,檢驗模組145可分別量測這些檢測部分301、302中的線段長度、邊緣間夾角等尺寸資訊。On the other hand, the inspection module 145 can identify the corresponding detection parts in the overall image, and measure the size of these detection parts separately as size information. For example, FIG. 3C is an example illustrating dimensional measurement. Please refer to FIG. 3C, the overall image WI defines the detection parts 301 and 302, and the inspection module 145 can measure the size information such as the length of the line segment and the angle between the edges in these detection parts 301 and 302, respectively.

接著,檢驗模組145可判斷整體影像的尺寸資訊是否符合對應的那些規範尺寸,並據以得出檢驗結果(步驟S250)。具體而言,檢驗模組145可比對尺寸資訊與對應規範尺寸的大小、尺寸資訊是否超出上限、下限或警戒上下限、或判斷兩者之間的差異是否超出差異門檻值。檢驗模組145可分別記錄那些檢測部分的尺寸資訊、對應規範尺寸、差異及其符合程度(例如,是否正常、是否為NG品、容許異常等),並挑選全部或部分資訊作為檢驗結果。在一實施例中,檢驗模組145還可設定容許數量(例如,1、3、或10等),並反應於檢測部分不符合規範尺寸的數量超過容許數量才視為NG品。此檢驗結果可能是表格、圖表或其他形式(例如,CPK報表或其他報表),並可輸出到顯示器或其他外部裝置檢視。檢驗結果也能結合整體影像或擷取影像,並在影像中標記異常位置。Next, the inspection module 145 can determine whether the size information of the overall image conforms to the corresponding standard sizes, and accordingly obtain the inspection result (step S250). Specifically, the verification module 145 can compare the size information with the corresponding standard size, whether the size information exceeds the upper limit, the lower limit, or the upper and lower warning limits, or determine whether the difference between the two exceeds the difference threshold. The inspection module 145 can separately record the size information, corresponding standard size, difference and conformity (eg, whether it is normal, whether it is NG product, or allowable abnormality, etc.) of those detected parts, and select all or part of the information as the inspection result. In an embodiment, the inspection module 145 may also set an allowable quantity (for example, 1, 3, or 10, etc.), and it is considered as an NG product only if the quantity of the detection part that does not meet the specification size exceeds the allowable quantity. The inspection results may be in the form of tables, charts or other forms (for example, CPK reports or other reports), and can be output to a display or other external device for viewing. The inspection results can also be combined with the whole image or captured images, and mark abnormal positions in the images.

在一實施例中,檢驗結果包括檢測部分的尺寸資訊與對應規範尺寸的差異。檢驗模組145可取得在不同的數個時間點對不同的多個待測物所得的那些檢測部分的對應差異,並依據那些待測物在不同的檢測部分的對應差異產生趨勢圖。此趨勢圖記錄那些時間點對應的差異及對應容許範圍。檢驗模組145可對各待測物的檢驗結果附加時間戳(timestamp),並對相同類型的待測物在不同時間點所取得檢驗結果整合。例如,檢驗模組145對檢測部分的項目進行分類,並將相同檢測部分的差異及符合程度依據時間順序排列甚至圖表化,以作為趨勢圖。In one embodiment, the inspection result includes the difference between the size information of the detection part and the corresponding standard size. The inspection module 145 can obtain the corresponding differences of those detection parts obtained at different time points for different multiple test objects, and generate a trend graph according to the corresponding differences of those test objects in different detection parts. This trend graph records the corresponding differences and corresponding allowable ranges at those time points. The inspection module 145 can add a timestamp to the inspection result of each object to be tested, and integrate the inspection results of the same type of object to be tested at different time points. For example, the inspection module 145 classifies the items of the detection part, and arranges or even charts the differences and the degree of conformity of the same detection part according to the chronological order as a trend graph.

圖4是一範例說明趨勢圖。請參照圖4,此圖是針對某一個檢測部分的尺寸所形成的趨勢圖。尺寸資訊403分別是不同時間點所得的量測結果(例如,1.966、1.956的數值)。這些量測結果經連線後可得出數值隨時間減少的趨勢。此外,趨勢圖可另外設定下限401及上限402,透過顯示器顯示後可清楚且快速地觀察出差異。使用者發現量測結果超過下限401或上限402,即可針對此檢測部分查找異常原因,並據以排除障礙。而藉由趨勢圖的分析,使用者可在產品製程的過程中了解機台運作的穩定性,並可即時地排除異常,以避免過多NG品產出。FIG. 4 is an example illustrating a trend chart. Please refer to FIG. 4, which is a trend graph formed for the size of a certain detection part. The size information 403 is the measurement results obtained at different time points (for example, the values of 1.966 and 1.956). After connecting these measurement results, the trend of the value decreasing with time can be obtained. In addition, the trend graph can be additionally set with a lower limit 401 and an upper limit 402, and the difference can be clearly and quickly observed after being displayed on the display. When the user finds that the measurement result exceeds the lower limit 401 or the upper limit 402, he can find the cause of the abnormality for this detection part and remove the obstacle accordingly. Through the analysis of the trend graph, the user can understand the stability of the machine operation during the product manufacturing process, and can eliminate the abnormality in real time to avoid excessive NG product output.

綜上所述,本新型創作實施例的尺寸量測裝置可自動化地拍攝待測物(更可適用於大型尺寸的待測物),並快速地執行精密量測(精度可達微米,甚至更小)。對於待測物在尺寸上的檢驗可連結標準的規範尺寸,並自動判斷OK及NG品,從而避免人為誤判。量測數據、拍攝影像或檢驗結果可以數位化方式儲存,並可自動產出各類型報表,從而節省人力。檢驗結果的圖表分析,可供使用者快速判斷產品生產狀況。此外,本新型創作實施例簡化量測步驟,可降低教育成本及人員流動率。In summary, the size measuring device of the new creative embodiment can automatically photograph the object to be measured (more suitable for large-sized objects to be measured), and quickly perform precise measurements (accuracy up to micrometers, even more small). For the inspection of the size of the test object, the standard standard size can be connected, and OK and NG products are automatically judged, so as to avoid human misjudgment. Measurement data, shooting images or inspection results can be stored digitally, and various types of reports can be automatically generated to save manpower. Graphical analysis of inspection results allows users to quickly determine product production status. In addition, the new creative embodiment simplifies measurement steps, which can reduce education costs and staff turnover.

雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the new creation has been disclosed as above with examples, it is not intended to limit the creation of the new creation. Anyone with ordinary knowledge in the technical field of the subject can make some changes and without departing from the spirit and scope of the creation of the new creation. Retouching, so the scope of protection of this new creation shall be subject to the scope defined in the appended patent application.

100:尺寸量測裝置 110:影像擷取裝置 120:光源 130:移動機構 140:儲存器 141:拍攝控制模駔 143:影像組合模組 145:檢驗模組 150:處理器 S210~S250:步驟 CI:擷取影像 WI:整體影像 301、302:檢測部分 401:下限 402:上限 403:尺寸資訊 100: size measuring device 110: Image capture device 120: light source 130: mobile mechanism 140: memory 141: Shooting control mode 143: Image combination module 145: Inspection module 150: processor S210~S250: Steps CI: Capture images WI: overall image 301, 302: Detection section 401: lower limit 402: upper limit 403: size information

圖1是依據本新型創作一實施例的尺寸量測裝置的元件方塊圖。 圖2是依據本新型創作一實施例的尺寸量測方法的流程圖。 圖3A是一範例說明針對不同拍攝部分的擷取影像。 圖3B是一範例說明整體影像。 圖3C是一範例說明尺寸測量。 圖4是一範例說明趨勢圖。 FIG. 1 is a block diagram of components of a size measuring device according to an embodiment of the present invention. FIG. 2 is a flowchart of a size measurement method according to an embodiment of the novel creation. FIG. 3A is an example illustrating captured images for different shooting parts. FIG. 3B is an example illustrating the overall image. FIG. 3C is an example illustrating dimensional measurement. FIG. 4 is an example illustrating a trend chart.

100:尺寸量測裝置 100: size measuring device

110:影像擷取裝置 110: Image capture device

120:光源 120: light source

130:移動機構 130: mobile mechanism

140:儲存器 140: memory

141:拍攝控制模駔 141: Shooting control mode

143:影像組合模組 143: Image combination module

145:檢驗模組 145: Inspection module

150:處理器 150: processor

Claims (5)

一種尺寸量測裝置,用於檢測一待測物,且該尺寸量測裝置包括: 一影像擷取裝置,分別對該待測物的多個拍攝部分拍攝,以取得多張擷取影像,其中每一該擷取影像針對該待測物的一該拍攝部分;以及 一處理器,耦接該影像擷取裝置,並經配置用以執行: 將該些擷取影像組合成一整體影像,其中該整體影像包括完整的該待測物; 依據一檢驗資訊判斷該整體影像中的多個檢測部分的尺寸資訊,其中該檢驗資訊包括該待測物的該些檢測部分及對應的多個規範尺寸;以及 判斷該整體影像的該尺寸資訊是否符合對應的該些規範尺寸,並據以得出一檢驗結果。 A size measuring device is used for detecting an object to be measured, and the size measuring device includes: An image capturing device, respectively shooting a plurality of shooting parts of the object to be tested to obtain a plurality of captured images, wherein each of the captured images is directed to a shooting part of the object to be tested; and A processor, coupled to the image capture device, is configured to execute: Combining the captured images into a whole image, wherein the whole image includes the complete object to be measured; Judging the size information of the plurality of detection parts in the overall image according to a piece of inspection information, wherein the inspection information includes the detection parts of the object to be tested and the corresponding plurality of standard sizes; and It is determined whether the size information of the overall image conforms to the corresponding standard sizes, and a test result is obtained accordingly. 如請求項1所述的尺寸量測裝置,更包括: 一移動機構,耦接該影像擷取裝置或供該待測物放置,其中 該處理器經配置用以: 依據該檢驗資訊產生一移動資訊,其中該移動資訊相關於該移動機構的活動距離或方向,且該移動資訊更相關於該影像擷取裝置分別朝向該待測物的每一該拍攝部分的相對位置;以及 依據該移動資訊驅動該移動機構活動。 The size measuring device according to claim 1, further comprising: A moving mechanism, coupled to the image capturing device or for placing the object to be measured, wherein The processor is configured to: A movement information is generated according to the inspection information, wherein the movement information is related to the moving distance or direction of the movement mechanism, and the movement information is more related to the relative position of the image capturing device respectively toward each of the shooting parts of the object to be measured Location; and Based on the mobile information to drive the mobile agency activities. 如請求項1所述的尺寸量測裝置,其中每一該拍攝部分與至少另一該拍攝部分有部分區域重疊,且該處理器經配置用以: 依據該些拍攝部分的重疊的部分區域將該些擷取影像組合成該整體影像。 The size measuring device according to claim 1, wherein each of the shooting portions overlaps with at least another of the shooting portions, and the processor is configured to: The captured images are combined into the overall image according to the overlapping partial regions of the captured parts. 如請求項1所述的尺寸量測裝置,其中該處理器經配置用以: 依據該待測物的識別資訊取得該檢驗資訊、一移動資訊及一拍攝參數,其中該移動資訊相關於該影像擷取裝置分別朝向該待測物的每一該拍攝部分的相對位置,且該拍攝參數相關於該影像擷取裝置的曝光時間及焦距、以及光源。 The size measurement device of claim 1, wherein the processor is configured to: Obtaining the inspection information, a movement information and a shooting parameter according to the identification information of the object to be tested, wherein the movement information is related to the relative position of the image capturing device toward each of the shooting parts of the object to be tested, and the The shooting parameters are related to the exposure time and focal length of the image capturing device, and the light source. 如請求項1所述的尺寸量測裝置,其中該檢驗結果包括該尺寸資訊與對應該規範尺寸的差異,且該處理器經配置用以: 取得在不同的多個時間點對不同的多個該待測物所得的該些檢測部分的對應差異;以及 依據該些待測物在不同該檢測部分的對應差異產生一趨勢圖,其中該趨勢圖記錄該些時間點對應的差異及對應容許範圍。 The size measuring device according to claim 1, wherein the inspection result includes the difference between the size information and the corresponding standard size, and the processor is configured to: Obtaining corresponding differences of the detection parts obtained at different time points to different multiple test objects; and A trend graph is generated according to the corresponding differences between the test objects in the different detection parts, wherein the trend graph records the corresponding differences and corresponding allowable ranges at the time points.
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