TWM594826U - Exposed connector and electronic component with the connector - Google Patents

Abstract

An electronic component with an exposed connector includes a substrate, a bottom electronic module, an exposed connector, and a bottom package. The bottom surface of the substrate has contacts; the bottom electronic module is connected to the bottom surface; the bottom package encapsulates the bottom electronic module and the exposed connector on the bottom surface; the guide body of the exposed connector can communicate with the contacts, and Can be exposed from the bottom package. In this way, the effect of not only being able to double-sided inserts (double-sided wire bonding), but also electrically connected to the motherboard through the exposed conductors is achieved.

Description

Exposed connector and electronic component with the connector

The packaging of the creative electronic component is related, in particular to an exposed connector and an electronic component with the connector.

For electronic components, such as memory chips, processor chips, or circuit boards with electronic modules, in order to meet the requirements of miniaturization, the best way is to advance from the original single-sided mounting (single-sided bonding) Double-sided inserts (double-sided threading), that is, they are also placed on the original bottom surface.

However, the bottom surface of the existing electronic components is usually configured with most connectors (such as pins or solder balls) that are electrically connected to the motherboard. Once the electronic components are also placed on the bottom surface, of course, the opposite components are also required on the bottom surface The electronic module is encapsulated, so that the bottom package also encapsulates the connectors together, so that it can no longer be electrically connected to the motherboard.

Even if the length of each connector is considered to be longer, so that one end of each connector can be exposed from the bottom package, but the pins are originally small, and once prolonged, they will easily break; as for the solder balls, after the extension, there is a tendency to leak or overflow problem.

The purpose of this creation is to provide an exposed connector and an electronic component with the connector. The contact that was originally encapsulated can be exposed through the specially designed guide body of the exposed connector, so it can still be Electrically connected to the motherboard.

In order to achieve the above object, the present invention provides an exposed connector, including: an insulating carrier having a first side and a second side; and at least one conductive body fixed on the insulating carrier, the conductive body has A first guide portion and a second guide portion, the first guide portion and the second guide portion are respectively located and exposed on the first side and the second side respectively for electrical connection, And the first guide portion and the second guide portion are connected to each other.

This creation also provides an electronic component with exposed connectors, including: A substrate having a bottom surface with at least one contact; A bottom electronic module connected to the bottom; An exposed connector includes: an insulating carrier having a first side and a second side; and, at least one conductive body fixed to the insulating carrier, the conductive body having a first conductive part and A second guide portion, the first guide portion and the second guide portion are respectively located and exposed on the first side and the second side, respectively, the first guide portion and the second guide portion are mutually Conducting, the first conducting portion of the at least one conducting body and the at least one contact conducting to each other; and A bottom surface package body encapsulates the bottom surface electronic module and the exposed connector on the bottom surface, and the second guide portion of the at least one guide body is exposed from the bottom surface package body.

Compared with the prior art, this creation has the following effects: not only can it be placed on both sides (double-sided wire bonding), but it can also be electrically connected to the motherboard through the exposed second guide part.

The detailed description and technical content of this creation are explained in conjunction with the drawings below. However, the drawings are provided for reference and explanation only, and are not intended to limit this creation.

This creation provides an exposed connector and an electronic component having the connector. Figs. 1 to 4 show a first embodiment of the exposed connector, and Fig. 5 shows a second embodiment of the exposed connector, as shown in Fig. 6 to 8 show a third embodiment of the exposed connector, and FIGS. 9 to 11 show the fourth embodiment of the exposed connector. As shown in FIG. 12, it is a schematic diagram of using two or more exposed connectors at the same time. .

As shown in FIGS. 1 to 4, the electronic component with exposed connectors (hereinafter referred to as electronic component) includes: a bottom electronic module 400, a bottom package 500, a substrate 600, and a top package structure 700 And a first embodiment of an exposed connector 100a.

The substrate 600 has a top surface 6a and a bottom surface 6b opposed to each other. The bottom surface 6b has at least one contact 61. In this embodiment, the bottom surface 6b is explained by taking a plurality of contacts 61 as an example.

The top surface packaging structure 700 includes a top surface electronic module (not shown) and a top surface package 7 that encapsulates the top surface electronic module on the top surface 6a. The top surface electronic module includes at least one wire bonding unit and a plurality of wire bonding units not shown in the figure, and the wire bonding unit is connected to the top surface 6a via wire bonding.

The bottom electronic module 400 is connected and fixed to the bottom 6b. In detail, the bottom electronic module 400 includes a plurality of bonding wires (not shown in the figure) and at least one wire bonding unit 4. In this embodiment, one wire bonding unit 4 is used as an example for description. Each wire bonding unit connects and fixes the wire bonding unit 4 to the bottom surface 6b via wire bonding.

The first embodiment of the exposed connector 100a includes: an insulating carrier 1a and at least one conductor 2a. In this embodiment, the exposed connector 100a is described by including a plurality of conductors 2a as an example.

The insulating carrier 1a has a first side 11 and a second side 12. The relationship between the first and second sides 11, 12 is not limited in this creation, and preferably is opposite to each other.

The lead body 2a includes a first lead portion 21a, a second lead portion 22a, and a buried portion 23 connected between the first lead portion 21a and the second lead portion 22a. The parts 21 a and 22 a are electrically connected to each other by the embedded part 23. The embedded portion 23 is embedded in the insulating carrier 1a to be fixed to each other, and the first and second conductive portions 21a and 22a are respectively located and exposed on the first side 11 and the second side 12 respectively for electrical conduction Preferably, the first and second guide portions 21a, 22a protrude from the first and second sides 11, 12, respectively, to facilitate connection. Next, the first lead portions 21a of the lead bodies 2a of all the exposed connectors 100a and the contacts 61 are electrically connected to each other. This creation does not limit how the first guide portion 21a and the contact 61 communicate with each other. In this embodiment, the first guide portion 21a and the contact 61 can pass through, for example, solder paste or solder balls (not shown) ) Are soldered to each other to conduct them, and the exposed connector 100a is soldered and fixed to the bottom surface 6b of the substrate 600.

As shown in FIG. 4, the outer diameters of the first guide portion 21a and the second guide portion 22a are larger than the outer diameter of the embedded portion 23, so that the cross-sectional shape of the guide body 2a in this embodiment can be I Shape or H shape, but this creation is not limited.

In this way, when the bottom electronic package 400 and all the exposed connectors 100a are packaged on the bottom 6b together with the bottom package 500, since each of the conductors 2a has a certain height, all the exposed connectors 100a The second lead portions 22a of the lead bodies 2a will be exposed from the bottom surface package 500, in particular, only the exposed surface 221 of the second lead portion 22a is sufficient to be electrically connected to the motherboard (not shown) connection. It is worth noting that, since the conductive bodies 2a of each exposed connector 100a are supported by the insulating carrier 1a, the conductive bodies 2a have the effect of being stable and not easily tilted, and have sufficient structural strength and are not easily broken effect.

In other embodiments not shown in the drawings, the first conducting portion 21a and the contact 61 can be connected to each other temporarily, and the first conducting portion 21a and the contact 61 can only be in contact with each other and not fixed to each other temporarily. (For example, soldering to each other); Then, as long as the exposed connector 100a at this time is encapsulated with the bottom package 500 on the bottom surface 6b, the exposed connector 100a can be fixed to ensure that each of the first guide portions 21a and each The contacts 61 can be fixed in a state where they are in contact with each other. In other words, in other embodiments not shown in this figure, the welding procedure can be omitted between each first guide portion 21a and each contact 61.

As shown in FIG. 5, this is the second embodiment of the creative exposed connector 100a. The second embodiment is substantially the same as the aforementioned first embodiment, and the difference is only in the lead body 2a of the second embodiment. In the second embodiment, the shapes of the first guide portion (not shown) and the second guide portion 22a1 are both rectangular, and the shapes of the first and second guide portions 21a, 22a of the first embodiment are both It is round.

The original electronic components shown in FIGS. 6 to 8 are substantially the same as the electronic components described in FIGS. 1 to 4 described above. The difference is that the exposed connector 100b of the third embodiment is different from the first embodiment. Details are as follows.

The third embodiment of the exposed connector 100b also includes an insulating carrier 1b and a plurality of conductors 2b.

In addition to the first and second sides 11 and 12, the insulating carrier 1 b also has a thickness side 15 connected between the periphery of the first side 11 and the periphery of the second side 12 in a surrounding shape.

The guiding body 2b includes a first guiding portion 21b, a second guiding portion 22b, and a connecting portion 24 connected between the first guiding portion 21b and the second guiding portion 22b. The connecting portions 21b and 22b are connected to each other through the connecting portion 24, and a clamping tiger 25 is formed between the first guiding portion 21b, the second guiding portion 22b and the connecting portion 24, so that the guiding body 2b The cross-sectional shape in this embodiment may be U-shaped.

The insulating carrier 1b is embedded in the clamping tiger 25 of each guide body 2b, so that the first guide portion 21b and the second guide portion 22b of each guide body 2b are clamped and exposed to the first of the insulating carrier 1b, respectively One side 11 and the second side 12 are fixed. Preferably, the connecting portion 24 of each conductor 2b is in contact with the thickness side 15 of the insulating carrier 1b to improve the stability of the conductor 2b fixed to the insulating carrier 1b.

The first lead portions 21b of the lead bodies 2b of all exposed connectors 100b and the contacts 61 are connected to each other, and the second lead portions 22b are exposed from the bottom package 500, especially only An exposed surface 221 of the second guide portion 22a is enough to be electrically connected to the main board (not shown).

The original electronic components shown in FIGS. 9 to 11 are substantially the same as the electronic components shown in FIGS. 6 to 8 previously disclosed, and the only difference is that the exposed connector 100c of the fourth embodiment differs from the third embodiment. Details are as follows.

The fourth embodiment of the exposed connector 100c also includes an insulating carrier 1c and a plurality of conductors 2c. The insulating carrier 1c also has first and second sides 11, 12 and a thick edge 15 in a surrounding shape.

The guiding body 2c includes a first guiding portion 21c, a second guiding portion 22c, and a curved connecting portion 26 connected between the first guiding portion 21c and the second guiding portion 22c. The guide portions 21c and 22c are connected to each other by the curved connection portion 26, and a clamping tiger mouth 25 is formed between the first guide portion 21c, the second guide portion 22c and the curved connection portion 26 together to guide the connection The cross-sectional shape of the body 2c in this embodiment may also be U-shaped. Wherein, the curved connection portion 26 is convexly bent toward the thickness side 15 and is caught by the thickness side 15 of the insulating carrier 1b. As for the portion of the curved connection portion 26 opposite to its bending direction, a groove 261 is correspondingly formed by The curved connection portion 26 of such a special shape has better support strength between the first and second guide portions 21c, 22c, and the first guide portion 21c and the second guide portion of each guide body 2c The clamping tightness of 22c clamped on the first side 11 and the second side 12 of the insulating carrier 1c is also tight. The first guide portion 21c and the second guide portion 22c of the guide body 2c are respectively exposed on the first side 11 and the second side 12 after clamping.

In addition, as shown in FIGS. 6 to 8 again, in the third embodiment of the exposed connector 100b, the insulating carrier 1b may further be formed with a plurality of lugs 13 spaced apart from each other along the thickness side 15, each lug 13 corresponding to Each guide body 2b is fitted into the clamping slot 25 and fixed to each other. Furthermore, a gap 14 is formed between the two lugs 13 adjacent to each other in the direction of the thickness side 15.

As shown in FIG. 12, most of the exposed connectors used in the electronic components of this creation can use all the exposed connectors of the same embodiment (as shown in FIGS. 1 to 11), and can also use more than two types of connectors at the same time. For different exposed connectors, for example, the substrate 600 shown in FIG. 12 is provided with two different exposed connectors 100b and 100c.

In summary, compared with the prior art, the present invention has the following effects: the bottom surface package 500 is encapsulated even on the bottom surface 6b of the substrate 600, thus causing the contacts 61 on the bottom surface 6b to be encapsulated by the bottom surface package 500 However, as long as each of the guide bodies 2a, 2b, 2c of the exposed connectors 100a, 100b, 100c, each contact 61 can be extended to the bottom surface package with the second guide portions 22a, 22a1, 22b, 22c The body 500 is exposed outside, so the original electronic component can be advanced into a double-sided placement (double-sided wire bonding), and can also be electrically connected to the motherboard through the exposed second guide portions 22a, 22a1, 22b, 22c Sexual connection. Furthermore, since the respective conductors 2a, 2b, 2c of the exposed connectors 100a, 100b, 100c are supported by the insulating carriers 1a, 1b, 1c, the conductors 2a, 2b, 2c have the effect of being stable and not easily tilted , And the effect of having sufficient structural strength and not easily broken.

The above mentioned are only the preferred and feasible embodiments of this creation, and the scope of patents of this creation is not limited by this. Any equivalent structural changes caused by the use of this creation description and graphic content are equally included in this creation. Within the scope of the rights, Chen Ming.

100a, 100b, 100c: exposed connectors

1a, 1b, 1c: insulating carrier

11: First side

12: Second side

13: Lug

14: break

15: thickness side

2a, 2b, 2c: conductor

21a, 21b, 21c: the first guide

22a, 22a1, 22b, 22c: second guide part

221: Appearance

23: Buried Department

24: connection

25: Hold the tiger's mouth

26: Curved connection

261: Notch

400: bottom electronic module

4: Unit to be wired

500: bottom package

600: substrate

6a: top surface

6b: Underside

61: Contact

700: top surface package structure

7: Top surface package

FIG. 1 is an exploded perspective view of an electronic component created, showing a first embodiment of an exposed connector.

FIG. 2 is a schematic diagram of the three-dimensional combination according to FIG. 1 for creation.

FIG. 3 is a three-dimensional combination diagram according to FIG. 1 for creation.

FIG. 4 is a schematic sectional view of the creation according to FIG. 2.

5 is a perspective view of a second embodiment of an exposed connector used in creating electronic components.

FIG. 6 is an exploded perspective view of an electronic component created, showing a third embodiment of the exposed connector.

FIG. 7 is a schematic diagram of the three-dimensional combination according to FIG. 6 for creation.

FIG. 8 is a schematic sectional view of the creation according to FIG. 7.

9 is an exploded perspective view of an electronic component created, showing a fourth embodiment of the exposed connector.

FIG. 10 is a schematic diagram of the three-dimensional combination according to FIG. 9 for creation.

FIG. 11 is a schematic sectional view of the creation according to FIG. 10.

FIG. 12 is a three-dimensional schematic diagram of the creation of electronic components using two or more exposed connectors.

100a: exposed connector

1a: insulating carrier

2a: guide body

400: bottom electronic module

4: Unit to be wired

500: bottom package

600: substrate

6a: top surface

6b: Underside

700: top surface package structure

7: Top surface package

Claims (11)

An exposed connector, including: An insulating carrier having a first side and a second side; and At least one conductive body is fixed on the insulating carrier, the conductive body has a first conductive part and a second conductive part, the first conductive part and the second conductive part are located and exposed respectively The first side and the second side are used for electrical conduction, and the first conduction part and the second conduction part are connected to each other. The exposed connector according to claim 1, wherein the guide body includes a buried portion, the first lead portion and the second lead portion, the buried portion is connected to the first lead portion and the first Between the two conductive parts, the embedded part is embedded in the insulating carrier, and the first conductive part and the second conductive part protrude from the first side and the second side, respectively. The exposed connector according to claim 2, wherein the outer diameters of the first guide portion and the second guide portion are larger than the outer diameter of the embedded portion. The exposed connector according to claim 1, wherein the insulating carrier further has a thickness edge connected between the peripheral edge of the first side and the peripheral edge of the second side, and the lead body includes the first lead Part, the second guiding part and a connecting part connected between the first guiding part and the second guiding part, between the first guiding part, the second guiding part and the connecting part A clamping tiger mouth is formed together, the insulating carrier is embedded in the clamping tiger mouth, and the first guide portion and the second guide portion are clamped on the first side and the second side, respectively. The exposed connector according to claim 4, wherein the first side and the second side of the insulating carrier are opposed to each other, and the connecting portion of the guide body abuts against the thickness side of the insulating carrier. The exposed connector according to claim 4, wherein the lead bodies are provided in plural, the insulating carrier is formed with a plurality of lugs spaced apart from each other along the thickness side, and each lug is correspondingly embedded in each of the lead bodies The grip is inside the tiger's mouth. The exposed connector according to claim 1, wherein the cross-sectional shape of the guide body is U-shaped, I-shaped or H-shaped. An electronic component having an exposed connector according to any one of claims 1 to 7, comprising: A substrate having a bottom surface with at least one contact; A bottom electronic module connected to the bottom; An exposed connector, including: An insulating carrier having a first side and a second side; and At least one conductive body is fixed on the insulating carrier, the conductive body has a first conductive part and a second conductive part, the first conductive part and the second conductive part are located and exposed respectively On the first side and the second side, the first guide portion and the second guide portion communicate with each other, and the first guide portion and the at least one contact of the at least one guide body communicate with each other; and A bottom surface package body encapsulates the bottom surface electronic module and the exposed connector on the bottom surface, and the second conductive portion of the at least one conductive body is exposed from the bottom surface package. The electronic component according to claim 8, wherein the exposed connectors are provided in plural, the conductive body of each exposed connector is also provided in plural, the bottom surface has plural contacts, and each of the exposed connectors The first lead portions of the lead bodies and the contacts of the lead body are connected to each other, and the second lead portions of the lead bodies of the exposed connectors are all from the bottom package Exposed. The electronic component according to claim 8, wherein the bottom electronic module includes at least one wire bonding unit and a plurality of wire bonding, and each wire bonding connects the at least one wire bonding unit to the bottom surface. The electronic component according to claim 8, further comprising a top surface packaging structure, the substrate further has a top surface relative to the bottom surface, the top surface packaging structure includes a top surface electronic module and the top surface electronic module A top surface package assembled on the top surface, the top surface electronic module is connected to the top surface.

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