TWM590078U - Cutting device for breach portion at substrate edge - Google Patents
Cutting device for breach portion at substrate edge Download PDFInfo
- Publication number
- TWM590078U TWM590078U TW108211450U TW108211450U TWM590078U TW M590078 U TWM590078 U TW M590078U TW 108211450 U TW108211450 U TW 108211450U TW 108211450 U TW108211450 U TW 108211450U TW M590078 U TWM590078 U TW M590078U
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting line
- substrate
- cut
- cutting
- edge
- Prior art date
Links
Images
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
一種基板邊緣欠缺部之分割裝置,係在基板A劃上欠缺部形成用輪廓裁切線1、其內側之前割用、左右平分及連結前割用之裁切線與其半裁線,包括:切口,係設置於桌台B邊緣部並使輪廓裁切線之部分欠缺而成;下側基底,係於切口8前方在前後方向進退移動;上側基底,係在下側基底上於左右方向進退移動;旋轉體22,係設置於上側基底上;前折割裝置G,係設置於旋轉體22前後方向一側,且由押板、加壓構件、及押片33而構成;後折割裝置H,係設置於旋轉體另一側,並由夾爪35、押入解除手段、及搖動手段而構成。分割異形基板時,於以夾具爪夾取部分施加扭轉並分割,藉此不會有在分割緣產生破裂之不良。A dividing device for the lacking part of the edge of the substrate, which is a contour cutting line 1 for forming the lacking part on the substrate A, and the cutting line and its half cutting line for the inner front cut, the left and right bisect, and the connecting front cut, including: a cut At the edge of table B, the part of the contour cutting line is missing; the lower base is attached to the front and back of the cut 8 to move forward and backward; the upper base is attached to the lower base to move in the left and right directions; the rotating body 22, It is installed on the upper base; the front folding device G is arranged on the side of the rotating body 22 in the front-rear direction, and is composed of the pressing plate, the pressing member, and the pressing piece 33; the rear folding device H is arranged on the rotating The other side of the body is composed of the clamping jaw 35, the pushing-in releasing means, and the shaking means. When the special-shaped substrate is divided, the portion gripped by the clamp jaws is twisted and divided, so that there is no defect of cracking at the dividing edge.
Description
本案係關於例如用以在車載用顯示面板等所使用車載用基板邊緣設置欠缺部之分割裝置,該欠缺部係用以迴避與開關或其他備品的衝突。 This case relates to, for example, a dividing device for providing a defective portion on the edge of an in-vehicle substrate used for an in-vehicle display panel. The missing portion is used to avoid conflict with a switch or other spare parts.
習知車載用顯示面板等基板除了單板及液晶基板以外,係使用有機EL基板,並在基板邊緣設置有欠缺部,該欠缺部係以迴避與車側開關或其他備品的衝突之方式凹入。 In addition to single boards and liquid crystal substrates, conventional vehicle display panels and other substrates use organic EL substrates, and a defect is provided on the edge of the substrate. The defect is recessed in a manner to avoid conflict with the vehicle side switch or other spare parts .
如圖12所示,上述欠缺部係在基板A劃上匸字狀劃線X。分割該劃線X所圍住內側並除去,藉此可得圖13所示之欠缺部Y。 As shown in FIG. 12, the above-mentioned missing portion is a scribe line X scribed on the substrate A. The inner side surrounded by the scribe line X is divided and removed, whereby the missing portion Y shown in FIG. 13 can be obtained.
分割上述劃線X所圍住內側並除去時,例如以加壓構件施加衝擊。 When the inside surrounded by the scribe line X is divided and removed, for example, an impact is applied by a pressing member.
但若施加衝擊而分割則有以下問題:欠缺部Y之劃線X之分割緣產生擦傷或破裂而產生不良品。 However, if the impact is applied to the division, there is a problem that the division edge of the scribe line X of the missing portion Y is scratched or broken, and a defective product is generated.
因此採用以下方式:如圖14所示,先在劃線X內側,於劃線X之並行兩側間劃上多條並行分割線Z,使用夾具依序分割該分割線Z,形成如圖13所示欠缺部Y。 Therefore, the following method is adopted: as shown in FIG. 14, first, on the inside of the scribe line X, draw a plurality of parallel dividing lines Z between the parallel sides of the scribe line X, and use a jig to divide the dividing lines Z in sequence to form as shown in FIG. 13 Defective part Y shown.
又,在劃線並行兩側間劃上多條並行分割線,故非常費工,且使用夾具等依序分割該各分割線,故作業效率差,於大量生產性上有所問題。 In addition, it is very laborious to draw a plurality of parallel dividing lines between the parallel sides of the scribing line, and the dividing lines are sequentially divided using a jig or the like, so the operation efficiency is poor, and there is a problem in mass productivity.
尤其,使用夾具分割接近劃線之接近部分時,若扭轉分割力的作用方向不對,則分割緣會擦傷或破裂而產生不良品,且效率並不佳。 In particular, when using a jig to divide the approaching part close to the scribe line, if the direction of the torsional dividing force is not correct, the dividing edge will be scratched or broken to produce a defective product, and the efficiency is not good.
因此,本案提供解決上述各種問題之分割裝置。 Therefore, this case provides a dividing device that solves the above-mentioned various problems.
為了解決上述課題,本案採之基板邊緣欠缺部之分割裝置採用以下構成: 在欠缺部形成用基板劃上兩端到達上述基板邊緣之匸字狀等欠缺部形成用輪廓裁切線,且在上述基板板面劃上在上述輪廓裁切線內側且兩端到達上述基板邊緣之前割用裁切線、將上述前割用裁切線內左右平分之左右平分裁切線、及連接最接近的上述前割用裁切線與上述左右平分裁切線之半裁線;上述基板邊緣欠缺部之分割裝置具備:附吸取保持機構之桌台,係於上面保持所供給載置之基板;切口,係使上述桌台邊緣部之上述輪廓裁切線外側部分欠缺而成;下側基底,係在上述桌台之上述切口前方藉由導引手段而在前後方向導引,且藉由移動手段而進退移動;上側基底,係在上述下側基底上藉由導引手段而在左右方向導引,且藉由移動手段而進退移動;旋轉體,係設置於上述上側基底上,並藉由旋轉手段而旋轉180°;前折割裝置,係設置於朝上述旋轉體前後方向的一側上方,並由押板、加壓構件、及押片而構成;及後折割裝置,係設置於上述旋轉體的另一側,並由夾爪、押入解除手段、及搖動手段而構成;上述押板係藉由昇降手段而昇降,且隨著降低而壓縮朝下押壓構件,押入上述基板之上述前割用裁切線與輪廓裁切線間的上面;上述加壓構件係將上述基板之上述前割用裁切線內的左右藉由汽缸而降低並押入;上述押片係藉由汽缸的作用而降低,並分割上述前割用裁切線內的兩側部分;上述夾爪係夾住以上述前折割裝置折割後剩下的上述輪廓裁切線內側剩下的上述半裁線兩側殘材的上下面;上述押入解除手段係使上述兩側夾爪從上述輪廓裁切線離開;上述搖動手段係以使上述夾爪折割扭轉之方式搖動;上述左右的押入解除手段係進行先在一側接著在另一側的時間差運動。 In order to solve the above-mentioned problems, the dividing device of the substrate edge defect part adopted in this case adopts the following structure: A contour cut line for forming a defect, such as a zigzag shape with both ends reaching the edge of the substrate, is cut on the substrate for forming a defect, and the surface of the substrate is cut inside the contour cut line and cut before the ends reach the edge of the substrate A cutting line, a left-right bisect cutting line that bisects the left and right sides of the front-cut cutting line, and a half-cut line connecting the closest front-cut cutting line and the left-right bisect cutting line; a dividing device for the substrate edge defect : The table with suction and holding mechanism is used to hold the substrate on the top; the cut is made by the lack of the outer part of the contour cutting line at the edge of the table; the lower base is attached to the table The front of the incision is guided in the front-rear direction by the guide means, and moves forward and backward by the moving means; the upper base is guided in the left-right direction by the guide means on the lower base, and by moving Means to move forward and backward; the rotating body is provided on the upper base and rotated by 180° by the rotating means; the front folding device is provided above the side in the front-back direction of the rotating body It consists of a pressing member and a pressing piece; and a rear cutting device is provided on the other side of the above-mentioned rotating body, and is composed of a clamping jaw, a pressing releasing means, and a shaking means; the pressing plate is formed by a lifting means While moving up and down, and compressing the downward pressing member with lowering, pressing the upper surface between the cutting line for front cutting and the contour cutting line of the substrate; The left and right are lowered and pushed by the cylinder; the pressing piece is lowered by the action of the cylinder and divides the two sides of the cutting line for the front cutting; the clamping jaw is clamped and cut by the front folding device The upper and lower surfaces of the remaining material on both sides of the half-cut line remaining on the inside of the outline cutting line; the push-in release means is to separate the jaws on both sides from the outline cut line; the shaking means is to fold the jaws Shake in a torsional way; the above-mentioned left-and-right push release means is to perform a time difference movement first on one side and then on the other side.
如上述,根據本案之基板邊緣欠缺部之分割裝置,將供給於桌台上之基板藉由吸取保持機構而支持,並藉由旋轉手段而使上側基底上之旋轉體之一端側前折割裝置朝向桌台上之基板方向。 As described above, according to the dividing device of the substrate edge-deficient portion of this case, the substrate supplied on the table is supported by the suction and holding mechanism, and one end side of the rotating body on the upper base is forwardly cut by the rotating means Facing the direction of the substrate on the table.
如此一來,一邊以押板押入基板,一邊藉由昇降手段降低加壓體,藉此可將平分基板之前割用裁切線內側裁切線左右的部分分割並折割,該押板係壓縮前折割裝置之押壓部。 In this way, while pressing the substrate with the plywood, the pressurizing body is lowered by the lifting and lowering means, by which the left and right part of the cutting line inside the cutting line before the bisection of the substrate can be divided and cut, the plywood is folded before compression Pressing part of cutting device.
接著,藉由旋轉手段而使旋轉體旋轉180°,一邊使前折割裝置退至基板相反方向,一邊使後折割裝置朝向基板方向,其後以夾爪夾住輪廓裁切線內側剩下的半裁線兩側殘材的上下面,將該夾取夾爪以離開輪廓線之方式解除,並藉由搖動手段而使夾爪扭轉搖動,而分割剩下的殘材,故可在基板保持於固定位置狀況下,極有效率地進行前折割及後折割,尤其係先進行後折割殘材左右的一邊其後進行殘材的另一邊之所謂時間差折割(分割),故具有消除下述問題之特有效果,亦即,因分割緣產生擦傷或破裂而產生不良品的問題。 Next, the rotating body is rotated by 180° by means of rotation, and while the front folding device is retracted to the opposite direction of the substrate, the rear folding device is oriented toward the substrate, and then the remaining inside of the contour cutting line is clamped by the jaws The upper and lower surfaces of the residual material on both sides of the half-cut line, the clamping jaw is released away from the contour line, and the clamping jaw is twisted and shaken by the shaking method to divide the remaining residual material, so it can be held on the substrate In a fixed position, the front and rear folding are performed very efficiently, especially the first and second sides of the residual material are firstly cut and the so-called time difference folding (division) is performed on the other side of the residual material. The unique effect of the following problem, that is, the problem of defective products due to scratches or cracks in the divided edges.
A‧‧‧基板 A‧‧‧Substrate
a‧‧‧欠缺部 a‧‧‧Deficient Department
B‧‧‧桌台 B‧‧‧Table
C‧‧‧導引手段 C‧‧‧ Guidance
D‧‧‧移動手段 D‧‧‧Moving means
E‧‧‧導引手段 E‧‧‧ Guidance
F‧‧‧移動手段 F‧‧‧Moving means
G‧‧‧前折割裝置 G‧‧‧Front cutting device
H‧‧‧後折割裝置 H‧‧‧Folding device
K‧‧‧殘材 K‧‧‧Remnant
1‧‧‧輪廓裁切線 1‧‧‧Outline cutting line
2‧‧‧前割用裁切線 2‧‧‧Cutting line for front cutting
3‧‧‧裁切線 3‧‧‧Cut line
4‧‧‧半裁線 4‧‧‧Half cut line
5‧‧‧吸取保持機構 5‧‧‧Sucking and holding mechanism
6‧‧‧箱 6‧‧‧ case
7‧‧‧小孔 7‧‧‧Eye
8‧‧‧切口 8‧‧‧cut
9‧‧‧下側基底 9‧‧‧Lower base
10‧‧‧上側基底 10‧‧‧Upper base
11‧‧‧定置地板 11‧‧‧ Fixed floor
12‧‧‧軌道 12‧‧‧ Orbit
13‧‧‧滑件 13‧‧‧Slider
14‧‧‧公螺釘 14‧‧‧ male screw
15‧‧‧母螺釘 15‧‧‧Female screw
16‧‧‧軌道 16‧‧‧ Orbit
17‧‧‧滑件 17‧‧‧Slider
18‧‧‧馬達 18‧‧‧Motor
19‧‧‧公螺釘 19‧‧‧ male screw
20‧‧‧母螺釘 20‧‧‧Female screw
22‧‧‧旋轉體 22‧‧‧rotating body
23‧‧‧基底 23‧‧‧ base
24‧‧‧昇降手段 24‧‧‧ Lifting means
25‧‧‧昇降體 25‧‧‧ Lifting body
26‧‧‧加壓構件 26‧‧‧Pressure member
27‧‧‧軸材 27‧‧‧Shaft
28‧‧‧螺旋彈簧 28‧‧‧coil spring
29‧‧‧汽缸 29‧‧‧Cylinder
30‧‧‧馬達 30‧‧‧Motor
31‧‧‧凹缺部 31‧‧‧Notch
32‧‧‧汽缸 32‧‧‧Cylinder
33‧‧‧押片 33‧‧‧ Catch
35‧‧‧夾爪 35‧‧‧jaw
36‧‧‧搖動手段 36‧‧‧Shaking
38‧‧‧插銷 38‧‧‧Latch
39‧‧‧孔 39‧‧‧hole
40‧‧‧框 40‧‧‧ frame
41‧‧‧汽缸 41‧‧‧Cylinder
42‧‧‧押片 42‧‧‧ Catch
51‧‧‧安裝座 51‧‧‧Mount
52‧‧‧插銷 52‧‧‧Latch
53‧‧‧長孔 53‧‧‧Long hole
圖1係表示本案之實施形態之平面圖。 FIG. 1 is a plan view showing an embodiment of this case.
圖2係同上之部分省略側面圖。 Figure 2 is a part of the same as above, with a side view omitted.
圖3係表示變更前折割裝置與後折割裝置的位置之狀態之側面圖。 3 is a side view showing a state where the positions of the front folding device and the rear folding device are changed.
圖4係表示後折割裝置之部分之放大正面圖。 Fig. 4 is an enlarged front view showing part of the rear folding device.
圖5係表示同上之扭轉搖動之狀態之放大正面圖。 Fig. 5 is an enlarged front view showing the state of torsional shaking in the above.
圖6係同上之部分省略放大平面圖。 Fig. 6 is the same as the above, and an enlarged plan view is omitted.
圖7係表示同上之扭轉搖動之時間差狀態之放大平面圖。 Fig. 7 is an enlarged plan view showing the state of the time difference of torsional shaking in the above.
圖8係表示以前折割裝置折割之放大平面圖。 Fig. 8 is an enlarged plan view showing the folding by the conventional folding device.
圖9係同上之放大側面圖。 Figure 9 is an enlarged side view of the above.
圖10係表示同上之折割後之放大側面圖。 Fig. 10 is an enlarged side view showing the same as above.
圖11係表示基板藉由前折割裝置及後折割裝置所進行的折割順序之平面圖。 FIG. 11 is a plan view showing the cutting sequence of the substrate by the front cutting device and the rear cutting device.
圖12係形成以往之欠缺部之第一步驟圖。 Fig. 12 is a diagram showing the first step of forming a conventional defect.
圖13係表示同上之次加工之第二步驟圖。 Fig. 13 is a diagram showing the second step of the above-mentioned secondary processing.
圖14係形成欠缺部之平面圖。。 Fig. 14 is a plan view of a defect. .
接著根據所附圖面說明本案之實施形態。本案之圖1~10所示A為基板,該基板形成有欠缺部a,該欠缺部a係從邊緣往內部方向凹入。 Next, the embodiment of this case will be described based on the attached drawings. A shown in FIGS. 1 to 10 of this case is a substrate, and the substrate is formed with a defect portion a, which is recessed from the edge toward the inside.
基板A除了單板及液晶基板以外有有機EL基板等,例如有下側為玻璃板且在該下側玻璃板上積層多層膜者等,在大片基板的上下面劃上縱列及橫列之分割線,將其分割為製品尺寸的矩形而得單個板,在該單個板上下面例如劃上車載用異形裁切線,分割該異形裁切線之周方向外側,隨著分割而回收端材,其中,如圖11之(V)所示,在上述車載用基板A邊緣形成有凹入之欠缺部a。 In addition to the single board and the liquid crystal substrate, the substrate A includes an organic EL substrate, for example, a glass plate on the lower side and a multilayer film is deposited on the lower glass plate, and the vertical and horizontal lines are drawn on the upper and lower surfaces of the large substrate The dividing line is divided into rectangles of product size to obtain a single board. On the lower and upper sides of the single board, for example, a special-shaped cutting line for vehicles is drawn, and the circumferential outer side of the shaped cutting line is divided. As shown in FIG. 11(V), a recessed portion a is formed on the edge of the vehicle-mounted substrate A.
為了形成該欠缺部a,如圖11之(I)所示,於基板A兩面劃上兩端到達基板A邊緣之匸字狀或U字狀等輪廓裁切線1,且劃上於該輪廓裁切線1內側且兩端到達基板A邊緣之弧狀前割用裁切線2、及將前割用裁切線2內左右平分之裁切線3,並在前處理劃上連結前割用裁切線2兩端間中間與輪廓裁切線1中間的半裁線4。
In order to form the missing portion a, as shown in FIG. 11(I), a
又,圖1、2、3、8、9、10所示B為桌台,該桌台係於上面供給載置基板A,該桌台B設置有吸取保持機構5,該吸取保持機構5係保持所載置之基板A。
In addition, as shown in FIGS. 1, 2, 3, 8, 9, and 10, B is a table, and the table is provided with a mounting substrate A on the top. The table B is provided with a suction and holding
作為上述吸取保持機構5,圖示中的情形為扁平中空箱6,並於該箱6內頂壁設置小孔7群,透過連接軟管(省略圖示)吸取箱6內,藉此於箱6上吸取保持基板A。
As the suction and holding
又,在桌台B前緣設置有切口8,該切口8係從箱6前面朝向後方,與基板A之欠缺部a為同形狀且稍大於欠缺部a。
In addition, a
又,如圖2、3所示,在桌台B之切口8前方設置有下側基底9,該下側基底9係藉由導引手段C而在前後方向導引,且藉由移動手段D而進退移動,並在該下側基底9上設置有上側基底10,該上側基底10係藉由導引手段E而在左右方向導引,且藉由移動手段F而進退移動。
In addition, as shown in FIGS. 2 and 3, a
如圖2、3所示,上述導引手段C係由前後方向軌道12及滑件13而構成,該前後方向軌道12係設置於定置地板11上且並列,該滑件13係設置於下側基底9下面並滑動自在卡合於該軌道12。如圖2、3所示,上述移動手段D係由
公螺釘14及母螺釘15而構成,該公螺釘14係藉由馬達30之運轉而可逆驅動,該母螺釘15係支持於該下側基底9下面並螺合於公螺釘14。如圖1、2所示,上述導引手段E係由左右方向軌道16及滑件17而構成,該左右方向軌道16係設置於下側基底9上且並列,該滑件17係設置於上側基底10下面並滑動自在卡合於該軌道16。如圖1、2所示,上述移動手段F係由公螺釘19及母螺釘20而構成,該公螺釘19係藉由馬達18之運轉而可逆驅動,該母螺釘20係支持於上側基底10下面並螺合於公螺釘19,但並不限定於此,例如可以線性馬達等使下側基底9可於前後方向滑動並使上側基底10可於左右方向滑動(該滑動目的如後述)。
As shown in FIGS. 2 and 3, the guide means C is composed of a front-
又,在上側基底10上搭載有旋轉體22,該旋轉體22係可將兩端前後方向的位置藉由具旋轉手段之馬達之運轉而方向轉換為180°相異位置(一邊朝向桌台B上之基板A的位置,另一邊朝向基板A之相反方向的位置),在該旋轉體22兩端中的一邊設置前折割裝置G,在另一邊設置後折割裝置H。
In addition, a rotating
如圖1、2、8、9、10所示,上述前折割裝置G係設置有昇降體25,並以加壓構件26加壓基板A之前割用裁切線2內側上面(參照圖9),該昇降體25係隨著昇降手段24之汽缸的作用而降低,該昇降手段24係支持於基底23,該基底23係從旋轉體22一端立起。
As shown in FIGS. 1, 2, 8, 9, and 10, the front cutting device G is provided with a lifting
如圖2所示,該加壓構件26係於昇降體25貫通軸材27上端側,在軸材27下端裝設板狀加壓構件26上面,並使嵌裝於軸材27之螺旋彈簧28兩端抵接昇降體25下面及加壓構件26上面,藉由支持於昇降體25之汽缸29,而使加壓構件26降低,故首先藉由昇降手段24而抵接基板A上面之前割用裁切線2內側部分。
As shown in FIG. 2, the pressing
此時,若抵接之加壓構件26的抵接力較強,則一邊稍微壓縮螺旋彈簧28,一邊頂起加壓構件26及軸材27,作用於基板A之前割用裁切線2內側之押壓力僅為汽缸29的作用力,而不會影響到輪廓裁切線1側。
At this time, if the pressing force of the contacting pressing
如此一來,在設置於加壓構件26兩側緣部間之凹缺部31中,藉由汽缸32而使押片33降低,而分割基板A之前割用裁切線2之內側裁切線3兩側部分,可分割為圖11之(II)所示略半圓狀。又,隨著分割,端材會從桌台B之切口8掉落(參照圖9、10)。
In this way, in the recessed
又,前述後折割裝置H係由左右夾爪35、搖動手段36、及押入解除手段而構成,該左右夾爪35係夾住兩側殘材K之前割用裁切線2緣部側的上下
面,該兩側殘材K係夾著輪廓裁切線1內側之半裁線4,該搖動手段36係以在折割該左右夾爪35時扭轉之方式搖動,該押入解除手段係隨著折割(藉由搖動手段36的作用)使夾爪35相對於輪廓裁切線1而離開。
In addition, the above-mentioned rear folding device H is composed of left and
上述搖動手段36係如圖4所示,在左右夾爪35之上下一對成組之下側夾爪35之兩外側角落設置插銷38,將該插銷38之搖動支點之孔39設置於後折割手段H之框40,並於該孔39貫通插銷38,藉此,在下側夾爪35扭轉折割時會傾動,上側夾爪35係以藉由安裝於框40之汽缸41的作用而昇降之方式設置,並以上下夾爪35夾住基板A的上下面。
As shown in FIG. 4, the above-mentioned rocking means 36 is provided with
如此一來,隨著汽缸41之伸長作用,透過押片42,下側夾爪35會如圖4~5所示傾動,而扭轉折割上下夾爪35所夾取基板A之輪廓裁切線1內側及半裁線4。
In this way, with the elongation of the
上述押入解除手段係使輪廓裁切線1內側左右之折割圖示殘材K相對於輪廓裁切線1而離開(如圖11之(III)、(IV)所示)。
The above-mentioned pushing-in release means makes the left and right cut-out material K on the inside of the
其目的如下:不會隨著分割(折割)殘材K或分割緣彼此離開,而產生分割緣之擦傷或破裂。 The purpose is as follows: it will not cause scraping or cracking of the dividing edge as the residual material K or the dividing edge are separated from each other.
因此,使插銷52貫通於長孔53並支持,該插銷52係從汽缸29之安裝座51突出於上方,該長孔53係以兩端朝軌道12長方向之方式設置,於上側夾爪35中,於兩端朝左右方向且在對向內側端變寬之傾斜導引54插入滑件55,隨著汽缸56之伸長使滑件55押出,藉此使上側夾爪35往離開輪廓裁切線1之方向押回。亦即,解除經輪廓裁切線1內側折割之殘材K,不會產生分割緣之擦傷或破裂之類之不良。
Therefore, the
又,殘材K係從中央往左右藉由半裁線4而分割,並解除殘材K一側,接著解除另一側之殘材K,若以如此時間差押入解除方式,則可解除上述擦傷或破裂之不良。圖中61為上側夾爪35之(往迴歸位置)押回機構。
In addition, the residual material K is divided by the half-
又,設置前述下側基底9及上側基底10的要因如下:在上側基底10之左右方向滑動中調整左右方向的位置,在下側基底9滑動中調整輪廓裁切線1、前割用裁切線2的分割作用點。
In addition, the reasons for providing the
A‧‧‧基板 A‧‧‧Substrate
B‧‧‧桌台 B‧‧‧Table
F‧‧‧移動手段 F‧‧‧Moving means
G‧‧‧前折割裝置 G‧‧‧Front cutting device
H‧‧‧後折割裝置 H‧‧‧Folding device
1‧‧‧輪廓裁切線 1‧‧‧Outline cutting line
11‧‧‧定置地板 11‧‧‧ Fixed floor
12‧‧‧軌道 12‧‧‧ Orbit
16‧‧‧軌道 16‧‧‧ Orbit
18‧‧‧馬達 18‧‧‧Motor
19‧‧‧公螺釘 19‧‧‧ male screw
22‧‧‧旋轉體 22‧‧‧rotating body
27‧‧‧軸材 27‧‧‧Shaft
33‧‧‧押片 33‧‧‧ Catch
35‧‧‧夾爪 35‧‧‧jaw
40‧‧‧框 40‧‧‧ frame
41‧‧‧汽缸 41‧‧‧Cylinder
52‧‧‧插銷 52‧‧‧Latch
53‧‧‧長孔 53‧‧‧Long hole
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-004904 | 2018-01-16 | ||
JP2018004904U JP3220338U (en) | 2018-12-17 | 2018-12-17 | Cutting device for lacking edge of substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM590078U true TWM590078U (en) | 2020-02-01 |
Family
ID=65516827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108211450U TWM590078U (en) | 2018-12-17 | 2019-08-28 | Cutting device for breach portion at substrate edge |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3220338U (en) |
CN (1) | CN211030322U (en) |
TW (1) | TWM590078U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113105109A (en) * | 2021-04-15 | 2021-07-13 | 廖顺 | Glass cutting device |
-
2018
- 2018-12-17 JP JP2018004904U patent/JP3220338U/en active Active
-
2019
- 2019-08-28 TW TW108211450U patent/TWM590078U/en unknown
- 2019-09-06 CN CN201921485788.4U patent/CN211030322U/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP3220338U (en) | 2019-02-28 |
CN211030322U (en) | 2020-07-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101240681B1 (en) | Plate material cutting unit, cutting device having the cutting unit, and cutting facility having the cutting device | |
TW201514108A (en) | Scribing method | |
TWI427046B (en) | Broken material of the brittle material substrate | |
JP2007099563A (en) | Apparatus and method of cutting sheet glass | |
TWM511050U (en) | Device for folding and cutting panels | |
TWM590078U (en) | Cutting device for breach portion at substrate edge | |
TWI620632B (en) | Cutting tool for substrate of brittle material | |
JP5129681B2 (en) | Substrate fixing mechanism and substrate fixing method using the same | |
JP5107514B2 (en) | Sorting substrate sorting and picking device | |
TWM530414U (en) | Liquid crystal panel fold-cutting device | |
CN211030323U (en) | Substrate edge end material cutting device | |
CN216862083U (en) | Film tearing device | |
JP2008094632A (en) | Panel parting method and device therefor | |
CN211030229U (en) | End material cutting device of special-shaped substrate | |
JP5517695B2 (en) | Folding device | |
KR100642902B1 (en) | Breaking system of glass | |
JP3220088U (en) | Deformed substrate cutting device | |
TWM594604U (en) | End material cutting device of substrate of special shape | |
CN219925144U (en) | Glass door pressing device | |
CN111148610A (en) | Length-adjustable flexible film material cutting device | |
CN215589652U (en) | Silicon material platform positioning mechanism and cutting equipment | |
JPH10132706A (en) | Inspection device for liquid crystal display panel | |
JP3182943U (en) | Thin cell panel cutting device | |
TWI846518B (en) | Irregular mold material feeder | |
CN110103286B (en) | Display panel cutting area separation device and use method thereof |