TWM588700U - Electroplating plate deplating device - Google Patents
Electroplating plate deplating device Download PDFInfo
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- TWM588700U TWM588700U TW108210580U TW108210580U TWM588700U TW M588700 U TWM588700 U TW M588700U TW 108210580 U TW108210580 U TW 108210580U TW 108210580 U TW108210580 U TW 108210580U TW M588700 U TWM588700 U TW M588700U
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Abstract
本創作屬於電鍍技術领域,公開了一種電鍍板退鍍裝置,包括依次設置的複數夾具、以及用於支撐並帶動複數夾具移動的傳輸機構,還包括呈間隔相對設置的第一固定架與第二固定架,第一固定架上設有調節機構,第二固定架上設有擋位板,在第一固定架與第二固定架之間設有退鍍組件。這樣,透過調節機構與擋位板相互配合使得各夾具在傳輸運行過程中實現開夾;透過在第一固定架與第二固定架之間設有退鍍組件,從而可對開夾後的夾具的導電夾頭進行退鍍清理,實現了夾具在運行過程中打開對導電夾頭進行退鍍清理工序,提高了生產效率。 This creation belongs to the field of electroplating technology, and discloses an electroplating plate de-plating device, which includes a plurality of fixtures arranged in sequence, and a transmission mechanism for supporting and driving the movement of the plurality of fixtures, and further includes a first fixing frame and a second device that are arranged at intervals A fixing frame is provided with an adjustment mechanism on the first fixing frame, a stopper plate is provided on the second fixing frame, and a deplating component is provided between the first fixing frame and the second fixing frame. In this way, through the cooperation between the adjustment mechanism and the stop plate, each clamp can realize clamping during the transmission operation; by providing a de-plating component between the first fixing frame and the second fixing frame, the clamping of the clamp after opening The conductive chuck is deplated and cleaned, which realizes the process of deplating and cleaning the conductive chuck when the fixture is opened during operation, and improves the production efficiency.
Description
本創作係關於電鍍技術領域,特別指一種電鍍板退鍍裝置。 This creation relates to the field of electroplating technology, especially referring to a device for deplating electroplated plates.
在電鍍板生產加工過程中,無論是掛鍍、水平或垂直電鍍中,電鍍夾具的導電夾頭都需進行退鍍這一步驟,雖然在使用過程中,會對導電夾頭部位做了塑膠或橡膠的包覆處理,但緊貼電鍍板的導電夾頭部位仍不可避免的會上鍍,這就需要在每個迴圈使用中都要對導電夾頭進行硝酸退鍍、清洗和吹乾。 During the production and processing of the electroplating board, whether it is hanging plating, horizontal or vertical plating, the conductive chuck of the electroplating fixture needs to be deplated. Although in use, the conductive chuck part is made of plastic or Rubber coating treatment, but the conductive chuck close to the electroplating plate is still inevitably plated. This requires that the conductive chuck be subjected to nitric acid deplating, cleaning and blow drying in each loop.
然而,傳統的電鍍板在退鍍過程中,電鍍夾具的導電夾頭是處於關夾狀態直接退鍍,當需要對導電夾頭的部位進行清理時,需要的退鍍的時間較長,進而導致剝掛槽長度的增加、退鍍藥水的增加以及廢藥水排放的增加,提升了企業的生產成本,降低了生產效率。 However, during the deplating process of traditional electroplating plates, the conductive chuck of the electroplating fixture is directly closed when the clamp is closed. When the part of the conductive chuck needs to be cleaned, it takes a long time to deplat, which leads to The increase in the length of the stripping trough, the increase in the stripping potion and the increase in the discharge of waste potion have increased the production cost of the enterprise and reduced the production efficiency.
本創作之主要目的,在於提供一種電鍍板退鍍裝置,旨在解決現有技術中的電鍍夾具因需對導電夾頭退鍍而導致生產效率低下的技術問題。 The main purpose of this creation is to provide an electroplating plate de-plating device, which aims to solve the technical problem of low production efficiency due to the need to de-plat the conductive chuck in the prior art electro-plating fixture.
因此,為達上述目的,本創作為一種電鍍板退鍍裝置,包括依次設置的複數夾具、以及一用於支撐並帶動該些夾具移動之傳輸機構,其特徵在於:該電鍍板退鍍裝置還包括呈間隔相對設置的第一固定架與第二固定架,該傳輸機構設置於該第二固定架上,該第一固定架上設有一與該些夾具的一側抵接配合之調節機構,該第二固定架上設有一與該些夾具的另一側抵接並配合該調節機構以使得該些夾具在傳輸運行過程中實現開夾之擋位板,該第一固定架與該第二固定架之間設有一用於對開夾後的該些夾具之導電夾頭進行退鍍清理之退鍍組件。 Therefore, in order to achieve the above purpose, the present invention is an electroplating plate deplating device, which includes a plurality of sequentially arranged clamps, and a transmission mechanism for supporting and driving the movement of the clamps, characterized in that the electroplating plate deplating device also It includes a first fixing frame and a second fixing frame which are arranged at intervals, and the transmission mechanism is arranged on the second fixing frame. The first fixing frame is provided with an adjusting mechanism which abuts and cooperates with one side of the clamps. The second fixing frame is provided with a stop plate which is in contact with the other sides of the clamps and cooperates with the adjustment mechanism to enable the clamps to open the clamp during the transmission operation. The first fixing frame and the second A deplating component for deplating and cleaning the conductive chucks of the clamps after clamping is provided between the fixing frames.
承上所述之電鍍板退鍍裝置,其中該退鍍組件包括一設置於該第二固定架上之支撐座、以及一固設於該支撐座上並用於盛裝一退鍍液之盛裝盒,該盛裝盒上開設有一供該些夾具之導電夾頭伸入該退鍍液中進行退鍍清理之開口。 According to the electroplating plate de-plating device described above, the de-plating component includes a support seat provided on the second fixing frame, and a holding box fixed on the support seat and used for containing a de-plating solution, The container has an opening for the conductive chucks of the fixtures to extend into the stripping solution for stripping cleaning.
承上所述之電鍍板退鍍裝置,其中該開口的截面形狀呈U形或者V形。 According to the electroplating plate stripping device described above, the cross-sectional shape of the opening is U-shaped or V-shaped.
承上所述之電鍍板退鍍裝置,其中該支撐座遠離該第一固定架的一端固定於該第二固定架上,該支撐座靠近該第一固定架的一端用於承載該盛裝盒。 According to the electroplating plate deplating device described above, the end of the support base away from the first fixing frame is fixed on the second fixing frame, and the end of the support base near the first fixing frame is used to carry the container.
承上所述之電鍍板退鍍裝置,其中該導電夾頭的底端與該盛裝盒的頂端相齊平。 According to the electroplating plate stripping device described above, the bottom end of the conductive chuck is flush with the top end of the containing box.
承上所述之電鍍板退鍍裝置,其中該調節機構包括一端呈傾斜設置於該第一固定架上並與該擋位板配合以使該些夾具在傳輸移動過程中呈逐漸開夾狀態之第一擋位桿,該第一擋位桿的另一端安裝有與該擋位板配合以使該些夾具在 移動過程中保持開夾狀態之調節座,該調節座安裝於該第一固定架上。 According to the electroplating plate deplating device described above, the adjusting mechanism includes an end that is inclinedly disposed on the first fixing frame and cooperates with the stop plate to make the clamps gradually open during the movement of the clamps A first gear lever, the other end of the first gear lever is fitted with the gear plate to make the clamps An adjustment base that maintains a clip-open state during movement, and the adjustment base is installed on the first fixing frame.
承上所述之電鍍板退鍍裝置,其中該第一擋位桿與該擋位板之間的距離沿著該些夾具的移動方向逐漸縮小。 According to the electroplating plate de-plating device described above, the distance between the first gear lever and the gear plate gradually decreases along the movement direction of the clamps.
承上所述之電鍍板退鍍裝置,其中該調節座遠離該第一擋位桿的一端還安裝有配合該擋位板以使該些夾具在移動過程中呈逐漸合夾狀態之第二擋位桿。 According to the electroplating plate de-plating device described above, the end of the adjusting base away from the first gear lever is also installed with a second gear that cooperates with the gear board to make the clamps gradually close to the clamping state during the movement Position rod.
承上所述之電鍍板退鍍裝置,其中該第二擋位桿與該擋位板之間的距離沿著該些夾具的移動方向逐漸增大。 According to the electroplating plate de-plating device described above, the distance between the second gear lever and the gear plate gradually increases along the movement direction of the clamps.
承上所述之電鍍板退鍍裝置,其中該第一擋位桿、該調節座、以及該第二擋位桿一體成型。 According to the electroplating plate deplating device described above, the first gear lever, the adjusting seat, and the second gear lever are integrally formed.
本創作提供的電鍍板退鍍裝置的有益效果在於:與現有技術相比,本創作的電鍍板退鍍裝置,透過設置傳輸機構,從而可支撐夾具並帶動夾具移動;透過設置呈間隔相對設置的第一固定架與第二固定架,並在第一固定架上設有調節機構,在第二固定架上安裝有擋位板,透過調節機構與擋位板相互配合使得各夾具在傳輸運行過程中實現開夾;此外,透過在第一固定架與第二固定架之間設有退鍍組件,從而可對開夾後的夾具的導電夾頭進行退鍍清理,實現了夾具在運行過程中打開對導電夾頭進行退鍍清理工序,縮短了退鍍的時長,提高了生產效率。 The beneficial effect of the electroplating plate de-plating device provided by this creation is that, compared with the prior art, the electroplating plate de-plating device of this creation can support the jig and drive the jig to move through the setting of the transmission mechanism; The first fixing frame and the second fixing frame are provided with an adjustment mechanism on the first fixing frame, and a stop plate is installed on the second fixing frame. Through the cooperation between the adjustment mechanism and the stop plate, each fixture is operated during the transmission operation Clamping is achieved in addition; in addition, by providing a stripping component between the first fixing frame and the second fixing frame, the conductive chuck of the clamp after clamping can be stripped and cleaned, and the clamp is opened during operation The stripping and cleaning process of the conductive chuck shortens the length of stripping and improves production efficiency.
綜上所述,本案不但在空間型態上確屬創新,並能較習用物品增進上述多項功效,應已充分符合新穎性及進步性之法定新型專利要件,爰依法提出申請,懇請 貴局核准本件新型專利申請案,以勵創作,至感德便。 In summary, this case is not only innovative in terms of space type, but also can improve the above-mentioned multiple functions compared with conventional articles. It should have fully met the requirements of novelty and progressive legal new type patents. This new type of patent application is designed to encourage creativity and to feel virtuous.
1‧‧‧夾具 1‧‧‧ Fixture
11‧‧‧滾筒組件 11‧‧‧Drum assembly
111‧‧‧導向桿 111‧‧‧Guide rod
112‧‧‧滾筒 112‧‧‧Roller
12‧‧‧第一夾臂 12‧‧‧First clamp arm
13‧‧‧第二夾臂 13‧‧‧Second clamp arm
14‧‧‧鉸接機構 14‧‧‧ articulated mechanism
141‧‧‧鉸接軸 141‧‧‧ articulated shaft
142‧‧‧推動件 142‧‧‧Pushing piece
15‧‧‧導電夾頭 15‧‧‧conductive chuck
2‧‧‧傳輸機構 2‧‧‧ Transmission organization
21‧‧‧主動輪 21‧‧‧Drive wheel
22‧‧‧從動輪 22‧‧‧driven wheel
23‧‧‧傳送帶 23‧‧‧Conveyor belt
3‧‧‧第一固定架 3‧‧‧ First fixing frame
4‧‧‧第二固定架 4‧‧‧Second fixing frame
5‧‧‧調節機構 5‧‧‧Regulation mechanism
51‧‧‧第一擋位桿 51‧‧‧ First gear lever
52‧‧‧調節座 52‧‧‧Adjustable seat
53‧‧‧第二擋位桿 53‧‧‧second gear lever
6‧‧‧擋位板 6‧‧‧stop plate
7‧‧‧退鍍組件 7‧‧‧Deplating components
71‧‧‧支撐座 71‧‧‧Support
72‧‧‧盛裝盒 72‧‧‧Box
73‧‧‧開口 73‧‧‧ opening
第1圖為本創作電鍍板退鍍裝置之結構示意圖。 Figure 1 is a schematic diagram of the structure of a de-plating device for creating an electroplating plate.
第2圖為本創作電鍍板退鍍裝置之另一結構示意圖。 Fig. 2 is another schematic structural diagram of a de-plating device for creating an electroplating plate.
第3圖為本創作電鍍板退鍍裝置之盛裝盒與導電夾頭之結構示意圖。 Figure 3 is a schematic diagram of the structure of the container and conductive chuck of the electroplating plate de-plating device.
第4圖為本創作電鍍板退鍍裝置之傳輸機構之結構示意圖。 Fig. 4 is a schematic structural diagram of a transmission mechanism for creating an electroplating plate de-plating device.
第5圖為本創作電鍍板退鍍裝置之夾具之結構示意圖。 Figure 5 is a schematic diagram of the structure of the fixture for the deplating device of the electroplating plate.
為了使本創作的目的、技術方案及優點更加清楚明白,以下結合圖式及實施例,對本創作進行進一步詳細說明。應當理解,此處所描述的具體實施例僅僅用以解釋本創作,並不用於限定本創作。 In order to make the purpose, technical solutions and advantages of this creation more clear, the creation will be further described in detail in conjunction with the drawings and embodiments below. It should be understood that the specific embodiments described herein are only used to explain the creation, and are not used to limit the creation.
需要說明的是,當元件被稱為“固定於”或“設置於”另一個元件,它可以直接在另一個元件上或可能同時存在居中元件。當一個元件被稱為是“連接於”另一個元件,它可以是直接連接到另一個元件或者可能同時存在居中元件。 It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on another element or there may be a center element at the same time. When an element is said to be "connected to" another element, it may be directly connected to the other element or may be centered at the same time.
另外,還需要說明的是,本創作實施例中的左、右、上、下等方位用語,僅是互為相對概念或是以產品的正常使用狀態為參考的,而不應該認為是具有限制性的以下結合具體實施例對本創作的實現進行詳細的描述。 In addition, it should also be noted that the terms of left, right, top and bottom in this creative example are only relative concepts or refer to the normal use status of the product, and should not be considered as limiting The following is a detailed description of the implementation of this creation in conjunction with specific embodiments.
請參閱第1圖至第5圖所示,本創作實施例提供一種電鍍板退鍍裝置,包括依次設置的複數夾具1以及用於支撐
並帶動夾具1移動的傳輸機構2,該電鍍板退鍍裝置還包括第一固定架3與第二固定架4,第一固定架3與第二固定架4呈間隔相對設置,該傳輸機構2設置於第二固定架4上,在第一固定架3上設有調節機構5,該調節機構5與各夾具1的一側抵接配合,在第二固定架4上設有擋位板6,該擋位板6與夾具1的另一側抵接配合,這樣,調節機構5與擋位板6配合可使得各夾具1在傳輸運行過程中實現開夾,此外,在第一固定架3與第二固定架4之間還設有退鍍組件7,該退鍍組件7可對各夾具1的導電夾頭15進行退鍍。這樣,透過設置傳輸機構2,從而可支撐夾具1並帶動夾具1移動;透過設置呈間隔相對設置的第一固定架3與第二固定架4,並在第一固定架3上設有調節機構5,在第二固定架4上安裝有擋位板6,透過調節機構5與擋位板6相互配合使得各夾具1在傳輸運行過程中實現開夾;此外,透過在第一固定架3與第二固定架4之間設有退鍍組件7,從而可對開夾後的夾具1的導電夾頭15進行退鍍清理,實現了夾具1在運行過程中打開對導電夾頭15進行退鍍清理工序,縮短了退鍍的時長,提高了生產效率。
Please refer to FIG. 1 to FIG. 5, this creative embodiment provides an electroplating plate stripping device, which includes a plurality of
進一步地,請參閱第2圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該退鍍組件7包括支撐座71,該支撐座71設置於第二固定架4上,在第二固定架4上設有盛裝盒72,該盛裝盒72可用於盛裝退鍍液,此外,在盛裝盒72上開設有開口73,該開口73可供各夾具1的導電夾頭15伸入至退鍍液中進行退鍍清理,實現各夾具1在移動過程中進行退鍍清理工序,提高了生產效率。
Further, please refer to FIG. 2, as a specific embodiment of the electroplating plate deplating device provided by the author, the
優選地,上述開口73的截面呈V形設置,透過將開口73設置為V形,可較好地適配導電夾頭15的形狀,使得導
電夾頭15能夠得到較好的退鍍清洗,當然,在本實施例中,根據實際情況和具體需求,該開口73的截面也可呈U形等其他形狀設置,此處不作唯一限定。
Preferably, the
優選地,在本實施例中,該支撐座71遠離第一固定架3的一端固定設於第二固定架4上,該支撐座71靠近第一固定架3的一端可用於承載該盛裝盒72上,具體地,該支撐座71透過螺釘固定於第二固定架4上,當然,在本實施例中,該支撐座71也可透過其他方式安裝於第一固定架3上,此處不作唯一限定。
Preferably, in this embodiment, the end of the
優選地,在本實施例中,請參閱第3圖所示,該導電夾頭15的底端與盛裝盒72的頂端相齊平,如第3圖中A所指的位置為導電夾頭的底端位置。透過這樣設置,從而可將導電夾頭15完全入盛裝盒72中,增強了退鍍清理的效果,當然,在本實施例中,根據實際情況和具體需求,該導電夾頭15的底端也可設置為低於或高於盛裝盒72的頂端,此處不作唯一限定。
Preferably, in this embodiment, as shown in FIG. 3, the bottom end of the
進一步地,請參閱第1圖與第2圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該調節機構5包括第一擋位桿51,該第一擋位桿51的一端呈傾斜設置於第一固定架3上,且該第一擋位桿51與擋位板6配合可使得各夾具1在傳輸移動過程中呈逐漸打開狀態,在上述第一擋位桿51的另一端安裝有調節座52,該調節座52安裝於第一固定架3上,且該調節座52可與擋位板6配合可使得各夾具1在傳輸移動過程中保持開夾狀態,為後續對導電夾頭15的退鍍做好了準備。
Further, please refer to FIG. 1 and FIG. 2, as a specific embodiment of the plating stripping device provided by the author, the adjustment mechanism 5 includes a
在本實施例中,當各夾具1在傳輸機構2的帶動下
移動時,當移動至與第一擋位桿51和擋位板6均接觸時,此時,各夾具1一側與第一擋位桿51接觸,各夾具1的另一側與擋位板6接觸,當各夾具1繼續移動時,由於各夾具1受到第一擋位桿51與擋位板6之間的夾緊力越來越大,此時,各夾具1則呈現逐漸打開狀態,當各夾具1移動至第一擋位桿51與調節座52的連接位置處時,此時各夾具1的張開角度達到最大,隨後,隨著各夾具1繼續移動,此時,各夾具1的一側與調節座52抵接,各夾具1的另一側與擋位板6抵接,則在調節座52與擋位板6的配合作用下,使得各夾具1在傳輸過程中始終保持張開狀態,從而為後續的各夾具1的導電夾頭15的退鍍提供了保證。
In this embodiment, when each
進一步地,請參閱第1圖與第2圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該第一擋位桿51與擋位板6之間的距離沿著各夾具1傳輸移動的方向逐漸縮小。透過這樣設置,從而使得各夾具1在傳輸移動的過程中,使得第一擋位桿51與擋位板6對各夾具1產生的抵接壓力呈逐漸增大狀態,為各夾具1在傳輸移動過程中呈逐漸打開狀態提供了保證。當然,在本實施例中,根據實際情況和具體需求,該第一擋位桿51與擋位板6之間的距離也可其他形式分佈,此處不作唯一限定。
Further, please refer to FIG. 1 and FIG. 2, as a specific embodiment of the electroplating plate deplating device provided by the author, the distance between the
進一步地,請參閱第1圖與第2圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該調節機構5還包括第二擋位桿53,該第二擋位桿53設置在遠離第一擋位桿51的一端,且該第二擋位桿53可與擋位板6配合使得夾具1在傳輸移動過程中呈逐漸合夾狀態。
Further, please refer to FIG. 1 and FIG. 2, as a specific embodiment of the electroplating plate deplating device provided by the author, the adjustment mechanism 5 further includes a
在本實施例中,當各夾具1與第一擋位桿51及擋位板6抵接時,此時可實現各夾具1的逐漸開夾,當各夾具1與調
節座52以及擋位板6抵接時,此時在調節座52與擋位板6的配合夾持下始終保持張開狀態,並在退鍍組件7中進行退鍍清洗,實現各夾具1一邊移動一邊進行退鍍清理工序,當進行退鍍清理工序之後,隨著各夾具1移動至與第二擋位桿53和擋位板6接觸時,此時,在第二擋位桿53與擋位板6的配合作用下,各夾具1可實現逐漸合夾,完成了各夾具1在傳輸移動過程中慢慢開夾一開夾保持一慢慢合夾的過程。
In this embodiment, when each
進一步地,請參閱第1圖與第2圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該第二擋位桿53與擋位板6之間的距離沿著各夾具1傳輸移動的方向逐漸增大。透過這樣設置,從而使得各夾具1在傳輸移動的過程中,使得第二擋位桿53與擋位板6對各夾具1產生的抵接壓力呈逐漸減小狀態,為各夾具1在傳輸移動過程中呈逐漸閉合狀態提供了保證,與此同時,也避免了各夾具1在自身結構作用下閉合發生剛性碰撞而對各夾具造成損壞,降低了各夾具1的使用壽命。當然,在本實施例中,根據實際情況和具體需求,該第一擋位桿51與擋位板6之間的距離也可其他形式分佈,此處不作唯一限定。
Further, please refer to FIG. 1 and FIG. 2, as a specific embodiment of the electroplating plate deplating device provided by the author, the distance between the
優選地,上述調節座52與擋位板6呈平行設置,這樣,可保證調節座52與擋位板6之間的抵接壓力是恆定不變,為後續各夾具1在退鍍組件7中進行退鍍清洗提供了保證,當然,在本實施例中,根據實際情況和具體需求,該調節座52與擋位板6也可呈其他形式分佈,此處不作唯一限定。
Preferably, the
優選地,上述第一擋位桿51、調節座52、以及第二擋位桿53一體成型,透過一體成型,可簡化後續對調節機構5的機械加工,簡化了加工的工藝流程。當然,在本實施例中,
根據實際情況和具體需求,該第一擋位桿51、調節座52、以及第二擋位桿53也可透過焊接的方式相互連接,又或者透過其他方式連接,此處不作唯一限定。
Preferably, the
進一步地,請參閱第4圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該傳輸機構2包括主動輪21與從動輪22,該主動輪21與從動輪22呈間隔相對設置,此外,該傳輸機構2還包括傳送帶23與驅動件(圖未示),該傳送帶23套裝於主動輪21與從動輪22上,且該傳送帶23可用於承載各夾具1,該驅動件與主動輪21連接,進而可帶動主動輪21轉動。這樣,透過驅動件帶動主動輪21轉動,主動輪21在傳送帶23的作用下帶動從動輪22轉動,從而可實現傳送帶23帶動各夾具1移動。優選地,在本實施例中,該驅動件可為驅動電機,當然該驅動件也可為一手輪帶動主動輪21轉動,此處不作唯一限定。
Further, please refer to FIG. 4, as a specific embodiment of the electroplating plate deplating device provided by the author, the
進一步地,請參閱第5圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,各夾具1包括第一夾臂12、第二夾臂13、以及鉸接機構14,該第一夾臂12與擋位板6抵接配合,該鉸接機構14可用於將第一夾臂12與第二夾臂13鉸接,在上述第二夾臂13上還設有滾筒組件11,該滾筒組件11可與調節機構5抵接配合。這樣,透過第一夾臂12與擋位板6抵接配合,滾筒組件11與調節機構5抵接配合,當各夾具1在調節機構5與擋位板6的夾持配合下移動,實現各夾具1由慢慢開夾-保持開夾-慢慢閉合的狀態。
Further, please refer to FIG. 5, as a specific embodiment of the plating plate stripping device provided by the present creation, each
具體地,該滾筒組件11包括導向桿111,該導向桿111一端呈傾斜設置於第二夾臂13上,在該導向桿111上設置有滾筒112,該滾筒112可轉動地設於導向桿111上,該滾筒112
可與上述調節機構5抵接配合,使得導向桿111帶動第二夾臂13朝向遠離第一夾臂12的方向運動。這樣,透過將滾筒112轉動地套裝於導向桿111上,當滾筒112與調節機構5接觸時,滾筒112可發生自轉,從而可減小與導軌機構3之間的摩擦力,避免了夾具1的物理性的損壞。
Specifically, the
進一步地,請參閱第5圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該導向桿111的軸向與第二夾臂13之間的夾角為100~150°,如第5圖所示,第5圖中的a代表的是導向桿111的軸向與第二夾臂13之間的夾角。具體地,該夾角a可為100°、110°、120°、130°、140°等,在本實施例中,該夾角a為150°,透過這樣設置,當導向桿111上的滾筒112與導軌機構3接觸時,可便於導向桿111帶動第二夾臂13朝向遠離第一夾臂12方向移動,與此同時,增大了第一夾臂12與第二夾臂13之間的開夾角度。當然,在本實施例中,根據實際情況和具體需求,該夾角a也可設置為其他角度,此處不作唯一限定。
Further, please refer to FIG. 5, as a specific embodiment of the plating stripping device provided by the author, the angle between the axial direction of the
進一步地,請參閱第5圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,該導向桿111軸向方向的長度大於滾筒112沿著導向桿111軸向方向的長度,透過這樣設置,一方面,可使得導向桿111能夠較好的支撐滾筒112,另一方面,減少滾筒112與導向桿111之間的接觸面積,進而減小滾筒112與導向桿111之間的摩擦力,便於滾筒112在抵接配合過程中發生自轉。當然,在本實施例中,該導向桿111軸向方向的長度也可設置為等於或小於該滾筒112沿著導向桿111的長度,此處不作唯一限定。
Further, please refer to FIG. 5, as a specific embodiment of the plating stripping device provided by the author, the length of the
優選地,在本實施例中,上述滾筒112為圓柱形,透過將滾筒112設置為圓柱形,從而可便於滾筒112沿著導向桿
111發生轉動,當然,在本實施例中,該滾筒112也可設置為圓錐形、球形等形狀,此處不作限定。
Preferably, in this embodiment, the
進一步地,請參閱第4圖,作為本創作提供的電鍍板退鍍裝置的一種具體實施方式,上述鉸接機構14包括鉸接軸141,該鉸接軸141可用於將第一夾臂12與第二夾臂13鉸接,在鉸接軸141上安裝有推動件142,該推動件142可用於推動第二夾臂13抵壓第一夾臂12,實現第一夾臂12與第二夾臂13夾持電路板。
Further, please refer to FIG. 4, as a specific embodiment of the electroplating plate stripping device provided by the present creation, the above-mentioned
優選地,在本實施例中,該推動件142為扭簧,該扭簧套設於鉸接軸141上,且該扭簧的一端抵持於第一夾臂12上,該扭簧的另一端抵持於第二夾臂13上。透過扭簧可推動第二夾臂13抵壓第一夾臂12,實現第一夾臂12與第二夾臂13夾持電路板。當然,在本實施例中,該推動件142也可設置彈片等其他結構件,此處不作唯一限定。
Preferably, in this embodiment, the pushing
在本實施例中,當傳輸機構2帶動各夾具1朝向調節機構5的方向移動時,此時,當滾筒112移動至與第一擋位桿51抵接,第一夾臂12與擋位板6抵接時,滾筒112會在傳輸機構2的作用下一邊移動一邊在第一擋位桿51上轉動,當滾筒112與第一擋位桿51的抵接壓力逐漸增大時,此時滾筒112透過導向桿111可帶動夾具1逐漸開夾,當滾筒112繼續移動時,此時當滾筒112與調節座52抵接配合時,此時可保證夾具1處於打開狀態,當滾筒112繼續移動時,此時當滾筒112與第二擋位桿53接觸時,滾筒112在傳輸移動過程中,滾筒112與第二擋位桿53的抵接壓力逐漸減小,此時,夾具1在扭簧的作用下逐漸閉合,實現了夾具1在移動過程中呈慢慢開夾一保持開夾一慢慢閉合的狀態,從而為後續的退鍍提供了保證,進而提高了的生產效
率。
In this embodiment, when the
綜上所述,僅為本創作之較佳可行實施例,非因此即侷限本創作之專利範圍,舉凡運用本創作說明書及圖式內容所為之等效結構變化,均理同包含於本創作之範圍內,合予陳明。 In summary, this is only the preferred and feasible embodiment of this creation, and therefore not to limit the scope of the patent of this creation. Any equivalent structural changes in the use of this creation description and the content of the drawings are equally included in this creation. Within the scope, together with Chen Ming.
1‧‧‧夾具 1‧‧‧ Fixture
3‧‧‧第一固定架 3‧‧‧ First fixing frame
4‧‧‧第二固定架 4‧‧‧Second fixing frame
5‧‧‧調節機構 5‧‧‧Regulation mechanism
51‧‧‧第一擋位桿 51‧‧‧ First gear lever
52‧‧‧調節座 52‧‧‧Adjustable seat
53‧‧‧第二擋位桿 53‧‧‧second gear lever
6‧‧‧擋位板 6‧‧‧stop plate
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CN201920413182.3U CN209941134U (en) | 2019-03-28 | 2019-03-28 | Electroplating plate deplating device |
CN201920413182.3 | 2019-03-28 |
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TWM588700U true TWM588700U (en) | 2020-01-01 |
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