TWM586500U - Shock absorption structure - Google Patents

Shock absorption structure Download PDF

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Publication number
TWM586500U
TWM586500U TW108207832U TW108207832U TWM586500U TW M586500 U TWM586500 U TW M586500U TW 108207832 U TW108207832 U TW 108207832U TW 108207832 U TW108207832 U TW 108207832U TW M586500 U TWM586500 U TW M586500U
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Taiwan
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perforations
absorbing structure
sound
shock absorbing
shock
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TW108207832U
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Chinese (zh)
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吳周榮
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精英電腦股份有限公司
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Priority to TW108207832U priority Critical patent/TWM586500U/en
Publication of TWM586500U publication Critical patent/TWM586500U/en

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Abstract

本創作提供一種減震結構,透過複數個第一固定元件將該減震結構固定於一裝置上,該減震結構包含一基座,該基座設有複數個第一通孔以及複數個連接件,複數個減震元件設有複數個第一穿孔且分別設置於該些個第一通孔,複數個第一固定元件穿設該些個第一穿孔將該基座固定於該裝置上,該承載座上設有一第一容置空間以及複數個第二穿孔,該連接件分別設置於該些個第二穿孔,將該承載座固定於該基座上,且該第一容置空間設置一收音元件,其包含有一緩衝元件及一吸音件,另有一頂蓋設有一貫穿孔、一凹槽以及於其下側凸設複數個連接部,該些個連接部插設於該些個第二穿孔,進一步設置複數個第二固定元件插設該些個第三穿孔、該些第二穿孔與該些個連接件固接,以固定該頂蓋、該承載座及該基座。 This creation provides a shock-absorbing structure, which is fixed to a device through a plurality of first fixing elements, the shock-absorbing structure includes a base, the base is provided with a plurality of first through holes and a plurality of connections Pieces, the plurality of shock absorbing elements are provided with a plurality of first perforations and are respectively disposed in the first through holes, the plurality of first fixing elements pass through the first perforations to fix the base on the device, The bearing seat is provided with a first receiving space and a plurality of second perforations, the connecting members are respectively disposed at the second holes, the bearing seat is fixed on the base, and the first receiving space is provided A sound-receiving element includes a buffer element and a sound-absorbing member, and a top cover is provided with a through hole, a groove, and a plurality of connecting portions protruding from a lower side thereof, and the connecting portions are inserted in the first The two perforations are further provided with a plurality of second fixing elements for inserting the third perforations, and the second perforations are fixedly connected to the connecting members to fix the top cover, the bearing seat and the base.

Description

減震結構 Shock-absorbing structure

本創作係關於一種結構,特別是一種減震結構。This creation is about a structure, especially a shock-absorbing structure.

傳統麥克風簡稱麥,又稱微音器或話筒,正式的中文名是傳聲器),譯自英文microphone,是由聲音的振動傳到麥克風的振膜上,推動裡面的磁鐵形成變化的電流,變化的電流送到後面的聲音處理電路進行放大處理。因此,由上述可知,麥克風是一種藉由各種方式,將講話、唱歌、或是樂器表演的聲波,也就是俗稱的振動轉換成電的訊號。The traditional microphone is called Mai, also known as a microphone or a microphone. The official Chinese name is microphone. Translated from the English microphone, the vibration of the sound is transmitted to the diaphragm of the microphone, which drives the magnet inside to form a changing current. The current is sent to the subsequent sound processing circuit for amplification. Therefore, from the above, it can be known that the microphone is a signal that converts the sound waves of speech, singing, or musical instrument performance, which is commonly known as vibration, into electricity in various ways.

麥克風類型又可分成下列幾種類型:動圈式麥克風(Dynamic Microphone),其包含線圈、振膜、永久磁鐵三部分,因為含有線圈和磁鐵,不像電容式麥克風輕便,靈敏度較低,高低頻響應表現較差。優點是聲音較為柔潤,適合用來收錄人聲;電容式麥克風(Condenser Microphone) 並沒有線圈及磁鐵,靠著電容兩片隔板間距離的改變來產生電壓變化,電容式麥克風因靈敏度較高,常用於高品質的錄音;駐極體電容麥克風(Electret Condenser Microphone)使用了可保有永久電荷的駐極體物質,因而不需再對電容器供電。但一般駐極體麥克風元件內建有電子電路以放大訊號,因此仍需以低電壓供電(常規電壓是1.0V-10V),此種麥克風目前廣泛使用在消費電子產品之中;微機電麥克風(MEMS Microphone)指使用微機電(MEMS,MicroElectrical-Mechanical System)技術做成的麥克風,也稱麥克風晶片(microphone chip)或矽麥克風(silicon microphone),微機電麥克風的主要應用於部分的手機、PDA等小型行動產品。此類小型麥克風以往使用的幾乎均是駐極體電容麥克風;鋁帶式麥克風(Ribbon Microphone) 在磁鐵兩極間放入通常是鋁質的波浪狀金屬箔帶,金屬薄膜受聲音震動時,因電磁感應而生訊號,由於形狀龐大及鋁箔帶很薄的脆弱性,現今主要用於專業錄音室;以及碳精麥克風(Carbon Microphone)作為舊式電話機的碳精話筒而曾大量使用,現在少人使用。Microphone types can be divided into the following types: Dynamic Microphones, which include coils, diaphragms, and permanent magnets. Because they contain coils and magnets, they are not as lightweight as condenser microphones, with low sensitivity and high and low frequencies. The response is poor. The advantage is that the sound is soft and suitable for recording human voice. The condenser microphone (Condenser Microphone) does not have a coil and a magnet. It changes the voltage by changing the distance between the two diaphragms of the capacitor. The condenser microphone is commonly used because of its high sensitivity For high-quality recording; the electret condenser microphone (Electret Condenser Microphone) uses an electret substance that can retain a permanent charge, so there is no need to power the capacitor. However, general electret microphone components have built-in electronic circuits to amplify signals, so they still need to be powered by low voltage (normal voltage is 1.0V-10V). Such microphones are currently widely used in consumer electronics; micro-electromechanical microphones ( MEMS Microphone refers to a microphone made using MEMS (MicroElectrical-Mechanical System) technology. It is also called a microphone chip or a silicon microphone. MEMS microphones are mainly used in some mobile phones, PDAs, etc. Small mobile products. Almost all such small microphones used in the past are electret condenser microphones. Ribbon microphones (Ribbon Microphones) Wavy metal foil strips, usually aluminum, are placed between the two poles of the magnet. Inductive signals are mainly used in professional recording studios due to their large shape and the fragility of aluminum foil strips. Carbon Microphones have been used extensively as carbon microphones in old telephones, and are now rarely used.

麥克風是蒐集空氣的震動,如此的訊號不會是一種很強大的訊號,但是偏偏此種訊號距離長會導致衰減之外,空氣種還有各種「電波」,如基地台的電波、WIFI的無線訊號……等等,在訊號微弱且距離拉長的情況下,接收到的訊號變得更微弱,此時在空氣中產生的各種訊號,就會形成在麥克風中的各種干擾雜訊。The microphone is used to collect air vibrations. Such a signal will not be a very powerful signal. However, the long range of this signal will cause attenuation. In addition to the air, there are various "radio waves", such as radio waves from base stations, and wireless from WIFI. Signals ... wait, when the signal is weak and the distance is long, the received signal becomes weaker. At this time, various signals generated in the air will form various interference noises in the microphone.

當電波產生的訊號會使麥克風產生雜訊外,若麥克風裝設於主機殼體內部,當主機運作時,主機殼體會因為內部運作而產生震動,於是這個震動就會造成在主機內的細小聲音,此時開啟麥克風就會把這些細小的聲音也接收,產生雜音。When the signal generated by the radio waves will cause noise to the microphone, if the microphone is installed inside the main body case, when the main body is operating, the main body case will cause vibration due to the internal operation, so this vibration will cause the inside of the main body. Small sounds. At this time, turning on the microphone will receive these small sounds and generate noise.

另外,除了上述在空氣中的電波會造成麥克風接收到多餘雜訊,以及運作產生的雜音外,還有另一種狀況也會使麥克風產生雜訊,因為麥克風本身的所造成的接觸不良之情形,例如說麥克風導線斷裂,或是導線氧化等情形,但麥克風接觸不良的問題,可以透過簡單的置換線材等的手法即可解決,因此,主要還是會專注於「電波干擾」的抑制。In addition, in addition to the above-mentioned radio waves in the air, the microphone may receive unwanted noise and noise generated during operation, there is another condition that may also cause the microphone to generate noise because of the poor contact caused by the microphone itself. For example, the microphone lead is broken or the wire is oxidized. However, the problem of poor microphone contact can be solved by simply replacing the wire. Therefore, the main focus is on the suppression of "radio interference".

現有的麥克風抑制雜訊之方法,多數以電子方式進行數位抑制雜訊,例如透過程式調整抑制麥克風的雜訊、取消聲音共鳴、增強麥克風以及消除準位偏移等模式,控制麥克風在收音時所一併收入的雜訊,但是,此種方法僅能消除由各種電子訊號所產生的電波雜訊,但其並無法消除因結構所產生的環境雜訊。Most of the existing methods for microphone noise suppression are electronically digitally suppressing noise, such as through program adjustments to suppress microphone noise, cancel sound resonance, enhance the microphone, and eliminate level shifts. Noise is also collected, but this method can only eliminate radio noise generated by various electronic signals, but it cannot eliminate environmental noise caused by the structure.

而為了解決上述因結構震動所產生的環境雜音之問題,本創作提供一種將麥克風透過矽膠覆蓋產生氣密的結構,使外部環境的聲音被氣密結構隔離,使麥克風不會接收到外部環境產生震動所形成的雜音。In order to solve the above-mentioned problem of environmental noise caused by structural vibrations, this creation provides a structure that seals the microphone through silicone to produce an air-tight structure, so that the sound of the external environment is isolated by the air-tight structure, so that the microphone will not receive the external environment. Noise caused by vibration.

此外,本創作亦可使用利用電子方式來抑制電子雜訊,結合上述氣密結構,使麥克風在使用時,不會接收到電子訊號所產生的電子雜訊,透過本創作之結構,也可以避免將麥克風接收安裝於封閉結構時,因為震動所產生的環境音,使麥克風在運作時,能夠順利的接收主要音效,避免雜訊一併接收。In addition, this creation can also use electronic methods to suppress electronic noise. In combination with the air-tight structure described above, the microphone will not receive electronic noise generated by electronic signals when used. Through the structure of this creation, it can also be avoided. When the microphone receiver is installed in a closed structure, the ambient sound generated by the vibration enables the microphone to smoothly receive the main sound effect during operation, avoiding noise reception at the same time.

依據上述內容可以知道,本創作為提供一種減震結構,透過該結構使麥克風在密閉環境錄製或接收音效時,不會接收到環境中的震動雜音,使收錄之主要音效清楚呈現。Based on the above, it can be known that this creation is to provide a shock-absorbing structure through which the microphone will not receive vibration noise in the environment when recording or receiving sound effects in a closed environment, so that the main recorded sound effects are clearly presented.

本創作之一目的,在於提供一種減震結構,其可將麥克風包覆,使麥克風在接收音效時,不會被外部環境的聲音影響之結構。One of the purposes of this creation is to provide a structure that can cover the microphone so that the microphone will not be affected by the sound of the external environment when receiving the sound effect.

針對上述之目的,本創作提供一種減震結構,其係固定於一裝置內,該減震結構係包含有一基座,其上設有複數個第一通孔以及複數個連接件,複數個減震元件設有複數個第一穿孔且分別設置於該些個第一通孔,複數個第一固定元件穿設該些個第一穿孔將該基座固定於該裝置上,一承載座,其係固定於該基座上,進一步,其上設有一第一容置空間,於該第一容置空間設置一收音元件,該收音元件上設置有一緩衝元件及一吸音件,並進一步於該承載座設置複數個第二穿孔,該些個連接件係設置於該些個第二穿孔,以及一頂蓋,其係設置於該承載座之上,並設有一貫穿孔、一凹槽以及於其下側凸設複數個連接部,該凹槽相對設置該吸音件,該些個連接部設置複數個第三穿孔,該些個連接部插設於該些個第二穿孔,進一步設置複數個第二固定元件插設該些個第三穿孔、該些個第二穿孔與該些個連接件固接,以固定該頂蓋、該承載座及該基座。For the above purpose, the present invention provides a shock-absorbing structure, which is fixed in a device. The shock-absorbing structure includes a base on which a plurality of first through holes and a plurality of connecting members are provided. The vibrating element is provided with a plurality of first perforations and is respectively disposed in the first through holes. The plurality of first fixing elements pass through the first perforations to fix the base on the device. It is fixed on the base, and further, a first receiving space is provided thereon, a sound receiving element is provided in the first receiving space, a buffer element and a sound absorbing member are provided on the sound receiving element, and further on the bearing The seat is provided with a plurality of second perforations, the connecting members are provided at the second perforations, and a top cover is provided on the bearing seat, and is provided with a through hole, a groove, and A plurality of connecting portions are convexly arranged on the lower side, the groove is oppositely provided with the sound absorbing member, the connecting portions are provided with a plurality of third perforations, the connecting portions are inserted into the second perforations, and a plurality of first Two fixed components are inserted into the A third through hole, the plurality of perforations and the plurality of second connection member fixed to the fixed roof, said base and said base.

本發明提供一實施例,其中該些個第二固定元件分別具有一帽部,該些個連接件分別具有一階梯部,該帽部與該階梯部夾設該承載座之一第一凸緣及該頂蓋之一第二凸緣,以固定該承載座及該頂蓋。The present invention provides an embodiment, wherein the second fixing elements each have a cap portion, the connecting members each have a step portion, and the cap portion and the step portion sandwich a first flange of the bearing seat. And a second flange of the top cover to fix the bearing seat and the top cover.

本創作提供一實施例,其中該收音元件係包含一電路板及一麥克風,該電路板電性連接該裝置。The present invention provides an embodiment, wherein the sound receiving element includes a circuit board and a microphone, and the circuit board is electrically connected to the device.

本創作提供一實施例,其中該些個減震元件結構更包含一凹陷部,其環設於該些個減震元件外側。The present invention provides an embodiment, wherein the structures of the damping elements further include a recessed portion, which is disposed on the outside of the damping elements.

本創作提供一實施例,其中該些個減震元件結構更包含複數個凸起部,其係設置於該些個減震元件之兩端。The present invention provides an embodiment, in which the damping element structures further include a plurality of raised portions, which are disposed at both ends of the damping elements.

本創作提供一實施例,其中該吸音件設有一開口。The present invention provides an embodiment, wherein the sound absorbing member is provided with an opening.

本創作提供一實施例,其中該緩衝元件相對設置於該開口。The present invention provides an embodiment in which the buffer element is disposed opposite to the opening.

本創作提供一實施例,其中該緩衝元件更包含一第四穿孔及一第二容置空間,該第四穿孔連通該第二容置空間,於該第二容置空間內設置該麥克風。The present invention provides an embodiment in which the buffer element further includes a fourth perforation and a second accommodation space, the fourth perforation communicates with the second accommodation space, and the microphone is disposed in the second accommodation space.

本創作提供一實施例,其中該緩衝元件更包含一環狀凸起部,該環狀凸起部抵接該頂蓋。The present invention provides an embodiment, wherein the buffer element further includes a ring-shaped raised portion, and the ring-shaped raised portion abuts the top cover.

本創作提供一實施例,其中該緩衝元件固定方式黏附固定或該頂蓋壓合固定。The present invention provides an embodiment in which the buffer element is fixed in an adhesive manner or the top cover is fixed in a fixed manner.

為使 貴審查委員對本創作之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明,說明如後:In order to make the reviewing committee members have a better understanding and understanding of the characteristics of this creation and the effects achieved, I would like to provide better examples and detailed descriptions with the following description:

傳統麥克風在收音時,容易接收到外部環境聲音或是電子訊號所產生的電子雜訊,導致在聆聽錄製結果的過程中發現主要音效中還有包含電子訊號雜訊或環境音,但上述之電子訊號雜訊可透過以韌體或軟體方式將雜訊音效去除,然而外部環境震動雜音卻無法透過韌體或軟體進行消除。When the traditional microphone is receiving radio, it is easy to receive electronic noise generated by external environmental sounds or electronic signals. As a result of listening to the recording results, it is found that the main sound effects also include electronic signal noise or environmental sounds. Signal noise can be removed by firmware or software. However, external environmental vibration noise cannot be eliminated by firmware or software.

因此,為了改良麥克風容易接收到外部環境雜訊影響接收的主要音效的缺點,本創作係利用減震元件以及緩衝元件,形成一減震結構,使麥克風固定於一裝置內時,可透過減震元件以及緩衝元件,將環境形成的震動抵消,使麥克風在收音時不會接收到震動所產生的音效。Therefore, in order to improve the shortcomings of the main sound effect that the microphone can easily receive noise from the external environment and affect the reception, this creation uses a shock absorbing element and a buffer element to form a shock absorbing structure. When the microphone is fixed in a device, it can pass the shock absorbing. The component and the buffering component cancel the vibration formed by the environment, so that the microphone will not receive the sound effect generated by the vibration when the radio is received.

在下文中,將藉由圖式來說明本創作之各種實施例來詳細描述本創作。然而本創作之概念可能以許多不同型式來體現,且不應解釋為限於本文中所闡述之例式性實施例。In the following, the present invention will be described in detail by explaining various embodiments of the present invention with drawings. However, the concept of this creation may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.

首先,請參閱第1圖,其為本創作之一實施例之組裝結構示意圖,以及第2圖,其為本創作之一實施例之爆炸結構示意圖,如圖所示,本創作係為一種減震結構1,其包含一基座12、複數個減震元件13、複數個第一固定元件14、一承載座15、一頂蓋18以及複數個第二固定元件19。First, please refer to FIG. 1, which is a schematic diagram of the assembly structure of one embodiment of the creation, and FIG. 2 is a schematic diagram of the explosion structure of one embodiment of the creation. As shown in the figure, this creation is a The seismic structure 1 includes a base 12, a plurality of damping elements 13, a plurality of first fixing elements 14, a bearing base 15, a top cover 18, and a plurality of second fixing elements 19.

本創作之該減震結構1其係固定於一裝置10內,透過該基座12上設有複數個第一通孔122以及複數個連接件124,將該些個減震元件13設置於該些個第一通孔122,在該些個減震元件上13設有複數個第一穿孔132,透過該些個第一固定元件14穿設該些個第一穿孔132將該基座12固定於該裝置10上,而進一步於該承載座15設置複數個第二穿孔156,且該些個連接件124設置於該些個第二穿孔156,該承載座15上設有一第一容置空間152,且該第一容置空間152內設置有一收音元件16,且該收音元件16上設置有一緩衝元件162及一吸音件164,再取該頂蓋18覆蓋設置於該承載座15上,該頂蓋18上設有一貫穿孔182、一凹槽184以及於其下側凸設複數個連接部186,該些個連接部186設置有複數個第三穿孔1862,該凹槽184相對設置該吸音件164,其中,該些個連接部186插設於該些個第二穿孔156,進一步設置該些個第二固定元件19插設該些個第三穿孔1862、該些第二穿孔156與該些個連接件124固接,以固定該頂蓋18、該承載座15及該基座12。使該收音元件16透過該貫穿孔182進行一收音程序。The damping structure 1 of this creation is fixed in a device 10, and the base 12 is provided with a plurality of first through holes 122 and a plurality of connecting members 124, and the damping elements 13 are disposed in the The first through holes 122 are provided with a plurality of first perforations 132 on the damping elements 13, and the bases 12 are fixed through the first fixing elements 14 through the first perforations 132. On the device 10, a plurality of second perforations 156 are further provided on the bearing seat 15, and the connecting members 124 are provided on the second perforations 156. A first accommodation space is provided on the bearing seat 15. 152, and a sound-receiving element 16 is disposed in the first accommodation space 152, and a buffer element 162 and a sound-absorbing member 164 are disposed on the sound-receiving element 16, and then the top cover 18 is covered and disposed on the bearing seat 15, The top cover 18 is provided with a through hole 182, a groove 184, and a plurality of connection portions 186 protruding from the lower side thereof. The connection portions 186 are provided with a plurality of third perforations 1862, and the groove 184 is opposite to the sound absorption. Piece 164, wherein the connecting portions 186 are inserted into the second through holes 156, and further The second fixing elements 19 are inserted into the third through holes 1862, the second through holes 156 are fixedly connected to the connecting members 124 to fix the top cover 18, the bearing base 15 and the base 12. . A sound receiving process is performed by passing the sound receiving element 16 through the through hole 182.

其中,請一併參考第3A圖,其為本創作之一實施例之俯視示意圖,以及第3B圖,其為本創作之一實施例之剖視示意圖(A-A線剖視),如圖所示,本實施例之該些個減震元件13係可為圓柱、方柱或橢圓柱之一,其結構包含一凹陷部134,其設置於該些個減震元件13上,該些個減震元件13兩側平面設有複數個凸起部136,且該些個第一穿孔132貫穿該些個減震元件13,透過該凹陷部134可將該些個減震元件13固定於該基座12之該些個第一通孔122上,透過該些個第一固定元件14穿設該些個第一穿孔132將該基座12固定於該裝置10上,另外,該些個減震元件13之材料硬度係介於50至70度之間,藉由材料的彈性來達到吸收震動的效果,且該些個減震元件13材料係選自於矽膠、橡膠之其中之一。Among them, please refer to FIG. 3A, which is a schematic plan view of an embodiment of the creation, and FIG. 3B, which is a schematic cross-sectional view (AA line section) of an embodiment of the creation, as shown in the figure. The damping elements 13 of this embodiment may be one of a cylinder, a square pillar, or an elliptical cylinder. The structure includes a recessed portion 134 disposed on the damping elements 13 and the damping. The two sides of the element 13 are provided with a plurality of convex portions 136, and the first perforations 132 penetrate the damping elements 13, through which the damping elements 13 can be fixed to the base. The first through holes 122 of 12 are fixed through the first fixing elements 14 through the first perforations 132 to fix the base 12 to the device 10, and the damping elements The material hardness of 13 is between 50 and 70 degrees. The elasticity of the material is used to achieve the effect of absorbing vibrations. The materials of the 13 damping elements are selected from one of silicone rubber and rubber.

另外,請參考第3C圖,其為本創作之一實施例之剖視示意圖(B-B線剖視),如圖所示,該收音元件16包含有該緩衝元件162、該吸音件164、一電路板166以及一麥克風168,該電路板166電性連接該裝置10,上述之該吸音件164設有一開口1642,該緩衝元件162相對設置於該開口1642,另外一提,該緩衝元件162設有一第四穿孔1622、一第二容置空間1624以及一環狀凸起部1626,該第四穿孔1622連通該第二容置空間1624,該緩衝元件162固定的方式係選自於黏附固定(以液態膠體或雙面膠黏附)或以該頂蓋18壓合該環狀凸起部1626固定(壓合固定),該麥克風168係可設置於該緩衝元件162之該第二容置空間1624內,該第二容置空間1624因為連通該第四穿孔1622,又該第四穿孔1622與該貫穿孔182相通,使該麥克風168可透過該貫穿孔182進行該收音程序。另外,該緩衝元件162之材料硬度係介於50至70度之間,藉由材料的彈性來達到吸收震動的效果,且該個緩衝元件162材料係選自於矽膠、橡膠之其中之一。In addition, please refer to FIG. 3C, which is a schematic cross-sectional view (BB line cross-section) of an embodiment of the creation. As shown in the figure, the sound receiving element 16 includes the buffer element 162, the sound absorbing member 164, and a circuit. The circuit board 166 and a microphone 168 are electrically connected to the device 10. The above-mentioned sound absorbing member 164 is provided with an opening 1642, and the cushioning element 162 is disposed opposite the opening 1642. In addition, the cushioning element 162 is provided with a A fourth perforation 1622, a second accommodation space 1624, and a ring-shaped raised portion 1626. The fourth perforation 1622 communicates with the second accommodation space 1624. The manner in which the buffer element 162 is fixed is selected from the group consisting of adhesive fixing (using (Liquid gel or double-sided adhesive) or press the top cover 18 to fix the ring-shaped protrusion 1626 (press-fix), the microphone 168 can be set in the second accommodation space 1624 of the buffer element 162 The second accommodation space 1624 communicates with the fourth through hole 1622, and the fourth through hole 1622 communicates with the through hole 182, so that the microphone 168 can perform the radio program through the through hole 182. In addition, the material hardness of the buffer element 162 is between 50 and 70 degrees, and the effect of absorbing vibration is achieved by the elasticity of the material, and the material of the buffer element 162 is selected from one of silicone rubber and rubber.

又,本創作之該減震結構1係透過該些個第二固定元件19,將該頂蓋18與該承載座15固定,使該減震結構1產生封閉效果,如第3D圖所示,其為本創作之一實施例之剖視示意圖(C-C線剖視),以及第3E圖,其為本創作之一實施例之局部放大示意圖,如圖所示,該些個第二固定元件19插設該些個第三穿孔1862、該些第二穿孔156與該些個連接件124固接,其中該些個第二固定元件19分別具有一帽部192,該連接件124具有一階梯部1242,該帽部192與該階梯部1242夾設該承載座15之一第一凸緣154及該頂蓋18之一第二凸緣188,用此結構來固定該承載座15及該頂蓋18,以達到本創作該減震結構1內的封閉效果。In addition, the shock-absorbing structure 1 created in this work is through the second fixing elements 19, fixing the top cover 18 and the bearing seat 15, so that the shock-absorbing structure 1 has a closed effect, as shown in FIG. 3D. It is a schematic cross-sectional view of an embodiment of the creation (CC line cross-section), and FIG. 3E is a partially enlarged schematic view of an embodiment of the creation. As shown in the figure, the second fixing elements 19 The third through holes 1862, the second through holes 156 are fixedly connected to the connecting members 124, wherein the second fixing elements 19 each have a cap portion 192, and the connecting member 124 has a stepped portion. 1242, the cap portion 192 and the step portion 1242 sandwich one of the first flange 154 of the bearing base 15 and one of the second flange 188 of the top cover 18. This structure is used to fix the bearing base 15 and the top cover 18, in order to achieve the sealing effect in the shock-absorbing structure 1 of this creation.

透過習知技術,可清楚得知以往的將該收音元件16放置於電腦機殼或音箱殼體時,通常為直接固定設置,並沒有針對該收音元件16進行特殊的結構設計,也因為如此,導致該習知該收音程序完成後,返放錄製之音效時,會聽到許多的細小的雜音,這些雜音也包含了機殼震動的聲音、音箱共振的聲音或是殼體本身產生的雜音,也因為如此,本創作針對該收音元件16進行減震結構設計。Through conventional techniques, it can be clearly known that when the sound receiving element 16 is placed in a computer case or a speaker case, it is usually directly fixed, and there is no special structural design for the sound receiving element 16. As a result, after learning that the radio program is completed, many small noises will be heard when the recorded sound is played back. These noises also include the sound of the chassis vibration, the sound of the speaker resonance, or the noise generated by the case itself. Because of this, the design of the sound-absorbing element 16 is designed for a shock-absorbing structure.

接著請一併參考第4圖,其為本創作之一實施例之使用狀態示意圖,當本實施例透過該些個第一固定元件14固定於該裝置10時,透過該些個減震元件13與該裝置10接觸,且該些個減震元件13具有彈性,因此透過該些個減震元件13吸收上述結構所產生的震動,避免電腦主機殼體或音箱殼體與該基座12接觸後產生雜音,再者透過該緩衝元件162覆蓋於該麥克風168外圍,將該頂蓋18抵接該緩衝元件162,使該麥克風168透過該頂蓋18上之該貫穿孔182進行該收音程序,此時,由於上述該些個減震元件13以將該裝置10震動吸收,去除環境中殼體震動的雜音後,再利用該至少一第二減震元件172降低該減震結構1內的雜音,使本實施例中之該收音元件16所接收到的音效,可將環境雜訊由原本的13.68分貝降至3.61分貝,使該收音元件16接收之音效清楚呈現。Next, please refer to FIG. 4 together, which is a schematic diagram of the use state of an embodiment of the creation. When this embodiment is fixed to the device 10 through the first fixing elements 14, the damping elements 13 are passed through It is in contact with the device 10 and the damping elements 13 have elasticity. Therefore, the shocks generated by the above structure are absorbed by the damping elements 13 to prevent the main body of the computer or the speaker shell from contacting the base 12 Noise is generated afterwards, and the periphery of the microphone 168 is covered by the buffering element 162, the top cover 18 abuts against the buffering element 162, and the microphone 168 performs the radio program through the through hole 182 in the top cover 18, At this time, since the above-mentioned damping elements 13 absorb the vibration of the device 10, after removing the noise of the housing vibration in the environment, the at least one second damping element 172 is used to reduce the noise in the damping structure 1. Therefore, the sound effect received by the sound receiving element 16 in this embodiment can reduce the environmental noise from the original 13.68 dB to 3.61 dB, so that the sound effect received by the sound receiving element 16 is clearly presented.

如上述,本創作該些個減震元件13以及該緩衝元件162選用之材料係可為矽膠或橡膠,下列以橡膠材料進行減震、吸音之原理說明,該些個減震元件13係透過橡膠材料之特性來進行減震吸音,橡膠是一種具有高彈態又有高黏態之材料,橡膠的彈性是由卷曲分子構像的變化產生的,橡膠分子間相互作用會妨礙分子鏈的運動,又表現出黏性特點,以致應力與應變往往處於不平衡狀態。橡膠的卷曲的長鏈分子結構及分子間存在的較弱的次級力,使得橡膠材料呈現出獨特的黏彈性能,也因此具有良好的減震、隔音和緩衝性能,橡膠廣泛用於隔離震動和吸收衝擊,也是由於橡膠具有滯後、阻尼及能進行可逆大變形的特點,橡膠的滯後和內摩擦特性通常用損耗因子表示,損耗因子越大,橡膠的阻尼和生熱越顯著,減震效果越明顯,也因為如此,本創作之該減震結構1方可產生減震吸震以及隔音之效果。As mentioned above, the materials used in the creation of the damping elements 13 and the cushioning element 162 may be silicone or rubber. The following explains the principle of damping and sound absorption with rubber materials. These damping elements 13 are made of rubber. The characteristics of the material are used for shock absorption and sound absorption. Rubber is a material with high elasticity and high viscosity. The elasticity of rubber is caused by the change of the conformation of the curled molecule. The interaction between the rubber molecules will hinder the movement of the molecular chain. It also exhibits viscosity characteristics, so that stress and strain are often in an unbalanced state. The curled long-chain molecular structure of rubber and the weak secondary force between the molecules make the rubber material exhibit unique viscoelastic properties and therefore have good shock absorption, sound insulation and cushioning properties. Rubber is widely used to isolate vibration The shock absorption and shock absorption are also due to the characteristics of rubber with hysteresis, damping and reversible large deformation. The hysteresis and internal friction characteristics of rubber are usually expressed by a loss factor. The more obvious, and because of this, the shock-absorbing structure 1 of this creation can produce the effects of shock absorption and sound insulation.

以上所述之實施例,本創作之方法,其提供一種減震結構,透過該結構使麥克風在密閉環境錄製或接收音效時,不會接收到環境中的震動雜音,使接收之音效清楚呈現。In the embodiment described above, the method of the present invention provides a shock-absorbing structure through which the microphone does not receive vibration noise in the environment when recording or receiving sound effects in a closed environment, so that the received sound effects are clearly presented.

惟以上所述者,僅為本創作之較佳實施例而已,並非用來限定本創作實施之範圍,舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本創作之申請專利範圍內。However, the above are only the preferred embodiments of this creation, and are not intended to limit the scope of implementation of this creation. For example, all changes and modifications based on the shapes, structures, features, and spirits described in the scope of the patent application for this creation are equal. Shall be included in the scope of the patent application for this creation.

1‧‧‧減震結構
10‧‧‧裝置
12‧‧‧基座
122‧‧‧第一通孔
124‧‧‧連接件
1242‧‧‧階梯部
13‧‧‧減震元件
132‧‧‧第一穿孔
134‧‧‧凹陷部
136‧‧‧凸起部
14‧‧‧第一固定元件
15‧‧‧承載座
152‧‧‧第一容置空間
154‧‧‧第一凸緣
156‧‧‧第二穿孔
16‧‧‧收音元件
162‧‧‧緩衝元件
1622‧‧‧第四穿孔
1624‧‧‧第二容置空間
1626‧‧‧環狀凸起部
164‧‧‧吸音件
1642‧‧‧開口
166‧‧‧電路板
168‧‧‧麥克風
18‧‧‧頂蓋
182‧‧‧貫穿孔
184‧‧‧凹槽
186‧‧‧連接部
188‧‧‧第二凸緣
1862‧‧‧第三穿孔
19‧‧‧第二固定元件
192‧‧‧帽部
1‧‧‧ shock-absorbing structure
10‧‧‧ device
12‧‧‧ base
122‧‧‧First through hole
124‧‧‧Connector
1242‧‧‧Staircase
13‧‧‧Damper
132‧‧‧first perforation
134‧‧‧ Depression
136‧‧‧ raised
14‧‧‧ the first fixing element
15‧‧‧bearing seat
152‧‧‧First accommodation space
154‧‧‧First flange
156‧‧‧second perforation
16‧‧‧ Radio components
162‧‧‧Buffer element
1622‧‧‧ Fourth perforation
1624‧‧‧Second accommodation space
1626‧‧‧Ring
164‧‧‧Sound Absorber
1642‧‧‧open
166‧‧‧Circuit Board
168‧‧‧Microphone
18‧‧‧ top cover
182‧‧‧through hole
184‧‧‧Groove
186‧‧‧Connection Department
188‧‧‧Second flange
1862‧‧‧th third perforation
19‧‧‧Second fixing element
192‧‧‧Cap

第1圖:其為本創作之一實施例之組裝結構示意圖;
第2圖:其為本創作之一實施例之爆炸結構示意圖;
第3A圖:其為本創作之一實施例之俯視示意圖;
第3B圖:其為本創作之一實施例之剖視示意圖;
第3C圖:其為本創作之一實施例之剖視示意圖;
第3D圖:其為本創作之一實施例之剖視示意圖;
第3E圖:其為本創作之一實施例之局部放大示意圖;以及
第4圖:其為本創作之一實施例之使用狀態示意圖。
Figure 1: Schematic diagram of the assembly structure of one embodiment of the creation;
Figure 2: It is a schematic diagram of the explosion structure of an embodiment of the creation;
Figure 3A: a schematic plan view of an embodiment of the present invention;
FIG. 3B is a schematic sectional view of an embodiment of the present invention;
FIG. 3C is a schematic cross-sectional view of an embodiment of the present invention;
Figure 3D: a schematic cross-sectional view of an embodiment of the creation;
FIG. 3E is a partially enlarged schematic diagram of an embodiment of the creation; and FIG. 4 is a schematic diagram of a use state of an embodiment of the creation.

Claims (10)

一種減震結構,其係固定於一裝置內,該減震結構係包含:
一基座,其上設有複數個第一通孔以及複數個連接件,複數個減震元件設有複數個第一穿孔且分別設置於該些個第一通孔,複數個第一固定元件穿設該些個第一穿孔將該基座固定於該裝置上;
一承載座,其係固定於該基座上,進一步,其上設有一第一容置空間,於該第一容置空間設置一收音元件,該收音元件上設置有一緩衝元件及一吸音件,並進一步於該承載座設置複數個第二穿孔,該些個連接件係分別設置於該些個第二穿孔;以及
一頂蓋,其係設置於該承載座之上,並設有一貫穿孔、一凹槽以及於其下側凸設複數個連接部,該凹槽相對設置該吸音件,該些個連接部設置複數個第三穿孔,該些個連接部插設於該些個第二穿孔,進一步設置複數個第二固定元件插設該些個第三穿孔、該些個第二穿孔與該些個連接件固接,以固定該頂蓋、該承載座及該基座。
A shock-absorbing structure is fixed in a device. The shock-absorbing structure includes:
A base provided with a plurality of first through holes and a plurality of connecting members, a plurality of damping elements provided with a plurality of first perforations and respectively disposed in the plurality of first through holes, and a plurality of first fixing elements Arranging the first perforations to fix the base on the device;
A bearing seat is fixed on the base, further, a first receiving space is provided thereon, a sound receiving element is provided in the first receiving space, a buffer element and a sound absorbing member are provided on the sound receiving element, A plurality of second perforations are further provided on the bearing seat, and the connecting members are respectively provided on the second holes; and a cover is provided on the bearing seat and is provided with a through hole, A groove and a plurality of connecting portions are protruded on the lower side thereof, the groove is oppositely provided with the sound absorbing member, the connecting portions are provided with a plurality of third perforations, and the connecting portions are inserted into the second perforations. A plurality of second fixing elements are further provided to insert the third perforations, and the second perforations are fixedly connected to the connecting members to fix the top cover, the bearing seat and the base.
如申請項1所述之減震結構,其中該些個第二固定元件分別具有一帽部,該些個連接件分別具有一階梯部,該帽部與該階梯部夾設該承載座之一第一凸緣及該頂蓋之一第二凸緣,以固定該承載座及該頂蓋。The shock absorbing structure according to claim 1, wherein each of the second fixing elements has a cap portion, each of the connecting members has a step portion, and the cap portion and the step portion sandwich one of the bearing seats. The first flange and a second flange of the top cover are used to fix the bearing seat and the top cover. 如申請項1所述之減震結構,其中該收音元件係包含一電路板及一麥克風,該電路板電性連接該裝置。The shock absorbing structure according to claim 1, wherein the sound receiving element comprises a circuit board and a microphone, and the circuit board is electrically connected to the device. 如申請項1所述之減震結構,其中該些個減震元件結構更包含一
凹陷部,其環設於該些個減震元件外側。
The shock absorbing structure according to claim 1, wherein the plurality of shock absorbing element structures further includes a recessed portion, which is disposed on the outer side of the plurality of shock absorbing elements.
如申請項1所述之減震結構,其中該些個減震元件結構更包含複
數個凸起部,其係設置於該些個減震元件之兩端。
The shock absorbing structure according to claim 1, wherein the structures of the plurality of shock absorbing elements further include a plurality of protrusions, which are disposed at both ends of the plurality of shock absorbing elements.
如申請項1所述之減震結構,其中該吸音件設有一開口。The shock absorbing structure according to claim 1, wherein the sound absorbing member is provided with an opening. 如申請項1所述之減震結構,其中該緩衝元件相對設置於該開
口。
The shock absorbing structure according to claim 1, wherein the buffer element is disposed opposite to the opening.
如申請項1所述之減震結構,其中該緩衝元件更包含一第四穿孔及一第二容置空間,該第四穿孔連通該第二容置空間,該第二容置空間內設置該麥克風。The shock absorbing structure according to claim 1, wherein the buffer element further includes a fourth perforation and a second accommodation space, the fourth perforation communicates with the second accommodation space, and the second accommodation space is provided with the microphone. 如申請項1所述之減震結構,其中該緩衝元件更包含一環狀凸起部,該環狀凸起部抵接該頂蓋。The shock-absorbing structure according to claim 1, wherein the cushioning element further includes a ring-shaped raised portion, and the ring-shaped raised portion abuts the top cover. 如申請項1所述之減震結構,其中該緩衝元件固定方式黏附固定或該頂蓋壓合固定。The shock absorbing structure according to claim 1, wherein the cushioning element is fixed in an adhesive manner or the top cover is pressed and fixed.
TW108207832U 2019-06-19 2019-06-19 Shock absorption structure TWM586500U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI756834B (en) * 2020-09-18 2022-03-01 緯穎科技服務股份有限公司 Cushioning element and electronic device having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI756834B (en) * 2020-09-18 2022-03-01 緯穎科技服務股份有限公司 Cushioning element and electronic device having the same

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