TWM584159U - Heat-transferring device - Google Patents

Abstract

A heat-transferring device is disclosed. The heat-transferring device at least comprises: a heat-transferring tube having an inlet on one side for allowing the fluid to enter the heat-transferring tube, and the other side of the heat-transferring tube is closed or has an outlet; and at least one through hole disposed on the heat-transferring tube, wherein the heat-transferring tube is used for contacting the heat source such that the fluid inside the heat-transferring tube absorbs the heat energy of the heat source. By using the heat-transferring tube with the through hole, the heat energy can be conducted and absorbed efficiently.

Description

Heat transfer device

This creation is a thermally conductive device, and in particular a thermally conductive device with adjustable temperature.

When we are in the process of heating, such as barbecue activities, we place the barbecue grill over the fire source, so that the ingredients on the barbecue grill can reach the cooked state. However, when the heat source is continuously heated on the barbecue grill, because the barbecue grill is Metal objects can easily cause the temperature of the barbecue grill to be too high, and the parts that touch the barbecue grill are liable to burn or stick, which is a problem for users.

In addition, many heating methods currently encounter the problem that the temperature of the heat source cannot be controlled, causing the object to be heated to be overheated. Therefore, there is an urgent need for a technology that can prevent the object to be heated from being overheated.

The purpose of this creation is to provide a heat conduction device that can solve the problem of traditional heating.

In order to achieve the above object, the present invention provides a heat conduction device, which includes at least: a heat conduction pipe, one side of the heat conduction pipe has an inlet for a fluid to enter the heat conduction pipe, and the other side of the heat conduction pipe is closed or has an outlet And at least one through hole is provided on the heat conduction tube, wherein the heat conduction tube is used to contact a heat source, so that the fluid located in the heat conduction tube absorbs the heat energy of the heat source.

Among them, the heat conduction tube is an integrally formed structure or a combination of two or more pieces.

Among them, the heat conduction tube is linear or curved, and the material of the heat conduction tube is metal or non-metal.

The transverse cross-sectional shape of the through-hole and / or the longitudinal cross-sectional shape of the heat-conducting tube is circular, rectangular, oval, or triangular.

The heat conduction tube has a top surface, a bottom surface, and a side surface located between the top surface and the bottom surface. The through hole is provided on the side surface and / or the top surface of the heat conduction tube.

Among them, the number of the through holes is plural, and they are arranged at equal or unequal intervals and are distributed on the heat conduction tube in a single row or a plurality of rows.

Among them, the flow system is air, water, nitrogen, or a combination thereof.

Among them, the heat conduction device further includes a pump for actively supplying fluid into the inlet of the heat conduction pipe.

The heat conduction device further includes a baffle provided inside or outside the heat conduction tube. The baffle selectively covers the through hole for opening or closing the through hole.

The baffle further has at least one through hole. When the baffle selectively covers the through hole, the position of the through hole corresponds to the through hole.

According to this created heat conduction device, it can achieve the following advantages and effects:

(1) The heat conduction device can be various shapes and can be integrated or combined, and can be applied to various heating processes.

(2) The heat conduction device has the function of absorbing thermal energy to adjust the temperature by introducing a fluid.

(3) The heat conduction device can adjust the temperature through the baffle.

In order to better understand the technical characteristics, content and advantages of this creation and the effects that it can achieve, the following is a detailed description of the accompanying drawings of this creation in the form of examples, and the main purpose of the drawings used therein It is only for the purpose of illustration and supplementary instructions. It may not be the actual scale and precise configuration after the implementation of the creation. Therefore, the scale and configuration relationship of the attached drawings should not be interpreted and limited to the scope of the actual implementation of the creation. In addition, in order to facilitate understanding, the same elements in the following embodiments are described with the same symbols. In addition, the dimensional ratios of the components shown in the drawings are only for the convenience of explaining each element and its structure, and are not intended to be limiting.

In addition, the terms used throughout the specification and the scope of patent applications, unless otherwise specified, usually have the ordinary meaning of each term used in this field, the content disclosed herein, and the special content. Certain terms used to describe this creation will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of this creation.

Regarding the use of "first", "second", etc. in this document, they do not specifically refer to the order or order, nor are they used to limit the creation. They are only used to distinguish components or operations described in the same technical terms.

Secondly, if the words "including", "including", "having", "containing" and the like are used in this article, they are all open-ended terms, which means including but not limited to.

First of all, this creation is a heat conduction device, which can be widely applied to any use and occasion of heating or conducting heat energy of a heat source. For example, the heat conducting device may be adapted to directly or indirectly contact a heat source, and this heat source may be, for example, an open flame heating or an open flame heating. Among them, the type of open flame heating is not particularly limited, and for example, a gas furnace or a charcoal fire can be used to achieve the open flame heating effect. As for the type of fireless heating, there is also no particular limitation, and for example, a fireless heating method that does not generate a flame, such as an induction cooker or water-proof heating, can be used. One of the characteristics of this creation is that fluid can be selectively passed into the heat conduction device to absorb the heat energy of the heat source. When the fluid flows out or overflows the heat conduction device, the thermal energy can be derived, thereby achieving the effect of adjusting the temperature of the interior of the heat conduction device or the surface of the pipe wall. For example, if the fluid is liquid water, it can absorb thermal energy and evaporate or vaporize it into water vapor, thereby deriving thermal energy to achieve the effect of adjusting temperature.

In the first embodiment of the present invention, the heat conducting device 100 includes at least a heat conducting tube 10 and at least one through hole 20. The heat transfer tube 10 has a hollow structure, and one side of the heat transfer tube 10 has an inlet 11. The fluid 30 can enter the heat transfer tube 10 through the inlet 11, wherein the other side of the heat transfer tube 10 may be closed or may have an outlet. In other words, the heat conduction pipe 10 is a hollow structure, and the thickness of the pipe wall is not particularly limited, and both sides may have openings or only one side may have an opening. The through hole 20 is provided on the heat conduction tube 10, wherein the heat conduction tube 20 is used to contact a heat source, so that the fluid 30 located in the heat conduction tube 10 absorbs heat energy of the heat source, for example, absorbs part or all of the heat energy. The fluid may be any substance having thermal conductivity and fluidity, and preferably, for example, air, water, nitrogen, or a combination thereof. The diameter of the through hole 20 may depend on the type of fluid. For example, if the fluid is liquid water, the pore diameter of the through-hole 20 may be larger than water molecules, for example, so that water can flow out of the through-hole 20 or the pore diameter of the through-hole 20 may be between water molecules and water vapor. This allows only water vapor to pass through the through hole 20.

The heat conduction tube 10 is, for example, an integrally formed structure or a combination of two or more pieces (as shown in FIG. 8). The outer shape of the heat conduction tube 10 is, for example, a straight shape (as shown in FIG. 1) or a curved shape (as (Shown in 2) or a plurality of linear shape heat conduction tubes combined into various shapes of heat conduction devices. The heat transfer tube 10 may be, for example, a round tube (as shown in FIG. 4), a square tube (as shown in FIG. 6), an oval tube (as shown in FIG. 7), or a triangular tube (as shown in FIG. 5), that is, its longitudinal direction The cross-sectional shape may be any shape, and is preferably circular, rectangular, oval, or triangular. The material of the heat conduction tube 10 may be, for example, a metal, such as iron, steel, other metals, or an alloy thereof. The material of the heat transfer tube 10 may also be, for example, a non-metal, such as a ceramic. In other words, the material of the heat conducting tube 10 may be any heat-resistant material.

As shown in FIG. 4, the heat conduction tube 10 has a top surface 12, a bottom surface 14, and a side surface 16 located between the top surface 12 and the bottom surface 14. surface. The through hole 20 of the heat conduction device is provided on the wall surface of the heat conduction pipe 10, and is preferably located on the side surface 16 and / or the top surface 12 of the heat conduction pipe 10. However, in some special cases, the through-hole 20 may also be located on the bottom surface of the heat-conducting pipe 10 to meet special needs. The transverse cross-sectional shape of the through hole 20 may be any shape, and is preferably circular, rectangular, oval, or triangular. In other words, the transverse cross-sectional shape of the through-hole 20 and / or the longitudinal cross-sectional shape of the heat-conducting tube 10 may be any shape, and is preferably circular, rectangular, oval, or triangular. In addition, the number of the through-holes 20 may be one or more, and is preferably a plurality, and is arranged, for example, at an equal pitch or an uneven pitch, and is distributed on the heat transfer tube 10 in a single row or a plurality of rows, for example.

The present invention further has a second embodiment, and the difference between the second embodiment and the first embodiment is that the heat conduction device 100 further has a fluid supply source. In detail, in the second embodiment of the present invention, the heat conducting device 100 includes at least a heat conducting tube 10, at least one through hole 20, and a fluid supply source 40. Wherein, the fluid supply source 40 may be, for example, a fluid tank for storing fluid, and communicates directly or indirectly (as shown in FIG. 9) to the inlet 11 of the heat transfer pipe 10 via a pipeline, for example. The type of the fluid tank is, for example, a bucket, a water cup, a water basin, or a water tower, but the type of the fluid tank in this creation is not limited to the above examples. The height of the fluid tank is preferably higher than the heat transfer tube 10, or at least the fluid in the fluid tank is higher than the heat transfer tube 10, so that the fluid can actively flow to the inside of the heat transfer tube 10 by using its own gravity, and can absorb the outside of the heat transfer tube 10. The thermal energy of the heat source can be used to flow the fluid out of the through-hole 20 on the heat-conducting tube, for example. In addition, the fluid supply source 40 may be an atmospheric environment. Moreover, the height of the fluid supply source 40 is not limited to being higher than the heat transfer tube 10. For example, as shown in FIG. 9, the heat conduction device may further have a pump 50, where the pump 50 may be, for example, between the fluid supply source 40 and the heat conduction pipe 10. Wherein, the pump 50 may use the fluid pipeline 102 for actively supplying fluid into the inlet 11 of the heat transfer pipe 10. The pump 50 may be, for example, a liquid pump or an air pump, and the fluid may be, for example, water, air, compressed air, other fluids, or a mixture thereof. The fluid pipeline 102 may be, for example, a general pipeline such as a water pipe or an air pipe. Alternatively, the fluid pipeline 102 may be, for example, a heat-resistant and / or pressure-resistant pipe, and the fluid in the fluid supply source 40 is transferred to the heat transfer pipe 10 through the fluid pipeline 102, and water mist can be sprayed through the through-hole 20 Or high-pressure fluid such as aerosol.

In addition, this creation has a third embodiment, as shown in FIG. 10, FIG. 11, and FIG. 12, and the difference between the third embodiment and the first embodiment or the second embodiment lies in the third embodiment of this creation. The heat conduction device 100 further includes a baffle 60 provided inside or outside the heat conduction tube 10. The user can selectively move or rotate the baffle 60 to cover the through-hole 20 of the heat-conducting pipe 10 to open or close the through-hole 20. Specifically, in the third embodiment of the present invention, the baffle 60 may be tubular (not shown) or a sheet body (as shown in FIG. 10), and the material of the baffle 60 may be the same or different from the heat conduction tube 10, It may be, for example, an integrally formed structure or a combination of two or more pieces. If the baffle 60 is tubular, the shape of the baffle 60 may be the same as that of the heat transfer tube 10, that is, the baffle 60 may have a linear shape or a curved shape, for example. To facilitate the movement of the baffle 60, one or both sides of the baffle 60 may also have a grip 61. In addition, the tube diameter or the sheet body radius of the baffle 60 may be, for example, larger or smaller than the heat conduction tube 10, wherein the tube diameter or the sheet body radius of the baffle 60 is preferably smaller than the heat conduction tube 10. If the baffle 60 is a sheet body (as shown in FIG. 10), its shape may correspond to the shape of the heat conduction tube 10 and may be, for example, an arc shape or a flat plate shape, as long as it can fit the inner or outer surface of the heat conduction tube 10. can. The above-mentioned method of moving the baffle 60 is not particularly limited, and may be, for example, pulling the baffle 60 out of the heat conduction pipe 10, thereby fully or partially opening the through hole 20 of the heat conduction pipe 10, that is, transmitting all or part of the heat conduction pipe 10 from the outside. The inside of the heat transfer tube 10 can be seen through the hole 20. Alternatively, the user can rotate the baffle 60 to rotate the baffle 60 and the heat conduction tube 10 with each other, thereby opening or closing the through hole 20 of the heat conduction tube 10 through the baffle 60. In other words, the effect of adjusting the temperature inside or on the surface of the heat transfer tube 10 can be achieved through the baffle 60. The heat conduction tube 10 and the baffle 60 may optionally have a guide groove 64 and a guide block 66, respectively. The guide block 66 may slide along the guide groove 64 to facilitate the rotation or movement of the baffle 60. The distribution direction of the guide grooves 64 may be the same as the rotation or movement direction of the baffle 60, for example. For example, if the baffle 60 is moved longitudinally relative to the heat transfer tube 10, the guide groove 64 may be longitudinally provided on one of the baffle 60 or the heat transfer tube 10, for example. If the baffle 60 is rotated relative to the heat transfer tube 10, the guide groove 64 may be provided on one of the baffle 60 or the heat transfer tube 10 in a ring or arc shape, for example. Moreover, the guide block 66 may be provided on the other side of the baffle 60 or the heat conduction tube 10.

In addition, the present invention further has a fourth embodiment, as shown in FIG. 13 and FIG. 14. The difference between the fourth embodiment and the third embodiment is that the baffle 60 of the fourth embodiment of the present invention is more selective. The through-hole 62 is penetrated through the baffle 60. The number and position of the through-holes 62 are not particularly limited, and may be the same as the number and distribution position of the through-holes 20, for example, as long as the amount of fluid that overflows to the outside of the heat transfer tube 10 through the through-hole 20 can be adjusted. In addition, the hole diameter of the through hole 62 can also be smaller than the through hole 20, for example, by controlling whether the position of the through hole 62 corresponds to the through hole 20, the effect of adjusting the opening size of the through hole 20 can be achieved. When the user selectively moves or rotates the baffle 60 to cover the through-hole 20 of the heat conduction tube 10, the position of the through-hole 62 may correspond to the through-hole 20. Therefore, if the hole diameter of the through-hole 62 is not equal to the hole diameter of the through-hole 20, it can be used to adjust the area inside the heat-conducting tube 10 exposed by the through-hole 20, thereby adjusting the amount of fluid overflowing through the through-hole 20 per unit time. The quantity can also be used to adjust the quantity of thermal energy derived through the through hole 20 per unit time of the fluid. In detail, if the area of the inside of the heat conduction tube 10 exposed in the through hole 20 is large, the amount of fluid flowing out of the through hole 20 per unit time will also be large, thereby achieving the effect of adjusting the temperature.

In addition, in the third embodiment or the fourth embodiment of the present creation, the baffle 60 may further be provided with a first magnetic member, and the heat conduction tube 10 may further be provided with a second magnetic member (not shown in the figure). (Illustrated), and the magnetic properties of the first magnetic member and the second magnetic member are different (for example, the magnetism of the first magnetic member is N pole, and the magnetism of the second magnetic member is S pole). The position of the first magnetic member can be, for example, on the outer surface of the baffle 60 (ie, the side surface adjacent to the heat conduction tube 10), and the position of the second magnetic member can be, for example, on the inner surface of the heat conduction tube 10 (heat conduction The inner wall of the tube 10, ie the inner wall adjacent to the baffle 60). Therefore, when the baffle 60 is moved or rotated, the first magnetic member on the baffle 60 can be attracted to each other by the magnetic force with the second magnetic member on the heat transfer tube 10, so that after the baffle 60 is moved or rotated, The baffle 60 is fixedly connected to the heat conduction pipe 10.

In addition, in this creation, the baffle 60 can be moved or rotated in a stepless or stepped manner, for example. For example, as shown in FIG. 10 and FIG. 11, the baffle 60 can be moved or rotated steplessly relative to the heat transfer tube 10. Alternatively, a plurality of card slots (not shown, and the card slots are arranged at equal or unequal intervals) are provided on the guide grooves 64 on the inner wall of the heat conduction tube 10, and the guide blocks 66 are retractable. It is provided on the baffle 60. Therefore, when the baffle 60 moves or rotates along the guide groove 64, the guide block 66 can be limited to one of the card slots, so that the baffle 60 can be moved or rotated stepwise. And since the guide block 66 can be connected to the baffle 60 telescopically by a spring, for example, when the baffle 66 moves or rotates along the guide groove 64, the spring is in a compressed state; and when the guide block 66 passes through the guide groove, At 6:00, the spring was in a relaxed state and the guide block 66 was confined in the slot. By turning or moving the baffle 60 steplessly or stepwise so that the baffle 60 only covers part of the through holes 20, different sections / areas of the same heat conduction tube 20 can have different heat conduction effects.

According to this created heat conduction device, it can achieve the following advantages and effects:

(1) The heat conduction device can be various shapes and can be integrated or combined, and can be applied to various heating processes.

(2) The heat conduction device has the function of absorbing thermal energy to adjust the temperature by introducing a fluid.

(3) The heat conduction device can adjust the temperature through the baffle.

The above description is exemplary only, and not restrictive. Any equivalent modification or change made without departing from the spirit and scope of this creation shall be included in the scope of the attached patent application.

100‧‧‧ heat conduction device

10‧‧‧Heat conduction tube

11‧‧‧ entrance

12‧‧‧Top

14‧‧‧ underside

16‧‧‧ side

20‧‧‧through hole

30‧‧‧ fluid

40‧‧‧ fluid supply source

50‧‧‧Pump

102‧‧‧fluid pipeline

60‧‧‧ bezel

61‧‧‧Grip

62‧‧‧through hole

64‧‧‧Guide

66‧‧‧Guide block

FIG. 1 is a schematic diagram of the appearance of the heat conduction device of the creation, in which the heat conduction tube has a linear shape.

FIG. 2 is a schematic diagram of the appearance of the heat conduction device of the creation, in which the heat conduction tube is a curved shape.

FIG. 3 is a schematic cross-sectional view of the heat conduction device of the present invention.

FIG. 4 is a schematic longitudinal sectional view of the heat conduction device of the present invention, in which the heat conduction tube is circular.

FIG. 5 is a schematic longitudinal sectional view of the heat conduction device of the present invention, wherein the heat conduction tube is triangular.

FIG. 6 is a schematic longitudinal sectional view of the heat conduction device of the present invention, in which the heat conduction tube is square.

FIG. 7 is a schematic longitudinal sectional view of the heat conduction device of the present invention, in which the heat conduction tube is oval.

FIG. 8 is a schematic longitudinal sectional view of the heat conduction device of the creation, wherein the heat conduction tube is square and consists of a sheet body.

FIG. 9 is a schematic diagram of the appearance of the heat conduction device, which has a fluid supply source and a pump.

FIG. 10 is a schematic cross-sectional view of the heat conduction device of the present invention, which has a baffle plate.

FIG. 11 is a schematic longitudinal sectional view of the heat conduction device of the creation, which has an arc-shaped baffle and the through hole is in an opened state.

FIG. 12 is a schematic longitudinal sectional view of the heat conduction device of the present invention, which has an arc-shaped baffle and the through hole is closed.

FIG. 13 is a schematic longitudinal sectional view of the heat conduction device of the present invention. The arc-shaped baffle plate has through holes and the through holes are opened.

FIG. 14 is a schematic longitudinal sectional view of the heat conduction device of the creation, the arc-shaped baffle plate has through holes and the through holes are opened.

Claims (10)

A heat conduction device including at least:
A heat conduction tube, one side of the heat conduction tube has an inlet for a fluid to enter the heat conduction tube, the other side of the heat conduction tube is closed or has an outlet; and at least one through hole is provided on the heat conduction tube. The heat conduction tube is used to contact a heat source, so that the fluid located in the heat conduction tube absorbs the heat energy of the heat source. The heat conduction device according to item 1 of the scope of patent application, wherein the heat conduction pipe is an integrally formed structure or is composed of two or more pieces. The heat conduction device according to item 1 of the scope of application for a patent, wherein the heat conduction pipe has a linear shape or a curved shape, and the material of the heat conduction pipe is metal or non-metal. The heat conduction device according to item 1 of the scope of the patent application, wherein the transverse cross-sectional shape of the through hole and / or the longitudinal cross-sectional shape of the heat conduction tube is circular, rectangular, oval or triangular. The heat conduction device according to item 1 of the patent application scope, wherein the heat conduction pipe has a top surface, a bottom surface, and a side surface located between the top surface and the bottom surface, and the through hole is provided on the side surface of the heat conduction tube. And / or the top surface. The heat conduction device according to item 1 of the scope of the patent application, wherein the number of the through holes is plural, and the through holes are arranged at equal or unequal intervals and are distributed on the heat conduction tube in a single row or a plurality of rows. The heat conduction device according to item 1 of the patent application scope, wherein the flow system is air, water, nitrogen, or a combination thereof. The heat conduction device according to item 1 of the scope of patent application, further includes a pump for actively supplying the fluid into the inlet of the heat conduction pipe. The heat conduction device according to item 1 of the scope of patent application, further includes a baffle provided inside or outside the heat conduction tube, the baffle selectively covering the through hole for opening or closing the through hole. The heat conduction device according to item 9 of the scope of patent application, wherein the baffle further has at least one through hole, and when the baffle selectively covers the through hole, the position of the through hole corresponds to the through hole.