TWM581770U - LED package structure - Google Patents

Abstract

A package structure of a light-emitting diode comprises: a carrier, a light-emitting layer, an encapsulation layer and a light interference layer. The carrier has a plurality of electrode layers on the surface and a plurality of pads on the bottom, and the electrode layers and the pads are electrically connected. The luminescent layer is composed of a plurality of luminescent wafers electrically connected to the electrode layers. The encapsulation layer is disposed on a surface of the carrier and encapsulates the light emitting chip packages. The light interference layer is disposed on a surface of the encapsulation layer. A structure for shielding the light source from being emitted on the surface of the encapsulation layer of the light-emitting diode can effectively shield the light-transmitting interference problem of the two light-emitting diodes with similar distances, and also make the production easier.

Description

Light-emitting diode package structure

The present invention relates to a light-emitting diode, and more particularly to a package structure of a light-emitting diode that avoids light-transmitting interference.

It is known that a light-emitting diode 10a (shown in FIG. 1) currently used on a television wall has a substrate 11a thereon, and the substrate 11a has a plurality of electrode layers 12a, and the bottom surface or the side surface of the substrate 11a has a plurality of Solder pad 13a. The three primary color (RGB) light-emitting chips 2a are electrically connected to the electrode layers 12a, and the surface of the substrate 11a is sealed to form an encapsulation layer 3a covering the three primary color light-emitting wafers 2a.

After the LEDs 10a are packaged, the two primary color light-emitting wafers having similar distances are prevented from causing crosstalk, and the surface of the encapsulation layer 3a is cut by a cutting technique to form a surface of the encapsulation layer 3a. A cross-shaped groove 31a. The trench 31a can cut the surface of the encapsulation layer 3a into a plurality of blocks to avoid light transmission interference. When the two primary color light-emitting chips 3a are viewed in the human eye, the light source generated by the light-emitting diodes does not cause mutual interference.

Although the groove 31a is cut on the surface of the encapsulation layer 3a of the light-emitting diode 10a to avoid light transmission interference, such a structural design may cause an undesirable effect of mutual interference between the fabrication and the light source.

Therefore, the main purpose of the present invention is to provide a novel technology for printing or coating a surface of a light-emitting diode on a surface of an encapsulating layer of a light-emitting diode, which can effectively shield two light-emitting diodes having similar distances. Light interference problems also make production easier  .  

Another purpose of the creation is that the creation can fill the groove after the surface of the encapsulation layer of the conventional light-emitting diode is filled with the coating material with the shielding light source, which can effectively shield the two light-emitting diodes with similar distances. Light transmission interference problem.

In order to achieve the above object, the present invention provides a package structure of a light-emitting diode, comprising: a carrier, a light-emitting layer, an encapsulation layer and a light interference layer. The carrier has a plurality of electrode layers on the surface and a plurality of pads on the bottom, and the electrode layers and the pads are electrically connected. The luminescent layer is composed of a plurality of luminescent wafers electrically connected to the electrode layers. The encapsulation layer is disposed on a surface of the carrier and encapsulates the light emitting chip packages. The light interference layer is disposed on a surface of the encapsulation layer.

In an embodiment of the present invention, the carrier is internally provided with an electrical conductor, and the electrical conductor electrically connects the electrode layers and the pads.

In one embodiment of the present invention, the carrier has a control circuit chip therein, and the control circuit chip electrically connects the electrode layers and the pads.

In one embodiment of the present invention, the illuminating wafers are flip-chip three primary color luminescent diode wafers.

In one embodiment of the present invention, the illuminating wafers have a pad on each of the illuminating wafers to electrically connect the illuminating wafers to the electrode layers.

In an embodiment of the present invention, the encapsulation layer is a light transmissive glue.

In one embodiment of the present invention, the light transmissive glue is a liquid epoxy resin, a solid epoxy resin or a silicone rubber.

In an embodiment of the present invention, the light interference layer has a cross shape on the surface of the encapsulation layer.

In one embodiment of the present invention, the coating of the light interference layer is a black ink mixed with an epoxy resin, or a black ink mixed with a silicone rubber.

In an embodiment of the present invention, the light interference layer has a thickness of 20 μm to 30 μm.

In order to achieve the above object, the present invention further provides a package structure of a light-emitting diode, comprising: a carrier, a light-emitting layer, an encapsulation layer and a light interference layer. The carrier has a plurality of electrode layers on the surface and a plurality of pads on the bottom, and the electrode layers and the pads are electrically connected. The luminescent layer is composed of a plurality of luminescent wafers electrically connected to the electrode layers. The encapsulation layer is disposed on the surface of the carrier, and encapsulates the light-emitting chip packages, and has a trench on the upper surface thereof. The light interference layer is disposed on a surface of the encapsulation layer and in the trench.

In an embodiment of the present invention, the carrier is internally provided with an electrical conductor, and the electrical conductor electrically connects the electrode layers and the pads.

In one embodiment of the present invention, the carrier has a control circuit chip therein, and the control circuit chip electrically connects the electrode layers and the pads.

In one embodiment of the present invention, the illuminating wafers are flip-chip three primary color luminescent diode wafers.

In one embodiment of the present invention, the illuminating wafers have a pad on each of the illuminating wafers to electrically connect the illuminating wafers to the electrode layers.

In an embodiment of the present invention, the encapsulation layer is a light transmissive glue.

In one embodiment of the present invention, the light transmissive glue is a liquid epoxy resin, a solid epoxy resin or a silicone rubber.

In an embodiment of the present invention, the light interference layer has a cross shape on a surface of the encapsulation layer  The section is T-shaped.  

In one embodiment of the present invention, the coating of the light interference layer is a black ink mixed with an epoxy resin, or a black ink mixed with a silicone rubber.

In an embodiment of the present invention, the light interference layer has a thickness of 20 μm to 30 μm.

In one embodiment of the present creation, the groove is cruciform and has a width of 100 μm.

The technical content and detailed description of this creation are as follows:

Please refer to FIG. 2-4 , which are schematic diagrams of the appearance of the package structure of the light-emitting diode of the first embodiment of the present invention and the top and side views of the light-emitting diode of FIG. 2 . As shown in the figure, the package structure of the light-emitting diode 10 of the present invention comprises: a carrier 1, a light-emitting layer 2, an encapsulation layer 3, and a light interference layer 4.

The carrier 1 has a plurality of electrode layers 11 on its upper surface, and the bottom of the carrier 11 has a plurality of pads 12, and the electrode layers 11 and the pads 12 pass through electrical conductors hidden inside the carrier 1 (in the figure) Not shown) Electrical connection. The pads 12 are electrically connected to the carrier 1 (not shown) of the matching device. In the present embodiment, a control circuit chip (not shown) may be disposed in the carrier 1 , and the control circuit chip is electrically connected to the electrode layers 11 and the pads 12 .

The luminescent layer 2 is composed of a plurality of luminescent wafers 21. The light-emitting chips 21 are electrically connected to the electrode layers 11 . In the present embodiment, the illuminating wafers 21 are flip-chip three-primary color (RGB) illuminating diode chips, and each of the three primary color illuminating wafers has a pad (not shown) for the three primary color illuminating wafers. It is electrically connected to the electrode layers 11.

The encapsulation layer 3 is disposed on the surface of the carrier 1 and encapsulates the luminescent wafers 21 . In the present embodiment, the encapsulating layer 3 is a light transmissive rubber material, which is a liquid epoxy resin (Epoxy), a solid epoxy resin or a silicone rubber.

The light interference layer 4 is printed or coated on the surface of the encapsulation layer 3 by a printing or coating technique. The light interference layer 4 can be seen in the upper view of FIG. The wafer 21 is spaced apart so that the light interference layer 4 avoids crosstalk caused by two adjacent light emitting chips 21. The coating is a mixture of black ink (lacquer) and epoxy resin (Epoxy), or black ink (lacquer) and silicone. In the present drawing, the light interference layer 4 has a thickness of 20 μm to 30 μm.

The surface of the encapsulation layer 3 is separated into two or more regions by the light interference layer 4, and the light interference layer 4 shields the light source between the two illuminating wafers 21 to reach the two illuminating wafers 21 in the human eye. No light transmission interference will occur.

Please refer to FIG. 5 , which is a schematic diagram of a package structure of a light emitting diode according to a second embodiment of the present invention. As shown in the figure, the second embodiment of the present invention is substantially the same as the first embodiment. The difference is that after the LED diode 10 is packaged, the surface of the encapsulation layer 3 is cut by a cutting technique to make the package. The surface of the layer 3 is formed with a cross-shaped groove 31. In the figure, the groove 31 has a width of 100 μm.

After the trench 31 is cut, the coating is applied to the surface of the trench 31 and the encapsulation layer 3 of the encapsulation layer 3 by a printing or coating technique to form a cross-shaped optical interference layer 4, which is interfering with the layer 4 The cross section is also in a T shape, and the surface of the encapsulation layer 3 is separated into two or more regions by the light interference layer 4, and the light interference layer 4 shields the light source between the two illuminating wafers 21 to reach the person. The two illuminating wafers 21 do not cause light transmission interference in the eye.

However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of the present creation. Therefore, the equivalent changes made by using the present specification or the content of the schema are all included in the right of the creation. Within the scope of protection, it is given to Chen Ming.

Conventional knowledge

10a‧‧‧Lighting diode

11a‧‧‧Substrate

12a‧‧‧electrode layer

13a‧‧‧ solder pads

2a‧‧‧Three primary color light-emitting wafers

3a‧‧‧Encapsulation layer

31a‧‧‧Gully

This creation

10‧‧‧Lighting diode

1‧‧‧ Carrier

11‧‧‧Electrode layer

12‧‧‧ solder pads

2‧‧‧Lighting layer

21‧‧‧Lighting chip

3‧‧‧Encapsulation layer

31‧‧‧ trench

4‧‧‧Light interference layer

FIG. 1 is a schematic view showing a package structure of a conventional light emitting diode;

2 is a perspective view showing the appearance of a package structure of a light-emitting diode according to a first embodiment of the present invention;

3 is a top plan view of the light emitting diode of FIG. 2;

Figure 4 is a side elevational view of the light emitting diode of Figure 2;

FIG. 5 is a schematic view showing a package structure of a light-emitting diode according to a second embodiment of the present invention.

Claims (21)

A package structure of a light emitting diode, comprising:  a carrier having a plurality of electrode layers on an upper surface thereof and a plurality of pads on the bottom, the electrode layers and the pads being electrically connected;  An illuminating layer is composed of a plurality of illuminating wafers, and the illuminating wafers are electrically connected to the electrode layers;  An encapsulation layer is disposed on the surface of the carrier and encapsulates the luminescent wafer packages;  A light interference layer is disposed on the surface of the encapsulation layer.   The package structure of the light-emitting diode according to the first aspect of the invention, wherein the carrier is internally provided with a conductor, and the electrode layer and the pads are electrically connected by the conductor. The package structure of the light-emitting diode according to the first aspect of the invention, wherein the carrier has a control circuit chip, and the control circuit chip electrically connects the electrode layers and the pads. The package structure of the light-emitting diode according to claim 1, wherein the light-emitting chips are flip-chip three-primary light-emitting diode chips. The package structure of the light-emitting diode according to the first aspect of the invention, wherein the light-emitting chips have a pad on the light-emitting chip, and the light-emitting chips are electrically connected to the electrode layers. The package structure of the light-emitting diode according to claim 1, wherein the package layer is a light-transmitting adhesive. The package structure of the light-emitting diode according to claim 6, wherein the light-transmitting adhesive material is a liquid epoxy resin, a solid epoxy resin or a silicone rubber. The package structure of the light-emitting diode according to claim 1, wherein the light interference layer has a cross shape on a surface of the package layer. The package structure of the light-emitting diode according to the first aspect of the invention, wherein the coating of the light interference layer is a black ink mixed with an epoxy resin, or a black ink mixed with a silicone rubber. The package structure of the light-emitting diode according to claim 1, wherein the light interference layer has a thickness of 20 μm to 30 μm. A package structure of a light emitting diode, comprising:  a carrier having a plurality of electrode layers on an upper surface thereof and a plurality of pads on the bottom, the electrode layers and the pads being electrically connected;  An illuminating layer is composed of a plurality of illuminating wafers, and the illuminating wafers are electrically connected to the electrode layers;  An encapsulation layer is disposed on the surface of the carrier, and encapsulates the light-emitting chip packages, and has a trench on the upper surface thereof;  A light interference layer is disposed on the surface of the encapsulation layer and in the trench.   The package structure of the light-emitting diode according to the invention of claim 11, wherein the carrier is internally provided with a conductor, and the electrode layer and the pads are electrically connected by the conductor. The package structure of the light-emitting diode according to claim 11, wherein the carrier has a control circuit chip, and the control circuit chip electrically connects the electrode layers and the pads. The package structure of the light-emitting diode according to claim 11, wherein the light-emitting chips are flip-chip three-primary light-emitting diode chips. The package structure of the light-emitting diode according to claim 11, wherein the light-emitting chips have a pad on the light-emitting chip, and the light-emitting chips are electrically connected to the electrode layers. The package structure of the light-emitting diode according to claim 11, wherein the package layer is a light-transmitting glue. The package structure of the light-emitting diode according to claim 16, wherein the light-transmitting adhesive is a liquid epoxy resin, a solid epoxy resin or a silicone rubber. The package structure of the light-emitting diode according to claim 11, wherein the light interference layer has a cross shape on a surface of the package layer and a T-shaped cross section. The package structure of the light-emitting diode according to claim 11, wherein the light interference layer coating is a black ink mixed with an epoxy resin, or a black ink mixed with a silicone rubber. The package structure of the light-emitting diode according to claim 11, wherein the light interference layer has a thickness of 20 μm to 30 μm. The package structure of the light-emitting diode according to claim 11, wherein the groove has a cross shape and a width of 100 μm.