TWM579714U - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes two components to be connected and a flexible metal-containing conduit. Each of the two components to be connected is selected from the group consisting of a manifold, a quick connector, an evaporator, a condenser, and a pump. The flexible metal-containing conduit is connected between the two components to be connected.

Description

Radiator

This case relates to a heat dissipation device, especially a heat dissipation device including a flexible metal coil.

In the conventional heat dissipation device, two to-be-connected elements are usually connected to each other by a hard pipe. However, rigid catheters are not adjustable and cannot absorb tolerances in component design. Although soft catheters such as plastic pipes (such as PVC pipes) can be used to avoid the above-mentioned problems, the current environmental awareness is rising, and plastic pipes may be banned because they do not comply with environmental protection regulations. Therefore, the existing catheter still needs to be improved.

The present invention provides a heat dissipation device, which includes two components to be connected and a flexible metal-containing snake tube. Each of the two components to be connected is selected from the group consisting of: a manifold, a quick connector, an evaporator, a condenser, and a pump. A flexible metal coil is connected between the two components to be connected. Since the new type adopts a flexible metal-containing coil, it is flexible, can effectively absorb the tolerances in the design of the component, and is made of metal material, which is convenient for recycling, so it can completely solve the problems described in the prior art.

In one embodiment, the two components to be connected are a manifold and a quick connector.

In one embodiment, the two components to be connected are a manifold and an evaporator.

In an embodiment, the two components to be connected are a quick coupling and an evaporator.

In an embodiment, the two elements to be connected are two evaporators.

In one embodiment, the two components to be connected are a manifold and a condenser.

In one embodiment, the two components to be connected are a manifold and a pump.

In an embodiment, the two components to be connected are an evaporator and a condenser.

In an embodiment, the flexible metal-containing coil is connected to at least one of the two components to be connected by welding.

In an embodiment, one of the two components to be connected is a quick connector, which can be connected to the quick connector by locking or destroying the press-fitting with a flexible metal coil.

In an embodiment, one of the two components to be connected is a quick connector, and the flexible metal-containing snake tube is connected to the quick connector through an anti-snake tube detachment mechanism.

In one embodiment, the anti-snake tube disengagement mechanism includes a buckle ring and a leak-proof rubber ring. The flexible metal-containing snake tube has a first groove and a second groove adjacent to the first groove. The first groove is provided to accommodate the buckle The ring and the second groove are provided to accommodate the leak-proof rubber ring.

Another preferred embodiment of the present invention provides a heat dissipation device including: two components to be connected, each of the two components to be connected is selected from the group consisting of: a manifold, an evaporator, a condenser and A pump; and a flexible metal-containing snake tube, at least one of the two ends of which has a quick connector, and the flexible metal-containing snake tube is connected between the two components to be connected.

In an embodiment, the flexible metal-containing snake tube is connected to the quick connector through an anti-snake tube disengagement mechanism.

In an embodiment, wherein the flexible metal-containing coil is connected to at least one of the two components to be connected by welding, or the flexible metal-containing coil is connected to the two to be connected by locking or breaking and pressing At least one of the components.

The new heat dissipation device uses a flexible metal-containing coil. Because of its flexibility, it can effectively absorb the design tolerances of the components when connecting the components to be connected, and because it is a metal material, it is easy to recycle. Completely solve the problems described in the prior art.

In addition, the inventor found that the body of the plastic material has a leakage problem, that is, the material in the tube may leak through the wall of the plastic tube, resulting in a reduction in the reliability of the heat dissipation device. However, the new heat dissipation device uses a flexible metal-containing snake tube, and the material in the tube cannot leak through the metal wall. Therefore, compared with a heat dissipation device using a plastic tube, the new heat dissipation device using a flexible metal coil can effectively prevent leakage and make the device highly reliable.

100‧‧‧ Components to be connected

110‧‧‧manifold

120‧‧‧Quick coupling

121‧‧‧Connector

130‧‧‧Evaporator

140‧‧‧Condenser

150‧‧‧Pump

200‧‧‧Flexible metal coil

201‧‧‧coolant supply line

202‧‧‧coolant discharge line

203A, 203B, 203C‧‧‧ pipeline

200a‧‧‧First groove

200b‧‧‧Second groove

300‧‧‧Anti-snake tube disengagement mechanism

310‧‧‧buckle

320‧‧‧Leakproof aprons

20‧‧‧Electronic device

40‧‧‧Chassis

Figure 1 is a schematic diagram of one of the basic implementation concepts of the new model.

FIG. 2 is a schematic diagram of a heat dissipation device according to various embodiments of the basic implementation concept of the present invention.

FIG. 3 is a partial schematic diagram of a heat dissipation device according to an embodiment of the present invention.

FIG. 4 is a schematic diagram of a specific implementation structure of some embodiments in FIG. 2.

Figure 1 is a schematic diagram of one of the basic implementation concepts of the new model. As shown in FIG. 1, the heat dissipation device includes two components 100 to be connected and a flexible metal-containing coil 200. The "flexible" metal-containing snake tube mentioned herein means that the flexible metal-containing snake tube can be bent properly without breaking. The flexible metal-containing "snake tube" described herein means that the outer side of the flexible metal-containing snake tube is wavy in the axial direction. In some embodiments, referring to FIG. 1, the flexible metal-containing coil 200 includes a plurality of wide portions (ie, portions with a larger outer diameter) and a plurality of narrow portions (ie, portions with a smaller outer diameter) alternately arranged so that The outer side of the flexible metal-containing coil 200 is wavy in the axial direction.

The element 100 to be connected can be selected from the group consisting of: manifold, quick coupling, evaporator, condenser and pump. However, the present invention can also be applied to other elements to be connected in the heat dissipation device, which is not limited to the above.

The flexible metal-containing coil 200 is connected between the two components 100 to be connected. It is worth noting that since the new type of flexible metal-containing coil is flexible, it can effectively absorb the design tolerances of the components, and it is made of metal material, which is convenient for recycling, so it can completely solve the problems described in the prior art. In some embodiments, the material of the flexible metal-containing coil includes metal, such as stainless steel, aluminum, zinc, or other suitable metal materials.

FIG. 2 is a schematic diagram of a heat dissipation device according to various embodiments of the basic implementation concept of the present invention. In one embodiment, the heat dissipation device shown in FIG. 2 includes a cluster type heat dissipation device. The cluster type heat dissipation device includes a manifold 110, one or more evaporators 130 and one or more flexible metal-containing coils 200, and a working medium (such as water) is filled in among them. In one embodiment, the cluster heat dissipation device further includes one or more quick connectors 120, which is beneficial to the assembly or maintenance of the cluster heat dissipation device.

The cluster heat dissipation device can be applied to electronic devices with multiple heat sources. The electronic device can be, for example, a rack (Rack), desktop host, server (Servers), small computer, medium-sized computer, large-scale computer or even super computer, etc., its internal CPU, GPU or memory module, etc. The components are easy to generate heat energy during operation and have the requirement of heat dissipation.

In an embodiment, as shown in FIG. 2, the two components to be connected are the manifold 110 and the evaporator 130 respectively. The flexible metal-containing coil 200 is connected between the manifold 110 and the evaporator 130. The manifold 110 has a function of shunting or collecting working media. In an embodiment, the manifold 110 may receive the cooled working medium and supply the cooled working medium. In an embodiment, the manifold 110 may be made of a metallic material or a non-metallic material with good thermal conductivity to further help the working medium to dissipate heat. The evaporator 130 may also be called a heat-absorbing head or a water-cooling head. The evaporator 130 can be directly attached to a heat source (not shown), or a thermally conductive paste, adhesive, solder, or thermally conductive block is interposed between the evaporator 130 and the heat source. In an embodiment, the working medium in the evaporator 130 absorbs heat and can be transported into the manifold 110 through the flexible metal-containing coil 200.

In an embodiment, as shown in FIG. 2, the two components to be connected are two evaporators 130, and the flexible metal coil 200 is connected between the two evaporators 130. In one embodiment, after the working medium in the evaporator 130 away from the manifold 110 absorbs heat, it can be transported through the flexible metal-containing coil 200 to the evaporator 130 near the manifold 110.

In an embodiment, as shown in Figure 2, the two components to be connected are For the quick connector 120 and the evaporator 130, the flexible metal coil 200 is connected between the quick connector 120 and the evaporator 130. The quick connector 120 may include an outer sleeve and an inner sleeve, both of which may be engaged or separated from each other. In one embodiment, after the working medium in the evaporator 130 absorbs heat, it can be transported through the flexible metal-containing coil 200 to the quick connector 120 and then into the manifold 110.

In an embodiment, as shown in FIG. 2, the two components to be connected are the manifold 110 and the quick connector 120 respectively, and the flexible metal-containing snake tube 200 is connected between the manifold 110 and the quick connector 120. The quick connector 120 can be connected to other components.

In one embodiment, as shown in FIG. 2, the two components to be connected are the manifold 110 and the condenser 140, and the flexible metal coil 200 is connected between the manifold 110 and the condenser 140. In an embodiment, the working medium can be transported from the manifold 110 through the flexible metal-containing coil 200 to the condenser 140 for cooling.

In one embodiment, as shown in FIG. 2, the two components to be connected are the manifold 110 and the pump 150, and the flexible metal-containing coil 200 is connected between the manifold 110 and the pump 150. In one embodiment, the working medium can be transported from the manifold 110 to the pump 150 through the flexible metal-containing coil 200.

In an embodiment, as shown in FIG. 2, the two components to be connected are two quick connectors 120, and the flexible metal coil 200 is connected between the two quick connectors 120.

In an embodiment, the heat dissipation device shown in FIG. 2 includes a heat exchange device. The heat exchange device includes an evaporator 130, a condenser 140, and a flexible metal-containing coil 200. The flexible metal-containing coil 200 is connected to the evaporator. Between 130 and the condenser 140.

The flexible metal-containing snake tube can be connected to the element to be connected in any manner, such as welding, locking, breaking and pressing, or through an additional anti-coil tube detachment mechanism to connect the element to be connected. The following provides several embodiments of the flexible metal-containing coil connection, but these embodiments are not intended to limit the present invention.

FIG. 3 is a partial schematic diagram of a heat dissipation device according to an embodiment of the present invention. In one embodiment, as shown in FIG. 3, the heat dissipation device includes a to-be-connected element 100, a flexible metal-containing coil 200, a quick connector 120, and a manifold 110. It is worth noting that the conventional plastic tube cannot be connected to the element 100 to be connected by welding, but the flexible metal coil 200 can be connected to the element to be connected by welding, but it is not limited thereto.

In one embodiment, as shown in FIG. 3, the flexible metal-containing snake tube 200 can be connected to the quick connector 120 through the snake tube release mechanism 300. In one embodiment, the anti-coil tube detachment mechanism 300 includes a retaining ring 310 and a leak-proof rubber ring 320. The buckle 310 can be, for example, a C-shaped or other shaped buckle. The leak-proof rubber ring 320 may be, for example, a Teflon rubber ring. The flexible metal-containing coil 200 has a first groove 200a and a second groove 200b, and the second groove 200b is adjacent to the first groove 200a. Compared with the first groove 200 a, the second groove 200 b is closer to the end of the flexible metal-containing coil 200. The first groove 200a is provided with a retaining ring 310 for accommodating the anti-coil tube disengagement mechanism 300, and the second groove 200b is provided with a leak-proof rubber ring 320 for accommodating the anti-coil tube disengagement mechanism 300. Through the snap ring 310, the flexible metal coil 200 can be strongly embedded in the quick connector 120. The leak-proof rubber ring 320 can prevent the working medium from flowing out.

In other embodiments, the flexible metal-containing coil can be connected to the quick connector in a locking or breaking press-fit manner. For example, the interior of the quick connector and flexible gold Corresponding threads can be provided on the outside of the end of the snake tube, so that the flexible metal-containing snake tube can be connected to the quick connector by screw locking. Alternatively, the end of the flexible metal-containing snake tube can be sleeved into the quick connector, and then the flexible metal-containing snake tube and the quick connector can be forcedly embedded by using a destructive compression method. However, in other embodiments, the anti-coil tube disengagement mechanism may also include a PIN pin or a tenon, etc. to prevent the flexible metal-containing coil tube from disengaging.

Please refer to FIG. 4 again, and please cooperate with those shown in FIG. 2; wherein, FIG. 4 is a schematic diagram of the specific implementation structure of some embodiments in FIG. 2; In the application field in which the electronic device 20 that needs to dissipate heat is included in the 40, of course, the present invention is not limited to this application.

It is stated that the cluster heat dissipation device of the present invention has at least one manifold 110, a plurality of evaporators 130 (or heat absorption head or water cooling head Cold plate), pipelines 201, 202, 203A, 203B, 203C and coolant (Not shown). Wherein, the manifold 110 includes a water inlet chamber and a water outlet chamber (not shown), which is connected to a coolant supply line 201 for receiving a cooler (cooled down) coolant (not shown) Out) and sent to each evaporator 130. Moreover, the manifold 110 is also connected to a coolant discharge line 202 to collect the coolant that has absorbed heat energy in each evaporator 130 and thus the temperature has increased (heated), and then it is transferred to the corresponding external condensing device or It is a heat exchange device (not shown) to reduce the temperature; when the cooling liquid is cooled down, it can return to the manifold 110 via the cooling liquid supply line 201 again.

In addition, each evaporator 130 is in thermal contact with a heat source (not shown) of the electronic device 20, so that the cooling fluid flowing through the inside of the evaporator 130 can be heated or undergo phase change to take away heat energy.

Therefore, the basic operating principle of heat dissipation shown in FIG. 4 is: after the coolant flows out from the manifold 110, it will enter the evaporator 130 through the pipeline 203A, absorb part of the heat energy of the heat source below, and then pass to the next The evaporator 130 also absorbs part of the heat energy generated by the heat source below, and finally the pipeline 203B will turn back between different cavities (not shown) inside the evaporator 130, allowing the cooling liquid to wrap back to each evaporator 130 to absorb The heat energy of other parts of the lower heat source is finally transferred back to the manifold 110 via the pipeline 203C.

Since the space of the chassis 40 is usually very small, and the components in the cluster heat dissipation device may sometimes need to be up / down (or front / rear, or left / right depending on the installation position of the electronic device 20 or other components) ) And other fine-tuning in different directions, is to replace the coolant supply line 201, the coolant discharge line 202, and the lines 203A, 203C with flexible metal-containing coils through the selection shown in Figure 4 of this case. Even if the space of the case 40 is narrow, it is still possible to fine-tune the assembly due to the features of these flexible metal coils, so as to greatly increase the flexibility of operation or maintenance.

In other words, for example, between the manifold 110 and the joint 121 provided at the chassis 40, the use of a flexible metal coil-containing coolant supply line 201 and a coolant discharge line 202 can obviously respond to the manifold 110 and the joint 121 The height position between them is different and there is room for fine-tuning the assembly; for another example, between the manifold 110 and the evaporator 130, the evaporator 130 can first be front / rear or left / right according to the actual position of the heat source in the electronic device 20 Fine adjustment, and due to the use of the flexible metal coiled pipe 203A, a fine adjustment tolerance can be provided without affecting the stability of the connection between the manifold 110 and the evaporator 130.

In addition, due to the coolant supply line 201 and the coolant discharge line 202 And the pipelines 200A and 200C are flexible metal-containing snake tubes. In order to completely eliminate the risk of loosening of the pipelines in the future, the new model can also choose to connect these pipelines to the components that are also metal (such as The tube 110 or the evaporator 130) is fixedly butted by a welding method, but at the same time, it can still retain the advantages of the flexible metal-containing coiled tube which can be fine-tuned for assembly.

Of course, all the pipelines shown in FIG. 4 can be partially or completely replaced with flexible metal coils according to actual application conditions and requirements, and are not limited to the new embodiment.

The above-mentioned embodiments are merely illustrative for explaining the principle and effect of the present invention, and explaining the technical features of the present invention, rather than limiting the protection scope of the present invention. Anyone who is familiar with the technology can change or equalize the arrangements that can be easily completed without violating the technical principles and spirit of the new model, which belongs to the scope of the new model.

Claims (15)

A heat dissipation device includes: two components to be connected, each of the two components to be connected is selected from the group consisting of: a manifold, a quick connector, an evaporator, a condenser, and a pump; and a The flexible metal-containing snake tube is connected between the two components to be connected. The heat dissipation device as described in item 1 of the patent application scope, wherein the two components to be connected are the manifold and the quick connector, respectively. The heat dissipation device as described in item 1 of the patent application scope, wherein the two components to be connected are the manifold and the evaporator, respectively. The heat dissipation device as described in item 1 of the patent application, wherein the two components to be connected are the quick connector and the evaporator. The heat dissipation device as described in item 1 of the patent application scope, wherein the two components to be connected are the two evaporators. The heat dissipation device as described in item 1 of the patent application scope, wherein the two components to be connected are the manifold and the condenser. The heat dissipation device as described in item 1 of the patent application scope, wherein the two components to be connected are the manifold and the pump. The heat dissipation device as described in item 1 of the patent application scope, wherein the two components to be connected are the evaporator and the condenser. The heat dissipation device as described in Item 1 of the patent application scope, wherein the flexible metal-containing coil is connected to at least one of the two components to be connected by welding. The heat dissipation device as described in item 1 of the patent application scope, wherein one of the two components to be connected is the quick connector, and the flexible metal-containing coil is connected to the quick connector by locking or breaking and pressing. The heat dissipation device as described in item 1 of the patent application scope, wherein one of the two components to be connected is the quick connector, and the flexible metal-containing snake tube is connected to the quick connector through a snake tube disengagement mechanism. The heat dissipation device as described in item 11 of the patent application scope, wherein the anti-coil tube disengagement mechanism includes a retaining ring and a leak-proof rubber ring, and the flexible metal-containing coil tube has a first groove and a second groove adjacent The first groove is configured to receive the buckle, and the second groove is configured to receive the leak-proof rubber ring. A heat dissipation device includes: two components to be connected, each of the two components to be connected is selected from the group consisting of: a manifold, an evaporator, a condenser, and a pump; and a flexible metal-containing coil, At least one of the two ends has a quick connector, and the flexible metal-containing coil is connected between the two components to be connected. The heat dissipation device as described in item 13 of the patent application range, wherein the flexible metal-containing snake tube is connected to the quick connector through a snake tube disengagement mechanism. The heat dissipation device as described in item 13 of the patent application scope, wherein the flexible metal-containing snake tube is connected to at least one of the two components to be connected by welding, or the flexible metal-containing snake tube is used to lock or break the compression At least one of the two components to be connected.