TWM577511U - Single-sensor double-lens application module - Google Patents

Single-sensor double-lens application module Download PDF

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TWM577511U
TWM577511U TW107216655U TW107216655U TWM577511U TW M577511 U TWM577511 U TW M577511U TW 107216655 U TW107216655 U TW 107216655U TW 107216655 U TW107216655 U TW 107216655U TW M577511 U TWM577511 U TW M577511U
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lens
image
application module
sensor
signal processor
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TW107216655U
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Chinese (zh)
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廖鎮峯
廖康伶
廖家綺
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升洋資訊企業有限公司
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Publication of TWM577511U publication Critical patent/TWM577511U/en

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Abstract

一種單感測器雙鏡頭應用模組,係應用於後置軟體圖像信號處理器,該單感測器雙鏡頭應用模組,包括︰一本體,包含位於前方一前本體及位於後方一後本體;二鏡頭,設於該本體之該前本體;一影像感測器,與後置軟體圖像信號處理器連接並設於該前本體與該後本體間,其對角線範圍內提供該二鏡頭投射物體部份所形成之二影像成像圈;一電路板,設於該本體之該後本體並電性連接於該影像感測器及該後置軟體圖像信號處理器;該單感測器雙鏡頭應用模組設有與該電路板電性連接之一USB插頭;藉此,有效使積變薄,成本低,技術提升至影像辨識新領域,可延伸更多相關產品。A single sensor dual lens application module is applied to a rear software image signal processor, and the single sensor dual lens application module includes: a body including a front front body and a rear side The second lens is disposed on the front body of the body; an image sensor is connected to the rear software image signal processor and disposed between the front body and the rear body, and is provided in a diagonal range thereof a second image projection ring formed by the second lens projecting portion; a circuit board disposed on the rear body of the body and electrically connected to the image sensor and the post-software image signal processor; The dual lens application module of the detector is provided with a USB plug electrically connected to the circuit board; thereby effectively reducing the product and reducing the cost, and the technology is upgraded to a new field of image recognition, and more related products can be extended.

Description

單感測器雙鏡頭應用模組Single sensor dual lens application module

本創作係有關一種應用模組,係指於本體設有二鏡頭與後置軟體圖像信號處理器連接之一影像感測器之單感測器雙鏡頭應用模組。The present invention relates to an application module, which is a single sensor dual lens application module in which an image sensor is connected to a main lens and a rear soft image signal processor.

按一般習用手機結構係設有單個鏡頭配合一個影像感測器,然現今進級利用兩個大尺寸鏡頭配合二個影像感測器之手機也就是為了達成3D之目的,3D感測從十多年前任天堂最熱銷的遊戲機Wii、微軟Xbox推出Kinect 遊戲機就已現蹤,這幾年該技術也延伸更多相關應用,例如︰精三維建模測量、地圖構建(SLAM)、擴增實境(AR)、互動教學、手勢辨識、線上試衣、安防和輔助駕駛等多個領域,目前全球五大智慧型手機品牌Samsung、Apple、華為、OPPD與Vivo已採用雙鏡頭,2017年iphoneX透過搭載True Depth相機模組達到人臉辨識,2018年後,估計只有二間廠牌有能力推出搭載與iphoneX採用的3D感測模組相似的手機;在成本方面,iphoneX使用的3D感測模組成本估計約18至24美元,而技術層面上,Apple本身在組裝過程也遇到不小挑戰,「校正」是主要技術門檻所在,紅外線一收一發的資料必須能對比起來,對模組組裝是不小挑戰;國內工研院光電所2004年發表相關產品,並展雍全球3D模組市場規模,工研產業經濟與趨勢研究中心(IELK)預估,2018年全球3D感測模組市場規模可到41.1億美元,較去年2017年15.33億美元大增168%;英飛淩目前推出兩款3D影像感測器︰IRS1010C(解析度160*120畫素)與RS1020C(解析度352*288畫素),這兩款產品都可透過I2C介面動態設定,可即時調整以改變光源及操作條件;晶片採裸晶出貨,能與攝影機模組內的攝影機鏡頭及紅外線(IR)照明源進行整合;Iintel RealSense3D攝影機及知名品牌皆陸續領導市場產出週邊商品,2018CES科技龍頭高通、意法半導體、英飛凌、德儀、聯發科、聯發科、華晶科、鈺創等廠商品,均展示3D感測解決方案及應用;進級設有兩個大尺寸鏡頭配合二個影像感測器之手機,係改進單個鏡頭配合一個影像感測器拍攝照片畫質,兩個鏡頭同時進光使進光量增加及兩個影像感測器同時感光,並利用圖像信號處理器做後期處理利用演算法融合,其提供使用者於拍攝照片有不同視角及景深,所以會比單個鏡頭配合一個影像感測器的畫質好,並適用低光的環境及獲得較佳現場畫質還原並抑制噪點,又拍照畫質係與鏡頭尺寸有很大關連性,大尺寸鏡頭能獲得較佳效果,但手機本身就有尺寸及厚度的限制,因此習用無論單個鏡頭或進級之兩個鏡頭之手機都無法使用符合實際大尺寸鏡頭,且單個鏡頭必須配合一個影像感測器,而兩個大尺寸鏡頭則必須配合二個影像感測器,此等都造成體積與厚度變大並增加成本,使得其在實用性上大打折扣,此乃為業者及消費者極欲突破之處。According to the general mobile phone structure, there is a single lens with an image sensor, but nowadays the mobile phone that uses two large-size lenses with two image sensors is used for 3D purposes, and 3D sensing has been used for more than ten years. Former Nintendo's best-selling game console Wii, Microsoft Xbox launched the Kinect game console, and the technology has extended more related applications, such as: 3D modeling measurement, map construction (SLAM), amplification Environment (AR), interactive teaching, gesture recognition, online fitting, security and assisted driving, etc. Currently, the world's top five smart phone brands Samsung, Apple, Huawei, OPPD and Vivo have adopted dual lenses, 2017 iphoneX through True Depth camera module achieves face recognition. After 2018, it is estimated that only two brands have the ability to launch a mobile phone similar to the 3D sensing module used by iphoneX. In terms of cost, the cost of 3D sensing module used by iphoneX Estimated to be about 18 to 24 US dollars, and on the technical level, Apple itself has encountered no small challenges in the assembly process. "Correction" is the main technical threshold, and infrared rays are collected. The data must be comparable, and it is no small challenge for module assembly; the Institute of Optoelectronics of China Institute of Technology published relevant products in 2004, and launched the global 3D module market scale, the Industrial and Industrial Economics and Trends Research Center (IELK) estimates In 2018, the global 3D sensing module market will reach US$4.11 billion, up 168% from US$1.533 billion in 2017. Infineon is currently launching two 3D image sensors: IRS1010C (resolution 160*120) Both) and RS1020C (resolution 352*288 pixels), both products can be dynamically set through the I2C interface, which can be adjusted instantly to change the light source and operating conditions; the wafer is shipped in bare crystal and can be combined with the camera module. Camera lens and infrared (IR) illumination source integration; Iintel RealSense3D camera and well-known brands are leading the market to produce peripheral products, 2018CES technology leading Qualcomm, STMicroelectronics, Infineon, Texas Instruments, MediaTek, MediaTek, Huajingke 3D sensing solutions and applications are displayed in the products of the company, etc.; the mobile phone with two large-size lenses and two image sensors is upgraded to improve the single lens. The image sensor takes a picture quality, the two lenses enter the light at the same time to increase the amount of light and the two image sensors are simultaneously sensitized, and the image signal processor is used for post-processing fusion using an algorithm, which provides the user with The photographs have different viewing angles and depth of field, so they will match the image quality of a single image sensor with a single lens, and it is suitable for low-light environment and better image quality reduction and noise suppression, as well as photo quality and lens size. There is a lot of correlation, large-size lenses can get better results, but the phone itself has the size and thickness limit, so the mobile phone that can be used with either the single lens or the two-stage lens can not be used with the actual large size lens. The lens must be matched with an image sensor, and the two large-size lenses must be matched with two image sensors, which cause the volume and thickness to increase and increase the cost, which makes it less useful in practicality. Industry and consumers are keen to break through.

為解決上述之現有技術不足之處,本創作主要目的,在於提供一種單感測器雙鏡頭應用模組,係於一本體設有二鏡頭及與後置軟體圖像信號處理器連接之一影像感測器,以期克服現有技術中之難處。In order to solve the above-mentioned deficiencies of the prior art, the main purpose of the present invention is to provide a single-sensor dual-lens application module, which is provided with a lens on a body and an image connected to a post-software image signal processor. Sensors to overcome the difficulties in the prior art.

本創作次要目的,在於提供一種單感測器雙鏡頭應用模組,透過二鏡頭投射物體部份所形成之二影像成像圈分別於單一該影像感測器對角線範圍內,另透過鏡頭改變視角與景深及後置軟體圖像信號處理之算法融合投射物體部份所形成之二影像成像圈及其影像區域尺寸,以達近拍及廣角鏡頭效果。The second objective of the present invention is to provide a single sensor dual lens application module. The two image imaging circles formed by projecting the object portion through the two lenses are respectively within a diagonal range of the single image sensor, and the lens is transmitted through the lens. The algorithm for changing the angle of view and the depth of field and the signal processing of the post-soft image image combines the two image imaging circles formed by the projected object portion and the image area size thereof to achieve the close-up and wide-angle lens effects.

本創作又一要目的,在於提供一種單感測器雙鏡頭應用模組,有效使該單感測器雙鏡頭應用模組體積變薄,成本低,技術提升至影像辨識新領域,可延伸更多相關產品。Another objective of the present invention is to provide a single sensor dual lens application module, which effectively reduces the size of the single sensor dual lens application module, and has low cost, and the technology is upgraded to a new field of image recognition, which can be extended. Multi-related products.

本創作所欲解決之問題,按手機本身就有尺寸及厚度的限制,因此習用無論單個鏡頭或進級之兩個鏡頭之手機都無法使用符合實際大尺寸鏡頭,同時單個鏡頭必須配合一個影像感測器,而兩個大尺寸鏡頭則必須配合二個影像感測器,此等都造成體積與厚度變大並增加成本,使得其在實用性上大打折扣。The problem that this creation is to solve depends on the size and thickness of the mobile phone itself. Therefore, the mobile phone that can be used with either the single lens or the two-stage lens cannot be used with the actual large-size lens, and the single lens must cooperate with an image sensing. The two large-size lenses must be combined with two image sensors, which cause volume and thickness to increase and increase the cost, which makes it practically compromised.

解決問題之技術手段,為達上述之目的,本創作係提供一種單感測器雙鏡頭應用模組,係應用於後置軟體圖像信號處理器,該單感測器雙鏡頭應用模組,包括︰ 一本體,包含位於前方一前本體及位於後方一後本體; 二鏡頭,係設於該本體之該前本體; 一影像感測器,係與該後置軟體圖像信號處理器連接並設於該前本體與該後本體間,該影像感測器之對角線範圍內提供該二鏡頭投射物體部份所形成之二影像成像圈; 一電路板,係設於該本體之該後本體,該電路板並電性連接於該影像感測器及該後置軟體圖像信號處理器。The technical means for solving the problem, in order to achieve the above purpose, the present invention provides a single sensor dual lens application module, which is applied to a post-software image signal processor, the single sensor dual lens application module, The main body includes a front body at the front and a rear body at the rear; the second lens is disposed on the front body of the body; and an image sensor is connected to the rear software image signal processor Between the front body and the rear body, a diagonal image of the image sensor provides a second image imaging circle formed by the two lens projection objects; a circuit board is disposed behind the body The main board is electrically connected to the image sensor and the post-software image signal processor.

其中,本創作該本體之該前本體設有提供該二鏡頭固定之二鏡頭座。The front body of the main body of the present invention is provided with two lens mounts for providing the two lenses.

其中,本創作該本體之該前本體另端設有提供該影像感測器固定之一內凹部。The front end of the front body of the body is provided with an inner recess for providing the image sensor.

其中,本創作該單感測器雙鏡頭應用模組設有與該電路板電性連接之一USB插頭。The single sensor dual lens application module of the present invention is provided with a USB plug electrically connected to the circuit board.

對照先前技術之功效,藉此,本創作該單感測器雙鏡頭應用模組主要係在一本體設有二鏡頭及與後置軟體圖像信號處理器連接之一影像感測器;進而達成,透過二鏡頭投射物體部份所形成之二影像成像圈分別於單一該影像感測器對角線範圍內,另透過鏡頭改變視角與景深及後置軟體圖像信號處理器之算法融合投射物體部份所形成之二影像成像圈及其影像區域尺寸,以達近拍及廣角鏡頭效果;有效使該單感測器雙鏡頭應用模組體積變薄,成本低,技術提升至影像辨識新領域,可延伸更多相關產品,符合進步、實用與使用者之所需,足見其增益之處。In contrast to the effects of the prior art, the single sensor dual lens application module is mainly provided with an image sensor connected to the second lens and the rear soft image signal processor; The two image imaging circles formed by projecting the object portion through the two lenses are respectively within a diagonal range of the image sensor, and the projection object is transformed by the lens to change the angle of view and the depth of field and the algorithm of the post-soft image signal processor. Part of the formed two image imaging circle and its image area size, in order to achieve close-up and wide-angle lens effect; effectively make the single-sensor dual-lens application module thinner, low cost, technology upgrade to new areas of image recognition, It can extend more related products, meet the needs of progress, practicality and users, and see its gains.

茲將本創作配合附圖,並以實施例之表達形式詳細說明如下,而於文中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本創作實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係侷限本創作於實際實施上的專利範圍,合先敘明。The present invention will be described in detail with reference to the accompanying drawings, and the drawings used in the text are intended to be illustrative only and to assist the specification, and may not be true proportion and precision after the implementation of the creation. Configuration, so the proportion of the attached schema and the configuration relationship should not be limited to the scope of the patent created in the actual implementation, which is described first.

請參閱第一圖、第二圖、第三圖及第四圖、第五圖及第六圖所示,係為本創作之立體分解圖、本創作之立體組合圖、本創作之組合剖面圖及本創作與投射物體產生之影像成像圈及透過與影像感測器連接之後置軟體圖像信號處理器改影像區域尺寸之實施例圖、本創作二鏡頭投射物體於單一影像感測器所產生二影像成像圈之實施例圖及本創作鏡頭視角與景深配置圖,本創作之單感測器雙鏡頭應用模組於一較佳之實施例中,係應用於後置軟體圖像信號處理器5,該單感測器雙鏡頭應用模組100,包括一本體1、二鏡頭4、一影像感測器3、一電路板2。Please refer to the first, second, third and fourth, fifth and sixth figures, which are the three-dimensional exploded view of the creation, the three-dimensional combination of the creation, and the combined sectional view of the creation. And the image imaging circle generated by the creation and the projection object and the embodiment of the image area of the software image signal processor connected to the image sensor, and the second lens projection object produced by the single image sensor The embodiment of the second image imaging circle and the view angle and depth of field configuration of the present lens, the single sensor dual lens application module of the present invention is applied to the rear software image signal processor 5 in a preferred embodiment. The single sensor dual lens application module 100 includes a body 1 , a second lens 4 , an image sensor 3 , and a circuit board 2 .

前述之一本體1,包含位於前方一前本體11及位於後方一後本體12;該本體1之該前本體11設有二鏡頭座112,該本體1之該前本體11另端設有一內凹部111(如第一圖至第三圖所示)。The first body 1 includes a front front body 11 and a rear rear body 12; the front body 11 of the main body 1 is provided with two lens mounts 112, and the front body 11 of the main body 1 is provided with an inner recess at the other end. 111 (as shown in the first to third figures).

前述之二鏡頭4,係設於該本體1之該前本體11;該鏡頭4係設於該本體1之該前本體11所設之二鏡頭座112(如第一圖至第三圖所示);利用該二鏡頭4從不同角度,對同一物體拍攝影像,再進行三角測量法等運算來取得投射物體之間的距離資訊,並作3D感測獲取空間的立體資訊,其透過二鏡頭4對物體進行拍攝影像,提供低光環境下有較佳效果外,拍攝之影像可分析現場還原度比較高,抑制噪點,使拍照畫質更清晰且具景深效果。The second lens 4 is disposed on the front body 11 of the body 1; the lens 4 is disposed on the two lens mounts 112 of the front body 11 of the body 1 (as shown in the first to third figures). Using the two lenses 4 to shoot images from the same object from different angles, and then perform triangulation calculations to obtain the distance information between the projected objects, and to obtain the stereoscopic information of the space by 3D sensing, which passes through the two lenses 4 When shooting images on an object to provide better results in low-light environments, the captured images can be analyzed to have a higher degree of reduction in the field, suppressing noise, and making the picture quality clearer and deeper.

前述之一影像感測器3,係與該後置軟體圖像信號處理器5連接並設於該前本體11與該後本體12間,該影像感測器3之對角線範圍內提供該二鏡頭4投射物體部份所形成之二影像成像圈,該影像感測器3係可設於該本體1之該前本體11另端所設之該一內凹部111(如第一圖至第三圖所示),該影像感測器3之該對角線範圍即所謂由鏡頭4看到出到物體的角度之視野(Field of View,FOV),其可藉由測量水平角及垂直角度得到,依正常情況下一鏡頭投射物體部份所形成之一影像成像圈只對應單一影像感測器3,該二鏡頭4投射物體部份所形成之二影像成像圈需要兩個的影像感測器3,本創作將該二鏡頭4投射物體部份所形成之二影像成像圈分別於單一該影像感測器3對角線範圍內,會使該影像感測器3所組成固定像素(pixel)之每一影像成像圈之像素尺寸(image size)變小(如第五圖所示),本創作另透過連接之後置軟體圖像信號處理5之算法融合投射物體部份所形成之二影像成像圈,使其獲得及提升其畫質。The image sensor 3 is connected to the rear soft image signal processor 5 and disposed between the front body 11 and the rear body 12. The image sensor 3 provides the diagonal range. The second image 4 is formed by the second image forming ring, and the image sensor 3 is disposed at the other end of the front body 11 of the body 1 (as shown in the first figure to the first As shown in the three figures, the diagonal range of the image sensor 3 is a field of view (FOV) that is seen by the lens 4 to the object, which can be measured by horizontal and vertical angles. Obtaining that, according to a normal situation, one of the image projection circles formed by the projection object portion of the lens only corresponds to the single image sensor 3, and the two image imaging circles formed by the projection portion of the two lenses 4 require two image sensing. 3, the two image imaging circles formed by the two lens 4 projecting objects are respectively within a diagonal range of the single image sensor 3, which will make the image sensor 3 constitute a fixed pixel (pixel ) the image size of each image imaging circle becomes smaller (eg As shown in FIG.), The creation of other processing algorithm 5 through the image signal after the connection software is set two image forming fused ring formed by the projection of the object portion so as to obtain and enhance its quality.

本創作該二鏡頭4所投射物體部份形成於該影像感測器3之二影像成像圈之二影像,透過後置軟體圖像信號處理器5改變其影像區域達成近拍或廣角鏡頭效果;而欲形成補捉較多影像,則透過與該影像感測器3連接之後置軟體圖像信號處理器5改變其影像區域達成其超薄及廣角鏡頭效果(如第四圖所示)。The image of the object projected by the two lenses 4 is formed on the second image of the image imaging circle of the image sensor 3, and the image image area of the image sensor 3 is changed by the post-soft image signal processor 5 to achieve a close-up or wide-angle lens effect; To form a larger image, the soft image signal processor 5 changes its image area after connecting with the image sensor 3 to achieve its ultra-thin and wide-angle lens effect (as shown in the fourth figure).

無論形成一狹窄視角之望遠鏡頭效果或具有補捉較多影像之廣角效果,都會使實際成像與理想影像之間產生變形(Distortion),同樣可透過該後置軟體圖像信號處理器5予以修正,本創作該二鏡頭4投射於該影像感測器3之二影像成像圈,由於無法完全覆蓋於該影像感測器3之對角線範圍,因此,投射於該影像感測器3之二影像成像圈部份其靠近中央部分清晰而其周圍及該二影像成像圈部份相鄰交疊部份會有變形,即所謂實際成像與理想影像之間的差異,而鏡頭4之畸變原因主要來自像差Abbreviation,該二鏡頭4對色光的彎曲能力不同,使成像點與光軸距離不同,其側向放大率亦隨之不同所造成,畸變有如桶狀畸變(或稱負型扭曲,negative distortion),整體影像會小,較常發生在廣角鏡頭或魚眼鏡頭,影像會變成四角向內收縮,邊線中段則向外凸出,另一種為枕狀畸變(或稱為正型扭曲,positive distortion),較常發在使用長焦段鏡頭或變焦鏡的望遠端,物體的影像會變成由四角向內凹陷,然由於本創作該二鏡頭4焦點距離固定,該二鏡頭4投射物體部份影像所形成二影像成像圈分別在該影像感測器3上,該影像感側器3所形成影像成像圈尺寸,可依據像素尺寸(Pixel size),係以百萬分之一公尺(UM)為單位及長邊及短邊之像素數量(pixel count)來決定對角線尺寸。Whether it is a telescope head effect that forms a narrow viewing angle or a wide-angle effect that captures more images, distortion between the actual image and the ideal image is generated, which can also be corrected by the post-software image signal processor 5. The second lens 4 is projected on the image imaging circle of the image sensor 3, and cannot be completely covered by the diagonal range of the image sensor 3, so it is projected on the image sensor 3 The image imaging circle portion is clear near the central portion and the surrounding portion and the adjacent overlapping portion of the image forming circle portion are deformed, that is, the difference between the actual imaging and the ideal image, and the distortion of the lens 4 is mainly caused. From the Abbreviation of the aberration, the bending ability of the four pairs of color light is different, so that the distance between the imaging point and the optical axis is different, and the lateral magnification is also different. The distortion is like barrel distortion (or negative distortion, negative) Distortion), the overall image will be small, more often in wide-angle lens or fisheye lens, the image will become inwardly contracted at four corners, the middle of the sideline will bulge outward, and the other will be pillow Distortion (or positive distortion), more often in the telephoto end of the telephoto lens or the zoom lens, the image of the object will become concave from the four corners, but due to the creation of the two lens 4 focal distance fixed The image capturing circle formed by the image of the image sensor 3 is formed on the image sensor 3, and the size of the image forming circle formed by the image sensor 3 can be based on the pixel size (Pixel size). The pixel size is determined by the unit of a millionth of a meter (UM) and the number of pixels on the long side and the short side (pixel count).

前述之一電路板2,係設於該本體1之該後本體12,該電路板2並電性連接於該影像感測器3及該後置軟體圖像信號處理器5;該單感測器雙鏡頭應用模組100可設有與該電路板2電性連接之一USB插頭101以提供電源(如第一圖至第三圖所示)。The circuit board 2 is electrically connected to the image sensor 3 and the post-software image signal processor 5; the single sensing is performed on the rear panel 12 of the main body 1. The dual lens application module 100 can be provided with a USB plug 101 electrically connected to the circuit board 2 to provide power (as shown in the first to third figures).

本創作其設有二鏡頭4與單一影像感測器3,可透過後置軟體圖像信號處理器5改變其影像區域,以達成其近拍或廣角鏡頭之效果,當二鏡頭4之每一鏡頭4投射物體部份形成之二影像成像圈於單一該影像感測器3範圍內時,亦可隨著二鏡頭4其每一鏡頭4不同位置,以改變其視角範圍,當視角範圍變小,會形成有一般所謂景深變淺的長焦鏡頭效果,當視角範圍變大,即會形成一般所稱之景深變深之廣角鏡頭,該二鏡頭4透過視角及景深相互配合以而產生不同效果,於本創作其配合可為相同視角及相同景深,或者相同視角及不同景深,或者不同視角及相同景深,或者不同視角及不同景深(如第六圖所示)。The present invention is provided with two lenses 4 and a single image sensor 3, which can be changed by the rear soft image signal processor 5 to achieve the effect of the close-up or wide-angle lens, when each lens of the two lenses 4 4 When the two image forming circles formed by the projecting object are within the range of the single image sensor 3, the range of the viewing angle may be changed according to the different positions of each lens 4 of the two lenses 4, and the viewing angle range becomes smaller. A telephoto lens effect with a generally shallow depth of field will be formed. When the angle of view becomes larger, a wide-angle lens with a deeper depth of field is formed, and the two lenses 4 have different effects by matching the angle of view and the depth of field. The creation of the creation can be the same perspective and the same depth of field, or the same perspective and different depth of field, or different perspectives and the same depth of field, or different perspectives and different depth of field (as shown in the sixth figure).

本創作其應用層面上更可延伸至數位內容產業、醫療美容、人體計測和工業逆向工程等微型運用領域、讓3D世界與人們的生活互動更加密切,亦可應用於智慧型手機、超筆電或筆電、平板電腦、數位相機、數位攝影機、PC多媒體,但並不以此限制本創作,能透過二鏡頭4,一影像感測器3,為市場增添低成本微型單感測器雙鏡頭應用模組100,對於小型產品設計是一大突破。The application level can be extended to digital applications such as digital content industry, medical beauty, human body measurement and industrial reverse engineering, so that the 3D world can interact more closely with people's lives. It can also be applied to smart phones and ultra-notes. Or a laptop, a tablet, a digital camera, a digital camera, or a PC multimedia, but this does not limit the creation. It can add a low-cost miniature single sensor dual lens to the market through the second lens 4 and an image sensor 3. The application module 100 is a breakthrough for small product design.

藉此,本創作該單感測器雙鏡頭應用模組100主要係在一本體1設有二鏡頭4及與後置軟體圖像信號處理器5連接之一影像感測器3;進而達成,透過二鏡頭4投射物體1部份所形成之二影像成像圈分別於單一該影像感測器3對角線範圍內,另透過鏡頭4改變視角與景深及後置軟體圖像信號處理器5之算法融合投射物體部份所形成之二影像成像圈及其影像區域尺寸,以達近拍及廣角鏡頭效果;有效使該單感測器雙鏡頭應用模組100體積變薄,成本低,技術提升至影像辨識新領域,可延伸更多相關產品,符合進步、實用與使用者之所需,足見其增益之處。Therefore, the single sensor dual lens application module 100 is mainly provided with a lens 4 on one body 1 and an image sensor 3 connected to the rear software image signal processor 5; The two image imaging circles formed by projecting the first part of the object through the two lenses 4 are respectively within a diagonal range of the single image sensor 3, and the angle of view and the depth of field and the post-soft image signal processor 5 are changed through the lens 4. The algorithm combines the two image imaging circles and the image area size formed by the projected object portion to achieve the close-up and wide-angle lens effects; effectively, the single-sensor dual-lens application module 100 is thinned, the cost is low, and the technology is improved to A new field of image recognition can extend more related products, meeting the needs of progress, practicality and users, and seeing its gains.

綜觀上述可知,本創作在突破先前之技術結構下,確實已達到所欲增進之功效,且也非熟悉該項技藝者所易於思及,再者,本創作申請前未曾公開,其所具之進步性、實用性,顯已符合創作專利之申請要件,爰依法提出創作申請,懇請貴局核准本件創作專利申請案,以勵創作,至感德便。Looking at the above, we can see that this creation has achieved the desired effect under the previous technical structure, and it is not easy for people who are familiar with the art to think about it. Moreover, this creation has not been disclosed before the application, and it has Progressive and practical, it has already met the requirements for the creation of patents, and has submitted an application for creation according to law. You are requested to approve the creation of a patent application for this article, so as to encourage creation and to be sensible.

以上所述之實施例僅係為說明本創作之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本創作之內容並據以實施,當不能以之限定本創作之專利範圍,即大凡依本創作所揭示之精神所作之均等變化或修飾,仍應涵蓋在本創作之專利範圍內。The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

100‧‧‧單感測器雙鏡頭應用模組100‧‧‧Single sensor dual lens application module

101‧‧‧USB 101‧‧‧USB

1‧‧‧本體 1‧‧‧ Ontology

11‧‧‧前本體 11‧‧‧ Front body

111‧‧‧內凹部 111‧‧‧ Inside recess

112‧‧‧鏡頭座 112‧‧‧ lens mount

12‧‧‧後本體 12‧‧‧ Rear body

2‧‧‧電路板 2‧‧‧ boards

3‧‧‧影像感測器 3‧‧‧Image sensor

4‧‧‧鏡頭 4‧‧‧ lens

5‧‧‧後置軟體圖像信號處理器 5‧‧‧After software image signal processor

第一圖︰為本創作之立體分解圖。 第二圖︰為本創作之立體組合圖。 第三圖︰為本創作之組合剖面圖。 第四圖︰為本創作與投射物體產生之影像成像圈及透過與影像感測器連接之後置軟體圖像信號處理器改影像區域尺寸之實施例圖。 第五圖︰為本創作二鏡頭投射物體於單一影像感測器所產生二影像成像圈之實施例圖。 第六圖︰為本創作鏡頭視角與景深配置圖。The first picture: the three-dimensional exploded view of the creation. The second picture: the three-dimensional combination of the creation. The third picture: a combined sectional view of the creation. The fourth figure is an embodiment of the image imaging circle generated by the creation and projection object and the image area size of the software image processor after being connected to the image sensor. Fig. 5 is a view showing an embodiment of a two-image imaging circle produced by a single-lens projection object in a single image sensor. The sixth picture: the configuration perspective of the creation lens and the depth of field.

Claims (4)

一種單感測器雙鏡頭應用模組,係應用於後置軟體圖像信號處理器,該單感測器雙鏡頭應用模組,包括︰ 一本體,包含位於前方一前本體及位於後方一後本體; 二鏡頭,係設於該本體之該前本體; 一影像感測器,係與該後置軟體圖像信號處理器連接並設於該前本體與該後本體間,該影像感測器之對角線範圍內提供該二鏡頭投射物體部份所形成之二影像成像圈; 一電路板,係設於該本體之該後本體,該電路板並電性連接於該影像感測器及該後置軟體圖像信號處理器。A single sensor dual lens application module is applied to a rear software image signal processor, and the single sensor dual lens application module includes: a body including a front front body and a rear side The second lens is disposed on the front body of the body; an image sensor is connected to the rear software image signal processor and disposed between the front body and the rear body, the image sensor Providing a second image imaging ring formed by the two lens projection objects in a diagonal range; a circuit board is disposed on the rear body of the body, and the circuit board is electrically connected to the image sensor and The post-software image signal processor. 如申請專利範圍第1項所述之單感測器雙鏡頭應用模組,其中,所述本體之該前本體設有提供該二鏡頭固定之二鏡頭座。The single sensor dual lens application module of claim 1, wherein the front body of the body is provided with two lens holders for providing the two lenses. 如申請專利範圍第2項所述之單感測器雙鏡頭應用模組,其中,所述本體之該前本體另端設有提供該影像感測器固定之一內凹部。The single-sensor dual-lens application module of claim 2, wherein the front end of the body is provided with an inner recess for providing the image sensor. 如申請專利範圍第1項至第3項中任一項所述之單感測器雙鏡頭應用模組,其中,所述單感測器雙鏡頭應用模組設有與該電路板電性連接之一USB插頭。The single sensor dual lens application module according to any one of the preceding claims, wherein the single sensor dual lens application module is electrically connected to the circuit board. One of the USB plugs.
TW107216655U 2018-12-07 2018-12-07 Single-sensor double-lens application module TWM577511U (en)

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