TWM577509U - Electronic device - Google Patents
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- TWM577509U TWM577509U TW108200695U TW108200695U TWM577509U TW M577509 U TWM577509 U TW M577509U TW 108200695 U TW108200695 U TW 108200695U TW 108200695 U TW108200695 U TW 108200695U TW M577509 U TWM577509 U TW M577509U
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Abstract
Description
本案係關於一種電子裝置。 This case relates to an electronic device.
筆記型電腦由於短小輕薄的獨特外型設計,使得筆記型電腦易於被攜帶。一般而言,筆記型電腦主要設有顯示螢幕與主機殼體。主機殼體於相鄰顯示螢幕的表面為操控面板。操控面板上設置有鍵盤。藉由操作鍵盤可輸入資訊至筆記型電腦內,並由顯示螢幕顯現出與其相對應的資訊畫面。 The notebook computer is easy to carry because of its short, thin and light unique design. In general, a notebook computer is mainly provided with a display screen and a main body casing. The surface of the host housing on the adjacent display screen is a control panel. A keyboard is provided on the control panel. By operating the keyboard, information can be input into the notebook, and the corresponding information screen appears on the display screen.
依據本揭露之一實施方式,電子裝置包含蓋體、框體以及顯示模組。蓋體包含底板以及圍繞底板之第一側壁且具有開設於第一側壁之第一組裝滑槽。框體設置於底板上,且包含第一突出部。第一突出部突伸並卡合於第一組裝滑槽中。顯示模組設置於框體中。 According to an embodiment of the present disclosure, an electronic device includes a cover, a frame, and a display module. The cover body includes a bottom plate and a first side wall surrounding the bottom plate and has a first assembly chute formed on the first side wall. The frame is disposed on the bottom plate and includes a first protrusion. The first protrusion protrudes and engages in the first assembly chute. The display module is set in the frame.
綜上所述,本揭露的蓋體的組裝滑槽可達到卡合顯示模組的效果。由於本案的多個組裝滑槽具有不同的結構,因此若框體上的突出部或蓋體的組裝滑槽存在結構配置 上的公差時,則組裝滑槽可提供結構上的緩衝,使得電子裝置不會因為製造的公差而使得框體無法組裝至蓋體。 In summary, the assembly chute of the cover body of the present disclosure can achieve the effect of engaging the display module. Since the plurality of assembly chutes of the present case have different structures, if the protruding portion of the frame body or the assembly chute of the cover body has a structural configuration In the case of the upper tolerance, the assembly chute can provide structural cushioning so that the electronic device does not cause the frame to be assembled to the cover due to manufacturing tolerances.
1‧‧‧電子裝置 1‧‧‧Electronic device
10‧‧‧第一機體 10‧‧‧First body
12‧‧‧框體 12‧‧‧ frame
14‧‧‧顯示模組 14‧‧‧Display module
16‧‧‧擋止件 16‧‧‧stops
18‧‧‧抵靠部 18‧‧‧Affiliation
20‧‧‧第二機體 20‧‧‧Second body
30‧‧‧樞接件 30‧‧‧ pivotal parts
100‧‧‧蓋體 100‧‧‧ cover
101‧‧‧底板 101‧‧‧floor
102、104、106、108‧‧‧側壁 102, 104, 106, 108‧‧‧ side walls
105‧‧‧邊緣 105‧‧‧ edge
109‧‧‧端面 109‧‧‧ end face
120、122、124‧‧‧突出部 120, 122, 124‧‧ ‧ protruding parts
121、123、125‧‧‧定位壁 121, 123, 125‧‧‧ positioning wall
1020a、1022a、1060a‧‧‧開口 1020a, 1022a, 1060a‧‧‧ openings
1020、1022‧‧‧組裝滑槽 1020, 1022‧‧‧ Assembly chute
1020b、1022b‧‧‧容置槽 1020b, 1022b‧‧‧ accommodating slots
1020c、1022c‧‧‧底部 1020c, 1022c‧‧‧ bottom
1020d‧‧‧限位部 1020d‧‧‧Limited
1020i、1022i‧‧‧承靠面 1020i, 1022i‧‧‧ bearing surface
1020n‧‧‧內緣 1020n‧‧‧ inner edge
1060‧‧‧限位孔 1060‧‧‧Limited holes
B-B、B’-B’‧‧‧線段 B-B, B’-B’‧‧‧ segments
D2、D3‧‧‧方向 D2, D3‧‧‧ direction
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖繪示依據本揭露一實施方式之電子裝置的立體圖。 The above and other objects, features, advantages and embodiments of the present disclosure will be more apparent and understood. The description of the drawings is as follows: FIG. 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.
第2圖繪示依據本揭露一實施方式之電子裝置的部分結構爆炸圖。 FIG. 2 is a partial exploded view of an electronic device according to an embodiment of the present disclosure.
第3A圖為第2圖所示之結構的局部結構放大圖。 Fig. 3A is an enlarged view showing a partial structure of the structure shown in Fig. 2.
第3B圖為第2圖所示之結構的另一局部結構放大圖。 Fig. 3B is an enlarged view of another partial structure of the structure shown in Fig. 2.
第4圖繪示依據本揭露一實施方式之框體以及顯示模組的部分結構立體圖。 FIG. 4 is a perspective view showing a partial structure of a frame and a display module according to an embodiment of the present disclosure.
第5A圖繪示依據本揭露一實施方式之蓋體與框體於組裝完成之後的部分結構立體圖。 FIG. 5A is a perspective view showing a partial structure of the cover body and the frame body after the assembly is completed according to an embodiment of the present disclosure.
第5B圖繪示第5A圖所示之結構的剖視圖。 Fig. 5B is a cross-sectional view showing the structure shown in Fig. 5A.
第6A圖繪示依據本揭露一實施方式之蓋體與框體於組裝完成之後的另一部分結構立體圖。 FIG. 6A is a perspective view showing another part of the structure after the assembly of the cover body and the frame body according to an embodiment of the present disclosure.
第6B圖繪示第6A圖所示之結構的剖視圖。 Fig. 6B is a cross-sectional view showing the structure shown in Fig. 6A.
第7圖繪示依據本揭露一實施方式之蓋體與框體於組裝完成之後的再一部分結構立體圖。 FIG. 7 is a perspective view showing another part of the structure after the assembly of the cover body and the frame body according to an embodiment of the present disclosure.
第8圖繪示依據本揭露一實施方式之蓋體與框體於組裝過中之一階段下的側視圖。 FIG. 8 is a side view showing the cover body and the frame body in one stage of assembly according to an embodiment of the present disclosure.
第9A圖繪示依據本揭露一實施方式之蓋體與框體於組裝過中之一階段下的側視圖。 FIG. 9A is a side view showing the cover body and the frame body in one stage of assembly according to an embodiment of the present disclosure.
第9B圖以及第9C圖分別為第9A圖所示之結構的局部結構放大圖。 Fig. 9B and Fig. 9C are enlarged views of a partial structure of the structure shown in Fig. 9A, respectively.
第10A圖繪示依據本揭露一實施方式之蓋體與框體於組裝過中之一階段下的側視圖。 FIG. 10A is a side view showing the cover body and the frame body in one stage of assembly according to an embodiment of the present disclosure.
第10B圖以及第10C圖分別為第10A圖所示之結構的局部結構放大圖。 10B and 10C are respectively enlarged partial views of the structure shown in Fig. 10A.
第11A圖繪示依據本揭露一實施方式之蓋體與框體於組裝過中之一階段下的側視圖。 FIG. 11A is a side view showing the cover body and the frame body in one stage of assembly according to an embodiment of the present disclosure.
第11B圖以及第11C圖分別為第11A圖所示之結構的局部結構放大圖。 Fig. 11B and Fig. 11C are enlarged views of a partial structure of the structure shown in Fig. 11A, respectively.
以下的說明將提供許多不同的實施方式或實施例來實施本揭露的主題。元件或排列的具體範例將在以下討論以簡化本揭露。當然,這些描述僅為部分範例且本揭露並不以此為限。例如,將第一特徵形成在第二特徵上或上方,此一敘述不但包含第一特徵與第二特徵直接接觸的實施方式,也包含其他特徵形成在第一特徵與第二特徵之間,且在此情形下第一特徵與第二特徵不會直接接觸的實施方式。此外,本揭露可能會在不同的範例中重複標號或文字。重複的目的是為了簡化及明確敘述,而非界定所討論之不同實施方式及配置間的關係。 The following description will provide many different embodiments or embodiments to implement the subject matter of the present disclosure. Specific examples of components or arrangements will be discussed below to simplify the disclosure. Of course, these descriptions are only partial examples and the disclosure is not limited thereto. For example, the first feature is formed on or above the second feature, and the description includes not only the embodiment in which the first feature is in direct contact with the second feature, but also other features formed between the first feature and the second feature, and An embodiment in which the first feature and the second feature are not in direct contact in this situation. In addition, the disclosure may repeat the label or text in different examples. The purpose of the repetition is to simplify and clarify the description, rather than to define the different embodiments and the relationships between the configurations.
此外,空間相對用語如「下面」、「下方」、「低 於」、「上面」、「上方」及其他類似的用語,在此是為了方便描述圖中的一個元件或特徵與另一個元件或特徵的關係。空間相對用語除了涵蓋圖中所描繪的方位外,該用語更涵蓋裝置在使用或操作時的其他方位。也就是說,當該裝置的方位與圖式不同(旋轉90度或在其他方位)時,在本文中所使用的空間相對用語同樣可相應地進行解釋。 In addition, spatial relative terms such as "below", "below" and "low" The words "above", "above", "above", and the like, are used to describe one element or feature in the figure in relation to another element or feature. Spatially relative terms encompasses other orientations of the device in use or operation, in addition to the orientation depicted in the figures. That is, when the orientation of the device is different from the schema (rotated 90 degrees or at other orientations), the spatially relative terms used herein may also be interpreted accordingly.
請參照第1圖至第11C圖,於一實施方式中,電子裝置1包含第一機體10、第二機體20以及樞接件30(見第8圖)。樞接件30樞接於第一機體10與第二機體20之間,使得第一機體10可相對於第二機體20轉動。如第2圖所示,第一機體10包含蓋體100、框體12、顯示模組14、擋止件16(見第11B圖)以及抵靠部18。於一實施方式中,電子裝置1為筆記型電腦,但本案不以此為限。於其他實施方式中,任何適合的電子裝置皆能應用於本案。舉例來說,於一實施方式中,第一機體1011為顯示螢幕。第二機體20包含輸入模組。在另一實施例中,第一機體10及第二機體20皆為觸控螢幕。 Referring to FIGS. 1 to 11C , in one embodiment, the electronic device 1 includes a first body 10 , a second body 20 , and a pivoting member 30 ( see FIG. 8 ). The pivoting member 30 is pivotally connected between the first body 10 and the second body 20 such that the first body 10 is rotatable relative to the second body 20. As shown in FIG. 2, the first body 10 includes a lid body 100, a frame body 12, a display module 14, a stopper 16 (see FIG. 11B), and an abutting portion 18. In an embodiment, the electronic device 1 is a notebook computer, but the present invention is not limited thereto. In other embodiments, any suitable electronic device can be used in the present case. For example, in an embodiment, the first body 1011 is a display screen. The second body 20 includes an input module. In another embodiment, the first body 10 and the second body 20 are touch screens.
如第2圖所示,蓋體100包含底板101以及圍繞底板101之側壁102、104、106及108。側壁102及104分別位於框體12或底板101的相對兩側,而側壁106及108分別位於框體12或底板101的另相對兩側。側壁102及104分別連接於側壁106及108之間。顯示模組14設置於框體12中。 As shown in FIG. 2, the cover 100 includes a bottom plate 101 and side walls 102, 104, 106, and 108 surrounding the bottom plate 101. The side walls 102 and 104 are respectively located on opposite sides of the frame 12 or the bottom plate 101, and the side walls 106 and 108 are respectively located on the opposite sides of the frame 12 or the bottom plate 101. Side walls 102 and 104 are connected between side walls 106 and 108, respectively. The display module 14 is disposed in the housing 12.
請參照第3A圖以及第3B圖。於一實施方式中,蓋體100具有開設於側壁102之組裝滑槽1020及1022(見第 3A圖)以及開設於側壁106之限位孔1060(見第3B圖)。蓋體100的組裝滑槽1020及1022位於框體12(見第2圖)的同一側。 Please refer to Figure 3A and Figure 3B. In one embodiment, the cover 100 has assembly chutes 1020 and 1022 that are formed in the side wall 102 (see 3A) and a limit hole 1060 opened in the side wall 106 (see FIG. 3B). The assembly chutes 1020 and 1022 of the cover 100 are located on the same side of the frame 12 (see Fig. 2).
於第3A圖中,蓋體100的側壁102具有遠離底板101之端面109。組裝滑槽1020具有開設於端面109之開口1020a、相對於開口1020a之底部1020c以及位於開口1020a與底部1020c之間的容置槽1020b。其中,容置槽1020b與開口1020a於底板101上的垂直投影係部分重疊的。亦即,組裝滑槽1020係自開口1020a朝底板101往外延伸。 In FIG. 3A, the side wall 102 of the cover 100 has an end surface 109 that is remote from the bottom plate 101. The assembly chute 1020 has an opening 1020a formed in the end surface 109, a bottom portion 1020c opposite to the opening 1020a, and a receiving groove 1020b between the opening 1020a and the bottom portion 1020c. The vertical projection system of the receiving groove 1020b and the opening 1020a on the bottom plate 101 partially overlaps. That is, the assembly chute 1020 extends outward from the opening 1020a toward the bottom plate 101.
於一實施方式中蓋體100的組裝滑槽1020更包含自底部1020c朝開口1020a突出的限位部1020d。 In one embodiment, the assembly chute 1020 of the cover 100 further includes a limiting portion 1020d protruding from the bottom portion 1020c toward the opening 1020a.
於一實施方式中,組裝滑槽1022具有開設於端面109之開口1022a、相對於開口1022a之底部1022c以及容置槽1022b。其中,容置槽1022b與開口1022a於底板101上的垂直投影係部分重疊的。亦即,組裝滑槽1022係自開口1022a朝底板101往外延伸。於一實施方式中,蓋體100的組裝滑槽1022與組裝滑槽1020大致相同。於另一實施方式中,組裝滑槽1022的底部1022c之間不具有朝開口1022a突出的限位部。 In one embodiment, the assembly chute 1022 has an opening 1022a formed in the end surface 109, a bottom portion 1022c opposite to the opening 1022a, and a receiving groove 1022b. The vertical projection of the receiving groove 1022b and the opening 1022a on the bottom plate 101 partially overlaps. That is, the assembly chute 1022 extends outwardly from the opening 1022a toward the bottom plate 101. In one embodiment, the assembly chute 1022 of the cover 100 is substantially identical to the assembly chute 1020. In another embodiment, the bottom portion 1022c of the assembly chute 1022 does not have a limit portion that protrudes toward the opening 1022a.
於一些實施方式中,蓋體100的側壁104(見第2圖)也可包含如第3A圖所示之組裝滑槽1020及1022。這些元件的結構、功能以及各元件之間的連接關係皆與第3A圖所示之組裝滑槽1020及1022大致相同,因此可參照前述相關 說明,在此不再贅述。於第3B圖中,限位孔1060具有朝向底板101的開口1060a。 In some embodiments, the side walls 104 of the cover 100 (see FIG. 2) may also include assembly chutes 1020 and 1022 as shown in FIG. 3A. The structure, function, and connection relationship between the components are substantially the same as those of the assembly chutes 1020 and 1022 shown in FIG. 3A. Therefore, reference may be made to the aforementioned correlation. Description, no longer repeat here. In FIG. 3B, the limiting hole 1060 has an opening 1060a facing the bottom plate 101.
請參照第4圖。第4圖繪示依據本揭露一實施方式之框體12以及顯示模組14的部分結構立體圖。於一實施方式中,框體12設置於如第2圖所示之底板101上,且框體12包含相連之定位壁121、123及125。框體12還包含突出部120、122及124。框體12的突出部120及122係位於定位壁121上對應側壁102之限位孔1060(見第3B圖)的位置。 Please refer to Figure 4. FIG. 4 is a perspective view showing a partial structure of the frame 12 and the display module 14 according to an embodiment of the present disclosure. In one embodiment, the frame 12 is disposed on the bottom plate 101 as shown in FIG. 2, and the frame 12 includes the adjacent positioning walls 121, 123, and 125. The frame 12 also includes protrusions 120, 122, and 124. The protruding portions 120 and 122 of the frame 12 are located at the position of the limiting hole 1060 (see FIG. 3B) of the corresponding sidewall 102 on the positioning wall 121.
於一些實施方式中,蓋體100的定位壁125也可包含如第4圖所示之突出部120及122。這些元件的結構、功能以及各元件之間的連接關係皆與如第4圖所示之突出部120及122大致相同,因此可參照前述相關說明,在此不再贅述。 In some embodiments, the positioning wall 125 of the cover 100 may also include protrusions 120 and 122 as shown in FIG. The structure and function of these components and the connection relationship between the components are substantially the same as those of the protruding portions 120 and 122 as shown in FIG. 4, and therefore, the related description will be referred to and will not be described herein.
於第4圖中,框體12的突出部124係位於定位壁123上對應側壁106之組裝滑槽1022(見第3A圖)的位置。於一實施方式中,框體12的突出部120、122及124係圓柱狀結構。 In Fig. 4, the protruding portion 124 of the frame 12 is located at the position of the assembly chute 1022 (see Fig. 3A) of the corresponding side wall 106 of the positioning wall 123. In one embodiment, the protrusions 120, 122, and 124 of the frame 12 are cylindrical structures.
請參照第5A圖以及第5B圖,於一實施方式中,框體12的突出部120卡合於蓋體100的組裝滑槽1020中,且被夾持於限位部1020d與容置槽1020b(見第5B圖)之間。藉此,蓋體100的組裝滑槽1020可達到卡合顯示模組14(見第5A圖)的效果。 Referring to FIG. 5A and FIG. 5B , in one embodiment, the protruding portion 120 of the frame 12 is engaged in the assembly sliding slot 1020 of the cover 100 and is clamped to the limiting portion 1020d and the receiving slot 1020b. (see Figure 5B). Thereby, the assembly chute 1020 of the cover 100 can achieve the effect of engaging the display module 14 (see FIG. 5A).
於第5B圖中,框體12的突出部120的外輪廓係部分接觸容置槽1020b的承靠面1020i,且突出部120的外 輪廓係部分與承靠面1020i的輪廓相符,但本案不以此為限。 In FIG. 5B, the outer contour of the protrusion 120 of the frame 12 partially contacts the bearing surface 1020i of the receiving groove 1020b, and the outer portion of the protruding portion 120 The contour portion corresponds to the contour of the bearing surface 1020i, but the present invention is not limited thereto.
請參照第6A圖以及第6B圖,於一實施方式中,框體12的突出部122位於蓋體100的組裝滑槽1022中,且擋止件16插設於組裝滑槽1022中,用以將框體12的突出部122卡合於組裝滑槽1022。於此實施方式中,框體12的突出部122的外輪廓係部分接觸組裝滑槽1022之容置槽1022b的承靠面1022i,且突出部122的外輪廓係部分與承靠面1022i的輪廓係相符,但本案不以此為限。 Referring to FIG. 6A and FIG. 6B , in one embodiment, the protruding portion 122 of the frame 12 is located in the assembly sliding slot 1022 of the cover 100 , and the blocking member 16 is inserted into the assembly sliding slot 1022 for The protruding portion 122 of the frame 12 is engaged with the assembly chute 1022. In this embodiment, the outer contour of the protruding portion 122 of the frame 12 contacts the bearing surface 1022i of the receiving groove 1022b of the assembly sliding groove 1022, and the outer contour portion of the protruding portion 122 and the contour of the bearing surface 1022i The system is consistent, but this case is not limited to this.
具體而言,擋止件16接觸組裝滑槽1022的底部1022c以及開口1022a的內緣,用以讓框體12的突出部122夾持於擋止件16與容置槽1022b之間(見第6B圖)。藉此,蓋體100的組裝滑槽1022可達到卡合顯示模組14(見第6A圖)的效果。 Specifically, the stopper 16 contacts the bottom portion 1022c of the assembly chute 1022 and the inner edge of the opening 1022a for clamping the protruding portion 122 of the frame 12 between the stopper 16 and the receiving groove 1022b (see the 6B)). Thereby, the assembly chute 1022 of the cover 100 can achieve the effect of engaging the display module 14 (see FIG. 6A).
請參照第7圖,於一實施方式中,框體12的突出部124突伸於側壁106的限位孔1060中。藉此,蓋體100的限位孔1060可限制框體12沿著側壁106延伸的方向D3移動,因而可隨之限制位於框體12中的顯示模組14沿著方向D3移動以達到固定顯示模組14的效果。於一實施方式中,方向D3實質上與方向D2垂直。 Referring to FIG. 7 , in an embodiment, the protruding portion 124 of the frame 12 protrudes from the limiting hole 1060 of the sidewall 106 . Therefore, the limiting hole 1060 of the cover body 100 can restrict the movement of the frame 12 along the direction D3 in which the side wall 106 extends, so that the display module 14 located in the frame 12 can be restricted to move along the direction D3 to achieve a fixed display. The effect of the module 14. In one embodiment, the direction D3 is substantially perpendicular to the direction D2.
第8圖至第11C圖分別繪示依據本案之一實施方式之電子裝置1中蓋體100與框體12於組裝過程中各階段的側視圖或局部放大圖。其中,第9B圖以及第9C圖分別為第9A圖所示之結構的局部結構放大圖,第10B圖以及第10C圖分別 為第10A圖所示之結構的局部結構放大圖。而第11B圖以及第11C圖分別為第11A圖所示之結構的局部結構放大圖。 8 to 11C are respectively side or partial enlarged views of the stages of the assembly of the cover 100 and the frame 12 in the electronic device 1 according to an embodiment of the present invention. 9B and 9C are respectively enlarged partial views of the structure shown in FIG. 9A, and FIG. 10B and FIG. 10C are respectively An enlarged view of a partial structure of the structure shown in Fig. 10A. 11B and 11C are respectively enlarged partial views of the structure shown in FIG. 11A.
應注意的是,此領域中具有通常知識者可瞭解到在第8圖至第11C圖的組裝過程進行之前、在第8圖至第11C圖的組裝過程進行中與在第8圖至第11C圖的組裝過程完成後可提供額外之元件的組裝。下文所述之一些組裝過程亦可被取代或移除,且這些組裝過程的步驟順序係可交換的。 It should be noted that those having ordinary skill in the art can understand that the assembly process of FIGS. 8 to 11C is performed before the assembly process of FIGS. 8 to 11C and the eighth to eleventh of FIG. Additional assembly of components can be provided after the assembly process of the drawing is completed. Some of the assembly processes described below may also be replaced or removed, and the order of the steps of these assembly processes may be interchanged.
於第8圖中,第一機體10的抵靠部18與框體12位於底板101的同一側,且自蓋體100的邊緣105朝遠離底板101突出。在將顯示模組14(見第4圖)組裝於蓋體100的過程中,首先將設置有顯示模組14之框體12朝向抵靠部18傾斜地抵靠,使得框體12的一端抵靠於抵靠部18,以達到定位的效果。 In FIG. 8 , the abutting portion 18 of the first body 10 and the frame 12 are located on the same side of the bottom plate 101 and protrude from the edge 105 of the cover 100 away from the bottom plate 101 . In the process of assembling the display module 14 (see FIG. 4) to the cover 100, the frame 12 provided with the display module 14 is first tilted against the abutting portion 18 so that one end of the frame 12 abuts. The abutting portion 18 is used to achieve the positioning effect.
接著,於第9A圖、第9B圖及第9C圖中,以框體12與抵靠部18相抵靠的部位做為支點,將框體12朝向蓋體100轉動並靠近蓋體100,直到設置於框體12上的突出部120接觸蓋體100之組裝滑槽1020的限位部1020d(見第9C圖)。此時,框體12上的突出部120及122分別位於蓋體100的組裝滑槽1020及1022中,且突出部122與組裝滑槽1022的底部1022c不接觸(見第9B圖)。 Next, in the 9A, 9B, and 9C, the portion where the frame 12 abuts against the abutting portion 18 serves as a fulcrum, and the frame 12 is rotated toward the cover 100 and close to the cover 100 until the setting The protruding portion 120 on the frame 12 contacts the limiting portion 1020d of the assembly chute 1020 of the cover 100 (see FIG. 9C). At this time, the protruding portions 120 and 122 on the frame 12 are respectively located in the assembly chutes 1020 and 1022 of the cover 100, and the protruding portion 122 does not contact the bottom portion 1022c of the assembly chute 1022 (see FIG. 9B).
接著,於第10A圖、第10B圖及第10C圖中,將框體12遠離抵靠部18並實質上沿著方向D2移動。此時,設置於框體12上的突出部120會自組裝滑槽1020之限位部 1020d的頂部滑入容置槽1020b,並且被夾持於限位部1020d與容置槽1020b之間(見第10C圖)。此時,框體12上的突出部122與組裝滑槽1022的底部1022c接觸(見第10B圖)。 Next, in FIGS. 10A, 10B, and 10C, the frame 12 is moved away from the abutting portion 18 and substantially moved in the direction D2. At this time, the protruding portion 120 disposed on the frame 12 will self-assemble the limiting portion of the sliding slot 1020. The top of the 1020d slides into the accommodating groove 1020b and is clamped between the limiting portion 1020d and the accommodating groove 1020b (see FIG. 10C). At this time, the protruding portion 122 on the frame 12 is in contact with the bottom portion 1022c of the assembly chute 1022 (see FIG. 10B).
同時,如第7圖所示之框體12的突出部124會突伸而插入如第7圖所示之側壁106的限位孔1060中。藉此,蓋體100的限位孔1060可限制框體12沿著側壁106的延伸方向D3移動,因而可隨之限制位於框體12中的顯示模組14沿著方向D3移動以達到固定顯示模組14的效果。 At the same time, the protruding portion 124 of the frame 12 as shown in Fig. 7 protrudes into the limiting hole 1060 of the side wall 106 as shown in Fig. 7. Therefore, the limiting hole 1060 of the cover 100 can restrict the movement of the frame 12 along the extending direction D3 of the side wall 106, thereby restricting the display module 14 located in the frame 12 from moving along the direction D3 to achieve a fixed display. The effect of the module 14.
於一實施方式中,由於組裝滑槽1022(見第10B圖)不具有如組裝滑槽1020(見第10C圖)所具有之於限位部1020d,因此若框體12上的突出部120、突出部122、蓋體100的組裝滑槽1020或1022存在結構配置上的公差時,則組裝滑槽1022之底部1022c上方的空間可提供結構上的緩衝,使得突出部122可部分落入底部1022c上方的空間。藉此,得電子裝置1不會因為製造的公差而使得框體12無法組裝至蓋體100。 In an embodiment, since the assembly chute 1022 (see FIG. 10B) does not have the limiting portion 1020d as in the assembly chute 1020 (see FIG. 10C), if the protruding portion 120 on the frame 12, When the protrusions 122, the assembly chute 1020 or 1022 of the cover 100 have structural tolerances, the space above the bottom 1022c of the assembly chute 1022 can provide structural cushioning such that the protrusions 122 can partially fall into the bottom 1022c. The space above. Thereby, the electronic device 1 does not cause the frame 12 to be assembled to the cover 100 due to manufacturing tolerances.
接著,於第11A圖、第11B圖及第11C圖中,將擋止件16(見第11B圖)插設於組裝滑槽1022中,以限制框體12的突出部122相對組裝滑槽1022移動。藉此,蓋體100的組裝滑槽1020及1022可達到卡合顯示模組14的效果。 Next, in FIGS. 11A, 11B, and 11C, the stopper 16 (see FIG. 11B) is inserted into the assembly chute 1022 to restrict the protruding portion 122 of the frame 12 from being assembled with the sliding groove 1022. mobile. Thereby, the assembly chutes 1020 and 1022 of the cover 100 can achieve the effect of engaging the display module 14.
由以上對於本揭露之具體實施方式之詳述,可以明顯地看出,蓋體的組裝滑槽可達到卡合顯示模組效果。由於本案的組裝滑槽具有不同的結構(亦即,組裝滑槽1022不 具有如組裝滑槽1020所具有之於限位部1020d),因此若框體上的突出部或蓋體的組裝滑槽存在結構配置上的公差時,則組裝滑槽可提供結構上的緩衝,使得電子裝置不會因為製造的公差而使得框體無法組裝至蓋體。 From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that the assembly chute of the cover can achieve the effect of the snap display module. Since the assembly chute of the present case has a different structure (that is, the assembly chute 1022 is not If the assembly chute 1020 has the limiting portion 1020d), the assembly chute can provide structural cushioning if the protruding portion of the frame or the assembly chute of the cover has structural tolerances. The electronic device is prevented from being assembled to the cover due to manufacturing tolerances.
前述多個實施方式的特徵可使本技術領域中具有通常知識者更佳地理解本揭露之各個態樣。本技術領域中具有通常知識者應可瞭解,為了達到相同之目的及/或本揭露之實施方式之相同優點,其可利用本揭露為基礎,進一步設計或修飾其他製程及結構。在本技術領域中具有通常知識者亦應瞭解,這樣的均等結構並未背離本揭露之精神及範圍,而在不背離本揭露之精神及範圍下,本技術領域中具有通常知識者可在此進行各種改變、替換及修正。 The features of the various embodiments described above will enable those of ordinary skill in the art to better understand the various aspects of the disclosure. It is to be understood by those of ordinary skill in the art that, in order to achieve the same objectives and/or the same advantages of the embodiments of the present disclosure, other processes and structures may be further designed or modified based on the disclosure. It is to be understood by those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the disclosure. Make various changes, replacements and corrections.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108200695U TWM577509U (en) | 2019-01-15 | 2019-01-15 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108200695U TWM577509U (en) | 2019-01-15 | 2019-01-15 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM577509U true TWM577509U (en) | 2019-05-01 |
Family
ID=67352950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108200695U TWM577509U (en) | 2019-01-15 | 2019-01-15 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM577509U (en) |
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2019
- 2019-01-15 TW TW108200695U patent/TWM577509U/en unknown
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