TWM573552U - Voice-controlled module for headset - Google Patents

Abstract

A sound control module for use in an earphone, which is electrically connected between the earphone and the electronic device for controlling the use function of the earphone, comprising: a long-shaped printed circuit board on which a control electronic circuit is disposed; A microelectromechanical (MEMS) microphone is soldered on the printed circuit board; and at least one micro-slip switch uses a micro-elastic material made of an alloy material as a button and utilizes surface mount technology (SMT) to At least one side of the micro-elastic piece is soldered on the printed circuit board, so that the micro-elastic piece is elastically displaced when pressed to touch a corresponding contact point provided on the printed circuit board to achieve a switching function; The sound control module achieves the requirements of thinning and miniaturization, and simplifies the process, reduces the production cost, and improves the use efficiency of the sound control module.

Description

Voice control module for headphones

The present invention relates to a voice control module for use in a headset, in particular to a micro-electromechanical (MEMS) microphone and at least one micro-slip switch on a long-shaped printed circuit board, and the micro-ellipse-type relationship utilizes a surface Adhesion technology (SMT) is soldered to the printed circuit board.

The sound control module for the earphones referred to in the present invention is electrically connected between an earphone (forming a body) and an electronic device (such as a mobile phone but not limited) for controlling the use function of the earphone, the voice control The structural configuration of the module is generally configured by combining a microphone and at least one button switch on a printed circuit board. However, in the case of a conventional microphone or push button switch, the volume itself is relatively large, so that when a conventional microphone or push button switch is arranged to be disposed on a printed circuit board, it is disadvantageous to the voice control module. Thinning or miniaturization requirements; in addition, the conventional push button switch is not only costly, but also limited by the structure of the push button switch, and cannot be produced by the surface mount technology (SMT) method, that is, it cannot be widely used. The surface mount technology (SMT) method or the related machine is used to solder and fix the conventional push button switch on the printed circuit board, so the process is relatively complicated, and the manufacturing cost is further increased, which is disadvantageous to the amount of the sound control module. Production.

Therefore, the conventional voice control module for earphones has the following disadvantages in component structure, process or practical application: First, since the assembled conventional microphone increases the total thickness of the voice control module, the voice control module is relatively caused. The thickness of the group is large, and the demand for thinning and miniaturization cannot be achieved, which is not conducive to the cooperation between the voice control module and the earphone; secondly, the conventional button switch has high cost and cannot utilize the surface adhesion technology (SMT) The method of production is unfavorable for mass production and application of the voice control module. Therefore, in view of the shortcomings of the conventional voice control module, the new type of person in this case has researched and improved and proposed an effective solution.

The main purpose of the present invention is to provide a voice control module for use in a headset, which is provided with a MEMS (Micro-Electrical Mechanical System) microphone and at least one micro-slip switch on a long chip printed circuit board, and The micro-ellipse-type open relationship is soldered on the printed circuit board by using Surface Mount Technology (SMT); thereby, the sound control module can be thinned and miniaturized, and the process can be simplified and the manufacturing cost can be reduced. And improve the efficiency of the use of the voice control module.

In order to achieve the above object, a preferred embodiment of the voice control module 1 for use in the present invention is electrically connected between an earphone and an electronic device for controlling the use function of the earphone, and includes: a long printed circuit board (PCB) having an electronic circuit for controlling the function of the earphone; a microelectromechanical (MEMS) microphone soldered to the printed circuit board; and at least one micro-slip switch The utility model utilizes a micro-elastic piece made of an alloy material as a switch button, and uses surface adhesion technology (SMT) to produce, so that at least one side of the micro-elastic piece is soldered on the printed circuit board, so that the The micro-elastic piece is elastically displaced when it is pressed to touch a corresponding contact point provided on the printed circuit board to achieve the switching action of the micro-slip switch; wherein, when used, the user has to press the at least one micro The shrapnel switch controls the function of the earphone through the electronic circuitry of the printed circuit board.

In an embodiment of the present invention, the miniature shrapnel of the micro-slip switch is soldered to the printed circuit board by one-side welding or two-sided soldering.

In an embodiment of the present invention, the micro-elastic is soldered to the printed circuit board by one-side soldering, wherein one side of the micro-elastic is soldered by solder paste (solder) in surface mount technology (SMT). Forming a fixed edge on the printed circuit board, and forming a movable edge on the opposite side of the unwelded side, so that the micro-elastic piece is biased downward by the elastic displacement of the movable edge when being pressed, in the printed circuit Corresponding contact points on the board.

In an embodiment of the present invention, the miniature shrapnel of the micro-slip switch is soldered to the printed circuit board by bilateral soldering, wherein the two sides of the micro-elastic are solder paste in surface mount technology (SMT) ( Soldering on the printed circuit board to form two fixed sides, and forming a movable end between the two side edges, so that the micro-elastic piece can be borrowed from the central area (active end) when pressed The elastic displacement is to actuate the corresponding contact point provided on the printed circuit board.

In an embodiment of the present invention, the function of using the earphone comprises a group selected from the group consisting of: a headphone switch, a MEMS microphone sound size, a selected song, or a combination of any two or more thereof, wherein The various functions of the earphones are achieved by respectively providing a micro-slip switch on the printed circuit board.

In an embodiment of the present invention, the voice control module is further combined with the earphone to form a body of the earphone unit, and the earphone unit includes a wired earphone type and a wireless earphone type.

In an embodiment of the present invention, the microelectromechanical (MEMS) microphone is a shaped body having a length of 2.4 mm, a width of 1.6 mm, and a small thickness of 1.49 mm.

In an embodiment of the present invention, the printed circuit board (PCB) is a printed circuit board (PCB) having a length of 30 mm and a width of 1.8 mm.

In an embodiment of the present invention, when the microelectromechanical (MEMS) microphone is assembled on the printed circuit board, the total thickness of the voice control module is 1.49 mm.

The structure and technical features of the present creation are described in detail with reference to the drawings. The illustrations are only used to illustrate the structural relationship and related functions of the creation. Therefore, the dimensions of the components are not set according to the actual scale and are not used to limit This creation.

Referring to Figures 1 and 2, respectively, it is a side view of the first embodiment of the voice control module 10 of the present invention (the micro-elastic is a single-sided welding method) and the second embodiment (the micro-spring is a bilateral welding method). The voice control module 1 of the present invention is electrically connected between an earphone 2 and an electronic device 3. As shown in FIG. 1, one end of the voice control module 10 is electrically connected to a earphone 2 The other end is electrically connected to an electronic device 3 but is not used to limit the creation. The user can use the operation of the voice control module 10 to control the function of the earphone 2, such as the switch of the earphone 2 (ie, Turn headphones on or off, adjust the sound size, or skip songs. The voice control module 1 mainly comprises a long printed circuit board (PCB) 10, a micro electromechanical (MEMS) microphone 20, and at least one microspring switch 30.

In actual production, the voice control module 1 is further combined with the earphone 2 to form an earphone unit 4, so that the earphone unit 4 forms a shape for the user to hang on the ear; in addition, the earphone unit 4 includes A wired earphone type or a wireless earphone type, that is, the earphone unit 4 and the electronic device 3 can be connected by wire or wirelessly, and the wired type or the wireless type can be connected to the existing electronic The technology is achieved, so the detailed structure thereof will not be described here.

The long-length printed circuit board (PCB) 10 is a printed circuit board (PCB) structure on which an electronic circuit 11 is disposed; wherein the structure of the long-shaped printed circuit board 10 (or the electronic circuit 11) Without limitation, a single-layer printed circuit board (PCB) may be provided with only one outer wiring layer 101 (but without or including any other inner wiring layer 102) as shown in FIG. 3, or a multilayer. As shown in FIG. 3, a printed circuit board (PCB) is provided with other wiring layers such as the inner wiring layer 102 in addition to the outer wiring layer 101, but is not intended to limit the creation. Since the design and fabrication of the line layout of the long-length printed circuit board (PCB) 10 (or the electronic circuit 11) can be achieved by the existing electronic technology, the detailed structure thereof will not be described herein.

The microelectromechanical (MEMS) microphone 20 is soldered to the printed circuit board 10. Here, it is particularly emphasized that the microelectromechanical (MEMS) microphone 20 is fabricated by a microelectromechanical molding method, so it is called a microelectromechanical (MEMS) microphone 20. . Since the design and fabrication of the MEMS microphone 20 can be achieved by the existing micro-electromechanical system (MEMS) fabrication technology, and the MEMS micro-electromechanical system structure of the MEMS microphone 20 is not the focus of the present invention, This will not be repeated here.

The at least one micro-slip switch 30 includes one or two or more micro-slip switches 30 as needed for the function, as shown in FIGS. 1 and 2, respectively, on the long-shaped printed circuit board 10 There are three miniature shrapnel switches 30 but are not intended to limit the creation. Each of the micro-slip switches 30 uses a micro-elastic piece 31 made of a metal material as a pressing switch body instead of a conventional push button switch which is relatively expensive to manufacture. Thereby, the surface mount technology (SMT, Surface Mount Technology) can be used for production, that is, the micro-elastic piece 31 is placed in the SMT carrier tape, and then the SMT mounter (SMT Mounter) is used for the production. In operation, the existing surface mount technology (SMT) device can be utilized to assemble the micro-elastic piece 31 on the printed circuit board 10. In addition, in order to meet the surface adhesion technology (SMT) process requirements, the micro-elastic piece 31 is selected from a copper alloy material that can be directly soldered, so that the micro-elastic piece 31 can be soldered by a surface bonding technology (SMT). 40 (solder) and solder assembly are shown on the printed circuit board 10 as shown in Figs. 3 and 4, thereby reducing the trouble of the surface of the micro-elastic piece 31 to be additionally subjected to an electroplating process (for soldering). In addition, the miniature shrapnel 31 used in the present invention is relatively easy to miniaturize, such as controlled in the range of 0.5-2.0 mm, or increased to 5 mm as needed, but is not intended to limit the creation.

At the time of assembly, at least one side 32 of the micro-elastic piece 31 is soldered to the printed circuit board 10 as shown in FIGS. 1 and 3, so that when the micro-elastic piece 31 is pressed, as shown by the arrow A in FIG. As shown by the arrow B in FIG. 4, the micro-elastic piece 31 is elastically displaced for downwardly touching a corresponding contact point 12 preset on the printed circuit board 10, thereby achieving the micro-slip switch 30. Switch action. When the pressing force (as indicated by the arrow A in FIG. 3) is released, the micro-elastic piece 31 is elastically restored to the original state for the next pressing operation; that is, when used, the user has to press each micro-elastic piece. The micro-elastic piece 31 of the switch 30 controls the use function of the earphone 2 (or the earphone unit 4).

In addition, the miniature shrapnel 31 of the micro-slip switch 30 utilizes surface adhesion technology (SMT) and is unilaterally welded (as shown in Figures 1 and 3) or welded on both sides (as shown in Figures 2 and 4). Soldering on the printed circuit board 10.

Referring to FIGS. 1 and 3, when the micro-elastic piece 31 is soldered to the printed circuit board 10 by one-side soldering, one side 32 of the micro-elastic piece 31 is soldered to the printed circuit board 10 to form a fixed edge. (32), and the opposite side 33 of the unwelded side forms a movable edge (33), so that when the micro-elastic piece 31 is pressed, as shown by the arrow A in FIG. 3, the side of the elastically movable side is obtained. The elastic displacement of 33 is directed to a corresponding contact point 12 that is pre-set on the printed circuit board 10.

Referring to FIGS. 2 and 4, when the micro-elastic piece 31 of the micro-slip switch 30 is soldered to the printed circuit board 10 by bilateral welding, the two side edges 34 of the micro-elastic piece 31 are soldered to the printed circuit board 10. Forming two fixed sides (34), and forming a movable end (35) between the central portions 35 between the two side edges 34, such that when the micro-elastic piece 31 is pressed, as indicated by an arrow B in FIG. The elastic displacement of the elastically movable central portion 35 is utilized to actuate a corresponding contact point 12 previously disposed on the printed circuit board 10.

In addition, the function of using the earphone 2 includes a group selected from the group consisting of: a headphone switch, adjusting a sound level of the MEMS microphone 20, selecting one of the songs, or a combination of any two or more thereof, wherein the earphone 2 has various items. The function is achieved by providing a micro-slip switch 30 on the printed circuit board 10, respectively.

Referring to Figures 5 and 6, in an embodiment of the present invention, the MEMS microphone 20 is a body having a length of 2.4 mm, a width of 1.6 mm, and a small thickness of 1.49 mm; the printed circuit board 10 is a length of 30 mm, A printed circuit board (PCB) having a width of 1.8 mm has a shape; wherein when the MEMS microphone 20 is assembled on the printed circuit board 10, the voice control module 1 is combined to form a length of 30 mm, a width of 1.8 mm, and a total thickness of 1.49. The shape of mm.

The above description is only a preferred embodiment of the present invention, and is intended to be illustrative only and not limiting; those of ordinary skill in the art understand that within the spirit and scope defined by the present inventive claims Many changes, modifications, and even equivalent changes are made, but they fall within the scope of this creation.

1‧‧‧Sound Control Module

2‧‧‧ headphones

3‧‧‧Electronic devices

4‧‧‧ headphone unit

10‧‧‧Long chip board

11‧‧‧Electronic circuits

12‧‧‧Contact points

20‧‧‧Micro-electromechanical microphone

30‧‧‧Micro-slip switch

31‧‧‧ miniature shrapnel

32‧‧‧ side

33‧‧‧ side

34‧‧‧ side

35‧‧‧Central District

40‧‧‧ solder paste

Fig. 1 is a side elevational view showing the first embodiment of the sound control module of the present invention (the micro-elastic is a one-side welding method). Fig. 2 is a side view showing the second embodiment of the voice control module of the present invention (the micro-elastic is a bilateral welding method). Fig. 3 is a side elevational cross-sectional view showing the miniature shrapnel of the micro-slip switch in Fig. 1 welded to the printed circuit board by one-side welding. Fig. 4 is a side elevational cross-sectional view showing the micro-elastic piece of the micro-slip switch in the second figure welded to the printed circuit board by bilateral welding. Figure 5 is a side elevational view of an embodiment of the voice control module of the present invention (and indicates an implementation size for reference). Figure 6 is a front elevational view of the embodiment shown in Figure 5 (and indicating an implementation size for reference).

Claims (10)

A sound control module for use in an earphone is electrically connected between an earphone and an electronic device for controlling the use function of the earphone, and comprises: a long piece printed circuit board on which a control electronic device is disposed a microelectromechanical microphone soldered to the printed circuit board; and at least one micro-elliptical switch, wherein each of the micro-ellipse-type switches utilizes a micro-elastic piece made of an alloy material as a key for pressing and utilizing Surface mount technology (SMT) to solder at least one side of the micro-elastic to the printed circuit board, such that the micro-elastic is elastically displaced when pressed to contact a predetermined contact on the printed circuit board Pointing to achieve the switching function of the micro-slip switch; wherein, when in use, the user has to press the at least one micro-slip switch to control the use function of the earphone through the printed circuit board. The voice control module for use in the earphone according to claim 1, wherein the miniature spring piece of the micro-slip switch is made of a copper alloy material. The voice control module for use in the earphone according to claim 1, wherein the micro-elastic of the micro-slip switch is soldered on the printed circuit board by one-side welding or bilateral welding. The voice control module for use in a headset according to claim 3, wherein when the micro-elastic is soldered to the printed circuit board by one-side soldering, one side of the micro-elastic is soldered on the printed circuit board. Forming a fixed edge, and forming a movable edge on the opposite side of the unwelded side, so that the micro-elastic piece is pressed by the elastic displacement of the movable edge to be pressed downward to be preset on the printed circuit board. Corresponding to the contact point. The voice control module for use in a headset according to claim 3, wherein when the micro-elastic of the micro-slip switch is soldered to the printed circuit board by bilateral welding, the two sides of the micro-elastic are soldered to the Forming two fixed sides on the printed circuit board, and forming a movable end between the two side edges, so that the micro-elastic piece can be depressed by the elastic displacement of the movable end when pressed Corresponding contact points on the printed circuit board. The voice control module for use in a headset according to claim 1, wherein the function of the earphone comprises a group selected from the group consisting of: a headphone switch, adjusting a MEMS microphone sound size, selecting one of the songs, or any two or two of A combination of the above, and wherein each of the functions of the earphones is provided by respectively providing a micro-slip switch on the printed circuit board. The voice control module of the present invention, wherein the voice control module is further combined with the earphone to form an earphone unit, so that the earphone unit forms a shape for the user to use on the ear, wherein the The headset unit must include a wired headset type or a wireless headset type. The voice control module for use in a headset according to claim 1, wherein the MEMS microphone is a body having a length of 2.4 mm, a width of 1.6 mm, and a thickness of less than 1.49 mm. The voice control module for use in a headset according to claim 1, wherein the printed circuit board is a printed circuit board (PCB) having a length of 30 mm and a width of 1.8 mm. The voice control module for use in a headset according to claim 1, wherein when the MEMS microphone is assembled on the printed circuit board, the voice control module is a body having a length of 30 mm, a width of 1.8 mm, and a thickness of 1.49 mm.