TWM573107U - Electronic device - Google Patents

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Publication number
TWM573107U
TWM573107U TW107211173U TW107211173U TWM573107U TW M573107 U TWM573107 U TW M573107U TW 107211173 U TW107211173 U TW 107211173U TW 107211173 U TW107211173 U TW 107211173U TW M573107 U TWM573107 U TW M573107U
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TW
Taiwan
Prior art keywords
electronic device
opening
waterproof structure
bottom plate
housing
Prior art date
Application number
TW107211173U
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Chinese (zh)
Inventor
陳垂鴻
鄭佳旻
楊清淵
鐘政涵
Original Assignee
華碩電腦股份有限公司
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Priority to TW107211173U priority Critical patent/TWM573107U/en
Publication of TWM573107U publication Critical patent/TWM573107U/en

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Abstract

An electronic device includes a housing, a waterproof structure, a functional module, and a driving element. The housing has an inner surface and an opening connected to each other. The waterproof structure has a first end surface, a second end surface and a sidewall connecting the first and second end surfaces. The first end surface hermetically abuts against the inner surface. The functional module is disposed in the waterproof structure. The driving element is located in the housing and configured to drive the functional module to move toward or away from the opening.

Description

電子裝置 Electronic device

本揭露是有關於一種電子裝置。 The disclosure relates to an electronic device.

現今手機產業朝向防水功能發展,其中在防水功能與伸縮相機結合之設計方面,大多是於相機模組的伸縮開口處設置防水圈。然而相機與防水圈之間的磨擦與組裝問題導致防水可靠度難以提升。 Nowadays, the mobile phone industry is developing towards waterproof function. Among them, in the design of waterproof function combined with telescopic camera, most of them are provided with waterproof ring at the telescopic opening of the camera module. However, the friction and assembly problems between the camera and the waterproof ring make it difficult to improve the waterproof reliability.

本揭露之一技術態樣為一種電子裝置。電子裝置包含殼體、防水結構、功能模組以及驅動件。殼體具有相連的內表面以及開口。防水結構具有第一端面、第二端面以及連接第一端面與第二端面之側壁。第一端面密封地與內表面抵接。功能模組設置於防水結構中。驅動件位於殼體內,並配置以帶動功能模組朝向以及遠離開口移動。 One aspect of the present disclosure is an electronic device. The electronic device includes a housing, a waterproof structure, a functional module, and a driving member. The housing has an associated inner surface and an opening. The waterproof structure has a first end surface, a second end surface, and side walls connecting the first end surface and the second end surface. The first end face sealingly abuts against the inner surface. The function module is arranged in the waterproof structure. The driving member is located in the housing and configured to move the functional module toward and away from the opening.

於本揭露上述實施例中,防水結構可形成自殼體的開口往殼體內部延伸出的一容置空間,且能夠使功能模組與電子裝置內部的其他元件完全隔離。如此一 來,水可經由開口進出此容置空間內,存在於防水結構與功能模組之間的空隙,但不會流出防水結構進入殼體內而接觸電子裝置的其他電子元件。 In the above embodiment, the waterproof structure can form an accommodating space extending from the opening of the housing to the inside of the housing, and can completely isolate the functional module from other components inside the electronic device. Such a The water can enter and exit the accommodating space through the opening, and exists in the gap between the waterproof structure and the functional module, but does not flow out of the waterproof structure into the housing to contact other electronic components of the electronic device.

100、200、300‧‧‧電子裝置 100, 200, 300‧‧‧ electronic devices

110、210、310‧‧‧殼體 110, 210, 310‧‧‧ housing

112、212、312‧‧‧開口 112, 212, 312‧‧

114、214、314‧‧‧內表面 114, 214, 314‧‧‧ inner surface

120、220、320‧‧‧防水結構 120, 220, 320‧ ‧ waterproof structure

122、222、322‧‧‧第一端面 122, 222, 322‧‧‧ first end face

124、224‧‧‧第二端面 124, 224‧‧‧ second end face

1242、2242‧‧‧端面開口 1242, 2242‧‧‧ end opening

126、226‧‧‧側壁 126, 226‧‧‧ side walls

128、228‧‧‧摺疊部 128, 228‧‧ ‧ folding department

130、230‧‧‧功能模組 130, 230‧‧‧ functional modules

140、240‧‧‧驅動件 140, 240‧‧‧ drive parts

150‧‧‧底板 150‧‧‧floor

152‧‧‧底板開口 152‧‧‧ bottom plate opening

160、260‧‧‧線材 160, 260‧‧‧ wire

170、270‧‧‧封膠 170, 270‧‧‧ Sealing

180‧‧‧固定件 180‧‧‧Fixed parts

182‧‧‧螺孔 182‧‧‧ screw hole

142、242‧‧‧帶動結構 142, 242‧‧‧ Driven structure

250‧‧‧黏著層 250‧‧‧Adhesive layer

316‧‧‧凹陷區域 316‧‧‧ recessed area

320A‧‧‧本體部 320A‧‧‧ Body Department

320B‧‧‧延伸部 320B‧‧‧Extension

P1‧‧‧第一位置 P1‧‧‧ first position

P2‧‧‧第二位置 P2‧‧‧ second position

W1‧‧‧第一寬度 W1‧‧‧ first width

W2‧‧‧第二寬度 W2‧‧‧ second width

R‧‧‧軸線方向 R‧‧‧ axis direction

3A-3A‧‧‧線段 3A-3A‧‧ ‧ line segment

第1A圖為繪示根據本揭露一實施例之電子裝置的立體圖,其中功能模組位於電子裝置的殼體內。 FIG. 1A is a perspective view of an electronic device according to an embodiment of the present disclosure, wherein the functional module is located in a housing of the electronic device.

第1B圖為繪示第1A圖中之電子裝置的另一立體圖,其中功能模組伸出電子裝置的殼體外。 FIG. 1B is another perspective view of the electronic device in FIG. 1A, wherein the functional module protrudes out of the housing of the electronic device.

第2圖為繪示第1A圖中之電子裝置去除部分殼體後的立體圖。 FIG. 2 is a perspective view showing the electronic device in FIG. 1A with a part of the housing removed.

第3A圖為繪示第2圖中之電子裝置沿著線段3A-3A的剖面圖。 Figure 3A is a cross-sectional view of the electronic device of Figure 2 taken along line 3A-3A.

第3B圖為繪示當第3A圖中之結構的另一剖面圖,其中功能模組伸出電子裝置的殼體外。 Figure 3B is another cross-sectional view showing the structure of Figure 3A with the functional module extending out of the housing of the electronic device.

第3C圖為第2圖中之部分結構的立體圖,其中底板與防水結構分離。 Fig. 3C is a perspective view of a portion of the structure in Fig. 2, in which the bottom plate is separated from the waterproof structure.

第4A圖為繪示根據本揭露另一實施例之電子裝置去除部分殼體後的剖面圖。 FIG. 4A is a cross-sectional view showing the electronic device with a portion of the housing removed according to another embodiment of the present disclosure.

第4B圖為第4A圖中之防水結構的立體圖。 Fig. 4B is a perspective view of the waterproof structure in Fig. 4A.

第4C圖為繪示第4A圖中之框線E中的放大圖。 Fig. 4C is an enlarged view showing a frame line E in Fig. 4A.

第5A圖為繪示根據本揭露另一實施例之電子裝置去除部分殼體後的剖面圖。 FIG. 5A is a cross-sectional view showing the electronic device with a portion of the housing removed according to another embodiment of the present disclosure.

第5B圖為第5A圖中之部分結構的立體圖。 Fig. 5B is a perspective view showing a part of the structure in Fig. 5A.

以下將以圖式揭露本揭露之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。且為了清楚起見,圖式中之層和區域的厚度可能被誇大,並且在圖式的描述中相同的元件符號表示相同的元件。 The embodiments of the present disclosure are disclosed in the following drawings, and for the sake of clarity, the details of the invention will be described in the following description. However, it should be understood that these practical details are not intended to limit the disclosure. That is, in some embodiments of the disclosure, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings. The thickness of layers and regions in the drawings may be exaggerated for clarity and the same elements in the description of the drawings represent the same elements.

第1A圖為繪示根據本揭露一實施例之電子裝置100的立體圖,其中功能模組130位於電子裝置100的殼體110內。第1B圖為繪示第1A圖中之電子裝置100的另一立體圖,其中功能模組130伸出電子裝置100殼體110外。電子裝置100包含功能模組130以及殼體110,且殼體110包含開口112。功能模組130可以是相機模組或是閃光燈模組。功能模組130可於開口112的位置伸縮。如第1A圖所示,當功能模組130被收起時,功能模組130位於殼體110內,且功能模組130的大部分體積位在殼體110內部。如第1B圖所示,當功能模組130被推出時,功能模組130大部分體積位在殼體110之外。 FIG. 1A is a perspective view of an electronic device 100 according to an embodiment of the present disclosure, wherein the function module 130 is located in the housing 110 of the electronic device 100. FIG. 1B is another perspective view of the electronic device 100 in FIG. 1A , wherein the functional module 130 extends out of the housing 110 of the electronic device 100 . The electronic device 100 includes a functional module 130 and a housing 110 , and the housing 110 includes an opening 112 . The function module 130 can be a camera module or a flash module. The functional module 130 can be expanded and contracted at the position of the opening 112. As shown in FIG. 1A, when the function module 130 is stowed, the function module 130 is located in the housing 110, and most of the volume of the function module 130 is inside the housing 110. As shown in FIG. 1B, when the function module 130 is pushed out, the function module 130 is mostly outside the housing 110.

第2圖為繪示第1A圖中之電子裝置100去除 部分殼體110後的正視圖。第3A圖為繪示第2圖中之電子裝置100於線段3A-3A處的剖面圖。第3B圖為繪示當第3A圖中之功能模組130伸出電子裝置100殼體110外的剖面圖。 Figure 2 is a diagram showing the removal of the electronic device 100 in Figure 1A. A front view of a portion of the housing 110. FIG. 3A is a cross-sectional view showing the electronic device 100 in FIG. 2 at a line segment 3A-3A. FIG. 3B is a cross-sectional view showing the function module 130 of FIG. 3A extending out of the housing 110 of the electronic device 100.

請同時參照第2圖、第3A圖及第3B圖。電子裝置100還包含殼體110、防水結構120、驅動件140、底板150。殼體110具有相連的開口112以及內表面114。功能模組130設置於底板150上,而防水結構120環繞功能模組130。於本實施例中,功能模組130透過螺絲與底板150固定,但其並非用以限制本揭露。 Please refer to Figure 2, Figure 3A and Figure 3B at the same time. The electronic device 100 further includes a housing 110, a waterproof structure 120, a driving member 140, and a bottom plate 150. The housing 110 has an associated opening 112 and an inner surface 114. The function module 130 is disposed on the bottom plate 150, and the waterproof structure 120 surrounds the function module 130. In this embodiment, the function module 130 is fixed to the bottom plate 150 by screws, but it is not intended to limit the disclosure.

第3C圖為第2圖中之部分結構的立體圖,其中底板150與防水結構120分離。請同時參照第3A圖、第3B圖及第3C圖。防水結構120具有第一端面122、第二端面124以及連接第一端面122與第二端面124之側壁126。防水結構120的第一端面122與殼體110之內表面114密封地抵接,第二端面124與底板150密封地抵接。第二端面124具有端面開口1242。底板150具有底板開口152。底板開口152與端面開口1242對應設置且連通。側壁126包圍出的空間與殼體110之開口112連通。也就是說,功能模組130位在由開口112與防水結構120之側壁126共同形成的連通空間內。除此之外,功能模組130與防水結構120之內壁無接觸,形成環繞功能模組130外圍之空隙。 3C is a perspective view of a portion of the structure in FIG. 2, in which the bottom plate 150 is separated from the waterproof structure 120. Please refer to the 3A, 3B and 3C drawings at the same time. The waterproof structure 120 has a first end surface 122, a second end surface 124, and side walls 126 connecting the first end surface 122 and the second end surface 124. The first end surface 122 of the waterproof structure 120 sealingly abuts against the inner surface 114 of the housing 110, and the second end surface 124 sealingly abuts the bottom plate 150. The second end surface 124 has an end opening 1242. The bottom plate 150 has a bottom plate opening 152. The bottom plate opening 152 is disposed and communicated with the end surface opening 1242. The space enclosed by the side wall 126 is in communication with the opening 112 of the housing 110. That is to say, the function module 130 is located in the communication space formed by the opening 112 and the side wall 126 of the waterproof structure 120. In addition, the function module 130 has no contact with the inner wall of the waterproof structure 120, and forms a gap around the periphery of the function module 130.

電子裝置100還包含線材160以及封膠170。線材160穿過底板150之底板開口152以及第二端面124之端 面開口1242以連接功能模組130。封膠170填補於線材160及底板150之底板開口152間之空隙以使底板150得以密封防水結構120之第二端面124。 The electronic device 100 also includes a wire 160 and a sealant 170. The wire 160 passes through the bottom plate opening 152 of the bottom plate 150 and the end of the second end surface 124 The face opening 1242 is connected to the function module 130. The sealant 170 fills the gap between the wire 160 and the bottom plate opening 152 of the bottom plate 150 to allow the bottom plate 150 to seal the second end face 124 of the waterproof structure 120.

在本實施例中,防水結構120可為具有較強回彈力且防水的材料。當上述之材料受外力擠壓時產生形變,其回彈力使材料與物體間的接觸介面緊密擠壓而達到密封效果。而當外力降低或去除後,材料的形變可迅速恢復回原狀。因此,在功能模組130設置於底板150,且防水結構120套設於功能模組130外的情況之下,由底板150往開口112之方向預先施加一壓力,即可利用防水結構120受擠壓後的回彈力而使得其第一端面122與殼體110的內表面114之間緊密抵接而密封,並使得其第二端面124與底板150緊密抵接而密封。於本實施例中,防水結構120可由矽膠所製成,但其並非用以限制本揭露。 In the embodiment, the waterproof structure 120 may be a material having strong resilience and being waterproof. When the above material is pressed by an external force, deformation occurs, and the resilience force causes the contact interface between the material and the object to be tightly pressed to achieve a sealing effect. When the external force is reduced or removed, the deformation of the material can be quickly restored back to its original state. Therefore, when the functional module 130 is disposed on the bottom plate 150 and the waterproof structure 120 is sleeved outside the functional module 130, a pressure is applied from the bottom plate 150 to the opening 112 to be squeezed by the waterproof structure 120. The resilience of the pressing causes the first end surface 122 to tightly abut against the inner surface 114 of the housing 110 to seal, and the second end surface 124 thereof is tightly abutted against the bottom plate 150 to seal. In the present embodiment, the waterproof structure 120 can be made of silicone, but it is not intended to limit the disclosure.

由此可知,防水結構120、開口112以及底板150可共同形成自開口112往殼體110內部延伸出的一容置空間,且能夠使功能模組130與電子裝置100內部的其他元件完全隔離。如此一來,水可經由開口112進出此容置空間內,存在於防水結構120與功能模組130之間的空隙,但不會流出防水結構120進入殼體110內而接觸電子裝置100的其他電子元件。 It can be seen that the waterproof structure 120, the opening 112 and the bottom plate 150 can form an accommodating space extending from the opening 112 to the inside of the housing 110, and can completely isolate the functional module 130 from other components inside the electronic device 100. In this way, water can enter and exit the accommodating space through the opening 112, and exists in the gap between the waterproof structure 120 and the functional module 130, but does not flow out of the waterproof structure 120 into the housing 110 to contact the electronic device 100. Electronic component.

電子裝置100還包含固定件180,固定件180可直接或間接地與驅動件140以及功能模組130銜接,並使驅動件140以及功能模組130固定於殼體110內部。於本 實施例中,固定件180包含螺孔182,可透過螺絲將固定件180固定於殼體110,但其並非用以限制本揭露。固定件180靠近殼體110的開口112以及內表面114,並環繞防水結構120之一部分,可輔助限位防水結構120於鄰近第一端面122之區域,並維持防水結構120與內表面114間的密封性。 The electronic device 100 further includes a fixing member 180. The fixing member 180 can directly or indirectly engage with the driving member 140 and the functional module 130, and fix the driving member 140 and the functional module 130 to the inside of the housing 110. Yu Ben In the embodiment, the fixing member 180 includes a screw hole 182, and the fixing member 180 can be fixed to the housing 110 through a screw, but it is not intended to limit the disclosure. The fixing member 180 is adjacent to the opening 112 and the inner surface 114 of the housing 110 and surrounds a portion of the waterproof structure 120 to assist the limiting waterproof structure 120 in the region adjacent to the first end surface 122 and maintain the waterproof structure 120 and the inner surface 114. Sealing.

於本實施例中,電子裝置100還具有一帶動結構142,其一端連接驅動件140,其另一端連接底板150。於本實施例中,帶動結構142是自底板150延伸的一部分。於其他實施例中,帶動結構142可以是額外的結構,並與驅動件140及底板150銜接。電子裝置100之驅動件140設置於殼體110內,並配置以透過帶動結構142而帶動底板150及功能模組130沿著軸線方向R遠離開口112移動至第一位置P1(如第3A圖所示),此時功能模組130整體位在開口112及防水結構120之側壁126內。驅動件140還配置以透過帶動結構142而帶動底板150及功能模組130沿著軸線方向R朝向開口112移動至第二位置P2(如第3B圖所示),此時大部分的功能模組130位在殼體110外。此外,當底板150由第一位置P1移動至第二位置P2之過程中,由於底板150往內表面114靠近,使得防水結構120沿軸線方向R上被壓縮。 In the embodiment, the electronic device 100 further has a driving structure 142, one end of which is connected to the driving member 140, and the other end of which is connected to the bottom plate 150. In the present embodiment, the driving structure 142 is a part extending from the bottom plate 150. In other embodiments, the driving structure 142 may be an additional structure and interface with the driving member 140 and the bottom plate 150. The driving device 140 of the electronic device 100 is disposed in the housing 110 and configured to move the bottom plate 150 and the function module 130 away from the opening 112 in the axial direction R to the first position P1 through the driving structure 142 (as shown in FIG. 3A). The function module 130 is entirely positioned in the opening 112 and the sidewall 126 of the waterproof structure 120. The driving member 140 is further configured to drive the bottom plate 150 and the function module 130 to move along the axial direction R toward the opening 112 to the second position P2 (as shown in FIG. 3B ). The 130 position is outside the housing 110. Further, during the movement of the bottom plate 150 from the first position P1 to the second position P2, since the bottom plate 150 approaches the inner surface 114, the waterproof structure 120 is compressed in the axial direction R.

具體來說,電子裝置100之防水結構120之側壁126具有複數個摺疊部128。摺疊部128由第一端面122依序連接至第二端面124。當驅動件140帶動底板150沿著 軸線方向R遠離開口112移動至第一位置P1時,此些摺疊部128彼此遠離展開,且防水結構120在垂直於軸線方向R的方向上具有第一寬度W1。當驅動件140帶動底板150沿著軸線方向R朝向開口112移動至第二位置P2時,此些摺疊部128彼此靠近堆疊,且防水結構120在垂直於軸線方向R的方向上具有第二寬度W2。第二寬度W2大於或等於第一寬度W1。 Specifically, the sidewall 126 of the waterproof structure 120 of the electronic device 100 has a plurality of folded portions 128. The folded portion 128 is sequentially connected to the second end surface 124 by the first end surface 122. When the driving member 140 drives the bottom plate 150 along When the axial direction R moves away from the opening 112 to the first position P1, the folded portions 128 are spread away from each other, and the waterproof structure 120 has a first width W1 in a direction perpendicular to the axial direction R. When the driving member 140 drives the bottom plate 150 to move along the axial direction R toward the opening 112 to the second position P2, the folded portions 128 are stacked close to each other, and the waterproof structure 120 has a second width W2 in a direction perpendicular to the axial direction R. . The second width W2 is greater than or equal to the first width W1.

也就是說,在驅動件140帶動功能模組130伸縮於殼體110內部及外部時,防水結構120之第一端面122維持與殼體110之內表面114密封地抵接,而第二端面124隨著底板150之位置移動,使得側壁126之摺疊部128彼此摺疊的程度可隨著底板150的移動過程而調整。由於防水結構120與功能模組130間具有空隙,可避免妨礙防水結構120之摺疊部128的摺疊或展開。除此之外,藉由摺疊部128的設計,可使得防水結構120在隨著功能模組130相對於殼體110伸縮時的變形具有規律性,因此可有效避免變形之防水結構120與功能模組130之間產生摩擦。如此一來,防水效果不會隨著使用次數而減損,進而增加可伸縮的功能模組130之防水功效可靠度。 That is, when the driving member 140 drives the functional module 130 to expand and contract inside and outside the housing 110, the first end surface 122 of the waterproof structure 120 maintains a sealing contact with the inner surface 114 of the housing 110, and the second end surface 124 As the position of the bottom plate 150 moves, the extent to which the folded portions 128 of the side walls 126 are folded over each other can be adjusted as the bottom plate 150 moves. Since there is a gap between the waterproof structure 120 and the functional module 130, the folding or unfolding of the folded portion 128 of the waterproof structure 120 can be avoided. In addition, by the design of the folding portion 128, the waterproof structure 120 can be regularly deformed as the functional module 130 is expanded and contracted relative to the housing 110, so that the deformed waterproof structure 120 and the functional module can be effectively avoided. Friction is generated between the groups 130. In this way, the waterproof effect is not degraded with the number of uses, thereby increasing the reliability of the waterproof function of the retractable functional module 130.

第4A圖為繪示根據本揭露另一實施例之電子裝置200去除部分殼體210後的剖面圖。第4A圖與第3A圖及第3B圖具有相同的剖面位置。第4B圖為第4A圖中之防水結構220的立體圖。請同時參照第4A圖及第4B圖為。電子裝置200包含殼體210、防水結構220、功能模組 230以及驅動件240。 FIG. 4A is a cross-sectional view showing the electronic device 200 removed from a portion of the housing 210 according to another embodiment of the present disclosure. Figure 4A has the same cross-sectional position as Figures 3A and 3B. Fig. 4B is a perspective view of the waterproof structure 220 in Fig. 4A. Please refer to both Figure 4A and Figure 4B. The electronic device 200 includes a housing 210, a waterproof structure 220, and a functional module. 230 and a drive member 240.

殼體210具有相連的開口212以及內表面214。防水結構220具有第一端面222、第二端面224以及連接第一端面222以及第二端面224之側壁226。第二端面224具有端面開口2242。也就是說,防水結構220為半開放式的袋狀結構,第一端面222為此袋狀結構的開放端面,且防水結構220之第二端面224可覆蓋功能模組230之底部,因此功能模組230位在開口212與防水結構220之側壁226共同形成的空間內。除此之外,功能模組230與防水結構220之內壁無接觸,具有環繞功能模組230外圍之空隙。 The housing 210 has an associated opening 212 and an inner surface 214. The waterproof structure 220 has a first end surface 222 , a second end surface 224 , and sidewalls 226 connecting the first end surface 222 and the second end surface 224 . The second end surface 224 has an end opening 2242. That is, the waterproof structure 220 is a semi-open bag-like structure, the first end surface 222 is an open end surface of the bag-like structure, and the second end surface 224 of the waterproof structure 220 can cover the bottom of the functional module 230, so the functional mode The set 230 is located in the space formed by the opening 212 and the side wall 226 of the waterproof structure 220. In addition, the function module 230 has no contact with the inner wall of the waterproof structure 220, and has a gap around the periphery of the function module 230.

電子裝置200還包含線材260以及封膠270。線材160穿過第二端面224之端面開口2242以連接功能模組130。封膠170填補於線材160及端面開口2242間之空隙以使防水結構220得以密封。 The electronic device 200 also includes a wire 260 and a sealant 270. The wire 160 passes through the end opening 2242 of the second end surface 224 to connect the functional module 130. The sealant 170 fills the gap between the wire 160 and the end opening 2242 to seal the waterproof structure 220.

第4C圖為繪示第4A圖中之框線E中的放大圖。電子裝置200還包含一黏著層250,黏著於防水結構220之第一端面222與殼體210之內表面214之間,以確保第一端面222與內表面214密封地連接。 Fig. 4C is an enlarged view showing a frame line E in Fig. 4A. The electronic device 200 further includes an adhesive layer 250 adhered between the first end surface 222 of the waterproof structure 220 and the inner surface 214 of the housing 210 to ensure that the first end surface 222 is sealingly connected to the inner surface 214.

於本實施例中,電子裝置200還具有一帶動結構242,其一端連接驅動件240,其另一端連接防水結構220。驅動件240配置以透過帶動結構242而帶動防水結構220及功能模組230沿著軸線方向R朝向靠近開口212或遠離開口212之方向移動。 In the embodiment, the electronic device 200 further has a driving structure 242, one end of which is connected to the driving member 240, and the other end of which is connected to the waterproof structure 220. The driving member 240 is configured to drive the waterproof structure 220 and the functional module 230 to move along the axial direction R toward the opening 212 or away from the opening 212.

於本實施例中,防水結構220之側壁226具有複數個摺疊部228,而當功能模組230及防水結構220透過驅動件240帶動時,側壁126之摺疊部228之變化特徵與第3A圖及第3B圖中之實施例中的摺疊部128相似,因此不再贅述。 In the present embodiment, the side wall 226 of the waterproof structure 220 has a plurality of folded portions 228. When the functional module 230 and the waterproof structure 220 are driven by the driving member 240, the folding portion 228 of the side wall 126 has a variation feature and FIG. 3A. The folded portion 128 in the embodiment of Fig. 3B is similar and therefore will not be described again.

由此可知,防水結構220以及開口212可共同形成自開口212往殼體210內部延伸出的一容置空間,且能夠使功能模組230與電子裝置200內部的其他元件完全隔離。如此一來,水可經由開口212進出此容置空間內,存在於防水結構220與功能模組230之間的空隙,但不會流出防水結構220進入殼體210內而接觸電子裝置200的其他電子元件。 It can be seen that the waterproof structure 220 and the opening 212 can form an accommodating space extending from the opening 212 to the inside of the housing 210, and can completely isolate the functional module 230 from other components inside the electronic device 200. In this way, water can enter and exit the accommodating space through the opening 212, and exists in the gap between the waterproof structure 220 and the functional module 230, but does not flow out of the waterproof structure 220 into the housing 210 to contact the electronic device 200. Electronic component.

此外,防水結構220與功能模組230間之空隙使得功能模組230在伸縮時,不會與防水結構220產生摩擦,可避免防水效果隨著使用次數而減損,增加可伸縮的功能模組230之防水功效可靠度。 In addition, the gap between the waterproof structure 220 and the function module 230 causes the function module 230 to not rub against the waterproof structure 220 when the telescopic structure is stretched, and the waterproof effect can be avoided as the number of uses is reduced, and the retractable function module 230 is added. Waterproof reliability.

第5A圖為繪示根據本揭露另一實施例之電子裝置300去除部分殼體310後的剖面圖。電子裝置300包含殼體310、防水結構320、功能模組230、驅動件240。電子裝置300與第4A圖之實施例不同的地方在於:凹陷區域316自內表面314遠離防水結構320凹陷,並連接於開口312。亦即凹陷區域316的內壁形成內表面314的一部分。防水結構320具有相連的本體部320A以及延伸部320B。延伸部320B具有遠離本體部320A的第一端面322。電子 裝置300不具有黏著層250,而具有第2圖所示的固定件180。 FIG. 5A is a cross-sectional view showing the electronic device 300 removed from a portion of the housing 310 according to another embodiment of the present disclosure. The electronic device 300 includes a housing 310, a waterproof structure 320, a function module 230, and a driving member 240. The difference between the electronic device 300 and the embodiment of FIG. 4A is that the recessed region 316 is recessed from the inner surface 314 away from the waterproof structure 320 and is connected to the opening 312. That is, the inner wall of the recessed region 316 forms a portion of the inner surface 314. The waterproof structure 320 has an associated body portion 320A and an extension portion 320B. The extension 320B has a first end surface 322 that is remote from the body portion 320A. electronic The device 300 does not have the adhesive layer 250, but has the fixture 180 shown in FIG.

第5B圖為第5A圖中之部分結構的立體圖。請同時參照第5A圖及第5B圖。於本實施例中,固定件180固定於殼體310內,環繞防水結構320之本體部320A,且鄰近延伸部320B。延伸部320B在與軸線方向R垂直的方向上之寬度略大於本體部320A在與軸線方向R垂直的方向上之寬度。防水結構320之延伸部320B被固定件180以及凹陷區域316之內表面314夾持。此外,防水結構320之延伸部320B卡合並容置於凹陷區域316內,以確保第一端面322與內表面314密封地抵接。 Fig. 5B is a perspective view showing a part of the structure in Fig. 5A. Please refer to both Figure 5A and Figure 5B. In this embodiment, the fixing member 180 is fixed in the housing 310, surrounds the body portion 320A of the waterproof structure 320, and is adjacent to the extending portion 320B. The width of the extending portion 320B in the direction perpendicular to the axial direction R is slightly larger than the width of the body portion 320A in the direction perpendicular to the axial direction R. The extension 320B of the waterproof structure 320 is held by the fixture 180 and the inner surface 314 of the recessed region 316. In addition, the extension 320B of the waterproof structure 320 is snap-fitted into the recessed region 316 to ensure that the first end surface 322 sealingly abuts the inner surface 314.

雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何熟習此技藝者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure. Any one skilled in the art can make various modifications and retouchings without departing from the spirit and scope of the disclosure. The scope is subject to the definition of the scope of the patent application attached.

Claims (14)

一種電子裝置,包含:一殼體,具有相連的一內表面以及一開口;一防水結構,具有一第一端面、一第二端面以及連接該第一端面與該第二端面之一側壁,該第一端面密封地與該內表面抵接;一功能模組,設置於該防水結構中;以及一驅動件,位於該殼體內,並配置以帶動該功能模組朝向及遠離該開口移動。 An electronic device comprising: a housing having an inner surface and an opening; a waterproof structure having a first end surface, a second end surface, and a side wall connecting the first end surface and the second end surface, The first end surface is sealingly abutted against the inner surface; a functional module is disposed in the waterproof structure; and a driving member is disposed in the housing and configured to move the functional module toward and away from the opening. 如請求項1所述之電子裝置,其中該電子裝置更包含一底板,該底板位於該殼體內,該防水結構的該第二端面密封地與該底板抵接。 The electronic device of claim 1, wherein the electronic device further comprises a bottom plate, the bottom plate being located in the housing, the second end surface of the waterproof structure sealingly abutting the bottom plate. 如請求項2所述之電子裝置,其中該功能模組設置於該底板上。 The electronic device of claim 2, wherein the functional module is disposed on the bottom plate. 如請求項2所述之電子裝置,其中該底板具有一底板開口且該第二端面具有一端面開口,該底板開口跟該端面開口對應設置,該電子裝置更包含:一線材,穿過該底板開口及該端面開口,以連接該功能模組;以及一封膠,設置於該線材與該底板開口之間,用以密封該底板開口與該線材間之空隙。 The electronic device of claim 2, wherein the bottom plate has a bottom plate opening and the second end surface has an end opening corresponding to the end opening, the electronic device further comprising: a wire passing through the bottom plate The opening and the opening are connected to connect the functional module; and a glue is disposed between the wire and the opening of the bottom plate for sealing a gap between the opening of the bottom plate and the wire. 如請求項2所述之電子裝置,其中該電子裝置更包含一帶動結構,該帶動結構連接該底板及該驅動件,該驅動件透過該帶動結構帶動該底板朝向及遠離該開口移動。 The electronic device of claim 2, wherein the electronic device further comprises a driving structure, the driving structure is coupled to the bottom plate and the driving member, and the driving member drives the bottom plate to move toward and away from the opening through the driving structure. 如請求項5所述之電子裝置,其中該驅動件透過該帶動結構帶動該底板沿著一軸線方向遠離該開口移動至一第一位置,並透過該帶動結構帶動該底板沿著該軸線方向朝向該開口移動至一第二位置。 The electronic device of claim 5, wherein the driving member drives the bottom plate to move away from the opening to a first position along an axial direction through the driving structure, and the base plate is driven along the axis direction through the driving structure. The opening moves to a second position. 如請求項6所述之電子裝置,其中當該底板位於該第一位置時,該防水結構在垂直於該軸線方向之一方向具有一第一寬度,當該底板位於該第二位置時,該防水結構在垂直於該軸線方向之該方向上具有一第二寬度,且該第二寬度大於或等於該第一寬度。 The electronic device of claim 6, wherein the waterproof structure has a first width in a direction perpendicular to the axial direction when the bottom plate is in the first position, and when the bottom plate is in the second position, the The waterproof structure has a second width in the direction perpendicular to the axis direction, and the second width is greater than or equal to the first width. 如請求項1所述之電子裝置,其中該防水結構的該第二端面具有一端面開口,該電子裝置還包含:一線材,穿過該端面開口,以連接該功能模組;以及一封膠,設置於該線材與該端面開口之間,用以密封該端面開口與該線材間之空隙。 The electronic device of claim 1, wherein the second end surface of the waterproof structure has an end opening, the electronic device further comprising: a wire passing through the end opening to connect the functional module; and a glue And disposed between the wire and the end opening to seal the gap between the end opening and the wire. 如請求項1所述之電子裝置,其中該電子裝置更包含一帶動結構,該帶動結構連接該防水結構及該驅動件,該驅動件透過該帶動結構帶動該防水結構及該功能模組朝向及遠離該開口移動。 The electronic device of claim 1, wherein the electronic device further comprises a driving structure, the driving structure is connected to the waterproof structure and the driving component, and the driving component drives the waterproof structure and the functional module toward the driving structure Move away from the opening. 如請求項9所述之電子裝置,其中該驅動件透過該帶動結構帶動該功能模組沿著一軸線方向遠離該開口移動至一第一位置,並透過該帶動結構帶動該功能模組沿著該軸線方向朝向該開口移動至一第二位置。 The electronic device of claim 9, wherein the driving member drives the functional module to move away from the opening to a first position along an axial direction, and the driving module drives the functional module along the driving structure. The axis direction moves toward the opening to a second position. 如請求項10所述之電子裝置,其中當該功能模組位於該第一位置時,該防水結構在垂直於該軸線方向之一方向上具有一第一寬度,當該功能模組位於該第二位置時,該防水結構在垂直於該軸線方向之一方向上具有一第二寬度,且該第二寬度大於或等於該第一寬度。 The electronic device of claim 10, wherein when the functional module is in the first position, the waterproof structure has a first width in a direction perpendicular to the axial direction, and when the functional module is located in the second In position, the waterproof structure has a second width in a direction perpendicular to the axial direction, and the second width is greater than or equal to the first width. 如請求項1所述之電子裝置,還包含:一黏著層,黏著於該防水結構之該第一端面與該殼體之該內表面之間。 The electronic device of claim 1, further comprising: an adhesive layer adhered between the first end surface of the waterproof structure and the inner surface of the housing. 如請求項1所述之電子裝置,其中該防水結構包含相連之一本體部以及一延伸部,該電子裝置還包含:一固定件,固定於該殼體內,並環繞該防水結構之該本體部,該防水結構之該延伸部夾持於該固定件與該殼體之該內表面之間。 The electronic device of claim 1, wherein the waterproof structure comprises a body portion and an extension portion, the electronic device further comprising: a fixing member fixed in the housing and surrounding the body portion of the waterproof structure The extension of the waterproof structure is sandwiched between the fixing member and the inner surface of the housing. 如請求項13所述之電子裝置,其中該殼體具有一凹陷區域,該凹陷區域自該內表面遠離該防水結構凹陷,並連接該開口,該防水結構之該延伸部進一步卡合並容置於該凹陷區域內。 The electronic device of claim 13, wherein the housing has a recessed area, the recessed area is recessed away from the waterproof structure from the inner surface, and the opening is connected, and the extension of the waterproof structure is further engaged and accommodated. Within the recessed area.
TW107211173U 2018-08-15 2018-08-15 Electronic device TWM573107U (en)

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