TWM572626U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TWM572626U
TWM572626U TW107214641U TW107214641U TWM572626U TW M572626 U TWM572626 U TW M572626U TW 107214641 U TW107214641 U TW 107214641U TW 107214641 U TW107214641 U TW 107214641U TW M572626 U TWM572626 U TW M572626U
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TW
Taiwan
Prior art keywords
threaded portion
stop block
threaded
substrate
heat dissipating
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TW107214641U
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Chinese (zh)
Inventor
賴志明
高永順
江忠偉
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技嘉科技股份有限公司
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Priority to TW107214641U priority Critical patent/TWM572626U/en
Publication of TWM572626U publication Critical patent/TWM572626U/en

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Abstract

A heat dissipation device includes a body, a first locking member, and a second locking member locked with the first locking member. The body has a through hole. The first locking member includes a first limiting block and a first threaded portion connected to the first limiting block and inserted into the through hole. The second locking member includes a connecting portion, a second limiting block, and a threaded part. The connecting portion has a second threaded portion, and the connecting portion is inserted into the through hole, so that the first threaded portion is threaded with the second threaded portion. An outer diameter of the first limiting block and an outer diameter of the second limiting block are greater than an outer diameter of the connecting portion, and the body is located between the first limiting block and the second limiting block.

Description

散熱裝置Heat sink

本創作係關於一種散熱器的結構,特別是一種適用於電路板的散熱裝置。This creation relates to the structure of a heat sink, and in particular to a heat sink suitable for a circuit board.

散熱裝置係可組裝於主機板上,而對主機板上的M.2擴充卡、晶片(例如CPU)及其他零件進行散熱,進而避免晶片或零件因高溫而壞損。市售的散熱裝置中,有一種設計是採用以螺絲鎖固於主機板,因此可將散熱裝置穩固地固定於主機板上。The heat sink can be assembled on the motherboard, and the M.2 expansion card, the chip (such as the CPU) and other components on the motherboard are dissipated to prevent the wafer or the component from being damaged due to high temperature. Among the commercially available heat sinks, one design is to be screwed to the motherboard, so that the heat sink can be firmly fixed to the motherboard.

然而,在此種設計中,散熱裝置的螺絲組件與散熱片係為分離的構件。因此,須要先將螺絲組件對準於散熱片上的開孔以及主機板上的固定柱後,才能進行安裝,容易發生零件掉落的問題而導致不便利性。However, in this design, the screw assembly and the heat sink of the heat sink are separate components. Therefore, it is necessary to align the screw assembly with the opening on the heat sink and the fixing post on the main board before installation, and the problem of falling parts is easy to occur, resulting in inconvenience.

鑑於上述問題,本創作提出一種散熱裝置。在一個實施例中,散熱裝置包括散熱本體、第一鎖固件以及鎖接於第一鎖固件的第二鎖固件。散熱本體具有一通孔。第一鎖固件包括第一擋止塊以及連接第一擋止塊並穿入通孔的第一螺紋部。第二鎖固件包括接合部、連接接合部的第二擋止塊以及連接第二擋止塊的螺合部。接合部具有一第二螺紋部,並且接合部穿入通孔而使得第一螺紋部與第二螺紋部相互鎖接。其中第一擋止塊與第二擋止塊的外徑大於接合部的外徑,而使散熱本體位於第一擋止塊與第二擋止塊之間。In view of the above problems, the present invention proposes a heat sink. In one embodiment, the heat sink includes a heat sink body, a first lock, and a second lock that is locked to the first lock. The heat dissipation body has a through hole. The first lock body includes a first stop block and a first threaded portion that connects the first stop block and penetrates the through hole. The second lock fastener includes a joint portion, a second stopper block that connects the joint portion, and a screw portion that connects the second stopper block. The engaging portion has a second threaded portion, and the engaging portion penetrates the through hole such that the first threaded portion and the second threaded portion are interlocked with each other. The outer diameter of the first stop block and the second stop block is larger than the outer diameter of the joint portion, and the heat dissipation body is located between the first stop block and the second stop block.

在一或多個實施例中,螺合部係具有第三螺紋部以與基板相互鎖接。具體來說,第三螺紋部可與基板的固定柱的第四螺紋部相互鎖接。其中,第一螺紋部與第二螺紋部所產生的摩擦扭矩大於第三螺紋部與第四螺紋部所產生的摩擦扭矩。其中,第一螺紋部與第三螺紋部為外螺紋部,且第一螺紋部的直徑大於第三螺紋部的直徑。In one or more embodiments, the threaded portion has a third threaded portion to interlock with the substrate. Specifically, the third threaded portion may be interlocked with the fourth threaded portion of the fixing post of the substrate. The friction torque generated by the first thread portion and the second thread portion is greater than the friction torque generated by the third thread portion and the fourth thread portion. Wherein, the first threaded portion and the third threaded portion are externally threaded portions, and the diameter of the first threaded portion is greater than the diameter of the third threaded portion.

在一或多個實施例中,螺合部係為一柱體而具有一第三螺紋部以與基板相互鎖接。具體來說,第三螺紋部可與基板的第四螺紋部相互鎖接。其中,第一螺紋部與第二螺紋部所產生的摩擦扭矩大於第四螺紋部與第三螺紋部所產生的摩擦扭矩。其中,第一螺紋部為外螺紋部,第三螺紋部為內螺紋部,第一螺紋部的直徑大於第三螺紋部的孔徑。In one or more embodiments, the screw portion is a cylinder and has a third thread portion to interlock with the substrate. Specifically, the third threaded portion can be interlocked with the fourth threaded portion of the substrate. The friction torque generated by the first thread portion and the second thread portion is greater than the friction torque generated by the fourth thread portion and the third thread portion. Wherein, the first threaded portion is an externally threaded portion, and the third threaded portion is an internal threaded portion, and the diameter of the first threaded portion is larger than the diameter of the third threaded portion.

在一或多個實施例中,第一擋止塊與第二擋止塊之間的距離大於通孔的孔長。In one or more embodiments, the distance between the first stop block and the second stop block is greater than the hole length of the through hole.

在一或多個實施例中,第一擋止塊的頂面係具有第一操作部,俾供使用者利用工具操作第一操作部而將第一鎖固件鎖固於第二鎖固件,並且使散熱裝置可進一步鎖固於基板。In one or more embodiments, the top surface of the first blocking block has a first operating portion for the user to lock the first locking member to the second locking member by operating the first operating portion with the tool, and The heat sink can be further locked to the substrate.

在一或多個實施例中,第二擋止塊的周緣係形成第二操作部,俾供使用者利用工具固定第二操作部而將第二鎖固件與第一鎖固件分離。In one or more embodiments, the periphery of the second stop block forms a second operating portion for the user to secure the second operating portion with the tool to separate the second locking member from the first locking member.

藉此,透過本創作一或多個實施例所提供的散熱裝置,係將鎖固組件可動地固定在散熱本體。因此,組裝時僅須將散熱裝置的鎖固組件對準於基板上的對應鎖接位置後即可進行安裝,因而提升組裝速度與便利性。另外,在一些實施例中,由於第一擋止塊與第二擋止塊之間的距離大於散熱本體的厚度,當散熱裝置被組裝到基板時,可以藉由調整各鎖固組件而使散熱裝置被水平地組裝於基板,使得各鎖固組件承受相同大小的應力。Therefore, the heat dissipating device provided by one or more embodiments of the present invention is configured to movably fix the locking component to the heat dissipating body. Therefore, it is only necessary to align the locking component of the heat sink to the corresponding locking position on the substrate after assembly, thereby improving assembly speed and convenience. In addition, in some embodiments, since the distance between the first stopper and the second stopper is greater than the thickness of the heat dissipation body, when the heat dissipation device is assembled to the substrate, the heat dissipation can be performed by adjusting each of the locking components. The device is assembled horizontally to the substrate such that each locking assembly is subjected to the same amount of stress.

請參閱圖1至圖4所示,為本創作一實施例所揭示的一種散熱裝置100。如圖1至圖4所示,散熱裝置100係用於但不限定於組裝於一基板900,如圖4所示。前述基板900可為電路板(例如但不限定為主機板)或者固定於電路板上的強化背板。當基板900為電路板,基板900上係設置有電子零件(例如處理晶片等)。散熱裝置100係用以使此些電子零件運作時產生的熱能快速地逸散而不至於影響電子零件的運作效能。本實施例中,散熱裝置100包括散熱本體20以及多個鎖固組件,而各鎖固組件包括第一鎖固件30以及第二鎖固件40。為求方便說明,以下內容僅以散熱本體20搭配一個鎖固組件進行說明。Please refer to FIG. 1 to FIG. 4 , which is a heat dissipation device 100 according to an embodiment of the present invention. As shown in FIGS. 1 to 4, the heat sink 100 is used for, but not limited to, assembly on a substrate 900, as shown in FIG. The aforementioned substrate 900 can be a circuit board (such as but not limited to a motherboard) or a reinforced backplane fixed to the circuit board. When the substrate 900 is a circuit board, the substrate 900 is provided with electronic components (for example, processing wafers, etc.). The heat sink 100 is used to quickly dissipate the heat generated by the operation of the electronic components without affecting the operational efficiency of the electronic components. In this embodiment, the heat dissipation device 100 includes a heat dissipation body 20 and a plurality of locking components, and each of the locking components includes a first locking component 30 and a second locking component 40. For convenience of explanation, the following content is only described with the heat dissipation body 20 and a locking component.

請參閱圖1至圖3,散熱本體20具有一通孔21而可供第一鎖固件30與第二鎖固件40穿入並相互鎖固。舉例來說,散熱本體20係可以為散熱片,並且前述散熱片可以於不同區域具有不同厚度,並不以此為限制。在本實施例中,散熱本體20係具有一頂面20a與一底面20b,而通孔21係自頂面20a貫通至底面20b。Referring to FIG. 1 to FIG. 3 , the heat dissipation body 20 has a through hole 21 for the first lock 30 and the second lock 40 to penetrate and lock each other. For example, the heat dissipation body 20 may be a heat sink, and the heat sink may have different thicknesses in different regions, and is not limited thereto. In the present embodiment, the heat dissipation body 20 has a top surface 20a and a bottom surface 20b, and the through hole 21 penetrates from the top surface 20a to the bottom surface 20b.

請參閱圖1至圖3,第一鎖固件30包括第一擋止塊31以及連接第一擋止塊31並且穿入通孔21的第一螺紋部32。在一或多個實施例中,第一擋止塊31的頂面311具有第一操作部312,以供使用者利用工具將第一鎖固件30鎖固於第二鎖固件40,並且使散熱裝置100可進一步被鎖固於基板900。換言之,第一鎖固件30係可以為螺絲,並且第一擋止塊31為前述螺絲的頭端而第一螺紋部32則為螺絲的尾端,再者,第一操作部312則可為螺牙以供螺絲起子插入後完成前述操作。因此,雖然在本實施例中,第一操作部312是十字形溝槽,但並不以此為限;第一操作部312也可以是各種類型的溝槽(例如但不限於米字、一字、三角)而可供各種類型的螺絲起子插入操作。Referring to FIGS. 1 to 3 , the first lock 30 includes a first stop block 31 and a first threaded portion 32 that connects the first stop block 31 and penetrates the through hole 21 . In one or more embodiments, the top surface 311 of the first blocking block 31 has a first operating portion 312 for the user to lock the first locking member 30 to the second locking member 40 by means of a tool and to dissipate heat. Device 100 can be further locked to substrate 900. In other words, the first locking member 30 can be a screw, and the first stopping block 31 is the front end of the screw and the first threaded portion 32 is the tail end of the screw. Further, the first operating portion 312 can be a screw. The tooth is inserted into the screwdriver to complete the aforementioned operation. Therefore, in the present embodiment, the first operating portion 312 is a cross-shaped groove, but is not limited thereto; the first operating portion 312 may also be various types of grooves (such as, but not limited to, a rice word, a Word, triangle) and can be inserted into various types of screwdrivers.

請參閱圖1至圖3,第二鎖固件40包括接合部41、連接接合部41的第二擋止塊42以及連接第二擋止塊42的螺合部43。接合部41係具有第二螺紋部411並且接合部41係穿入通孔21,使得第一鎖固件30的第一螺紋部32與第二鎖固件40的第二螺紋部411可以相互鎖接。並且,第一擋止塊31的外徑L1與第二擋止塊42的外徑L2係大於接合部41的外徑L3,因此第一鎖固件30與第二鎖固件40結合後係可以可動地固定於散熱本體20,使得第一擋止塊31對應頂面20a,而第二擋止塊42對應底面20b。換句話說,散熱本體20可以被定位於第一擋止塊31與第二擋止塊42之間。Referring to FIGS. 1 to 3 , the second lock 40 includes an engaging portion 41 , a second stopper 42 that connects the joint portion 41 , and a screw portion 43 that connects the second stopper 42 . The engaging portion 41 has the second threaded portion 411 and the engaging portion 41 penetrates into the through hole 21 such that the first threaded portion 32 of the first locking member 30 and the second threaded portion 411 of the second locking member 40 can be interlocked with each other. Moreover, the outer diameter L1 of the first blocking block 31 and the outer diameter L2 of the second blocking block 42 are larger than the outer diameter L3 of the engaging portion 41, so that the first locking member 30 and the second locking member 40 are coupled to be movable. The ground block is fixed to the heat dissipation body 20 such that the first stop block 31 corresponds to the top surface 20a and the second stop block 42 corresponds to the bottom surface 20b. In other words, the heat dissipation body 20 can be positioned between the first stop block 31 and the second stop block 42.

在一或多個實施例中,第二擋止塊42的周緣係形成第二操作部421,俾供使用者利用工具固定第二操作部421而將第二鎖固件40與第一鎖固件30相互鎖接或分離。第二操作部421可為方形、六角形、八角形、梅花形等造型,而可適用於各式扳手或夾具。藉此,使用者於固定第二操作部421後,再將工具插入前述第一操作部312並進行順時針或逆時針的轉動以達成第一鎖固件30與第二鎖固件40之間的鎖接或分離。In one or more embodiments, the periphery of the second blocking block 42 forms a second operating portion 421 for the user to fix the second operating portion 421 with the tool to lock the second locking member 40 with the first locking member 30. Interlock or separate from each other. The second operating portion 421 can be square, hexagonal, octagonal, quincunx, etc., and can be applied to various wrenches or clamps. Thereby, after the user fixes the second operating portion 421, the tool is inserted into the first operating portion 312 and rotated clockwise or counterclockwise to achieve the lock between the first locking member 30 and the second locking member 40. Connect or separate.

請參閱圖1至圖3,螺合部43係用以與基板900相互鎖接,而達成將散熱裝置100固定於基板900的作用。具體來說,如圖1至圖4,在一或多個實施例中,螺合部43具有第三螺紋部431,而基板900上的固定柱901係具有第四螺紋部,使得螺合部43可與固定柱901相互鎖接,進而將散熱裝置100固定於基板900上。在本實施例中,第一螺紋部32與第三螺紋部431均為外螺紋部,而第一螺紋部32的直徑D1係可大於第三螺紋部431的直徑D2;也就是說,第一螺紋部32與第二螺紋部411所產生的摩擦扭矩係大於第三螺紋部431與第四螺紋部所產生的摩擦扭矩。因此,若欲將散熱裝置100自基板900上拆卸下來時,摩擦扭矩較小的第三螺紋部431與第四螺紋部可以分開而不至於將摩擦扭矩較大的第一螺紋部32與第二螺紋部411分開。具體來說,在本實施例中,第一螺紋部32對應的摩擦扭矩為3至2.5 N·m,而第三螺紋部431對應的摩擦扭矩為2至1.5 N·m。Referring to FIGS. 1 to 3 , the screwing portion 43 is used to lock the substrate 900 to each other, thereby achieving the function of fixing the heat sink 100 to the substrate 900 . Specifically, as shown in FIGS. 1 to 4, in one or more embodiments, the screw portion 43 has a third thread portion 431, and the fixing post 901 on the substrate 900 has a fourth thread portion so that the screw portion The fixing member 901 can be interlocked with the fixing post 901 to fix the heat sink 100 to the substrate 900. In this embodiment, the first threaded portion 32 and the third threaded portion 431 are both externally threaded portions, and the diameter D1 of the first threaded portion 32 can be greater than the diameter D2 of the third threaded portion 431; that is, the first The frictional torque generated by the threaded portion 32 and the second threaded portion 411 is greater than the frictional torque generated by the third threaded portion 431 and the fourth threaded portion. Therefore, if the heat sink 100 is to be detached from the substrate 900, the third thread portion 431 and the fourth thread portion having a small friction torque can be separated without the first thread portion 32 and the second having a large friction torque. The threaded portions 411 are separated. Specifically, in the present embodiment, the first screw portion 32 has a frictional torque of 3 to 2.5 N·m, and the third threaded portion 431 has a frictional torque of 2 to 1.5 N·m.

然而,本創作之散熱裝置100與基板900的組接方式並不以前述為限。請繼續參閱圖5,圖5係本創作散熱裝置100一實施例的鎖固組件的另一實施態樣的分解圖。如圖5所示,在此實施例中,第二鎖固件40的螺合部43’係為一柱體而具有一第三螺紋部431’,而基板900的固定柱係突伸一第四螺紋部(圖未示出),使得螺合部43’可與基板900相互鎖接,進而將散熱裝置100固定於基板900上。另外,在本實施例中,第一螺紋部32為外螺紋部,第三螺紋部431’為內螺紋部,而第一螺紋部32的直徑D1係可大於第三螺紋部431’的孔徑D3。也就是說,第一螺紋部32與第二螺紋部411所產生的摩擦扭矩係大於第四螺紋部與第三螺紋部431’所產生的摩擦扭矩。因此,若欲將散熱裝置100自基板900上拆卸下來時,摩擦扭矩較小的第四螺紋部與第三螺紋部431’可以分開而不至於將摩擦扭矩較大的第一螺紋部32與第二螺紋部411分開。具體來說,在本實施例中,第一螺紋部32對應的摩擦扭矩為3至2.5 N·m,而第三螺紋部431’對應的摩擦扭矩為2至1.5 N·m。However, the manner in which the heat sink 100 and the substrate 900 of the present invention are assembled is not limited to the foregoing. Please refer to FIG. 5. FIG. 5 is an exploded view of another embodiment of the locking assembly of the embodiment of the heat sink 100 of the present invention. As shown in FIG. 5, in this embodiment, the screwing portion 43' of the second locking member 40 is a cylinder and has a third threaded portion 431', and the fixing column of the substrate 900 protrudes from the fourth thread. The portion (not shown) allows the screw portion 43' to be coupled to the substrate 900 to fix the heat sink 100 to the substrate 900. In addition, in the embodiment, the first threaded portion 32 is an externally threaded portion, and the third threaded portion 431' is an internally threaded portion, and the diameter D1 of the first threaded portion 32 is greater than the diameter D3 of the third threaded portion 431'. . That is, the frictional torque generated by the first threaded portion 32 and the second threaded portion 411 is greater than the frictional torque generated by the fourth threaded portion and the third threaded portion 431'. Therefore, if the heat sink 100 is to be detached from the substrate 900, the fourth thread portion and the third thread portion 431' having a small friction torque can be separated without the first thread portion 32 having a large friction torque. The two threaded portions 411 are separated. Specifically, in the present embodiment, the first screw portion 32 has a frictional torque of 3 to 2.5 N·m, and the third threaded portion 431' has a frictional torque of 2 to 1.5 N·m.

在前述實施例中,第一螺紋部32為外螺紋部,而第二螺紋部411為內螺紋部,但本創作並不以此為限。在一或多個實施例中,第一螺紋部可以是內螺紋部,而第二螺紋部可以是外螺紋部,使得第一鎖固件30與第二鎖固件40可以相互鎖固,不再贅述。In the foregoing embodiment, the first threaded portion 32 is an externally threaded portion, and the second threaded portion 411 is an internally threaded portion, but the present invention is not limited thereto. In one or more embodiments, the first threaded portion may be an internal threaded portion, and the second threaded portion may be an externally threaded portion, such that the first locking member 30 and the second locking member 40 may be interlocked with each other, and no further description is provided. .

在一或多個實施例中,第一擋止塊31與第二擋止塊42之間的距離D4係大於通孔21的孔長L4。換句話說,第一擋止塊31與第二擋止塊42之間的距離D4係大於散熱本體20的厚度。另外,在本實施例中,通孔21的孔徑係略大於接合部41的外徑L3,使得前述鎖固組件可以相對散熱本體20在垂直方向上順暢地活動。具體來說,在本實施例中,前述距離D4與孔長L4之間的差距係可介於0.15 mm至0.2 mm。再者,在本實施例中,通孔21與接合部41的截面係實質上皆為圓形,使得前述鎖固組件可以相對散熱本體20順暢地轉動。如此,若欲將散熱裝置100組裝於基板900時,由於前述配置,鎖固組件可相對散熱本體20活動,而便於將鎖固組件對準基板900上的對應鎖固位置(即前述固定柱901),以使散熱裝置100可被水平地裝設到基板900上,但本創作並不以此為限制;於另一實施例中,第一擋止塊31與第二擋止塊42之間的距離D4係可大致等於通孔21的孔長L4。也就是說,第一鎖固件30與第二鎖固件40結合後係可以固定散熱本體20,使得第一擋止塊31抵頂於頂面20a而第二擋止塊42抵頂於底面20b。In one or more embodiments, the distance D4 between the first stop block 31 and the second stop block 42 is greater than the hole length L4 of the through hole 21. In other words, the distance D4 between the first stop block 31 and the second stop block 42 is greater than the thickness of the heat dissipation body 20. In addition, in the present embodiment, the aperture of the through hole 21 is slightly larger than the outer diameter L3 of the joint portion 41, so that the aforementioned locking assembly can smoothly move in the vertical direction with respect to the heat dissipation body 20. Specifically, in the present embodiment, the difference between the aforementioned distance D4 and the hole length L4 may be between 0.15 mm and 0.2 mm. Furthermore, in the present embodiment, the cross-section of the through hole 21 and the joint portion 41 are substantially circular, so that the aforementioned locking assembly can smoothly rotate relative to the heat dissipation body 20. As such, if the heat dissipating device 100 is to be assembled to the substrate 900, the locking assembly can be moved relative to the heat dissipating body 20 due to the foregoing configuration, and the locking assembly can be aligned with the corresponding locking position on the substrate 900 (ie, the fixing post 901). So that the heat sink 100 can be horizontally mounted on the substrate 900, but the creation is not limited thereto; in another embodiment, between the first stop block 31 and the second stop block 42 The distance D4 can be approximately equal to the hole length L4 of the through hole 21. That is to say, after the first locking member 30 is combined with the second locking member 40, the heat dissipating body 20 can be fixed such that the first stopping block 31 abuts against the top surface 20a and the second stopping block 42 abuts against the bottom surface 20b.

另外,基板900上還可以包括發光元件,而發光元件的光線可以經過基板900與散熱裝置100之間的空隙側向地散出。由於散熱裝置100可以藉由鎖固組件而水平地組裝在基板900上,使得自空隙散出的光線也較為均勻,進而可以提供較好的導光效果。In addition, the substrate 900 may further include a light emitting element, and the light of the light emitting element may be laterally scattered through the gap between the substrate 900 and the heat sink 100. Since the heat dissipating device 100 can be horizontally assembled on the substrate 900 by the locking component, the light emitted from the gap is relatively uniform, thereby providing a better light guiding effect.

藉此,透過本創作一或多個實施例所提供的散熱裝置,係將鎖固組件可動地固定在散熱本體。因此,組裝時僅須將散熱裝置的鎖固組件對準於基板上的對應鎖接位置後即可進行安裝,因而提升組裝速度與便利性。另外,在一些實施例中,由於第一擋止塊與第二擋止塊之間的距離大於散熱本體的厚度,當散熱裝置被組裝到基板時,可以藉由調整各鎖固組件而使散熱裝置被水平地組裝於基板,使得各鎖固組件承受相同大小的應力。Therefore, the heat dissipating device provided by one or more embodiments of the present invention is configured to movably fix the locking component to the heat dissipating body. Therefore, it is only necessary to align the locking component of the heat sink to the corresponding locking position on the substrate after assembly, thereby improving assembly speed and convenience. In addition, in some embodiments, since the distance between the first stopper and the second stopper is greater than the thickness of the heat dissipation body, when the heat dissipation device is assembled to the substrate, the heat dissipation can be performed by adjusting each of the locking components. The device is assembled horizontally to the substrate such that each locking assembly is subjected to the same amount of stress.

100‧‧‧散熱裝置100‧‧‧heating device

20‧‧‧散熱本體 20‧‧‧Solution body

20a‧‧‧頂面 20a‧‧‧ top

20b‧‧‧底面 20b‧‧‧ bottom

21‧‧‧通孔 21‧‧‧through hole

30‧‧‧第一鎖固件 30‧‧‧First lock firmware

31‧‧‧第一擋止塊 31‧‧‧First stop block

311‧‧‧頂面 311‧‧‧ top surface

312‧‧‧第一操作部 312‧‧‧First Operation Department

32‧‧‧第一螺紋部 32‧‧‧First threaded part

40‧‧‧第二鎖固件 40‧‧‧Second lock firmware

41‧‧‧接合部 41‧‧‧ joints

411‧‧‧第二螺紋部 411‧‧‧Second thread

42‧‧‧第二擋止塊 42‧‧‧second stop block

421‧‧‧第二操作部 421‧‧‧Second Operations Department

43、43’‧‧‧螺合部 43, 43’‧‧‧ Threading Department

431‧‧‧第三螺紋部 431‧‧‧ Third thread

431’‧‧‧第三螺紋部 431'‧‧‧ Third thread

900‧‧‧基板 900‧‧‧Substrate

901‧‧‧固定柱 901‧‧‧ fixed column

D1、D2‧‧‧直徑 D1, D2‧‧‧ diameter

L1、L2、L3‧‧‧外徑 L1, L2, L3‧‧‧ outer diameter

D3‧‧‧孔徑 D3‧‧‧ aperture

D4‧‧‧距離 D4‧‧‧ distance

L4‧‧‧孔長 L4‧‧‧ Kong Chang

圖1係本創作散熱裝置一實施例的分解圖。 圖2係本創作散熱裝置一實施例的組裝示意圖。 圖3係本創作散熱裝置一實施例的剖面示意圖。 圖4係本創作散熱裝置一實施例的使用狀態示意圖。 圖5係本創作散熱裝置一實施例的鎖固組件的另一實施態樣的分解圖。1 is an exploded view of an embodiment of the heat sink of the present invention. FIG. 2 is an assembled view of an embodiment of the heat sink of the present invention. 3 is a schematic cross-sectional view showing an embodiment of the heat sink of the present invention. FIG. 4 is a schematic view showing the state of use of an embodiment of the heat sink of the present invention. Figure 5 is an exploded view of another embodiment of the locking assembly of an embodiment of the present heat sink.

Claims (10)

一種散熱裝置,包括: 一散熱本體,具有一通孔; 一第一鎖固件,包括: 一第一擋止塊;以及 一第一螺紋部,連接該第一擋止塊,該第一螺紋部穿入該通孔;以及 一第二鎖固件,包括: 一接合部,具有一第二螺紋部,該接合部穿入該通孔,使得該第一螺紋部與該第二螺紋部相互鎖接; 一第二擋止塊,連接該接合部;以及 一螺合部,連接該第二擋止塊; 其中該第一擋止塊與該第二擋止塊的外徑大於該接合部的外徑,而使該散熱本體位於該第一擋止塊與該第二擋止塊之間。A heat dissipating device includes: a heat dissipating body having a through hole; a first locking member comprising: a first stopping block; and a first threaded portion connecting the first stopping block, the first threaded portion is worn And a second locking member, comprising: a joint portion having a second threaded portion, the engaging portion penetrating the through hole, such that the first threaded portion and the second threaded portion are interlocked with each other; a second stop block connecting the joint portion; and a screwing portion connecting the second stop block; wherein an outer diameter of the first stop block and the second stop block is larger than an outer diameter of the joint portion The heat dissipation body is located between the first stop block and the second stop block. 如請求項1所述的散熱裝置,其中該螺合部係具有一第三螺紋部以與一基板的一第四螺紋部相互鎖接。The heat sink of claim 1, wherein the screw portion has a third threaded portion for interlocking with a fourth threaded portion of a substrate. 如請求項2所述的散熱裝置,其中該第一螺紋部與該第二螺紋部所產生的摩擦扭矩大於該第三螺紋部與該第四螺紋部所產生的摩擦扭矩。The heat sink according to claim 2, wherein the frictional torque generated by the first threaded portion and the second threaded portion is greater than the frictional torque generated by the third threaded portion and the fourth threaded portion. 如請求項2所述的散熱裝置,其中該第一螺紋部與該第三螺紋部為外螺紋部,且該第一螺紋部的直徑大於該第三螺紋部的直徑。The heat dissipating device of claim 2, wherein the first threaded portion and the third threaded portion are externally threaded portions, and the diameter of the first threaded portion is greater than the diameter of the third threaded portion. 如請求項1所述的散熱裝置,其中該螺合部係為一柱體而具有一第三螺紋部以與一基板的一第四螺紋部相互鎖接。The heat dissipating device of claim 1, wherein the screwing portion is a cylinder and has a third threaded portion for interlocking with a fourth threaded portion of a substrate. 如請求項5所述的散熱裝置,其中該第一螺紋部與該第二螺紋部所產生的摩擦扭矩大於該第四螺紋部與該第三螺紋部所產生的摩擦扭矩。The heat dissipating device of claim 5, wherein the frictional torque generated by the first threaded portion and the second threaded portion is greater than the frictional torque generated by the fourth threaded portion and the third threaded portion. 如請求項5所述的散熱裝置,其中該第一螺紋部為外螺紋部,該第三螺紋部為內螺紋部,且該第一螺紋部的直徑大於該第三螺紋部的孔徑。The heat dissipating device of claim 5, wherein the first threaded portion is an externally threaded portion, the third threaded portion is an internally threaded portion, and the diameter of the first threaded portion is greater than the diameter of the third threaded portion. 如請求項1所述的散熱裝置,其中該第一擋止塊與該第二擋止塊之間的距離大於該通孔的孔長。The heat dissipation device of claim 1, wherein a distance between the first stop block and the second stop block is greater than a hole length of the through hole. 如請求項1所述的散熱裝置,其中該第一擋止塊的頂面係具有一第一操作部。The heat dissipating device of claim 1, wherein the top surface of the first blocking block has a first operating portion. 如請求項1所述的散熱裝置,其中該第二擋止塊的周緣係形成一第二操作部。The heat dissipating device of claim 1, wherein the periphery of the second blocking block forms a second operating portion.
TW107214641U 2018-10-26 2018-10-26 Heat dissipation device TWM572626U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709849B (en) * 2020-01-20 2020-11-11 技嘉科技股份有限公司 Heat dissipating assembly and main board module
CN113138644A (en) * 2020-01-20 2021-07-20 技嘉科技股份有限公司 Heat radiation assembly and motherboard module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709849B (en) * 2020-01-20 2020-11-11 技嘉科技股份有限公司 Heat dissipating assembly and main board module
CN113138644A (en) * 2020-01-20 2021-07-20 技嘉科技股份有限公司 Heat radiation assembly and motherboard module
US11102913B2 (en) 2020-01-20 2021-08-24 Giga-Byte Technology Co., Ltd. Heat dissipating assembly and main board module

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