TWM566419U - Connector with thermal conduction function - Google Patents

Abstract

A connector with heat conduction function includes an insulating body, a grounding spring seat (EMI shrapnel seat), a plurality of terminals, and a heat conduction mechanism. The grounding spring seat is disposed on one side of the insulating body. The plurality of terminals are disposed through the insulative housing, and each of the terminals has an electrical contact section and a soldering section. The electrical contact sections protrude into the insertion space of the insulative housing, and the soldering sections are soldered to a circuit board. The heat transfer mechanism includes a heat conduction element extending from the grounding spring seat to the circuit board, and a thermal protection element in contact with the heat conduction element, and the thermal protection element contacts a heated actuation element of the circuit board.

Description

Connector with heat transfer function

This creation relates to a connector, and more particularly to a connector having a heat transfer function.

The USB Type-C interface plug connector can be used to interface with a USB Type-C interface socket connector for power transfer. When there is a liquid, such as soda, sports drinks, etc., accidentally infiltrating into the plug-in space of the connector, it is easy to cause a short circuit (micro-short circuit) between the terminals to generate a high temperature, so that the connector may be melted and the terminal is blackened. In order to avoid the foregoing, it is common to provide a PTC (Thermistor) on the board of the connector. However, the high temperature is slowly conducted to the PTC via the terminal and the circuit board, so when the PTC is slowly heated to the switching temperature, the connector may have been burnt and the terminal is blackened.

Therefore, the author believes that the above-mentioned defects can be improved, and he is devoted to research and cooperation with scientific principles, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects.

The main purpose of the present invention is to provide a side surface having an insulating body; a plurality of terminals are disposed through the insulating body, each terminal has a connected electrical contact section and a soldering section, and each of the electrical contact segments protrudes Extending into the docking space, each soldering segment is soldered to a circuit board; and a heat conducting mechanism includes a heat conducting component extending from the grounding spring mount to the circuit board, and a heat conducting component a thermal protection element in contact, and the thermal protection element contacts a heated actuation element of the circuit board.

Preferably, the contact portion of the thermal conduction element simultaneously contacts the thermal protection element and the heated actuation element in a covering manner, and the thermal protection element surrounds a circumference contacting the heated actuation element.

Preferably, the contact portion of the thermal conduction element contacts the top and sides of the thermal protection element, and the thermal protection element completely surrounds the top and periphery of the heated actuation element.

Preferably, the thermal protection element surrounds the top and periphery of the heated actuation element, and the contact of the thermal conduction element extends through the thermal protection element and contacts the top of the heated actuation element.

Preferably, the connector with heat conduction function further comprises a shielding shell sleeved on the insulating body, and the contact portion of the heat conducting element simultaneously contacts the inner surface of the shielding shell and the top of the thermal protection element.

Preferably, the connector with heat conduction function further comprises another grounding spring seat disposed on the other side of the insulating body.

Preferably, the connector having heat conduction function further comprises another heat conduction mechanism, and the other heat conduction mechanism comprises another heat conduction element extending from the other grounding spring seat to the circuit board, and the other Another thermal protection element in contact with the thermal conduction element, and another such thermal protection element encloses another heated actuation element that contacts the circuit board.

Preferably, the heat conducting element extends from the opening of the grounding spring mount toward the circuit board.

Preferably, the heat conducting element is made of a high thermal conductivity material.

Preferably, the heat conduction element is made of one of a graphene sheet, an insulating thermally conductive sheet, a carbon fiber material, and a metal material.

Preferably, the thermal protection element is made of one of a highly thermally conductive plastic material, a ceramic material, and a metal material.

Therefore, the present invention comprises a heat conducting member extending from the grounding elastic piece to the circuit board through the heat conducting mechanism, and a thermal protection element contacting the heat conducting element, and the thermal protection element contacts the heated actuating element on the circuit board, and has good Heat transfer effect to avoid deformation, melting or damage of the connector under high temperature operation.

For the advantages of this creation, please refer to the following detailed description and drawings of this creation for further understanding.

1‧‧‧Insulating body

11‧‧‧Dock space

2, 2a‧‧‧ Grounding shrapnel seat (EMI shrapnel seat)

21‧‧‧ Grounding shrapnel (EMI shrapnel)

22‧‧‧ openings

3‧‧‧ terminals

31‧‧‧Electrical contact

32‧‧‧welding section

4‧‧‧ boards

41, 41a‧‧‧Heat actuating components

5, 5a‧‧‧ heat conduction mechanism

51, 51a‧‧‧Heat conduction element

511‧‧‧Contacts

52, 52a‧‧‧ Thermal protection components

6‧‧‧Shielded enclosure

FIG. 1 is a schematic view showing the appearance of a first embodiment of a connector with a heat conduction function.

2 is a schematic cross-sectional view showing a first embodiment of a connector having a heat conduction function.

3 is a schematic cross-sectional view showing a second embodiment of a connector having a heat conduction function.

4 is a schematic cross-sectional view showing a third embodiment of a connector having a heat conduction function.

FIG. 5 is a schematic cross-sectional view showing a fourth embodiment of a connector having a heat conduction function.

Fig. 6 is a schematic cross-sectional view showing a fifth embodiment of a connector having a heat conduction function.

FIG. 7 is a schematic view showing the appearance of a sixth embodiment of a connector with a heat conduction function.

Fig. 8 is a schematic cross-sectional view showing a sixth embodiment of a connector having a heat conduction function.

Please refer to FIG. 1 to FIG. 8 , which are the embodiments of the present invention. It should be noted that the related embodiments of the present invention and the appearance are only used to specifically describe the implementation manner of the present invention. In order to understand the content of this creation, not to limit the scope of protection of this creation.

[Example 1]

As shown in FIG. 1 and FIG. 2, which is the first embodiment of the present invention, the connector with the heat conduction function is a USB Type-C interface plug connector, which can be matched with one. The socket connector (not shown) of the USB Type-C interface is docked. The connector having the heat conduction function in the present embodiment may include an insulating body 1, a grounding spring holder 2, a terminal 3, a circuit board 4, and a heat conduction mechanism 5. In addition, the connector of the present invention may further include a shielded outer casing 6 in the present embodiment, and the embodiment of the shielded outer casing 6 may be appropriately changed according to actual needs, and is not limited in this embodiment.

The front end of the insulative housing 1 is formed with a docking space 11 for insertion of a mating tongue (sheet) (not shown) of the receptacle connector. The outer shape of the insulative housing 1 can be appropriately changed according to actual needs, and the embodiment is not limited.

The grounding spring holder 2 is disposed on one side of the insulative housing 1. The grounding elastic piece seat 2 (otherly referred to as an EMI elastic piece seat) may be formed with a grounding elastic piece 21 (also referred to as an EMI elastic piece) that passes through the insulating body 1 and protrudes into the insertion space 11 , that is, the grounding elastic piece and the grounding elastic piece seat may be One piece. In general, the number of grounding elastic pieces 21 can be three. Moreover, when the mating tongue of the socket connector is inserted into the docking space 11, the grounding elastic piece 21 can be used to contact the grounding piece on the docking tongue to reduce electromagnetic interference (EMI). In addition, this embodiment may further have another grounding spring holder 2a disposed on the other side of the insulative housing 1. The appearance of the grounding spring seats 2, 2a can be appropriately changed according to actual needs, and the embodiment is not limited.

A plurality of terminals 3 are provided through the insulative housing 1 . Moreover, each of the terminals 3 has an electrical contact section 31 and a soldering section 32. The electrical contact sections 31 protrude into the insertion space 11, and the soldering sections 32 are soldered to the circuit board 4. Generally, the plurality of terminals 3 includes twelve upper rows of terminals and twelve lower row of terminals, but the number of terminals can be adjusted according to actual needs.

The heat transfer mechanism 5 includes a heat conduction member 51 extending from the grounding spring holder 2 toward the circuit board 4, and a heat protection member 52 in contact with the heat conduction member 51, and the heat protection member 52 surrounds the heat-actuating member 41 on the contact circuit board 4.

In detail, the heat-actuating element 41 may be a PTC (thermistor), a mini-Breaker (mini-circuit breaker), a temperature-triggered fuse, or other thermal switch, etc., but is not limited to the above. The heat conduction element 51 can extend from the upper or lower side of the grounding spring holder 2 to the circuit board 4. The heat conduction element 51 can also be integrally formed with the grounding spring holder 2 to extend to the circuit board 4, that is, the heat conduction element 51 and the grounding spring holder 2 are integrated. It is disposed between the shield case 6 and the insulative housing 1, and the thickness of the insulative housing 1 can be appropriately adjusted to reduce interference. Therefore, when a liquid such as soda water or a conductive substance penetrates into the insertion space 11, the electrical contact section 31 is short-circuited (micro-short) with the grounding elastic piece 21, or a short circuit (micro short circuit) between the terminals of the electrical contact section 31, The short circuit (micro-short circuit) phenomenon or the high thermal energy generated by the contact resistance of the terminal is rapidly transmitted to the heat conduction element 51, and the heat conduction element 51 can quickly conduct high heat to the heat-actuating element 41 to avoid the insulation body. 1 burning and terminal blackening.

In this embodiment, the heat conducting element 51 can be extended from the opening 22 of the grounding elastic piece 2 corresponding to the electrical contact section 31 toward the circuit board 4, so when the heat conducting element 51 is designed to be below the opening, in order to avoid electrical contact with the segment The terminal of the 31 is in contact with the heat conducting component 51, and the material of the heat conducting component 51 (such as an insulating and thermally conductive sheet) is extended to the circuit board, and the contact portion 511 of the heat conducting component 51 simultaneously contacts the thermal protection component 52 in a covering manner. The actuating element 41 is heated, and the thermal protection element 52 surrounds the periphery of the heated actuating element 41, which can be used to protect the heated actuating element 41, and can also be used as a heat transfer medium. Thereby, when the contact resistance of the terminal is increased or the high heat generated by the terminal short circuit (micro short circuit) is transmitted to the heat conduction element 51, the heat conduction element 51 and the heat protection element 52 can quickly conduct heat to the heat-actuating element 41 to be heated. The actuating element 41 can be quickly actuated, and the insulative body 1 can be quickly prevented from being burnt and the terminal is blackened.

Further, the heat conducting element 51 can also be made of a material having good thermal conductivity, such as graphene sheets, and graphene is a single stripped from the graphite material. The layer carbon atom surface material has a high thermal conductivity and can be as high as 5300 W/m‧K, and can quickly conduct the thermal energy of the terminal of the electrical contact section 31 and the grounding elastic piece 21 to the heat-actuating element 41, so that the heated actuating element 41 can be quickly actuated. In addition, the heat conducting element 51 can also be made of other high thermal conductivity materials, such as carbon fiber materials having a thermal conductivity of about 1100 W/m‧K. The appearance of the heat conducting element 51 can be appropriately changed according to actual needs, and the embodiment is not limited.

Alternatively, the thermal protection element 52 can be made of a highly thermally conductive plastic material, a ceramic material or a metallic material to protect the heated actuation element 41 and act as a heat transfer medium. The appearance of the thermal protection element 52 can be appropriately changed according to actual needs, and the embodiment is not limited.

[Embodiment 2]

As shown in FIG. 3, which is the second embodiment of the present invention, the present embodiment is similar to the first embodiment, and the same portions of the two embodiments are not described again, and the main differences between the two embodiments are as follows: Heat transfer mechanism 5. The difference between this embodiment and the above-described first embodiment will be described below.

In the present embodiment, the contact portion 511 of the heat conduction element 51 contacts the top and one side of the thermal protection element 52, and the thermal protection element 52 completely surrounds the top and periphery of the heat-actuating element 41. Thereby, the heat-actuating element 41 is provided with better protection.

[Embodiment 3]

As shown in FIG. 4 , which is the third embodiment of the present invention, the present embodiment is similar to the above-mentioned second embodiment, and the same portions of the two embodiments are not described again, and the main differences between the two embodiments are as follows: Heat transfer mechanism 5. The difference between this embodiment and the above-described second embodiment will be described below.

In the present embodiment, the thermal protection element 52 surrounds the top and periphery of the heated actuation element 41, and the contact portion 511 of the thermal conduction element 51 extends through the thermal protection element 52 and contacts the top of the heated actuation element 41, the contact portion of the thermal conduction element 51. 511 can Extend a length depending on actual needs. The heat-actuating element 41 is surrounded by the thermal protection element 52 to provide better protection of the heated actuating element 41, and the thermal energy is more rapidly transmitted to the heated actuating element 41, causing the heated actuating element 41 to actuate rapidly.

[Embodiment 4]

As shown in FIG. 5, it is the fourth embodiment of the present invention. The present embodiment is similar to the above-mentioned second embodiment. The same portions of the two embodiments are not described again, and the main differences between the two embodiments are as follows: Heat transfer mechanism 5. The difference between this embodiment and the above-described second embodiment will be described below.

In the present embodiment, the contact portion 511 of the heat conduction member 51 contacts the top and one side of the thermal protection member 52, and is in contact with the inner surface of the shield case 6 that is sleeved on the insulative housing 1. Thereby, heat conducted to the contact portion 511 of the heat conduction member 51 can be convected to the outside via the shield case 6.

[Embodiment 5]

As shown in FIG. 6 , which is the fifth embodiment of the present invention, the present embodiment is similar to the first embodiment, and the same portions of the two embodiments are not described again, and the main difference between the two embodiments is: another Heat transfer mechanism 5a. The difference between this embodiment and the above-described first embodiment will be described below.

The connector having the heat conduction function in the present embodiment may include another heat conduction mechanism 5a in the present embodiment, and the heat conduction mechanism 5a includes another heat conduction element 51a extending from the other grounding spring piece 2a toward the circuit board 4, and heat conduction. The other thermal protection element 52a that the element 51a contacts, and the thermal protection element 52a surrounds the other heated actuation element 41a that contacts the circuit board 4. Thereby, the heat conduction effect can be enhanced by the two heat conduction mechanisms 5, 5a.

[Embodiment 6]

As shown in FIG. 7 and FIG. 8 , it is the sixth embodiment of the present invention. This embodiment is similar to the first embodiment, and the same portions of the two embodiments are not described again, and the two implementations are omitted. The main difference of the example is: grounding the spring seat 2. The difference between this embodiment and the above-described first embodiment will be described below.

In the present embodiment, the grounding spring holder 2 extends horizontally in the direction of the circuit board 4 for a length, so that the grounding spring holder 2 of the embodiment has a long length. The heat conducting element 51 can also be designed to be integrally formed with the grounding elastic piece holder 2 to extend horizontally in the direction of the circuit board 4, and the thickness of the insulating body 1 can be appropriately adjusted to reduce interference.

In summary, the present invention includes a heat conduction element extending from the grounding spring seat to the circuit board and a thermal protection element in contact with the heat conduction element through the heat conduction mechanism, and the thermal protection element contacts the heat-actuating element on the circuit board, and has Good heat transfer to avoid deformation, melting or damage of the connector under high temperature operation.

The above is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the patents of the present invention. Any changes and modifications made to the scope of the patent application of the present invention should be covered by the present invention.

Claims (10)

A connector with a heat conduction function, comprising: an insulative housing having a plug-in space formed at a front end of the insulative housing; a grounding spring tab seat disposed on one side of the insulative housing; and a plurality of terminals disposed throughout the chassis Insulating body, each terminal has a connected electrical contact section and a soldering section, each electrical contact section protrudes into the plugging space, each soldering section is soldered to a circuit board; and a heat conducting mechanism includes There is a thermal conduction element extending from the grounding spring seat toward the circuit board, and a thermal protection element in contact with the thermal conduction element, and the thermal protection element contacts a heated actuation element of the circuit board. A connector having a heat conduction function according to claim 1, wherein a contact portion of the heat conduction member simultaneously contacts the heat protection member and the heat-actuated member in a covering manner, and the thermal protection member surrounds the contact The periphery of the heated actuator. A connector having a heat transfer function according to claim 1, wherein a contact portion of the heat conduction member contacts a top portion and a side portion of the heat protection member, and the heat protection member completely surrounds a top portion of the heat-actuating member Periphery. The connector of claim 1, wherein the thermal protection element surrounds a top and a periphery of the heated actuation element, and a contact portion of the thermal conduction element extends through the thermal protection element and contacts the The top of the heated actuator. The connector with heat conduction function according to claim 1 further includes another grounding spring piece seat disposed on the other side of the insulating body. The heat conduction function connector according to claim 1 further includes another heat conduction mechanism, and the other heat conduction mechanism includes another heat conduction element extending from the other grounding spring holder toward the circuit board, And another thermal protection element in contact with another of the thermal conduction elements, and the other of the thermal protection elements Surrounding another heated actuator element that contacts the circuit board. A connector having a heat transfer function according to claim 1, wherein the heat conduction member extends from the opening of the grounding spring holder toward the circuit board. A connector having heat transfer function as claimed in claim 1, wherein the heat conduction member is made of a material having a high thermal conductivity. A connector having a heat transfer function according to claim 1, wherein the heat conduction member is made of one of a graphene sheet, an insulating thermally conductive sheet, a carbon fiber material, and a metal material. The connector of claim 1, wherein the thermal protection element is made of one of a highly thermally conductive plastic material, a ceramic material, and a metal material.