TWM565900U - High-frequency connector with lapped gold fingers added on grounded metal casing - Google Patents
High-frequency connector with lapped gold fingers added on grounded metal casing Download PDFInfo
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- TWM565900U TWM565900U TW107205128U TW107205128U TWM565900U TW M565900 U TWM565900 U TW M565900U TW 107205128 U TW107205128 U TW 107205128U TW 107205128 U TW107205128 U TW 107205128U TW M565900 U TWM565900 U TW M565900U
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 83
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- 239000010931 gold Substances 0.000 title claims abstract description 27
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 27
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- 229910000831 Steel Inorganic materials 0.000 claims description 3
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- 239000010959 steel Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
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Abstract
本創作係一種在接地金屬外殼增設搭接金手指之高頻連接器,至少包括一絕緣座體、複數支訊號端子及一接地金屬外殼,其中,該等訊號端子係組裝於該絕緣座體內,且該絕緣座體能伸入且安裝於該接地金屬外殼中,該高頻連接器之特徵在於,該接地金屬外殼之頂緣係較該絕緣座體之頂面高出一預定高度,以形成一插接部位,該插接部位上則形成有複數個搭接金手指,如此,俟對應之一插接頭,被插接至該高頻連接器時,該等搭接金手指能穩固地搭接抵靠在該插接頭外緣所披覆之金屬殼體的外壁面,以有效阻隔外界電磁波對各該訊號端子造成電磁干擾(EMI)。 The present invention relates to a high-frequency connector for attaching a gold finger to a grounded metal casing, comprising at least one insulating body, a plurality of signal terminals and a grounded metal casing, wherein the signal terminals are assembled in the insulating body. The high-voltage connector is characterized in that the top edge of the grounded metal casing is higher than a top surface of the insulating body by a predetermined height to form a In the plugging portion, a plurality of overlapping gold fingers are formed on the plugging portion, so that when the one plug connector is connected to the high frequency connector, the overlapping gold fingers can be firmly connected Abutting against an outer wall surface of the metal casing covered by the outer edge of the plug connector to effectively block external electromagnetic waves from causing electromagnetic interference (EMI) to each of the signal terminals.
Description
本創作係關於連接器,尤指一種在金屬外殼上增設有搭接金手指,以能提升抗EMI表現的高頻連接器。 This creation is about a connector, especially a high-frequency connector that adds a gold finger to the metal casing to enhance the anti-EMI performance.
按,連接器(Connector)係泛指所有應用在電子訊號及電源傳輸上的連接元件及其附屬配件,是一般電子裝置上所有電流與訊號的傳輸橋樑,其設計及製作品質的良窳自然會對電流與訊號的傳輸可靠度產生極為重要的影響,亦與各該電子裝置是否能維持正常的運作息息相關。一般言,各式電子裝置(如:智慧型手機、平板電腦、桌上型電腦、筆記型電腦、數位相機...等)上,根據其設計上的要求,均會配置有對應類型之高頻連接器,以期使各該電子裝置不僅能維持本身的正常地運作,尚能彼此連接相互交換資料,令各該連接器能在元件與元件間、裝置與裝置間、或系統與系統之間進行電流與訊號之傳輸,從而構成一個完整的電訊系統,因此,連接器實乃構成該電訊系統所需之最基礎的元件。 According to the connector, the connector refers to all the connecting components and their accessories on the electronic signal and power transmission. It is the transmission bridge of all currents and signals on the general electronic device. The design and production quality will naturally be good. It has a very important impact on the reliability of current and signal transmission, and is also closely related to whether the electronic device can maintain normal operation. Generally speaking, all kinds of electronic devices (such as smart phones, tablets, desktop computers, notebook computers, digital cameras, etc.) will be configured with corresponding types according to their design requirements. Frequency connectors, in order to enable the electronic devices not only to maintain their normal operation, but also to exchange data with each other, so that the connectors can be between components and components, between devices and devices, or between systems and systems. The current and signal are transmitted to form a complete telecommunications system. Therefore, the connector is the most basic component required for the telecommunications system.
根據產業研究報告所載,在過去十幾年來,相對於其它零組件產業而言,進入連接器產業的許多台灣業者都還算是獲利頗為豐厚的族群,究其原因,主要是在相關電子裝置的領域中,無論各國際大廠或台灣廠商對於其各自產製之電子裝置在市場上的定位及區隔均已日趨清楚,且 已臻極為明確之地步,此一現象,亦導致其各自產製之電子裝置中所使用的高低階連接器間的技術差異頗大,此一特點,令各該廠商在委託台灣連接器業者製造各式連接器時,均會嚴格地要求必需能製作出符合其特殊要求,且具備廣泛應用能力的連接器,此一嚴苛的產品要求,迫使接受委託代工的台灣連接器業者,不得不更加努力不懈地致力於產品的改良及研究開發,以期能具備各式專攻項目據以產製符合客戶不同要求的各式連接器產品,據此,台灣連接器業者在十幾年來不斷地摸索、學習及磨練下,早已練就了能避開後續低價紅海(中國相關廠商)競爭的技術能力。 According to the industry research report, in the past decade or so, compared with other component industries, many Taiwanese companies entering the connector industry are still quite profitable ethnic groups. The reason is mainly related to electronics. In the field of devices, regardless of the positioning and division of the electronic devices of their respective international manufacturers or Taiwanese manufacturers in the market, it has become increasingly clear, and This has become a very clear point. This phenomenon has also led to considerable technical differences between the high and low-order connectors used in their respective electronic devices. This feature has enabled the manufacturers to commission the Taiwan connector manufacturers. All kinds of connectors are strictly required to be able to produce connectors that meet their special requirements and have a wide range of application capabilities. This demanding product requirement forces Taiwan connector manufacturers who are commissioned to OEM. We are working harder on product improvement and research and development, in order to have a variety of specialized projects to produce various connector products that meet different requirements of customers. According to this, Taiwan connector manufacturers have been groping for more than ten years. Under the study and tempering, I have already trained the technical ability to avoid the competition of the low-cost Red Sea (Chinese related manufacturers).
然而,早在2008年金融風暴以來的十年間,以連接器為主力產品的相關台灣連接器業者,即曾清楚感受且經歷過一次嚴重的產業危機,當時,PC產業因整體市場的需求不振、進入門檻過低及產業競爭激烈等情事,而一蹶不振,從而並波及台灣連接器產業,導致許多台灣連接器業者面臨無法繼續經營的生存危機,且猛然地認知到應即時調整經營策略,以資應對,且期望能利用多元轉型的策略,令連接器產品的應用層面,不再僅侷限於PC產業,而應能更廣泛地含蓋各式通訊或消費性電子產品(如:手機與遊戲機...等),據此,原本大量倚賴電腦與其周邊設備的台灣連接器業者,近十幾年來,均已紛紛轉型至研發與生產各式消費性電子產品、顯示器...等產品上所須使用的利基型連接器。 However, as early as the decade of the 2008 financial turmoil, the relevant Taiwan connector manufacturers who used connectors as their main products had clearly felt and experienced a serious industrial crisis. At that time, the PC industry was weak due to the overall market demand. The barriers to entry and the fierce competition in the industry have been devastating, and this has affected the connector industry in Taiwan. As a result, many Taiwan connector manufacturers are facing a crisis of survival that cannot continue to operate, and they suddenly realize that they should adjust their business strategies immediately. And expect to be able to take advantage of the multi-transformation strategy, so that the application level of connector products is no longer limited to the PC industry, but should be more widely covered with various communication or consumer electronics (such as: mobile phones and game consoles. .., etc. According to this, Taiwan connector manufacturers, which originally relied heavily on computers and their peripheral devices, have been transformed into products for research and development and production of various consumer electronic products, displays, etc. in the past decade or so. The niche type connector used.
但是,誠如前述,2008年的金融風暴確實已一舉打破了連接器產業中許多業者間長久以來所遵循的產業默契或潛規則,如:原本生產高階或高端技術連接器的美、歐、日連接器業者,在獲利日益短缺的現實逼迫下,也考量開始生產中低階連接器,而嚴重地侵入了台灣連接器業者 多年來所掌握的主力產品線,面對此一情勢的變化,台灣連接器業者除必須加快腳步調整經營策略之外,尚必需在新策略中加入能兼顧過去未檢討到的點與面,並針對未來連接器之各種特性,進行探討、研發與改良,以能生產出更多且更符合市場需要的優良連接器產品,始能在市場佔據一席之地,茲舉例而言,誠如前述,連接器是作為電子裝置本身及彼此間傳輸電流及訊號的重要基礎元件,其對於電子裝置本身及彼此間是否能維持正常運作,有著極為重要且關鍵的影響力,近年來,由於市場對各式電子裝置的傳輸速度應不斷提昇之迫切要求下,如何在高速傳輸數據的前提下,維持訊號傳輸品質與速度的精準性及穩定性,自然廣泛地受到相關學者及業者們的特別關注及重視;以數據傳輸為例,從早期USB 1.0的最大傳輸速度為12Mbps,逐步演進到USB 2.0時期的最大傳輸速度為480Mbps,之後,在USB 3.0(Super Speed USB)時期,資料的最大傳輸速度更提升到5Gbps,甚至,在USB 3.1 Gen 2時期,更直接將最大傳輸速度提高到10Gbps,以滿足人們對高速數據傳輸的強烈需求。 However, as mentioned above, the 2008 financial turmoil has indeed broken the industry tacit or unspoken rules that have long been followed by many players in the connector industry, such as the US, Europe and Japan that originally produced high-end or high-end technology connectors. Connector manufacturers, under the pressure of increasing shortage of profits, also considered the production of low-end connectors, and seriously invaded Taiwan connector manufacturers. In the main product line that has been mastered for many years, in addition to the change of the situation, Taiwan connector manufacturers must add a new strategy to balance the points and aspects that have not been reviewed in the past. For the future, the various characteristics of the connector, research, development and improvement, in order to produce more and better meet the market needs of the excellent connector products, can now occupy a place in the market, for example, as mentioned above, the connector It is an important basic component for transmitting current and signals between the electronic devices themselves and each other. It has an extremely important and critical influence on whether the electronic devices themselves and each other can maintain normal operation. In recent years, due to various electronic devices in the market Under the urgent need of continuous improvement of transmission speed, how to maintain the accuracy and stability of signal transmission quality and speed under the premise of high-speed data transmission, it is naturally widely concerned and valued by relevant scholars and practitioners; Transmission as an example, from the early USB 1.0 maximum transfer speed of 12Mbps, gradually evolved to USB 2.0 The maximum transmission speed is 480Mbps. Later, during the USB 3.0 (Super Speed USB) period, the maximum transmission speed of data is increased to 5Gbps. Even in the USB 3.1 Gen 2 period, the maximum transmission speed is directly increased to 10Gbps. There is a strong demand for high speed data transmission.
傳統上,電子連接器技術主要著重於各該連接器內訊號端子的機械結構設計,然而,隨著科技的發展,在數位訊號的傳輸速度已邁向高速化及高頻化之情勢下,經由各該電子連接器傳輸之數位訊號本身亦會在傳輸過程中發生損耗,因此,如何使損耗降至最低,從而令數位訊號能獲得穩定且精準的傳輸品質,如今已成為高頻電子連接器產業在開發上之一重要課題。按,高頻電子連接器產品的開發原本即是一項極具困難度及艱鉅性技術門檻的工作,尤其是,其中在機械結構的設計上與其在高頻電磁電性設分析上是兩門截然不同的專業領域,因此,如何在工程設計上取 得最佳的平衡點,即是一項艱鉅的挑戰,有鑑於此,如何在確保高頻電子連接器擁有良好結構強度的情況下,尚能同時提升其在高頻訊號傳輸品質精準性與傳輸速度穩定性上的表現,即成為本創作在此欲探討之一重要課題,以期望藉由本創作所衍生之創新技術,能有效縮短業界在開發高頻電子連接器的時程,且能提升國內在傳輸高頻訊號上的分析與設計能力,從而能與世界技術接軌。 Traditionally, the electronic connector technology has mainly focused on the mechanical structure design of the signal terminals in each connector. However, with the development of technology, the transmission speed of digital signals has been moving toward high speed and high frequency. The digital signals transmitted by the electronic connectors themselves are also lost during transmission. Therefore, how to minimize the loss, so that the digital signals can obtain stable and accurate transmission quality, has become a high-frequency electronic connector industry. An important topic in development. According to the development of high-frequency electronic connector products, it is a difficult and arduous technical threshold. In particular, it is two in the design of mechanical structure and its analysis of high-frequency electromagnetic electricity. Very different areas of expertise, therefore, how to take engineering design The best balance point is a daunting challenge. In view of this, how to ensure the high-frequency electronic connector has good structural strength, it can simultaneously improve its high-frequency signal transmission quality accuracy and transmission. The performance of speed stability has become an important topic for this creation, and it is expected that the innovative technology derived from this creation can effectively shorten the time course of developing high-frequency electronic connectors in the industry and enhance domestic The ability to analyze and design high-frequency signals to connect with world technology.
為了能在競爭激烈的高頻電子連接器市場中,脫穎而出,創作人憑藉著多年來專業從事各式電源或訊號連接器設計、加工及製造之豐富實務經驗,且秉持著精益求精的研究精神,在經過長久的努力研究與實驗後,終於研發出本創作之一種在接地金屬外殼增設搭接金手指之高頻連接器,期藉由本創作之問世,能有效增進該高頻連接器在傳輸高頻訊號上的精準性及穩定性,從而使相關電子裝置始終能維持正常且穩定的運作,而令使用者能獲得更佳的使用經驗。 In order to stand out in the highly competitive high-frequency electronic connector market, the creators rely on years of experience in the design, processing and manufacturing of various power supply or signal connectors, and adhere to the spirit of excellence in research. After a long period of hard work and experimentation, I finally developed a high-frequency connector that adds a gold finger to the grounded metal casing. With the advent of this creation, the high-frequency connector can effectively improve the transmission of high-frequency connectors. The accuracy and stability of the signal, so that the relevant electronic devices can always maintain normal and stable operation, so that users can get better experience.
本創作之一目的,係提供一種在接地金屬外殼增設搭接金手指之高頻連接器,該高頻連接器至少包括一絕緣座體、複數支訊號端子及一接地金屬外殼,其中,該絕緣座體內設有至少一排端子槽組,各排端子槽組分別包括複數個相互間隔排列之端子槽,各該訊號端子係分別定位至各該端子槽中,各該訊號端子的頂端係外露在該絕緣座體的頂端,各該訊號端子的底端則係由該絕緣座體之底面延伸而出,供分別焊接至一電路板之頂面上對應之訊號接點,且令該絕緣座體之底面能與該電路板之頂面保持一設計間隙;該接地金屬外殼內設有一容納空間,該容納空間的構形係 與該絕緣座體的構形相匹配,以令該接地金屬外殼能完全包覆住該絕緣座體除頂面及底面外之其餘表面;該接地金屬外殼之頂緣係較該絕緣座體之頂面高出一預定高度,且該接地金屬外殼上較該絕緣座體之頂面高出該預定高度之插接部位尚能圍繞著該絕緣座體之頂面,而在對應於該絕緣座體頂面之位置形成一插接口,供插接對應之一插接頭,該接地金屬外殼上較該絕緣座體之頂面高出該預定高度之插接部位上,係利用沖壓成形的技術,分別形成有複數個搭接金手指,各該搭接金手指之一端係與該接地金屬外殼相連接,各該搭接金手指之另一端則係朝該接地金屬外殼內彎折,且在延伸一預定深度而形成一彈性臂後,再朝該接地金屬外殼外彎折而形成一搭接部,該接地金屬外殼之底緣凸設有複數支接地支撐腳,各該接地支撐腳係由該接地金屬外殼之底緣延伸而出,以連接至該電路板之頂面上對應之接地插孔或接地接點,以確保該高頻連接器能被穩固地安裝在該電路板上,而不易鬆動,且令該接地金屬外殼與該電路板之接地端能始終穩固地維持在相互電氣導通之接地狀態。 One of the purposes of the present invention is to provide a high frequency connector for attaching a gold finger to a grounded metal casing, the high frequency connector comprising at least one insulating body, a plurality of signal terminals and a grounded metal casing, wherein the insulation The terminal body is provided with at least one row of terminal slot groups, and each row of terminal slot groups respectively includes a plurality of terminal slots arranged at intervals, each of the signal terminals is respectively positioned in each of the terminal slots, and the top ends of the signal terminals are exposed at a top end of the insulating base, the bottom end of each of the signal terminals is extended from a bottom surface of the insulating base for soldering to a corresponding signal contact on a top surface of a circuit board, and the insulating base is The bottom surface can maintain a design gap with the top surface of the circuit board; the ground metal housing is provided with a receiving space, and the configuration of the receiving space is Matching with the configuration of the insulating base body, so that the grounded metal outer casing can completely cover the remaining surface of the insulating base body except the top surface and the bottom surface; the top edge of the grounded metal outer shell is higher than the top of the insulating base body The surface is raised by a predetermined height, and the insertion portion of the grounded metal casing higher than the predetermined height of the top surface of the insulating seat can surround the top surface of the insulating body, and corresponds to the insulating seat The position of the top surface forms a plug-in interface for inserting and connecting one of the plug connectors, and the grounded metal shell is higher than the top surface of the insulating seat by the predetermined height, and is formed by using a stamping forming technique. Forming a plurality of overlapping gold fingers, one end of each of the overlapping gold fingers is connected to the grounded metal casing, and the other end of each of the overlapping gold fingers is bent toward the grounded metal casing, and extending one Forming a resilient arm at a predetermined depth, and then bending outwardly toward the grounded metal casing to form a lap portion. The bottom edge of the grounded metal casing is convexly provided with a plurality of ground supporting legs, and the grounding supporting legs are grounded by the grounding Bottom of metal casing Extending out to connect to a corresponding grounding jack or grounding contact on the top surface of the circuit board to ensure that the high frequency connector can be securely mounted on the circuit board without loosening and grounding The metal casing and the grounding end of the circuit board can be stably maintained in a grounded state of mutual electrical conduction.
如此,俟對應之該插接頭,通過該插接口,而被插接至該高頻連接器時,該接地金屬外殼上鄰近該插接口之該等搭接部,將能因對應之該等彈性臂所施加之彈性作用力,而分別穩固地搭接抵靠在該插接頭外緣所披覆之金屬殼體外壁,不僅令該高頻連接器與該對應之插接頭能穩固地插接成為一體,共同傳輸高頻訊號,亦因該接地金屬外殼能與該金屬殼體電氣導通地結合成為一體,共同屏蔽該高頻連接器與該插接頭間相互電氣連接之訊號端子,故不僅能有效阻隔外界電磁波對各該訊號端子上高頻訊號造成電磁干擾(EMI)而產生雜訊(noise),且能有效避免相鄰訊號端子上 高頻訊號因電磁干擾所產生之雜訊對周遭電子元件的訊號處理造成負面影響,尚能將該等雜訊宣洩至該電路板之接地端,予以排除,從而確保該電路板及其上電子元件能在高頻訊號處理上維持訊號之穩定性及完整性(Signal Integrity,簡稱SI)。 In this way, when the plug connector corresponding to the plug is inserted into the high frequency connector through the plug connector, the grounded metal housing adjacent to the jack portion of the plug connector can be adapted to the elasticity The elastic force applied by the arm is firmly lapped against the outer wall of the metal casing covered by the outer edge of the plug joint, so that the high frequency connector and the corresponding plug connector can be stably inserted. Integrally, the high-frequency signal is transmitted together, and the grounded metal casing can be electrically integrated with the metal casing to integrally shield the signal terminal electrically connected between the high-frequency connector and the plug connector, thereby not only being effective Blocking external electromagnetic waves to cause electromagnetic interference (EMI) to high frequency signals on each of the signal terminals to generate noise, and can effectively avoid adjacent signal terminals The noise generated by the high-frequency signal due to electromagnetic interference has a negative impact on the signal processing of the surrounding electronic components, and the noise can be vented to the ground of the circuit board to be excluded, thereby ensuring the circuit board and the electronics thereon. The component maintains the stability and integrity of the signal (Signal Integrity, SI for short) on high frequency signal processing.
本創作之另一目的,係為了令該高頻連接器與該對應之插接頭能更穩固地插接成為一體,共同傳輸高頻訊號,該高頻連接器尚包括一彈性搭接環,該彈性搭接環係由彈性鋼片製成,其硬度及彈性均大於該接地金屬外殼之硬度及彈性,但是,其厚度則小於該接地金屬外殼之厚度,該彈性搭接環之構形係與該接地金屬外殼上較該絕緣座體之頂面高出該預定高度之插接部位相匹配,且其上設有複數個嵌卡鉤,以藉由該等嵌卡鉤,令該彈性搭接環能精準地定位在該插接部位上,該彈性搭接環上則係利用沖壓成形的技術,分別形成有該等搭接金手指,各該搭接金手指之一端係與該彈性搭接環相連接,各該搭接金手指之另一端則係朝彈性搭接環內彎折且在延伸一預定深度而形成一彈性臂後,再朝彈性搭接環外彎折而形成對應之搭接部。 Another purpose of the present invention is to enable the high-frequency connector and the corresponding plug connector to be more stably plugged together to transmit a high-frequency signal, and the high-frequency connector further includes an elastic overlapping ring. The elastic lap ring is made of elastic steel sheet, and its hardness and elasticity are greater than the hardness and elasticity of the grounded metal shell, but the thickness thereof is smaller than the thickness of the grounded metal shell, and the configuration of the elastic lap ring is The grounded metal casing is matched with the insertion portion of the top surface of the insulating seat higher than the predetermined height, and a plurality of embedded hooks are disposed thereon to enable the elastic joint by the embedded hooks The ring can be accurately positioned on the plugging portion, and the elastic overlapping ring is formed by the stamping forming technology, and the overlapping gold fingers are respectively formed, and one end of each of the overlapping gold fingers is overlapped with the elastic The loops are connected, and the other end of each of the overlapping gold fingers is bent in the elastic overlapping ring and formed into a resilient arm after extending a predetermined depth, and then bent outwardly toward the elastic overlapping ring to form a corresponding Connection.
為便 貴審查委員能對本創作目的、技術特徵及其功效,做更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下: For the sake of your review, you can make a further understanding and understanding of the purpose, technical features and efficacy of this creation. The examples are shown in the following diagram:
[習知] [知知]
無 no
[本創作] [This creation]
1‧‧‧高頻連接器 1‧‧‧High frequency connector
10‧‧‧絕緣座體 10‧‧‧Insulated body
102‧‧‧絕緣座體之底面 102‧‧‧Bottom of the insulating body
103‧‧‧嵌卡槽 103‧‧‧Inch card slot
104‧‧‧絕緣座體之頂面 104‧‧‧Top surface of the insulating body
120‧‧‧端子槽 120‧‧‧Terminal slot
13‧‧‧訊號端子 13‧‧‧ Signal Terminal
13T‧‧‧訊號端子頂端 13T‧‧‧ signal terminal top
13B‧‧‧訊號端子底端 13B‧‧‧ signal terminal bottom
16‧‧‧接地金屬外殼 16‧‧‧Grounded metal casing
160‧‧‧容納空間 160‧‧‧ accommodation space
161‧‧‧接地支撐腳 161‧‧‧ Grounding support feet
1611‧‧‧對應於彎角之接地支撐腳 1611‧‧‧ Grounding foot corresponding to the corner
1612‧‧‧對應於其它位置之接地支撐腳 1612‧‧‧ Grounding feet corresponding to other locations
163‧‧‧嵌卡鍵 163‧‧‧ embedded card
164‧‧‧插接部位 164‧‧‧Docking site
1640‧‧‧開孔 1640‧‧‧Opening
165‧‧‧插接口 165‧‧‧ Plug interface
17‧‧‧彈性搭接環 17‧‧‧Flexible lap ring
170‧‧‧嵌卡鉤 170‧‧‧Inlay hook
166、176‧‧‧搭接金手指 166, 176‧‧‧Golding the golden finger
166A、176A‧‧‧彈性臂 166A, 176A‧‧‧ resilient arm
166T、176T‧‧‧搭接部 166T, 176T‧‧‧ lap joint
20‧‧‧電路板 20‧‧‧ boards
21‧‧‧接地插孔 21‧‧‧ Grounding jack
22‧‧‧接地接點 22‧‧‧ Grounding contacts
d‧‧‧預定間距 D‧‧‧predetermined spacing
G‧‧‧設計間隙 G‧‧‧Design gap
D‧‧‧預定深度 D‧‧‧Predetermined depth
H‧‧‧預定高度 H‧‧‧Predetermined height
第1圖係本創作之一較佳實施例中高頻連接器的立體分解示意圖;第2圖係第1圖所示本創作之較佳實施例中高頻連接器的組立示意圖; 第3圖係本創作之另一較佳實施例中高頻連接器的立體分解示意圖;及第4圖係第3圖所示本創作之另一較佳實施例中高頻連接器的組立示意圖。 1 is a perspective exploded view of a high frequency connector in a preferred embodiment of the present invention; and FIG. 2 is a schematic view showing the assembly of a high frequency connector in the preferred embodiment of the present invention shown in FIG. 1; 3 is a perspective exploded view of a high-frequency connector in another preferred embodiment of the present invention; and FIG. 4 is a schematic view showing the assembly of a high-frequency connector in another preferred embodiment of the present invention.
本創作係一種在接地金屬外殼增設搭接金手指之高頻連接器1,在本創作之一較佳實施例中,請參閱第1及2圖所示,茲為方便說明起見,在本創作之後續敘述中,係以第1及2圖之上方作為該高頻連接器1之頂側或頂端方位,且以第1及2圖之下方作為該高頻連接器1之底側或底端方位,合先陳明。在該較佳實施例中,復請參閱第1圖所示,該高頻連接器1至少包括一絕緣座體10、複數支訊號端子13、一接地金屬外殼16;其中,復請參閱第2圖所示,該絕緣座體10內設有至少一排端子槽組,本創作以兩排端子槽組為例,各排端子槽組分別包括複數個相互間隔排列之端子槽120,該兩排端子槽組中相互對應之二端子槽120係彼此區隔且保持一預定間距d;各該訊號端子13係分別定位至各該端子槽120中,各該訊號端子13的頂端13T係外露在該絕緣座體10的頂面104,各該訊號端子13的之底端13B則係由該絕緣座體10之底面102延伸而出,供分別焊接至一電路板20之頂面上對應之訊號接點(圖中未示),且令該絕緣座體10之底面102能與該電路板20之頂面保持一設計間隙G,該設計間隙G係為該電路板20之頂面及各該訊號端子13的底端13B與周遭冷空氣間提供一能相互對流的空間,以達成為該電路板20及各該訊號端子13提供散熱降溫作用之目的;該接地金屬外殼16內設有一容納空間160,該容納空間160的構形係與該絕緣座體10的構形相 匹配,以令該接地金屬外殼16能完全包覆住該絕緣座體10除頂面及底面外之其餘表面;該接地金屬外殼16之頂緣係較該絕緣座體10之頂面104高出一預定高度H,而形成一插接部位164,該插接部位164尚能圍繞著該絕緣座體10之頂面104,而在對應於該絕緣座體10頂面104之位置形成一插接口165,供插接對應之一插接頭(圖中未示)。 The present invention relates to a high-frequency connector 1 for attaching a gold finger to a grounded metal casing. In a preferred embodiment of the present invention, please refer to Figures 1 and 2, for convenience of explanation, In the following description of the creation, the top of the first and second figures is used as the top side or the top end of the high frequency connector 1, and the lower side of the first and second figures is used as the bottom side or the bottom of the high frequency connector 1. End orientation, combined with Chen Ming. In the preferred embodiment, as shown in FIG. 1, the high frequency connector 1 includes at least one insulating base 10, a plurality of signal terminals 13, and a grounded metal casing 16; As shown in the figure, the insulating base 10 is provided with at least one row of terminal slot groups. The present invention takes two rows of terminal slot groups as an example, and each row of terminal slot sets respectively includes a plurality of terminal slots 120 arranged at intervals, the two rows The two terminal slots 120 corresponding to each other in the terminal slot group are separated from each other and maintained at a predetermined interval d. Each of the signal terminals 13 is respectively positioned in each of the terminal slots 120, and the top end 13T of each of the signal terminals 13 is exposed. The top surface 104 of the insulating base 10 and the bottom end 13B of each of the signal terminals 13 extend from the bottom surface 102 of the insulating base 10 for soldering to the corresponding signal on the top surface of a circuit board 20 a point (not shown), and the bottom surface 102 of the insulating base 10 can maintain a design gap G with the top surface of the circuit board 20, and the design gap G is the top surface of the circuit board 20 and each of the signals The bottom end 13B of the terminal 13 provides a space for convection between the surrounding cold air and the surrounding cold air. The signal terminal 13 is provided for the purpose of heat dissipation board 20 and each of cooling effect; the grounding metal housing 16 equipped with a receiving space 160, the receiving system 160 of the spatial configuration of the insulating base member 10 is configured physiognomy Matching, so that the grounded metal casing 16 can completely cover the remaining surfaces of the insulating base 10 except the top surface and the bottom surface; the top edge of the grounded metal casing 16 is higher than the top surface 104 of the insulating base 10. A predetermined height H forms a plug-in portion 164 which can surround the top surface 104 of the insulating base 10 and form a plug-in interface corresponding to the top surface 104 of the insulating base 10. 165, for plugging one of the corresponding plug connectors (not shown).
復請參閱第2圖所示,該插接部位164上係利用沖壓成形的技術,分別形成有複數個搭接金手指166,各該搭接金手指166之一端係與該接地金屬外殼16相連接,各該搭接金手指166之另一端則係朝該接地金屬外殼16內彎折且在延伸一預定深度D而形成一彈性臂166A後,再朝該接地金屬外殼16外彎折而形成一搭接部166T。復請參閱第1及2圖所示,該接地金屬外殼16之底緣凸設有複數支接地支撐腳161,各該接地支撐腳161係由該接地金屬外殼16之底緣延伸而出,並能連接(如:焊接、抵靠)至該電路板20之頂面上對應之接地插孔21或接地接點22,以確保該高頻連接器1能被穩固地安裝在該電路板20上,而不易鬆動,且令該接地金屬外殼16與該電路板20之接地端能始終穩固地維持在相互電氣導通之接地狀態。如此,俟對應之該插接頭(圖中未示),通過該插接口165,被插接至該高頻連接器1時,該接地金屬外殼16上鄰近該插接口165之該等搭接部166T,將因對應之該等彈性臂166A所分別施加之彈性作用力,而能穩固地搭接且抵靠在該插接頭外緣所披覆之金屬殼體外壁,不僅令該高頻連接器1能與該對應之插接頭能穩固地插接成為一體,共同傳輸高頻訊號,亦因該接地金屬外殼16能與該金屬殼體電氣導通地結合成為一體,共同屏蔽該高頻連接器1與該插接頭間相互電氣連接之訊號端子,故,不僅能有效阻隔外界電磁波對各該訊號端子 上高頻訊號造成電磁干擾(EMI)而產生雜訊(noise),且能有效避免相鄰訊號端子上高頻訊號因電磁干擾(EMI)所產生之雜訊(noise)對周遭電子元件的訊號處理造成負面影響,尚能將該等雜訊宣洩至該電路板之接地端,予以排除,從而確保該電路板及其上電子元件能在高頻訊號處理上維持訊號之穩定性及完整性(Signal Integrity,簡稱SI)。 Referring to FIG. 2 , the plugging portion 164 is formed by a press forming technique, and a plurality of overlapping gold fingers 166 are formed respectively, and one end of each of the overlapping gold fingers 166 is connected to the grounded metal shell 16 . The other end of each of the overlapping gold fingers 166 is bent toward the grounded metal casing 16 and extends to a predetermined depth D to form a resilient arm 166A, and then bent outwardly of the grounded metal casing 16 to form A lap 166T. Referring to FIGS. 1 and 2, a plurality of ground support legs 161 are protruded from a bottom edge of the grounded metal casing 16, and each of the ground support legs 161 extends from a bottom edge of the grounded metal casing 16 and The grounding jack 21 or the grounding joint 22 on the top surface of the circuit board 20 can be connected (eg, soldered, abutted) to ensure that the high frequency connector 1 can be stably mounted on the circuit board 20. It is not easy to loosen, and the grounding metal casing 16 and the grounding end of the circuit board 20 can be stably maintained in a grounded state of mutual electrical conduction. In this way, the plug connector (not shown) corresponding to the cymbal is inserted into the high frequency connector 1 through the plug connector 165, and the ground metal shell 16 is adjacent to the lap portion of the plug connector 165. 166T, which can firmly lap and abut against the outer wall of the metal casing covered by the outer edge of the plug joint due to the elastic force applied by the corresponding elastic arms 166A, not only the high frequency connector 1 can be firmly integrated with the corresponding plug connector to jointly transmit the high frequency signal, and the grounded metal shell 16 can be electrically integrated with the metal shell to integrally shield the high frequency connector 1 a signal terminal electrically connected to the plug connector, so that not only external electromagnetic waves can be effectively blocked for each of the signal terminals The high-frequency signal causes electromagnetic interference (EMI) to generate noise, and can effectively avoid the noise of the high-frequency signal on the adjacent signal terminal due to electromagnetic interference (EMI) to the surrounding electronic components. The processing has a negative impact, and the noise can be vented to the ground of the board to be eliminated, thereby ensuring that the board and its electronic components can maintain signal stability and integrity in high-frequency signal processing ( Signal Integrity, referred to as SI).
此外,由於本創作中各該接地支撐腳161係彼此間隔地排列在對應於該設計間隙G之位置,以令各該接地支撐腳161能分別位在對應於二相鄰訊號端子13底端13B間之位置,從而使該絕緣座體10及其中之該等訊號端子13能完全被包圍在該接地金屬外殼16及該等接地支撐腳161內,以藉由該金屬殼體16及該等接地支撐腳161之屏蔽、導引、支撐及保護作用,有效達成下列四大功效及目的:(1)該金屬殼體16及該等接地支撐腳161之包覆及包圍所產生之屏蔽作用,除能有效防止外界電磁波對各該訊號端子13上之高頻訊號造成電磁干擾而產生雜訊之外,尚能有效避免相鄰之該等訊號端子13上之高頻訊號間相互發生電磁干擾所產生之雜訊向外洩漏,而對該電路板20上電子元件(圖中未示)的訊號處理精準度造成負面影響;(2)該等接地支撐腳161能將外界電磁波或該等訊號端子13上所產生之雜訊宣洩至該電路板之接地端,而予以排除,從而確保該電路板20及其上電子元件(圖中未示)在高頻訊號處理上之訊號完整性(Signal Integrity,簡稱SI);(3)該金屬殼體16尚能保護該絕緣座體10及其中之該等訊號端子13,令其不致因遭遇碰撞而輕易毀損;及 (4)另,該等接地支撐腳161亦能有效支撐該絕緣座體10,且令該絕緣座體10之底面102與該電路板20之頂面間始終能保持在該設計間隙G,以透過該設計間隙G,為該電路板20之頂面及各該訊號端子13的底端13B與周遭冷空氣間提供一能相互對流的空間,從而能有效地達成為該電路板20及該等訊號端子13實現散熱降溫作用之目的。 In addition, since the ground supporting legs 161 are arranged at intervals corresponding to the design gap G in the present creation, the ground supporting legs 161 can be respectively located at the bottom end 13B corresponding to the two adjacent signal terminals 13. The position of the insulating base 10 and the signal terminals 13 therein can be completely enclosed in the grounded metal casing 16 and the grounding support legs 161 to be grounded by the metal casing 16 and the grounding The shielding, guiding, supporting and protecting functions of the supporting legs 161 can effectively achieve the following four functions and purposes: (1) the shielding effect of the covering and enclosing of the metal casing 16 and the grounding supporting legs 161, except The utility model can effectively prevent external electromagnetic waves from causing electromagnetic interference to the high-frequency signals on the signal terminals 13 to generate noise, and can effectively prevent electromagnetic interference between the high-frequency signals on the adjacent signal terminals 13 from being generated. The noise leaks outward, which adversely affects the signal processing accuracy of the electronic components (not shown) on the circuit board 20; (2) the ground support pins 161 can transmit external electromagnetic waves or the signal terminals 13 Produced on The noise is vented to the ground of the board, and is eliminated to ensure the signal integrity of the circuit board 20 and its electronic components (not shown) in high-frequency signal processing (Signal Integrity, SI for short) (3) The metal housing 16 can protect the insulating base 10 and the signal terminals 13 therein so as not to be easily damaged by collision; (4) In addition, the grounding support legs 161 can also effectively support the insulating base 10, and the bottom surface 102 of the insulating base 10 and the top surface of the circuit board 20 can always be maintained in the design gap G to Through the design gap G, a space for convection between the top surface of the circuit board 20 and the bottom end 13B of each of the signal terminals 13 and the surrounding cold air is provided, so that the circuit board 20 and the like can be effectively realized. The signal terminal 13 achieves the purpose of cooling and cooling.
復請參閱第1及2圖所示,在本創作之前述實施例中,該絕緣座體10上尚凹設有至少一嵌卡槽103;另,在該接地金屬外殼16上對應於各該嵌卡槽103之位置處則分別沖壓成形地設有一嵌卡鍵163,該嵌卡鍵163能在受力後向內彎折而嵌卡至對應之該嵌卡槽103內,以確保該接地金屬外殼16能穩固且完全地包覆住該絕緣座體10上除頂面及底面外之其餘表面。再者,為了令該接地金屬外殼16能在該電路板20上,提供該絕緣座體10及其中之該等訊號端子13更穩固且穩定的支撐力,在本創作之前述實施例中,該絕緣座體10之構形可為一呈長方體或正方體之構形,且該接地金屬外殼16底緣上對應於四個彎角之該等接地支撐腳1611的直徑或橫斷面係大於位於其它位置之該等接地支撐腳1612的直徑或橫斷面,又,該等接地支撐腳1611能夠採用焊接方式,固定於對應之接地插孔21,該等接地支撐腳1612則能夠抵靠至對應之接地接點22,但不以此為限。此外,請參閱第3圖所示,為了有效降低該接地金屬外殼16之重量,且能有效提升該高頻連接器1之散熱效果,該接地金屬外殼16之該插接部位164上尚設有複數個開孔1640,各該開孔1640係分別與該容納空間160相連通,以令該接地金屬外殼16內的空氣能與周遭冷空氣相互對流,從而快速降低該絕緣座體10及其中該等訊號端子13之溫度。 Referring to FIGS. 1 and 2, in the foregoing embodiment of the present invention, at least one of the insertion slots 103 is recessed in the insulating base 10; and, corresponding to each of the grounded metal housings 16 At the position of the card slot 103, a snap-in button 163 is formed in the form of a stamping and forming, and the card-locking button 163 can be bent inwardly to be inserted into the corresponding card slot 103 to ensure the grounding. The metal casing 16 can firmly and completely cover the remaining surfaces of the insulating base 10 except for the top surface and the bottom surface. Furthermore, in order to enable the grounded metal casing 16 to be provided on the circuit board 20, the insulating base 10 and the signal terminals 13 therein are provided with a more stable and stable supporting force. In the foregoing embodiment of the present invention, The configuration of the insulating base 10 may be a rectangular parallelepiped or a rectangular parallelepiped configuration, and the diameter or cross section of the ground supporting legs 1611 corresponding to the four corners on the bottom edge of the grounded metal outer casing 16 is larger than that of the other. The ground support legs 1612 of the position may be of a diameter or a cross section, and the ground support legs 1611 may be fixed to the corresponding ground insertion holes 21 by welding, and the ground support legs 1612 can be abutted to the corresponding ones. Ground contact 22, but not limited to this. In addition, as shown in FIG. 3, in order to effectively reduce the weight of the grounded metal casing 16, and effectively improve the heat dissipation effect of the high frequency connector 1, the plugged portion 164 of the grounded metal casing 16 is still provided. a plurality of openings 1640, each of the openings 1640 being in communication with the receiving space 160, so that the air in the grounded metal casing 16 can convect the surrounding cold air, thereby rapidly reducing the insulating body 10 and the The temperature of the signal terminal 13.
復請參閱第3圖所示,在本創作之其它實施例中,為了令該高頻連接器1與該對應之插接頭能更穩固地插接成為一體,共同傳輸高頻訊號,該高頻連接器1尚包括一彈性搭接環17,該彈性搭接環17係由彈性鋼片製成,其硬度及彈性均大於該接地金屬外殼16之硬度及彈性,但是,其厚度則小於該接地金屬外殼16之厚度,復請參閱第3圖所示,該彈性搭接環17的構形係與該接地金屬外殼16之該插接部位164的構形相匹配,並能固定(如:焊接)至該接地金屬外殼16上,在該實施例中,該彈性搭接環17上設有複數個嵌卡鉤170,請參閱第4圖所示,藉由該等嵌卡鉤170能令該彈性搭接環17精準地定位在對應於該接地金屬外殼16之該插接部位164上,該彈性搭接環17上則係利用沖壓成形的技術,分別形成有複數個搭接金手指176,各該搭接金手指176之一端係與該彈性搭接環17相連接,各該搭接金手指176之另一端則係朝彈性搭接環17內彎折且在延伸一預定深度D而形成一彈性臂176A後,再朝彈性搭接環17外彎折而形成一搭接部176T,且各該搭接部係分別對應於各該開孔1640。 Referring to FIG. 3, in other embodiments of the present invention, in order to enable the high-frequency connector 1 and the corresponding plug connector to be more stably plugged together, the high-frequency signal is transmitted together, and the high-frequency signal is transmitted. The connector 1 further includes an elastic lap ring 17 which is made of elastic steel sheet and has hardness and elasticity greater than the hardness and elasticity of the grounded metal shell 16, but the thickness is smaller than the ground. The thickness of the metal casing 16 is as shown in FIG. 3, and the configuration of the elastic overlapping ring 17 is matched with the configuration of the insertion portion 164 of the grounded metal casing 16, and can be fixed (eg, welded). To the grounded metal casing 16, in the embodiment, the elastic overlapping ring 17 is provided with a plurality of embedded hooks 170. As shown in FIG. 4, the elastic hooks 170 can make the elastic The lap ring 17 is accurately positioned on the insertion portion 164 corresponding to the grounded metal casing 16, and the elastic lap ring 17 is formed by a stamping forming technique, and a plurality of overlapping gold fingers 176 are respectively formed. One end of the overlapping gold finger 176 is connected to the elastic overlapping ring 17, each The other end of the overlapping gold finger 176 is bent in the elastic overlapping ring 17 and extends to a predetermined depth D to form a resilient arm 176A, and then bent outwardly to the elastic overlapping ring 17 to form a lap joint. The portion 176T, and each of the overlapping portions corresponds to each of the openings 1640.
如此,俟對應之該插接頭(圖中未示),通過該插接口165,被插接至該高頻連接器1時,該彈性搭接環17上鄰近該插接口165之該等搭接部176T,將因對應之該等彈性臂176A所分別施加之彈性作用力,而能穩固地搭接且抵靠在該插接頭外緣所披覆之金屬殼體外壁,不僅令該高頻連接器1與該對應之插接頭能穩固地插接成為一體,共同傳輸高頻訊號,亦因該接地金屬外殼16與該金屬殼體電氣導通地結合成為一體,而能共同屏蔽該高頻連接器1與該插接頭間相互電氣連接之訊號端子,不僅能有效阻隔外界電磁波對各該訊號端子上高頻訊號造成電磁干擾(EMI)而產生雜訊 (noise),且能有效避免相鄰訊號端子上高頻訊號因電磁干擾(EMI)所產生之雜訊(noise)對周遭電子元件的訊號處理造成負面影響,尚能將該等雜訊宣洩至該電路板之接地端,予以排除,從而確保該電路板及其上電子元件能在高頻訊號處理上維持訊號之穩定性及完整性(Signal Integrity,簡稱SI)。 In this way, the plug connector (not shown) corresponding to the plug is connected to the high frequency connector 1 through the plug connector 165, and the overlap of the elastic strap ring 17 adjacent to the plug connector 165 The portion 176T can firmly overlap and abut against the outer wall of the metal casing covered by the outer edge of the plug joint due to the elastic force applied by the corresponding elastic arms 176A, not only the high frequency connection The connector 1 and the corresponding plug connector can be stably inserted into one body to jointly transmit the high frequency signal, and the grounded metal shell 16 is electrically integrated with the metal shell to be integrated, and the high frequency connector can be shielded together. 1 The signal terminal electrically connected to the plug connector not only effectively blocks external electromagnetic waves from causing electromagnetic interference (EMI) to high frequency signals on the signal terminals, but also generates noise. (noise), and can effectively avoid the noise caused by electromagnetic interference (EMI) on the adjacent signal terminals, which can negatively affect the signal processing of the surrounding electronic components, and can still vent the noise to The ground terminal of the board is eliminated to ensure that the board and its electronic components can maintain the stability and integrity of the signal (Signal Integrity, SI for high frequency signal processing).
最後,為了令業者能夠根據產品的設計需求,彈性地調整其生產製程,以有效地提高整體的生產效率及產品良率,在本創作之其它實施態樣中,該高頻連接器1之結構設計並不侷限於第1~4圖所示之結構,業者亦能根據產品或生產線上的實際需求,調整各該元件的造形、構造及組合關係,甚至,藉由增減各該元件,以有效達成提高整體生產效率及產品良率之目的,在本創作之另一實施例中,請參閱第2圖所示,係透過射出成型的製程,先將該絕緣座體10及該等訊號端子13等元件,製作成為一體,再將由一金屬板材經沖壓成型製成之該接地金屬外殼16,經彎折成形而包覆至該絕緣座體10上除頂側及底側之外緣表面,以令該接地金屬外殼16能與該絕緣座體10穩固地結合成為一體,而具備堅固及穩定之機械結構及特性,然而,在本創作之其它實施例中,亦能視實際的需要,令該絕緣座體10成為由複數個絕緣塑料元件所組合而成者,據此,無論該絕緣座體10係由單一絕緣塑料元件製成之個體,或者,是由複數個絕緣塑料元件個體所組合而成者,只要該絕緣座體10上在對應之位置處分別開設有該等端子槽120,以供分別嵌接各該訊號端子13,具體實現本創作之前述功能及效果,均為本創作在此欲主張保護之高頻連接器1,並予指明。 Finally, in order to enable the industry to flexibly adjust its production process according to the design requirements of the product, in order to effectively improve the overall production efficiency and product yield, in other implementations of the present invention, the structure of the high frequency connector 1 The design is not limited to the structure shown in Figures 1 to 4. The manufacturer can adjust the shape, structure and combination of the components according to the actual needs of the product or the production line, and even by increasing or decreasing each component. For the purpose of improving overall production efficiency and product yield, in another embodiment of the present invention, as shown in FIG. 2, the insulating body 10 and the signal terminals are firstly passed through an injection molding process. 13 and other components are integrally formed, and the grounded metal casing 16 which is formed by stamping and forming a metal plate is bent and formed to cover the outer surface of the insulating seat 10 except for the top side and the bottom side. Therefore, the grounded metal casing 16 can be firmly integrated with the insulating base 10, and has a firm and stable mechanical structure and characteristics. However, in other embodiments of the present invention, it can also be regarded as The need for the insulating base 10 to be a combination of a plurality of insulating plastic components, according to which the insulating base 10 is made of a single insulating plastic component, or a plurality of insulating plastics. The combination of the individual components, as long as the terminal slots 120 are respectively formed at the corresponding positions on the insulating base 10 for respectively engaging the signal terminals 13, thereby realizing the aforementioned functions and effects of the present invention. It is the high frequency connector 1 that is intended to be protected by this creation and is specified.
按,以上所述,僅係本創作之較佳實施例,惟,本創作所主張之權利範圍,並不侷限於此,按凡熟悉該項技藝人士,依據本創作所揭 露之技術內容,可輕易思及之等效變化,均應屬不脫離本創作之保護範疇。 According to the above, it is only a preferred embodiment of the present invention, but the scope of the claims claimed by the present invention is not limited thereto, and according to those skilled in the art, according to the present disclosure The technical content of Lu, the equivalent change that can be easily considered, should not fall within the protection scope of this creation.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW107205128U TWM565900U (en) | 2018-04-19 | 2018-04-19 | High-frequency connector with lapped gold fingers added on grounded metal casing |
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| Application Number | Priority Date | Filing Date | Title |
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| TW107205128U TWM565900U (en) | 2018-04-19 | 2018-04-19 | High-frequency connector with lapped gold fingers added on grounded metal casing |
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| TWM565900U true TWM565900U (en) | 2018-08-21 |
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| TW107205128U TWM565900U (en) | 2018-04-19 | 2018-04-19 | High-frequency connector with lapped gold fingers added on grounded metal casing |
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