TWM565405U - LED light emitting device - Google Patents

LED light emitting device Download PDF

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Publication number
TWM565405U
TWM565405U TW107204439U TW107204439U TWM565405U TW M565405 U TWM565405 U TW M565405U TW 107204439 U TW107204439 U TW 107204439U TW 107204439 U TW107204439 U TW 107204439U TW M565405 U TWM565405 U TW M565405U
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Taiwan
Prior art keywords
light
emitting diode
package
light emitting
led
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TW107204439U
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Chinese (zh)
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黃建中
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大陸商弘凱光電(深圳)有限公司
弘凱光電股份有限公司
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Priority to TW107204439U priority Critical patent/TWM565405U/en
Publication of TWM565405U publication Critical patent/TWM565405U/en

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Abstract

一種LED發光裝置,包含基板、四個發光二極體及封裝體。四個發光二極體分別定義為第一發光二極體、第二發光二極體、第三發光二極體及第四發光二極體,其能分別發出波長610奈米至780奈米、波長500奈米至570奈米、450奈米至495奈米的光束及白光光束。任一個發光二極體的照射範圍能與其餘發光二極體中的至少一個的照射範圍部分重疊。四個發光二極體以多行的形式排列設置於基板。封裝體包覆四個發光二極體設置。第四發光二極體的出光角度小於其他發光二極體的出光角度。當LED發光裝置通電時,四個發光二極體所發出的光束能相互混合而成為混光光束。 An LED lighting device comprises a substrate, four light emitting diodes and a package. The four light-emitting diodes are respectively defined as a first light-emitting diode, a second light-emitting diode, a third light-emitting diode, and a fourth light-emitting diode, which can respectively emit a wavelength of 610 nm to 780 nm, Beams with a wavelength of 500 nm to 570 nm and 450 nm to 495 nm and white light beams. The illumination range of any of the light-emitting diodes may partially overlap the illumination range of at least one of the remaining light-emitting diodes. The four light emitting diodes are arranged in a plurality of rows on the substrate. The package is covered with four light emitting diodes. The light-emitting angle of the fourth light-emitting diode is smaller than the light-emitting angle of the other light-emitting diodes. When the LED lighting device is energized, the light beams emitted by the four light emitting diodes can be mixed with each other to become a mixed light beam.

Description

LED發光裝置 LED lighting device

本創作涉及一種發光裝置,特別是一種LED發光裝置。 The present invention relates to a light emitting device, and more particularly to an LED light emitting device.

隨著相關業者或是消費者對於燈具、顯示器等,所發出的光束的顏色越來越要求,現有以三原色的LED作為光源的燈具、顯示器等,已無法滿足業者或是消費者的需求。 As the related manufacturers or consumers are increasingly demanding the color of the light emitted by the lamps, displays, etc., the existing lamps and displays using the three primary colors of LEDs as the light source have been unable to meet the needs of the industry or consumers.

緣此,本創作人乃潛心研究並配合學理的運用,而提出一種設計合理且有效改善上述問題的本創作。 Therefore, the author is concentrating on research and using the application of theory, and proposes a creation that is reasonable in design and effective in improving the above problems.

本創作的主要目的在於提供一種LED發光裝置,用以改善現有技術中,以三原色LED作為光源的燈具、顯示器等,所呈現出的顏色無法滿足業者或是消費者的需求的問題。 The main purpose of the present invention is to provide an LED lighting device for improving the prior art, such as lamps, displays, and the like using three primary color LEDs as light sources, and the colors presented cannot meet the needs of the industry or the consumer.

為了實現上述目的,本創作提供一種LED發光裝置,其包含:一基板;一第一發光二極體、一第二發光二極體、一第三發光二極體及一第四發光二極體,該第一發光二極體固定設置於該基板,該第一發光二極體能發出波長610奈米至780奈米的光束;該第二發光二極體固定設置於該基板,該第二發光二極體能發出波長500奈米至570奈米的光束;該第三發光二極體固定設置於該基板,該第三發光二極體能發出波長450奈米至495奈米的光束;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體中的任一個的照射範圍能與其餘發光二極體中的至少一個的照射範圍部分重疊;該第四發光二極體固定設置於該基板,該第四發光二極體能發出白光光束;該第一發光二 極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體以多行的形式排列設置於該基板;至少一封裝體,設置於該基板,該封裝體包覆該第一發光二極體、該第二發光二極體、該第三發光二極體及該第四發光二極體,該封裝體在遠離該基板的一側具有一出光面,該第一發光二極體、該第二發光二極體、該第三發光二極體及該第四發光二極體所發出的光束能通過該出光面向外射出;其中,該第四發光二極體的出光角度小於該第一發光二極體的出光角度,該第四發光二極體的出光角度小於該第二發光二極體的出光角度,該第四發光二極體的出光角度小於該第三發光二極體的出光角度;其中,當該LED發光裝置通電時,該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體所發出的光束能相互混合而成為一混光光束。 In order to achieve the above object, the present invention provides an LED lighting device, including: a substrate; a first light emitting diode, a second light emitting diode, a third light emitting diode, and a fourth light emitting diode. The first light emitting diode is fixedly disposed on the substrate, and the first light emitting diode can emit a light beam having a wavelength of 610 nm to 780 nm; the second light emitting diode is fixedly disposed on the substrate, and the second light emitting The diode can emit a light beam having a wavelength of 500 nm to 570 nm; the third light emitting diode is fixedly disposed on the substrate, and the third light emitting diode can emit a light beam having a wavelength of 450 nm to 495 nm; An illumination range of any one of the light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode, and an irradiation range portion of at least one of the remaining light emitting diodes The fourth light-emitting diode is fixedly disposed on the substrate, and the fourth light-emitting diode can emit a white light beam; the first light-emitting diode The polar body, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode are arranged in a plurality of rows on the substrate; at least one package is disposed on the substrate, and the package is disposed on the substrate The first light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode are coated, and the package has a light emitting surface on a side away from the substrate, The light beam emitted by the first light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode can be emitted outward through the light emitting surface; wherein the fourth light emitting diode The light-emitting angle of the body is smaller than the light-emitting angle of the first light-emitting diode, and the light-emitting angle of the fourth light-emitting diode is smaller than the light-emitting angle of the second light-emitting diode, and the light-emitting angle of the fourth light-emitting diode is smaller than the light-emitting angle a light-emitting angle of the third light-emitting diode; wherein, when the LED light-emitting device is energized, the first light-emitting diode, the second light-emitting diode, the third light-emitting diode, and the fourth light-emitting diode The beams emitted by the body can be mixed with each other to form a mixed beam

為了實現上述目的,本創作還提供一種LED發光裝置,其中,LED發光裝置包含:一基板;一第一發光二極體、一第二發光二極體、一第三發光二極體及一第四發光二極體,該第一發光二極體固定設置於該基板,該第一發光二極體能發出波長610奈米至780奈米的光束;該第二發光二極體固定設置於該基板,該第二發光二極體能發出波長500奈米至570奈米的光束;該第三發光二極體固定設置於該基板,該第三發光二極體能發出波長450奈米至495奈米的光束;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體中的任一個的照射範圍能與其餘發光二極體中的至少一個的照射範圍部分重疊;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體以多行的形式排列設置於該基板;至少兩個封裝體,分別定義為一第一封裝體及一第二封裝體,該第一封裝體及該第二封裝體設置於該基板,該第一封裝體包覆該第一發光二極體、該第二發光二極體及該第三發光二極體,該第一封裝體遠離該基板的一側具有一出光面,該第一發光二極體、該第二發光二極體及 該第三發光二極體所發出的光束能通過該第一封裝體的出光面向外射出;該第二封裝體包覆該第四發光二極體,該第二封裝體遠離該基板的一側具有一出光面;該第四發光二極體能發出波長450奈米至495奈米的光束,該第二封裝體中包含有黃色螢光粉,該第四發光二極體所發出的光束能激發黃色螢光粉而由該第二封裝體的出光面向外射出白色光束;其中,當該LED發光裝置通電時,由該第一封裝體的出光面射出的光束及由該第二封裝體的出光面向外射出的光束能相互混合而成為一混光光束。 In order to achieve the above object, the present invention also provides an LED light-emitting device, wherein the LED light-emitting device comprises: a substrate; a first light-emitting diode, a second light-emitting diode, a third light-emitting diode, and a first a fourth light-emitting diode, the first light-emitting diode is fixedly disposed on the substrate, and the first light-emitting diode can emit a light beam having a wavelength of 610 nm to 780 nm; the second light-emitting diode is fixedly disposed on the substrate The second light emitting diode can emit a light beam having a wavelength of 500 nm to 570 nm; the third light emitting diode is fixedly disposed on the substrate, and the third light emitting diode can emit a wavelength of 450 nm to 495 nm. a light beam; an illumination range of the first light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode can be at least equal to at least one of the remaining light emitting diodes The illumination range of the first light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode are arranged in a plurality of rows on the substrate; Two packages, each defined as one a first package body and a second package body are disposed on the substrate, the first package body covering the first light emitting diode, the second light emitting diode, and the second package body a third light emitting diode having a light emitting surface on a side of the first package away from the substrate, the first light emitting diode, the second light emitting diode, and The light emitted by the third light emitting diode can be emitted through the light emitting surface of the first package; the second package covers the fourth light emitting diode, and the second package is away from the side of the substrate Having a light-emitting surface; the fourth light-emitting diode can emit a light beam having a wavelength of 450 nm to 495 nm, and the second package body contains yellow phosphor powder, and the light beam emitted by the fourth light-emitting diode can excite a yellow phosphor and a white light beam emitted from the light-emitting surface of the second package; wherein, when the LED light-emitting device is energized, the light beam emitted from the light-emitting surface of the first package and the light emitted by the second package The outwardly directed beams can be mixed with each other to form a mixed beam.

本創作的有益效果可以在於:使用者可以通過控制輸入四個發光二極體的電流及電壓,能據以細微地調整LED發光裝置所發出的混光光束的亮度及其色溫,從而可滿足相關業者或是消費者對於顏色的要求。 The beneficial effect of the present invention may be that the user can control the current and voltage of the four light-emitting diodes, and can finely adjust the brightness and color temperature of the mixed light beam emitted by the LED light-emitting device, thereby satisfying the correlation. The color or the requirements of the industry or consumer.

為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

1‧‧‧LED發光裝置 1‧‧‧LED lighting device

11‧‧‧第一發光二極體 11‧‧‧First Light Emitting Diode

12‧‧‧第二發光二極體 12‧‧‧Second light-emitting diode

13‧‧‧第三發光二極體 13‧‧‧ Third Light Emitting Diode

14、14’‧‧‧第四發光二極體 14, 14' ‧ ‧ fourth luminous diode

141‧‧‧晶粒結構 141‧‧‧ grain structure

1411‧‧‧出光面 1411‧‧‧Glossy

1412‧‧‧環側面 1412‧‧‧ ring side

20‧‧‧基板 20‧‧‧Substrate

21‧‧‧接腳 21‧‧‧ feet

30‧‧‧封裝體 30‧‧‧Package

30a‧‧‧出光面 30a‧‧‧Glossy

30b‧‧‧環側面 30b‧‧‧ring side

31‧‧‧第一封裝體 31‧‧‧First package

31a‧‧‧出光面 31a‧‧‧Glossy

32、32’‧‧‧第二封裝體 32, 32'‧‧‧ second package

32a‧‧‧出光面 32a‧‧‧Glossy

40‧‧‧不透光封裝體 40‧‧‧Opacity package

50‧‧‧不透光層 50‧‧‧ opaque layer

60‧‧‧燈杯 60‧‧‧light cup

601‧‧‧第一開口 601‧‧‧ first opening

602‧‧‧第二開口 602‧‧‧ second opening

603‧‧‧內側面 603‧‧‧ inside

圖1A為本創作的LED發光裝置的第一實施例的示意圖。 1A is a schematic view of a first embodiment of the LED lighting device of the present invention.

圖1B為本創作的LED發光裝置的第一發光二極體、第二發光二極體及第三發光二極體的示意圖。 FIG. 1B is a schematic diagram of a first light emitting diode, a second light emitting diode, and a third light emitting diode of the LED light emitting device of the present invention.

圖1C為本創作的LED發光裝置的第四發光二極體的示意圖。 1C is a schematic view of a fourth light emitting diode of the LED light emitting device of the present invention.

圖2為本創作的LED發光裝置的第一實施例的俯視圖。 2 is a plan view of a first embodiment of the LED lighting device of the present invention.

圖3為圖1的LED發光裝置沿剖面線Ⅲ切開的剖面示意圖。 3 is a cross-sectional view of the LED lighting device of FIG. 1 taken along section line III.

圖4為本創作的LED發光裝置的第二實施例的示意圖。 4 is a schematic view of a second embodiment of the LED lighting device of the present invention.

圖5為圖4的LED發光裝置沿剖面線V切開的剖面示意圖。 5 is a cross-sectional view of the LED lighting device of FIG. 4 taken along section line V.

圖6為本創作的LED發光裝置的第二實施例於製作過程中的示意圖。 Fig. 6 is a schematic view showing the second embodiment of the LED light-emitting device of the present invention in the manufacturing process.

圖7為本創作的LED發光裝置的第三實施例的示意圖。 Fig. 7 is a schematic view showing a third embodiment of the LED light-emitting device of the present invention.

圖8為本創作的LED發光裝置的第四實施例的示意圖。 Fig. 8 is a schematic view showing a fourth embodiment of the LED light-emitting device of the present invention.

圖9為圖8的俯視圖。 Figure 9 is a plan view of Figure 8.

圖10為本創作的LED發光裝置的第五實施例的示意圖。 Fig. 10 is a schematic view showing a fifth embodiment of the LED light-emitting device of the present invention.

圖11為本創作的LED發光裝置的第六實施例的示意圖。 Figure 11 is a schematic view of a sixth embodiment of the LED lighting device of the present invention.

圖12為圖11的俯視圖。 Figure 12 is a plan view of Figure 11 .

圖13為本創作的LED發光裝置的第七實施例的俯視示意圖。 Fig. 13 is a top plan view showing a seventh embodiment of the LED light-emitting device of the present invention.

以下係藉由特定的具體實例說明本創作之LED發光裝置的實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點與功效。本創作亦可藉由其他不同的具體實例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本創作之精神下進行各種修飾與變更。又本創作之圖式僅為簡單說明,並非依實際尺寸描繪,亦即未反應出相關構成之實際尺寸,先予敘明。以下之實施方式係進一步詳細說明本創作之觀點,但並非以任何觀點限制本創作之範疇。 The following describes an embodiment of the LED lighting device of the present invention by a specific specific example, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification. The present invention may also be implemented or applied by other specific examples. The details of the present specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. The drawing of this creation is only a brief description, and is not depicted in actual size, that is, the actual size of the relevant composition is not reflected, which will be described first. The following embodiments are intended to further explain the scope of this creation, but do not limit the scope of the creation in any way.

請一併參閱圖1A、圖1B、圖1C、圖2及圖3,其為本創作的LED發光裝置的第一實施例的示意圖。如圖所示,LED發光裝置1包含有四個發光二極體、一基板20及一封裝體30。四個發光二極體固定設置於基板20,封裝體30包覆四個發光二極體設置。在實際應用中,圖1A及圖2所示的LED發光裝置1可以作為單一模組,而使用者可以通過連接外露於基板20的多個接腳21,以將各個發光二極體所需的電力輸入;當然,在不同的實施例中,圖1A及圖2所示的基板20可以是電子裝置的電路板中的其中一區域,亦即,LED發光裝置1也可以是直接製作於電子裝置的電路板上。 Please refer to FIG. 1A, FIG. 1B, FIG. 1C, FIG. 2 and FIG. 3, which are schematic diagrams of a first embodiment of the LED light-emitting device of the present invention. As shown in the figure, the LED lighting device 1 includes four LEDs, a substrate 20 and a package 30. The four light-emitting diodes are fixedly disposed on the substrate 20, and the package body 30 is covered with four light-emitting diodes. In practical applications, the LED lighting device 1 shown in FIG. 1A and FIG. 2 can be used as a single module, and the user can connect the plurality of pins 21 exposed on the substrate 20 to select the respective LEDs. The power input; of course, in different embodiments, the substrate 20 shown in FIG. 1A and FIG. 2 may be one of the areas of the circuit board of the electronic device, that is, the LED light-emitting device 1 may also be directly fabricated on the electronic device. On the circuit board.

四個發光二極體分別定義為一第一發光二極體11、第二發光二極體12、一第三發光二極體13及一第四發光二極體14。第一發光二極體11能發出波長610奈米至780奈米的光束,即以肉眼觀之為紅色的光束;第二發光二極體12能發出波長500奈米至570 奈米的光束,即以肉眼觀之為綠色的光束;第三發光二極體13能發出波長450奈米至495奈米的光束,即以肉眼觀之為藍色的光束。第一發光二極體11、第二發光二極體12、第三發光二極體13皆可以為單晶粒結構,而其可以根據需求以任何製造方式製成,並根據需求搭配不同的手段而固定於基板20上,於此不加以限制。 The four light emitting diodes are respectively defined as a first light emitting diode 11, a second light emitting diode 12, a third light emitting diode 13 and a fourth light emitting diode 14. The first light-emitting diode 11 can emit a light beam having a wavelength of 610 nm to 780 nm, that is, a light beam which is red by the naked eye; and the second light-emitting diode 12 can emit a wavelength of 500 nm to 570. The light beam of the nanometer is a green light beam which is viewed by the naked eye; the third light-emitting diode 13 can emit a light beam having a wavelength of 450 nm to 495 nm, that is, a light beam which is blue in the naked eye. The first light-emitting diode 11, the second light-emitting diode 12, and the third light-emitting diode 13 can each have a single-grain structure, and can be fabricated in any manufacturing manner according to requirements, and can be matched with different means according to requirements. It is fixed to the substrate 20 and is not limited thereto.

特別說明的是,如圖1B所示,上述第一發光二極體11、第二發光二極體12及第三發光二極體13,其所發出的光束是可以向任何方向散射,即第一發光二極體11、第二發光二極體12及第三發光二極體13的晶粒結構並未設置有任何遮光的結構。另外,第一發光二極體11、第二發光二極體12及第三發光二極體13的晶粒外型可以是矩形、半球型等,於此不加以限制。 Specifically, as shown in FIG. 1B, the first light-emitting diode 11, the second light-emitting diode 12, and the third light-emitting diode 13 emit light beams that can be scattered in any direction, that is, The grain structure of the light-emitting diode 11, the second light-emitting diode 12, and the third light-emitting diode 13 is not provided with any light-shielding structure. In addition, the crystal shape of the first light-emitting diode 11, the second light-emitting diode 12, and the third light-emitting diode 13 may be a rectangular shape, a hemispherical shape, or the like, and is not limited thereto.

如圖1C所示,第四發光二極體14能發出白光光束,在具體應用中,第四發光二極體14可以由單晶粒結構構成或者是由多晶粒結構所構成,於此不加以限制。第四發光二極體14的晶粒結構141包含一出光面1411及一環側面1412,出光面1411位於晶粒結構141的與基板20相反的一側,環側面1412與出光面1411的周緣相連接,而第四發光二極體14所發出的白光光束,將僅可通過出光面1411向外射出,而白光光束將無法通過環側面1412向外射出。關於第四發光二極體14的具體結構可以是根據需求加以選擇,只要可以發出白光光束皆屬本實施例涵蓋的範圍,舉例來說,第四發光二極體14可以是藍光發光二極體搭配黃色螢光粉的晶粒結構、紫外光發光二極體搭配混和有藍色、綠色、紅色螢光粉的晶粒結構或由藍光發光二極體、紅光發光二極體及藍光發光二極體組成的晶粒結構。 As shown in FIG. 1C, the fourth light-emitting diode 14 can emit a white light beam. In a specific application, the fourth light-emitting diode 14 can be composed of a single-grain structure or a multi-grain structure. Limit it. The grain structure 141 of the fourth LED 14 includes a light-emitting surface 1411 and a ring side surface 1412. The light-emitting surface 1411 is located on the opposite side of the substrate structure 20 from the substrate 20, and the ring-side surface 1412 is connected to the periphery of the light-emitting surface 1411. The white light beam emitted by the fourth light-emitting diode 14 will only be emitted outward through the light-emitting surface 1411, and the white light beam will not be emitted outward through the ring side 1412. The specific structure of the fourth light-emitting diode 14 can be selected according to requirements, as long as the white light beam can be emitted, which is covered by the embodiment. For example, the fourth light-emitting diode 14 can be a blue light-emitting diode. The grain structure of the yellow phosphor powder and the ultraviolet light emitting diode are mixed with the crystal structure of blue, green and red phosphor powder or by the blue light emitting diode, the red light emitting diode and the blue light emitting light The grain structure of the polar body.

請一併參閱圖1B、圖1C及圖3,圖1B顯示為第一發光二極體11、第二發光二極體12、第三發光二極體13的晶粒結構的示意圖;圖1C顯示為第四發光二極體14的晶粒結構的示意圖;圖3顯示為圖1的LED發光裝置1沿剖面線Ⅲ切開的示意圖。第四 發光二極體14的晶粒結構所發出的光束的出光角度,是小於第一發光二極體11(第二發光二極體12或第三發光二極體13)的晶粒結構所發出的光束的出光角度。 Please refer to FIG. 1B , FIG. 1C and FIG. 3 . FIG. 1B is a schematic diagram showing the grain structure of the first LED, the second LED 12 and the third LED 13; FIG. 1C shows A schematic view of the grain structure of the fourth light-emitting diode 14; FIG. 3 is a schematic view of the LED light-emitting device 1 of FIG. 1 cut along section line III. fourth The exit angle of the light beam emitted by the grain structure of the light-emitting diode 14 is smaller than that of the first light-emitting diode 11 (the second light-emitting diode 12 or the third light-emitting diode 13). The angle of light exiting the beam.

如圖2所示,四個發光二極體11、12、13、14是以多行的形式排列設置於基板20,也就是說,四個發光二極體11、12、13、14不是一直線地排列設置於基板20,且任一個發光二極體的照射範圍能與其餘發光二極體中的至少一個的照射範圍的部分重疊;具體來說,如圖2所示,第二發光二極體12的照射範圍可以是與第一發光二極體11、第三發光二極體13的照射範圍的部分相互重疊,第四發光二極體14的照射範圍可以是與第二發光二極體12、第三發光二極體13的照射範圍的部分相互重疊。優選地,四個發光二極體11、12、13、14是以陣列形式設置於基板20,如此,第一發光二極體11、第二發光二極體12、第三發光二極體13及第四發光二極體14所發出的光束,將可混合出相對均勻的混合光束。 As shown in FIG. 2, the four light emitting diodes 11, 12, 13, 14 are arranged in a plurality of rows on the substrate 20, that is, the four light emitting diodes 11, 12, 13, 14 are not in line. Arranged on the substrate 20, and the illumination range of any one of the light-emitting diodes can overlap with a portion of the illumination range of at least one of the remaining light-emitting diodes; specifically, as shown in FIG. 2, the second light-emitting diode The irradiation range of the body 12 may overlap with the portions of the first light-emitting diode 11 and the third light-emitting diode 13 , and the irradiation range of the fourth light-emitting diode 14 may be the second light-emitting diode. 12. The portions of the illumination range of the third light-emitting diode 13 overlap each other. Preferably, the four light emitting diodes 11, 12, 13, 14 are disposed on the substrate 20 in an array, such that the first light emitting diode 11, the second light emitting diode 12, and the third light emitting diode 13 And the light beam emitted by the fourth light-emitting diode 14 can mix a relatively uniform mixed light beam.

封裝體30包覆四個發光二極體11、12、13、14設置,封裝體30可以是透光結構,而四個發光二極體11、12、13、14所發出的光線能通過封裝體30以向外射出。于本實施例中,封裝體30的周圍還設置有一不透光封裝體40,其包覆封裝體30的環側面30b(如圖3所示),而四個發光二極體11、12、13、14所發出的光束,將僅可通過封裝體30的一出光面30a(如圖3所示)向外射出,所述出光面30a位於遠離基板20的一側面。在本實施例中,是在透光的封裝體30週邊設置不透光封裝體40為例,但不以此為限,在不同的應用中,也可以是在透光的封裝體30的環側面以塗布等方式,形成有不透光層。 The package body 30 is provided with four light-emitting diodes 11, 12, 13, and 14. The package body 30 can be a light-transmitting structure, and the light emitted by the four light-emitting diodes 11, 12, 13, and 14 can be packaged. The body 30 is ejected outward. In this embodiment, an opaque package 40 is disposed around the package 30, which covers the ring side 30b of the package 30 (as shown in FIG. 3), and four LEDs 11, 12, The light beams emitted by the semiconductors 13 and 14 can be emitted only through a light-emitting surface 30a (shown in FIG. 3) of the package 30, and the light-emitting surface 30a is located on a side away from the substrate 20. In this embodiment, the opaque package 40 is disposed around the transparent package 30, but not limited thereto. In different applications, the ring of the transparent package 30 may also be used. The side surface is formed with an opaque layer by coating or the like.

另外,所述不透光封裝體40面對于透光的封裝體30環側面30b的一側面,還可以是具有反射結構(例如是反射塗料等),借此,四個發光二極體11、12、13、14所發出的光束,將可被不透光封裝體40的反射結構反射,從而增加四個發光二極體所發出的 光束,由出光面30a射出的出光效率。當然,在不同的應用中,也可以是在設置不透光封裝體40前,先于透光的封裝體30的環側面形成反射結構,而後再于透光的封裝體30的周緣設置不透光封裝體40。 In addition, the opaque package 40 may have a reflective structure (for example, a reflective paint or the like) on one side of the ring side surface 30b of the light-transmissive package 30, whereby the four light-emitting diodes 11 are provided. The light beams emitted by 12, 13, and 14 will be reflected by the reflective structure of the opaque package 40, thereby increasing the emission of the four light-emitting diodes. The light beam, the light extraction efficiency emitted by the light exit surface 30a. Of course, in different applications, before the opaque package 40 is disposed, the reflective structure is formed before the ring side of the transparent package 30, and then the periphery of the transparent package 30 is opaque. Light package 40.

在於透光的封裝體30的環側面30b以塗布等方式,形成有不透光層的實施例中,所述不透光層面對于透光的封裝體30的一側,同樣可以是具有反射光束的功能,藉以,增加四個發光二極體11、12、13、14所發出的光束由出光面30a射出的出光效率。 In the embodiment in which the ring side surface 30b of the light-transmissive package 30 is formed by coating or the like, and the opaque layer is formed, the opaque layer may have a reflected beam for one side of the transparent package 30. The function is to increase the light-emitting efficiency of the light emitted by the four light-emitting diodes 11, 12, 13, 14 from the light-emitting surface 30a.

另外,根據LED發光裝置1的應用方式不同,透光的封裝體30周圍也可以是不設置有不透光封裝體40、不透光層或是相關的反射結構,舉例來說,LED發光裝置1應用為指示燈時,透光的封裝體30的周圍則可不設置有上述不透光封裝體40、不透光層或是相關的反射結構。 In addition, depending on the application mode of the LED light-emitting device 1, the light-transmissive package 30 may be provided with no opaque package 40, an opaque layer or an associated reflective structure. For example, the LED light-emitting device When the application is an indicator light, the opaque package 40, the opaque layer or the related reflective structure may not be disposed around the transparent package 30.

在實際應用中,透光的封裝體30內還可以摻入光擴散粒子(例如PMMA、Silicone等),以使四個發光二極體11、12、13、14所發出的光束更均勻地由出光面30a射出,而使由出光面30a射出的混光光束能有更好的混光表現。值得一提的是,在本實施例中,是以透光的封裝體30為矩形立方體為例,但不以此為限,透光的封裝體30的外型,可以是根據需求進行變化。舉例來說,本實施例的LED發光裝置1可以是作為面光源,而當LED發光裝置1作為指示燈時,透光的封裝體30則可以是呈現為半球狀。 In practical applications, the light-transmissive package 30 may also incorporate light-diffusing particles (for example, PMMA, Silicone, etc.) so that the light beams emitted by the four light-emitting diodes 11, 12, 13, 14 are more uniformly The light-emitting surface 30a is emitted, so that the light-mixed light beam emitted from the light-emitting surface 30a can exhibit a better light-mixing performance. It is to be noted that, in this embodiment, the transparent package 30 is a rectangular cube. However, the shape of the transparent package 30 may be changed according to requirements. For example, the LED lighting device 1 of the present embodiment may be a surface light source, and when the LED lighting device 1 is used as an indicator light, the light-transmitting package 30 may be in a hemispherical shape.

關於上述透光的封裝體30及不透光封裝體40的設置於基板20上的先後順序,於此不加以限制,可以根據需求加以選擇。舉例來說,可以先於基板20上形成有具有凹槽的不透光封裝體40,而後在於不透光封裝體40的凹槽中填入透光封裝膠,以固化形成透光的封裝體30;或者也可以是先形成透光的封裝體30後,再于其周緣形成不透光封裝體40。 The order in which the light-transmitting package 30 and the opaque package 40 are disposed on the substrate 20 is not limited thereto, and may be selected according to requirements. For example, the opaque package 40 having the recess may be formed on the substrate 20, and then the transparent encapsulant is filled in the recess of the opaque package 40 to form a transparent package. 30; Alternatively, the light-emitting package 30 may be formed first, and then the opaque package 40 may be formed on the periphery thereof.

如上所述,四個發光二極體11、12、13、14所分別發出的紅 光光束、綠光光束、藍光光束及白光光束,將可共同由透光的封裝體30的出光面30a射出,並據以相互混合成為一混光光束,而相關的使用者可以通過調整輸入第一發光二極體11的電壓或電流、輸入第二發光二極體12的電壓或電流、輸入第三發光二極體13的電壓或電流及輸入第四發光二極體14的電壓或電流,據以調整由出光面30a射出的混光光束的亮度及色溫等。本創作的LED發光裝置1通過以多行排列方式設置於基板20的四個發光二極體11、12、13、14,使用者可以根據需求,更細微地調出不同色溫的混光光束。 As described above, the red light emitted by the four light-emitting diodes 11, 12, 13, and 14, respectively The light beam, the green light beam, the blue light beam and the white light beam are collectively emitted from the light emitting surface 30a of the light transmissive package 30, and are mutually mixed to form a mixed light beam, and the relevant user can adjust the input. a voltage or current of the light-emitting diode 11, a voltage or current input to the second light-emitting diode 12, a voltage or current input to the third light-emitting diode 13, and a voltage or current input to the fourth light-emitting diode 14, The brightness, color temperature, and the like of the light-mixing light beam emitted from the light-emitting surface 30a are adjusted. The LED light-emitting device 1 of the present invention is provided on the four light-emitting diodes 11, 12, 13, and 14 of the substrate 20 in a plurality of rows, and the user can finely adjust the mixed light beams of different color temperatures according to requirements.

在具體應用中,LED發光裝置1還可以包含有一處理模組(例如是固定設置於基板20的微處理器),其電性連接四個發光二極體11、12、13、14,處理模組能單獨地控制第一發光二極體11、第二發光二極體12、第三發光二極體13及第四發光二極體14的亮度、色溫等,而使用者即可以通過處理模組,以對應控制四個發光二極體11、12、13、14分別的亮度及色溫,據以根據需求調整出不同色溫、亮度的混光光束。 In a specific application, the LED lighting device 1 may further include a processing module (for example, a microprocessor fixedly disposed on the substrate 20) electrically connected to the four LEDs 11, 12, 13, 14 and the processing module. The group can individually control the brightness, color temperature, and the like of the first light-emitting diode 11, the second light-emitting diode 12, the third light-emitting diode 13, and the fourth light-emitting diode 14, and the user can pass the processing mode. The group controls the brightness and color temperature of the four light-emitting diodes 11, 12, 13, and 14 respectively, and adjusts the mixed light beams of different color temperatures and brightness according to the demand.

請一併參閱圖4至圖6,其為本創作的LED發光裝置的第二實施例的示意圖。如圖所示,本實施例與前述實施例最大不同之處在于,LED發光裝置1可以是包含有兩個封裝體30,其分別定義為一第一封裝體31及一第二封裝體32,且第四發光二極體14所產生的光束,不僅是由晶粒結構141的出光面1411(如圖1C所示)射出,而第四發光二極體14所產生的光束是能由晶粒結構141的任何側面向外射出,即,第四發光二極體14所發出的光束路徑與圖1B相似。 Please refer to FIG. 4 to FIG. 6 together, which is a schematic diagram of a second embodiment of the LED lighting device of the present invention. As shown in the figure, the present embodiment is different from the previous embodiment in that the LED light-emitting device 1 can include two packages 30, which are respectively defined as a first package body 31 and a second package body 32. And the light beam generated by the fourth light-emitting diode 14 is not only emitted by the light-emitting surface 1411 of the grain structure 141 (as shown in FIG. 1C), but the light beam generated by the fourth light-emitting diode 14 can be made of crystal grains. Any side of the structure 141 exits outwardly, i.e., the beam path emitted by the fourth LED 14 is similar to that of Figure 1B.

如圖5所示,其顯示為圖4所示的LED發光裝置1沿剖面線V切開後的剖面示意圖。如圖所示,第一發光二極體11(也可以是第二發光二極體12或第三發光二極體13)的出光角度,大致與第四發光二極體14的出光角度相同。 As shown in FIG. 5, it is a schematic cross-sectional view showing the LED light-emitting device 1 shown in FIG. 4 cut along a section line V. As shown in the figure, the light-emitting angle of the first light-emitting diode 11 (which may be the second light-emitting diode 12 or the third light-emitting diode 13) is substantially the same as the light-emitting angle of the fourth light-emitting diode 14.

如圖6所示,第一封裝體31可以是先形成於基板20上,而第一封裝體31對應包覆第一發光二極體11、第二發光二極體12及第三發光二極體13。第一封裝體31的外型可以是根據第一發光二極體11、第二發光二極體12及第三發光二極體13於基板20上的排列方式不同而改變,不以圖中所示類似於L型的外型為限。第一封裝體31為透光的結構,而第一發光二極體11、第二發光二極體12及第三發光二極體13所產生的光束,將能由第一封裝體31的任一側面向外射出。 As shown in FIG. 6 , the first package body 31 may be first formed on the substrate 20 , and the first package body 31 correspondingly covers the first light emitting diode 11 , the second light emitting diode 12 , and the third light emitting diode Body 13. The shape of the first package body 31 may be changed according to the arrangement of the first light emitting diode 11, the second light emitting diode 12 and the third light emitting diode 13 on the substrate 20, not in the figure. It is limited to the appearance of the L-shaped. The first package body 31 has a light transmitting structure, and the light beams generated by the first light emitting diode 11, the second light emitting diode 12, and the third light emitting diode 13 can be used by the first package 31. One side is shot outwards.

在實際應用中,第一封裝體31的環側面(連接出光面31a的周緣),設置有一不透光層50,其可以是以塗布等方式形成于第一封裝體31的環側面,於此不加以限制。不透光層50能阻擋第一發光二極體11、第二發光二極體12及第三發光二極體13所發出的光束向外射出,而第一發光二極體11、第二發光二極體12及第三發光二極體13所發出的光束,將僅能通過第一封裝體31的出光面31a向外射出。與前述實施例相同地,在不同的實施例中,不透光層50還可以是能反射第一發光二極體11、第二發光二極體12及第三發光二極體13所發出的光束。 In practical applications, the ring side surface of the first package body 31 (connecting the periphery of the light exit surface 31a) is provided with an opaque layer 50, which may be formed on the ring side surface of the first package body 31 by coating or the like. No restrictions. The light-impermeable layer 50 can block the light beams emitted by the first light-emitting diode 11, the second light-emitting diode 12, and the third light-emitting diode 13 from being emitted outward, and the first light-emitting diode 11 and the second light-emitting body The light beams emitted from the diodes 12 and the third light-emitting diodes 13 can only be emitted outward through the light-emitting surface 31a of the first package body 31. In the different embodiments, the opaque layer 50 can also reflect the first light-emitting diode 11, the second light-emitting diode 12, and the third light-emitting diode 13 beam.

如圖4及圖5所示,第二封裝體32包覆第四發光二極體14,第二封裝體32遠離基板20的一側面為出光面32a,連接出光面32a的其餘側面則定義為環側面,第二封裝體32的環側面設置有不透光層50,其能防止第四發光二極體14所發出的光束由第二封裝體32非出光面32a的側面向外射出,而第四發光二極體14所發出的光束,將僅可通過第二封裝體32的出光面32a向外射出。與前述不透光層50相同地,設置于第二封裝體32的環側面的不透光層50,除了阻擋第四發光二極體14所發出的光束由環側面向外射出外,不透光層50還可以是能反射第四發光二極體14所發出的光束。 As shown in FIG. 4 and FIG. 5, the second package body 32 covers the fourth LED body 14. The side surface of the second package body 32 away from the substrate 20 is a light-emitting surface 32a, and the remaining side surface of the light-emitting surface 32a is defined as The ring side surface of the second package body 32 is provided with an opaque layer 50, which prevents the light beam emitted by the fourth light-emitting diode 14 from being emitted outward from the side of the non-light-emitting surface 32a of the second package body 32. The light beam emitted from the fourth light-emitting diode 14 can be emitted only through the light-emitting surface 32a of the second package 32. The opaque layer 50 disposed on the side surface of the ring of the second package body 32 is the same as the opaque layer 50 except that the light beam emitted from the fourth light-emitting diode 14 is emitted from the side of the ring. The light layer 50 may also be a light beam that is reflected by the fourth light-emitting diode 14.

如前所述,通過設置于第一封裝體31的環側面的不透光層50 及設置于第二封裝體32的環側面的不透光層50,四個發光二極體11、12、13、14所發出的光束,將被限制由第一封裝體31的出光面31a及第二封裝體32的出光面32a射出。 As described above, the opaque layer 50 is disposed on the side of the ring of the first package body 31. And the opaque layer 50 disposed on the side of the ring of the second package 32, the light beams emitted by the four LEDs 11, 12, 13, 14 are limited by the light-emitting surface 31a of the first package 31 and The light exit surface 32a of the second package 32 is emitted.

在本實施例的圖式中,是以第二封裝體32為矩形體為例,但第二封裝體32的外型也可以是根據需求進行變化,舉例來說,第二封裝體32鄰近于第一封裝體31的出光面31a的部分,可以是呈現為半球狀。第一封裝體31的厚度及第二封裝體32的厚度,可以是如圖中所示大致相同,但不以此為限,在不同的實施例中,也可以是第二封裝體32的厚度,不大於第一封裝體31的厚度。 In the embodiment of the present embodiment, the second package body 32 is a rectangular body, but the shape of the second package body 32 may also be changed according to requirements. For example, the second package body 32 is adjacent to the second package body 32. A portion of the light-emitting surface 31a of the first package 31 may be in a hemispherical shape. The thickness of the first package body 31 and the thickness of the second package body 32 may be substantially the same as shown in the figure, but not limited thereto. In different embodiments, the thickness of the second package body 32 may also be , not greater than the thickness of the first package body 31.

請參閱圖7,其為本創作的LED發光裝置的第三實施例的示意圖。如圖所示,本實施例與前述實施例最大不同之處在于,LED發光裝置1的封裝體30為透光結構,而四個發光二極體11、12、13、14所發出的光束,能通過封裝體30的任一側面向外射出。另外,基板20上還設置有一燈杯60,其兩端分別具有一第一開口601及一第二開口602,第一開口601的口徑小於第二開口602的口徑。如圖所述,燈杯60的側面剖視圖,可以是呈現為中空截錐狀,而第一開口601可以對應套設于LED發光裝置1。燈杯60的內側面603為反射面(或者是具有反射結構),而通過透光的封裝體30向外射出的混光光束,將能被燈杯60的內側面反射,以向第二開口602方向射出。所述燈杯60的外型及其相對于LED發光裝置1的設置方式,不以圖中所示為限,可以是根據需求加以變化。當然,在實際應用中,封裝體30的外型可以是根據需求加以變化,不局限為圖中所示的矩形體。 Please refer to FIG. 7, which is a schematic diagram of a third embodiment of the LED lighting device of the present invention. As shown in the figure, the difference between the embodiment and the foregoing embodiment is that the package 30 of the LED lighting device 1 is a light transmitting structure, and the light beams emitted by the four LEDs 11, 12, 13, 14 are It can be emitted outward through any side of the package 30. In addition, a light cup 60 is disposed on the substrate 20, and a first opening 601 and a second opening 602 are respectively defined at the two ends. The diameter of the first opening 601 is smaller than the diameter of the second opening 602. As shown in the figure, the side cross-sectional view of the lamp cup 60 may be a hollow truncated cone shape, and the first opening 601 may be correspondingly sleeved on the LED lighting device 1. The inner side surface 603 of the lamp cup 60 is a reflective surface (or has a reflective structure), and the mixed light beam emitted outwardly from the transparent package 30 can be reflected by the inner side surface of the lamp cup 60 to the second opening. Shot in the direction of 602. The appearance of the lamp cup 60 and its arrangement with respect to the LED lighting device 1 are not limited to those shown in the drawings, and may be changed as needed. Of course, in practical applications, the appearance of the package 30 may be changed according to requirements, and is not limited to the rectangular body shown in the drawing.

在不同的應用中,LED發光裝置1也可以是不具有封裝體30,而四個發光二極體1、12、13、14是對應位於第一開口601中。 In different applications, the LED lighting device 1 may also have no package 30, and the four LEDs 1, 12, 13, 14 are correspondingly located in the first opening 601.

請一併參閱圖8及圖9,其為本創作的第四實施例的示意圖。如圖所示,本實施例與前述實施例最大不同在於:基板20上設置 有一第一封裝體31、一第二封裝體32’及一不透光封裝體40。不透光封裝體40與基板20共同形成有四個凹槽,四個發光二極體11、12、13、14’對應位於四個凹槽中,第一封裝體31形成于第一發光二極體11、第二發光二極體12及第三發光二極體13所位於的三個凹槽中,第二封裝體32’形成于第四發光二極體14’所位於的凹槽中。第四發光二極體14’可以是能發出波長450奈米至495奈米的光束,即以肉眼觀之為藍色的光束,而第二封裝體32’包含有黃色螢光粉,第四發光二極體14’所發出的光束,能激發黃色螢光粉,而由第二封裝體32’的出光面32a射出白光光束。 Please refer to FIG. 8 and FIG. 9 together, which is a schematic diagram of a fourth embodiment of the present invention. As shown in the figure, the biggest difference between this embodiment and the foregoing embodiment is that the substrate 20 is disposed. There is a first package body 31, a second package body 32' and an opaque package body 40. The opaque package 40 and the substrate 20 are formed with four recesses, and the four LEDs 11, 12, 13, 14' are correspondingly located in the four recesses, and the first package 31 is formed on the first illuminator The second package 32 ′ is formed in the recess in which the fourth light-emitting diode 12 ′ is located, and the second light-emitting diode 12 and the third light-emitting diode 13 are located in the three recesses. . The fourth light-emitting diode 14' may be a light beam capable of emitting a wavelength of 450 nm to 495 nm, that is, a light beam which is blue in the naked eye, and the second package 32' contains yellow phosphor powder, and the fourth The light beam emitted by the light-emitting diode 14' can excite the yellow phosphor, and the white light beam is emitted from the light-emitting surface 32a of the second package 32'.

所述不透光封裝體40所形成的四個凹槽,能阻擋設置於凹槽中的發光二極體11、12、13、14’所發出的光束,向非第一封裝體31的出光面31a或非第二封裝體32’的出光面32a的側面射出,即,各發光二極體11、12、13、14’所發出的光束,無法通過形成各凹槽的側壁向外射出。在本實施例中,是以不透光封裝體40為形成在基板20上的結構體為例,但不以此為限,在不同的實施例中,可以是在基板20形成第一封裝體31後,在第一封裝體31的環側面(與出光面31a周緣相連接的側面)形成有不透光層(類似圖4所示的不透光層50),而後再於基板20上形成包覆第四發光二極體14’的第二封裝體32’(其內包含有黃色螢光粉),最後,再于第二封裝體32’的環側面形成不透光層。換言之,本實施例所述LED發光裝置1的四個發光二極體11、12、13、14’,其所發出的光束僅能通過第一封裝體31的出光面31a或第二封裝體32’的出光面32a向外射出,而無法由其他方向向外射出。當然,在實際應用中,形成凹槽的側壁或是不透光層面面對第一封裝體31或是第二封裝體32’的一側,可以是具有反射的功能,於此不加以限制。 The four recesses formed by the opaque package 40 can block the light emitted by the LEDs 11, 12, 13, 14' disposed in the recesses, and emit light to the non-first package 31. The side surface of the light-emitting surface 32a of the surface 31a or the non-second package 32' is emitted, that is, the light beams emitted from the respective light-emitting diodes 11, 12, 13, 14' cannot be emitted outward through the side walls forming the respective grooves. In this embodiment, the opaque package 40 is exemplified as the structure formed on the substrate 20, but not limited thereto. In different embodiments, the first package may be formed on the substrate 20. After 31, an opaque layer (similar to the opaque layer 50 shown in FIG. 4) is formed on the ring side surface of the first package body 31 (the side surface connected to the periphery of the light exit surface 31a), and then formed on the substrate 20. The second package body 32' (which contains the yellow phosphor powder) covering the fourth light-emitting diode 14' is finally formed, and finally, the opaque layer is formed on the ring side surface of the second package body 32'. In other words, the four light-emitting diodes 11, 12, 13, 14' of the LED lighting device 1 of the present embodiment can only pass the light-emitting surface 31a of the first package body 31 or the second package body 32. The light exiting surface 32a is emitted outwardly and cannot be emitted outward from other directions. Of course, in a practical application, the sidewall of the recess or the side of the opaque layer facing the first package 31 or the second package 32' may have a function of reflection, which is not limited herein.

特別說明的是,在本實施例中,是以不透光封裝體40形成為類似田字型的結構(即具有前述的四個凹槽)為例,但不透光封 裝體40的外型,不以此為限。如圖10所示,在不同的實施例中,不透光封裝體40形成為非田字型的結構。 In particular, in the present embodiment, the opaque package 40 is formed into a structure similar to a field type (ie, having the aforementioned four grooves) as an example, but the light-tight seal is not provided. The shape of the body 40 is not limited thereto. As shown in FIG. 10, in various embodiments, the opaque package 40 is formed in a non-tower structure.

請一併參閱圖11至圖13,圖11及圖12為本創作的LED發光裝置的第六實施例,圖13為本創作的LED發光裝置的第七實施例的示意圖。如圖10所述,LED發光裝置1可以是包含有9個發光二極體,其分別包含有兩個前述的第一發光二極體11、兩個第二發光二極體12、兩個第三發光二極體13及三個第四發光二極體14’;三個第四發光二極體14’可以是一直線地排列設置,而其餘的發光二極體則是並排三個第四發光二極體14’設置,且相同的發光二極體不相鄰設置。於本實施例圖中,是以不透光封裝體40對應形成有9個凹槽,而不透光封裝體40呈現出類似九宮格的外型,且第一封裝體31及第二封裝體32’對應形成於該些凹槽中為例,但不以此為限。 Referring to FIG. 11 to FIG. 13 together, FIG. 11 and FIG. 12 are a sixth embodiment of the LED light-emitting device of the present invention, and FIG. 13 is a schematic view of a seventh embodiment of the LED light-emitting device of the present invention. As shown in FIG. 10, the LED light-emitting device 1 may include nine light-emitting diodes, which respectively include two of the foregoing first light-emitting diodes 11, two second light-emitting diodes 12, and two The three light emitting diodes 13 and the three fourth light emitting diodes 14'; the three fourth light emitting diodes 14' may be arranged in a line, while the remaining light emitting diodes are three fourth light emitting side by side. The diodes 14' are disposed, and the same light-emitting diodes are not adjacently disposed. In the embodiment of the present invention, nine recesses are formed correspondingly to the opaque package 40, and the opaque package 40 exhibits a shape similar to a nine-square grid, and the first package 31 and the second package 32 are provided. ' Correspondingly formed in the grooves as an example, but not limited thereto.

如圖13所示,LED發光裝置1可以是包含有兩個第一發光二極體11、三個第二發光二極體12、三個第三發光二極體13及一個第四發光二極體14,九個發光二極體大致是陣列地排列設置於基板20,而第四發光二極體14對應被其餘的發光二極體所包圍,且相同的發光二極體不相鄰設置。當然,在不同的實施例中,第一發光二極體11、第二發光二極體12及第三發光二極體13的數量,可以是根據需求加以變化,不以圖中所示為限。 As shown in FIG. 13, the LED light-emitting device 1 may include two first light-emitting diodes 11, three second light-emitting diodes 12, three third light-emitting diodes 13, and a fourth light-emitting diode. The body 14 has nine light-emitting diodes arranged substantially in an array on the substrate 20, and the fourth light-emitting diodes 14 are correspondingly surrounded by the remaining light-emitting diodes, and the same light-emitting diodes are not adjacently disposed. Of course, in different embodiments, the number of the first LEDs 11, the second LEDs 12, and the third LEDs 13 may be changed according to requirements, and is not limited to the one shown in the figure. .

如上所述,本創作的LED發光裝置1所包含的發光二極體的數量,可以是根據需求加以變化,不以前述實施例的四個或是本實施例的九個為限。為了使LED發光裝置1能發出較為均勻的混光光束,發光二極體的數量可以是4個、9個、16個、25個以此類推,而發光二極體於基板20上的排列方式則可以對應為2X2、3X3、4X4、5X5以此類推。 As described above, the number of the light-emitting diodes included in the LED light-emitting device 1 of the present invention may be changed according to requirements, and is not limited to four of the foregoing embodiments or nine of the embodiments. In order to enable the LED light-emitting device 1 to emit a relatively uniform light-mixing beam, the number of the light-emitting diodes may be four, nine, sixteen, twenty-five, and the like, and the arrangement of the light-emitting diodes on the substrate 20 Then it can correspond to 2X2, 3X3, 4X4, 5X5 and so on.

值得一提,前述各實施例所述的LED發光裝置可以是以塑封帶引線片式載體(Plastic leaded chip carrier,PLCC)的封裝方式生 產製造,即,LED發光裝置1可以是模組化地設計,而相關使用者則可以快速且方便地將LED發光裝置1固定於所需的電路板。當然,LED發光裝置1不局限于上述的封裝方式,或者也可以是不同的方式直接固定於所需的電路板上。 It is worth mentioning that the LED light-emitting device described in the foregoing embodiments may be formed by a package of a plastic leaded chip carrier (PLCC). The manufacturing, that is, the LED lighting device 1 can be modularly designed, and the related user can quickly and conveniently fix the LED lighting device 1 to the desired circuit board. Of course, the LED lighting device 1 is not limited to the above-described packaging method, or may be directly fixed to a desired circuit board in different manners.

特別說明的是,各圖式中所示的封裝體的厚度及其與各發光二極體之相對比例,皆僅為其中一示範態樣,于實際應用中,封裝體的厚度可以根據需求變化,不以圖中所示為限。另外,本創的LED發光裝置可以根據需求作為各式光源,例如面光源、點光源等,且可應用於各式燈具產品中,例如戶外燈具、投光燈具等,於此不加以限制。 In particular, the thickness of the package shown in each figure and its relative ratio to each of the light-emitting diodes are only one of the exemplary aspects. In practical applications, the thickness of the package can be changed according to requirements. , not limited to the one shown in the figure. In addition, the LED light-emitting device of the present invention can be used as various light sources, such as a surface light source, a point light source, etc., according to requirements, and can be applied to various types of lighting products, such as outdoor lighting, floodlighting, etc., and is not limited herein.

綜上所述,本創作的LED發光裝置,通過四個發光二極體的設計,可以讓使用者能更細緻地調整LED發光裝置投射出的混光光束的亮度、色溫等,而本創作的LED發光裝置具有良好配光效果。 In summary, the LED lighting device of the present invention allows the user to finely adjust the brightness, color temperature, etc. of the mixed light beam projected by the LED light-emitting device through the design of the four light-emitting diodes. The LED lighting device has a good light distribution effect.

以上所述僅為本創作的較佳可行實施例,非因此侷限本創作的專利範圍,故舉凡運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的保護範圍內。 The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

Claims (10)

一種LED發光裝置,其中,該LED發光裝置包含:一基板;一第一發光二極體、一第二發光二極體、一第三發光二極體及一第四發光二極體,該第一發光二極體固定設置於該基板,該第一發光二極體能發出波長610奈米至780奈米的光束;該第二發光二極體固定設置於該基板,該第二發光二極體能發出波長500奈米至570奈米的光束;該第三發光二極體固定設置於該基板,該第三發光二極體能發出波長450奈米至495奈米的光束;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體中的任一個的照射範圍能與其餘發光二極體中的至少一個的照射範圍部分重疊;該第四發光二極體固定設置於該基板,該第四發光二極體能發出白光光束;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體以多行的形式排列設置於該基板;至少一封裝體,設置於該基板,該封裝體包覆該第一發光二極體、該第二發光二極體、該第三發光二極體及該第四發光二極體,該封裝體在遠離該基板的一側具有一出光面,該第一發光二極體、該第二發光二極體、該第三發光二極體及該第四發光二極體所發出的光束能通過該出光面向外射出;其中,該第四發光二極體的出光角度小於該第一發光二極體的出光角度,該第四發光二極體的出光角度小於該第二發光二極體的出光角度,該第四發光二極體的出光角度小於該第三發光二極體的出光角度;其中,當該LED發光裝置通電時,該第一發光二極體、該第二發光二極體、該第三發光 二極體以及該第四發光二極體所發出的光束能相互混合而成為一混光光束。 An LED light-emitting device, wherein the LED light-emitting device comprises: a substrate; a first light-emitting diode, a second light-emitting diode, a third light-emitting diode, and a fourth light-emitting diode; A light-emitting diode is fixedly disposed on the substrate, and the first light-emitting diode can emit a light beam having a wavelength of 610 nm to 780 nm; the second light-emitting diode is fixedly disposed on the substrate, and the second light-emitting diode can Generating a light beam having a wavelength of 500 nm to 570 nm; the third light emitting diode is fixedly disposed on the substrate, and the third light emitting diode can emit a light beam having a wavelength of 450 nm to 495 nm; the first light emitting diode The illumination range of the body, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode may partially overlap the illumination range of at least one of the remaining light emitting diodes; The fourth light emitting diode is fixedly disposed on the substrate, and the fourth light emitting diode can emit a white light beam; the first light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth Light-emitting diodes are arranged in multiple rows The substrate; the at least one package is disposed on the substrate, the package encapsulating the first LED, the second LED, the third LED, and the fourth LED The package has a light-emitting surface on a side away from the substrate, and the light beam emitted by the first light-emitting diode, the second light-emitting diode, the third light-emitting diode, and the fourth light-emitting diode The light emitting angle of the fourth light emitting diode is smaller than the light emitting angle of the first light emitting diode, and the light emitting angle of the fourth light emitting diode is smaller than the second light emitting diode. The light-emitting angle of the fourth light-emitting diode is smaller than the light-emitting angle of the third light-emitting diode; wherein, when the LED light-emitting device is energized, the first light-emitting diode and the second light-emitting diode Body, the third illuminating The light beams emitted by the diode and the fourth light emitting diode can be mixed with each other to form a mixed light beam. 根據申請專利範圍第1項之LED發光裝置,其中,該第四發光二極體為晶粒結構,且該第四發光二極體所發出的光束僅能由晶粒結構的出光面射出。 The LED light-emitting device of claim 1, wherein the fourth light-emitting diode has a grain structure, and the light beam emitted by the fourth light-emitting diode can only be emitted from the light-emitting surface of the grain structure. 根據申請專利範圍第1項之LED發光裝置,其中,該封裝體為一透光結構,該LED發光裝置還包含有一不透光封裝體,該不透光封裝體環繞該封裝體的周緣設置,而使該第一發光二極體、該第二發光二極體、該第三發光二極體及該第四發光二極體所發出的光束僅能通過該出光面射出。 The LED light-emitting device of claim 1, wherein the package is a light-transmitting structure, the LED light-emitting device further comprising an opaque package, the opaque package surrounding the periphery of the package, The light beams emitted by the first light-emitting diode, the second light-emitting diode, the third light-emitting diode, and the fourth light-emitting diode can be emitted only through the light-emitting surface. 根據申請專利範圍第1項之LED發光裝置,其中,該封裝體為一透光結構,該封裝體定義有一環側面,該環側面與該出光面的周緣相連接,該環側面設置有一不透光層,該不透光層能阻止該第一發光二極體、該第二發光二極體、該第三發光二極體或該第四發光二極體所發出的光束向外射出,而該第一發光二極體、該第二發光二極體、該第三發光二極體或該第四發光二極體所發出的光束僅能通過該出光面向外射出。 The LED light-emitting device of claim 1, wherein the package is a light-transmissive structure, the package defines a ring side, the side of the ring is connected to the periphery of the light-emitting surface, and the side of the ring is provided with an impervious surface. a light layer, the opaque layer can prevent the light emitted by the first light emitting diode, the second light emitting diode, the third light emitting diode or the fourth light emitting diode from being emitted outward, and The light beam emitted by the first light emitting diode, the second light emitting diode, the third light emitting diode or the fourth light emitting diode can only be emitted outward through the light emitting surface. 根據申請專利範圍第1項之LED發光裝置,其中,該LED發光裝置包含有兩個該封裝體,兩個該封裝體分別定義為一第一封裝體及一第二封裝體,該第一封裝體包覆該第一發光二極體、該第二發光二極體及該第三發光二極體,該第二封裝體包覆該第四發光二極體;該第一封裝體及該第二封裝體的與該基板相反的一側面為一出光面,環繞該第一封裝體的出光面周緣的環側面設置有一不透光層,環繞該第二封裝體的出光面周緣的環側面設置有另一不透光層,而該第一發光 二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體所發出的光束將僅能通過該第一封裝體的出光面及該第二封裝體的出光面向外射出。 The LED lighting device of claim 1, wherein the LED lighting device comprises two packages, and the two packages are respectively defined as a first package and a second package, the first package Body coating the first light emitting diode, the second light emitting diode and the third light emitting diode, the second package covering the fourth light emitting diode; the first package and the first A side surface of the second package opposite to the substrate is a light exiting surface, and an annular opaque layer is disposed around a ring side of the periphery of the light emitting surface of the first package body, and a ring side surface surrounding the periphery of the light emitting surface of the second package body is disposed There is another opaque layer, and the first illuminating The light beam emitted by the diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode can pass only through the light emitting surface of the first package and the second package. The light is emitted out of the way. 根據申請專利範圍第1項之LED發光裝置,其中,該LED發光裝置還包含有一處理模組,該處理模組電性連接該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體,且該處理模組能單獨控制進入任一個發光二極體的電壓及電流,以改變該LED發光裝置所發出的混光光束的亮度及色溫。 The LED lighting device of claim 1, wherein the LED lighting device further comprises a processing module, the processing module electrically connecting the first LED, the second LED, the first a three-emitting diode and the fourth light-emitting diode, and the processing module can individually control the voltage and current entering any one of the light-emitting diodes to change the brightness and color temperature of the mixed light beam emitted by the LED light-emitting device . 一種LED發光裝置,其中,該LED發光裝置包含:一基板;一第一發光二極體、一第二發光二極體、一第三發光二極體及一第四發光二極體,該第一發光二極體固定設置於該基板,該第一發光二極體能發出波長610奈米至780奈米的光束;該第二發光二極體固定設置於該基板,該第二發光二極體能發出波長500奈米至570奈米的光束;該第三發光二極體固定設置於該基板,該第三發光二極體能發出波長450奈米至495奈米的光束;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體中的任一個的照射範圍能與其餘發光二極體中的至少一個的照射範圍部分重疊;該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體以多行的形式排列設置於該基板;至少兩個封裝體,分別定義為一第一封裝體及一第二封裝體,該第一封裝體及該第二封裝體設置於該基板,該第一封裝體包覆該第一發光二極體、該第二發光二極體及該第三發光二極體,該第一封裝體遠離該基板的一側具有一出光 面,該第一發光二極體、該第二發光二極體及該第三發光二極體所發出的光束能通過該第一封裝體的出光面向外射出;該第二封裝體包覆該第四發光二極體,該第二封裝體遠離該基板的一側具有一出光面;該第四發光二極體能發出波長450奈米至495奈米的光束,該第二封裝體中包含有黃色螢光粉,該第四發光二極體所發出的光束能激發黃色螢光粉而由該第二封裝體的出光面向外射出白色光束;其中,當該LED發光裝置通電時,由該第一封裝體的出光面射出的光束及由該第二封裝體的出光面向外射出的光束能相互混合而成為一混光光束。 An LED light-emitting device, wherein the LED light-emitting device comprises: a substrate; a first light-emitting diode, a second light-emitting diode, a third light-emitting diode, and a fourth light-emitting diode; A light-emitting diode is fixedly disposed on the substrate, and the first light-emitting diode can emit a light beam having a wavelength of 610 nm to 780 nm; the second light-emitting diode is fixedly disposed on the substrate, and the second light-emitting diode can Generating a light beam having a wavelength of 500 nm to 570 nm; the third light emitting diode is fixedly disposed on the substrate, and the third light emitting diode can emit a light beam having a wavelength of 450 nm to 495 nm; the first light emitting diode The illumination range of the body, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode may partially overlap the illumination range of at least one of the remaining light emitting diodes; The first light emitting diode, the second light emitting diode, the third light emitting diode, and the fourth light emitting diode are arranged in a plurality of rows on the substrate; at least two packages are respectively defined as a first package and a second package, the The first package covers the first light emitting diode, the second light emitting diode, and the third light emitting diode, and the first package is disposed on the substrate. The first package covers the first light emitting diode, the second light emitting diode, and the third light emitting diode. a light away from the side of the substrate The light emitted by the first light emitting diode, the second light emitting diode, and the third light emitting diode can be emitted through the light emitting surface of the first package; the second package covers the light a fourth light emitting diode having a light emitting surface on a side of the second package away from the substrate; the fourth light emitting diode emitting a light beam having a wavelength of 450 nm to 495 nm, wherein the second package includes a yellow fluorescent powder, the light beam emitted by the fourth light emitting diode can excite the yellow fluorescent powder and emit a white light beam from the light emitting surface of the second package; wherein when the LED light emitting device is energized, the first light emitting powder The light beam emitted from the light exit surface of the package and the light beam emitted from the light exit surface of the second package body can be mixed to form a mixed light beam. 根據申請專利範圍第7項之LED發光裝置,其中,該LED發光裝置包含有一不透光封裝體,該不透光封裝體設置於該基板,該不透光封裝體與該基板共同形成有四個凹槽,四個該凹槽彼此不相互連通,且形成各個該凹槽的側壁為不透光結構,該第一發光二極體、該第二發光二極體、該第三發光二極體以及該第四發光二極體對應地位於四個該凹槽中,該第二封裝體對應形成於該第四發光二極體所位於的該凹槽,該第一封裝體對應形成于其餘三個該凹槽;其中,該第一發光二極體、該第二發光二極體及該第三發光二極體所分別產生的光束僅能通過相對應的該第一封裝體的出光面向外射出。 The LED light-emitting device of claim 7, wherein the LED light-emitting device comprises an opaque package, the opaque package is disposed on the substrate, and the opaque package is formed with the substrate a recess, the four recesses are not in communication with each other, and the sidewalls of each of the recesses are opaque, the first LED, the second LED, and the third LED The body and the fourth light-emitting diode are correspondingly located in the four recesses, and the second package body is correspondingly formed in the recess in which the fourth light-emitting diode is located, and the first package body is formed correspondingly to the rest. The light beam generated by the first light emitting diode, the second light emitting diode, and the third light emitting diode can only pass through the corresponding light emitting surface of the first package Shoot out. 根據申請專利範圍第7項之LED發光裝置,其中,環繞該第一封裝體的出光面周緣的環側面設置有一不透光層,環繞該第二封裝體的出光面周緣的環側面設置有另一不透光層。 The LED light-emitting device of claim 7, wherein a ring-shaped side surface surrounding a periphery of the light-emitting surface of the first package body is provided with an opaque layer, and a ring side surface surrounding the periphery of the light-emitting surface of the second package body is provided with another An opaque layer. 根據申請專利範圍第7項之LED發光裝置,其中,該LED發光裝置還包含有一處理模組,該處理模組電性連接該第一發光二極體、該第二發光二極體、該第三發光二極體以及該 第四發光二極體,且該處理模組能單獨控制進入任一個發光二極體的電壓及電流,以改變該LED發光裝置所發出的混光光束的亮度及色溫。 The LED lighting device of claim 7, wherein the LED lighting device further comprises a processing module, the processing module electrically connecting the first LED, the second LED, the first Three-emitting diode and the The fourth light emitting diode, and the processing module can individually control the voltage and current entering any one of the light emitting diodes to change the brightness and color temperature of the mixed light beam emitted by the LED light emitting device.
TW107204439U 2018-04-03 2018-04-03 LED light emitting device TWM565405U (en)

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