TWM560801U - Sole using high-viscosity fluid to generate heat by friction - Google Patents

Sole using high-viscosity fluid to generate heat by friction Download PDF

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Publication number
TWM560801U
TWM560801U TW107201973U TW107201973U TWM560801U TW M560801 U TWM560801 U TW M560801U TW 107201973 U TW107201973 U TW 107201973U TW 107201973 U TW107201973 U TW 107201973U TW M560801 U TWM560801 U TW M560801U
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TW
Taiwan
Prior art keywords
heat
viscosity fluid
package module
film
generating insole
Prior art date
Application number
TW107201973U
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Chinese (zh)
Inventor
Teh-Hua Tsai
Pi-Pai Chang
Chih-Hua Hsieh
Hung-Li Hsieh
Original Assignee
Chang Pi Pai
Hsieh Chih Hua
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Chang Pi Pai, Hsieh Chih Hua filed Critical Chang Pi Pai
Priority to TW107201973U priority Critical patent/TWM560801U/en
Publication of TWM560801U publication Critical patent/TWM560801U/en

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Abstract

本新型在於提供一種高黏度流體摩擦生熱鞋墊,該高黏度流體摩擦生熱鞋墊係包括一高黏度流體、一封裝模組、一導熱膜,一隔熱膜,該封裝模組包覆該高黏度流體,該導熱膜位於封裝模組上方、該隔熱膜位於封裝模組下方,人腳踩踏該高黏度流體因形變與模擦產生熱能,熱能由該導熱膜向上傳至人腳,達到增加溫度保暖之功效。 The present invention provides a high-viscosity fluid friction heat-generating insole comprising a high-viscosity fluid, a package module, a heat-conductive film, and a heat-insulating film, and the package module covers the high Viscous fluid, the thermal conductive film is located above the package module, the thermal insulation film is located under the package module, and the high-viscosity fluid is generated by the human foot by the deformation and the die-cutting heat, and the thermal energy is uploaded from the thermal conductive film to the human foot to increase The effect of warming the temperature.

Description

高黏度流體摩擦生熱鞋墊High viscosity fluid friction heat insoles

本新型涉及一種高黏度流體摩擦生熱鞋墊,可依使用者需求而提升鞋墊溫度,而達到足部保暖之功效。 The invention relates to a high-viscosity fluid friction heat-generating insole, which can improve the temperature of the insole according to the needs of the user, and achieve the effect of keeping the foot warm.

傳統的鞋墊,其保溫的設計,主要為以不易導熱的材料,藉以減少熱能散失,達到保暖之功效。 The traditional insole has a heat-insulating design, which is mainly made of materials that are not easily thermally conductive, so as to reduce the loss of heat energy and achieve the effect of keeping warm.

然而,使用者身體肌膚必須產生足夠的體溫,方能適用;倘若使用者的四肢末梢溫度過低,隔熱效果良好的鞋墊,仍然無法禦寒。 However, the user's body skin must produce sufficient body temperature before it can be applied; if the user's limbs are too cold, the insole with good insulation will not be able to keep out the cold.

傳統的鞋墊,亦有採取電能加熱者,然其溫度控制欠佳,有溫度過高或過低之虞,危及使用者的安全。並且需要外接電池,體積大過於笨重,降低使用者的便利性。 The traditional insole is also heated by electric energy, but its temperature control is not good, and the temperature is too high or too low, endangering the safety of the user. And need an external battery, the volume is too bulky, reducing the convenience of the user.

故傳統的鞋墊或會產生熱能者,仍有前述的問題有待改善,成為本新型欲改進的目的。 Therefore, the traditional insole may generate heat, and the above problems still need to be improved, which is the purpose of the present invention.

有鑑於先前技術所存在的問題,本創作乃提供一種高黏度流體摩擦生熱鞋墊,可依使用者需求提升溫度,以達到足部保暖的功效。 In view of the problems of the prior art, the present invention provides a high-viscosity fluid friction heat-generating insole, which can be heated according to the user's demand to achieve the warmth of the foot.

為達上述目的,本創作之高黏度流體摩擦生熱鞋墊,為解決上述問題及達到本新型的目的,本新型的技術手段,為一種高黏度流體摩 擦生熱鞋墊,其特徵在於:所述生熱鞋墊(100),其包括有一高黏度流體(1);以及一封裝模組(2);所述封裝模組(2)包覆該高黏度流體(1),而形成密閉空間;所述高黏度流體(1)為具接受動能產成熱能者。 In order to achieve the above purpose, the present invention relates to a high-viscosity fluid friction heat-generating insole. In order to solve the above problems and achieve the purpose of the present invention, the technical means of the present invention is a high-viscosity fluid friction. The heat-insulating insole is characterized in that: the heat-generating insole (100) comprises a high-viscosity fluid (1); and a package module (2); the package module (2) covers the high-viscosity The fluid (1) forms a confined space; the high-viscosity fluid (1) is a person who receives kinetic energy to generate thermal energy.

優選的是,所述生熱鞋墊(100),其還包括一隔熱膜(4),該隔熱膜(4)位於該封裝模組(2)下部,該隔熱膜(4)阻絕熱能向下傳導;所述生熱鞋墊(100),其還包括一導熱膜(3),而該導熱膜(3)位於該封裝模組(2)上部,該封裝模組(2)夾設於該導熱膜(3)與隔熱膜(4)之間,而該導熱膜(3)向上導熱。 Preferably, the heat generating insole (100) further includes a heat insulating film (4) located at a lower portion of the package module (2), the heat insulating film (4) blocking heat energy The heat generating insole (100) further includes a heat conductive film (3), and the heat conductive film (3) is located at an upper portion of the package module (2), and the package module (2) is sandwiched between The heat conductive film (3) is interposed between the heat shielding film (3) and the heat conductive film (3).

優選的是,所述導熱膜(3)為熱傳性良好彈性聚合物的薄膜者。 Preferably, the heat conductive film (3) is a film of a heat transferable elastic polymer.

優選的是,所述隔熱膜(4)為隔絕熱傳之彈性聚合物的薄膜者。 Preferably, the heat insulating film (4) is a film that insulates the heat-transferring elastic polymer.

與現有技術相比,本新型的效果如下所示: Compared with the prior art, the effects of the present invention are as follows:

第一點:本新型中,通過高黏度流體(1)及封裝模組(2)的配合,溫度上升合宜安全性高,不需要額外的電源與控制電路,而且最重要的是,不容易故障,耐衝擊性佳。 The first point: In this new type, the high temperature fluid (1) and the package module (2) are combined to ensure high temperature rise, no additional power supply and control circuit, and most importantly, not easy to malfunction. Good impact resistance.

第二點:本新型中,生熱鞋墊中的高黏度流體(1),受到封裝模組(2上的人體重力摩擦,會產生熱能,相較於習知的鞋墊,安全性高,且不需要外加電池,彈性亦充足,舒適性與便利性皆佳。 The second point: In the present invention, the high-viscosity fluid (1) in the heat-generating insole is subjected to the friction of the human body by the package module (2, which generates heat energy, which is safer than the conventional insole, and is not Need to add batteries, flexibility is also sufficient, comfort and convenience are good.

1‧‧‧高黏度流體 1‧‧‧High viscosity fluid

2‧‧‧封裝模組 2‧‧‧Package Module

3‧‧‧導熱膜 3‧‧‧thermal film

4‧‧‧隔熱膜 4‧‧‧Insulation film

100‧‧‧生熱鞋墊 100‧‧‧heating insoles

第1圖:本新型高黏度流體摩擦生熱鞋墊的系統架構圖。 Figure 1: System architecture diagram of the new high-viscosity fluid friction heat-generating insole.

第2圖:本新型高黏度流體摩擦生熱鞋墊的系統細部方塊圖。 Figure 2: System block diagram of the new high-viscosity fluid friction heat-generating insole.

第3圖:本新型高黏度流體摩擦生熱鞋墊的立體示意圖。 Figure 3: A three-dimensional schematic diagram of the novel high-viscosity fluid friction heat-generating insole.

第4圖:本新型高黏度流體摩擦生熱鞋墊的剖視圖。 Figure 4: A cross-sectional view of the novel high viscosity fluid friction heat generating insole.

以下依據圖面所示的實施例詳細說明如後:如第1圖所示,揭示出一種高黏度流體摩擦生熱鞋墊,其特徵在於:所述生熱鞋墊(100),其包括有一高黏度流體(1);以及一封裝模組(2);所述封裝模組(2)包覆該高黏度流體(1),而形成密閉空間;所述高黏度流體(1)為具接受摩擦力產成熱能者。 The following is a detailed description of the following embodiments according to the drawings: as shown in FIG. 1, a high-viscosity fluid friction heat-generating insole is disclosed, characterized in that the heat-generating insole (100) includes a high viscosity. a fluid (1); and a package module (2); the package module (2) encloses the high-viscosity fluid (1) to form a closed space; the high-viscosity fluid (1) is capable of receiving friction Produce heat.

其中,通過高黏度流體(1)及一封裝模組(2)的配合,形成一生熱系統,產生的熱能不會太大,溫度上升合宜,安全性高,不需要額外的電源與控制電路。 Among them, through the cooperation of the high viscosity fluid (1) and a package module (2), a heat generating system is formed, the generated heat energy is not too large, the temperature rises properly, the safety is high, and no additional power supply and control circuit are needed.

如第1圖所示,本新型高黏度流體摩擦生熱鞋墊,通過高黏度流體(1)及封裝模組(2)組成生熱鞋墊(100),組件簡單,能降低成本,便於生產,同時更能將故障率降至最低。 As shown in Fig. 1, the novel high-viscosity fluid friction heat-generating insole comprises a high-viscosity fluid (1) and a package module (2) to form a heat-generating insole (100), which is simple in assembly, can reduce cost and is convenient for production, and at the same time It is better to minimize the failure rate.

如第2圖及第3圖所示,所述生熱鞋墊(100),其還包括一隔熱膜(4),該隔熱膜(4)位於該封裝模組(2)下部;所述生熱鞋墊(100),其還設有一導熱膜(3),而該導熱膜(3)位於該封裝模組(2)上部,該封裝模組(2)夾設於該導熱膜(3))與隔熱膜(4)之間。 As shown in FIG. 2 and FIG. 3, the heat generating insole (100) further includes a heat insulating film (4) located at a lower portion of the package module (2); The heat generating insole (100) is further provided with a heat conducting film (3), and the heat conducting film (3) is located at an upper portion of the package module (2), and the package module (2) is sandwiched between the heat conducting film (3) ) and the thermal insulation film (4).

上述中,高黏度流體(1)受到封裝模組(2)上的人體重力摩擦而產生熱能,以達到提升鞋墊溫度的功效,相較於習知的鞋墊,溫度合宜上升,無溫度過高或過低之虞,使用者的安全保障高,不需要外加電池與控制電路,此外彈性充足,達到舒適與便利。 In the above, the high-viscosity fluid (1) is subjected to the friction of the human body on the package module (2) to generate heat energy, so as to improve the temperature of the insole. Compared with the conventional insole, the temperature is suitable to rise, and the temperature is not too high or Too low, the user's safety is high, no need to add batteries and control circuits, in addition to sufficient flexibility to achieve comfort and convenience.

以上依據圖式所示的實施例詳細說明本新型的構造、特徵及作用效果;惟以上所述僅為本新型之較佳實施例,但本新型不以圖面所示限定實施範圍,因此舉凡與本新型意旨相符的修飾性變化,只要在均等效果的範圍內都應涵屬於本新型專利範圍內。 The structure, features and effects of the present invention are described in detail above with reference to the embodiments shown in the drawings. However, the above description is only a preferred embodiment of the present invention, but the present invention does not limit the scope of implementation as shown in the drawings. Modification changes consistent with the meaning of the present invention are intended to fall within the scope of the present invention as long as they are within the scope of equal effect.

Claims (4)

一種高黏度流體摩擦生熱鞋墊,其特徵在於:所述生熱鞋墊(100),其包含有一高黏度流體(1);以及一封裝模組(2);所述封裝模組(2)包覆該高黏度流體(1)而形成密閉空間;所述高黏度流體(1)為具接受人體腳踩之動能產成熱能者。 A high viscosity fluid friction heat generating insole characterized by: the heat generating insole (100) comprising a high viscosity fluid (1); and a packaging module (2); the packaging module (2) package The high-viscosity fluid (1) is covered to form a sealed space; the high-viscosity fluid (1) is a heat-generating body that receives the kinetic energy of the human foot. 如請求項1所述的高黏度流體摩擦生熱鞋墊,其中:所述生熱鞋墊(100),其還設有一隔熱膜(4),而該隔熱膜(4)位於該封裝模組(2)下部;所述生熱鞋墊(100),其還設有一導熱膜(3),而該導熱膜(3)位於該封裝模組(2)上部,該封裝模組(2)夾設於該導熱膜(3)與隔熱膜(4)之間。 The high-viscosity fluid friction heat-generating insole according to claim 1, wherein: the heat-generating insole (100) is further provided with a heat-insulating film (4), and the heat-insulating film (4) is located in the package module. (2) a lower portion; the heat generating insole (100) further comprising a heat conductive film (3), wherein the heat conductive film (3) is located at an upper portion of the package module (2), and the package module (2) is disposed Between the heat conductive film (3) and the heat insulating film (4). 如請求項2所述的高黏度流體摩擦生熱鞋墊,其中:所述導熱膜(3)為熱傳性良好彈性聚合物的薄膜者。 The high viscosity fluid friction heat generating insole according to claim 2, wherein the heat conductive film (3) is a film of a heat transferable elastic polymer. 如請求項3所述的高黏度流體摩擦生熱鞋墊,其中:所述隔熱膜(4)為隔絕熱傳之彈性聚合物的薄膜者。 The high-viscosity fluid friction heat-generating insole according to claim 3, wherein the heat-insulating film (4) is a film that blocks heat-transferring elastic polymer.
TW107201973U 2018-02-08 2018-02-08 Sole using high-viscosity fluid to generate heat by friction TWM560801U (en)

Priority Applications (1)

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TW107201973U TWM560801U (en) 2018-02-08 2018-02-08 Sole using high-viscosity fluid to generate heat by friction

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TWM560801U true TWM560801U (en) 2018-06-01

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