TWM560010U - Integrated modular optical distance sensing component - Google Patents

Abstract

An integrated modular optical distance sensing component integrates an IR LED and a photosensitive chip on an integrated die holder to achieve an integrated modular optical distance sensing component; the integrated die holder has an IR LED Reflecting cup, the reflective cup can cause the IR LED to deviate from the yoke of the photosensitive chip to prevent infrared noise from interfering with the photosensitive chip 16, and the optical cup can increase the light intensity of the IR LED and reduce the illumination angle, and reduce the infrared light passing. The loss of the optical lens; in addition, the height of the IR LED and the photosensitive chip can be individually adjusted according to the needs of the mold of the integrated mold base, thereby obtaining the best matching position.

Description

Integrated modular optical distance sensing component

This creation is related to the optical distance sensing component, and more specifically, an integrated modular optical distance sensing component that encapsulates an infrared light emitting diode (IR LED) and a photosensitive chip in a mold base.

When the smart phone is brought close to the user's ear, by detecting the user's proximity, the smart phone will turn off the display backlight and the touch screen to save battery life and help prevent the touch screen from being accidentally touched. Gesture detection uses the same set of components to allow smart phones to recognize simple gestures such as scrolling and button selection. The proximity and the gesture detection are achieved by the optical distance sensing unit, and the optical distance sensing unit generally includes an optical sensor and an infrared light emitting diode (hereinafter referred to as an IR LED). As shown in the first figure, the conventional optical distance sensing unit separates the IR LED from the optical sensor on one substrate. The problem that is more likely to occur is that the distance between the IR LED and the sensor is very close, so that a small amount of IR LED The light is emitted directly to the sensor and suppresses the reflected light from the detected object. In order to solve this problem, the barrier 3 is disposed between the IR LED 1 and the sensor 2, but the spacing between the substrate 4 and the mobile phone glass panel 5 is extremely small, and the air gap needs to be maintained in a small pitch, and the barrier is not suitable. Limitations such as contact with the glass panel result in the height of the barrier 3 not being able to reliably block the IR LED from interfering with the reflected light.

As shown in the first figure, in addition, in order to match the mobile phone installation environment, adjust the IR LED and sense The distance between the detector and the glass panel of the mobile phone, changing the angle of illumination, etc., the IR LED 1 and the sensor 2 are integrally padded with the height block 6, but cannot be separately for the IR LED 1 or the sensor 2 The height adjustment is not possible, and the precise height is not obtained, so it is difficult to obtain the best fit position.

This creation is to solve the problems described in the prior art.

The integrated modular optical distance sensing component that solves the above problems comprises: an integrated mold base comprising a light cup and a chip carrying groove; the light cup and the chip carrying groove are adjacent to each other a light-emitting diode chip is encapsulated in the bottom of the cup, and a photosensitive chip is encapsulated in the chip carrying groove; the light cup has an off-angle light output of the infrared light-emitting diode chip a tilting angle; the infrared light emitting diode chip generates a first mating height through the bottom of the cup to the bottom surface of the integrated mold base; the photosensitive chip generates a through the bottom of the chip carrying groove of the chip to the bottom surface of the integrated mold base a second mating height; the first mating height and the second mating height may be the same or different.

Preferably, the tilt angle of the light cup is 1-25 degrees.

Preferably, the first mating height may be smaller than the second mating height.

Preferably, the first mating height may be greater than the second mating height.

Further, the cup bottom of the light cup has a focal length adjusting groove, and the infrared light emitting diode chip is fixed to the bottom of the focal length adjusting groove by a conductive adhesive.

In the preferred embodiment of the present invention, the first mating height is formed by the bottom of the focal length adjusting groove to the bottom surface of the integrated mold base.

In a preferred embodiment of the present invention, the integrated mold base includes a length and a width, the length being 2-4 mm and the width being 1-2.5 mm.

In a preferred embodiment of the present invention, the integrated mold base includes a total height, and the ratio of the first mating height to the total height is 1:2.5 to 1:3.5.

In a preferred embodiment of the present invention, the integrated mold base includes a total height, and the ratio of the second mating height to the total height is 1:1.5 to 1:2.5.

In a preferred embodiment of the present invention, the ratio of the first mating height to the second mating height is 1:1.3 to 1:1.5.

The effect of this creation: the integrated mold base is made of precision plastic injection molding. This creation integrates the IR LED and the sensor chip on the integrated die holder to achieve the purpose of integrating the modularized optical distance sensing component.

The cup side of the reflective cup is a curved surface design, and the IR LED is deflected from the yaw angle of the photosensitive chip by the tilt angle of 1-25 degrees to avoid infrared light noise interfering with the photosensitive chip, thereby eliminating the previous The "barrier" and related issues described in the technology.

The physical partition between the light cup and the chip carrying groove of the present invention also has the function of blocking infrared light from interfering with the photosensitive chip.

Because the integrated mold base adopts precision plastic injection molding, the first matching height and the second matching height can be individually adjusted for the IR LED and the photosensitive chip according to the use requirements, thereby obtaining the best matching position and eliminating the prior art. The "high block" described.

By using the focal length adjusting groove, the purpose of improving the light intensity and reducing the light-emitting angle is achieved, the light loss caused by the light passing through the optical lens is reduced, and the infrared light is prevented from interfering with the photosensitive chip.

This creation greatly reduces the volume of the optical sensing component by 40% to 50%, and controls the component size according to the requirements within the above data and ratio range. Compared to the prior art, this creation has a wider range of applications and fields.

10‧‧‧Integrated mold base

11‧‧‧ bottom

12‧‧‧ light cup

122‧‧‧ cup bottom

123‧‧‧focal length adjustment slot

13‧‧‧chip carrier

131‧‧‧ bottom

14‧‧‧Physical division

15‧‧‧Infrared LED chip / IR LED

16‧‧‧Photosensitive chip

θ ‧‧‧ tilt angle

H‧‧‧ total height

H1‧‧‧First mating height

H2‧‧‧second mating height

L‧‧‧ length

W‧‧‧Width

The first figure is a schematic diagram of a conventional optical distance sensing unit.

The second figure is a three-dimensional appearance of the creative light distance sensing unit.

The third figure is a top view of the creative light distance sensing unit.

The fourth figure is a cross-sectional view of the IV-IV of the third figure.

The fifth figure is a cross-sectional view of the light cup of the creative light distance sensing unit.

The sixth figure is a schematic diagram of the emitted light and the reflected light of the creative light distance sensing unit.

In order to facilitate the explanation of the central idea expressed in the column of the above novel content, it is expressed by a specific embodiment. Various items in the embodiments are depicted in terms of ratios, dimensions, amounts of deformation, or displacements that are suitable for illustration, and are not drawn to the proportions of actual elements, as set forth above.

As shown in the second to fourth embodiments, an integrated modular optical distance sensing component includes: an integrated mold base 10, the integrated mold base 10 includes a light cup 12 and a chip carrying slot 13; the light cup 12 And the chip carrying slot 13 is disposed adjacent to the chip carrying slot 13 and has a physical partition 14 therebetween; the cup bottom 122 of the light cup 12 has a focal length adjusting slot 123, and the infrared adjusting LED is fixed by a conductive adhesive in the focal length adjusting slot 123. A chip 15 (hereinafter referred to as an IR LED) in which a photosensitive chip 16 is packaged. The packaging and conduction of the IR LED 15 and the photosensitive chip 16 are conventional and arranged as the case may be.

The integrated mold base 10 includes a length L and a width W. In the preferred embodiment disclosed herein, the length L is 2-4 mm and the width W is 1-2.5 mm.

The light cup 12 has an inclination angle θ which causes the IR LED 15 to emit light at an off angle. The angle of inclination is 1-25 degrees. The oblique direction of the light cup 12 includes, but is not limited to, a direction away from the photosensitive chip 16.

The IR LED 15 generates a first mating height H1 through the focal length adjusting slot 123 to the bottom surface 11 of the integrated die holder 10. The photosensitive chip 16 generates a second mating height H2 through the groove bottom 131 of the chip carrying groove 13 to the bottom surface 11 of the integrated die holder 10. The first mating height H1 and the second mating height H2 may be the same or different; if the latter, the first mating height H1 is smaller than the second mating height H2; however, the first fit is not excluded in the present creation. The height H1 is greater than the feasibility of the second mating height H2.

In the preferred embodiment disclosed in the present application, the integrated mold base 10 includes a total height H, and the ratio of the first mating height H1 to the total height H is 1:2.5 to 1:3.5. The ratio of the second mating height H2 to the total height is 1:1.5 to 1:2.5. The ratio of the first mating height H1 to the second mating height H2 is 1:1.3 to 1:1.5.

As shown in the sixth figure, the integrated mold base 10 is injection molded from precision plastic. In this creation, the IR LED 15 and the sensor chip 16 are integrated on the integrated die holder 10 to achieve the purpose of integrating the modular light distance sensing component. The reflective cup 12 is designed to cause the IR LED 15 to deviate from the yaw angle of the photosensitive chip 16 (such as arrow A) by the aforementioned inclination angle θ of 1-25 degrees, so as to prevent infrared light noise from interfering with reflected light (such as The arrow B) and the sensor chip 16 can thereby eliminate the "barrier" and related problems described in the prior art. Moreover, the physical partition 14 between the optical cup 12 and the chip carrying slot 13 of the present invention also has the function of blocking infrared light from interfering with the photosensitive chip 16.

Because the integrated mold base 10 adopts precision plastic injection molding, the first matching height H1 and the second matching height H2 can be individually adjusted for the IR LED 15 and the photosensitive chip 16 according to the use requirements, thereby obtaining the best matching position. And the "high block" described in the prior art is dispensed with.

The focal length adjusting groove 123 is used for the purpose of increasing the light intensity and reducing the light-emitting angle, reducing the light loss caused by the light passing through the optical lens, and also preventing the infrared light from interfering with the photosensitive chip 16.

This creation greatly reduces the volume of the optical sensing component by 40% to 50%, and controls the component size according to the requirements within the above data and ratio range. Compared to the prior art, this creation has a wider range of applications and fields.

Claims (10)

An integrated modular optical distance sensing component, comprising: an integrated mold base, the integrated mold base comprises a light cup and a chip carrying groove; the light cup is adjacent to the chip carrying groove, and has a solid body therebetween An infrared light emitting diode chip is encapsulated in the bottom of the cup, and a photosensitive chip is encapsulated in the carrying groove of the light cup; the light cup has an inclined angle for causing the infrared light emitting diode chip to generate off-angle light; The infrared light emitting diode chip generates a first matching height through the bottom of the cup to the bottom surface of the integrated mold base; the photosensitive chip generates a second matching height through the groove bottom of the chip bearing groove to the bottom surface of the integrated mold base; The first mating height and the second mating height may be the same or different. The integrated modular optical distance sensing component of claim 1, wherein the tilt angle is 1-25 degrees. The integrated modular optical distance sensing component of claim 1, wherein the first mating height is less than the second mating height. The integrated modular optical distance sensing component of claim 1, wherein the first mating height is greater than the second mating height. The integrated modular optical distance sensing component of claim 1, wherein the cup bottom of the light cup has a focal length adjusting groove, and the infrared light emitting diode chip is fixed to the bottom of the focal length adjusting groove. The integrated modular optical distance sensing component of claim 5, wherein the first mating height is formed by a groove bottom of the focal length adjusting groove to a bottom surface of the integrated die base. The integrated modular optical distance sensing component of claim 1, wherein the integrated die holder comprises a length and a width, the length being 2-4 mm, and the width being 1-2.5 mm. The integrated modular optical distance sensing component of claim 1, wherein the integrated mold base comprises a total height, and the ratio of the first mating height to the total height is 1:2.5 to 1:3.5. The integrated modular optical distance sensing component of claim 1, wherein the integrated mold base comprises a total height, and the ratio of the second mating height to the total height is 1:1.5 to 1:2.5. The integrated modular optical distance sensing component of claim 1, wherein a ratio of the first mating height to the second mating height is 1:1.3 to 1:1.5.