TWM557960U - Supporting module - Google Patents

Supporting module Download PDF

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Publication number
TWM557960U
TWM557960U TW106214991U TW106214991U TWM557960U TW M557960 U TWM557960 U TW M557960U TW 106214991 U TW106214991 U TW 106214991U TW 106214991 U TW106214991 U TW 106214991U TW M557960 U TWM557960 U TW M557960U
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TW
Taiwan
Prior art keywords
support
module
supporting
present
electronic component
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TW106214991U
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Chinese (zh)
Inventor
李青
柯順原
鼎權 黄
健廷 許
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華碩電腦股份有限公司
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Priority to TW106214991U priority Critical patent/TWM557960U/en
Publication of TWM557960U publication Critical patent/TWM557960U/en

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Abstract

A supporting module used to support an electronic element of an electronic device is provided. The electronic device also has a case. The supporting module includes a body and a support element. The body has a fixed portion and a support portion, wherein the fixed portion is adapted to connect to the case. The support element is detachably connected to the supporting portion to contact the electronic element, and the support element is located between the supporting portion and electronic element.

Description

支撐模組Support module

本新型創作是有關於一種支撐結構,且特別是有關於一種支撐模組。 The novel creation relates to a support structure, and in particular to a support module.

在一般桌上型電腦的主機中,會在主機板上搭配顯示卡以增進電腦的顯示效能。對一些電腦玩家或測試人員而言,更可能會在主機板上搭配多張顯示卡、音效卡或者是其他類型的擴充卡,藉以求得較高的運作效能。然而,當主機板的插槽上配置了較為厚重的擴充卡時,例如高階顯示卡,由於擴充卡本身重量分佈不平均,往往因受重力因素造成擴充卡的彎折,進而造成擴充卡的的損壞。此外,插槽內用以和擴充卡電性連接的針腳也因為單邊的受力不平均,導致受力較大的針腳容易產生彈性疲乏而無法與擴充卡上的連接介面(例如金手指)之間形成良好的電性接觸關係,進而影響兩者間的訊號傳輸,更嚴重者,還會造成插槽的毀損而無法使用。 In the host computer of a general desktop computer, a display card is provided on the motherboard to improve the display performance of the computer. For some computer gamers or testers, it is more likely to have multiple display cards, sound cards or other types of expansion cards on the motherboard for higher performance. However, when a thicker expansion card is disposed on the slot of the motherboard, such as a high-order display card, the expansion card itself is unevenly distributed, and the expansion card is often bent due to gravity factors, thereby causing the expansion card. damage. In addition, the pins in the slot for electrically connecting to the expansion card are also unevenly affected by the unilateral force, so that the pins with high force are prone to elastic fatigue and cannot be connected to the interface on the expansion card (such as a gold finger). A good electrical contact relationship is formed, which in turn affects the signal transmission between the two, and more seriously, the slot is damaged and cannot be used.

因此,在市面上常有額外販售的支撐架以加強上述擴充卡的支撐性進而避免其彎折並損毀。但目前而言,市售的支撐架 需要由多個零件組合,並且使用螺絲固定其支撐位置以及在機殼上的固定,往往造成使用者花費過多的力氣與時間。此外,市面上的支撐架在組裝後並不易於再次調整位置或拆卸。 Therefore, there are often additional support frames on the market to enhance the support of the above expansion cards to prevent them from being bent and damaged. But for now, the commercially available support frame The need to combine multiple parts, and the use of screws to fix their support position and the fixing on the casing often cause the user to spend too much effort and time. In addition, the support frame on the market is not easy to adjust position or disassembly after assembly.

另一方面,在市售的主機板中,會搭配使用金屬背板以保護主機板上的零件。然而,由於主機板上具有許多需要裸露以使用螺絲的固定孔位,因此在此金屬背板中,這些對應於主機板上需裸露位置的材料必須切割並移除,因而造成這些材料的浪費。 On the other hand, in a commercially available motherboard, a metal backplane is used in combination to protect the components on the motherboard. However, since the motherboard has a plurality of fixing holes that need to be exposed to use the screws, in the metal backing plate, these materials corresponding to the bare positions on the main board must be cut and removed, thereby causing waste of these materials.

本新型創作的支撐結構,用以支撐一電子裝置的一電子元件。電子裝置還具有一殼體。支撐模組包括一本體以及一支撐元件。本體具有一固定部以及一支撐部,其中固定部係用以連接於殼體。支撐元件可拆卸地連接於支撐部上,用以接觸電子元件,且支撐元件位於支撐部與電子元件之間。 The novel creation support structure is used to support an electronic component of an electronic device. The electronic device also has a housing. The support module includes a body and a support member. The body has a fixing portion and a supporting portion, wherein the fixing portion is for connecting to the housing. The support member is detachably coupled to the support portion for contacting the electronic component, and the support member is located between the support portion and the electronic component.

基於上述,在本新型創作的支撐結構中,由於本體具有固定部以及支撐部,且由電子裝置的底板切割形成,因此可有效利用多餘材料以節省成本,且不需組合額外的零件。此外,由於支撐元件可拆卸地連接於支撐部上以接觸電子元件,因此可使支撐模組簡單組裝。 Based on the above, in the support structure created by the present invention, since the body has the fixing portion and the support portion and is formed by cutting the bottom plate of the electronic device, the excess material can be effectively utilized to save cost, and no additional parts need to be combined. In addition, since the support member is detachably coupled to the support portion to contact the electronic component, the support module can be simply assembled.

為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will become more apparent and understood from the following description.

10‧‧‧電子裝置 10‧‧‧Electronic devices

20、20A、20B‧‧‧電子元件 20, 20A, 20B‧‧‧ electronic components

30‧‧‧殼體 30‧‧‧Shell

40‧‧‧固定片 40‧‧‧Fixed tablets

50‧‧‧電路板 50‧‧‧ boards

60‧‧‧底板 60‧‧‧floor

100、100A、100B、100C、100D、100E、100F、100G、100H、100I‧‧‧支撐模組 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I‧‧‧ support modules

110、110A、110B、110C、110D、110E、110F、110G、110H、110I‧‧‧本體 110, 110A, 110B, 110C, 110D, 110E, 110F, 110G, 110H, 110I‧‧‧ ontology

120、120A、120B‧‧‧固定部 120, 120A, 120B‧‧‧ Fixed Department

122‧‧‧固定元件 122‧‧‧Fixed components

124‧‧‧折勾 124‧‧‧Fold

130、130A、130B、130C、130D、130E、130F、130G‧‧‧支撐部 130, 130A, 130B, 130C, 130D, 130E, 130F, 130G‧‧‧ support

132‧‧‧凹面結構 132‧‧‧ concave structure

134‧‧‧凸出部 134‧‧‧protrusion

140、140A‧‧‧第一部分 140, 140A‧‧‧ Part 1

142‧‧‧圖案化凹槽結構 142‧‧‧ patterned groove structure

150、150A‧‧‧第二部分 150, 150A‧‧‧ Part II

160、160A、160B、160C、160D、160E‧‧‧支撐元件 160, 160A, 160B, 160C, 160D, 160E‧‧‧ support components

162、162A、162B、162C‧‧‧連接元件 162, 162A, 162B, 162C‧‧‧ connecting components

164‧‧‧支撐墊 164‧‧‧Support mat

170‧‧‧擴充支撐件 170‧‧‧ Expansion support

172‧‧‧擴充支撐部 172‧‧‧Extended support

180‧‧‧滑動件 180‧‧‧Sliding parts

A、B、C、D‧‧‧通孔 A, B, C, D‧‧‧ through holes

E、F‧‧‧開口 E, F‧‧‧ openings

G‧‧‧插槽 G‧‧‧ slots

S‧‧‧接觸面 S‧‧‧ contact surface

SL‧‧‧滑軌 SL‧‧‧rails

SL1‧‧‧第一滑軌 SL1‧‧‧ first slide

SL2‧‧‧第二滑軌 SL2‧‧‧Second slide

SP‧‧‧卡扣部 SP‧‧‧Snap Department

圖1A及圖1B分別為本新型創作一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。 1A and 1B are respectively a perspective view and a front view of a supporting module and supporting electronic components thereof according to an embodiment of the present invention.

圖2為圖1A的示意圖。 Figure 2 is a schematic view of Figure 1A.

圖3A及圖3B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。 3A and 3B are respectively a perspective and front perspective view of a supporting module and supporting electronic components thereof according to another embodiment of the present invention.

圖4為本新型創作另一實施例的支撐模組的示意圖。 4 is a schematic view of a support module of another embodiment of the present invention.

圖5A及圖5B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。 5A and 5B are respectively a perspective view and a front view of a supporting module and supporting electronic components thereof according to another embodiment of the present invention.

圖6A及圖6B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖。 6A and FIG. 6B are respectively perspective views of different perspectives of the support module and its supporting components of another embodiment of the present invention.

圖7A及圖7B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖。 7A and 7B are respectively perspective views of different perspectives of a support module and a supporting member thereof according to another embodiment of the present invention.

圖8A及圖8B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖。 8A and FIG. 8B are respectively perspective views of different perspectives of the support module and its supporting components of another embodiment of the present invention.

圖9A及圖9B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖。 9A and 9B are respectively perspective views of different perspectives of a support module and a supporting member thereof according to another embodiment of the present invention.

圖10A及圖10B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。 10A and 10B are respectively a perspective and front perspective view of a supporting module and supporting electronic components thereof according to another embodiment of the present invention.

圖11A及圖11B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。 11A and FIG. 11B are respectively a perspective view and a front view of a support module and a supporting electronic component thereof according to another embodiment of the present invention.

圖1A及圖1B分別為本新型創作一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。圖2為圖1A的支撐模組的本體的示意圖。請參考圖1A至圖2,在本實施例中,支撐模組100包括一本體110以及至少一支撐元件160。支撐模組100用以支撐一電子裝置10的一電子元件20。 1A and 1B are respectively a perspective view and a front view of a supporting module and supporting electronic components thereof according to an embodiment of the present invention. 2 is a schematic view of the body of the support module of FIG. 1A. Referring to FIG. 1A to FIG. 2 , in the embodiment, the support module 100 includes a body 110 and at least one supporting component 160 . The support module 100 is used to support an electronic component 20 of an electronic device 10.

電子裝置10除了具有電子元件20,還具有一電路板50、一底板60以及一殼體30,電子元件20可例如是顯示卡或安插於電路板50的其他種電子元件,殼體30例如是桌上型電腦的機殼,底板60例如是用以保護電路板50的金屬背板。然而,本新型並不限於此。 In addition to the electronic component 20, the electronic device 10 has a circuit board 50, a bottom plate 60, and a housing 30. The electronic component 20 can be, for example, a display card or other electronic components mounted on the circuit board 50. The housing 30 is, for example, The case of the desktop computer, the bottom plate 60 is, for example, a metal back plate for protecting the circuit board 50. However, the present invention is not limited to this.

本體110係由底板60切割而形成的一片狀結構,片狀結構具有一固定部120以及一支撐部130。具體而言,在本實施例中,用於保護電路板50的底板60具有多餘的部分而必需被切割移除,而本體110則由這些多餘的部分切割製作而成,如圖2所繪示。換句話說,本體110可由電子裝置10中的部分材料製作而成,增加現有材料的可利用性。 The body 110 is a one-piece structure formed by cutting the bottom plate 60. The sheet structure has a fixing portion 120 and a supporting portion 130. Specifically, in the present embodiment, the bottom plate 60 for protecting the circuit board 50 has redundant portions and must be cut and removed, and the body 110 is cut from these redundant portions, as shown in FIG. . In other words, the body 110 can be made of a portion of the material in the electronic device 10, increasing the availability of existing materials.

固定部120用以連接於電子裝置10的一殼體30,支撐部130用以支撐電子元件20。在本實施例中,固定部120具有多個通孔B,這些通孔B用以藉由一固定元件122固定於電子裝置10的殼體30。固定部120的延伸方向與支撐部130的延伸方向相互垂直,如圖1A及圖1B所繪示。固定元件122的數量可依據使用 情況增加為複數個,本新型並不限於此。 The fixing portion 120 is configured to be connected to a casing 30 of the electronic device 10 for supporting the electronic component 20 . In the present embodiment, the fixing portion 120 has a plurality of through holes B for fixing to the housing 30 of the electronic device 10 by a fixing member 122. The extending direction of the fixing portion 120 and the extending direction of the supporting portion 130 are perpendicular to each other, as shown in FIGS. 1A and 1B. The number of fixing elements 122 can be used according to the use The situation is increased to plural, and the present invention is not limited to this.

支撐元件160可拆卸地連接於支撐部130上,用以接觸電子元件20,支撐元件160例如可以是橡膠墊或其他可避免刮傷電子元件20的支撐元件。支撐元件160位於支撐部130與電子元件20之間。具體而言,支撐部130具有多個通孔A,用以使支撐元件160通過並固定於通孔A。如此一來,可避免支撐模組100支撐電子元件20時造成其表面刮傷受損。支撐元件160的數量可依據使用情況增加為複數個,本新型並不限於此。 The support member 160 is detachably coupled to the support portion 130 for contacting the electronic component 20. The support member 160 can be, for example, a rubber pad or other support member that can prevent the electronic component 20 from being scratched. The support member 160 is located between the support portion 130 and the electronic component 20. Specifically, the support portion 130 has a plurality of through holes A for passing and fixing the support member 160 to the through hole A. In this way, the surface of the support module 100 supporting the electronic component 20 can be prevented from being damaged by scratches on the surface. The number of support members 160 may be increased to a plurality depending on the use, and the present invention is not limited thereto.

詳細而言,在本實施例中,支撐部130具有一第一部分140以及一第二部分150,第二部分150由支撐部130彎折而成,用以使支撐元件160可拆卸地連接。第二部分150具有多個通孔A,用以使支撐元件160通過並固定於這些通孔A。 In detail, in the present embodiment, the support portion 130 has a first portion 140 and a second portion 150. The second portion 150 is bent by the support portion 130 for detachably connecting the support member 160. The second portion 150 has a plurality of through holes A for passing and fixing the support members 160 to the through holes A.

換句話說,用以支撐且朝向電子元件20的一面(即第二部分150)可藉由彎折支撐部130以形成第一部分140以及第二部分150。因此,可不需額外組裝步驟並節省組裝零件的使用。在本實施例中,第一部分140具有多個圖案化凹槽結構142,如此一來可增加支撐部130的支撐強度。圖案化凹槽結構142的形狀及數量可依據使用情況設計,本新型並不限於此。 In other words, the side for supporting and facing the electronic component 20 (ie, the second portion 150) can be formed by bending the support portion 130 to form the first portion 140 and the second portion 150. Therefore, no additional assembly steps are required and the use of assembled parts is saved. In the present embodiment, the first portion 140 has a plurality of patterned groove structures 142, which can increase the support strength of the support portion 130. The shape and number of the patterned groove structure 142 can be designed according to the use case, and the present invention is not limited thereto.

圖3A及圖3B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。請參考圖3A及圖3B,本實施例的支撐模組100A類似於圖1A中的支撐模組100,其兩者之間的差異在於,在本實施例中,支撐部130A由本體110A彎 折而成,且支撐部130A具有多個通孔A,用以使支撐元件160通過並固定於這些通孔A。 3A and 3B are respectively a perspective and front perspective view of a supporting module and supporting electronic components thereof according to another embodiment of the present invention. Referring to FIG. 3A and FIG. 3B, the support module 100A of the present embodiment is similar to the support module 100 of FIG. 1A, and the difference between the two is that, in the embodiment, the support portion 130A is bent by the body 110A. The support portion 130A has a plurality of through holes A for passing and fixing the support member 160 to the through holes A.

換句話說,支撐部130A可直接由本體110A彎折出朝向電子元件20A的一面。如此一來,可增加電子元件20A下方的可用空間以擴充另一個電子元件20B至電子裝置10。在本實施例中將本體110A彎折以形成支撐部130A的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 In other words, the support portion 130A can be bent directly from the body 110A toward the side of the electronic component 20A. As a result, the available space under the electronic component 20A can be increased to expand the other electronic component 20B to the electronic device 10. In the embodiment, the embodiment in which the body 110A is bent to form the support portion 130A can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖4為本新型創作另一實施例的支撐模組的示意圖。請參考圖4,本實施例的支撐模組100B類似於圖3A中的支撐模組100A,其兩者之間的差異在於,在本實施例中,支撐部130A具有多個凹面結構132,用以使支撐元件160A連接,其中至少一支撐元件160A具有磁性。 4 is a schematic view of a support module of another embodiment of the present invention. Referring to FIG. 4, the support module 100B of the present embodiment is similar to the support module 100A of FIG. 3A, and the difference between the two is that in the embodiment, the support portion 130A has a plurality of concave structures 132. To connect the support members 160A, at least one of the support members 160A has magnetic properties.

換句話說,支撐模組100B可用具磁性支撐元件160A吸附於支撐部130A上的凹面結構132中以支撐電子元件20A(見如圖3B)。如此一來,可使得使用者易於調整磁性支撐元件160A在支撐部130A上的位置。在本實施例中所提供具磁性支撐元件160A的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 In other words, the support module 100B can be adapted to the magnetic support member 160A to be attracted to the concave structure 132 on the support portion 130A to support the electronic component 20A (see FIG. 3B). As a result, the user can easily adjust the position of the magnetic support member 160A on the support portion 130A. The embodiment provided with the magnetic support member 160A in this embodiment can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖5A及圖5B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。請參考圖5A及圖5B,本實施例的支撐模組100C類似於圖1A中的支撐模組100,其兩者之間的差異在於,在本實施例中,固定部120A具有多個折勾 124,且這些折勾124由固定部120A經切割後彎折而成。 5A and 5B are respectively a perspective view and a front view of a supporting module and supporting electronic components thereof according to another embodiment of the present invention. Referring to FIG. 5A and FIG. 5B, the support module 100C of the present embodiment is similar to the support module 100 of FIG. 1A, and the difference between the two is that in the embodiment, the fixing portion 120A has a plurality of folding hooks. 124, and the folding hooks 124 are bent by the fixing portion 120A and then bent.

詳細而言,可先提供一對應的固定片40固定於電子裝置10的殼體30上,固定片40具有可對應於固定部120A上多個折勾124的多個通孔C,再藉由折勾124扣掛至通孔C上以將支撐模組100C組裝於殼體30上。 In detail, a corresponding fixing piece 40 is firstly fixed on the housing 30 of the electronic device 10. The fixing piece 40 has a plurality of through holes C corresponding to the plurality of folding hooks 124 on the fixing portion 120A, and The folding hooks 124 are hooked onto the through holes C to assemble the support module 100C to the housing 30.

如此一來,可使得使用者易於調整支撐模組100C在殼體30上的位置。此外,由於可設計固定片40上的多個通孔C的分佈較殼體30上原本多個通孔B(見如圖3B)的分佈緊密,因此支撐模組100C在垂直方向上的位置能更精確地調整。在本實施例中將固定部120A切割並彎折形成多個折勾124的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 In this way, the user can easily adjust the position of the support module 100C on the housing 30. In addition, since the distribution of the plurality of through holes C on the fixing piece 40 can be designed to be more closely distributed than the original plurality of through holes B (see FIG. 3B) on the casing 30, the position of the supporting module 100C in the vertical direction can be Adjust more precisely. In the embodiment, the embodiment in which the fixing portion 120A is cut and bent to form a plurality of folding hooks 124 can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖6A及圖6B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖,其中圖6B為圖6A中區域P1於另一視角的立體展開圖。請參考圖6A及圖6B,本實施例的支撐模組100D類似於圖5A中的支撐模組100C,其兩者之間的差異在於,在本實施例中,支撐元件160A包括一連接元件162以及一支撐墊164,連接元件162連接支撐部130B以及支撐墊164,實際而言,支撐墊164可拆卸地延伸通過並固定於連接元件162的一通孔D上,支撐墊164用以接觸電子元件20(見如圖1B)。 6A and FIG. 6B are respectively perspective views of different perspectives of the support module and its supporting elements according to another embodiment of the present invention, wherein FIG. 6B is a perspective exploded view of the region P1 of FIG. 6A at another viewing angle. Referring to FIG. 6A and FIG. 6B, the support module 100D of the present embodiment is similar to the support module 100C of FIG. 5A, and the difference between the two is that, in the embodiment, the support member 160A includes a connection member 162. And a support pad 164, the connecting member 162 is connected to the support portion 130B and the support pad 164. In fact, the support pad 164 is detachably extended through and fixed to a through hole D of the connecting member 162 for contacting the electronic component 20 (see Figure 1B).

詳細而言,連接元件162為彎折而成的片狀支撐結構,其材質可相同或不同於本體110D由電子裝置10(見如圖2)的單一材料切割形成,本新型並不限於此。而支撐墊164可選用相同 或不同於如圖1A實施例中的支撐元件160,本新型亦不限於此。 In detail, the connecting member 162 is a bent sheet-shaped supporting structure, and the material thereof may be the same or different from that of the body 110D cut by a single material of the electronic device 10 (see FIG. 2), and the present invention is not limited thereto. The support pad 164 can be the same Or different from the support member 160 in the embodiment of FIG. 1A, the present invention is not limited thereto.

支撐部130B具有多個凸出部134,連接元件162具有用以連接這些凸出部134的一開口E。如此一來,可使得使用者易於調整支撐元件160A在支撐部130B的位置。在本實施例中所提供使用連接元件162連接支撐部130B以及支撐墊164的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 The support portion 130B has a plurality of projections 134 having an opening E for connecting the projections 134. As a result, the user can easily adjust the position of the support member 160A at the support portion 130B. The embodiment in which the connection member 162 is used to connect the support portion 130B and the support pad 164 in the present embodiment can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖7A及圖7B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖,其中圖7B為圖7A中區域P2於另一視角的立體展開圖。請參考圖7A及圖7B,本實施例的支撐模組100E類似於圖5A中的支撐模組100C,其兩者之間的差異在於,在本實施例中,支撐元件160B包括一連接元件162A以及一支撐墊164,連接元件162A連接支撐部130C以及支撐墊164。 7A and FIG. 7B are respectively perspective views of different perspectives of the support module and its supporting components of another embodiment of the present invention, wherein FIG. 7B is a perspective exploded view of the region P2 of FIG. 7A at another viewing angle. Referring to FIG. 7A and FIG. 7B, the support module 100E of the present embodiment is similar to the support module 100C of FIG. 5A, and the difference between the two is that, in the embodiment, the support member 160B includes a connection member 162A. And a support pad 164, the connecting member 162A is connected to the support portion 130C and the support pad 164.

其中,第二部分150A具有一滑軌SL,用以使連接元件162A連接並滑動。如此一來,可使得使用者易於調整支撐元件160B在支撐部130C的位置。在本實施例中所提供使用連接元件162A連接支撐部130C以及支撐墊164的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 The second portion 150A has a slide rail SL for connecting and sliding the connecting member 162A. In this way, the user can easily adjust the position of the support member 160B at the support portion 130C. The embodiment in which the connecting member 162A is connected to the support portion 130C and the support pad 164 provided in the present embodiment can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖8A及圖8B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖,其中圖8B為圖8A中區域P3於另一視角的立體展開圖。請參考圖8A及圖8B,本實施例的支撐模組100F類似於圖6A中的支撐模組100D,其兩者之間的 差異在於,在本實施例中,支撐部130D具有多個插槽G,且連接元件162B具有用以連接這些插槽G的一卡扣部SP。 8A and FIG. 8B are respectively perspective views of different perspectives of the support module and its supporting components according to another embodiment of the present invention, wherein FIG. 8B is a perspective exploded view of the region P3 of FIG. 8A at another viewing angle. Referring to FIG. 8A and FIG. 8B, the support module 100F of the present embodiment is similar to the support module 100D of FIG. 6A. The difference is that, in the present embodiment, the support portion 130D has a plurality of slots G, and the connecting member 162B has a latch portion SP for connecting the slots G.

詳細而言,連接元件162B可藉由彎折形成卡扣部SP以對應於支撐部130D上的插槽G,且藉由雙卡扣結構結合至兩相鄰插槽G的方式增加其固定強度。如此一來,可使得使用者易於調整支撐元件160C在支撐部130D的位置。在本實施例中所提供使用連接元件162B連接支撐部130D以及支撐墊164的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 In detail, the connecting member 162B can be formed by bending to form the locking portion SP to correspond to the slot G on the supporting portion 130D, and the fixing strength is increased by the double snap structure being coupled to the two adjacent slots G. . In this way, the user can easily adjust the position of the support member 160C at the support portion 130D. The embodiment in which the connecting member 162B is connected to the support portion 130D and the support pad 164 provided in the present embodiment can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖9A及圖9B分別為本新型創作另一實施例的支撐模組及其支撐元件的不同視角的立體示意圖,其中圖9B為圖9A中區域P4於另一視角的立體展開圖。請參考圖9A及圖9B,本實施例的支撐模組100G類似於圖6A中的支撐模組100D,其兩者之間的差異在於,在本實施例中,支撐部130E具有多個開口F,這些開口F由支撐部130E經切割後彎折而成,例如是採用沖壓的方式製作而成,連接元件162C具有用以連接這些開口F的一卡扣部SP。 9A and 9B are respectively perspective views of different perspectives of a support module and a supporting member thereof according to another embodiment of the present invention, wherein FIG. 9B is a perspective exploded view of the region P4 of FIG. 9A at another viewing angle. Referring to FIG. 9A and FIG. 9B, the support module 100G of the present embodiment is similar to the support module 100D of FIG. 6A, and the difference between the two is that in the embodiment, the support portion 130E has a plurality of openings F. These openings F are formed by cutting and bending the support portion 130E, for example, by stamping, and the connecting member 162C has a latching portion SP for connecting the openings F.

詳細而言,連接元件162C可藉由彎折形成卡扣部SP以對應於支撐部130E上的開口F,且藉由類插槽結構的其中一側結合至開口F的方式增加其固定強度。如此一來,可使得使用者易於調整支撐元件160D在支撐部130E的位置。在本實施例中所提供使用連接元件162C連接支撐部130E以及支撐墊164的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 In detail, the connecting member 162C can be formed by bending to form the snap portion SP to correspond to the opening F on the support portion 130E, and the fixing strength is increased by the one side of the slot-like structure being coupled to the opening F. In this way, the user can easily adjust the position of the support member 160D at the support portion 130E. The embodiment in which the connecting member 162C is used to connect the support portion 130E and the support pad 164 in the present embodiment can also be applied to other implementable embodiments, and the present invention is not limited thereto.

圖10A及圖10B分別為本新型創作另一實施例的支撐模 組及其支撐電子元件的立體及前視示意圖。請參考圖10A及圖10B,本實施例的支撐模組100G類似於圖1A中的支撐模組100,其兩者之間的差異在於,在本實施例中,第一部分140A具有一第一滑軌SL1,且支撐模組100H還包括一擴充支撐件170以及一滑動件180。 10A and 10B are respectively supporting modes of another embodiment of the present invention. A perspective and front view of the group and its supporting electronic components. Referring to FIG. 10A and FIG. 10B, the support module 100G of the present embodiment is similar to the support module 100 of FIG. 1A, and the difference between the two is that, in this embodiment, the first portion 140A has a first slide. The rail SL1, and the support module 100H further includes an expansion support 170 and a slide 180.

擴充支撐件170用以支撐電子裝置10的另一電子元件20B,擴充支撐件170具有一第二滑軌SL2以及一擴充支撐部172。滑動件180可調式地連接第一滑軌SL1以及第二滑軌SL2,其中擴充支撐件170可藉由滑動件180調整垂直方向的位置以及水平方向的位置。 The expansion support 170 is used to support another electronic component 20B of the electronic device 10. The expansion support 170 has a second slide rail SL2 and an expansion support portion 172. The sliding member 180 adjustably connects the first sliding rail SL1 and the second sliding rail SL2, wherein the expansion supporting member 170 can adjust the position in the vertical direction and the position in the horizontal direction by the sliding member 180.

詳細而言,在電子裝置10安裝有雙電子元件20A、20B的情況下,可藉由支撐模組100H的支撐部130F支撐第一電子元件20A,再藉由連接於支撐部130F的擴充支撐件170支撐第二電子元件20B,具體而言,由擴充支撐部172支撐第二電子元件20B。 In detail, in the case where the electronic device 10 is mounted with the dual electronic components 20A, 20B, the first electronic component 20A can be supported by the support portion 130F of the support module 100H, and the expansion support member connected to the support portion 130F can be supported. 170 supports the second electronic component 20B, specifically, the second electronic component 20B is supported by the expansion support portion 172.

在本實施例中,擴充支撐部172由擴充支撐件170彎折而成,但本新型並不限於此。另一方面,擴充支撐件170在水平方向上的位置可藉由滑動件180在第一滑軌SL1中調整,擴充支撐件170在垂直方向上的位置可藉由滑動件180在第二滑軌SL2中調整。 In the present embodiment, the expansion support portion 172 is bent by the expansion support member 170, but the present invention is not limited thereto. On the other hand, the position of the expansion support 170 in the horizontal direction can be adjusted in the first slide rail SL1 by the slider 180, and the position of the expansion support member 170 in the vertical direction can be on the second slide rail by the slide member 180. Adjusted in SL2.

如此一來,可使得使用者易於調整用於支撐第二電子元件20B的擴充支撐件170的位置,進而適於使用在不同規格的電子裝置10或電子元件20A、20B上。在本實施例中所提供使用擴 充支撐件170支撐第二電子元件20B的實施方式,亦可適用於其他可實施的實施例中,本新型並不限於此。 In this way, the user can easily adjust the position of the expansion support 170 for supporting the second electronic component 20B, and is thus suitable for use on the electronic device 10 or the electronic components 20A, 20B of different specifications. The use provided in this embodiment The embodiment in which the charging support 170 supports the second electronic component 20B is also applicable to other implementable embodiments, and the present invention is not limited thereto.

圖11A及圖11B分別為本新型創作另一實施例的支撐模組及其支撐電子元件的立體及前視示意圖。在本實施例中,支撐模組包括一本體110I以及一支撐元件160E。本體110I具有一固定部120B以及一支撐部130G,且本體110I為片狀結構。 11A and FIG. 11B are respectively a perspective view and a front view of a support module and a supporting electronic component thereof according to another embodiment of the present invention. In this embodiment, the support module includes a body 110I and a support member 160E. The body 110I has a fixing portion 120B and a supporting portion 130G, and the body 110I has a sheet structure.

支撐元件160E可拆卸地連接於支撐部130G上,其中本體110I由電子裝置10的單一材料切割形成,固定部120B用以連接於電子裝置10的一殼體30,支撐元件160E用以接觸電子元件20A、20B,且支撐元件160E位於支撐部130G與電子元件20A、20B之間,其中支撐元件160E的數量及位置可依據電子元件20A、20B的數量及規格在支撐部130G的滑軌SL上移動而調整。 The support member 160E is detachably connected to the support portion 130G, wherein the body 110I is formed by cutting a single material of the electronic device 10, the fixing portion 120B is used for connecting to a housing 30 of the electronic device 10, and the support member 160E is for contacting the electronic component. 20A, 20B, and the supporting member 160E is located between the supporting portion 130G and the electronic components 20A, 20B, wherein the number and position of the supporting members 160E can be moved on the sliding rail SL of the supporting portion 130G according to the number and specifications of the electronic components 20A, 20B. And adjust.

詳細而言,固定部120B由本體110I彎折而成,固定部120B具有一接觸面S,用以接觸殼體30的底部以支撐著支撐部130G。舉例而言,固定部120B的彎折形狀例如為三角形,以使形成出接觸面S以佇立於殼體30的底部,然而在其他的實施例中,亦可彎折固定部120B成具有接觸面S不同形狀,本新型並不限於此。 In detail, the fixing portion 120B is bent by the body 110I, and the fixing portion 120B has a contact surface S for contacting the bottom of the housing 30 to support the support portion 130G. For example, the bent shape of the fixing portion 120B is, for example, a triangle such that the contact surface S is formed to stand on the bottom of the housing 30. However, in other embodiments, the fixing portion 120B may be bent to have a contact surface. S different shapes, the present invention is not limited to this.

因此,實際而言,固定部120B並不需要藉由額外的固定元件固定於機殼30上。如此一來,可使得使用者易於調整固定部120B的位置,進而適於使用在不同規格的電子裝置10或電子元件20A、20B上。 Therefore, in practice, the fixing portion 120B does not need to be fixed to the casing 30 by an additional fixing member. In this way, the user can easily adjust the position of the fixing portion 120B, and is suitable for use on the electronic device 10 or the electronic components 20A, 20B of different specifications.

綜上所述,在本新型創作的支撐結構中,由於本體具有固定部以及支撐部,且由電子裝置的底板切割形成,因此可有效利用多餘材料以節省成本,且不需組合額外的零件。此外,由於支撐元件可拆卸地連接於支撐部上以接觸電子元件,因此可使支撐模組簡單組裝。 In summary, in the support structure created by the present invention, since the body has a fixing portion and a supporting portion and is formed by cutting the bottom plate of the electronic device, the excess material can be effectively utilized to save cost, and no additional parts need to be combined. In addition, since the support member is detachably coupled to the support portion to contact the electronic component, the support module can be simply assembled.

雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

Claims (12)

一種支撐模組,用以支撐一電子裝置的一電子元件,該電子裝置包括一殼體,該支撐模組包括:一本體,具有一固定部以及一支撐部,其中該固定部係用以連接於該殼體;以及一支撐元件,可拆卸地連接於該支撐部上,用以接觸該電子元件,且該支撐元件位於該支撐部與該電子元件之間。 A support module for supporting an electronic component of an electronic device, the electronic device comprising a housing, the support module comprising: a body having a fixing portion and a supporting portion, wherein the fixing portion is for connecting And a support member detachably coupled to the support portion for contacting the electronic component, and the support member is located between the support portion and the electronic component. 如申請專利範圍第1項所述的支撐模組,其中該固定部的延伸方向與該支撐部的延伸方向相互垂直。 The support module of claim 1, wherein the extending direction of the fixing portion and the extending direction of the supporting portion are perpendicular to each other. 如申請專利範圍第2項所述的支撐模組,其中該支撐部具有多個通孔,用以使該支撐元件通過並固定於該些通孔。 The support module of claim 2, wherein the support portion has a plurality of through holes for the support member to pass through and fix to the through holes. 如申請專利範圍第2項所述的支撐模組,其中該支撐部具有多個凹面結構,用以使該支撐元件連接,其中該支撐元件具有磁性。 The support module of claim 2, wherein the support portion has a plurality of concave structures for connecting the support members, wherein the support members are magnetic. 如申請專利範圍第1項所述的支撐模組,其中該支撐部具有一第一部分以及一第二部分,該第二部分由該支撐部彎折而成,用以使該支撐元件可拆卸地連接。 The support module of claim 1, wherein the support portion has a first portion and a second portion, the second portion being bent by the support portion for detachably supporting the support member connection. 如申請專利範圍第5項所述的支撐模組,其中該第一部分具有一第一滑軌,且該支撐模組還包括:一擴充支撐件,用以支撐該電子裝置的另一電子元件,該擴充支撐件具有一第二滑軌以及一擴充支撐部;以及一滑動件,可調式地連接該第一滑軌以及該第二滑軌,其中 該擴充支撐件可藉由該滑動件調整垂直方向的位置以及水平方向的位置。 The support module of claim 5, wherein the first portion has a first slide rail, and the support module further comprises: an expansion support member for supporting another electronic component of the electronic device, The expansion support has a second slide rail and an expansion support portion; and a sliding member that adjustably connects the first slide rail and the second slide rail, wherein The expansion support can adjust the position in the vertical direction and the position in the horizontal direction by the slider. 如申請專利範圍第1項所述的支撐模組,其中該支撐元件包括一連接元件以及一支撐墊,該連接元件連接該支撐部以及該支撐墊,該支撐墊用以接觸該電子元件。 The support module of claim 1, wherein the support member comprises a connecting member and a support pad, the connecting member connecting the support portion and the support pad, the support pad for contacting the electronic component. 如申請專利範圍第7項所述的支撐模組,其中該支撐部具有多個凸出部,該連接元件具有用以連接該些凸出部的一開口。 The support module of claim 7, wherein the support portion has a plurality of protrusions, and the connection member has an opening for connecting the protrusions. 如申請專利範圍第7項所述的支撐模組,其中該支撐部具有一第一部分以及一第二部分,且該第二部分由該支撐部彎折而成,該第二部分具有一滑軌,用以使該連接元件連接並滑動。 The support module of claim 7, wherein the support portion has a first portion and a second portion, and the second portion is bent by the support portion, and the second portion has a slide rail For connecting and sliding the connecting element. 如申請專利範圍第7項所述的支撐模組,其中該支撐部具有多個插槽,該連接元件具有用以連接該些插槽的一卡扣部。 The support module of claim 7, wherein the support portion has a plurality of slots, and the connection member has a buckle portion for connecting the slots. 如申請專利範圍第7項所述的支撐模組,其中該支撐部具有多個開口,該連接元件具有用以連接該些開口的一卡扣部。 The support module of claim 7, wherein the support portion has a plurality of openings, and the connection member has a buckle portion for connecting the openings. 如申請專利範圍第1項所述的支撐模組,其中該固定部具有多個通孔,該些通孔用以藉由一固定元件固定於該電子裝置的該殼體。The support module of claim 1, wherein the fixing portion has a plurality of through holes for fixing to the housing of the electronic device by a fixing member.
TW106214991U 2017-10-11 2017-10-11 Supporting module TWM557960U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787137B (en) * 2022-06-13 2022-12-11 振躍精密滑軌股份有限公司 Geometry reinforcement structure of slide rail

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787137B (en) * 2022-06-13 2022-12-11 振躍精密滑軌股份有限公司 Geometry reinforcement structure of slide rail

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