TWM556933U - Glue-applying device - Google Patents
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- TWM556933U TWM556933U TW106218859U TW106218859U TWM556933U TW M556933 U TWM556933 U TW M556933U TW 106218859 U TW106218859 U TW 106218859U TW 106218859 U TW106218859 U TW 106218859U TW M556933 U TWM556933 U TW M556933U
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Abstract
一種佈膠裝置,其包含有一供膠單元;以及一載膠單元,其係設於該供膠單元的下方;其中,該供膠單元係提供樹脂給該載膠單元,該載膠單元係一次性將該樹脂提供給一承載台或該承載台的模穴。 A rubberizing device comprising a glue supply unit; and a rubber loading unit disposed under the rubber supply unit; wherein the rubber supply unit supplies resin to the rubber loading unit, the rubber loading unit is once The resin is supplied to a carrier or a cavity of the carrier.
Description
本創作是有關於一種佈膠裝置,尤指一種能一次性提供適量與適當分布之樹脂,以供大面積封裝程序所需的裝置。 The present invention relates to a cloth dispensing device, and more particularly to a device that can provide a proper amount and proper distribution of resin at one time for a large area packaging process.
於先進半導體封裝製程中為求輕、薄、短、小的積體電路,發展出扇型封裝技術,藉由大尺寸的載板將積體電路佈置在其上以進行後製程,此製程可得較佳的產品品質及產能,以提高製程及產品的競爭力。 In the advanced semiconductor packaging process, in order to find a light, thin, short, and small integrated circuit, a fan-type packaging technology has been developed, in which a large-sized carrier board is placed on the integrated circuit for post-processing, and the process can be performed. Better product quality and capacity to improve process and product competitiveness.
因大尺寸載板封裝的面積大,封裝之樹脂材料受限於材料特性因素,樹脂為熱固性材料受熱後即產生特性反應,必須在特定時間內完成填裝製程。 Due to the large area of the large-size carrier package, the resin material of the package is limited by the material property factor, and the resin is a thermosetting material that undergoes a characteristic reaction after being heated, and the filling process must be completed within a certain time.
綜合上述,現有的扇型封裝技術具有至少兩個缺點。一為將樹脂直接佈在載板上,再將載板與樹脂一同加熱並封裝,樹脂會因受熱時間過長且不均,產品品質不佳。二為將樹脂直接佈自壓模模穴內,因佈膠面積大因而所需時間長,樹脂受熱時間不均,影響其流動性與封裝品質。 In summary, the existing fan-type packaging technology has at least two disadvantages. One is to directly coat the resin on the carrier, and then heat and package the carrier together with the resin. The resin will be too long and uneven due to heating time, and the product quality is not good. Secondly, the resin is directly clothed from the die cavity, and the time required for the rubber is large, and the resin is heated unevenly, which affects the fluidity and packaging quality.
本創作提供一種佈膠裝置,其係能掌握封裝樹脂於允許的時間內,一次性提供適量與適當分布的樹脂,以完成封裝程序。 The present invention provides a cloth dispensing device capable of grasping the encapsulating resin to provide an appropriate amount and appropriately distributed resin at a time to complete the packaging process.
基於上述,本創作提出一種佈膠裝置,其包括: 一供膠單元;以及一載膠單元,其係設於該供膠單元的下方;其中,該供膠單元係提供樹脂給該載膠單元,該載膠單元係一次性將該樹脂提供給一承載台或該承載台的模穴。 Based on the above, the present invention proposes a cloth dispensing device comprising: a rubber supply unit; and a rubber loading unit disposed under the rubber supply unit; wherein the rubber supply unit supplies a resin to the rubber loading unit, the rubber loading unit provides the resin to the resin at a time A carrier or a cavity of the carrier.
基於上述,本創作之佈膠裝置,其先利用精密定量的供膠單元提供樹脂,以使供膠單元係將樹脂佈於載膠單元。待供膠單元將樹脂佈於載膠單元後,載膠單元係移動至承載台的上方,或者承載台係相對於載膠單元上升至一設定距離。載膠單元係提供樹脂給承載台或承載台的模穴。待樹脂已位於承載台或模穴後,載膠單元係回到最初位置,或者承載台係下降至最初位置。承載台對樹脂加熱,以進行大尺寸的載板與積體電路之結合製程。 Based on the above, the cloth dispensing device of the present invention first provides the resin by using a precise and quantitative rubber supply unit, so that the rubber supply unit distributes the resin to the rubber loading unit. After the resin unit is disposed on the loading unit, the loading unit moves to the upper side of the loading platform, or the loading platform rises to a set distance relative to the loading unit. The loading unit provides a resin to the cavity of the carrier or carrier. After the resin has been placed in the carrier or cavity, the gum carrier unit is returned to the original position or the carrier system is lowered to the original position. The carrier heats the resin to perform a combination process of a large-sized carrier and an integrated circuit.
為讓創作之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above features and advantages of the creation more apparent, the following embodiments are described in detail with reference to the accompanying drawings.
10‧‧‧供膠單元 10‧‧‧Glue unit
100‧‧‧滴料模組 100‧‧‧Drip Module
101‧‧‧控量模組 101‧‧‧Control Module
11‧‧‧載膠單元 11‧‧‧Loading unit
110‧‧‧擋膠板 110‧‧‧ Rubber sheet
1100‧‧‧開孔 1100‧‧‧ openings
111‧‧‧導膠板 111‧‧‧Adhesive sheet
1110‧‧‧閘件 1110‧‧‧
1111‧‧‧引料斜面 1111‧‧‧Feeding bevel
112‧‧‧開關模組 112‧‧‧Switch Module
1120‧‧‧推件 1120‧‧‧Pushing pieces
1121‧‧‧導件 1121‧‧‧Guide
1122‧‧‧復原件 1122‧‧‧Restoration
12‧‧‧控制單元 12‧‧‧Control unit
S1~S2‧‧‧步驟 S1~S2‧‧‧ steps
第1圖為本創作之一種佈膠裝置之立體示意圖。 Figure 1 is a perspective view of a cloth dispensing device of the present invention.
第2圖為本創作之一種佈膠裝置之俯視示意圖。 Figure 2 is a top plan view of a cloth dispensing device of the present invention.
第3圖為一供膠單元與一載膠單元之立體示意圖。 Figure 3 is a perspective view of a glue supply unit and a rubber loading unit.
第4圖為供膠單元於載膠單元之移動路徑示意圖。 Figure 4 is a schematic view showing the movement path of the glue supply unit to the loading unit.
第5圖為供膠單元於載膠單元之另一移動路徑示意圖。 Figure 5 is a schematic view of another movement path of the glue supply unit to the loading unit.
第6圖為載膠單元之動作示意圖。 Figure 6 is a schematic view of the operation of the loading unit.
第7圖為載膠單元之局部立體示意圖。 Figure 7 is a partial perspective view of the loading unit.
第8圖為載膠單元之另一局部立體示意圖。 Figure 8 is another partial perspective view of the loading unit.
第9圖為本創作應用於一種佈膠方法之流程圖。 Figure 9 is a flow chart of a method for applying a glue to the creation.
請配合參考第1圖與第2圖所示,本創作係一種佈膠裝置,其係應用於一封裝製程,該佈膠裝置具有一供膠單元10、一載膠單元11與一控制單元12。 Please refer to FIG. 1 and FIG. 2 , the present invention is a cloth dispensing device, which is applied to a packaging process, the glue dispensing device has a glue supply unit 10 , a rubber loading unit 11 and a control unit 12 . .
請配合參考第3圖所示,供膠單元10具有一移動模組(圖中未示)、一滴料模組100與一控量模組101。移動模組係耦接一機台,該機台可為龍門機台、加工工具機、壓合機。滴料模組100係耦接移動模組。控量模組101係設於滴料模組100的底端。 Referring to FIG. 3, the glue supply unit 10 has a moving module (not shown), a drop module 100 and a control module 101. The mobile module is coupled to a machine platform, which can be a gantry machine, a machining machine, a press machine. The drips module 100 is coupled to the mobile module. The control module 101 is disposed at the bottom end of the drips module 100.
載膠單元11係設於供膠單元10的下方。載膠單元11具有一擋膠板110、一導膠板111與一開關模組112。 The loading unit 11 is disposed below the glue supply unit 10. The loading unit 11 has a rubber sheet 110, a rubber sheet 111 and a switch module 112.
請配合參考第4圖、第5圖、第6圖、第7圖與第8圖所示,擋膠板110具有複數個開孔1100,舉例而言,該些開孔1100可為條孔、圓孔、多邊形孔、不規則形狀孔,但不限定,其係依據實際狀況而設定。導膠板111係可移動地設於擋膠板110的頂端,以封閉開孔1100。導膠板111具有複數個閘件1110。前述之開孔1100係位於二閘件1110之間。各閘件1110相對於開孔1100的兩側邊分別具有一引料斜面1111。 Referring to FIG. 4, FIG. 5, FIG. 6, FIG. 7 and FIG. 8, the rubber sheet 110 has a plurality of openings 1100. For example, the openings 1100 may be strip holes. Round holes, polygonal holes, and irregularly shaped holes, but are not limited, and are set according to actual conditions. The rubber guide plate 111 is movably disposed at the top end of the rubber sheet 110 to close the opening 1100. The rubber guide plate 111 has a plurality of gate members 1110. The aforementioned opening 1100 is located between the two gates 1110. Each of the gate members 1110 has a lead inclined surface 1111 with respect to both sides of the opening 1100.
開關模組112係設於擋膠板110與導膠板111之間。開關模組112具有一推件1120、至少一導件1121與至少一復原件1122。推件1120係設於導膠板111的一端,並且突出於擋膠板110的外部。推件1120突出於擋膠板110的外部係耦接一動力源,該動力源可為氣壓缸、油壓缸、螺桿總成、馬 達與齒輪組之總成。導件1121設於導膠板111的至少一側邊,並且位於擋膠板110與導膠板111之間。於本實施例中,導件1121係設於導膠板111的兩側邊。復原件1122係被導件1121所貫穿,復原件1122的一端係耦接導膠板111,復原件1122的另一端係耦接擋膠板110。復原件1122為一彈簧或一彈性體。 The switch module 112 is disposed between the rubber sheet 110 and the adhesive sheet 111. The switch module 112 has a pushing member 1120, at least one guiding member 1121 and at least one restoring member 1122. The pushing member 1120 is disposed at one end of the adhesive sheet 111 and protrudes outside the rubber sheet 110. The pusher 1120 protrudes from the exterior of the rubber sheet 110 and is coupled to a power source, which can be a pneumatic cylinder, a hydraulic cylinder, a screw assembly, and a horse. The assembly with the gear set. The guiding member 1121 is disposed on at least one side of the adhesive sheet 111 and located between the rubber sheet 110 and the adhesive sheet 111. In the embodiment, the guiding members 1121 are disposed on both sides of the adhesive sheet 111. The restoring member 1122 is coupled to the guide member 1121. One end of the restoring member 1122 is coupled to the adhesive sheet 111, and the other end of the restoring member 1122 is coupled to the rubber sheet 110. The restoration member 1122 is a spring or an elastic body.
控制單元12係訊號連接供膠單元10與載膠單元11。控制單元12係控制移動模組,以使移動模組於一設定路徑與一設定速度移動滴料模組100。控制單元12係進一步控制控量模組101,以使位於滴料模組100中的樹脂以一定量、定速或定量定速掉落。控制單元12係控制動力源,動力源係驅動導膠板111,以使導膠板111相對於擋膠板110往復移動。 The control unit 12 is connected to the glue supply unit 10 and the rubber loading unit 11 by a signal. The control unit 12 controls the mobile module to move the mobile module to move the drip module 100 at a set path and a set speed. The control unit 12 further controls the control module 101 to cause the resin located in the drip module 100 to drop at a certain amount, a constant speed, or a constant rate. The control unit 12 controls the power source, and the power source drives the pressure guiding plate 111 to reciprocate the rubber sheet 111 relative to the rubber sheet 110.
請配合參考第9圖所示,本創作之佈膠裝置應用於一種佈膠方法,其步驟包含有: Please refer to the drawing in Figure 9, the cloth dispensing device of the present invention is applied to a cloth coating method, and the steps thereof include:
步驟S1,提供樹脂。供膠單元10的移動模組係將供膠單元10的滴料模組100移動至載膠單元11的上方。移動模組係使滴料模組100於一設定路徑與一設定速度移動,該設定路徑係為一X軸向(第一軸向)至Y軸向(第二軸向)的S形移動、一Y軸向(第二軸向)至X軸向(第一軸向)的S形移動、一點至點移動或一線性移動。如第4圖與第5圖所示。控量模組101於滴料模組100移動時係控制位於滴料模組100中的樹脂以一定量、定速或定量定速掉落至載膠單元11的導膠板111的閘件1110之間。因導膠板111的閘件1110具有引料斜面1111,故樹脂會被引料斜面1111所引導,而進入至二閘件1110之間。位於二閘件1110之間的樹脂高度係低於閘件1110的高度。 In step S1, a resin is provided. The moving module of the glue supply unit 10 moves the drip module 100 of the glue supply unit 10 above the loading unit 11. The moving module moves the drips module 100 at a set path and a set speed, and the set path is an S-shaped movement from an X-axis (first axial direction) to a Y-axis (second axial direction), An S-shaped movement from the Y-axis (second axial direction) to the X-axis (first axial direction), a point-to-point movement or a linear movement. As shown in Figures 4 and 5. When the drip module 100 moves, the control module 101 controls the resin located in the drip module 100 to drop to the gate 1110 of the adhesive sheet 111 of the loading unit 11 at a certain amount, constant speed or quantitative constant speed. between. Since the gate member 1110 of the adhesive sheet 111 has the lead inclined surface 1111, the resin is guided by the lead inclined surface 1111 and enters between the two shutter members 1110. The resin height between the two gate members 1110 is lower than the height of the gate member 1110.
步驟S2,進行佈膠。當樹脂已佈滿導膠板111,控量模組101係控制滴料模組100,以使滴料模組100不再提供樹脂給導膠板111。一承載 台係相對於載膠單元11上升,並且上升至距離載膠單元11一設定距離。動力源係將依推力提供給推件1120,以使推件1120推動導膠板111。移動的導膠板111係使擋膠板110的開孔1100,如第6圖、第7圖與第8圖所示,以使位於二閘件1110之間的樹脂經由擋膠板110的開孔1100掉落至承載台的頂端。待樹脂已完全掉落至承載台後,承載台係回到最初位置,並對樹脂加熱,以進行大尺寸的載板與積體電路之結合製程。 In step S2, the glue is applied. When the resin has been filled with the adhesive sheet 111, the control module 101 controls the drip module 100 so that the drip module 100 no longer supplies the resin to the adhesive sheet 111. One bearer The stage rises relative to the loading unit 11 and rises to a set distance from the loading unit 11. The power source system will be provided to the pusher 1120 according to the thrust so that the pusher 1120 pushes the guide plate 111. The moving adhesive sheet 111 is such that the opening 1100 of the rubber sheet 110 is as shown in FIGS. 6 , 7 and 8 so that the resin located between the two shutters 1110 is opened through the rubber sheet 110 . The hole 1100 is dropped to the top of the stage. After the resin has completely fallen to the stage, the stage is returned to the original position and the resin is heated to perform a combination of the large-sized carrier and the integrated circuit.
本創作之佈膠裝置,其先利用精密定量的供膠單元10提供樹脂,再利用可於第一軸向與第二軸向移動的移動模組,如伺服模組,以移動供膠單元10,以使供膠單元10係將樹脂佈於載膠單元11。待供膠單元10將樹脂佈於載膠單元11後,載膠單元11係移動至承載台的上方,或者承載台係相對於載膠單元11上升至一預定距離。開關模組112係使導膠板111相對於擋膠板110移動,而使樹脂透過開孔1100掉落至承載台或承載台的模穴中。待樹脂已位於承載台或模穴後,載膠單元11係回到最初位置,或者承載台係下降至最初位置。承載台對樹脂加熱,以進行大尺寸的載板與積體電路之結合製程。 The cloth distributing device of the present invention firstly supplies the resin by using the precise and quantitative rubber supply unit 10, and then moves the movable module, such as the servo module, which can move in the first axial direction and the second axial direction, to move the rubber supply unit 10 So that the glue supply unit 10 is to lining the resin to the loading unit 11. After the rubber supply unit 10 has disposed the resin on the loading unit 11, the loading unit 11 is moved to the upper side of the loading table, or the loading platform is raised relative to the loading unit 11 by a predetermined distance. The switch module 112 moves the adhesive sheet 111 relative to the rubber sheet 110 to cause the resin to fall through the opening 1100 into the cavity of the carrier or the carrier. After the resin has been placed in the carrier or cavity, the gum carrier unit 11 is returned to the original position or the carrier system is lowered to the original position. The carrier heats the resin to perform a combination process of a large-sized carrier and an integrated circuit.
以上所述,乃僅記載本創作為呈現解決問題所採用的技術手段之較佳實施方式或實施例而已,並非用來限定本創作專利實施之範圍。即凡與本創作專利申請範圍文義相符,或依本創作專利範圍所做的均等變化與修飾,皆為本創作專利範圍所涵蓋。 The above descriptions are merely illustrative of the preferred embodiments or examples of the technical means employed to solve the problems, and are not intended to limit the scope of the invention. Any change or modification that is consistent with the scope of the patent application scope of this creation or the scope of the patent creation is covered by the scope of the creation patent.
Claims (7)
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TW106218859U TWM556933U (en) | 2017-12-19 | 2017-12-19 | Glue-applying device |
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TW106218859U TWM556933U (en) | 2017-12-19 | 2017-12-19 | Glue-applying device |
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Cited By (1)
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TWI668770B (en) * | 2017-12-19 | 2019-08-11 | 均華精密工業股份有限公司 | Arranging glue apparatus and method thereof |
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Cited By (1)
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TWI668770B (en) * | 2017-12-19 | 2019-08-11 | 均華精密工業股份有限公司 | Arranging glue apparatus and method thereof |
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